DE112019007391T5 - DEVICE MOUNT MANAGEMENT DEVICE, DEVICE MOUNT MANAGEMENT METHOD, DEVICE MOUNT MANAGEMENT PROGRAM AND DATA CARRIER - Google Patents

Abstract

On a display 64, charts B2, B3, B4 showing a change over time of OEE components (degree of utilization, degree of performance, degree of quality) (constituent change over time) are displayed together with the state of occurrence of events correlating with the components (long-term standstill, short-term Downtime, set-up work, errors, suction errors and placement defects and the like) in production lines La, Lb, Lc displayed (Fig. 4 to 12). Administrative personnel can therefore determine the event that is the cause of a decrease in the OEE components based on the occurrence of the events. In this way, the administrative staff can easily take effective measures regarding the decrease in the OEE components.

Description

technical field

The invention relates to a technique for managing a component placement system for manufacturing component-mounted printed circuit boards based on OEE.

General state of the art

Component placement systems for manufacturing circuit boards loaded with components are widely used. Patent Document 1 discloses a mounting management apparatus that manages a component mounting system using OEE (Overall Equipment Effectiveness). According to this mounting management device, the production of the printed circuit boards can be managed by examining the OEE items of utilization rate, efficiency level, and quality level.

Prior Art Documents

patent documents

Patent Document 1: WO 2016/203533

Summary of the Invention

object of the invention

With the above method, although a decrease in the OEE components can be detected, it cannot detect the fact of the occurrence of an event that is the cause of the decrease. Therefore, it may be difficult for administrative staff to take effective action on the decline in OEE components.

The present invention has been made in view of the above problem, and has as an object to provide a technique that enables management personnel in managing a component mounting system for manufacturing component-mounted circuit boards based on OEE to take effective measures against decline without difficulty to meet the OEE components.

means of solving the task

A component mounting management apparatus according to the present invention includes a display and a control section that displays a component change over time, which indicates a change over time in OEE components for a component mounting system for manufacturing circuit boards mounted with components, on the display, the control section monitoring the occurrence of on the Component placement system occurring events with correlation to the components on the display indicates.

A component mounting management method according to the present invention includes a step of displaying a time component change indicating a time change of OEE components for a component mounting system for manufacturing component mounted boards on a display, and a step of displaying an occurrence of occurring on the component mounting system Events correlated to the constituents on the display.

A component mounting management program according to the present invention causes a computer, a step of displaying a component change over time indicating a change over time of OEE components for a component mounting system for manufacturing component-mounted circuit boards on a display, and a step of displaying an occurrence of on events occurring in the component placement system with correlation to the components on the display.

A data carrier according to the invention stores the component placement management program in a manner which can be read by a computer.

In the present invention with this configuration (device for component mounting management, method for component mounting management, program for component mounting management and data carrier), together with a component change over time indicating the change over time of the OEE components, the occurrence of events with correlation to the components in the component mounting system shown on the display. Administrative personnel can therefore determine the event that is the cause of the decrease in OEE components based on the fact of occurrence of the events. In this way, the administrative staff can easily take effective measures regarding the decrease in the OEE components.

The component mounting management apparatus may be configured to further include an operation section that accepts an input operation from management personnel for the component for which a component change over time is indicated on the display, and the control section displays at least one of usage rate, performance level, and quality level of the OEE on the display, and displays the state of occurrence of an event with correlation to the item to which the input operation relates, on the display. With this configuration, by performing an input operation for an item of interest, the management personnel can recognize the state of occurrence of an event correlated to that item.

The device for component mounting management may be configured such that a usage rate change, which indicates a change in the usage rate over time, is displayed as a time component change on the display, and the control section treats each stoppage of a plurality of devices of the component mounting system as an event correlating with the usage rate and a Device idle time, which is the time during which the device is idle, for each device as a state of occurrence of the event on the display. With this configuration, the management personnel can recognize the state of occurrence of the event correlating with the utilization rate and determine the event that is a cause of the decrease in the utilization rate. In this way, the management staff can easily take effective measures against the decline in the utilization rate.

The component mounting management device may be configured such that the operation section accepts, as an input operation, an operation for selecting a device from a plurality of devices whose device down time is displayed on the display, and the control section accepts a plurality of errors that have occurred at that one device, each as an event is treated with correlation to the utilization degree and displays a failure dead time, which is a time during which a failure has caused this device to be dead, for each failure as the state of occurrence of the event on the display. With this configuration, the management personnel can recognize the state of occurrence of failures on a device of interest and determine the failure that is a cause of the drop in the utilization rate. In this way, the management staff can easily take effective measures against the decline in the utilization rate.

The component mounting management apparatus may be configured such that a utilization rate change indicating a temporal change in the utilization rate is displayed as a temporal component change on the display, and the control section treats respective set-up works on a plurality of devices of the component mounting system as an event correlating with the utilization rate and for each Device displays a setup time, which is the time required for the setup work, as the state of occurrence of the event on the display. With this configuration, the management personnel can know the state of occurrence of setup work on the devices of the component mounting system and determine the setup work that is the cause of the decrease in the utilization efficiency. In this way, the management staff can easily take effective measures against the decline in the utilization rate.

The component mounting management device may be configured such that the operation section accepts, as an input operation, an operation for selecting one device from a plurality of devices whose set-up time is displayed on the display, and the control section for a plurality of types of circuit boards manufactured on this device that are required for the Manufacture of the respective types of circuit board indicates required set-up time as the state of occurrence of the event on the display. With this configuration, the management personnel can recognize the state of occurrence of setup work on a device of interest for respective types of boards, and determine the setup work that is a cause of the decline in the utilization rate. In this way, the management staff can easily take effective measures against the decline in the utilization rate.

The component mounting management apparatus may be configured such that the operation section accepts, as an input operation, an operation for selecting one type of board from a plurality of board types whose setup time is displayed on the display, and the control section accepts mounting time regulation of setup work for the manufacture of the one board type in a time series the display shows. With this configuration, the management personnel can recognize the mounting timing of the setup work for a board type of interest in a time series and identify the setup work that is a cause of the decrease in the utilization rate. In this way, the management staff can easily take effective measures against the decline in the utilization rate.

The component mounting management apparatus may be configured such that a performance level change indicating a change in the performance level over time is displayed as a time component change on the display, and the control section treats each stoppage of a plurality of devices of the component mounting system as an event correlating to the efficiency and, for each device, a device downtime, which is the time during which the device stops, as the state of occurrence of the event on the display. With this configuration, the management personnel can know the state of occurrence of the event correlating with the performance level and determine the event that is the cause of the drop in the performance level. In this way, the management staff can easily take effective measures against the decline in the efficiency.

The component mounting management device may be configured such that the operation section accepts, as an input operation, an operation for selecting a device from a plurality of devices whose device down time is displayed on the display, and the control section accepts a plurality of errors that have occurred at that one device, each as an event is treated with correlation to the degree of performance and for each fault indicates a fault idle time, which is a time during which the fault caused the shutdown of that device, as the state of occurrence of the event on the display. With this configuration, the management personnel can know the state of occurrence of failures on a device of interest and determine the failure that is a cause of the drop in performance. In this way, the management staff can easily take effective measures against the decline in the efficiency.

The component mounting management apparatus may be configured such that a performance level change indicating a change in the performance level over time is displayed as a component change over time on the display, and the control section treats respective component suction failures at a plurality of devices of the component mounting system as an event correlated to the performance level and for each device displays a value indicative of the occurrence of an aspiration failure as the state of occurrence of the event on the display. With this configuration, management personnel can know the state of occurrence of suction failures at the respective devices and identify devices where suction failures frequently occur. In this way, the management staff can easily take effective measures against the decline in the efficiency.

The component mounting management device may be configured such that the operation section accepts, as an input operation, an operation for selecting one device from a plurality of devices for which the occurrence of suction errors is indicated on the display, this one device performs component suction under a plurality of different suction conditions, and the For each suction condition, the control section displays the number of suction failures that have occurred at that device as the state of occurrence of the event on the display. With this configuration, for each suction condition, management personnel can know the state of occurrence of suction failures at a device of interest and identify a suction condition in which suction failures frequently occur. In this way, the management staff can easily take effective measures against the decline in the efficiency.

The component mounting management device may be configured such that the one device sucks a component supplied by a component supply station by means of a nozzle attached to a mounting head, the sucking condition being one of a component ID for identifying the components , the component supply station, the placement head and the nozzle. With this configuration, management personnel can see how differences in component, component supply station, placement head, or nozzle affect suction errors. In this way, the management staff can easily take effective measures against the decline in the efficiency.

The component mounting management apparatus may be configured such that the operation section accepts, as an input operation, an operation for selecting one fault from a plurality of faults for which the fault dead time is displayed on the display, and the control section for a plurality of operators involved in the one fault, shows on the display how often the one error has occurred involving the respective operator. With this configuration, the management personnel can recognize the number of times an error of interest involving each of a plurality of operators involved in the error has occurred, and identify the operator who frequently encounters the error. In this way, the management personnel can easily take effective measures regarding the decline in the utilization rate or the performance level.

The component mounting management apparatus may be configured such that the operation section accepts, as an input operation, an operation for selecting one fault from a plurality of faults for which the fault dead time is displayed on the display, and the control section accepts the frequency of occurrence of the one fault in a time series on the display shows. With this configuration, based on the frequency of occurrence of an error of interest, management personnel can know how the error affects the downtime of the device. In this way, the management personnel can easily take effective measures regarding the decline in the utilization rate or the performance level.

The component mounting management apparatus may be configured such that a quality grade change indicating a change in the quality grade over time is displayed as a component change over time on the display, the control section treating component mounting defects as the event correlated with the quality grade and the number of defects occurred as the the condition of the occurrence of the event on the display. With this configuration, the management personnel can recognize the number of component mounting faults that have occurred with correlation to the quality grade. In this way, the administrative staff can easily take effective measures against the decline in the quality level.

The component mounting management apparatus may be configured such that the control section displays the number of occurrences of defects for each of a plurality of categories indicating a different affiliation of the components on the display. With this configuration, the management personnel can recognize the number of occurrences of component mounting shortages with correlation to the grade of quality according to the membership of the components, and identify components in which mounting shortages occur frequently. In this way, the administrative staff can easily take effective measures against the decline in the quality level.

The component mounting management apparatus may be configured such that the control section displays the number of occurrences of defects for each of a plurality of categories indicating different causes of defects on the display. With this configuration, the management personnel can recognize the number of occurrences of component mounting shortages with correlation to the quality grade according to the cause of a mounting shortage concerned, and identify causes that make a mounting shortage occur frequently. In this way, the administrative staff can easily take effective measures against the decline in the quality level.

The component mounting management apparatus may be configured such that the operation section accepts an operation for selecting one category from a plurality of categories as an input operation, and the control section treats a plurality of defects that have occurred in the one category, each as an event correlating to the grade of quality and the content showing several defects in list form on the display. With this configuration, management personnel can see the content of multiple defects that have occurred for a component association or defect cause of interest. In this way, the administrative staff can easily take effective measures against the decline in the quality level.

The component mounting management apparatus may be configured such that the operation section accepts, as an input operation, an operation for selecting one defect from the list, and the control section displays a plurality of images taken at different times of the locations in the component mounting system where the one defect has occurred indicates. With this configuration, based on the multiple images taken of the place where the defect of interest has occurred, the management personnel can know the state of occurrence of the defect. In this way, the administrative staff can easily take effective measures against the decline in the quality level.

