DE112017006815T5 - Assembly body work device - Google Patents

Abstract

This mounting body working device (1) is configured such that in the case of obstruction between a mounting body (2) and heads (141), (142) based on the shape of the mounting body (2) held by a holding section (132) and a moving area (FIG. R1, R2, R3) of a head unit (14), a disability preventing position (12, 14, 15) of the holding portion (132) is obtained, and the holding portion (132) is moved by a moving mechanism (131) to the disability preventing position (12, 14, 15) becomes.

Description

Technical area

The present invention relates to a stocking work apparatus, and more particularly to a stocking work apparatus in which a stocking body is held and work is performed thereon.

General state of the art

As a mounting device for electronic circuit components (mounting body working apparatus) in which a three-dimensional circuit board (mounting body) is held and work is performed thereon, for example, in the unexamined Japanese Patent Application No. 2012-119643 disclosed device known.

In the unaudited Japanese Patent Application No. 2012 - 119643 For example, there is disclosed an electronic circuit device mounting apparatus comprising a 3D circuit board holding apparatus for holding a three-dimensional circuit board and a mounting head for mounting the three-dimensional circuit board with electronic circuit components held by the 3D circuit board holder. The three-dimensional circuit board comprises a first attachment surface and a second attachment surface for mounting electronic circuit components. The first attachment surface and the second attachment surface are each inclined.

In the unaudited Japanese Patent Application No. 2012 - 119643 For example, a 3D circuit board holding apparatus has a support block (holding section) for supporting a three-dimensional circuit board and a first rotating device (tilting mechanism section) that inclines the support block about a horizontally extending axis. The support block is raised and lowered by a circuit board support lifting device (lifting mechanism section) and rotated by a second rotating device (rotating mechanism section) about a vertically extending axis. In this way, the support block is displaced in position by the electronic circuit component mounting apparatus, the first rotating device, the circuit board supporting lifter, and the second rotating device. Thereby, the first rotation device, the circuit board support lifter and the second rotation device, the first attachment surface and the second attachment surface can each be moved to a position in which the attachment head can mount electronic circuit devices.

Documents of the prior art

Patent documents

Patent Document 1: Untested Japanese Patent Application No. 2012-119643

Brief description of the invention

Object of the present invention

The carrier block from the unchecked Japanese Patent Application No. 2012-119643 is moved by the first rotating device, the printed circuit board support lifting device and the second rotating device to bring each of the first attachment surface and the second attachment surface in the horizontal. At this time, the support block moves so that an attachment head can attach electronic circuit components to the first attachment surface. There is a problem that there is a hindrance between the other attachment head adjacent to the one attachment head and the three-dimensional circuit board carried by the displaced support block. Therefore, there is a need for a stocking body working apparatus that can obviate obstruction between a head and a holding portion of the stocking body holding unit holding the stocker body.

The present invention has been made to solve the above-mentioned problem, and an object of the present invention is to provide a stocking work apparatus in which obstruction between a head and a stocking body held by a holding portion of the stocker holding unit can be avoided.

Means for solving the problem

In order to achieve this object, a stocking body working apparatus according to one aspect of the invention comprises a stocking body holding unit holding a stocking body loaded with components and a head unit having a plurality of heads performing work on the stocking body held by the stocking box holding unit, the stocking board holding unit is configured to include a holding portion holding the stocker body and a moving mechanism that moves the stocking member held by the holding portion by moving the holding portion, wherein in case of obstruction between the stocking body and the heads based on the shape of the the holding portion held holding body and a moving range of the head unit, a disability preventing position of the holding body holding the holding portion is obtained and the holding portion by the moving mechanism is moved to the obstruction avoiding position.

As described above, in the stocker working apparatus according to one aspect of the invention, based on the shape of the stocking body held by the holding portion and the moving range of the head unit, a disability prevention position of the stocker holding portion is obtained and the holding portion is moved to the disability preventing position by the movement mechanism. By thus moving the holding portion to the obstruction avoiding position by the moving mechanism, the stocking body held by the holding portion is moved to the obstruction avoiding position. In this way, obstruction between a head of the head unit and the stocker held by the holding portion of the stocker holding unit can be avoided.

The stocking body working apparatus according to this aspect is preferably configured such that, in the case where work is performed by the movement of a plurality of heads to a disability between a head other than the head and the stocking body Obstruction preventing position is obtained and the holding portion is moved by the moving mechanism in the disability avoiding position. With this configuration, by moving the holding portion to the obstruction avoiding position by means of the moving mechanism, obstruction between a head other than the head performing work and the loading body can be avoided when a plurality of heads are moved.

In the stocking body working apparatus configured to obtain the obstruction avoidance position of the holding portion based on the shape of the stocking body and the moving range of the head unit, the configuration is preferably such that it is judged based on the shape data of the stocking body and the moving range data of the head unit there is a hindrance between the mounting body and a plurality of heads of the head unit, and the obstruction avoiding position is obtained when disability occurs. By this configuration, it is judged from data on whether there is a hindrance between the mounting body and the plurality of heads of the head unit. Therefore, instead of actually moving the component body and the plural heads and judging whether or not there is a hindrance, the existence of a disability between the component body and the heads can be easily and quickly judged.

In the stocking body working device configured to move the holding portion by the moving mechanism, the configuration is preferably such that the holding portion is moved to the obstruction avoiding position by performing at least one operation of rotating, lowering and tilting the holding portion by the moving mechanism. By this configuration, a disability between the mounting body and the plurality of heads can be avoided without linear movement of the holding portion in the horizontal. In this way, instead of moving the holding portion horizontally and performing at least one operation of turning, lowering and tilting the holding portion, the mechanisms for moving the holding portion to the obstruction avoidance position (linear moving mechanism) can be reduced, thereby controlling the movement of the holding portion in the disability avoidance position can be simplified by the proportion of linear movement.

In the stocking body working apparatus, preferably, the moving mechanism includes a lifting mechanism portion that moves the stocking body held by the holding portion in a top-bottom direction, a tilting mechanism portion attached to the lifting mechanism portion and rotating the holding portion about a first rotation axis that is in a direction of travel of the machine Lift mechanism portion extends in the vertical direction, and a rotation mechanism portion attached to the tilt mechanism portion and rotates the holding portion about a second rotation axis extending in a direction perpendicular to the first rotation axis, the configuration being such that using at least one of the lift mechanism portion, the tilting mechanism portion and the rotating mechanism portion, a process is performed, which corresponds to a lowering, tilting or rotation of the holding portion, whereby the holding portion is moved to the disability prevention position. With this configuration, since the rotation mechanism portion is attached to the tilting mechanism portion and the tilting mechanism portion is attached to the lift mechanism portion, the placement body can be rotated in a state by the rotation mechanism portion in which the fitting body is not inclined by the tilting mechanism portion. In this way, since the component body is rotated in a state by the rotary mechanism portion in which the component body is not inclined, the rotational radius of the component body can be reduced as compared with the case where the component body is rotated in a tilted state. In this way, a disability between a plurality of heads and the mounting body can be more inhibited than by a mechanism that rotates the mounting body in an inclined state.

In the mounting body working apparatus configured such that the holding portion moves the mounting body to the obstruction avoiding position, the configuration is preferably such that the mounting body includes a circuit board in three-dimensional form and a plurality of components equipped with the circuit board, with each assembly A printed circuit board with a component in the event that on the basis of the shape of the mounting body including the mounted component and the circuit board and the movement range of the plurality of heads to a disability between the mounting body and the plurality of heads, the holding portion moves by the moving mechanism in the disability prevention position becomes. With this configuration, the holding portion can be moved to the obstruction avoidance position in consideration of the shape of the mounting body that changes with each mounting of the three-dimensionally shaped circuit board with a respective one of the plurality of components. Even if the shape of the mounting body changes with each assembly of a component by the assembly of the circuit board with the components, a mutual interference between the component body and the plurality of heads can be avoided in this way.

In the stocking body working apparatus configured such that the holding portion moves the stocking body to the obstruction avoidance position, the configuration is preferably such that the plurality of heads includes a plurality of stocking-equipped stocking heads and, if continuously loaded by the plurality of stocker heads, a single cycle of stocking operations is performed, during the one cycle of the holding portion is moved to a specific disability prevention position in which a disability between the mounting body and the plurality of mounting heads can be avoided, and so a cycle of assembly operations is performed summarized. With this configuration, without moving the mounting body through the holding section from the obstruction avoiding position, a cycle of mounting operations can be performed in a summary of the individual heads arrayed on a straight line. In this way, the movement of the mounting body through the holding portion for performing the mounting operations of the plurality of heads on the mounting body can be minimized. A cycle refers to the period of time from the beginning of an operation of the assembly of the component body with a component at a specific position on the circuit board by a mounting head to the completion of the assembly with all components.

