DE1151165B - Device for covering contact strips during dip soldering of the conductor tracks of insulating plates - Google Patents
Device for covering contact strips during dip soldering of the conductor tracks of insulating platesInfo
- Publication number
- DE1151165B DE1151165B DEF31161A DEF0031161A DE1151165B DE 1151165 B DE1151165 B DE 1151165B DE F31161 A DEF31161 A DE F31161A DE F0031161 A DEF0031161 A DE F0031161A DE 1151165 B DE1151165 B DE 1151165B
- Authority
- DE
- Germany
- Prior art keywords
- contact strips
- dip soldering
- conductor tracks
- insulating plates
- covering contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 title claims description 12
- 239000004020 conductor Substances 0.000 title claims description 4
- 229920002379 silicone rubber Polymers 0.000 claims description 3
- 239000004945 silicone rubber Substances 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 description 4
- 239000002966 varnish Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000001035 drying Methods 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0557—Non-printed masks
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Description
Vorrichtung zum Abdecken von Kontaktstreifen beim Tauchlöten der Leiterzüge von isolierenden Platten Die Erfindung bezieht sich auf Vorrichtungen zum Abdecken von Kontaktstreifen, die dem elektrischen Anschluß der Leiterzüge von isolierenden Platten (Schaltplatten) an elektrische Stecker dienen, beim Tauchlöten.Device for covering contact strips during dip soldering of the conductor tracks of insulating panels The invention relates to devices for covering of contact strips, the electrical connection of the conductor tracks of insulating Plates (circuit boards) on electrical plugs are used in dip soldering.
Bei der Tauchlötung von Schaltplatten dürfen die auf diesen aufgebrachten Kontaktstreifen nicht verzinnt werden. Diese Kontaktstreifen sind üblicherweise versilberte oder vergoldete Kupferfolien. Um zu verhindern, daß sie bei der Tauchlötung verzinnt werden, wurden sie bisher mit Schutzlack überzogen. Dies erfordert jedoch mehrere Arbeitsgänge. Der Schutzlack muß aufgebracht und anschließend getrocknet werden. Nach der Tauchlötung muß der Schutzlack durch ein Lösungsmittel entfernt und schließlich müssen die Kontaktstreifen gereinigt werden. Die Erfindung bezweckt, eine Vorrichtung anzugeben, bei deren Verwendung derartige Arbeitsgänge vermieden werden.When soldering circuit boards by dip soldering, the Contact strips are not tinned. These contact strips are common silver-plated or gold-plated copper foils. To prevent them from being immersed in soldering are tinned, they were previously coated with protective varnish. However, this requires several operations. The protective lacquer must be applied and then dried will. After dip soldering, the protective varnish must be removed with a solvent and finally the contact strips must be cleaned. The invention aims to specify a device which, when used, avoids such operations will.
Die erfindungsgemäße Vorrichtung besteht aus einem aus Silicongummi gefertigten Schuh, der den Kontaktstreifen in einem Schlitz umfaßt.The device according to the invention consists of a silicone rubber manufactured shoe, which includes the contact strip in a slot.
Sie hat den Vorteil, daß sich das Aufbringen eines Schutzlackes und die damit zusammenhängenden Arbeitsgänge des Trocknens, der Entfernung des Lackes und der Reinigung der Kontaktstreifen erübrigen.It has the advantage that the application of a protective varnish and the related operations of drying, removing the varnish and there is no need to clean the contact strips.
Der Schuh ist in Form eines Klotzes hergestellt und mit einem derartigen quaderförmigen Schlitz versehen, daß der Teil der Schaltplatten, auf den die Kontaktstreifen aufgebracht sind, in den Schlitz einschiebbar ist.The shoe is made in the form of a block and with such a block cuboid slot provided that the part of the circuit boards on which the contact strips are applied, can be inserted into the slot.
Die Erfindung wird an Hand eines Ausführungsbeispiels beschrieben. Es zeigt Fig. 1 eine Schaltplatte und einen Schuh in getrenntem Zustand, Fig. 2 eine Schaltplatte und einen Schuh in ineinandergeschobenem Zustand.The invention is described using an exemplary embodiment. 1 shows a circuit board and a shoe in a separated state, FIG. 2 a shift plate and a shoe in a nested condition.