The component mounting management apparatus may be configured such that the component mounting system performs suction of components under a plurality of different suction conditions, and the control section displays the suction condition at the time of occurrence of the one shortage on the display. With this configuration, the management personnel can recognize the suction condition at the time when a defect of interest occurs. In this way, the administrative staff can easily take effective measures against the decline in the quality level.

The component mounting management apparatus may be configured such that the component mounting system is a construction element supplied by a component supply station by means of a nozzle attached to a mounting head, the suction condition being one of a component identifier for identifying the components, the component supply station, the mounting head and the nozzle. With this configuration, management personnel can see how differences in component, component supply station, placement head, or nozzle affect the occurrence of defects. In this way, the administrative staff can easily take effective measures against the decline in the quality level.

The component mounting management apparatus may be configured such that the control section displays a respective relationship among the component ID, component supply station, mounting head and nozzle, and the number of occurrences of suction failure on the display. With this configuration, management personnel can see how differences in component ID, component supply station, placement head, and nozzle affect the occurrence of suction errors. In this way, the management personnel can easily take effective measures against the decline in the performance level or the quality level.

The component mounting management apparatus may be configured such that the operation section accepts, as an input operation, an operation for selecting one component ID from a plurality of component IDs, and the control section counts the number of occurrences of suction failure of the component having the one component ID to which at least one of component supply station, mounting head and Nozzle involved is shown on the gauge. With this configuration, management personnel can see how a combination of a component of interest and the element (component supply station, placement head, or nozzle) that participated in sucking that component affects the occurrence of sucking failures. In this way, the management personnel can easily take effective measures against the decline in the performance level or the quality level.

The component mounting management apparatus may be configured such that the display shows the number of occurrences of suction failure for each solid of one element, the operation section accepts, as an input operation, an operation for selecting one solid from the plurality of solids of one element displayed on the display, and the control section displays a cause of occurrence of suction failures of the component having the one component ID involving the one solid of the one component on the display. With this configuration, the management personnel can know the cause that the solid of the one item of interest generated the suction error. In this way, the management personnel can easily take effective measures against the decline in the performance level or the quality level.

The component mounting management apparatus may be configured such that the display shows the number of occurrences of suction failure for each solid of one element, the operation section accepts, as an input operation, an operation for selecting one solid from the plurality of solids of one element displayed on the display, and the The control section displays the frequency of occurrence of suction failures of a component having the one component ID involving the one solid of the one component in a time series on the display. With this configuration, the management personnel can recognize the frequency of occurrence of suction failures on a solid of the one item of interest. In this way, the management personnel can easily take effective measures against the decline in the performance level or the quality level.

The component mounting management apparatus may be configured such that the display shows the number of occurrences of suction failure for each solid of one element, the operation section accepts as an input operation an operation for selecting a solid from the plurality of solids displayed on the display, and the control section accepts the number the suction error that has occurred on a component with a different component ID than the one component ID, in which the one solid of the one component was involved, on the display. With this configuration, the management personnel can know the number of suction failures caused by the solid of the one element of interest on components having a component ID other than the one component ID. In this way, the management personnel can easily take effective measures against the decline in the performance level or the quality level.

The component mounting management apparatus may be configured such that the control section displays the frequency of occurrence of suction failure and the frequency of occurrence of operations other than suction failure in a time series on the display. With this configuration, the management personnel can recognize operations other than the suction failures that affect the occurrence of suction failures. In this way, the management personnel can easily take effective measures against the decline in the performance level or the quality level.

effect of the invention

According to the present invention, management personnel in managing a component mounting system for manufacturing component-mounted boards based on OEE can easily take effective measures against a decrease in OEE items.

character list

• 1 ein Blockschaubild, das in schematischer Weise eine Leiterplattenfertigungsanlage mit Fertigungslinien veranschaulicht, die einem Beispiel eines Bauelementbestückungssystems entspricht;
• 2 eine schematische Teildraufsicht auf einen Bestückungsautomaten, der die einzelnen Fertigungslinien der Leiterplattenfertigungsanlage aus 1 aufweisen;
• 3 eine schematische Ansicht eines Beispiels einer Fertigungsverwaltungsansicht, die auf einer Anzeige einer Verwaltungsvorrichtung angezeigt wird;
• 4 eine Ansicht eines Beispiels der Fertigungsverwaltungsansicht bei Auswahl eines Nutzungsgrads;
• 5 eine Ansicht eines Beispiels der Fertigungsverwaltungsansicht bei Auswahl eines Bestückungsautomaten aus einem Diagramm von Stillstandszeiten gesondert nach Vorrichtung;
• 6 eine Ansicht eines Beispiels der Fertigungsverwaltungsansicht bei Auswahl eines Bestückungsautomaten aus einem Diagramm von Rüstzeiten gesondert nach Vorrichtung;
• 7 eine Ansicht eines Beispiels der Fertigungsverwaltungsansicht bei Auswahl eines Leistungsgrads;
• 8 eine Ansicht eines Beispiels der Fertigungsverwaltungsansicht bei Auswahl eines Bestückungsautomaten aus einem Diagramm von Stillstandszeiten gesondert nach Vorrichtung;
• 9 eine Ansicht eines Beispiels der Fertigungsverwaltungsansicht bei Auswahl eines Bestückungsautomaten aus einem Diagramm der Anzahl von Ansaugfehlern gesondert nach Vorrichtung;
• 10 eine Ansicht eines Beispiels der Fertigungsverwaltungsansicht bei Auswahl eines Qualitätsgrads;
• 11 eine Ansicht eines Beispiels der Fertigungsverwaltungsansicht bei Auswahl einer Bauelementkennung aus einem Diagramm der Anzahl aufgetretener Mängel;
• 12 eine Ansicht eines Beispiels der Fertigungsverwaltungsansicht bei Auswahl eines Mangels aus einer Liste von Schritten mit Mängeln;
• 13 eine schematische Ansicht eines Beispiels einer Stillstandsanalyseansicht, die ein Aspekt der Fertigungsverwaltungsansicht ist;
• 14 eine schematische Ansicht eines Beispiels einer Ansauganalyseansicht, die ein Aspekt der Fertigungsverwaltungsansicht ist;
• 15 eine schematische Ansicht eines Beispiels einer Ansauganalyseansicht, die ein Aspekt der Fertigungsverwaltungsansicht ist;
• 16 eine schematische Ansicht eines Beispiels einer Ansauganalyseansicht, die ein Aspekt der Fertigungsverwaltungsansicht ist;
• 17 eine schematische Ansicht eines Beispiels einer Ansauganalyseansicht, die ein Aspekt der Fertigungsverwaltungsansicht ist; und
• 18 eine schematische Ansicht eines Beispiels einer Rüstanalyseansicht, die ein Aspekt der Fertigungsverwaltungsansicht ist.

Show it:

• 1 12 is a block diagram that schematically illustrates a circuit board manufacturing facility with production lines, which corresponds to an example of a component mounting system;
• 2 a schematic partial plan view of an automatic placement machine, which consists of the individual production lines of the circuit board manufacturing plant 1 exhibit;
• 3 12 is a schematic view showing an example of a manufacturing management view displayed on a display of a management device;
• 4 a view of an example of the production management view when a utilization rate is selected;
• 5 12 is a view showing an example of the manufacturing management view when selecting a pick and place machine from a chart of downtimes separately by device;
• 6 12 is a view showing an example of the manufacturing management view when an automatic pick and place machine is selected from a chart of setup times separately by device;
• 7 12 is a view showing an example of the manufacturing management view when a performance level is selected;
• 8th 12 is a view showing an example of the manufacturing management view when selecting a pick and place machine from a chart of downtimes separately by device;
• 9 12 is a view showing an example of the manufacturing management view when a pick and place machine is selected from a graph of the number of suction failures separately by device;
• 10 12 is a view showing an example of the manufacturing management view when a grade is selected;
• 11 12 is a view showing an example of the manufacturing management view when a component ID is selected from a defect occurrence number chart;
• 12 Figure 14 shows an example of the manufacturing management view when selecting a defect from a list of steps with defects;
• 13 Fig. 12 is a schematic view of an example of a downtime analysis view, which is an aspect of the manufacturing management view;
• 14 Fig. 12 is a schematic view showing an example of a suction analysis view which is an aspect of the manufacturing management view;
• 15 Fig. 12 is a schematic view showing an example of a suction analysis view which is an aspect of the manufacturing management view;
• 16 Fig. 12 is a schematic view showing an example of a suction analysis view which is an aspect of the manufacturing management view;
• 17 Fig. 12 is a schematic view showing an example of a suction analysis view which is an aspect of the manufacturing management view; and
• 18 12 is a schematic view of an example of a setup analysis view that is an aspect of the manufacturing management view.

embodiment of the invention

1 FIG. 12 is a block diagram schematically illustrating a circuit board manufacturing facility with assembly lines, which corresponds to an example of a component mounting system. In 1 1 and 2 are shown in XYZ orthogonal coordinates, with the Z direction being the vertical direction, while the X and Y directions are both horizontal. As in 1 shown, a printed circuit board manufacturing plant 1 has three production lines La-Lc. Since the production lines La-Lc essentially have the same structure, mainly Production line La is described, while production lines Lb, Lc are given corresponding reference numerals and their description is omitted for the sake of simplicity. In the production line La, a printer 2, a tester 3a, a plurality of (three) pick and place machines 4a-4c, a tester 3b, a reflow oven 5, and a tester 3c are arranged in a row in the X direction, which is the board conveying direction.

The printer 2 prints the printed circuit boards with an application material (solder) by means of screen printing. The automatic placement machines 4a-4c are equipped with a structure that will be explained below with reference to FIG 2 is described, and equip the printed circuit boards with solder by the printer 2 with components. The reflow 5 heats the printed circuit board fitted with components by the automatic placement machines 4a-4c and thereby melts the solder which connects the components and the printed circuit board. The inspecting devices 3a-3c are each devices for inspecting the external appearance of objects and performing detection based on a two-dimensional or three-dimensional image of the object. The test device 3a checks the quality of the solder printed on the printed circuit boards by the printer 2 before the printed circuit boards are transported into the automatic placement machine 4a, the test device 3b checks the placement quality of the components on the printed circuit boards by the automatic placement machines 4a-4c before the printed circuit boards are transported in the reflow oven 5 and the testing device 3c checks the quality of the solder heated with the reflow oven 5. Thus, by performing solder printing, component mounting, and reflow on the circuit boards during their X-direction transportation in the production line La, circuit boards that have been mounted with components (component-mounted circuit boards) are manufactured.

The circuit board manufacturing facility 1 also has a management device 6 for managing the production lines La-Lc. The management device 6 has a control section 61 , a storage section 62 , a communication section 63 , a display 64 and an input device 65 . The control section 61 is a processor such as a CPU (Central Processing Unit) or the like, which executes calculations necessary for managing the production lines La, Lb, Lc.

The storage section 62 is formed by an HDD (Hard Disk Drive) or the like in which data and programs necessary for management of the production lines La, Lb, Lc are stored. Specifically, a manufacturing management program 621 is stored in the storage section 62, and by executing the manufacturing management program 621, the control section 61 executes board manufacturing management described below. The production management program 621 is provided in a state of storage on a data carrier 69 readable by a computer. The data carrier 69 is, for example, an HDD that an external computer is equipped with, and it is downloaded to the management device 6 from the HDD of the external computer (data carrier 69 ) and stored in the storage section 62 . The data carrier 69 is not limited to an HDD, and may be, for example, a USB flash memory or an optical disk or the like.