In the stocking body working apparatus configured such that the holding portion moves the stocking body to the obstruction avoidance position, the configuration is preferably such that the head unit includes a height measuring portion that measures a height position of the stocking body and a state of movement of the holding portion into the obstruction avoiding position the height position of the mounting body is measured by the height measuring section, and it is checked whether the holding section is located in the obstruction avoiding position. By this configuration, it can be checked by the height measuring section, whether the mounting body is arranged in the obstruction avoidance position. In this way, obstruction between the mounting body and the plurality of heads can be surely avoided.

Effect of the invention

According to the present invention, obstruction between a head and the mounting body held by the holding portion of the mounting body holding unit can be avoided.

list of figures

• 1 eine Vorderansicht, die den Gesamtaufbau einer Bestückungskörperarbeitsvorrichtung gemäß einer Ausführungsform der vorliegenden Erfindung darstellt;
• 2 eine perspektivische Ansicht eines Bestückungskörpers, der an der Bestückungskörperarbeitsvorrichtung der Ausführungsform der vorliegenden Erfindung gehalten wird;
• 3 eine Draufsicht, die den Gesamtaufbau der Bestückungskörperarbeitsvorrichtung der Ausführungsform der vorliegenden Erfindung darstellt;
• 4 eine Seitenansicht, die den Gesamtaufbau der Bestückungskörperarbeitsvorrichtung der Ausführungsform der vorliegenden Erfindung darstellt;
• 5 ein Blockdiagramm, das den steuerungsbezogenen Aufbau der Bestückungskörperarbeitsvorrichtung der Ausführungsform der vorliegenden Erfindung darstellt;
• 6 eine perspektivische Ansicht einer Bestückungskörperhalteeinheit der Bestückungskörperarbeitsvorrichtung der Ausführungsform der vorliegenden Erfindung;
• 7 ein Ablaufdiagramm zum Vermeiden der gegenseitigen Behinderung zwischen einem Bestückungskörper und einem Bestückungskopf bei der Bestückungskörperarbeitsvorrichtung der Ausführungsform der vorliegenden Erfindung;
• 8 eine Seitenansicht der Bestückungskörperarbeitsvorrichtung der Ausführungsform der vorliegenden Erfindung, die eine Simulation eines Zustands darstellt, in dem ein Abgabekopf Lotpaste auf den Bestückungskörper aufträgt;
• 9 eine Seitenansicht der Bestückungskörperarbeitsvorrichtung der Ausführungsform der vorliegenden Erfindung, die eine Simulation eines Zustands darstellt, in dem eine Behinderung zwischen dem Bestückungskörper und einem Bestückungskopf vorliegt;
• 10(a) eine Seitenansicht der Bestückungskörperarbeitsvorrichtung, die die Behinderungsvermeidungsposition des Bestückungskörpers darstellt, und 10(b) eine Seitenansicht der Bestückungskörperarbeitsvorrichtung, die einen Zustand der Messung der Höhenposition des Bestückungskörpers darstellt;
• 11(a) eine Seitenansicht der Bestückungskörperarbeitsvorrichtung, die einen Zustand des Auftragens von Lotpaste auf den Bestückungskörper durch den Abgabekopf darstellt, 11(b) eine Draufsicht auf den Bestückungskörper, die einen Bewegungsfähigkeitsbereich des Abgabekopfes darstellt, und 11(c) eine Draufsicht auf den Bestückungskörper, die einen Arbeitsbereich des Abgabekopfes darstellt;
• 12 ein Ablaufdiagramm zum Vermeiden der gegenseitigen Behinderung zwischen einem Bestückungskörper und einem Abgabekopf bei der Bestückungskörperarbeitsvorrichtung der Ausführungsform der vorliegenden Erfindung;
• 13(a) eine Seitenansicht der Bestückungskörperarbeitsvorrichtung, die eine Simulation eines Zustands darstellt, in dem der Bestückungskopf den Bestückungskörper mit einem elektronischen Bauelement bestückt, und 13(b) eine Seitenansicht der Bestückungskörperarbeitsvorrichtung, die eine Simulation eines Zustands darstellt, in dem eine Behinderung zwischen dem Bestückungskörper und dem Abgabekopf vorliegt;
• 14(a) eine Seitenansicht der Bestückungskörperarbeitsvorrichtung, die die Behinderungsvermeidungsposition des Bestückungskörpers darstellt, und 14(b) eine Seitenansicht der Bestückungskörperarbeitsvorrichtung, die einen Zustand der Messung der Höhenposition des Bestückungskörpers darstellt;
• 15(a) eine Seitenansicht der Bestückungskörperarbeitsvorrichtung, die einen Zustand darstellt, in dem der Bestückungskopf den Bestückungskörper mit einem elektronischen Bauelement bestückt, 15(b) eine Draufsicht auf den Bestückungskörper, die einen Bewegungsfähigkeitsbereich des Bestückungskopfes darstellt, und 15(c) eine Draufsicht auf den Bestückungskörper, die einen Arbeitsbereich des Bestückungskopfes darstellt;
• 16(a) eine Seitenansicht der Bestückungskörperarbeitsvorrichtung, die eine Simulation eines Zustands darstellt, in dem eine Behinderung zwischen dem Bestückungskörper, bei dem die Leiterplatte mit einem elektronischen Bauelement bestückt wurde, und dem Bestückungskopf vorliegt, und 16(b) eine Seitenansicht der Bestückungskörperarbeitsvorrichtung, die eine Simulation eines Zustands darstellt, in dem der Bestückungskörper in die Behinderungsvermeidungsposition bewegt wurde;
• 17 eine Seitenansicht, die einen Zustand darstellt, wobei bei der Bestückungskörperarbeitsvorrichtung der Ausführungsform der vorliegenden Erfindung unter Verwendung von mehreren Bestückungsköpfe die Leiterplatte gleichzeitig mit mehreren elektronischen Bauelemente bestückt wird;
• 18 ein Ablaufdiagramm zum Vermeiden der gegenseitigen Behinderung zwischen einer Kopfeinheit und dem Bestückungskörper bei einer Bewegung der Kopfeinheit bei der Bestückungskörperarbeitsvorrichtung der Ausführungsform der vorliegenden Erfindung;
• 19 eine Seitenansicht der Bestückungskörperarbeitsvorrichtung der Ausführungsform der vorliegenden Erfindung, die eine Simulation eines Zustands darstellt, in dem sich die Kopfeinheit bewegt;
• 20 eine Seitenansicht der Bestückungskörperarbeitsvorrichtung der Ausführungsform der vorliegenden Erfindung, die eine Simulation eines Zustands darstellt, in dem eine Behinderung zwischen dem Bestückungskörper und dem Abgabekopf vorliegt;
• 21(a) eine Seitenansicht der Bestückungskörperarbeitsvorrichtung, die die Behinderungsvermeidungsposition des Bestückungskörpers darstellt, und 21(b) eine Seitenansicht der Bestückungskörperarbeitsvorrichtung, die einen Zustand der Bewegung der Kopfeinheit darstellt; und
• 22 eine Seitenansicht der Bestückungskörperarbeitsvorrichtung der Ausführungsform der vorliegenden Erfindung, die eine Simulation eines Zustands darstellt, in dem der Bestückungskörper unter Verwendung eines Neigemechanismusabschnitt in die Behinderungsvermeidungsposition bewegt wurde.

Show it:

• 1 FIG. 10 is a front view illustrating the overall structure of a stocking body working apparatus according to an embodiment of the present invention; FIG.
• 2 a perspective view of a mounting body, which is held on the mounting body working device of the embodiment of the present invention;
• 3 Fig. 10 is a plan view illustrating the overall structure of the stocker working device of the embodiment of the present invention;
• 4 Fig. 10 is a side view illustrating the overall structure of the stocking body working apparatus of the embodiment of the present invention;
• 5 FIG. 10 is a block diagram illustrating the control related structure of the stocker working device of the embodiment of the present invention; FIG.
• 6 FIG. 3 is a perspective view of a stocker holding unit of the stocker working apparatus of the embodiment of the present invention; FIG.
• 7 FIG. 10 is a flowchart for avoiding mutual interference between a mounting body and a mounting head in the mounting body working apparatus of the embodiment of the present invention; FIG.
• 8th 10 is a side view of the stocker working device of the embodiment of the present invention, illustrating a simulation of a state in which a discharge head applies solder paste to the stocker;
• 9 10 is a side view of the stocker working device of the embodiment of the present invention, illustrating a simulation of a condition in which there is a hindrance between the stocker body and a mounting head;
• 10 (a) 3 is a side view of the stocker working device illustrating the obstruction avoidance position of the stocker, and FIG 10 (b) FIG. 10 is a side view of the stocker working device illustrating a state of measuring the height position of the stocker; FIG.
• 11 (a) FIG. 12 is a side view of the stocker working device illustrating a state of applying solder paste to the stocker body by the discharge head. FIG. 11 (b) a plan view of the mounting body, which represents a range of movement of the dispensing head, and 11 (c) a plan view of the mounting body, which represents a working area of the dispensing head;
• 12 a flowchart for avoiding the mutual interference between a mounting body and a dispensing head in the mounting body working device of the embodiment of the present invention;
• 13 (a) 3 is a side view of the stocker working device illustrating a simulation of a state in which the stocker head equips the stocker with an electronic component, and FIG 13 (b) Fig. 10 is a side view of the stocker working device illustrating a simulation of a condition in which there is a hindrance between the stocker and the discharge head;
• 14 (a) 3 is a side view of the stocker working device illustrating the obstruction avoidance position of the stocker, and FIG 14 (b) FIG. 10 is a side view of the stocker working device illustrating a state of measuring the height position of the stocker; FIG.
• 15 (a) FIG. 10 is a side view of the stocker working device illustrating a state in which the stocker head loads the stocker body with an electronic component. FIG. 15 (b) a plan view of the component body, which has a range of motion of the Placement head represents, and 15 (c) a plan view of the mounting body, which represents a working area of the mounting head;
• 16 (a) 3 is a side view of the stocker working device illustrating a simulation of a condition in which a disability exists between the stocker body in which the board has been loaded with an electronic component and the stocker head, and FIG 16 (b) FIG. 10 is a side view of the stocker working device illustrating a simulation of a state in which the stocker body has been moved to the obstruction avoidance position; FIG.
• 17 10 is a side view illustrating a state in which, in the mounting body working apparatus of the embodiment of the present invention, using a plurality of mounting heads, the board is simultaneously populated with a plurality of electronic components;
• 18 a flow chart for avoiding the mutual interference between a head unit and the mounting body in a movement of the head unit in the mounting body working device of the embodiment of the present invention;
• 19 10 is a side view of the stocker working device of the embodiment of the present invention, illustrating a simulation of a state in which the head unit is moving;
• 20 10 is a side view of the stocker working device of the embodiment of the present invention, illustrating a simulation of a condition in which there is a hindrance between the stocker body and the discharge head;
• 21 (a) 3 is a side view of the stocker working device illustrating the obstruction avoidance position of the stocker, and FIG 21 (b) Fig. 10 is a side view of the stocker working device illustrating a state of movement of the head unit; and
• 22 13 is a side view of the stocker working device of the embodiment of the present invention, illustrating a simulation of a state in which the stocker body has been moved to the obstruction avoidance position using a tilting mechanism portion.

Embodiment of the invention

Hereinafter, a concrete embodiment of the present invention will be described with reference to the figures.

As in 1 is a picking body working device 1 designed such that it is a circuit board 8th with electronic components 7 as an integrated circuit, a transistor, a capacitor and a resistor and the like populated. In the stocking body working device 1 The transport direction of the printed circuit board applies 8th as the X direction and the direction perpendicular to the X direction in the horizontal direction as the Y direction. A direction on the component body working device 1 perpendicular to the X-direction and the Y-direction is considered Z-direction. The electronic components 7 are an example of the "components" of the claims.

assembly body

The assembly body 2 has a circuit board 8th , several electronic components 7 with which the circuit board 8th equipped, and a storage element 31 on, on which the circuit board 8th for transportation in the stocking work apparatus 1 is stored. The circuit board 8th is like 2 shown a circuit board 8th whose shape is not flat, but three-dimensional. In the example off 2 about includes the circuit board 8th a base section 21 and one from the base section 21 projecting projection portion 22 , The projection section 22 is provided so as to be the entire length of the one edge portion of the base portion 21 occupies. The assembly body 2 has a height in the projection direction of the protrusion portion 22 on.

The top surface of the base section 21 is how in 2 shown, a first assembly area 21a that come with electronic components 7 is equipped. The top surface of the protrusion portion 22 is a second assembly area 22a that come with electronic components 7 is equipped. At the first assembly area 21a is a recess section 23 formed, the opposite of the remaining first assembly area 21a is deepened. The second assembly area 22a is a flat surface. At the first assembly area 21a an unillustrated measuring mark (FM) is attached.

Assembly body work device

As in 1 shown has the component body working device 1 a function, wherein a transported board 8th to X2 Side is transported and at a certain position, the first assembly area 21a and the second assembly area 22a the circuit board 8th with electronic components 7 be fitted. More specifically, the stocking body working device 1 a frame 10 , a component body transport section 11 , a band feeder device 12 (please refer 3 ), a mounting body holding unit 13 , a head unit 14 , a carrier section 15 , a pair of track sections 16 (please refer 3 ), a component recognition camera 17 (please refer 3 ), a circuit board recognition camera 18 (please refer 4 ), a laser measuring section 19 (please refer 4 ) and a control device 20 (please refer 5 ) on.

Assembly body transport section

The component body transport section 11 is designed such that it, as in 3 shown the circuit board 8th transported, in transport direction ( X2 Direction) transported and transported away. The component body transport section 11 includes an upstream transport section 111 , middle transport section 112 and downstream transport section 113 ,

The upstream transport section 111 points as in 3 shown a pair of first conveyor sections 111 on. The pair first conveyor sections 111 supports the two end sections in a direction perpendicular to the transport direction ( Y Direction) of the storage element 31 on which the circuit board 8th is stored, from below. The pair first conveyor sections 111 transports the transported board 8th to the middle transport section 112 ,

The middle transport section 112 is between the upstream transport section 111 and the downstream transport section 113 arranged. The middle transport section 112 points as in 3 shown a pair of second conveyor sections 112a on. The pair of second conveyor sections 112a supports the two end sections in a direction perpendicular to the transport direction ( Y Direction) of the storage element 31 on which the circuit board 8th is stored, from below. The pair of second conveyor sections 112a takes over the circuit board 8th from the upstream transport section 111 and transports the transferred PCB 8th to the downstream transport section 113 , The pair of second conveyor sections 112a moves the circuit board 8th to a position of the transfer to the Bestückungskörperhalteeinheit 13 ,

The downstream transport section 113 has a pair of third conveyor sections 231 on, like in 3 shown. The pair third conveyor sections 113a supports the two end sections in a direction perpendicular to the transport direction ( Y Direction) of the storage element 31 on which the circuit board 8th is stored, from below. The pair third conveyor sections 113a takes over with the electronic components 7 equipped printed circuit board 8th from the middle transport section 112 and transports those with the electronic components 7 equipped printed circuit board 8th to a downstream transport path, not shown.

Sliver conveyor device

As in 3 is shown at an end portion of the frame 10 on the Y2 Page a feeder layout section 10a for arranging a plurality of tape feeders 12 intended. At one end of the frame 10 on the Y1 Page is not a feeder layout section 10a provided, and it is not a band feeder device 12 arranged.

The band feeder devices 12 hold, as in 4 shown a role 121 To which a tape is wound, at certain intervals several electronic components 7 holds. The band feeder devices 12 turn the roll 121 , whereby they move the tape forward, that the electronic components 7 holds, and thus lead the electronic components 7 from the front end to. The band feeder devices 12 are via unillustrated ports, which are at Zubringeranordnungsabschnitt 10a are provided, electrically connected to the control device 20 (please refer 5 ) connected. In this way, the band feeding devices convey 12 based on a control signal from the control device 20 the tape from the roll 121 forward.

Assembly body holding unit

The component body holding unit 13 takes over, as in 1 shown at the transfer position the component body 2 that with the electronic components 7 should be equipped, from Assembly body transport section 11 and hold him. The component body holding unit 13 includes a holding section 132 , the body of the assembly 2 holds, and a movement mechanism 131 that of the holding section 132 held mounting body 2 by moving the holding section 132 emotional.

The component body holding unit 13 can the held assembly body 2 by means of the movement mechanism 131 up and down (in Z Direction). The component body holding unit 13 can the component body 2 by means of the movement mechanism 131 tend. Tilting in the present specification means rotating the placement body 2 in terms of the Z- Direction in the Y1 Direction or Y2 -Direction. The component body holding unit 13 can the component body 2 by means of the movement mechanism 131 rotate. By the mounting body holding unit 13 So by means of the movement mechanism 131 at least one operation of moving up / down, tilting or turning the holding section 132 Thus, it can be the position of the component body 2 to adjust. The detailed configuration of the mounting body holding unit 13 will be described below.

This is the circuit board 8th , as in 1 shown in a through the storage element 31 held state as the component body 2 from the assembly body transport section 11 transported. The storage element 31 is an element for transporting the printed circuit board 8th by means of the component body transport section 11 , The storage element 31 holds the circuit board 8th in a detachable way. The storage element 31 is configured to be separate from the mounting body holding unit 13 is held.

