DE1279150B - Method for connecting components to printed circuit boards - Google Patents

Method for connecting components to printed circuit boards

Info

Publication number
DE1279150B
DE1279150B DE1967T0034962 DET0034962A DE1279150B DE 1279150 B DE1279150 B DE 1279150B DE 1967T0034962 DE1967T0034962 DE 1967T0034962 DE T0034962 A DET0034962 A DE T0034962A DE 1279150 B DE1279150 B DE 1279150B
Authority
DE
Germany
Prior art keywords
solder
conductor tracks
circuit boards
infrared
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE1967T0034962
Other languages
German (de)
Inventor
Dipl-Phys Hans Isert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tenovis GmbH and Co KG
Original Assignee
Telefonbau und Normalzeit GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonbau und Normalzeit GmbH filed Critical Telefonbau und Normalzeit GmbH
Priority to DE1967T0034962 priority Critical patent/DE1279150B/en
Priority to DE1968T0035897 priority patent/DE1292224B/en
Publication of DE1279150B publication Critical patent/DE1279150B/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0053—Soldering by means of radiant energy soldering by means of I.R.
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/304—Protecting a component during manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

BUNDESREPUBLIK DEUTSCHLANDFEDERAL REPUBLIC OF GERMANY

DEUTSCHESGERMAN

PATENTAMTPATENT OFFICE

AUSLEGESCHRIFTEDITORIAL

Int. CL:Int. CL:

H05kH05k

Deutsche KI.: 21a4-75German KI .: 21a4-75

Nummer: 1279150Number: 1279150

Aktenzeichen: P 12 79 150.3-35 (T 34962)File number: P 12 79 150.3-35 (T 34962)

Anmeldetag: 5. Oktober 1967 Filing date: October 5, 1967

Auslegetag: 3. Oktober 1968Open date: October 3, 1968

Die Erfindung betrifft ein Verfahren zum Verbinden von Bauelementen mit den Leiterzügen von Leiterplatten,The invention relates to a method for connecting components with the conductor tracks of Printed circuit boards,

Bei der Herstellung von Leiterplatten werden zwei Verfahren benutzt, um die Leiterzüge mit metallischen Überzügen als Ätzschutz zu versehen. Bei dem einen Verfahren werden Zinn- oder Zinnlegierungen zum Überziehen der Leiterbahnen und der durchkontaktierten Löcher angewendet, während nach dem anderen Verfahren eine mehrere Mikron starke Goldschicht auf den Leiterzügen und in den durchkontaktierten Löchern aufgebracht wird, wobei unter dem Gold Nickel aufgetragen ist.In the manufacture of printed circuit boards, two processes are used to make the conductor tracks with metallic To provide coatings as protection against corrosion. In one process, tin or tin alloys are used Plating the conductive traces and the plated through holes applied while after another Process a several micron thick layer of gold on the conductor tracks and in the plated through holes Holes is applied, with nickel is applied under the gold.

Das zuletzt genannte Verfahren hat Vorteile, wenn an den Leiterplatten Steckanschlüsse vorgesehen sind. Diese müssen aus verschiedenen Gründen vernickelt und vergoldet sein. Es erweist sich dann als zweckmäßig, in durchgehenden Arbeitsgängen gleich alle Leiterzüge, durchkontaktierte Löcher und Steckeranschlußstellen zu vernickeln und zu vergolden.The last-mentioned method has advantages if plug-in connections are provided on the circuit boards are. For various reasons, these have to be nickel-plated and gold-plated. It turns out then as expedient, all conductor tracks are plated through in continuous work steps Nickel-plating and gold-plating holes and plug connection points.