The communication section 63 carries out communication with the individual devices 2, 3a-3c, 4a-4c, 5 of the production lines La-Lc in a wired or wireless manner. The communication section 63, for example, obtains a log 622 indicating the operation history of the devices 2, 3a-3c, 4a-4c, 5 in response to an instruction from the control section 61, and stores it in the storage section 62.

The display 64 displays information to management personnel described below, and the input device 65 accepts input operations from the management personnel. The management device 6 is formed by a PC or a tablet. In the former case, the input device 65 is a mouse or keyboard, and in the latter case, the display 64 and the input device 65 are integrated by the touch panel display. Also, in the former case, the management personnel performs various input operations such as selection, instruction or the like described below by clicking or hovering the mouse on target locations displayed on the display, while in the latter case performs various input operations such as selection, instruction or the like described below by touching target locations displayed on the display with a finger or a tool.

2 shows a schematic partial plan view of an automatic placement machine, which the individual production lines of the circuit board production plant 1 exhibit. In the figure, no distinction is made between pick and place machines 4a-4c, and it is indicated as pick and place machine 4. The automatic placement machine 4 has a pair of transport devices 41 arranged in a line in the X direction, and the transport devices 41 carry out the transport of a circuit board 10 . That is, the mounter 4 mounts the circuit board 10 transported from the upstream side in the X-direction by the transport device 41 to a mounting work position (PCB position 10 in 2 ) has been transported, with a component, and transports the circuit board 10 mounted with the component by means of the transport device 41 in the X direction to the downstream side from the mounting work position. The mounting of a component on the printed circuit board 10 denotes a process of placing a component on the solder printed on the printed circuit board 10 .

Two component supply sections 42 are lined up in the X direction on both sides in the Y direction of the pair of transporters 41, and a plurality of component supply stations F (feeders) are lined up in the X direction on the component supply sections 42. At the component supply stations F, component supply rollers are arranged, which are wound with component supply tape on which small-sized components such as integrated circuits, transistors, capacitors and the like are received at specified intervals, and by intermittently transporting out the component supply tape drawn from the component supply roller, the component supply stations F feed the Components to their front end.

In this case, the component supply stations F are provided with component supply station identifiers in order to distinguish between the component supply stations F. The component supply station IDs are unique information of the component supply stations F, and different solids of the component supply stations F have different component supply station IDs. The component feed rollers are provided with component identifiers for distinguishing the components received in the component feed roller in question. The component identifiers are unique information of the component feed rollers.

On the automatic loader 4, a pair of Y-axis rails 431 extending in the Y-direction, a Y-axis ball screw 432 extending in the Y-direction, and a Y-axis motor 433 that drives the Y-axis ball screw 432 to rotate are provided. The pair of Y-axis rails 431 are supported movably in the Y-direction by an X-axis bracket 434 extending in the X-direction, and the X-axis bracket 434 is fixed to a nut of the Y-axis ball screw 432 . The X-axis support 434 has an X-axis ball screw 435 extending in the X-direction and an X-axis motor 436 that drives the X-axis ball screw 435 to rotate. The X-axis bracket 434 supports the head unit 44 movably in the X-direction, and the head unit 44 is fixed to a nut of the X-axis ball screw 435 . Thus, by the Y-axis motor 433 rotating the Y-axis ball screw 432, it can move the head unit 44 in the Y direction, and by the X-axis motor 436 rotating the X-axis ball screw 435, it can move the head unit 44 in the X direction.

The head units 44 have a plurality of (six) mounting heads 45 lined up in the X direction. The head units 44 each have an elongated shape extending in the Z direction, and a nozzle for sucking components is detachably attached to the lower end of the head units 44 . The head units 44 carry out the component mounting by placing the components from the component supply stations F onto the circuit boards 10 by means of the nozzles.

The mounting head 45 directs the nozzle at the front end portion of the component supply station F from above. Then, the mounting head 45 is lowered, and the component fed to the front end portion of the component supply station F comes into contact with the nozzle. Next, the mounting head 45 sucks the component by the nozzle and rises. After the mounting head 45 has picked up a component from the component supply station F in this way, it moves over the circuit board 10. With the mounting head 45 now releasing the suction of the component through the nozzle, the circuit board 10 is mounted with the component.

Also, between the two component supply sections 42 lined up in the X-direction, a component-recognition camera 46 is disposed upward, and based on the images picked up by the component-recognition camera 46, the presence of suction defects is checked. Thus, the nozzle moving from the component supply station F to the circuit board 10 for component mounting passes the field of view of the component recognition camera 46, and the component recognition camera 46 takes a picture as soon as the nozzle reaches its field of view. Thus, the component recognition camera 46 recognizes whether a suction failure has occurred based on whether there is a component sucked by the nozzle, based on the orientation of the component, and the like. When a suction error is detected, the mounting head 45 brings the nozzle back over the front end portion of the component supply station F and tries to suck a component by the nozzle again.

In addition, a board recognition camera 47 facing downward is mounted on the head unit 44, and the board recognition camera 47 moves together with the Head unit 44 in the X direction and in the Y direction. The board recognition camera 47 recognizes the position of the board 10 based on a pick-up image of a measurement mark attached to the board 10 transported to the mounting work position. Based on the recognition result, the position of the mounted component in the X direction and in Y is determined by the mounting head 45 -Direction adjusted. The pick and place machine 4 is also used to pick up the components mounted on the circuit board.

Next, board manufacturing management executed by the management device 6 of the board manufacturing facility 1 will be described. 3 FIG. 12 is a schematic view showing an example of a manufacturing management view displayed on a display of the management device. The production management view S has a setting section Sa, a selection section Sb, and a detail section Sc.

The setting section Sa is used for setting the display object in the manufacturing management view S . That is, the management personnel makes settings of a target period (start to finish) and a target assembly line (line name) among the assembly lines La-Lc by operating the input device 65 at the setting section Sa. In the example off 3 the production line La is set as the target production line.

In the selection section Sb, charts B1, B2, B3, B4 for the change over time in the OEE (overall equipment effectiveness), the degree of utilization, the degree of performance and the degree of quality of the target production line La in the target period are displayed. The charts B1, B2, B3, B4 are calculated by the control section 61 based on the log 622 obtained from the target assembly line La. The charts B1, B2, B3, B4 give values for the individual time units for time units (1 day) that are shorter than the target period and into which the target period is evenly divided. For example, chart B1, which shows the change in OEE over time, shows the OEE of a day for each day within the target period. Likewise, the charts B2, B3, B4 showing the change over time in the degree of utilization, degree of performance and degree of quality indicate the change over time of the degree of utilization, degree of performance and degree of quality of a day for each day within the target period. The time unit is not limited to one day and can also be, for example, one hour or half an hour.

By designating one of the OEE component diagrams B2, B3, B4 displayed in the selection section Sb of the degree of utilization, the degree of efficiency, and the degree of quality, the management personnel can perform an input operation on the input device 65 to select this component. Then, based on the log 622, the control section 61 calculates the occurrence of an event correlated to the one component within the target period on the target assembly line La and displays it in the detail section Sc. The administrative staff can specify a default day (default time unit) from the target period, as a result of which the state of the occurrence of the event on the default day is displayed in the detail section Sc. This point is concretely described below.

4 Fig. 12 shows a view of an example of the manufacturing management view when the utilization rate is selected. When a target day (e.g., April 7) is set in the utilization efficiency chart B2, the control section 61 treats stoppages of the automatic loader 4a, 4b, 4c of the target production line La as events correlating with the utilization efficiency. Then, the control section 61 displays a chart C1 indicating the idle times of the automatic loaders 4a, 4b, 4c (device idle times) on the target day in the detail section Sc.

The ones in the C1 diagram 4 The specified downtimes according to the device are the respective accumulated time of long-term downtimes of the placement machines 4a, 4b, 4c. The accumulated time of the long-term downtime on the placement machine 4 is thus displayed for the individual placement machines 4a, 4b, 4c. This long-term standstill is a first type of standstill from a relatively long, first type of standstill (a so-called long standstill) of the placement machines 4a, 4b, 4c and a relatively short, second type of standstill, which differs from the first type of standstill (a so-called brief standstill) . Based on diagram C1, the administration personnel can recognize the situation of the occurrence of long-term standstills at the automatic placement machines 4a, 4b, 4c.

Various methods for distinguishing between the first type of standstill and the second type of standstill are conceivable. As an example, a stall that lasts for at least a specified reference time is categorized as a first type of stall, while a stall below that reference time is categorized as a second type of stall. Another example is a method in which the administrative staff divides the downtimes into the first type of downtime and the second type of downtime in advance, depending on the cause.

In addition, in response to a target day being set in the utilization efficiency chart B2, the control section 61 treats set-up work on the automatic loaders 4a, 4b, 4c of the target production line La as events correlating with the utilization efficiency. Then, the control section 61 displays a chart C2 showing the set-up times of the automatic loaders 4a, 4b, 4c on the target day in the detail section Sc. The ones in the C2 diagram 4 The set-up times given by device are the respective accumulated time for set-up work during which preparations for component placement such as attaching the component supply stations F to the placement machines 4a, 4b, 4c are carried out. The accumulated time of the set-up work on the placement machine 4 is thus displayed for the individual placement machines 4a, 4b, 4c. The administrative personnel can recognize the situation of the occurrence of set-up work on the placement machines 4a, 4b, 4c on the basis of diagram C2.

By designating one of the automatic loaders 4a, 4b, 4c indicated in the diagram C1 displayed in the detail section Sc, the management personnel can perform an input operation for selecting this automatic loader 4 on the input device 65. Then, the control section 61 displays errors which were a cause of long-term stoppage of this one automatic loader 4 on the target day.

5 Fig. 12 is a view showing an example of the manufacturing management view when selecting a pick and place machine from a chart of downtimes separately by device. For example, when a pick and place machine 4a is selected from the chart C1, the control section 61 treats a plurality of errors E11, E12, E13, E14, which caused a long-term standstill of the one pick and place machine 4a on the target day, each as an event correlated with the utilization ratio. In addition, the control section 61 displays a chart C3 in the detail section Sc, which indicates the accumulated time for which the plurality of errors E11, E12, E13, E14 on the target day has caused the automatic placement machine 4a to be at a standstill (failure standstill time) ordered by the length of the fault standstill time . The administrative personnel can recognize the situation of the occurrence of the errors E11, E12, E13, E14 on the placement machine 4a on the basis of diagram C3.

By designating one of the automatic loaders 4a, 4b, 4c indicated in the diagram C2 displayed in the detail section Sc, the management personnel can perform an input operation for selecting this automatic loader 4 on the input device 65. In addition, the control section 61 displays the set-up time for each type of circuit board that was manufactured on the one pick-and-place machine 4 on the default day. The circuit board type designates the type of manufactured component mounting circuit board, with different configurations being treated as different circuit board types before the mounting of components or after the mounting of components on the circuit board.

6 Fig. 12 shows a view of an example of the manufacturing management view when selecting a pick and place machine from the chart of setup times separately by device. For example, when the pick and place machine 4a is selected from the chart C2, the control section 61 displays a chart C4 in the detail section Sc corresponding to a plurality of board types K1, K2, K3 manufactured at the pick and place machine 4a on the target day for the production of the board types K1, K2, K3 lists required set-up time. The planned and the actual set-up time are displayed next to each other, so that the planned set-up time and the actual set-up time (i.e. the set-up time actually required) can be compared. The management personnel can recognize the situation of the occurrence of set-up work on the automatic loader 4a based on the chart C4.

