DE1160176B - Process for the production of molding compounds from basic polyamides, compounds containing NCO groups and epoxy resins in the liquid phase - Google Patents

Process for the production of molding compounds from basic polyamides, compounds containing NCO groups and epoxy resins in the liquid phase

Info

Publication number
DE1160176B
DE1160176B DER32772A DER0032772A DE1160176B DE 1160176 B DE1160176 B DE 1160176B DE R32772 A DER32772 A DE R32772A DE R0032772 A DER0032772 A DE R0032772A DE 1160176 B DE1160176 B DE 1160176B
Authority
DE
Germany
Prior art keywords
epoxy resins
liquid phase
compounds
nco groups
production
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DER32772A
Other languages
German (de)
Inventor
Dipl-Ing Hans O Schroeder
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rheinische Blattmetall AG
Original Assignee
Rheinische Blattmetall AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rheinische Blattmetall AG filed Critical Rheinische Blattmetall AG
Priority to DER32772A priority Critical patent/DE1160176B/en
Publication of DE1160176B publication Critical patent/DE1160176B/en
Pending legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40High-molecular-weight compounds
    • C08G18/4009Two or more macromolecular compounds not provided for in one single group of groups C08G18/42 - C08G18/64
    • C08G18/4054Mixtures of compounds of group C08G18/60 with other macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)

Description

Verfahren zur Herstellung von Formmassen aus basischen Polyamiden, NCO-Gruppen aufweisenden Verbindungen und Epoxyharzen in flüssiger Phase An aufgetragene Massen, wie Schutzschichten für die Verpackung von Lebensmitteln oder Klebschichten für Formkörper oder Kaschierungen, werden - da es sich um Werterhaltung sehr empfindlicher Güter handelt - hohe Anforderungen gestellt.Process for the production of molding compounds from basic polyamides, Compounds containing NCO groups and epoxy resins in the liquid phase Masses, such as protective layers for food packaging or adhesive layers for moldings or laminations, because it is a question of maintaining value, they are very sensitive Goods trades - high demands are made.

Außer den technischen Erfordernissen ist jedoch für deren Einsatzmöglichkeit auch maßgebend, daß bei der kontinuierlichen Beschichtung von Trägermaterial von der Rolle weg in Fertigbandstraßen z. B. die Dauer der Einbrennzeit genügend kurz ist, weil die bauliche Länge der Trocknungsvorrichtungen und die maximale Arbeitsgeschwindigkeit davon abhängen. In addition to the technical requirements, however, is for their possible use also decisive that in the continuous coating of carrier material of the role away in prefabricated strip lines z. B. the duration of the burn-in time is short enough is because of the structural length of the drying devices and the maximum working speed depends on.

Kombinationen von Äthoxylin- und Phenolharzen erfordern dabei Einbrennzeiten von etwa 15 Minuten. Combinations of ethoxylin and phenolic resins require stoving times of about 15 minutes.

Durch Zusatz von Härtern bzw. durch Erhöhung der Härtermenge kann in einigen Fällen die Aushärtung beschleunigt werden. Es muß aber in Kauf genommen werden, daß die Topfzeit der Lösung verkürzt und die Elastizität der gebildeten Schicht verringert wird. By adding hardeners or by increasing the amount of hardener in some cases the hardening process can be accelerated. But it has to be accepted be that the pot life of the solution is shortened and the elasticity of the formed Layer is reduced.

Es ist bereits bekannt, daß als Überzugsmittel dienende Reaktionsprodukte aus Polyurethanen und basischen Polyamiden schon in Lösung bei der Zugabe von Epoxyharzen reagieren. Es ist fernerhin bekannt, daß ungeschützte Isocyanate sofort mit verschiedenen organischen Gruppen, speziell OH-Gruppen, zur Reaktion führen, was zu einer Verdickung der Lösung und demzufolge zu Schwierigkeiten bei dem maschinellen Auftrag führt. Es ist deshalb versucht worden, mit phenolverkappten Isocyanaten eine bessere Beständigkeit der Lösungen von basischen Polyamiden mit Epoxyharzen zu erreichen, was jedoch nur unvollkommen gelang, weil diese Lösungen je nach Temperatur Mischungsverhältnis und Flüssigkeitsbewegung schon nach wenigen Minuten mehr oder weniger verdickten. Nach kurzer Zeit ging die Reaktion bis zur Gelatinierung. It is already known that reaction products used as coating agents from polyurethanes and basic polyamides already in solution with the addition of epoxy resins react. It is also known that unprotected isocyanates immediately with various organic groups, especially OH groups, lead to a reaction, which leads to a thickening the solution and consequently leads to difficulties in the machine application. Attempts have therefore been made to achieve better resistance with phenol-capped isocyanates of solutions of basic polyamides with epoxy resins to achieve what, however, only Succeeded imperfectly, because these solutions depending on the temperature mixing ratio and fluid movement more or less thickened after just a few minutes. After a short time the reaction proceeded to gelatinization.

