DE112021007307T5 - Component push-up device and component assembly device - Google Patents

Abstract

A component push-up device pushes a die upward from beneath a wafer adhered to a wafer plate to separate the die from the wafer plate. The component push-up device includes a push-up tool having a suction surface that sucks a lower surface of the wafer plate by negative pressure, and a push-up pin provided to be directed from the suction surface to the wafer plate protrudes and retracts therein, with the push-up pin protruding from the suction surface to push the die upward; and a support member movable relative to and along the wafer and removably supporting the push-up tool. A magnet is included in one of the push-up tool and the support member, and at least one surface of another of the push-up tool and the support member opposite the magnet is made of a magnetic material.

Description

Technical area

The present invention relates to a component pushing-up device that pushes a die (bare chip) upwards from underneath a wafer plate or wafer foil in order to separate the die when the die is detached from a wafer adhering to the wafer plate is recorded, and a component or component assembly device that contains the component push-up device.

State of the art

A component mounting device is known which picks up a die (bare chip) from a singulated wafer and mounts the die on a substrate. In this component mounting apparatus, such a process is repeated in which a wafer camera captures an image of a wafer being conveyed by a wafer feeder to a predetermined position (component placement area) in the apparatus to detect the wafer, and then a head with a function of holding a die and receiving a die.

The component mounter includes a component push-up device that, before the die is picked up, pushes a die upward from beneath the wafer adhered to a wafer plate to separate the die from the wafer plate. The component push-up device includes a cylindrical suction housing and a push-up pin provided at a central portion of the suction housing to extend and retract. While the suction housing sucks the wafer plate from its lower surface or underside, the push-up pin pushes the die up from below.

Because the dies vary in size, the component push-up device must be used with a suction housing and push-up pin appropriate for the size of a die. For example, Patent Literature 1 discloses a component push-up device that includes a unit called a suction cup with a suction housing and a push-up pin, the suction cup being replaceable. A clamping mechanism is mounted in the suction cup, and the suction cup can be attached to and detached from a predetermined attachment part by operating a lever.

However, in the component push-up device of Patent Literature 1, the assembly of the clamping mechanism complicates the peripheral structures of the suction housing and the push-up pin. In a component push-up device that includes a movable head with a suction housing and a push-up pin, and in which the head pushes up a die while moving with respect to a wafer, an increase in weight of the head due to assembly of the clamping mechanism can result in cycle time losses.

citation list

Patent literature

Patent literature 1: JP 2012-169321 A

Summary of the invention

The present invention was created in view of the problem described above. It is an object of the present invention to enable changing of a push-up tool such as a suction housing and a push-up pin with a simpler configuration in a component push-up device.

A component pushing-up device according to one aspect of the present invention is a component pushing-up device that pushes up a die from underneath a wafer adhered to a wafer plate to remove the die from the wafer plate to separate, wherein the component push-up device is a push-up tool with a suction surface that sucks a lower surface or bottom of the wafer plate by negative pressure, and a push-up pin provided so that it is from the suction surface to the protruding and retracting into the wafer plate, the push-up pin protruding from the suction surface to push the die upward, and including a support member provided to be relative to and along the wafer is movable and removably supports or carries the push-up tool, wherein a magnet is provided on one of the push-up tool and the support member and at least one surface of another of the push-up tool and the support member opposite the magnet consists of a magnetic material.

A component mounting apparatus according to one aspect of the present invention includes a component feeder in which a wafer that has been singulated and adhered to a wafer plate is placed, a component transfer head that has a die disposed in the component feeder Picks up the wafer and transfers the die to a substrate, and the above-mentioned component or component push-up device, which transfers a die from below half of the wafer plate pushes up when the component transfer head picks up the die.

Brief description of the drawings

• 1 Fig. 10 is a top plan view showing an overall configuration of a component mounter (a component mounter with a component push-up device of the present invention) according to an embodiment of the present invention.
• 2 is a schematic perspective view showing a head unit and a push-up unit.
• 3 is a perspective view of the high-pressure unit.
• 4 is an enlarged perspective view of a main part of the push-up unit.
• 5 is a perspective view of a push-up head.
• 6 is a cross-sectional view of the high pressure head.
• 7(A) until 7(C) are explanatory views of a process of pushing up a die by the pushing up head.
• 8th is a table showing a relationship between magnetic poles of a fixed magnet of a suction case and a fixed magnet of a suction case.

Description of the embodiments

Preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[Description of the component assembly device]

1 Fig. 10 is a top plan view showing an overall configuration of a component mounter 1 according to an embodiment of the present invention. The component mounting device 1 is a device that mounts a die 7a (component or component) from a separated wafer 7 on a substrate P. The component mounting device 1 includes a base 2, a conveyor 3, a head unit 4, a component feeder 5 (component placement area), a wafer feeder 6, a camera unit 32U and a push-up unit 40. 2 is a schematic perspective view showing the head unit 4 and a push-up unit 40 not shown in FIG 1 appears.