7 Fig. 12 shows a view of an example of the manufacturing management view when the performance level is selected. When a target day (for example, April 7) is set in the efficiency chart B3, the control section 61 treats stoppages of the automatic loader 4a, 4b, 4c of the target production line La as events correlated to the efficiency. Then, the control section 61 displays a chart C5 indicating the idle times of the automatic loaders 4a, 4b, 4c (device idle times) on the target day in the detail section Sc.

The ones in the C5 diagram 7 The specified downtimes according to the device are the respective accumulated time of short-term downtimes of the placement machines 4a, 4b, 4c. The accumulated time of the short standstill at the placement machine 4 is thus displayed for the individual placement machines 4a, 4b, 4c. As discussed above, a short-term stall is the second type of stall among the first type of stall and the second type of stall. On the basis of diagram C5, the administrative staff can recognize the situation in which short-term standstills occur at the automatic placement machines 4a, 4b, 4c.

In response to a target day being specified in the performance level chart, the control section 61 treats suction failures at the automatic loaders 4a, 4b, 4c of the production line La as events correlated with the efficiency. The control section 61 displays a chart C6 indicating the state of occurrence of suction failures of the automatic loader 4a, 4b, 4c on the target day in the detail section Sc. Thus, the situation of the occurrence of suction errors at the placement machine 4 for the individual placement machines 4a, 4b, 4c is displayed. At this time, the manager performs an input operation on the input device 65 to select the number of suction failures or the suction success rate, and displays a suction failure occurrence state chart C6 for the selection. The management personnel can recognize the state of occurrence of suction failures at the automatic placement machines 4a, 4b, 4c based on the chart C6.

By designating one of the automatic loaders 4a, 4b, 4c indicated in the diagram C5 displayed in the detail section Sc, the management personnel can perform an input operation on the input device 65 to select this automatic loader 4. Then, the control section 61 displays errors which were a cause of momentary standstill of this one automatic loader 4 on the target day.

8th Fig. 12 is a view showing an example of the manufacturing management view when selecting a pick and place machine from a chart of downtimes separately by device. For example, when the automatic placement machine 4a is selected from the chart C5, the control section 61 treats a plurality of errors E21, E22, E23, E24, which have caused a short-term standstill of the one automatic placement machine 4a on the default day, each as an event correlated with the efficiency. In addition, the control section 61 displays a chart C7 in the detail section Sc, which lists the accumulated time for which the plural errors E21, E22, E23, E24 on the target day have caused the automatic placement machine 4a to be at a standstill (failure standstill time), ordered by the length of the fault standstill time . The administrative personnel can recognize the situation of the occurrence of the errors E21, E22, E23, E24 on the placement machine 4a on the basis of diagram C7.

By designating one of the automatic loaders 4a, 4b, 4c indicated in the diagram C6 displayed in the detail section Sc, the management personnel can perform an input operation for selecting that one automatic loader 4 on the input device 65. Then, the control section 61 displays the number of sucking failures that occurred on the automatic loader 4 on the default day.

9 Fig. 14 is a view showing an example of the manufacturing management view when a pick and place machine is selected from a graph of the number of suction failures separately by device. For example, when the automatic loader 4a is selected from the chart C6, the control section 61 displays in the detail section Sc a chart C8 listing the number of suction failures that occurred on the automatic loader 4a on the target day by suction condition. The management personnel can perform an input operation on the input device 65 to select a suction condition from among component ID, component supply station ID, mounting head, and nozzle. As exemplified in 9 shown, when the component identifier for several component identifiers (ID1-ID4) is selected, the respective number of suction errors when attempting to suction the component with the relevant component identifier is displayed in diagram C8. The same applies to the selection of feeder ID, head (mounting head) or nozzle. The management personnel can know the state of occurrence of suction failure at the automatic loader 4a based on chart C8.

10 Fig. 12 shows a view of an example of the manufacturing management view when quality level is selected. When a target day (e.g., April 7) is set in the chart of the grade B4, the control section 61 treats defects occurring on the target assembly line La as an event correlated with the grade. Then, the control section 61 displays a chart C9 indicating the number of occurrences of defects on the target assembly line La on the target day in the detail section Sc.

As shown in diagram C9 10 1, when the number of occurrences of defects is displayed on the input device 65, the management personnel can perform an input operation to select an item of defect cause and component ID, component type and reference (icon indicating the mounting position of the component on the circuit board 10) to display the affiliation of each component . For example, when the component ID is set as shown in the chart C9, the control section 61 displays the number of occurrences of defects for a plurality of categories ID1, ID2, ID3 indicating different component IDs (that is, by component ID). In the example of diagram C9, four insertion defects have occurred for the component with component identifier ID1, three insertion defects have occurred for the component with component identifier ID2, and one insertion deficiency has occurred for the component with component identifier ID3. If the component type is specified, the same If the number of defects that have occurred are displayed for multiple categories that indicate the different component types (i.e. by component type), and if the cause of the defect is specified, the number of defects that have occurred is displayed for multiple categories that specify the different causes of defects (i.e. by cause of the defect) .

By specifying one of the plural categories (part IDs ID1, ID2, ID3 in this example) indicated in the diagram C9 displayed in the detail section Sc, the management personnel can perform an input operation on the input device 65 to select that category. Then, the control section 61 displays a list of defects that have occurred for the one category (list of steps with defects).

11 Fig. 12 is a view showing an example of the manufacturing management view when the component ID is selected from a defect occurrence number chart. For example, when a component identifier ID1 (category) is selected from the multiple component identifiers ID1, ID2, ID3 (multiple categories) indicated in the chart C9, the control section 61 treats the defects (the four defects indicated in the chart C9) occurred for the component identifier ID1 as events with correlation to the degree of quality. Then, in the detail section Sc, the control section 61 displays a defect steps list C10 which is a list of the details of the plurality of defects. As the details, the concrete date and time of the defect, as well as the board type, lot and board ID on which the defect occurred are specifically displayed. The board ID is information used to identify each board. The management personnel can recognize the state of occurrence of defects in the selected component identifier ID1 based on chart C10. A display similar to that in diagram C10 can also be displayed for the type of component and the cause of the defect from diagram C9 11 to be executed.

By specifying one defect from among the (four) defects of the list of defect steps displayed in the detail section Sc, the management personnel can perform an input operation on the input device 65 to select that defect. Then, the control section 61 displays an overall view C11 in the detail section Sc listing a plurality of images 11-15 taken at different times of the location where the defect in question has occurred (destination location of component mounting) ( 12 ). In addition, the control section 61 displays the suction condition (component ID, component supply station, mounting head and nozzle) of the component mounted at the place where the shortage has occurred together with the overall map C11 ( 12 ). 12 12 shows a view of an example of the manufacturing management view when selecting a defect from the list of steps with defects.

Image I1 is an image obtained before solder printing by the printer 2 by spot imaging, Image I2 is a post inspection obtained after solder printing by the printer 2 by the inspector 3a by spot imaging the printing, Fig. 13 is a picture obtained after the component is mounted by a pick and place machine of the pick and place machines 4a-4c from the pick and place machine by taking a picture of the place in question after the component placement, Fig. 14 is a before the reflow process in the reflow oven 5 image obtained from the inspecting device 3b by taking a picture of the subject before reflow, and image 15 is an image obtained after the reflow in the reflow oven 5 by taking a picture of the subject after the reflow. The management personnel can know the situation of the occurrence of the defect based on the images I1-I5 of the place where the defect occurred.

In the embodiment with the configuration described above, the graphs B2, B3, B4 showing a change over time in the OEE components (degree of use, degree of performance, degree of quality) (constituent change over time) are displayed on the display 64 together with the state of occurrence of with Events correlating to the components (long-term downtime, short-term downtime, set-up work, errors, suction errors and defects and the like) are displayed in the production lines La, Lb, Lc ( 4 until 12 ). Administrative personnel can therefore determine the event that is the cause of the decrease in OEE components based on the fact of occurrence of the events. In this way, the administrative staff can easily take effective measures regarding the decrease in the OEE components.

In addition, it is possible in this embodiment to carry out analyzes of correlating events for the individual OEE components (degree of utilization, degree of performance, degree of quality). That is, by performing an input operation for selecting the OEE constituent diagrams B2, B3, B4 by clicking or the like, the management personnel can display the analysis views (e.g., view C1, etc.) showing the state of occurrence of the event with correlation to the component specified in the selected diagram B2, B3, B4 (can therefore change the display). If only the state of affairs of the occurrence of the event is given, an aspect is also conceivable in which the state of affairs of the occurrence of the event is displayed separately from the OEE components. However, with such an aspect of displaying separately from the OEE components, it is difficult for the administrative staff to grasp the relationship between the OEE components and the event (i.e., whether there is a correlation or not). On the other hand, according to this embodiment, in which the state of occurrence of events correlated to the item concerned is indicated by the selection of the OEE items, the management personnel can easily grasp the relationship between the OEE items and the event, and also can know the state of the Quickly capture occurrences of events correlating to the component of interest with a simple input operation. In this way, the administrative staff can efficiently determine the cause of the decrease in OEE components and easily take effective measures.

In addition, the input device 65 (operating section) is provided, which accepts input operations from management personnel for the OEE components utilization rate, efficiency level and quality level, whose charts B2, B3, B4 indicating their respective change over time (component change over time) are displayed on the display 64 will. In addition, the control section 61 displays the state of occurrence of events correlating to the item of the utilization rate, the efficiency level, and the quality level to which the input operation relates, on the display 64 ( 4 until 12 ). With this configuration, by performing an input operation for an item of interest, the management personnel can recognize the state of occurrence of an event correlated to that item.

The diagram B2 indicating the change in the utilization rate with time (the utilization rate change) is displayed on the display 64 . The control section 61 treats a long-term standstill of the plural pick and place machines 4a, 4b, 4c (plural devices) of the production lines La, Lb, Lc as an event correlated with the utilization ratio. The device down time, which is a time of long-term stoppage of the automatic loaders 4a, 4b, 4c, is displayed as the state of occurrence of the long-term stoppage for each automatic loader 4a, 4b, 4c on the display 64 (chart C1 of Fig 4 ). With this configuration, the management personnel can know the situation of the occurrence of the long-term downtime correlating with the utilization rate from the chart C1 and identify the long-term downtime that is the cause of the decrease in the utilization rate. In this way, the management staff can easily take effective measures against the decline in the utilization rate.

The input device 65 accepts, as an input operation, an operation for selecting an automatic insertion machine from the plurality of automatic insertion machines 4a, 4b, 4c for which the device down time is displayed on the display 64 in chart C1. The control section 61 treats the plural errors E11, E12, E13, E14 which have occurred at this one automatic loader each as an event correlated with the utilization ratio. The dead time, which is the time during which the errors E11, E12, E13, E14 caused a long-term deadlock of the pick and place machine, is displayed as the state of occurrence of the long-term dead for the errors E11, E12, E13, E14, respectively 64 displayed (diagram C3 in 5 ). With this configuration, the management personnel can know the state of occurrence of the errors E11, E12, E13, E14 on the placement machine of interest and identify the errors E11, E12, E13, E14 which are the cause of the decrease in the utilization rate. In this way, the management staff can easily take effective measures against the decline in the utilization rate.

