DE1439606A1 - Procedure for checking the contact security by means of a heat test - Google Patents
Procedure for checking the contact security by means of a heat testInfo
- Publication number
- DE1439606A1 DE1439606A1 DE19621439606 DE1439606A DE1439606A1 DE 1439606 A1 DE1439606 A1 DE 1439606A1 DE 19621439606 DE19621439606 DE 19621439606 DE 1439606 A DE1439606 A DE 1439606A DE 1439606 A1 DE1439606 A1 DE 1439606A1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor components
- room temperature
- contact
- heat treatment
- checking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
- G01R31/70—Testing of connections between components and printed circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
Description
Verfahren zur Überprüfung der Kontaktsicherheit durch Wärmetest" Die Erfindung betrifft ein Verfahren zur Überprüfung der Kontaktsicherheit der Verbindungsstellen von Elektrodenzuleitungen und Elektroden bei Halbleit erbauelementen wie Transistoren oder Dioden. Procedure for checking the contact security by means of a heat test " The invention relates to a method for checking the contact security of the connection points of electrode leads and electrodes in semiconductor components such as transistors or diodes.
Für den vermehrten Einsatz von Halbleiterbauelementen in weiten Bereichen der Technik ist die Frage der Zuverlässigkeit der einzelnen Bauelemente von entscheidender Bedutung. Untersuchungen haben ergeben, daß die Zuverlässigkeit von Bauelementen sehr oft durch Kontaktunsicherheiten an den Lötstellen von Elektrodenzuleitung und Elektrode in Frage gestellt wird. Der Erfindung liegt daher die Aufgabe zugrunde, ein Verfahren aufzuzeigen, durch welches die Kontaktsicherheit von Halbleiterbauelementen ohne nachteilige Auswirkungen auf das Halbleitersystem ermittelt werden kann.For the increased use of semiconductor components in a wide range In terms of technology, the question of the reliability of the individual components is of decisive importance Importance. Studies have shown that the reliability of components very often due to contact uncertainties at the soldering points of the electrode lead and Electrode is in question. The invention is therefore based on the object to show a method by which the contact security of semiconductor components can be determined without adverse effects on the semiconductor system.
Zur Lösung der gestellten Aufgabe wird erfindungsgemäß vorgeschlagen, daß das Halbleiterbauelement zur Ermittelung der Kontaktsicherheit einer Wärmebehandlung unter und über der Raumtemperatur unterworfen wird.According to the invention, the object is achieved suggested that the semiconductor component to determine the contact reliability of a heat treatment is subjected below and above room temperature.
Nach dieser Wärmebehandlung können die kontaktsicheren Halbleiterbauelemente von den nicht kontaktsicheren Haibleiterbauelement en getrennt werden, da kontaktunsichere Bauelemente, die vor der Wärmebehandlung noch nicht ermittelt werden können, nach der Wärmebehandlung zu erkennen sind.After this heat treatment, the contact-safe semiconductor components be separated from the non-contact-safe semiconductor components, as contact-insecure Components that cannot yet be determined before the heat treatment the heat treatment can be seen.
Das erfindungsgemäße Verfahren eignet sich bevorzugt für Halbleit erbauelemente, deren Elektrodenzuleitungen mit den Elektroden verlötet sind, Es empfiehlt sich, die Temperaturbehandlung unter und über der Raumtemperatur ein- oder mehrmals zu wiederholen. Die Temperaturbehandlung unterhalb der Raumtemperatur erfolgt im allgemeinen vor der Temperaturbehandlung über der Raumtemperatur.The method according to the invention is preferably suitable for semiconductors building elements whose electrode leads are soldered to the electrodes, Es it is recommended that the temperature treatment below and above room temperature or to repeat several times. The temperature treatment below room temperature generally takes place before the temperature treatment above room temperature.
Unter Raumtemperatur soll eine Temperatur von 25 0C verstanden werden, Bei entsprechender Wahl der Temperaturen tritt keine berbeanspruchung der einwandfrei kontaktierten Halbleiterbauelemente bei einem solchen Temperaturwechseltest auf.Room temperature should be understood to mean a temperature of 25 0C, With the appropriate choice of temperatures, there is no overstressing of the faultlessly contacted semiconductor components in such a temperature cycle test.
Die einwandfreien Lötstellen bleiben erhalten, während die Elemente mit schlechten oder kalten Lötstellen, die ursprünglich nicht zu erkennen waren, nach der Wärmebehandlung erkannt und aus sortiert werden können.The flawless solder joints are retained while the elements with bad or cold solder joints that originally not to were recognized, recognized and sorted out after the heat treatment.
Die Erfindung soll an einem Ausführungsbeispiel näher erläutert werden.The invention is to be explained in more detail using an exemplary embodiment.
Die auf Kontakt sicherheit zu überprüfenden Halbleiterbauelemente werden bei der Uberprüfung insgesamt zehn Temperaturzyklen unterworfen. Ein T emp eraturzyklu s besteht in einer Wärmebehandlung unter und über der Raumtemperatur. Bei der Temperaturbehandlung unterhalb der Raumtemperatur werden die zu überprüfenden Halbleiterbauelement in einer geeigneten Umgebung 3 Minuten lang bei + 10° gelagert. Auf diese Temperaturbohandlung folgt eine 30 Minuten lange Nachbehandlung bei + 6o0C. Nach zehnmaligem Durchfahren der angegebenen Temperaturzyklen können kontaktunsichere Elemente aussortiert werden, ohne daß eine Zerstörung der einwandfrei kontaktierten BS-elemente zu verzeichnen ist4 Die zu überprüfenden Halbleiterbauelemente können beispielsweise Legierungstransistoren sein.The semiconductor components to be checked for contact safety are subjected to a total of ten temperature cycles during the test. A T emp eraturzyklu s consists of a heat treatment below and above room temperature. In the case of temperature treatment below room temperature, the Semiconductor component stored in a suitable environment for 3 minutes at + 10 °. This temperature treatment is followed by a 30-minute post-treatment at + 6o0C. After running through the specified temperature cycles ten times, there may be unsafe contacts Elements are sorted out without destroying the properly contacted BS elements to be recorded is4 The semiconductor components to be checked can be alloy transistors, for example.
Claims (7)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DET0022561 | 1962-08-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE1439606A1 true DE1439606A1 (en) | 1968-12-12 |
Family
ID=7550603
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19621439606 Pending DE1439606A1 (en) | 1962-08-07 | 1962-08-07 | Procedure for checking the contact security by means of a heat test |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE1439606A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102014109951A1 (en) * | 2014-07-16 | 2016-02-18 | Endress + Hauser Gmbh + Co. Kg | Method for checking component connections |
-
1962
- 1962-08-07 DE DE19621439606 patent/DE1439606A1/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102014109951A1 (en) * | 2014-07-16 | 2016-02-18 | Endress + Hauser Gmbh + Co. Kg | Method for checking component connections |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
SH | Request for examination between 03.10.1968 and 22.04.1971 |