As in 1 shown, the storage element 31 a plate-shaped storage section 311 and one on the bottom surface of the storage portion 311 formed held section 312 on. At the top surface ( Z1 side surface) of the storage section 311 a weakly sticky adhesive layer is formed. By the mounting body 2 is glued to the adhesive surface, the storage section 311 the component body 2 releasably hold on the top surface. On the underside surface of the storage section 311 ( Z2 side surface) is a held section 312 for holding the storage element 31 by the mounting body holding unit 13 intended. The held section 312 is in X Direction of the storage element 31 provided near the center when the mounting body 2 at the storage section 311 is held. The held section 312 jumps from the bottom surface of the storage section 311 down (in Z2 Direction). The component body holding unit 13 holds the storage element 31 by holding the held section 312 of the storage element 31 holds. In this way, the circuit board 8th over the storage element 31 from the mounting body holding unit 13 held.

In the middle section of the frame 10 is how in 3 shown, a rectangular in plan view opening portion 10b educated. At the opening section 10b of the frame 10 is a recording section 10c appropriate. The recording section 10c is how in 1 shown as one of the top surface of the frame 10 ( Z1 -side surface) downwards (in Z2 Direction) formed recessed form. At least part of the mounting body holding unit 13 is in the recording section 10c taken arranged.

rail sections

The rail sections 16 are, as in 3 shown, designed in such a way that they are in a direction of transport of the support portion 15 vertical direction (Y direction) are movable. Specifically, the pair is rail sections 16 formed extending in the Y direction. The pair of rail sections 16 is at both end portions of the frame 10 fixed in X direction. The pair of rail sections 16 each includes a ball screw extending in the Y direction 16a , several Y-axis motors 16b attached to the ball screws 16a are provided, and a guide rail, not shown. The Y-axis motors 16b each rotate a corresponding ball screw 16a , If the Y-axis motors 16b the ball screws 16a rotate, the carrier section moves 15 on the pair of rail sections 16 along in a direction perpendicular to the transport direction (Y direction).

support section

The carrier section 15 is how in 3 shown configured in the transport direction of the head unit 14 (X direction) is movable. More specifically, the carrier section comprises 15 a running in the X direction ball screw 15a , an X-axis motor 15b who has the ball screw 15a rotates, and a not shown in the X-direction guide rail. The head unit 14 is in the transport direction (X direction) on the support section 15 moved along when the ball screw 15a through the X-axis motor 15b is turned.

By this configuration, the head unit 14 designed so that they are above the frame 10 in the horizontal direction ( X Direction and Y direction) can be moved. In this way, the head unit can 14 for example via the band feeder device 12 move and one of the band feeder device 12 supplied electronic component 7 suck. In addition, the head unit 14 for example, about the of the mounting body holding unit 13 held circuit board 8th move and the circuit board 8th with the sucked electronic component 7 equip.

head unit

The head unit 14 is how in 1 shown adapted to work on the of the mounting body holding unit 13 held mounting body 2 perform. The head unit 14 is over the beam section 15 and the pair of rail sections 16 on the frame 10 appropriate. The head unit 14 is (in Z1 Direction) above the mounting body transport section 11 , the fitting body holding unit 13 and the band feeder device 12 arranged. The head unit 14 leads to the of the mounting body holding unit 13 held mounting body 2 a process for loading with the component 7 by. The assembly is a work process, the head unit 14 one of the band feeder device 12 supplied electronic component 7 sucks and the circuit board 8th with the sucked electronic component 7 stocked.

The head unit 14 points as in 1 shown a delivery head 141 , a placement head 142 , several ball screw spindles 143 , one Z -Achsenmotor 144 and one R -Achsenmotor 145 (please refer 5 ) on. The dispensing head 141 and the placement head 142 are in a row on a straight line in the transport direction ( X Direction). At the delivery head 141 and at the placement head 142 are each a ball screw 143 and a Z -Achsenmotor 144 intended. The dispensing head 141 and the placement head 142 are an example of the "multiple heads" of the claims.

The dispensing head 141 points as in 1 shown with a nozzle attached to the front end. The dispensing head 141 Lot solder, which is supplied through a syringe, not shown, from a nozzle at the front end and is configured such that it solder paste on the first mounting surface 21a and the second assembly area 22a of the component body 2 can apply.

The placement head 142 points as in 1 shown at the front end (lower end) mounted nozzle. The placement head 142 is configured such that it is generated by the negative pressure generated by a negative pressure generating portion, not shown, at the front end portion of the nozzle, that of the band feeder device 12 supplied electronic component 7 can suck in and hold. The placement head 142 is configured such that it, by an overpressure, which is generated by a pressure generator, not shown, at the front end portion of the nozzle, the first mounting surface 21a and the second assembly area 22a of the component body 2 with electronic components 7 can equip. Of the R -Achsenmotor 145 is designed such that it the placement head 142 around the central axis of the nozzle ( Z- Axis) turns.

The ball screw spindles 143 extend as in 1 shown, each in top-bottom direction. The Z -Achsenmotoren 144 each rotate a corresponding ball screw 143 , When the ball screws 143 through the Z-axis motors 144 can be turned, the placement head 142 and the dispensing head 141 along the ball screw 143 be moved up and down. In this way, the placement head 142 between a first height position, in which sucking and mounting (attaching) the electronic components 7 can be performed, and a second height position in which a movement of the head unit 14 in a horizontal direction is possible to move up and down. The dispensing head 141 can between a third height position in which application of solder paste is possible, and a fourth height position in which movement of the head unit 14 in a horizontal direction is possible to move up and down.

Component recognition camera

As in 3 shown is the component recognition camera 17 configured to prior to mounting the electronic component 7 that from the nozzle of the placement head 142 sucked component 7 from below (from the Z2 Direction). More precise is the component recognition camera 17 near the band feeder device 12 on the frame 10 intended.

Board recognition camera

As in 4 shown is the circuit board recognition camera 18 configured to prior to mounting the electronic component 7 the position detection mark on the component body 2 from above (from the Z1 Direction). The position detection mark is a mark for detecting the position of the mounting body 2 , More precisely, the circuit board recognition camera 18 at a lower end portion (in Z2 Direction) on the back surface (in Y1 Direction) of the head unit 14 intended. The circuit board recognition camera 18 can work together with the head unit 14 over the rack 10 in the horizontal direction ( X Direction and Y Direction).

Laser measuring section

As in 1 shown is the laser measuring section 19 configured to prior to mounting the electronic component 7 a height position H1 of the component body 2 to eat. More precisely irradiated the laser measuring section 19 the component body 2 with laser light and measures by picking up the mounting body 2 reflected light the height position H1 of the component body 2 , The through the laser measuring section 19 measured height position H1 is based on the distance from the lower end position of the laser measuring section 19 up to the measuring position on the top surface of the component body 2 calculated. The laser measuring section 19 is an example of the "height measuring section" of the claims. The height position H1 is an example of the "height position" from the claims.

The laser measuring section 19 is how in 4 shown on the back surface (in Y1 Direction) of the head unit 14 appropriate. The laser measuring section 19 can work together with the head unit 14 over the rack 10 in the horizontal direction (X direction and Y direction) are moved. In addition, the laser measuring section moves 19 over the rack 10 in the horizontal direction and radiates laser light from above to the component mounting position on the component body 2 ,

control device

As in 5 shown, includes the control device 20 a CPU (Central Processing Unit), a ROM (Read Only Memory) and a RAM (Random Access Memory), and the like, and is configured to control the operation of the stocker working device 1 to control. More specifically, the controller controls 20 the component body transport section 11 , the mounting body holding unit 13 , the head unit 14 , the beam section 15 , the pair of rail sections 16 , the component recognition camera 17 , the circuit board recognition camera 18 , the laser measuring section 19 , the band feeder device 12 and the like according to programs stored in advance therein. For example, the control device acquires 20 the measurement result of the height position H1 of the component body 2 from the laser measuring section 19 , Based on the measurement result of the altitude position H1 of the component body 2 fits the control device 20 the height position H1 of the component body 2 by means of the mounting body holding unit 13 at. The control device 20 also fits on the basis of the measurement result of the height position H1 of the component body 2 the Absenkmaß the mounting head 142 and the dispensing head 141 at.

Assembly body holding unit

As in 6 shown includes the component body holding unit 13 the movement mechanism 131 , the holding section 132 and a fixation section 133 , The movement mechanism 131 has a lift mechanism section 131 , a tilting mechanism section 131b and a rotary mechanism section 131c on.

The lifting mechanism section 131 is how in 6 shown configured to the holding portion 132 along an axis running in the top-bottom direction A1 (shown as a dotted line) moved up and down. More specifically, the lift mechanism section 131 a drive motor 41 , a pulley mechanism 42 , a ball screw 43 and a mounting portion 44 on.