The diagram B2 indicating the change in the utilization rate with time (the utilization rate change) is displayed on the display 64 . The control section 61 handles set-up work on the plural pick and place machines 4a, 4b, 4c of the production lines La, Lb, Lc as events correlated with the utilization ratio. The setup time at the automatic placement machines 4a, 4b, 4c is displayed on the display 64 as a matter of occurrence of setup work for each automatic placement machine 4a, 4b, 4c (diagram C2 of Fig 4 ). With this configuration, the management personnel can know the state of occurrence of set-up work on the automatic loaders 4a, 4b, 4c of the production lines La, Lb, Lc from the chart C2, and determine the set-up work that is the cause of the decrease in the utilization rate. In this way, the management staff can easily take effective measures against the decline in the utilization rate.

The input device 65 accepts, as an input operation, an operation for selecting an automatic placement machine from the plurality of automatic placement machines 4a, 4b, 4c, for which the set-up time is displayed on the display 64 in diagram C2. The control section 61 shows the set-up time required for the production of the circuit board types K1, K2, K3 for a number of circuit board types K1, K2, K3 produced on this one placement machine as the situation of the occurrence of set-up work on the display 64 (diagram C4 in Fig 6 ). With this configuration, the management personnel can know the state of occurrence of set-up work at the placement machine of interest for the plural types of boards K1, K2, K3 from the chart C4 and determine the set-up work that is a cause of the decrease in the utilization efficiency. In this way, the management staff can easily take effective measures against the decline in the utilization rate.

The chart B3 indicating the change in the power level with time (the power level change) is displayed on the display 64. FIG. The control section 61 treats a momentary standstill of the plurality of automatic loaders 4a, 4b, 4c of the production lines La, Lb, Lc as an event correlated with the efficiency. The control section 61 displays the device down time, which is a time of short-term stoppage of the automatic loaders 4a, 4b, 4c, as a matter of occurrence of the short-term stoppage for each automatic loader 4a, 4b, 4c on the display 64 (chart C5 of Fig 7 ). With this configuration, the management personnel can know the situation of the occurrence of the short-term stall correlating with the efficiency from the chart C5 and identify the short-term stall which is the cause of the drop in the efficiency. In this way, the management staff can easily take effective measures against the decline in the efficiency.

The input device 65 accepts, as an input operation, an operation for selecting a pick and place machine from the plurality of pick and place machines 4a, 4b, 4c for which the device down time is displayed on the display 64 in chart C5. The control section 61 treats the plural errors E21, E22, E23, E24 which have occurred at this one automatic loader each as an event correlated with the efficiency. The control section 61 displays the error dead time, which is the time during which the errors E21, E22, E23, E24 have caused a long-term stoppage of the one pick and place machine, for the errors E21, E22, E23, E24, respectively, as the state of occurrence of the long-term standstill on the display 64 (diagram C7 in 8th ). With this configuration, management personnel can use chart C7 to know the state of occurrence of errors E21, E22, E23, E24 on the placement machine of interest and identify error E21, E22, E23, E24 which is the cause of the drop in efficiency. In this way, the management staff can easily take effective measures against the decline in the efficiency.

The graph B3 indicating the change in the power level with time (power level change) is displayed on the display 64. FIG. The control section 61 treats a component suction error at the plural placement machines 4a, 4b, 4c of the production lines La, Lb, Lc as an event correlated with the efficiency. The control section 61 displays a value indicating the state of occurrence of suction failure (number of occurrences of suction failure or suction success rate) for each automatic loader 4a, 4b, 4c as the state of occurrence of suction failure on the display 64 (graph C6 of Fig 7 ). With this configuration, the management personnel can use the chart C6 to know the state of occurrence of suction failure at each automatic loader 4a, 4b, 4c, and identify automatic loaders 4a, 4b, 4c where suction failure frequently occurs. In this way, the management personnel can easily take effective measures against the decline in the efficiency.

The input device 65 accepts, as an input operation, an operation for selecting an autoloader from among the plurality of autoloaders 4a, 4b, 4c for which the value indicating the state of occurrence of suction failure is displayed on the display 64. The automatic placement machines 4a, 4b, 4c perform suction of components under a plurality of different suction conditions, therefore, for each suction condition, the control section 61 displays the number of occurrences of suction failure at the selected automatic placement machine 4 on the display 64 (chart C9 of Fig 9 ). With this configuration, for each suction condition, the management personnel can know the state of occurrence of suction failures on a placement machine of interest and determine the suction condition in which suction failures frequently occur. In this way, the management staff can easily take effective measures against the decline in the efficiency.

The suction condition is the component identifier for identifying the components, the component supply station F, the mounting head 45, or the nozzle. With this configuration, management personnel can see how differences in component, component supply station F, mounting head 45, or nozzle affect suction errors. In this way, the administrative personnel can easily take effective measures regarding the decline in performance.

The graph B4 indicating the change in quality level with time (quality level change) is displayed on the display 64. FIG. The control section 61 treats component mounting defects as events correlating to the grade. The number of times the mounting shortage has occurred is displayed as a state of occurrence of the mounting shortage on the display 64 (graph C9 of Fig 10 ). With this configuration, management personnel can use chart C9 to know the number of component mounting deficiency occurrences correlated with quality grade. In this way, the administrative staff can easily take effective measures against the decline in the quality level.

The control section 61 displays the number of occurrences of defects for respective categories (component identifiers ID1, ID2, ID3 in the example above) indicating the different affiliation of the components (component identifier or component type) on the display (chart C9 of Fig 10 ). With this configuration, the management personnel can use the chart C9 to know the number of occurrences of component mounting shortages correlated with the grade of quality according to the affiliation of the components, and identify components in which mounting shortages occur frequently. In this way, the administrative staff can easily take effective measures against the decline in the quality level.

The control section 61 displays the number of occurrences of defects on the display 64 for each of a plurality of categories indicating different causes of defects. With this configuration, the management personnel can use the chart C9 to know the number of occurrences of component mounting shortages correlating with the grade according to the cause of a mounting shortage concerned, and determine a cause that makes a mounting shortage occur frequently. In this way, the administrative staff can easily take effective measures against the decline in the quality level.

The input device 65 accepts, as an input operation, an operation for selecting one category from a plurality of categories. The control section 61 treats a plurality of defects occurring in this category, each as an event correlated with the grade. The control section 61 displays the contents of the plural defects in list form on the display 64 (list C10 of the steps with defects from 11 ). With this configuration, from the list of defective steps C10, the management personnel can recognize the content of multiple defects that have occurred for a component association or defect cause of interest. In this way, the administrative staff can easily take effective measures against the decline in the quality level.

The input device 65 accepts, as an input operation, an operation for selecting a defect from the defects displayed in the defect step list C10. The control section 61 displays a plurality of images I1-I5, taken at different times, of the location on the production lines La, Lb, Lc where the defect has occurred (target location of component mounting) on the display 64 (overall view C11 from FIG 12 ). With this configuration, based on the multiple images I1-I5 taken from the place where the defect of interest has occurred, the management personnel can recognize the state of occurrence of the defect. In this way, the administrative staff can easily take effective measures against the decline in the quality level.

The control section 61 displays the suction condition at the time of occurrence of the shortage on the display 64 (entire map C11 of Fig 12 ). With this configuration, the management personnel can know from the display 64 the suction condition at the time when a defect of interest occurs. In this way, the administrative staff can easily take effective measures against the decline in the quality level.

The suction condition is one of the component identifier for identifying the components, the component supply station F, the mounting head 45, and the nozzle. With this configuration, management personnel can see how differences in component, component supply station, placement head, or nozzle affect the occurrence of defects. In this way, the administrative staff can easily take effective measures against the decline in the quality level.

Incidentally, in this embodiment, a diagram C3 is displayed on the display 64, which indicates the times for the plurality of errors E11, E12, E13, E14 at which a long-term downtime occurred on an automatic placement machine due to the respective error ( 5 ). In this respect, by specifying one of the several errors E11, E12, E13, E14 indicated in diagram C3, the administrative staff can, on Ein output device 65 perform an input operation for selecting this error. The control section 61 displays a standstill analysis view for analyzing the standstill of the pick and place machine on the display 64 in response to the input operation. This downtime analysis view is not only displayed for long-term downtimes, but equally for short-term downtimes. Since their content is the same, however, the long-term standstill is described here as an example.

13 Fig. 12 is a schematic view of an example of the downtime analysis view, which is an aspect of the manufacturing management view. In the settings section Sa off 13 the device designation of a specific pick-and-place machine can be set from the pick-and-place machines 4a, 4b, 4c. However, at the time of switching from the chart C3 to the still analysis view, the pick and place machine 4a selected in the process up to the switch to the still analysis view (that is, the one selected in chart C1) is set as the initial setting in the setting section Sa. In addition, in the setting section Sa, corresponding to the manufacturing management view S being the standstill analysis view, an error standstill is set as the analysis type.

A diagram C12 is displayed in the detailed section Sc, which indicates for a plurality of errors E11-E19 how often the set placement machine 4a came to a standstill due to the error. The management personnel can know the state of occurrence of the errors E11-D19 on the automatic loader 4a based on the chart C12.

Also, in the detail section Sc, a chart C13 is displayed for a plurality of operators (performers of setup work) working on the one shown in chart C3 5 selected errors were involved, indicates the number of errors that occurred due to the participation of the respective operator. An operator involved in an error is an operator who performed set-up work immediately before the error, or in other words, an operator who performed set-up work in preparation for the component mounting in which the error occurred. In this way, the number of errors that have occurred involving operators O1, O2, O3, O4 is indicated (that is, the number of times the placement machine has stopped due to the error). The management personnel can understand the state of error occurrence in the plural operators O1, O2, O3, O4 from the chart C13.

In the detail section Sc, a chart C14 is displayed showing the frequency of occurrence of the in chart C3 5 selected error in a time series. The number of errors that have occurred is therefore indicated in the diagram C14 at fixed time intervals. Management personnel can recognize the state of error occurrence in a time series based on this chart C14.

The display in Chart C13 and Chart C14 relates to off at the time of the initial switch to the standstill analysis view 13 the error selected in diagram C3. However, if another error is selected from the multiple errors E11-E19 displayed in diagram C12 by means of an input operation on the input device 65, the diagram C13 gives the number of errors that have occurred (i.e. the number of times the automatic placement machine has stopped due to the other error) for the operators 01-04, and chart C14 indicates the frequency of occurrence of the other error in a time series.

According to this error analysis, the input device 65 accepts, as an input operation, an operation for selecting an error from the plurality of errors E11, E12, E13, E14 for which the error dead time is displayed in the diagram C3 of the display 64. The control section 61 displays, for each of the plural operators O1, O2, O3, O4 involved in the one error, how many times the error involving the operator has occurred on the display 64 (chart C13 of Fig 13 ). With this configuration, management personnel can use chart C13 to know how many times an error of interest involving each of a plurality of operators O1, O2, O3, O4 involved in the error has occurred, and determine which operator O1 in which the error occurs frequently. In this way, the management staff can easily take effective measures against the decline in the utilization rate.

The input device 65 accepts, as an input operation, an operation for selecting an error from the plurality of errors E11, E12, E13, E14 for which the error dead time is displayed in the diagram C3 of the display 64. The control section 61 displays the occurrence frequency of the error in a time series on the display 64 (chart C14 of Fig 13 ). With this configuration, based on the frequency of occurrence of an error of interest, the management personnel can know how the error affects the stoppage of the automatic loader 4. In this way, the management staff can easily take effective measures against the decline in the utilization rate.