Beim Einlöten von Bauelementen in die durchkontaktierten Löcher derartiger Leiterplatten im Schwall-, Tauch- oder ähnlichen Verfahren ergeben sich aber Schwierigkeiten insofern, als sich das Gold der Leiterzüge mit sehr großer Geschwindigkeit, abhängig von der Zusammensetzung des Lotes und der Temperatur des Lötbades, im Lot löst und sowohl an den eigentlichen Lötstellen als auch im Lötbad spröde Gold-Zinn- bzw. Gold-Zinn-Blei-Verbindungen bildet. Es führen bereits Goldkonzentrationen von etwa 5 Gewichtsprozent zu völlig spröden Legierungen. Diese machen die Lötstelle gegen mechanische Beanspruchungen äußerst empfindlich.When soldering components into the plated-through holes of such circuit boards in the Surge, immersion or similar processes arise, however, insofar as the gold of the conductors at very high speed, depending on the composition of the solder and the Temperature of the solder bath, dissolves in the solder and both at the actual soldering points and in the solder bath forms brittle gold-tin or gold-tin-lead compounds. There are already gold concentrations from about 5 percent by weight to completely brittle alloys. These make the solder joint against mechanical Extremely sensitive to stress.

Gegenstand der Erfindung ist es, diesen Nachteil bei dem Einlöten von Bauelementen in Leiterplatten zu vermeiden. Erfindungsgemäß wird dies dadurch erreicht, daß die Leiterzüge in an sich bekannter Weise mit Gold oder einem anderen stark Infrarot reflektierenden, als Ätzschutz dienenden Material überzogen sind, daß das Lot an der Lötstelle um die Anschlüsse der Bauelemente ringförmig angeordnet ist und daß die Erwärmung des Lotes durch Infrarotstrahlen erfolgt.The object of the invention is to overcome this disadvantage when soldering components in printed circuit boards to avoid. According to the invention this is achieved in that the conductor tracks are known per se With gold or another highly infrared reflective material that acts as an etch protection material are coated so that the solder is arranged in a ring at the soldering point around the connections of the components and that the solder is heated by infrared rays.

Sollen die Bauelemente mit Hartlot eingelötet werden, so werden die mit einem Infrarot reflektierenden Überzug versehenen Leiterzüge beim Lötvorgang zusätzlich mit einer Blende abgedeckt, die an den Lötstellen mit entsprechenden Aussparungen versehen ist. Als Infrarotstrahlungsquelle wird vorzugsweise eine Halogen-Quarzlampe verwendet.If the components are to be soldered in with hard solder, those that are reflective with an infrared Coated conductor tracks are additionally covered with a cover during the soldering process, which is provided with corresponding recesses at the soldering points. The preferred infrared radiation source is a halogen quartz lamp is used.

Das erfindungsgemäße Verfahren wird an Hand Verfahren zum Verbinden von Bauelementen mit LeiterplattenThe method according to the invention is based on methods for connecting components with Printed circuit boards

Anmelder:Applicant:

Telefonbau und Normalzeit G. m. b. H.,Telephone construction and normal time G. m. B. H.,

6000 Frankfurt, Mainzer Landstr. 134-1466000 Frankfurt, Mainzer Landstr. 134-146

Als Erfinder benannt:Named as inventor:

Dipl.-Phys. Hans Isert, 6078 Neu IsenburgDipl.-Phys. Hans Isert, 6078 Neu Isenburg

der Zeichnungen anschließend näher erläutert. Es zeigtthe drawings explained in more detail below. It shows

Fig. 1 das Einlöten von Bauelementen in eine Leiterplatte mit Hilfe eines Infrarotstrahlers,Fig. 1 the soldering of components in a circuit board with the help of an infrared radiator,

Fig. 2 das gleiche Verfahren, jedoch mit einer zusätzlichen Blende.
Die in Fig. 1 dargestellte Leiterplatte 1 ist mit Leiterzügen 2 versehen und trägt durchkontaktierte Löcher 3. Als Ätzschutz sind die Leiterzüge und die durchkontaktierten Löcher nach dem Vernickeln mit einem Goldüberzug versehen. Die Bauelemente 4 sind mit ihren Anschlußenden 5 durch die Löcher 3 so hindurchgesteckt, daß sie auf der den Leiterzügen abgewandten Seite der Leiterplatte liegen.2 shows the same method, but with an additional diaphragm.
The circuit board 1 shown in Fig. 1 is provided with conductor tracks 2 and has plated through holes 3. As protection against etching, the conductor tracks and the plated through holes are provided with a gold coating after nickel-plating. The components 4 are inserted with their connection ends 5 through the holes 3 so that they lie on the side of the circuit board facing away from the conductor tracks.