The base 2 is a base on which various devices included in the component mounting device 1 are mounted. The conveyor 3 is a conveying path for the substrate P and is installed on the base 2 so as to extend in the X direction. The conveyor 3 carries the substrate P from outside the apparatus to a predetermined mounting position, and carries the substrate P out from the mounting position to the outside of the apparatus after mounting. The position where the substrate P in 1 is the mounting position. The component feeder 5 feeds a plurality of dies 7a in an arrangement of the separated wafer 7.

The head unit 4 picks up the die 7a from the component feeder 5, moves the die 7a to the mounting position, and mounts the die 7a on the substrate P. The head unit 4 includes a plurality of heads 4H (“component transfer heads” of the present invention ), which suck and hold the Die 7a when the picking is performed. The head 4H can extend and retract (move up and down) in the Z direction with respect to the head unit 4 and can rotate about an axis. The head unit 4 is mounted with a substrate recognition camera 31 that images the substrate P. A reference mark on the substrate P is recognized from the image captured by the substrate recognition camera 31, and a positional deviation is corrected when a component is mounted.

The component mounting device 1 includes a drive mechanism D1 that can move the head unit 4 in a horizontal direction (X and Y directions) between the component feeder 5 and the substrate P held at the mounting position. The drive mechanism D1 includes a pair of Y-axis fixed rails 13, a pair of Y-axis first servo motors 14, a pair of ball screw shafts 15, and a support frame 16 having a pair of Y-axis fixed Rails 13 are bridged, with one of each pair on the +X side and the other on the -X side. The ball screw shaft 15 is screwed into a nut 17 provided on the support frame 16. The drive mechanism D1 includes a guide member (not shown) mounted on the support frame 16, a first X-axis servo motor 18 and a ball screw shaft 19. The guide member supports the head unit 4 so that it is movable in the X direction, and the ball screw shaft 19 is screwed into a nut (not shown) provided on the head unit 4.

The head unit 4 moves in a horizontal direction (X and Y directions) by an operation of the drive mechanism D1 described above. That is, the head unit 4 moves integrally with the support frame 16 in the Y direction by rotating the first Y-axis servo motor 14 driving the ball screw 15. The head unit 4 moves in the X direction with respect to the support frame 16 by rotating the first X-axis servo motor 18 driving the ball screw shaft 19.

The component feeder 5 contains the wafer feeder 6, which feeds a plurality of dies 7a in the form of the wafer 7 to a predetermined component or component removal position (wafer table 10). The wafer feeder 6 includes a wafer holding frame 8 that holds a wafer plate 8a. A group of a number of dies 7a, 7a, ... formed by singulating the wafer 7 into a grid pattern adheres to the wafer plate 8a. The wafer feeder 6 exchanges the wafer holding frames 8, thereby guiding the die 7a to the component removal position.

The wafer feeding device 6 contains a wafer storage lift 9, the wafer table 10 and a wafer conveyor 11. The wafer storage lift 9 stores the wafer plates 8a in several vertical tables, to which the wafer 7 adheres and each are held by the wafer holding frame 8. The wafer table 10 is installed on the base 2 on the -Y side of the wafer storage elevator 9. The wafer table 10 is disposed adjacent to the mounting position where the supported substrate P stops on the +Y side. The wafer conveyor 11 pulls the wafer holding frame 8 from the wafer storage lift 9 onto the wafer table 10.

The camera unit 32U is movable in the X direction and the Y direction and includes a wafer camera 32. The wafer camera 32 images a part of the wafer 7 positioned on the wafer table 10, i.e. H. the The 7a in a camera view. Based on the captured image, the position of the 7a to be captured is recognized. The component mounter 1 includes a drive mechanism D2 that causes the camera unit 32U to move in a horizontal direction (X and Y directions) between the component feeder 5 and a predetermined standby position.

The drive mechanism D2 includes a pair of Y-axis fixed rails 33, a second Y-axis servo motor 34, a ball screw shaft 35 and a support frame 36 which includes a pair of Y-axis fixed rails 33 bridged, with one of the fixed Y-axis rails 33 on the +X side and the other on the -X side, with the second Y-axis servo motor 34 and the ball screw shaft 35 on the +X side condition. The ball screw shaft 35 is screwed into a nut 37 provided on the support frame 36. The drive mechanism D2 includes a guide member (not shown) mounted on the support frame 36, a second X-axis servo motor 38 and a ball screw shaft 39. The guide member supports the camera unit 32U so that it is movable in the X direction, and the ball screw shaft 39 is screwed into a nut (not shown) provided on the camera unit 32U.

The camera unit 32U moves in a horizontal direction (X and Y directions) by an operation of the drive mechanism D2 described above. That is, the camera unit 32U moves integrally with the support frame 36 in the Y direction by rotating the second Y-axis servo motor 34 driving the ball screw 35. The camera unit 32U moves in the X direction with respect to the support frame 36 by rotating the second X-axis servo motor 38 driving the ball screw shaft 39.