The analysis using the downtime analysis view is not only limited to long-term downtimes, but also applied to short-term downtimes. When applied to short-term stoppages, the same effect can be obtained for efficiency.

In this embodiment, the relationship between the suction conditions component ID, component supply station F, mounting head 45 and nozzle and the state of occurrence of suction failure is indicated in the chart C8 and the overall map C11. When the management personnel performs a specified operation (e.g., click or touch) on the chart C8 or the whole map C11 on the input device 65, the control section 61 displays a suction analysis view for analyzing suction at the pick and place machine on the display 64.

14 Fig. 12 schematically shows an example of the suction analysis view, which is an aspect of the manufacturing management view. In this example, where in the settings section Sa off 14 the device name of the target automatic loader is settable among the automatic loaders 4a, 4b, 4c, the automatic loader 4a is set as the target automatic loader. Also, in the setting section Sa, corresponding to the manufacturing management view S being the suction analysis view, the number of occurrence suction failures is set as the analysis type.

In the detail section Sc, graphs C15, C16, C17, C18 are displayed showing the relationship between the number of occurrences of suction failure at the set automatic placement machine 4a and each suction condition of component ID, component supply station, mounting head and nozzle.

Graph C15 indicates the relationship between the component identifier (suction condition) and the number of occurrences of suction failure. In other words, the number of component suction errors that have occurred is indicated in diagram C15 for the plurality of component identifiers ID1-ID6. The management personnel can recognize differences in the number of occurrences of suction failure according to the different component IDs as the case of occurrence of suction failure from chart C15.

Chart C16 indicates the relationship between the component supply station (suction condition) and the number of occurrences of suction failure. In other words, the number of suction errors that have occurred on components that have been supplied from the respective component supply station F is indicated in diagram C16 for the plurality of component supply station identifiers ID1-ID6. The management personnel can recognize differences in the number of occurrences of suction failure according to the different component supply station IDs of the component supply stations F (that is, the individual solids of the component supply station F) as a matter of occurrence of suction failure from chart C16.

Chart C17 indicates the relationship between the mounting head 45 (suction condition) and the number of occurrences of suction failure. That is, in the chart C17, the respective number of component suction errors that have occurred is indicated for the plurality of mounting heads 45a-45f. The management personnel can recognize differences in the number of occurrences of suction failure according to different mount heads 45 (that is, individual solid bodies of the mount head 45) as a state of occurrence of suction failure from chart C17.

Graph C18 indicates the relationship between the nozzle N (suction condition) and the number of occurrences of suction failure. That is, in chart C18, the respective number of component suction failures caused by the plurality of nozzles N1-N6 are indicated. Management personnel can recognize differences in the number of occurrences of suction failure according to different nozzles N (that is, individual solids of nozzle N) as the occurrence of suction failure from chart C18.

In this manner, the control section 61 displays the respective relationship between the number of component suction failure occurrences and the component identifiers, the component supply stations F (i.e., the component supply station identifiers), the mounting heads 45, and the nozzles N on the display 64 (charts C14, C15, C16, C17 the end 14 ). With this configuration, the management personnel can recognize how the component ID, the component supply station, the mounting head 45, and the nozzle N each affect the occurrence of suction failure. In this way, the management personnel can easily take effective measures against the decline in the performance level or the quality level.

In addition, the input device 65 accepts, as an input manipulation, an manipulation for selecting a component identifier from the plurality of component identifiers ID1-ID6 displayed in the chart C15. The control section 61 displays the content of corresponding to this input operation 15 64 on the display. 15 12 schematically shows an example of the intake analysis view, which is an aspect of the manufacturing management view.

As in 15 shown, charts C19, C20, C21 are displayed in the detail section Sc. Diagram C19 indicates the number of suction errors that occurred per component supply station identifier for components with the relevant component identifier, which were respectively supplied by the component supply stations F with the plurality of component supply station identifiers ID1, ID2, ID3, ID4. Diagram C20 indicates the number of suction errors per placement head 45 that have occurred due to the plurality of placement heads 45a, 45b, 45c, 45d for components with the relevant component identifier. Diagram C21 indicates the number of suction errors per nozzle N that occurred due to the plurality of nozzles N1, N2, N3, N4 for components with the relevant component identifier. The relevant component identifier specified here is the component identifier selected in diagram C15. This point also applies to the intake analysis view described below.

That is, the input device 65 accepts, as an input operation, an operation for selecting a component identifier from the plurality of component identifiers of chart C15. The control section 61 displays, on the display 64, the number of occurrences of suction failures of components with the concerned component ID involving at least one of component supply station F, mounting head 45 and nozzle N by relating them to that one item ( Diagrams C19, C20, C21). With this configuration, management personnel can see how the combination of a component ID of interest and an element involved in sucking a component with that component ID (component supply station F, mounting head 45, or nozzle N) affects the occurrence of sucking errors. In this way, the management personnel can easily take effective measures against the decline in the performance level or the quality level.

In 15 the graphs C19, C20, C21 of the display 64 indicate the number of suction failure occurrences for each solid of the corresponding elements (component supply station F, mounting head 45, nozzle N). The diagram C19 therefore shows the respective number of suction errors that have occurred for a number of different examples of the component supply stations F, which are identified by the component supply station identifiers ID1, ID2, ID3, ID4. The diagram C20 shows the respective number of suction errors that have occurred for the different specimens of the multiple fitting heads 45a, 45b, 45c, 45d. The diagram C21 shows the respective number of suction errors that have occurred for the different specimens of the plurality of nozzles N1, N2, N3, N4.

In this regard, the input device 65 accepts, as an input manipulation, an manipulation for selecting one solid of the plurality of solids of the respective elements displayed in the charts C19, C20, C21 of the display 64 (component supply station F, mounting head 45, nozzle N). The control section 61 displays the content of corresponding to this input operation 16 64 on the display. 16 12 schematically shows an example of the intake analysis view, which is an aspect of the manufacturing management view.

As in 16 shown, in the detail section Sc, along with the charts C19, C20, C21, charts C22, C23, C24 are displayed. The diagrams C22, C23, C24 are displayed if, for example, a component supply station F with the component supply station identifier ID1 is selected from several different examples of the component supply station F identified by the component supply station identifiers ID1, ID2, ID3, ID4.

Diagram C22 indicates causes R1, R2, R3 for the occurrence of suction errors of components with the one component ID, which were supplied by the component supply station F with the component supply station ID ID1 selected on the input device 65. As the causes R1, R2, R3, for example, dropping the component picked up by the component supply station F or not recognizing a joint of the spliced component supply tape, thereby trying to pick up a component from an empty tray. This example shows the case in which the solid body of the component supply station F identified by the component supply station identifier ID1 was selected from the diagram C19. If a solid of the mounting head 45 is selected from the chart C20 or a solid of the nozzle N is selected from the chart C21, a similar display is made.

In this way, the control section 61 displays the cause R1, R2, R3 of the occurrence of a suction failure on a component with the one component ID in which the solid of the component (component supply station F, mounting head 45 or nozzle N) was involved on the display 64 (Diagram C22). With this configuration, the management personnel can know the cause that the solid of the one item of interest generated the suction error. In this way, the administrative staff easily take effective action on the decline in performance or quality.

If the solid is a component supply station F as discussed above, the solid that was involved in the suction error is the component supply station F that supplied the component at which the suction error occurred case that the solid is a mounting head 45, the mounting head 45 that attempted to suck the component where the sucking failure occurred, and in the case that the solid is a nozzle N, the nozzle N that tried to suck the component where the sucking failure occurred.

Diagram C23 indicates the frequency of the occurrence of suction errors on components with one component identifier, which were supplied by the component supply station F with the component supply station identifier ID1 selected by means of the input device 65, in a time series. This example shows the case in which the solid body of the component supply station F identified by the component supply station identifier ID1 was selected from the diagram C19. When a solid of the mounting head 45 is selected from the chart C20 or a solid of the nozzle N is selected from the chart C21, a similar display is made.

In this manner, the control section 61 displays the frequency of occurrence of a suction failure of a component having the one component ID to which the solid of the component (component supply station F, mounting head 45, or nozzle N) has participated in a time series on the display 64 (graph C23). With this configuration, the management personnel can recognize the frequency of occurrence of suction failures on a solid of the one item of interest. In this way, the management personnel can easily take effective measures against the decline in the performance level or the quality level.

Diagram C24 indicates the frequency of the occurrence of suction errors on components with a different component ID than the one component ID, which were supplied by the component supply station F with the component supply station identifier ID1 selected by means of the input device 65 in a time series. This example shows the case in which the solid body of the component supply station F identified by the component supply station identifier ID1 was selected from the diagram C19. If a solid of the mounting head 45 is selected from the chart C20 or a solid of the nozzle N is selected from the chart C21, a similar display is made.

In this manner, the control section 61 displays the number of occurrences of suction failures of components having a component ID other than the one component ID involving the solid of the component (component supply station F, mounting head 45, or nozzle N) on the display 64 (graph C24 ). With this configuration, the management personnel can know the number of suction failures caused by the solid of the one element of interest on components having a component ID other than the one component ID. In this way, the management personnel can easily take effective measures against the decline in the performance level or the quality level.

In the above example, a component identifier was selected from the multiple component identifiers in chart C15 and an analysis was performed displaying charts C19-C24. However, as described below, a similar analysis can also be carried out using diagrams C16, C17, C18.

At this time, the input device 65 accepts, as an input operation, an operation for selecting a component supply station identifier from the plurality of component supply station identifiers in chart C16. The control section 61 displays the number of components supplied from the one component supply station F (as the component supply station F identified by the component supply station identifier) of the occurrence of suction failures involving at least one of the component, mounting head 45 and nozzle N of the display 64 by relating it to the one element. With this configuration, management personnel can understand how the combination of a component supply station F of interest and an element (component, mounting head 45, or nozzle N) involved in sucking the component supplied by this component supply station F affects the occurrence of suction errors. In this way, the management personnel can easily take effective measures against the decline in the performance level or the quality level.

The display 64 shows the number of suction errors that have occurred (suction errors from one Components supplied to component supply station F) in which a respective solid was involved, separately according to solids of one element (component, placement head 45 or nozzle N) (if the element is the component, according to component identifier). The input device 65 accepts, as an input operation, an operation for selecting one solid (or component ID) of the plurality of solids (or component IDs) of one element (component, mounting head 45, or nozzle N) displayed on the display 64 . The control section 61 displays the cause of the suction errors on the components supplied from the one component supply station F, in which the one solid (or the component identifier) of the one element (component, mounting head 45 or nozzle N) was involved, on the display 64. With this configuration, the management personnel can recognize the cause of suction failures that have occurred for a solid (or a component identifier) of an item (component, mounting head 45, or nozzle N) of interest. In this way, the management personnel can easily take effective measures against the decline in the performance level or the quality level.

An aspirating error in which a component identifier was involved designates an aspirating error which has occurred on a component with the relevant component identifier. This point also applies in the following.

