DE112021005388T8 - Trägermessvorrichtung, trägermessverfahren und trägerverwaltungsverfahren - Google Patents
Trägermessvorrichtung, trägermessverfahren und trägerverwaltungsverfahren Download PDFInfo
- Publication number
- DE112021005388T8 DE112021005388T8 DE112021005388.4T DE112021005388T DE112021005388T8 DE 112021005388 T8 DE112021005388 T8 DE 112021005388T8 DE 112021005388 T DE112021005388 T DE 112021005388T DE 112021005388 T8 DE112021005388 T8 DE 112021005388T8
- Authority
- DE
- Germany
- Prior art keywords
- carrier
- measuring device
- management method
- measuring
- carrier measuring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000007726 management method Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
- G01B5/02—Measuring arrangements characterised by the use of mechanical techniques for measuring length, width or thickness
- G01B5/06—Measuring arrangements characterised by the use of mechanical techniques for measuring length, width or thickness for measuring thickness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/28—Work carriers for double side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020-171944 | 2020-10-12 | ||
JP2020171944A JP7425411B2 (ja) | 2020-10-12 | 2020-10-12 | キャリア測定装置、キャリア測定方法、及びキャリア管理方法 |
PCT/JP2021/036539 WO2022080159A1 (ja) | 2020-10-12 | 2021-10-04 | キャリア測定装置、キャリア測定方法、及びキャリア管理方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE112021005388T5 DE112021005388T5 (de) | 2023-07-27 |
DE112021005388T8 true DE112021005388T8 (de) | 2023-09-28 |
Family
ID=81208014
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE112021005388.4T Active DE112021005388T8 (de) | 2020-10-12 | 2021-10-04 | Trägermessvorrichtung, trägermessverfahren und trägerverwaltungsverfahren |
Country Status (7)
Country | Link |
---|---|
US (1) | US20230384077A1 (de) |
JP (1) | JP7425411B2 (de) |
KR (1) | KR20230065329A (de) |
CN (1) | CN116367961A (de) |
DE (1) | DE112021005388T8 (de) |
TW (1) | TWI789895B (de) |
WO (1) | WO2022080159A1 (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11921175B2 (en) | 2021-04-28 | 2024-03-05 | Canon Medical Systems Corporation | Arrayed structure and magnetic resonance imaging apparatus |
CN115638757B (zh) * | 2022-11-11 | 2023-11-28 | 法博思(宁波)半导体设备有限公司 | 一种硅片量测范围无限制的装置及方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52125725A (en) | 1976-04-15 | 1977-10-21 | Toshiba Ray O Vac | Alkaline battery |
JPS6056793B2 (ja) | 1978-12-27 | 1985-12-11 | 株式会社日立製作所 | プラズマ表面処理装置 |
JPS5732858U (de) | 1980-08-01 | 1982-02-20 | ||
JPS6056793U (ja) | 1983-09-22 | 1985-04-20 | 三菱重工業株式会社 | ジェット着地位置、角度表示装置 |
US6544103B1 (en) | 2000-11-28 | 2003-04-08 | Speedfam-Ipec Corporation | Method to determine optimum geometry of a multizone carrier |
JP5732858B2 (ja) | 2011-01-12 | 2015-06-10 | 株式会社Sumco | 基板厚み測定装置及び基板厚み測定方法 |
JP6056793B2 (ja) | 2014-03-14 | 2017-01-11 | 信越半導体株式会社 | 両面研磨装置用キャリアの製造方法及び両面研磨方法 |
JP6622117B2 (ja) * | 2016-03-08 | 2019-12-18 | スピードファム株式会社 | 平面研磨装置及びキャリア |
KR101856875B1 (ko) | 2016-12-06 | 2018-05-10 | 에스케이실트론 주식회사 | 웨이퍼 캐리어 두께 측정장치 |
JP7070010B2 (ja) * | 2018-04-16 | 2022-05-18 | 株式会社Sumco | キャリアの製造方法および半導体ウェーハの研磨方法 |
JP7110877B2 (ja) * | 2018-09-27 | 2022-08-02 | 株式会社Sumco | ワークの両面研磨装置および両面研磨方法 |
-
2020
- 2020-10-12 JP JP2020171944A patent/JP7425411B2/ja active Active
-
2021
- 2021-09-06 TW TW110133000A patent/TWI789895B/zh active
- 2021-10-04 KR KR1020237012110A patent/KR20230065329A/ko unknown
- 2021-10-04 WO PCT/JP2021/036539 patent/WO2022080159A1/ja active Application Filing
- 2021-10-04 DE DE112021005388.4T patent/DE112021005388T8/de active Active
- 2021-10-04 US US18/030,660 patent/US20230384077A1/en active Pending
- 2021-10-04 CN CN202180069702.3A patent/CN116367961A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
TW202217943A (zh) | 2022-05-01 |
WO2022080159A1 (ja) | 2022-04-21 |
US20230384077A1 (en) | 2023-11-30 |
JP2022063602A (ja) | 2022-04-22 |
CN116367961A (zh) | 2023-06-30 |
TWI789895B (zh) | 2023-01-11 |
DE112021005388T5 (de) | 2023-07-27 |
JP7425411B2 (ja) | 2024-01-31 |
KR20230065329A (ko) | 2023-05-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R012 | Request for examination validly filed |