The push-up unit 40 is disposed below the component feeder 5 and pushes the die 7a to be sucked by the head 4H upward from the lower surface side of the wafer plate 8a. The push-up unit 40 is arranged on the base 2 so that it is movable in the X and Y directions within a range approximately corresponding to the wafer table 10. The component mounting device 1 includes a drive mechanism D3 that makes the push-up unit 40 movable.

The drive mechanism D3 includes a support frame 42 movable along a pair of guide rails 41 extending in the Y direction, a ball screw shaft 43 extending in the Y direction, and a third Y-axis servo motor 44. The ball screw shaft 43 is screwed into a nut (not shown) provided on the support frame 42. An X-direction moving mechanism includes a guide member (not shown) mounted on the support frame 42, a third X-axis servo motor 46, and a ball screw shaft 45. The guide member thus supports the push-up unit 40 that it is movable in the X direction, and the ball screw shaft 45 is screwed into a nut (not shown) provided on the push-up unit 40.

The push-up unit 40 moves in a horizontal direction (X and Y directions). an operation of the drive mechanism D3 described above. That is, the push-up unit 40 moves in the Y direction integrally with the support frame 42 by rotating the third Y-axis servo motor 44 driving the ball screw shaft 43. The push-up unit 40 moves in the X direction with respect to the support frame 42 by rotating the third X-axis servo motor 46 driving the ball screw shaft 45.

The push-up unit 40 includes two push-up heads 50A and 50B, each provided with a push-up pin 71 that pushes up the die 7a, as will be described in detail later (only the push-up pin 71 is shown in FIG 2 shown). The push-up unit 40 lifts the push-up pin 71 to push the die 7a up through the wafer plate 8a when the die 7a is sucked by the head 4H. In this example, the above-described push-up unit 40 and the drive mechanism D3 correspond to the “component push-up device” of the present invention.

A component or component recognition camera 30 is mounted on the base 2. Before the die 7a is mounted on the substrate P, the component recognition camera 30 takes images from below the die 7a, which is sucked in by the head 4H of the head unit 4. Based on the captured image, it is determined whether the head 4H has abnormally sucked the chip 7a, whether it has not sucked the die 7a, etc.

A basic operation of the component mounting device 1 described above is as follows. First, the wafer conveyor 11 pulls the wafer holding frame 8 out of the wafer storage lift 9. As a result, the wafer plate 8a, to which a group of several dies 7a, 7a, ... adheres (wafer 7), is arranged on the wafer table 10 together with the wafer holding frame 8.

Next, the camera unit 32U moves over the wafer table 10 and images the wafer 7. The imaging or image recording by the camera unit 32U serves to recognize a group of dies 7a that are to be sucked in by the head 4H during the next recording or removal.

When the imaging of the group of dies 7a is completed, the camera unit 32U retracts from above the wafer table 10 and the head unit 4 is positioned above the wafer table 10 while the push-up unit 40 is positioned below the wafer 7. Then, the head 4H picks up from the wafer 7 the group of dies 7a recognized by the imaging by the camera unit 32U. In this pick-up, the push-up pin 71 of the push-up unit 40 is raised to push the die 7a up through the wafer plate 8a.

After recording the die 7a, the head unit 4 moves from above the wafer table 10 to above the component recognition camera 30 to above the substrate P at the mounting position. The die 7a sucked by the head 4H is then mounted on the substrate P.

Synchronously with the movement of the head unit 4 from above the wafer table 10 after taking the picture 7a, the camera unit 32U moves to enter the space above the wafer table 10. Thereafter, the head unit 4 and the camera unit 32U move to alternately enter and exit the space above the wafer table 10 to repeat the recording of the die 7a and the mounting of the die 7a on the substrate P.

[Detailed structure of high-pressure unit 40]

3 is a perspective view of the push-up unit 40 and 4 is an enlarged perspective view of a main part of the push-up unit 40. 5 is a perspective view of the push-up heads 50A and 50B provided on the push-up unit 40, and 6 is a cross-sectional view of the push-up head 50A (50B).

The push-up unit 40 includes a base frame 47 connected to the drive mechanism D3. The base frame 47 includes a pair of the push-up heads 50A and 50B, a switching mechanism D4 that switches the push-up heads 50A or 50B, a first lifting mechanism D5 that causes the push-up heads 50A and 50B to slide out in the Z direction, or to retract (move up and down), and a second lifting mechanism D6 that causes the later-described push-up pin 71 provided on the push-up heads 50A and 50B to extend or retract (up) in the Z direction and move off).

The push-up heads 50A and 50B push the die 7a up through the wafer plate 8a when the die 7a is sucked by the head 4H. The push-up heads 50A and 50B basically have the same structure except that the type of the push-up tool 60 described later is different.