The display 64 shows the number of suction failures that have occurred (suction failures on components supplied from the one component supply station F) in which a respective solid was involved, separately according to solids of the one element (component, mounting head 45 or nozzle N) (if the element is the component is, according to the component identifier). The input device 65 accepts, as an input operation, an operation for selecting one solid (or component ID) of the plurality of solids (or component IDs) of one element (component, mounting head 45, or nozzle N) displayed on the display 64 . The control section 61 displays the frequency of occurrence of the suction failures of the components supplied from the one component supply station F, in which the one solid (or the component identifier) of the one element (component, mounting head 45 or nozzle N) was involved, in a time series of the display 64. With this configuration, the management personnel can recognize the frequency of occurrence of suction failures for a solid (or component identifier) of an element of interest (component, mounting head 45, or nozzle N). In this way, the management personnel can easily take effective measures against the decline in the performance level or the quality level.

The display 64 shows the number of suction failures that have occurred (suction failures on components supplied from the one component supply station F) in which a respective solid was involved, separately according to solids of the one element (component, mounting head 45 or nozzle N) (if the element is the component is, according to the component identifier). The input device 65 accepts, as an input operation, an operation for selecting one solid (or component ID) of the plurality of solids (or component IDs) of one element (component, mounting head 45, or nozzle N) displayed on the display 64 . The control section 61 displays the number of occurrences of suction failures of the components supplied from a component supply station F other than the one component supply station F, in which the one solid (or the component identifier) of the one element (component, mounting head 45 or nozzle N) was involved. 64 on the display. With this configuration, management personnel can recognize the number of suction failure occurrences of components supplied from a component supply station F other than the one component supply station F for a solid (or component ID) of a one component (component, mounting head 45, or nozzle N) of interest. In this way, the management personnel can easily take effective measures against the decline in the performance level or the quality level.

That is, the input device 65 accepts, as an input operation, an operation for selecting one mounting head 45 from the plurality of mounting heads 45 in diagram C17. The control section 61 displays the number of component suction failures occurred by the one mounting head 45 involving at least one of the component, component supply station F and nozzle N on the display 64 by relating them to the one item. With this configuration, management personnel can see how the combination of a mounting head 45 of interest and an element that has participated in the suction of components by the mounting head 45 (component, component supply station F, or nozzle N) affects the occurrence of suction failure. In this way, the management personnel can easily take effective measures against the decline in the performance level or the quality level.

The display 64 shows the number of suction errors (component suction errors by the one mounting head 45) occurred, in which each solid was involved, separately by solids of the one element (component, component supply station F or nozzle N) (if the element is the component, by component identifier). The input device 65 accepts, as an input operation, an operation for selecting one solid (or component ID) of the plurality of solids (or component IDs) displayed on the display 64 of one component (component, component supply station F, or nozzle N). The control section 61 displays the cause of component suction errors by the one mounting head 45 involving the one solid (or component ID) of the one element (component, component supply station F or nozzle N) on the display 64 . With this configuration, the management personnel can recognize the cause of suction failures that have occurred for a solid (or a component identifier) of an item (component, mounting head 45, or nozzle N) of interest. In this way, the management personnel can easily take effective measures against the decline in the performance level or the quality level.

The display 64 shows the number of suction failures (component suction failures by the one mounting head 45) occurred, in which each solid was involved, separately by specimen of the one element (component, component supply station F or nozzle N) (if the element is the component, by component identifier). The input device 65 accepts as an input operation an operation for selecting one solid (or component ID) of the plurality of solids (or component IDs) displayed on the display 64 of one component (component, component supply station F, or nozzle N). The control section 61 displays the frequency of occurrence of component suction errors by the one mounting head 45 in which the one solid (or the component identifier) of the one element (component, component supply station F or nozzle N) was involved in a time series on the display 64 . With this configuration, the management personnel can recognize the frequency of occurrence of suction failures for a solid (or component identifier) of an object of interest (component, component supply station F, or nozzle N). In this way, the management personnel can easily take effective measures against the decline in the performance level or the quality level.

The display 64 shows the number of suction failures (component suction failures by the one mounting head 45) occurred, in which each solid was involved, separately by specimen of the one element (component, component supply station F or nozzle N) (if the element is the component, by component identifier). The input device 65 accepts as an input operation an operation for selecting one solid (or component ID) of the plurality of solids (or component IDs) displayed on the display 64 of one component (component, component supply station F, or nozzle N). The control section 61 displays the number of component suction errors by a mounting head 45 other than the one mounting head 45 in which the one solid (or the component identifier) of the one element (component, component supply station F or nozzle N) was involved, on the display 64 . With this configuration, the management personnel can recognize the number of occurrences of component suction failure by a mounting head 45 other than the one mounting head 45 for a solid (or a component ID) of a one component (component, component supply station F, or nozzle N) of interest. In this way, the management personnel can easily take effective measures against the decline in the performance level or the quality level.

That is, the input device 65 accepts, as an input operation, an operation for selecting a nozzle N from the plurality of nozzles N in chart C18. The control section 61 displays the number of component suction failures occurred by the one nozzle N involving at least one of the component, component supply station F and mounting head 45 on the display 64 by relating it to the one item. With this configuration, management personnel can see how the combination of a nozzle of interest and an element that has participated in sucking components through the nozzle N (component, component supply station F, or mounting head 45) affects the occurrence of suction failure. In this way, the management personnel can easily take effective measures against the decline in the performance level or the quality level.

The display 64 shows the number of suction failures (component suction failures by the one nozzle N) occurred in which each solid was involved, separately by solids of the one component (component, component supply station F, or mounting head 45) (if the component is the component, by component identifier). The input device 65 accepts, as an input operation, an operation for selecting one item (or component identifier) of the plurality of solids (or component identifiers) displayed on the display 64 of one element (component, component supply station F, or mounting head 45). The control section 61 displays the cause of the component suction errors by the one nozzle N involving the one solid (or component ID) of the one element (component, component supply station F, or mounting head 45) on the display 64 . With this configuration, the management personnel can recognize the cause of occurring suction failures for a solid (or a component ID) of a component of interest (component, component supply station F, or mounting head 45). In this way, the management staff can easily take effective measures against the decline in the efficiency or the quality level.

The display 64 shows the number of suction failures that occurred (component suction failures by the one nozzle N) in which each copy was involved, separately by solids of the one component (component, component supply station F, or mounting head 45) (if the component is the component, by component identifier). The input device 65 accepts, as an input operation, an operation for selecting one solid (or component identifier) of the plurality of solids (or component identifiers) displayed on the display 64 of one element (component, component supply station F, or mounting head 45). The control section 61 displays the frequency of occurrence of component suction failures by the one nozzle N involving the one solid (or component identifier) of the one element (component, component supply station F, or mounting head 45) in a time series on the display 64 . With this configuration, the management personnel can recognize the frequency of occurrence of suction failure for a solid (or a component ID) of a component of interest (component, component supply station F, or mounting head 45). In this way, the management personnel can easily take effective measures against the decline in the performance level or the quality level.

The display 64 shows the number of suction failures that occurred (component suction failures by the one nozzle N) in which each copy was involved, separately by solids of the one component (component, component supply station F, or mounting head 45) (if the component is the component, by component identifier). The input device 65 accepts, as an input operation, an operation for selecting one solid (or component identifier) of the plurality of solids (or component identifiers) displayed on the display 64 of one element (component, component supply station F, or mounting head 45). The control section 61 displays the number of component suction failures by a nozzle N other than the one nozzle N involving the one solid (or component ID) of the one element (component, component supply station F, or mounting head 45) on the display 64 . With this configuration, the management personnel can recognize the number of occurrences of component suction failures by a nozzle N other than the one nozzle N for a solid (or component ID) of a one component (component, component supply station F, or mounting head 45) of interest. In this way, the management personnel can easily take effective measures against the decline in the performance level or the quality level.

Also, a chart C23 is displayed on the display 64 indicating the frequency of occurrence of suction failure for a combination of the component ID and the one item (component supply station F, mounting head 45, or nozzle N) in a time series. Also, as described above, graphs are displayed on the display 64 indicating the frequency of occurrence of suction failure in a time series for other combinations of two of component ID, component supply station F, mounting head 45 and nozzle N.

In this regard, the input device 65 accepts, as an input manipulation, an manipulation for selecting the frequency of occurrence of suction failures that have occurred at a combination of two of the component identifier, component supply station F, mounting head 45, and nozzle N. The control section 61 displays the content of corresponding to this input operation 17 64 on the display. 17 12 schematically shows an example of the intake analysis view, which is an aspect of the manufacturing management view.

As in 17 As shown, in the setting section Sa, it is possible to set the suction conditions of component ID, component supply station F (feeder ID), mounting head 45, and nozzle N. In addition, types of operations displayed in chart C26 described below can be set at the setting section Sa.

The chart C25 displayed in the detail section Sc indicates the frequency of occurrence of suction failures in a time series and is labeled Dia grams 23 off 16 identical. On the other hand, the chart C26 displayed in the detail section Sc indicates operations other than the frequency of occurrence of suction failures in a time series. These processes other than suction failure are processes to be performed by operators who perform set-up work and processes to be performed by the automatic loader 4, and as described above, any type of event can be set in the setting section Sa.

The diagram C27 displayed in the detail section Sc shows details of the suction errors specified in diagram C27, specifically for each suction error time of occurrence of the suction error, component supply station ID of the component supply station F that supplied the component at which a suction error occurred, designation of the Suction error and cause of the suction error. The chart C28 displayed in the detail section Sc shows details of the operations displayed in chart C27, and shows the time, title and operator for the operation in question.

In this way, the control section 61 displays the frequency of occurrence of suction failure and the frequency of occurrence of events other than suction failure in a time series on the display 64 . With this configuration, the management personnel can recognize operations other than the suction failures that affect the occurrence of suction failures. In this way, the management personnel can easily take effective measures against the decline in the performance level or the quality level.

As in 6 shown, in this embodiment the diagram C4 is displayed in the detail section Sc, which indicates the set-up time required for the production of the circuit board types K1, K2, K3 for several types of circuit boards K1, K2, K3, which were manufactured on the default day by a certain placement machine 4a. The management personnel can perform an operation for selecting a board type from the plurality of board types K1, K2, K3, the setup time of which is displayed on the display 64, for the chart C4 on the input device 65 as an input manipulation. The control section 61 displays the content of corresponding to this input operation 18 64 on the display. 18 12 schematically shows an example of the setup analysis view, which is an aspect of the manufacturing management view.

In the setting section Sa, two line designations can be specified from the production lines La, Lb, Lc. It happens that an operator who is located between the two production lines La, Lb, for example, carries out set-up work on these. In this case, the operator performs set-up work on the production line La at the component supply section 42 on the rear (one side in Y-direction) and set-up work on the production line Lb on the component supply section 42 on the front (other side in Y-direction). In addition, the operator performing the set-up work can be set at the setting section Sa. In the example of 18 In the detail section Sc, the time is displayed when the operator O1 has performed set-up work on the rear side of the production line La and the front side of the production line Lb to produce, for example, a type of circuit board K1 selected from the plural types of circuit boards K1, K2, K3 from diagram C4 6 was selected.

This means that the diagram C29 displayed in the detailed section Sc shows the respective execution times of the set-up work for the production of the printed circuit board type K1 in a time series for the back of the several automatic placement machines 4a, 4b, 4c of the production line La. The diagram C30 displayed in the detailed section Sc shows the respective execution times of the set-up work for the production of the printed circuit board type K1 in a time series for the front side of the several automatic placement machines 4a, 4b, 4c of the production line Lb.