The drive motor 41 turns the ball screw 43 over the pulley mechanism 42 , The ball screw 43 rotates through the over the pulley mechanism 42 from the drive motor 41 transmitted driving force about the axis A1 , The attachment section 44 is an element for attaching the tilting mechanism section 131b , the rotating mechanism section 131c and the holding section 132 on the lifting mechanism section 131 , On the Y1 Side of the attachment section 44 is the tilting mechanism section 131b appropriate. On the X2 Side of the tilt mechanism section 131b are the Rotation mechanism section 131c and the holding section 132 appropriate. If the ball screw 43 through the drive motor 41 is rotated, the attachment portion 44 along the ball screw 43 be moved up and down. In this way, the lifting mechanism section 131 together with the attachment section 44 the tilting mechanism section 131b , the rotary mechanism section 131c and the holding section 132 move up and down (in Z direction). The axis A1 is an axis that extends through the center of the ball screw 43 extends.

The tilting mechanism section 131b is configured such that it the holding section 132 by turning the holding section 132 one in relation to the axis A1 in the vertical direction extending axis A2 inclines. More specifically, the tilt mechanism section 131b a drive motor 51 , a pulley mechanism 52 and a rotary shaft section 53 on. The axis A2 is an example of the "first axis of rotation" from the claims.

The drive motor 51 turns the rotary shaft section 53 over the pulley mechanism 52 , In addition, the drive motor 51 such that it can rotate in the forward (clockwise) and reverse (counterclockwise) directions. The rotary shaft section 53 rotates through the over the pulley mechanism 52 from the drive motor 51 transmitted driving force about the axis A2 , The axis A2 is an axis extending through the center of the rotary shaft section 53 extends.

At one end section on the X2 Side of the rotary shaft section 53 is the rotary mechanism section 131c appropriate. The rotary mechanism section 131c is configured to coincide with the rotary shaft portion 53 around the axis of rotation A2 can rotate when the rotary shaft section 53 through the drive motor 51 is turned. In this way, the tilting mechanism section rotates 131b the holding section 132 together with the rotary mechanism section 131c around the axis A2 and thereby tends him in the Y Z -Level. The tilting mechanism section 131b can the rotating mechanism section 131c in this case from a ground state in each case in a direction perpendicular to the transport direction Y1 Direction or Y2 Direction within an angle range of 0 to 90 degrees.

The rotary mechanism section 131c is how in 6 shown configured to the holding portion 132 around an axis A3 turns in a direction perpendicular to the axis A2 extends. More specifically, the rotating mechanism section 131c a drive motor 61 and a pulley mechanism 62 on. The axis A3 is an example of the "second axis of rotation" from the claims.

The drive motor 61 turns the holding section 132 over the pulley mechanism 62 , In addition, the drive motor 61 such that it can rotate in the forward (clockwise) and reverse (counterclockwise) directions. The holding section 132 rotates through the over the pulley mechanism 62 from the drive motor 61 transmitted driving force about the axis A3 ,

The holding section 132 is how in 4 shown, designed such that it the component body 2 by means of the storage element 31 holds. More specifically, the holding section 132 , as in 6 shown a cylindrical main section 341 and several (three) claw sections 63 on. The main portion is on the rotating mechanism section 131c appropriate. The several (three) claw sections 63 are at equal angular intervals (distances of 120 degrees) at the main section 341 arranged. The several (three) claw sections 63 are each movable in the radial direction of the main section. By the multiple claw sections 63 can be moved in the radial direction of the main section to the center, they can the held section 312 of the storage element 31 hold. By the multiple claw sections 63 can be moved away from the center in the radial direction of the main portion, they can the held portion 312 of the storage element 31 release.

As in 1 shown is the fixation section 133 a member for attaching and fixing the mounting body holding unit 13 on the frame 10 , The component body holding unit 13 is about the fixation section 133 for example, by passing screws or the like through the upper edge of the receiving portion 10c on the frame 10 fixed.

Disability prevention when applying solder paste through the dispensing head

At the stocking body working device 1 the head unit moves 14 using the rail sections 16 and the carrier section 15 in the horizontal plane. It is conceivable that the head unit 14 in the vicinity of the component body 2 emotional. In this case, it happens that the dispensing head 141 and the placement head 142 the head unit 14 depending on the height position H1 of the component body 2 the component body 2 hinder.

It is also conceivable that the mounting body 2 moves and its position is changed so that the dispensing head 141 the head unit 14 Solder paste on the surface of the component body 2 can apply. If in this case a part of the component body 2 is present, the farther than the work surface to which the dispensing head 141 Applying solder paste, protruding upwards, can lead to a disability of the placement head 142 through the assembly body 2 come.

Therefore, the stocking body working device is 1 the present embodiment configured such that a disability between that of the holding section 132 held mounting body 2 and the nozzle of the head unit 14 is avoided. In the following, the avoidance of obstruction between the head (dispensing head 141 and placement head 142 ) of the head unit 14 and from the holding section 132 held mounting body 2 by the mounting body holding unit 13 described.

In the stocking body working device 1 is based on processing, as described in 7 shown a disability between that of the holding section 132 the mounting body holding unit 13 held mounting body 2 (especially the circuit board 8th ) and the placement head 142 avoided.

First, the control device attains 20 in step S1 Data on the shape of the electronic component 7 , the circuit board 8th , the head unit 14 and the heads. More precisely, the control device attains 20 three-dimensional data of the electronic component 7 , three-dimensional data of the circuit board 8th , three-dimensional data of the head unit 14 and three-dimensional data of the dispensing head 141 , Using a three-dimensional coordinate system formed of coordinates of the horizontal plane and coordinates in the vertical direction, the control device sets 20 three-dimensional data of the component body 2 in RAM starting from the shape of the electronic component 7 represent. Using the three-dimensional coordinate system, the controller sets 20 also three-dimensional data of the circuit board 8th in the RAM, which is the shape of the circuit board 8th represent. Using the three-dimensional coordinate system, the controller sets 20 also three-dimensional data of the head unit 14 in the RAM, which is the shape of the head unit 14 represent. Using the three-dimensional coordinate system, the controller sets 20 also three-dimensional data of the dispensing head 141 and the placement head 142 in the RAM, which is the shape of the dispensing head 14 and the placement head 142 represent. The three-dimensional data of the electronic component 7 and the three-dimensional data of the circuit board 8th are an example of the "shape data of the mounting body" from the claims.

In addition, the control device attains 20 Data about a range of motion R1 the mounting body holding unit 13 and the head unit 14 , More precisely, the control device attains 20 as data on the range of motion R1 the mounting body holding unit 13 and the head unit 14 Data on a respective predetermined range of motion R1 based on three-dimensional data of the overall structure of the component body working device 1 based. The data about the range of motion R1 the mounting body holding unit 13 , the head unit 14 , the dispensing head 141 and the placement head 142 are each stored in RAM.

In step S2 judges the control device 20 based on the range of motion R1 the head unit 14 and the shape of the component body 2 if there is a disability. More specifically, the control device performs 20 based on the three-dimensional data on the shape of the mounting body holding unit 13 , the component body 2 , the head unit 14 , the dispensing head 141 and the placement head 142 a simulation by. The simulation is carried out in such a way that on the basis of the data on the movement range R1 the mounting body holding unit 13 and the head unit 14 a respective virtual movement of the mounting body holding unit 13 and the head unit 14 takes place at the position at which the circuit board 8th with the electronic component 7 is equipped. The controller judges 20 in that there is a hindrance when the three-dimensional data of the head unit 14 and the three-dimensional data of the mounting body holding unit 13 held assembly body 2 overlay each other. When in step S2 no obstruction between the three-dimensional data of the head unit 14 and the three-dimensional data of the component body 2 is present, a transition is made to step S9 ,

As an example of the simulation from step S2 is like 8th to 10 with respect to the three-dimensional data, a case is conceivable in which the dispensing head 141 Solder paste on the first assembly area 21a of the component body 2 applying. As in 8th is shown at the bottom of the mounting head 142 the projection section 22 of the component body 2 arranged. It is done as 9 shown a movement of the head unit 14 in Z2 Direction, and the head unit 14 becomes virtual in the placement position I1 (third height position) moves. Disability or non-obstruction between the component body 2 and the head unit 14 is according to the shape data of the circuit board 8th and the range of motion R1 the head unit 14 as shown in Table 1.

The range of motion R1 is the distance from the actual position of the head unit 14 up to the position in which the head unit 14 is moved virtually. Shape data of the printed circuit board 8th were in advance in the RAM of the controller 20 stored. In Table 1, the shape data of the circuit board 8th the shape of the second row from above. In the second column of Table 1, the range of motion corresponds R1 the placement position I1 , When the dispensing head 141 in the assembly position I1 is arranged, in which he solder paste on the first assembly area 21a can apply, as shown in Table 1, between the projection portion 22 of the component body 2 and the placement head 142 to a disability (see 9 ). In this case, a transition is made to step S3 , The range of motion R1 is an example of the "range of motion data" from the claims.

As in 7 shown attains the control device 20 in step S3 a disability avoidance position 12 in which the obstruction between the placement head 142 and the component body 2 can be avoided. More specifically, the control device performs 20 moving to the obstruction avoidance position by using at least one of the rotary mechanism section 131c , the tilting mechanism section 131b and the lift mechanism section 131 performs an operation of rotating, tilting or lowering the holding portion 132 equivalent.