As in 5 and 6 As shown, the push-up head 50A (50B) includes a base member 52 and a push-up tool 60 mounted on the base member 52. The high-pressure tool 60 contains a Suction housing 62 for sucking the wafer plate 8a from below, and a pen holder 63. The pen holder 63 includes a top-closed cylindrical holder body 70 and a push-up pin 71 held at the upper end of the holder body 70. The push-up pin 71 pushes the die 7a upwards.

The optimal type of number, arrangement, size (diameter and length) and tip shape of the push-up pins 71 provided on the pin holder 63 differs for different sizes of the die 7a, circuits formed on the die 7a, and the like. Therefore, the pen holder 63 including the most suitable push-up pin 71 corresponding to the die 7a is selected from a plurality of types of pin holders 63 and mounted in the push-up head 50A (50B).

The push-up head 50A (50B) includes a push-up main shaft 74 supported by the base member 52 to be movable in the up-down direction. The pin holder 63 is detachably attached to the upper end of the push-up main shaft 74. The push-up main shaft 74 is a splined shaft and is supported to be movable in the up-down direction (movable in the Z direction) by a splined bearing 75 mounted in one in the base member 52 formed through hole 55 is attached. A cylindrical pin base 72 is fixed near the upper end of the push-up main shaft 74 in a state of slightly protruding upward (referred to as a protruding portion 74a).

The pin base 72 includes a base body 72a and a fixed magnet 72b stacked on the upper end of the base body 72a. The fixing magnet 72b has a ring shape that is flat in the Z direction and is disposed on the base body 72a, with the protruding portion 74a (press-up main shaft 74) penetrating the center of the fixing magnet 72b. The fixing magnet 72b is arranged so that it does not come off from the protruding portion 74a (press-up main shaft 74).

The pen holder 63 is disposed on the pen base 72 with the protruding portion 74a inserted into the holder body 70 and positioned circumferentially with respect to the protruding portion 74a. The entire holder body 70 or at least one surface or surface of the holder body 70 facing the pin base 72 (fixing magnet 72b) consists of a magnetic material such as iron. That is, the pen holder 63 is fixed to the pen base 72 by the magnetic force of the fixing magnet 72b. The pen holder 63 (holder body 70) and the pen base 72 have approximately the same outer diameter and are attached to each other to integrally form a single columnar shape.

A lower end portion of the push-up main shaft 74 projects downward from the base member 52, and a cylindrical driver member 76 is provided at the lower end portion. A coil spring 78 is attached to the push-up main shaft 74 at a location between the driver member 76 and the lower surface of the base member 52. The push-up main shaft 74 is biased downward (in the -Z direction) by the elastic force of the coil spring 78, whereby the pin base 72 abuts against the spline bearing 75 and is in a fully lowered position (the position in 6 ) is held.

The suction housing 62 includes a top-closed cylindrical portion 65 having a suction surface 66 at the upper end that sucks the wafer plate 8a, and a flange 67 extending from the lower end portion of the cylindrical portion 65. The suction housing 62 is attached to the upper surface 54 of the base member 52 via the flange 67. An annular protruding portion 53 is protrudingly provided to surround the through hole 55 on the upper surface 54 of the base member 52, and a recessed portion 67b corresponding to the protruding portion 53 is formed in the lower surface of the flange 67. The suction housing 62 is disposed on the upper surface 54 of the base member 52, with the protruding portion 53 engaged with (fitting into) the recessed portion 67b. A cutout 67a is formed in an edge of the flange 67, and a positioning pin 69 provided upright on the upper surface 54 is inserted into the cutout 67a. Thereby, the suction housing 62 is positioned in the circumferential direction with respect to the base member 52.

A plurality of fixed magnets 68 are arranged at a constant interval in the circumferential direction around the projection portion 53 on the upper surface 54 of the base member 52. These fixed magnets 68 are embedded in the base member 52 such that the upper surfaces of the fixed magnets 68 and the upper surface 54 of the base member 52 are flush with one another. Meanwhile, the entire suction housing 62 or at least a surface or surface of the suction housing 62 (fixed magnets 68) facing the base member 52 is made of a magnetic material such as iron. That is, the suction housing 62 is fixed or attached to the base member 52 by the magnetic force of the fixed magnets 68.

Between the inner ceiling surface or surface of the cylindrical section 65 of the A gap is formed between the suction housing 62 and the holder body 70 of the pen holder 63, which allows the pen holder 63 to be raised and lowered. When the push-up main shaft 74 is raised from the fully lowered position to raise the pin holder 63 to a position in which the pin holder 63 abuts the top surface of the cylindrical portion 65 or to a position close to this position, the push-up pin 71 stands out Pin hole 66a formed in the suction surface 66 (ceiling surface). Through this projection, the push-up pin 71 can push the die 7a upwards. Meanwhile, when the pin holder 63 is positioned in the fully lowered position together with the push-up main shaft 74, the push-up pin 71 is retracted into the pin holder 63. Meanwhile, for example, the amount of protrusion of the push-up pin 71 from the suction surface 66 is changed (adjusted) according to the type of die 7a.