Das erfindungsgemäße Verfahren zur Herstellung von Formmassen aus basischen Polyamiden, verkappten, mindestens zwei NCO-Gruppen aufweisenden Verbindungen und Epoxyharzen in flüssiger Phase ist dadurch gekennzeichnet, daß die basischen Polyamide in Dispersionsform verwendet werden. Auf diese Weise wird die Haltbarkeit der Lösung verlängert. Die Topfzeit der Mischungen gestattet eine Verarbeitung an den Maschinen über längere Zeiträume (70 Minuten und mehr), obwohl die drei Komponenten in ihrem Mengenverhältnis keiner Beschränkung unterworfen sind. Als Zusatz zu dieser Mischung haben sich einerseits Phenolharze (speziell Alkylphenolharze) und andererseits ungesättigte Verbindungen (speziell Triallylcyanurat) bewährt, die sich in parallelen oder gemeinsamen Reaktionen an der Aushärtung beteiligen. The inventive method for the production of molding compositions from basic polyamides, masked compounds containing at least two NCO groups and epoxy resins in the liquid phase is characterized in that the basic Polyamides are used in dispersion form. This way the durability increases the solution extended. The pot life of the mixtures allows processing the machines for long periods of time (70 minutes and more), although the three components are not subject to any restriction in their quantitative ratio. As an addition to this Mixture have on the one hand phenolic resins (especially alkylphenolic resins) and on the other hand unsaturated compounds (especially Triallylcyanurat) proven, which are in parallel or participate in joint reactions in the curing process.

Diese Dispersionen ergeben hochwertige Schichten, die bei höherer Temperatur in außerordentlich kurzer Zeit gebildet werden. These dispersions result in high-quality layers, which with higher Temperature can be formed in an extremely short time.

In den nachfolgenden Beispielen ist als Epoxyharz (Äthoxylinharz) Epichlorhydrin-Bisphenolharz (Epoxydwert etwa 0,2), als basisches Polyamid niedermolekulares, basisches Polyamid mit einer Aminzahl von etwa 90, halbfest und als zwei NCO-Gruppen aufweisende Verbindung phenolverkapptes Diisocyanat aufgeführt. In the following examples, the epoxy resin (ethoxylin resin) Epichlorohydrin bisphenol resin (epoxy value approx. 0.2), as a basic polyamide, low molecular weight, basic polyamide with an amine number of about 90, semi-solid and as two NCO groups containing compound phenol-capped diisocyanate listed.

Vergleichsversuch 30 Teile phenolverkapptes Diisocyanat, 50 0/o, in Toluol (2/s)-Methyläthylketon (3/5) gelöst, 35 Teile Epichlorhydrin-Bisphenolharz (Epoxydwert etwa 0,2), 500/0, wie oben gelöst, 35 Teile niedermolekulares, basisches Polyamid mit einer Aminzahl von etwa 90, halbfest, 50 O/o, wie oben gelöst. Comparative experiment 30 parts of phenol-capped diisocyanate, 50%, dissolved in toluene (2 / s) methyl ethyl ketone (3/5), 35 parts of epichlorohydrin bisphenol resin (Epoxy value about 0.2), 500/0, as solved above, 35 parts of low molecular weight, basic Polyamide with an amine number of about 90, semi-solid, 50%, dissolved as above.