Das Lot 6 wird in Form von Ringen über die Anschlußenden 5 der Bauelemente 5 gesteckt.
Zum Erhitzen des Lotes ist eine stabförmige Halogen-Quarzlampe 7 vorgesehen, die mit einem vorzugsweise elliptischen Reflektor 8 ausgestattet ist. Die Leiterplatte 1 wird mit den einzulötenden Bauelementen in Pfeilrichtung unter der Quarzlampe 7 hindurchbewegt. Hierbei wird das Lot 6 erhitzt und die Lötverbindung hergestellt. Das Infrarot reflektierende Gold auf den Leitern und in den Löchern 3 wird hierbei nicht erwärmt, so daß keine spröden Lötstellen entstehen können und auch die Leiter nicht erwärmt werden.The solder 6 is placed over the connection ends 5 of the components 5 in the form of rings.
A rod-shaped halogen quartz lamp 7, which is equipped with a preferably elliptical reflector 8, is provided for heating the solder. The circuit board 1 with the components to be soldered is moved in the direction of the arrow under the quartz lamp 7. Here, the solder 6 is heated and the soldered connection is made. The infrared reflecting gold on the conductors and in the holes 3 is not heated, so that no brittle solder points can arise and the conductors are not heated either.

Gegen eine Erwärmung weitgehend geschützt sind auch die Bauelemente auf der Rückseite der Leiterplatte, die gegebenenfalls durch einen Luftstrom gekühlt werden können. Bei diesem Verfahren gelangen an jede Lötstelle stets gleich große Lotmengen. Die Gefahr der Bildung von Lötbrücken ist ausgeschlossen, so daß kein Lötstopplack erforderlich ist. Ebenso sind keine kalten Lötstellen möglich. DasThe components on the back of the circuit board are also largely protected against heating. which can optionally be cooled by an air stream. Get in with this procedure Always the same amount of solder at each solder joint. The risk of the formation of solder bridges is excluded, so that no solder mask is required. Cold solder joints are also not possible. That

: :- 809 619/209:: - 809 619/209

Verfahren läßt sich gut automatisieren, und es wird viel Lot eingespart, so daß gegebenenfalls teureres, zinnfreies Lot verwendet werden kann. Bei größeren Platten können mehrere Lampen 7 angeordnet werden. Process can be easily automated, and a lot of solder is saved, so that possibly more expensive, tin-free solder can be used. In the case of larger plates, several lamps 7 can be arranged.

Soll eine hartgelötete Verbindung zwischen den Leiterbahnen und den Anschlußfahnen der Bauelemente hergestellt werden, so wird, wie in Fig. 2 dargestellt, verfahren. Die Anordnung zum Einlöten ist die gleiche wie in Fig. 1. Zum Schmelzen des Hartlotes ist jedoch eine längere Einwirkung der Infrarotstrahlung notwendig. Um hierbei die Leiterplatte 1 und die Leiterzüge 2 zusätzlich vor Erwärmung zu schützen, wird über der Leiterplatte eine Blende 9 angebracht und mit dieser unter der Quarzlampe 8 hindurchbewegt. Die Blende 9 besitzt eine Infrarot reflektierende Oberfläche und Aussparungen 10 oberhalb der Lötstellen. Das Hartlot 11 wird ebenfalls ringförmig auf die Anschlußenden aufgesteckt, aoShould a brazed connection between the conductor tracks and the connecting lugs of the components are produced, the procedure is as shown in FIG. 2. The arrangement for soldering is the same as in Fig. 1. To melt the However, hard solder requires a longer exposure to infrared radiation. To do this the circuit board 1 and the conductor tracks 2 to additionally protect against heating, a Aperture 9 attached and moved with this under the quartz lamp 8. The aperture 9 has a Infrared reflective surface and recesses 10 above the soldering points. The braze 11 is also placed in a ring on the connection ends, ao

