DE1427769A1 - Verfahren zum Zerlegen einer Halbleiterscheibe in Einzelelemente - Google Patents

Verfahren zum Zerlegen einer Halbleiterscheibe in Einzelelemente

Info

Publication number
DE1427769A1
DE1427769A1 DE19641427769 DE1427769A DE1427769A1 DE 1427769 A1 DE1427769 A1 DE 1427769A1 DE 19641427769 DE19641427769 DE 19641427769 DE 1427769 A DE1427769 A DE 1427769A DE 1427769 A1 DE1427769 A1 DE 1427769A1
Authority
DE
Germany
Prior art keywords
dividing
semiconductor wafer
individual elements
individual
elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19641427769
Other languages
English (en)
Inventor
Johannes Lotz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefunken Patentverwertungs GmbH
Original Assignee
Telefunken Patentverwertungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefunken Patentverwertungs GmbH filed Critical Telefunken Patentverwertungs GmbH
Publication of DE1427769A1 publication Critical patent/DE1427769A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043—Making grooves, e.g. cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • Dicing (AREA)

Description

  •

Claims (1)

  1. P a t -e n t a n s p r ü c h e
DE19641427769 1964-03-12 1964-03-12 Verfahren zum Zerlegen einer Halbleiterscheibe in Einzelelemente Pending DE1427769A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DET0025800 1964-03-12

Publications (1)

Publication Number Publication Date
DE1427769A1 true DE1427769A1 (de) 1968-12-19

Family

ID=7552311

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19641427769 Pending DE1427769A1 (de) 1964-03-12 1964-03-12 Verfahren zum Zerlegen einer Halbleiterscheibe in Einzelelemente

Country Status (1)

Country Link
DE (1) DE1427769A1 (de)

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