In this example, the base member 52 and the pin base 72 correspond to the “support member” of the present invention. In particular, the base member 52 corresponds to the “base section” and the pin base 72 corresponds to the “movable section”.

The push-up head 50A (50B) includes a vacuum supply mechanism for sucking the wafer plate 8a. The vacuum supply mechanism includes a vacuum port 57 provided in a lower portion of the base member 52 and a vacuum passage 56 formed in the base member 52. The vacuum connection 57 is connected to a vacuum generator 58 (see 3 ) connected by a pipe (not shown). The vacuum passage 56 introduces vacuum into the through hole 55, which is supplied to the vacuum port 57. Thereby, negative pressure is supplied to the interior of the suction housing 62 (cylindrical portion 65) through the through hole 55.

The suction surface 66 has a plurality of concentric annular grooves and openings (not shown) through which the annular grooves communicate with the interior of the suction housing 62. A negative pressure passage provided between the suction housing 62 and the pin holder 63 communicates with each opening, and negative pressure is supplied to the annular grooves through the openings (the wafer plate 8a is sucked via the annular grooves), thereby causing the wafer plate 8a to pass through the suction surface 66 is sucked in.

As in 3 and 4 As shown, the push-up unit 40 includes a movable frame 48 movable in the X direction with respect to the base frame 47. The push-up heads 50A and 50B are mounted side by side on the movable frame 48 in the X direction. The movable frame 48 is connected to an operating shaft 49a of a first air cylinder 49 fixed to the base frame 47, and the movable frame 48 slides back and forth in the X direction by operating the first air cylinder 49. When the movable frame 48 is in an advanced position, the push-up heads 50A are in a predetermined working position Wp (the Fig 3 state shown), and when the movable frame 48 is in a retracted position, the push-up head 50B is disposed at the working position Wp. This performs switching between the push-up heads 50A and 50B used for pushing up the die 7a. The movable frame 48 and the first air cylinder 49 constitute the switching mechanism D4.

The push-up heads 50A and 50B are supported by a pair of guide rails 51 provided on the movable frame 48 to extend in the Z direction to be movable in the up-down direction. The first lifting mechanism D5 for raising and lowering the push-up heads 50A and 50B includes a pair of the guide rails 51, a first push-up member 81, a second air cylinder 80, and a cam mechanism (not shown). The first push-up member 81 is provided below the push-up head 50A (50B) positioned at the working position Wp to be movable in the up-down direction. The first push-up member 81 is raised and lowered by the second air cylinder 80, which operates the cam mechanism to raise and lower the push-up head 50A (50B) positioned at the working position Wp between the raised position and the lowered position. In the raised position, the suction surface 66 of the suction housing 62 abuts the lower surface of the wafer plate 8a held by the wafer holding frame 8 disposed on the wafer table 10 this one close.

The second lifting mechanism D6 for raising and lowering the push-up pin 71 includes a second push-up member 82, a Z-axis servo motor 84 and a transmission mechanism 83. The components of the second lifting mechanism D6 are mounted on a bracket (not shown) which is attached to the first push-up member 81. Therefore, the second lifting mechanism D6 is raised and lowered together with the first push-up member 81.

The second push-up member 82 is provided on the Y side of the first push-up member 81 and below the push-up head 50A (50B) in the working position Wp. The second push-up member 82 is a block member with a flat top surface. The second push-up member 82 is supported by a guide member (not shown) attached to the bracket to move in the up-down direction. The second push-up member 82 is driven by the Z-axis servo motor 84 via the transmission mechanism 83 including a feed screw mechanism or the like, and is raised and lowered along the guide member.

When the second push-up member 82 is positioned at the fully lowered position, as shown in 6 As shown, the upper surface of the second push-up member 82 faces, via a small gap, the lower surface of the driver member 76 of the push-up main shaft 74 of the push-up head 50A (50B), which is positioned at the working position Wp. By lifting the second push-up member 82, the push-up main shaft 74 is pushed up against the biasing force of the coil spring 78, and the pin holder 63 (pull-up pin 71) is raised along with the lifting of the push-up main shaft 74, whereby the push-up pin 71 protrudes from the pin hole 66a of the suction housing 62 . Then, by lowering the second push-up member 82, the push-up main shaft 74 is lowered while receiving the biasing force of the coil spring 78, and is returned to the fully lowered position in which the push-up main shaft 74 was previously positioned. As a result, the push-up pin 71 retracts into the suction housing 62.

The reference number 58 in 3 denotes a vacuum generator attached to the base frame 47. The vacuum generator 58 is connected to the vacuum port 57 of the high-pressure heads 50A and 50B via a pipe (not shown). The negative pressure generator 58 switches between a mode of supplying negative pressure to the high-pressure heads 50A and 50B for sucking the wafer plate and a mode of stopping supplying negative pressure (discharging to the atmosphere).