As an example of the simulation in step S3 attains the control device 20 based on the in 9 shown simulation result of a simulation result of a disability avoidance position 12 , where, as in 10 (a) shown, the component body 2 through the rotary mechanism section 131c is moved in a rotated position by 180 °. In this case, since the projecting portion 22 of the component body 2 not on the bottom of the mounting head 142 there is no obstruction between the projection section 22 and the placement head 142 , In this way, the control device determines 20 by means of the simulation, a position and position of the component body 2 in which there is no obstruction between the component body 2 and the placement head 142 comes. The disability avoidance position I2 is an example of the "disability avoidance position" of the claims.

As in 7 shown, raises / lowers, turns and tilts the controller 20 in step S4 based on the in step S3 calculated disability avoidance position 12 the component body 2 , That is, the control device 20 Gives the necessary commands for movement into the disability avoidance position 12 to the lift mechanism section 131 , the tilting mechanism section 131b and the rotary mechanism section 131c out. For the disability avoidance position 12 according to the simulation, the control device 20 a command for a rotation of about 180 ° to the rotating mechanism section 131c out. In this way the assembly body arrives 2 , as in 10 (b) shown by means of the rotary mechanism section 131c in a rotated by 180 ° state.

In step S5 calculates the control device 20 , as in 10 (b) shown by the laser measuring section 19 the height position H1 of the component body 2 , The laser measuring section 19 moves along with the movement of the head unit 14 by means of the carrier section 15 in transport direction ( X Direction) also in the transport direction ( X -Direction). Also moves the laser measuring section 19 along with the movement of the head unit 14 by means of the rail sections 16 in the direction perpendicular to the transport direction ( Y Direction) also in the direction perpendicular to the transport direction ( Y -Direction). As a result, the laser measuring section moves 19 by means of the carrier section 15 and the rail sections 16 in the horizontal plane and can cover the entire top surface of the component body 2 Emit laser light. The at the laser measuring section 19 measured height position H1 is sent to the control device 20 sent and stored on the RAM, which is a storage medium of the control device 20 is. So can the control device 20 the actual height position H1 the top surface of the component body 2 gain.

In step S6 checks the control device 20 whether the measured height position H1 the disability avoidance position 12 is. Exactly those in step S3 obtained data of disability prevention position 12 and in step S5 obtained data of altitude position H1 of the component body 2 compared. When in step S6 the data of the disability avoidance position 12 and the altitude position data H1 of the component body 2 do not match, a return to step S4 , When in step S6 the data of the disability avoidance position 12 and the altitude position data H1 of the component body 2 match, a transition is made to step S7 ,

In step S7 calculates the control device 20 , as in 11 (a) shown in a state in which the mounting body 2 in the disability avoidance position I2 is fixed, a range of motion ability P1 of the dispensing head 141 , That is, an area is calculated in which, as in 11 (b) as shown by the laser measuring section 19 measured data of the top surface of the component body 2 the dispensing head 141 without obstruction of the component body 2 Has access. The access area of the dispensing head 141 becomes the shape of the mounting body based on the three-dimensional data 2 and the three-dimensional data on the shape of the dispensing head 141 as well as the data of the movement range R1 the head unit 14 calculated.

As in 7 shown, calculates the control device 20 in step S8 in a state in which the mounting body 2 in the disability avoidance position 12 is fixed, a workspace P2 of the dispensing head 141 , That is, the control device 20 calculated as in 11 (c) shown within the access area (range of motion ability P1 ) of the dispensing head 141 a workspace P2 in which the dispensing head 141 by moving the head unit 14 by means of the carrier section 15 and the rail sections 16 without obstruction of the component body 2 can work without the mounting body 2 is moved. The workspace P2 of the dispensing head 141 is converted to the form of the disability prevention position on the basis of three-dimensional data 12 moving assembly body 2 and data about the range of motion R1 the head unit 14 calculated.

In step S9 carries the dispensing head 141 Solder paste on the component body 2 on. That is, the dispensing head 141 carries within the workspace P2 in step S8 was calculated and in which the dispensing head 141 Working on the assembly body 2 can perform solder paste on.

In step S10 judges the control device 20 whether applying solder paste to the circuit board 8th through the dispensing head 141 in the workspace P2 of the dispensing head 141 is completed. When applying solder paste to the component body 2 is not completed, the control device returns 20 to step S9 back.

In step S11 judges the control device 20 whether the application of solder paste on the component body 2 through the dispensing head 141 on all parts of the component body 2 is completed. When applying solder paste to the component body 2 is completed, terminates the control device 20 the work.

Avoiding obstruction in mounting an electronic component by the mounting head In the mounting body working device 1 is based on processing, as described in 12 shown a disability between that of the holding section 132 the mounting body holding unit 13 held mounting body 2 and the dispensing head 141 avoided.

First, the control device attains 20 in step S12 Data on the shape of the electronic component 7 , the circuit board 8th , the head unit 14 and the heads. The control device 20 Gets data about a range of motion R2 the mounting body holding unit 13 , the head unit 14 and the heads (dispensing head 141 and placement head 142 ).

In step S13 judges the control device 20 based on the range of motion R2 the head unit 14 and the shape of the component body 2 if there is a disability. More specifically, the control device performs 20 based on the three-dimensional data on the shape of the mounting body holding unit 13 , the component body 2 , the head unit 14 , the dispensing head 141 and the placement head 142 a simulation by. The simulation is carried out in such a way that on the basis of the data on the movement range R2 the mounting body holding unit 13 and the head unit 14 a respective virtual movement is made to the position at which the circuit board 8th with the electronic component 7 is equipped. The controller judges 20 in that there is a hindrance when the three-dimensional data of the head unit 14 and the three-dimensional data of the mounting body holding unit 13 held assembly body 2 overlay each other. When in step S13 no obstruction between the three-dimensional data of the head unit 14 and the three-dimensional data of the component body 2 is present, a transition is made to step S9 , The range of motion R2 is an example of the "range of motion data" from the claims.

As an example of the simulation from step S13 is how in 13 and 14 as regards the three-dimensional data, a case is conceivable in which the mounting head 142 the first assembly area 21a of the component body 2 with an electronic component 7 stocked. As in 13 shown is at the bottom of the dispensing head 141 the projection section 22 of the component body 2 arranged. This is done as in 13 shown a movement of the head unit 14 in Z2 Direction, and the head unit 14 becomes virtual in the placement position 13 (first height position) moves. Disability or non-obstruction between the component body 2 and the head unit 14 is according to the shape data of the circuit board 8th and the range of motion R2 the head unit 14 as shown in Table 2. The range of motion R2 is the distance from the actual position of the head unit 14 up to the position in which the head unit 14 is moved virtually. Shape data of the printed circuit board 8th were in advance in the RAM of the controller 20 stored. In Table 2, the shape data of the circuit board 8th the shape of the second row from above. In the second column of Table 2, the range of movement corresponds R2 the placement position 12 , If the placement head 142 is arranged in the position in which he has the first assembly area 21a with the electronic component 7 As shown in Table 2, disability occurs between the protruding portion 22 of the component body 2 and the dispensing head 141 (please refer 13 (b) ). In this case, a transition is made to step S14 ,

As in 14 shown attains the control device 20 in step S14 a disability avoidance position 14 in which the obstruction between the dispensing head 141 and the component body 2 can be avoided. More specifically, the control device performs 20 a movement into the disability avoidance position I4 by using at least one of the rotary mechanism section 131c , the tilting mechanism section 131b and the lift mechanism section 131 performs an operation of rotating, tilting or lowering the holding portion 132 equivalent. The disability avoidance position 14 is an example of the "disability avoidance position" of the claims.

As an example of the simulation in step S14 attains the control device 20 based on the in 13 (b) shown simulation result of a simulation result of a disability avoidance position 14 , where, as in 14 (a) shown, the component body 2 through the rotary mechanism section 131c is moved in a rotated position by 180 °. In this case, since the projecting portion 22 of the component body 2 not on the bottom of the dispensing head 141 there is no obstruction between the projection section 22 and the dispensing head 141 , In this way, the control device determines 20 by means of the simulation, a position and position of the component body 2 in which there is no obstruction between the component body 2 and the placement head 142 comes.

As in 12 shown, raises / lowers, turns and tilts the controller 20 in step S15 based on the in step S14 calculated disability avoidance position I4 the component body 2 , That is, the control device 20 Gives the necessary commands for movement into the disability avoidance position I4 to the lift mechanism section 131 , the tilting mechanism section 131b and the rotary mechanism section 131c out. For the disability avoidance position 14 According to the simulation, the control device outputs 20 a command for a rotation of about 180 ° to the rotating mechanism section 131c out. In this way the assembly body arrives 2 , as in 14 (b) shown by means of the rotary mechanism section 131c in a rotated by 180 ° state.