100 Teile Die Mischung wird schnell dicker und geliert bald. 100 parts The mixture thickens quickly and soon gels.

Beispiel 5 Teile entionisiertes Wasser mit 2 0/o eines Emulgators für » Öl-in-Wasser«-Emulsionen, 25 Teile phenolverkapptes Diisocyanat in Lösung, wie oben gelöst, 29,5 Teile Epichlorhydrin-Bisphenolharz-(Epoxydwert etwa 0,2)Lösung, wie oben gelöst, 29,5 Teile wäßrige 500/obige Dispersion von niedermolekularem, basischem Polyamid mit einer Aminzahl von etwa 90, halbfest. Example 5 parts of deionized water with 2% of an emulsifier for "oil-in-water" emulsions, 25 parts of phenol-capped diisocyanate in solution, dissolved as above, 29.5 parts of epichlorohydrin bisphenol resin (epoxy value about 0.2) solution, dissolved as above, 29.5 parts of aqueous 500 / above dispersion of low molecular weight, basic polyamide with an amine number of about 90, semi-solid.

89 Teile Die Mischung läßt sich bei Zimmertemperatur auftragen und bleibt über 1 Stunde verarbeitungsfähig. Die Durchhärtung erfolgt beim Einbrennen. Durch weitere Zusätze von 4 Teilen Alkylphenolharzlösung 50 O/o, wie oben gelöst, und 7 Teilen Triallylcyanurat 50 0/o, wie oben gelöst, 100 Teile lassen sich Aushärtungseigenschaften, Chemikalien-, Wärme- und Wasserfestigkeit modifizieren und verbessern, ohne daß die Topfzeit ungünstig beeinflußt wird. Durch Unterbringung der besonders schnell reagierenden Substanzen in zwei verschiedenen Phasen gelingt es demnach erfindungsgemäß, die Härtezeit beim Einbrennen der Schutzschicht abzukürzen, die Topfzeit der Lösung jedoch zu verlängern. 89 parts The mixture can be applied at room temperature and remains workable for over 1 hour. The hardening takes place during stoving. By further additions of 4 parts of alkylphenol resin solution 50%, as dissolved above, and 7 parts of triallyl cyanurate 50%, as dissolved above, 100 parts can be hardening properties, Modify and improve chemical, heat and water resistance, without the Pot life is adversely affected. By accommodating those who react particularly quickly According to the invention, substances in two different phases are therefore successful Shorten the curing time when baking the protective layer, the pot life of the solution however to extend.

Die Dicke der nach dem erfindungsgemäßen Verfahren erhaltenen Schichten kann in weiten Grenzen variiert werden. Das Verfahren gestattet die Herstellung von Formmassen aus basischen Polyamiden, verkappten, mindestens zwei NCO-Gruppen aufweisenden Verbindungen und Epoxyharzen in flüssiger Phase, deren Konzentration keinen Beschränkungen unterworfen ist. The thickness of the layers obtained by the process according to the invention can be varied within wide limits. The method allows manufacture of molding compounds made from basic polyamides, masked, at least two NCO groups containing compounds and epoxy resins in the liquid phase, their concentration is not subject to any restrictions.

Claims (1)

PATENTANSPRUCH: Verfahren zur Herstellung von Formmassen aus basischen Polyamiden, verkappten, mindestens zwei NCO-Gruppen aufweisenden Verbindungen und Epoxyharzen in flüssiger Phase, dadurch gekennzeichnet, daß die basischen Polyamide in Dispersionsform verwendet werden. PATENT CLAIM: Process for the production of molding compounds from basic Polyamides, masked compounds containing at least two NCO groups and Epoxy resins in the liquid phase, characterized in that the basic polyamides can be used in dispersion form. In Betracht gezogene Druckschriften: Deutsche Auslegeschrift Nr. 1090 803. Documents considered: German Auslegeschrift No. 1090 803.
DER32772A 1962-05-23 1962-05-23 Process for the production of molding compounds from basic polyamides, compounds containing NCO groups and epoxy resins in the liquid phase Pending DE1160176B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DER32772A DE1160176B (en) 1962-05-23 1962-05-23 Process for the production of molding compounds from basic polyamides, compounds containing NCO groups and epoxy resins in the liquid phase

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DER32772A DE1160176B (en) 1962-05-23 1962-05-23 Process for the production of molding compounds from basic polyamides, compounds containing NCO groups and epoxy resins in the liquid phase

Publications (1)

Publication Number Publication Date
DE1160176B true DE1160176B (en) 1963-12-27

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1090803B (en) * 1959-06-10 1960-10-13 Schering Ag Coating agents or reactive lacquers

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1090803B (en) * 1959-06-10 1960-10-13 Schering Ag Coating agents or reactive lacquers

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