[Operation and effect of the high-pressure unit 40]

7(A) until 7(C) are explanatory views of a process of pushing up the die Fig. 7a by the pushing up heads 50A and 50B. In 7(A) until 7(C) the representation of die 7a (wafer 7) is omitted. As described above, when the head 4H picks up the die 7a from the wafer 7, the push-up unit 40 is positioned under the wafer 7 and pushes the die 7a up through the wafer plate 8a. A specific operation of the high-pressure unit 40 is as follows.

First, of the two push-up heads 50A and 50B, the push-up head used for pushing up the die 7a is positioned at the working position Wp by the operation of the switching mechanism D4. The push-up unit 40 is moved by the operation of the drive mechanism D3, and the push-up head 50A (50B) positioned at the working position Wp is positioned under the die 7a to be pushed up ( 7(A) .

Next, the push-up head 50A (50B) positioned at the working position Wp is raised by the operation of the first lifting mechanism D5 ( 7(B) ). Through this operation, the suction surface 66 of the suction case 62 comes into contact with or comes close to the bottom of the wafer plate 8a, and the wafer plate 8a is sucked by the suction surface 66 by negative pressure. This negative pressure suction is performed at substantially the same time as the time when the push-up head 50A (50B) reaches the fully raised position (at the same time when the suction surface 66 comes into contact with the lower surface of the wafer plate 8a). or comes close to it).

Subsequently, the pin holder 63 is raised and lowered together with the push-up main shaft 74 by the operation of the second lifting mechanism D6. Through this process, the push-up pin 71 protrudes from the suction housing 62 (suction surface 66) and penetrates the wafer plate 8a to push the die 7a upward ( 7(C) ). Here, the push-up pin 71 (pin holder 63) is raised and lowered at the same time or at a slightly later time than the suction of the wafer plate 8a by the suction housing 62. The push-up pin 71 is raised and lowered in one of the ways, that is, either raised and lowered continuously or temporarily held in position after raising and then lowering.

When picking up the die 7a is completed, the push-up pin 71 (pin holder 63) is returned to the fully lowered position and the supply of negative pressure by the negative pressure generator 58 is stopped. In this state, the push-up unit 40 is moved by the operation of the drive mechanism D3, and the push-up head 50A (50B) is positioned under the die 7a to be pushed up next. That is, the push-up unit 40 moves while the suction surface 66 of the suction housing 62 slides on or remains near the underside of the wafer plate 8a.

Then the wafer plate 8a is sucked in by negative pressure, the push-up pin 71 (pin holder 63) is raised and lowered by the operation of the second lifting mechanism D6 to push up the next die 7a ( 7(C) ), and the suction of the wafer plate 8a by negative pressure is stopped. Then the push-up process of the die 7a is repeated in a similar manner.

In the push-up unit 40, although the push-up tool 60 suitable for pushing up the die 7a is mounted in the push-up heads 50A and 50B, replacing the push-up tool 60 of each push-up head 50A (50B) is required when necessary, for example, when changing the wafer 7. In this case, the push-up tool 60 including the suction housing 62 and the pen holder 63 must be replaced.

In the high-pressure unit 40 described above, the suction housing 62 is fixed or attached to the base member 52 by the fixed magnets 68. The pen holder 63 is also fixed or attached to the pen base 72 by the fixed magnet 72b. Therefore, an operator can easily replace the push-up tool 60 without using a tool by simply lifting and removing the suction case 62 and the pen holder 63 in this order from the base member 52 or the like, and a new suction case 62 and a new pen holder 63 in reverse order to put them in their place.

In this case, the attractive forces of the fixed magnets 68 and 72b are set within a range of 5 to 30 N, respectively. The attraction range is determined experimentally in order to achieve both the stability of attraction of the suction case 62 and the pen holder 63 and easy manual attachment and detachment of the suction case 62 and the pen holder 63 by the operator. Therefore, the operator can replace the suction case 62 and the pen holder 63 with a simple operation.

Therefore, according to the configuration of the push-up unit 40, the push-up tool 60 (suction housing 62 and pin holder 63) is replaceable with a simple configuration compared to a conventional structure (Patent Literature 1) that includes a clamping mechanism for replacing a push-up tool. In addition, since the fixed magnets 68 and 72b are simply mounted in the base member 52, the weight of the push-up head 50A (50B) basically does not increase significantly. Therefore, there is no adverse effect due to an increase in weight of the push-up head 50A (50B), which could easily lead to loss of time in moving the push-up unit 40.

In addition, the fixed magnets 68 and 72b for fixing or fastening the high-pressure tool 60 (suction housing 62 and pin holder 63) are arranged only on the base member 52 and the pin base 72. Therefore, the fixed magnets 68 and 72b can be commonly used for a plurality of types of high-pressure tools 60, which makes sense.