Fig. 1 zeigt eine Schaltplatte 1, die über Kontaktstreifen 2 an nicht dargestellte Stecker elektrisch anschließbar ist. Um zu verhindern, daß bei der Tauchlötung auch die Kontaktstreifen 2 verzinnt werden, wird der Schuh 3 auf den Teil 4 der Schaltplatte 1 aufgeschoben. Dadurch werden die Kontaktstreifen 2, wie aus Fig. 2 ersichtlich, abgedeckt, und das Lot kann bei der nun vorzunehmenden Tauchlötung nicht an die Kontaktstreifen 2 gelangen. Dagegen werden alle nicht abgedeckten Stellen 10 der Kupferfolie verzinnt. Nach vorgenommener Tauchlötung wird der Schuh 3 entfernt, und damit werden die Kontaktstreifen 2 freigegeben. Zwecks einfacherer Darstellung sind nur vier Kontaktstreifen dargestellt und nicht deren zwölf, wie sie beispielsweise für handelsübliche Stecker erforderlich sind.Fig. 1 shows a circuit board 1, which can be electrically connected to connectors (not shown) via contact strips 2. In order to prevent the contact strips 2 from being tinned during dip soldering, the shoe 3 is pushed onto part 4 of the circuit board 1. As a result, the contact strips 2 are covered, as can be seen from FIG. 2, and the solder cannot reach the contact strips 2 during the dip soldering that is now to be carried out. In contrast, all uncovered areas 10 of the copper foil are tinned. After the dip soldering has been carried out, the shoe 3 is removed, and the contact strips 2 are thus released. For the sake of simplicity, only four contact strips are shown and not twelve, as are required, for example, for commercially available plugs.
Der Schuh 3 ist aus Silikonkautschuk hergestellt, einem Material, welches bei der Temperatur des Lötbades von rund 235° C beständig ist und welches das Bad nicht verschmutzt oder verändert. Dieser Schuh ist wiederholt verwendbar.The shoe 3 is made of silicone rubber, a material which is resistant at the temperature of the solder bath of around 235 ° C and which the bathroom is not dirty or altered. This shoe can be used repeatedly.
Der Teil 4 der Schaltplatte 1, auf den die Kontaktstreifen 2 aufgebracht sind, ist in bezug auf die Kante 5 der Schaltplatte 1 derart zurückgesetzt, daß die Leisten 6 und 7 entstehen. Diese Leisten 6 bzw. 7 lassen sich in Nuten 8 bzw. 9 des Schuhes 3 einschieben, so daß ein guter Sitz des Schuhes 3 während der Tauchlötung gewährleistet ist.The part 4 of the circuit board 1 to which the contact strips 2 are applied are, is set back with respect to the edge 5 of the circuit board 1 such that the strips 6 and 7 are created. These strips 6 and 7 can be inserted into grooves 8 or 9 of the shoe 3 insert so that a good fit of the shoe 3 during the dip soldering is guaranteed.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DEF31161A DE1151165B (en) | 1960-05-05 | 1960-05-05 | Device for covering contact strips during dip soldering of the conductor tracks of insulating plates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DEF31161A DE1151165B (en) | 1960-05-05 | 1960-05-05 | Device for covering contact strips during dip soldering of the conductor tracks of insulating plates |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE1151165B true DE1151165B (en) | 1963-07-04 |
Family
ID=7094075
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DEF31161A Pending DE1151165B (en) | 1960-05-05 | 1960-05-05 | Device for covering contact strips during dip soldering of the conductor tracks of insulating plates |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE1151165B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3829412A1 (en) * | 1988-08-30 | 1990-03-01 | Siemens Ag | Soldering apparatus |
| DE3832424A1 (en) * | 1988-09-23 | 1990-03-29 | Siemens Ag | Soldering apparatus |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB825297A (en) * | 1956-02-16 | 1959-12-16 | Gen Mills Inc | Improvements in or relating to the production of soldered joints on circuit carrying panels |
-
1960
- 1960-05-05 DE DEF31161A patent/DE1151165B/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB825297A (en) * | 1956-02-16 | 1959-12-16 | Gen Mills Inc | Improvements in or relating to the production of soldered joints on circuit carrying panels |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3829412A1 (en) * | 1988-08-30 | 1990-03-01 | Siemens Ag | Soldering apparatus |
| DE3832424A1 (en) * | 1988-09-23 | 1990-03-29 | Siemens Ag | Soldering apparatus |
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