In step S16 calculates the control device 20 by means of the laser measuring section 19 the height position H1 of the component body 2 , The at the laser measuring section 19 measured height position H1 the top surface of the component body 2 is sent to the control device 20 sent and stored on the RAM, which is a storage medium of the control device 20 is.

In step S17 checks the control device 20 whether the measured height position H1 the disability avoidance position 14 is. Exactly those in step S14 obtained data of disability prevention position 14 and in step S16 obtained data of altitude position H1 of the component body 2 compared. When in step S17 the data of Disability prevention position 14 and the altitude position data H1 of the component body 2 do not match, a return to step S15 , When the data of the disability avoidance position 14 and the altitude position data H1 of the component body 2 match, a transition is made to step S18 ,

In step S18 calculates the control device 20 , as in 15 (a) shown in a state in which the mounting body 2 in the disability avoidance position 14 is fixed, a range of motion ability P3 of the mounting head 142 , That is, an area is calculated in which, as in 15 (b) as shown by the laser measuring section 19 measured data of the top surface of the component body 2 the placement head 142 without obstruction of the component body 2 Has access. The access area of the placement head 142 becomes the shape of the mounting body based on the three-dimensional data 2 and the three-dimensional data about the shape of the mounting head 142 as well as the data of the movement range R2 the head unit 14 calculated.

As in 12 shown, calculates the control device 20 in step S19 in a state in which the mounting body 2 in the disability avoidance position I4 is fixed, a workspace P4 of the mounting head 142 , That is, the control device 20 calculated as in 15 (c) shown within the access area (range of motion ability P3 ) of the mounting head 142 a workspace P4 in which the placement head 142 by moving the head unit 14 by means of the carrier section 15 and the rail sections 16 without obstruction of the component body 2 can work without the mounting body 2 is moved. The workspace P4 of the mounting head 142 is converted to the form of the disability prevention position on the basis of three-dimensional data 14 moving assembly body 2 and data about the range of motion R2 the head unit 14 calculated.

In step S20 mounted the mounting head 142 an electronic component 7 on the component body 2 , That is, the placement head 142 mounted within the workspace P4 in step S19 was calculated and in which the placement head 142 Working on the assembly body 2 can perform an electronic component 7 ,

In step S21 judges the control device 20 Whether mounting an electronic component 7 through the placement head 142 in the workspace P2 of the mounting head 142 is completed. When assembling electronic components 7 through the placement head 142 is not completed, drives the control device 20 with step S20 continued.

In step S22 judges the control device 20 Whether mounting electronic components 7 through the placement head 142 on all parts of the component body 2 is completed. If that is the mounting of electronic components 7 through the placement head 142 is completed, terminates the control device 20 the work.

Even if the circuit board 8th as in 16 (a) and 16 (b) already shown with an electronic component 7 is populated, every time you load the circuit board 8th with an electronic component 7 According to the method described above, the calculation of the obstruction avoidance position on the component body 2 carried out. That is, in step S2 or step S13 leads the control device 20 based on the three-dimensional data of the component body 2 in which the circuit board 8th with an electronic component 7 equipped, the head unit 14 , the dispensing head 141 and the placement head 142 a simulation by.

Even if like in 17 shown two placement heads 142 is present, the calculation of the obstruction avoidance position is performed according to the method described above. In this case, the control device 20 for shortening the time required for a single cycle, the electronic component mounting process 7 in the obstruction avoidance position, the equipping in the obstruction avoidance position with two equipping heads 142 perform to the circuit board 8th with electronic components 7 to equip. The control device 20 In the obstruction avoidance position, a continuous mounting of the circuit board can also be achieved 8th with electronic components 7 for a placement head cycle with two placement heads 142 carry out.

Avoidance of obstruction between body and head unit during movement

Next, in the stocking body working apparatus 1 based on the in 18 shown processing a disability between the component body 2 and the head unit 14 while moving the head unit 14 avoided.

First, the control device attains 20 in step S23 Data on the shape of the electronic components 7 , the circuit board 8th , the head unit 14 and the heads (dispensing head 141 and placement head 142 ). In addition, the control device attains 20 Data about a range of motion R3 the mounting body holding unit 13 and the head unit 14 ,

In step S24 judges the control device 20 based on the range of motion R3 the head unit 14 and the shape of the component body 2 if there is a disability. More specifically, the control device performs 20 based on the three-dimensional data on the shape of the mounting body holding unit 13 , the component body 2 , the head unit 14 , the dispensing head 141 and the placement head 142 a simulation by. The simulation is carried out in such a way that the head unit 14 based on the range of motion data R3 the head unit 14 in X Direction or Y Direction is moved. The controller judges 20 in that there is a hindrance when the three-dimensional data of the head unit 14 and the three-dimensional data of the mounting body holding unit 13 held assembly body 2 overlay each other. When in step S24 no obstruction between the three-dimensional data of the head unit 14 and the three-dimensional data of the component body 2 is present, a transition is made to step S27 , The range of motion R3 is an example of the "range of motion data" from the claims.

As an example of the simulation from step S24 is how in 19 With regard to the three-dimensional data, a case is conceivable in which a disability between the dispensing head 141 and the protrusion section 22 of the component body 2 is present. The projection section 22 of the component body 2 is at the bottom of the mounting head 142 arranged. This is done as in 20 shown a movement of the head unit 14 in X1 Direction, and the head unit 14 becomes virtual in a passing position P1 emotional. Disability or non-obstruction between the component body 2 and the head unit 14 is according to the shape data of the circuit board 8th and the range of motion R3 the head unit 14 as shown in Table 3.

The range of motion R3 is the distance from the actual position of the head unit 14 up to the position in which the head unit 14 is moved virtually. Shape data of the printed circuit board 8th were in advance in the RAM of the controller 20 stored. In Table 3, the shape data of the circuit board 8th the shape of the second row from above. In the second column of Table 3, the range of movement corresponds R3 the passing position P1 , If the head unit 14 through the carrier section 15 unchanged in X1 Direction is moved, as shown in Table 3, there is a disability between the dispensing head 141 and the protrusion section 22 of the component body 2 , In this case, a transition is made to step S25 ,

As in 21 shown attains the control device 20 in step S25 a disability avoidance position 15 in which there is no obstruction between the dispensing head 141 and the component body 2 takes place. More specifically, the control device performs 20 a movement into the disability avoidance position I5 by using at least one of the rotary mechanism section 131c , the tilting mechanism section 131b and the lift mechanism section 131 performs an operation of rotating, tilting or lowering the holding portion 132 equivalent. The disability avoidance position 15 is an example of the "disability avoidance position" of the claims.

For movement into the disability avoidance position 15 according to the simulation 21 (a) attains the control device 20 , as in 21 (b) shown a disability avoidance position 15 in which the assembly body 2 through the lift mechanism section 131 is lowered. The control device 20 can also, as in 22 shown a disability avoidance position I5 spend, for which the mounting body 2 is tilted by the rear tilting machine section.

As in 18 shown, raises / lowers, turns and tilts the controller 20 in step S26 based on the in step S17 calculated disability avoidance position 15 the component body 2 , That is, the control device 20 are commands for driving the lifting mechanism section 131 , the tilting mechanism section 131b and the rotary mechanism section 131c out. For the disability avoidance position 15 According to the simulation, the control device outputs 20 a command to lower or tilt the mounting body 2 to the lift mechanism section 131 out.

In step S27 judges the control device 20 whether the movement or position change of the mounting body 2 is completed. When the movement or position change of the component body 2 is completed, terminates the control device 20 the work.

Effect of the present embodiment

With the present embodiment, the following effects can be obtained.

In the present embodiment, the control apparatus obtains 20 the component body working device 1 in the event that it works with the heads (dispensing head 141 or mounting head 142 ) to a disability between the component body 2 and a head comes, based on the shape of the mounting body 2 and the range of motion ( R1 . R2 . R3 ) of the head unit 14 a disability avoidance position ( I2 . I4 . I5 ) of the holding section 132 , In addition, the control device 20 configured such that the holding portion 132 through the movement mechanism 131 into the disability avoidance position ( I2 . I4 . I5 ) is moved. In this way, the control device 20 the holding section 132 by means of the movement mechanism 131 into the disability avoidance position ( I2 . I4 . I5 ) and thus a disability between the head and the component body 2 prevent.

If it is moving the head unit 14 to a disability between the dispensing head 141 or the placement head 142 and the component body 2 come get the control device 20 in the present embodiment, a disability prevention position (FIG. I2 . I4 . I5 ) and moves the holding section 132 by means of the movement mechanism 131 into the disability avoidance position ( I2 . 14 . 15 ). In this way, by moving the holding section 132 by means of the movement mechanism 131 into the disability avoidance position ( I2 . I4 . I5 ) while moving the head unit 14 a disability between the dispensing head 141 or the placement head 142 and the component body 2 be avoided.