Although not mentioned in the above description, in the push-up unit 40, the orientation of the magnetic pole of the fixed magnets 68 that fixes the suction housing 62 and the orientation of the magnetic pole of the fixed magnet 72b that fixes the pin holder 63 are the same. This means that no repulsive force acts between the fixed magnet 68 and the fixed magnet 72b. Like in particular 8th shown, when the upper surface side of the fixed magnet 72b (pen holder magnet) is the N pole, the upper surface side of the fixed magnets 68 (suction housing magnets) is also set as the N pole (combination 1). When the upper surface side of the fixed magnet 72b is an S pole, the upper surface side of the fixed magnets 68 is also set as an S pole (combination 2).

This configuration avoids the following adverse event caused by a repulsive force. As described above, when the push-up heads 50A and 50B move to the position for the next die 7a of the same wafer 7, the push-up heads 50A and 50B move while the suction surface 66 of the suction housing 62 slides on the underside of the wafer plate 8a or stays near them ( 7(B) ). If a repulsive force acts during this movement, the suction housing 62 can be raised against the elastic force of the coil spring 78, since the fixed magnet 72b (second magnet), which fixes or fastens the pen holder 63, is higher than the fixed magnets 68 (first magnets ), which fix or fasten the suction housing 62 in the high-pressure unit 40. If this happens, the push-up pin 71 may inadvertently protrude from the suction housing 62 and damage the wafer plate 8a. In this regard, according to the configuration of the push-up unit 40 in which the orientations of the magnetic poles of the fixed magnets 68 and 72b are the same, no repulsive force occurs and the occurrence of such an adverse event is avoided.

The component mounter 1 described above is an example of a preferred embodiment of a component mounter that includes the component push-up device according to the present invention, and the specific configuration of the component mounter 1 and the component push-up device can be changed accordingly without departing from the essence of the present invention to deviate from the invention. For example, a configuration described below can be used.

In the embodiment, for example, the fixed magnets 68 and 72b for fixing or fastening the high-pressure tool 60 (suction housing 62 and pin holder 63) are arranged on the base member 52 and on the base body 72a. However, the fixed magnets 68 and 72b can be provided on the high-pressure tool 60 (suction housing 62 and pin holder 63) or on both, i.e. on the base member 52 and on the base body 72a, and on the high-pressure tool 60. For example, in some cases, the attractive force may preferably be changed according to the size of the suction housing 62 (suction surface 66). In such cases, the fixed magnet 68 can be provided on the suction housing 62. The same applies to the relationship between the pen holder 63 and the fixed magnet 72b.

In the embodiment, the fixed magnets 68 for fixing the suction housing 62 are provided at a constant distance around the projection portion 53 on the upper surface 54 of the base member 52, and the fixed magnet 72b for fixing the pen holder 63 has a ring shape . The fixed magnets 68 and 72b may take other specific shapes as long as the suction housing 62 and the pen holder 63 can be removably fixed. However, the configuration in which the fixed magnet is intermittently provided at a constant distance or in a continuous ring shape around the push-up center of the push-up tool 60, as in the embodiment, is advantageous in that the magnetic force is uniformly applied to the push-up tool 60 (suction housing 62 and pin holder 63 ) acts to stably fix or fasten the high-pressure tool 60.

Furthermore, in the embodiment, the example in which the component pushing-up device according to the present invention is applied to the component mounting device has been described. However, the component pushing-up device according to the present invention can be applied to various devices such as a tape device that accommodates a die formed by cutting a wafer into a tape or a component mounting device that mounts the die on a substrate.

[Invention Included in Embodiments]

A component push-up device according to one aspect of the present invention is a component push-up device that pushes up a die from underneath a wafer adhered to a wafer plate to separate the die from the wafer plate, wherein the Component push-up device is a push-up tool having a suction surface that sucks a lower surface of the wafer plate by negative pressure, and a push-up pin provided so as to protrude from the suction surface toward the wafer plate and retracts therein, the push-up pin protruding from the suction surface to push the die upward, and including a support member provided to be movable relative to and along the wafer and the push-up tool removably supports or carries, wherein a magnet is provided on one of the push-up tool and the support member and at least one surface or surface of another of the push-up tool and the support member opposite the magnet consists of a magnetic material.

According to the configuration of the component push-up device, the push-up tool can be changed (replaced) with a simple configuration compared to a conventional structure with a special clamping mechanism.

More specifically, in the component push-up device, the support member includes a base portion and a movable portion that can be raised and lowered with respect to the base portion, and the push-up tool includes a suction housing that is hollow, includes the suction surface at an upper end, and through the base portion is removably supported, and a pin holder that holds the push-up pin is disposed inside the housing to be removably supported by the movable portion, and is raised and lowered together with the movable portion, wherein the magnet is provided on one of the suction housing and the base portion, and at least one surface of the other of the suction housing and the base portion facing the magnet is made of the magnetic material, and the magnet is provided on one of the pen holder and the movable portion, and at least one of the Magnets opposite or opposite surface or surface of the other of the pen holder and the movable section consists of the magnetic material.