In addition, lists C31, C32 are displayed in the detail section Sc. List C31 gives details of the set-up work specified in diagrams C29, C30, specifically when the set-up work was carried out, content of the set-up work, designation of the line on which the set-up work was carried out, designation of the device on which the set-up work was carried out (designation of the placement machine), time required for the set-up work and the operator who carried out the set-up work. List C31 also shows details of errors that required the set-up work specified in charts C29, C30, specifically when the error occurred, name of the error, name of the line on which the error occurred, and name of the error, designation of the device (pick and place machine) on which the error occurred.

The input device 65 thus accepts, as an input operation, an operation for selecting a circuit board type from the plurality of circuit board types K1, K2, K3, the set-up time of which is displayed on the display 64. The control section 61 displays the execution time of the setup work for the production of one type of circuit board in a time series on the display 64 (charts C29, C30). With this configuration, the administration staff can control the loading time of the set-up work for identify a circuit board type of interest in a time series and determine the set-up work that is a cause of the decline in the utilization rate. In this way, the management staff can easily take effective measures against the decline in the utilization rate.

Thus, in the present embodiment, the management device 6 corresponds to an example of the “component mounting management device” of the present invention, the control section 61 to an example of the “control section” of the present invention, the display 64 to an example of the “display” of the present invention, the input device 65 an example of the "operation section" of the present invention, the manufacturing management program 621 an example of the "component mounting management program" of the present invention, the data carrier 69 an example of the "data carrier" of the present invention, which form manufacturing lines La, Lb, Lc an example of the “component placement system” of the present invention, the charts B2, B3, B4 correspond to an example of the “component change over time” of the present invention, and the degree of utilization, efficiency and quality degree to an example of the “OEE components” of the above underlying invention.

The present invention is not limited to the above-described embodiment, and various changes can be made to the above within the scope thereof. For example, the number of production lines L of the circuit board manufacturing facility 1 is not limited to the above example, and there may be only one line, for example. Also, the number of pick and place machines 4 constituting the production line L can be changed as needed.

It is also not mandatory to 3 as the OEE components to display all of Utilization Level, Performance Level and Quality Level. Therefore, a configuration is also possible in which one of them is displayed.

Also, it is not mandatory for the management device 6 to have all the functions indicated by the displays C1-C32 in the detail section Sc. Therefore, the management device 6 can also be configured such that only a part of the displays C1-C32 is displayed while the rest are not displayed.

Different things are also conceivable as the specific content of the errors E11, E12, E13, E14 indicated in diagram C3 and the errors E21, E22, E23, E24 indicated in diagram C7. As concrete examples, errors in sucking components from the component supply station F, errors in component recognition by the component recognition camera 46, errors in transporting the printed circuit boards 10 by the transport device 41, or data errors in the printed circuit boards 10 or the like can be mentioned.

Various standards are also conceivable for the errors in order to judge, as described above, which is a cause for the first type of downtime (long downtime) and which is a cause for the second type of downtime (short downtime). For example, classification according to whether the downtime lasts for a standard time (e.g., 5 minutes) or longer, or classification made in advance by the administrative staff is possible.

Reference List

1

PCB manufacturing facility

6

Management device (component mounting management device)

61

control section

64

advertisement

65

Input Device (Operation Section)

621

Manufacturing Management Program (Component Placement Management Program)

69

disk

La, Lb, Lc

production line (component placement system)

B2, B3, B4

Diagram (component change over time)

QUOTES INCLUDED IN DESCRIPTION

This list of the documents cited by the applicant was generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Patent Literature Cited

• WO 2016/203533 [0003]

Claims (30)

Apparatus for component placement management, comprising: an ad and a control section that displays a temporal component change on the display indicating a temporal change of OEE components with respect to a component mounting system for manufacturing component-mounted circuit boards, wherein the control section displays a state of occurrence of events occurring at the component mounting system with correlation to the components on the display. Apparatus for component mounting management claim 1 , further comprising an operation section that accepts an input operation from management personnel to the component for which the component change over time is displayed on the display, wherein the control section displays at least one of utilization level, performance level and quality level of the OEE components on the display, and the indicates the state of occurrence of an event correlated with the part to which the input operation relates on the display. Apparatus for component mounting management claim 2 , wherein a utilization rate variation indicating the temporal variation of the utilization rate is displayed as the temporal component variation on the display, and the control section treats a respective downtime of a plurality of devices of the component mounting system as an event correlating to the utilization rate and, for each device, a device down time showing a Time of standstill of the device is, as the state of occurrence of the event indicates on the display. Apparatus for component mounting management claim 3 , wherein the operation section accepts as an input operation an operation for selecting a device from the plurality of devices whose device down time is displayed on the display, and the control section treats a plurality of errors that have occurred at the one device, each as an event correlated with the utilization ratio and for displays each error on the display an error idle time, which is the idle time of the one device due to the error, as a matter of fact of occurrence of the event. Apparatus for component mounting management claim 2 , wherein a utilization rate variation indicating the temporal variation of the utilization rate is displayed as the temporal component variation on the display, and the control section treats each setup time at a plurality of devices of the component mounting system as an event correlating with the utilization rate, and for each device, a device down time showing a time required for the set-up work on the device as a state of occurrence of the event on the display. Apparatus for component mounting management claim 5 , wherein utilization ratio setup work, the operation section accepts as an input operation an operation for selecting one device from the plural devices whose setup time is displayed on the display, and the control section for plural types of circuit boards manufactured on the one device to manufacture the respective ones Board type required set-up time as a matter of occurrence of the event on the display. Apparatus for component mounting management claim 6 wherein the operation section accepts as an input operation an operation for selecting one type of board from the plurality of board types for which the setup time is displayed on the display, and the control section displays the execution timing of the setup work for manufacturing the one board type in a time series on the display. Apparatus for component mounting management claim 2 , wherein a utilization rate change indicating the change in the performance rate over time is displayed as the component change over time on the display, and the control section treats a respective stoppage of a plurality of devices of the component mounting system as an event correlating to the performance rate and, for each device, a device down time which a Time of standstill of the device is, as the state of occurrence of the event indicates on the display. Apparatus for component mounting management claim 8 , wherein the operation section accepts as an input operation an operation for selecting a device from the plurality of devices whose device down time is displayed on the display, and the control section treats a plurality of errors that have occurred at the one device, each as an event correlated with the performance level and for displays each error on the display an error idle time, which is the idle time of the one device due to the error, as a matter of fact of occurrence of the event. Apparatus for component mounting management claim 2 wherein a performance rate change indicating the change in the performance rate over time is displayed as the component change over time on the display, and the control section treats respective component suction errors occurring at the plurality of devices of the component mounting system as an event correlated with the performance rate and for each device one value indicating the state of occurrence of a suction failure as the state of occurrence of the event on the display. Apparatus for component mounting management claim 10 wherein the operation section accepts as an input operation an operation for selecting one device from the plurality of devices for which the occurrence of suction errors is indicated on the display, this one device performs suction of components under a plurality of different suction conditions, and the control section for each suction condition the number of the occurred suction error on this device as the state of occurrence of the event on the display. Apparatus for component mounting management claim 11 wherein the one apparatus sucks a component supplied by a component supply station by means of a nozzle attached to a mounting head, the suction condition being one of a component identifier for identifying the components, the component supply station, the mounting head and the nozzle acts. Apparatus for component mounting management claim 4 or 9 , wherein the operation section accepts as an input operation an operation for selecting one error from plural errors for which the error dead time is displayed on the display, and the control section for plural operators involved in the one error displays on the display how many times the an error involving the respective operator has occurred. Apparatus for component mounting management claim 4 or 9 wherein the operation section accepts as an input operation an operation for selecting one fault from a plurality of faults for which the fault dead time is displayed on the display, and the control section displays the frequency of occurrence of the one fault in a time series on the display. Apparatus for component mounting management claim 2 wherein a grade change indicating a change in the grade over time is displayed as a constituent change over time on the display, and the control section treats component mounting defects as the event correlated to the grade and displays the number of defects that have occurred as a state of occurrence of the event on the display . Apparatus for component mounting management claim 15 , wherein the control section displays the number of defects that have occurred, respectively for a plurality of categories indicating a different belonging of the components, on the display. Apparatus for component mounting management claim 15 , wherein the control section displays the number of occurrences of defects for each of a plurality of categories indicating different causes of defects on the display. Apparatus for component mounting management Claim 16 or 17 , wherein the operation section accepts, as an input operation, an operation for selecting one category from a plurality of categories, and the control section treats a plurality of defects that have occurred in the one category, each as the event correlated to the grade of quality, and displays the contents of the plurality of defects in list form on the display shows. Apparatus for component mounting management Claim 18 wherein the operation section accepts as an input operation an operation for selecting one defect from the list, and the control section displays a plurality of images of locations in the component mounting system where the one defect has occurred, taken at different times, on the display. Apparatus for component mounting management claim 19 wherein the component mounting system performs suction of components under a plurality of different suction conditions, and the control section displays the suction condition upon the occurrence of the one deficiency on the display. Apparatus for component mounting management claim 20 wherein the component mounting system sucks a component supplied by a component supply station by means of a nozzle attached to a mounting head, the sucking condition being one of a component ID for identifying components, the component supply station, the placement head and the nozzle. Apparatus for component mounting management claim 12 or 21 wherein the control section displays a respective relationship among the component ID, component supply station, mounting head and nozzle and the number of occurrences of suction failure on the display. Apparatus for component mounting management Claim 22 wherein the operation section accepts as an input operation an operation for selecting one component ID from a plurality of component IDs, and the control section displays the number of occurrences of suction failure of the component having that one component ID involving at least one of the component supply station, mounting head and nozzle on the display . Apparatus for component mounting management Claim 23 , wherein the display indicates the number of occurrences of suction failure for individual solids of the one element, the operation section accepts as an input operation an operation for selecting a solid from the plurality of solids of the one element displayed on the display, and the control section accepts a cause for the occurrence of suction failures of the component with the one component identifier in which the one solid of the one element was involved, on the display. Apparatus for component mounting management Claim 23 , wherein the display indicates the number of occurrences of suction failure for individual solids of the one element, the operation section accepts as an input operation an operation for selecting a solid from the plurality of solids of the one element displayed on the display, and the control section indicates the frequency of occurrence of suction failures a component with the one component identifier, in which the one solid of the one element was involved, in a time series on the display. Apparatus for component mounting management Claim 23 , wherein the display shows the number of occurrences of suction failures for individual solids of the one element, the operation section accepts as an input operation an operation for selecting a solid from the plurality of solids displayed on the display, and the control section counts the number of occurrences of suction failures of a component with a component identifier other than the one component identifier in which the one solid of the one component participated on the display. Apparatus for component mounting management according to one of Claims 22 until 26 wherein the control section displays the frequency of occurrence of suction failure and the frequency of occurrence of events other than suction failure in a time series on the display. A component placement management method, comprising: displaying on a display a constituent change over time indicating a change over time of OEE constituents with respect to a component placement system for manufacturing component-mounted circuit boards, and displaying a state of occurrence of an event occurring in the component placement system with correlation to the component on the display. Component placement management program that causes a computer to perform the following steps: displaying on a display a constituent change over time indicating a change over time of OEE constituents with respect to a component placement system for manufacturing component-mounted circuit boards, and displaying a state of occurrence of an event occurring in the component placement system with correlation to the component on the display. Data medium on which the component placement management program is based claim 29 recorded in a computer readable manner.

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