DE1439022A1 - Kuehlkoerper fuer ein Halbleiterbauelement - Google Patents
Kuehlkoerper fuer ein HalbleiterbauelementInfo
- Publication number
- DE1439022A1 DE1439022A1 DE1960S0068334 DES0068334A DE1439022A1 DE 1439022 A1 DE1439022 A1 DE 1439022A1 DE 1960S0068334 DE1960S0068334 DE 1960S0068334 DE S0068334 A DES0068334 A DE S0068334A DE 1439022 A1 DE1439022 A1 DE 1439022A1
- Authority
- DE
- Germany
- Prior art keywords
- heat sink
- semiconductor component
- semiconductor
- component
- sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
- Kühlkörper für ein Halbleiterbauelement
Claims (1)
- Neue Patentansprüche
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19601789156 DE1789156C3 (de) | 1960-05-03 | 1960-05-03 | Kühlkörper für ein Halbleiterbauelement |
DE1960S0068334 DE1439022B2 (de) | 1960-05-03 | 1960-05-03 | Kühlkörper für ein Halbleiterbauelement |
DE19611439091 DE1439091A1 (de) | 1960-05-03 | 1961-07-21 | Kuehlkoerper mit Kuehlfahnen fuer Halbleiteranordnungen |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE1960S0068334 DE1439022B2 (de) | 1960-05-03 | 1960-05-03 | Kühlkörper für ein Halbleiterbauelement |
DES0074926 | 1961-07-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE1439022A1 true DE1439022A1 (de) | 1969-02-06 |
DE1439022B2 DE1439022B2 (de) | 1974-03-21 |
Family
ID=25996074
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1960S0068334 Granted DE1439022B2 (de) | 1960-05-03 | 1960-05-03 | Kühlkörper für ein Halbleiterbauelement |
DE19611439091 Pending DE1439091A1 (de) | 1960-05-03 | 1961-07-21 | Kuehlkoerper mit Kuehlfahnen fuer Halbleiteranordnungen |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19611439091 Pending DE1439091A1 (de) | 1960-05-03 | 1961-07-21 | Kuehlkoerper mit Kuehlfahnen fuer Halbleiteranordnungen |
Country Status (1)
Country | Link |
---|---|
DE (2) | DE1439022B2 (de) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2902771A1 (de) * | 1978-07-21 | 1980-01-31 | Bbc Brown Boveri & Cie | Kuehlvorrichtung fuer halbleiterbauelemente |
DE10014458A1 (de) * | 2000-03-23 | 2001-10-04 | Ulrich Grauvogel | Kühlkörper |
JP2006183122A (ja) * | 2004-12-28 | 2006-07-13 | Denso Corp | ダイカスト用アルミニウム合金およびアルミニウム合金鋳物の製造方法 |
-
1960
- 1960-05-03 DE DE1960S0068334 patent/DE1439022B2/de active Granted
-
1961
- 1961-07-21 DE DE19611439091 patent/DE1439091A1/de active Pending
Also Published As
Publication number | Publication date |
---|---|
DE1439022B2 (de) | 1974-03-21 |
DE1439091A1 (de) | 1969-01-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C3 | Grant after two publication steps (3rd publication) |