Claims (3)

' Patentansprüche: : ' .'Claims::'. 1. Verfahren zum Verbinden von Bauelementen mit den Leiterzügen von Leiterplatten, dadurch gekennzeichnet, daß die Leiterzüge (2) in an sich bekannter Weise mit Gold oder einem anderen stark Infrarot reflektierenden, als Ätzschutz dienenden Material überzogen sind, daß das Lot (6 bzw. U) an der Lötstelle um die Anschlüsse (5) der Bauelemente (4) ringförmig angeordnet ist und daß die Erwärmung des Lotes durch Infrarotstrahlen erfolgt.1. A method for connecting components with the conductor tracks of printed circuit boards, thereby characterized in that the conductor tracks (2) in a known manner with gold or another The solder is coated with a highly infrared reflective material that serves as an etch protection (6 or U) at the soldering point around the connections (5) of the components (4) arranged in a ring and that the solder is heated by infrared rays. 2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß die mit einem Infrarot reflektierenden Überzug versehenen Leiterzüge (2) beim Lötvorgang zusätzlich durch eine Blende (9) abgedeckt werden, die an den Lötstellen mit entsprechenden Aussparungen (10) versehen ist.2. The method according to claim 1, characterized in that the reflective with an infrared Coated conductor tracks (2) are additionally covered by a cover (9) during the soldering process, which at the soldering points with corresponding recesses (10) is provided. 3. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß als Infrarotstrahlungsquelle eine Halogen-Quarzlampe (7) verwendet wird.3. The method according to claim 1, characterized in that the infrared radiation source a halogen quartz lamp (7) is used. Hierzu 1 Blatt Zeichnungen1 sheet of drawings 809 619/209 9.68 © Bundesdruckerei Berlin809 619/209 9.68 © Bundesdruckerei Berlin
DE1967T0034962 1967-10-05 1967-10-05 Method for connecting components to printed circuit boards Pending DE1279150B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE1967T0034962 DE1279150B (en) 1967-10-05 1967-10-05 Method for connecting components to printed circuit boards
DE1968T0035897 DE1292224B (en) 1967-10-05 1968-02-17 Method for soldering printed circuit boards with infrared rays

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1967T0034962 DE1279150B (en) 1967-10-05 1967-10-05 Method for connecting components to printed circuit boards

Publications (1)

Publication Number Publication Date
DE1279150B true DE1279150B (en) 1968-10-03

Family

ID=7558883

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1967T0034962 Pending DE1279150B (en) 1967-10-05 1967-10-05 Method for connecting components to printed circuit boards

Country Status (1)

Country Link
DE (1) DE1279150B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0315228A1 (en) * 1987-11-04 1989-05-10 Peter Gammelin Soldering apparatus
EP0326821A1 (en) * 1988-02-01 1989-08-09 Siemens Aktiengesellschaft Apparatus for the treatment with radiation of circuit boards clad with surface-mounted component
DE3839396A1 (en) * 1988-11-22 1990-05-23 Nixdorf Computer Ag Method and device for soldering electrical components lying on a printed circuit board to the printed circuit board

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5196667A (en) * 1987-04-11 1993-03-23 Peter Gammelin Soldering and desoldering device
EP0315228A1 (en) * 1987-11-04 1989-05-10 Peter Gammelin Soldering apparatus
WO1989004589A1 (en) 1987-11-04 1989-05-18 Peter Gammelin Welding device
EP0326821A1 (en) * 1988-02-01 1989-08-09 Siemens Aktiengesellschaft Apparatus for the treatment with radiation of circuit boards clad with surface-mounted component
DE3839396A1 (en) * 1988-11-22 1990-05-23 Nixdorf Computer Ag Method and device for soldering electrical components lying on a printed circuit board to the printed circuit board

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