In this component pushing-up device, a plurality of members which are provided as a pushing-up tool, i.e. H. the suction housing and the pen holder, can be changed (replaced) with a simple configuration.

In the component pushing-up device described above, it is desirable that the magnet is provided on the support member.

According to this configuration, the magnet is commonly used for a plurality of high-pressure tools (suction housing and pin holder), which is reasonable.

It should be noted that when the support member includes the base portion and the movable portion and the push-up tool includes the suction housing and the pen holder, and when the component push-up device is configured so that a second magnet, which is a magnet for fixing the pen holder to the movable portion is disposed higher than a first magnet, which is a magnet for fixing the suction case to the base portion in a state in which the pen holder is located together with the movable portion at a lowered position with respect to the suction case , it is preferable that the orientations of magnetic poles of the first magnet and the second magnet are the same.

According to this configuration, a repulsion force acting between the magnets and preventing the pen holder from functioning properly, i.e. H. causes the pen holder to be unintentionally raised so that the push-up pin protrudes can be avoided.

In the component push-up device described above, the magnet is preferably provided in the form of magnets which are intermittently arranged at a constant distance or in a continuous ring shape around a push-up center of the push-up tool.

According to this configuration, a magnetic force uniformity acts on the push-up tool to stably fix the push-up tool.

Furthermore, in the component push-up device described above, an attractive force for attracting the push-up tool by the magnet is preferably in a range of 5 to 30 N.

According to this configuration, both stable suction by the push-up tool and easy manual attachment and detachment of the push-up tool by the operator can be achieved.

A component mounting apparatus according to one aspect of the present invention includes a component feeder in which a wafer that has been singulated and adhered to a wafer plate is placed, a component transfer head that has a die disposed in the component feeder picks up a wafer and transfers the die to a substrate, and the above-mentioned component push-up device according to one of the above-mentioned aspects, which pushes up a die from below the wafer plate when the component transfer head picks up the die.

According to the configuration of this component mounting device including the component push-up device described above, the push-up tool can be changed (replaced) with a simple configuration.

QUOTES INCLUDED IN THE DESCRIPTION

This list of documents listed by the applicant was generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• JP 2012169321 A [0006]

Claims (7)

Component push-up device that pushes a die upward from underneath a wafer adhered to a wafer plate to separate the die from the wafer plate, the component push-up device comprising: a push-up tool having a suction surface that sucks a lower surface of the wafer plate by negative pressure, and a push-up pin provided to protrude from the suction surface toward the wafer plate, and retracts into this with the push-up pin protruding from the suction surface to push the die upward; and a support member provided to be movable relative to and along the wafer and to removably support the push-up tool, wherein a magnet is provided on one of the push-up tool and the support member, and at least one surface of another of the push-up tool and the support member opposite the magnet is made of a magnetic material. Component push-up device Claim 1 , wherein the support member includes a base portion and a movable portion that is raised and lowered with respect to the base portion, the push-up tool includes a suction housing that is hollow, includes the suction surface at an upper end, and is removably supported by the base portion and a pin holder that holds the push-up pin is disposed inside the housing to be removably supported by the movable portion, and is raised and lowered together with the movable portion, the magnet on one of the suction housing and the Base section is provided, and at least one surface of the other of the suction housing and the base section facing the magnet is made of the magnetic material, and the magnet is provided on one of the pen holder and the movable section, and at least one surface opposite the magnet or surface of the other of the pen holder and the movable section is made of the magnetic material. Component push-up device Claim 1 or 2 , wherein the magnet is contained in the carrier member. Component push-up device Claim 3 , wherein the support member includes the base portion and the movable portion and the push-up tool includes the suction housing and the pen holder, and the component push-up device is configured so that a second magnet, which is a magnet for fixing the pen holder to the movable portion, is higher is arranged as a first magnet, which is a magnet for fixing the suction housing to the base portion in a state in which the pen holder is located together with the movable portion at a lowered position with respect to the suction housing, alignments of magnetic poles of the first magnet and the second magnet are the same. Component push-up device according to one of the Claims 1 until 4 , wherein the magnet is preferably provided in the form of magnets which are intermittently arranged at a constant distance or in a continuous ring shape around a high-pressure center of the high-pressure tool. Component push-up device according to one of the Claims 1 until 5 , wherein an attractive force for attracting the high-pressure tool by the magnet is preferably in a range of 5 to 30 N. Component mounting apparatus comprising: a component feeder in which a wafer which has been singulated and adheres to a wafer plate is placed; a component transfer head that picks up a die from a wafer disposed in the component feeder and transfers the die to a substrate; and the component or component push-up device according to one of the Claims 1 until 6 , which pushes a die up from underneath the wafer plate as the component transfer head picks up the die.

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