In addition, the control device judges 20 in the present embodiment, as described above, based on the three-dimensional shape data of the mounting body 2 and the range of motion data ( R1 . R2 . R3 ) of the head unit 14 whether there is a hindrance between the assembly body 2 and a head is coming or not. The control device 20 is designed such that in the event that there is a disability between the component body 2 and a head comes, a disability avoidance position ( 12 . 14 . 15 ) attained. In this way, it can be judged from the three-dimensional data whether there is a hindrance between the mounting body 2 and a head is coming. Instead of the assembly body 2 and actually moving the multiple heads and judging whether there is mutual obstruction can thus easily and quickly detect the existence of a disability between the component body 2 and the minds are judged.

In the present embodiment, the control device performs 20 through the movement mechanism 131 at least one operation of turning, lowering and tilting the holding portion 132 and moves the holding section 132 into the disability avoidance position ( I2 . 14 . 15 ). So can the control device 20 without linear movement of the holding section 132 in the horizontal disability between the assembly body 2 and avoid the heads. Instead of the holding section 132 to move in the horizontal and at least one operation of turning, lowering and tilting the holding section 132 In this way, the mechanisms for moving the holding section can be carried out 132 into the disability avoidance position ( I2 . I4 . I5 ) (linear motion mechanism) can be reduced. This allows the controller to move the holding section 132 into the disability avoidance position ( I2 . I4 . I5 ).

The movement mechanism 131 In the present embodiment, as described above, the lift mechanism portion includes 131 , the tilting mechanism section 131b and the rotary mechanism section 131c , In this case, the control device performs 20 using at least one of the rotary mechanism section 131c , the lifting mechanism section 131 and the tilting mechanism section 131b a process, the turning, lowering or tilting of the holding section 132 corresponds, and moves the holding section 132 into the disability avoidance position ( 12 . 14 . 15 ). Since the rotary mechanism section 131c at the tilting mechanism section 131b is attached and the tilting mechanism section 131b on the lifting mechanism section 131 is attached, it can be the mounting body 2 through the rotary mechanism section 131 be rotated after the component body 2 through the tilting mechanism section 131c was inclined. Since the rotary mechanism section 131c at the tilting mechanism section 131b is attached and the tilting mechanism section 131b on the lifting mechanism section 131 is attached, the mounting body 2 in this way in a state through the rotary mechanism section 131b be rotated, in which the component body 2 not through the tilting mechanism section 131c is inclined. Because the component body 2 in this way in a state of the component body 2 are rotated by the rotating mechanism portion in which the mounting body 2 is not inclined, the rotational radius of the component body 2 compared to the case that the mounting body 2 in an inclined state of the component body 2 is turned down. In this way, a disability between the component body 2 and the dispensing head 141 and placement head 142 be prevented more than by a mechanism that the assembly body 2 turns in a tilted state.

The assembly body 2 In the present embodiment, as described above, the three-dimensionally shaped circuit board 8th and several electronic components 7 with which the circuit board 8th is equipped. With every assembly of the printed circuit board 8th with an electronic component 7 moves the control device 20 the holding section 132 by means of the movement mechanism 131 into the disability avoidance position ( I2 . I4 . I5 ), if it is based on the shape of the mounting body 2 with the electronic components 7 and the circuit board 8th and the range of motion ( R1 . R2 . R3 ) of the heads to a disability between the component body 2 and the mind is coming. In this way, the holding section 132 taking into account the shape of the component body 2 That deals with every populating the circuit board 8th with a respective one of the plurality of electronic components 7 changed into the disability avoidance position ( I2 . 14 . 15 ) are moved. Even if the shape of the assembly body 2 by the assembly of the printed circuit board 8th with the electronic components 7 Thus, a disability between the component body can thus change 2 and the minds are avoided.

The control device 20 In the present embodiment, it is configured to be the printed circuit board as described above 8th using two placement heads 142 with electronic components 7 in the disability avoidance position ( I2 . I4 ) performs an entire placement cycle. In this way can of the strung on a straight line placement heads 142 an entire assembly cycle can be performed without the assembly body 2 by means of the holding section 132 from the disability avoidance position ( I2 . I4 ) to move away. In this way, the movement of the mounting body 2 through the holding section 132 for performing the mounting operations of the two mounting heads 142 on the component body 2 be minimized.

In the present embodiment, the head unit comprises 14 as described above the laser measuring section 19 for measuring the height position H1 of the component body 2 , The control device 20 Check if the holding section 132 in the disability avoidance position ( I2 . I4 . I5 ) is arranged by, in a state in which they have a movement of the holding portion 132 into the disability avoidance position ( I2 . 14 . I5 ) has caused the height position H1 of the component body 2 through the laser measuring section 19 is measured. In this way, through the laser measuring section 19 be checked if the component body 2 in the disability avoidance position ( I2 . I4 . I5 ) is arranged. So can a disability between the assembly body 2 and the dispensing head 141 and placement head 142 be avoided with certainty.

Modification Example

The disclosed embodiments are to be considered in all respects as illustrative and not restrictive. The scope of the present invention is set forth not in the foregoing description of the embodiments but in the claims, and includes all equivalents and changes within the scope of the claims (modification examples).

For example, the above embodiment shows an example in which the head unit 14 the dispensing head 141 and the placement head 142 but the present invention is not limited thereto. In the present invention, the head unit may also include only one or more of the dispensing head or the placement head. Also, the head unit may each comprise a plurality of dispensing heads and placement heads. Also, it may include other working heads besides the dispensing head and the loading head.

In the embodiment described above, the dispensing head 141 designed such that it solder paste on the circuit board 8th but the present invention is not limited thereto. In the present invention, the dispensing head may also be configured to apply adhesive or conductive paste to the circuit board.

In the embodiment described above, the control device is 20 configured such that they after the application of solder paste on the entire circuit board 8th through the dispensing head 141 the assembly of all parts of the circuit board 8th with electronic components 7 through the placement head 142 However, the present invention is not limited thereto. In the present invention, the application of solder paste to the circuit board by the dispensing head and the mounting of electronic components by the mounting head may also be performed alternately.

In the embodiment described above, the mounting body comprises 2 a three-dimensional circuit board 8th However, the present invention is not limited thereto. In the present invention, the circuit board may also be a flat circuit board.

In the embodiment described above, the control device calculates 20 the disability avoidance position ( I2 . 14 . 15 ) by a simulation using a diagram represented by a virtual coordinate system, but the present invention is not limited thereto. The control device may also calculate the obstruction avoidance position in the present invention using numerical values using the dimensions of the dispensing head, the mounting head, and the mounting body.

In the embodiment described above, the control device performs 20 the operations of the mounting head 142 for a cycle of assembling the circuit board 8th with electronic components 7 with two placement heads 142 by, but the present invention is not limited thereto. In the present invention, the control device may control the operations of the mounting head 142 for one cycle also with three or placement heads 142 carry out.

In the embodiment described above, the control device moves 20 the component body 2 using one of the lift mechanism section 131 , the tilting mechanism section 131b and the rotary mechanism section 131c into the disability avoidance position ( I2 . I4 . I5 ), but the present invention is not limited thereto. In the present invention, the control device may also move the mounting body to the obstruction avoiding position using two or more of the lifting mechanism section, the tilting mechanism section, and the rotating mechanism section.

In the embodiment described above, as the "height measuring portion" in the claims, the laser measuring portion 19 but the present invention is not limited thereto. In the present invention, as the "height measuring section" of the claims, a touch sensor may also be used.

In the above-described embodiment, the processing flow of the control section has been described for the sake of convenience by way of flow charts with processing being performed sequentially according to a processing flow, but the present invention is not limited thereto. The processing flow of the control section may also be event-based Processes are carried out in which the processing is performed on an event-by-event basis. In this case, a purely event-based control or a partly event-driven, partly run-based control can take place.

LIST OF REFERENCE NUMBERS

1

Assembly body work device

2

assembly body

7

electronic component

8th

circuit board

13

Assembly body holding unit

14

head unit

19

Laser measuring section (height measuring section)

20

control device

132

holding section

131

movement mechanism

131

Lifting mechanism section

131b

Tilt mechanism section

131c

Rotation mechanism section

141

Dispensing head (multiple heads)

142

Placement head (multiple heads)

H1

height position

I2, I4, I5

Disability prevention position

R1, R2, R3

range of motion

A2

Axis (first axis of rotation)

A3

Axis (second axis of rotation

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• JP 2012119643 [0002, 0005, 0006]
• JP 2012 [0003, 0004]
• JP 119643 [0003, 0004]

Claims (8)

A picking body working device comprising a mounting body holding unit (13) holding a mounting body (2) equipped with a component (7), and a head unit (14) having a plurality of heads (141), (142) performing work on the stocker held by the stocker holding unit; wherein the mounting body holding unit includes a holding portion (132) holding the mounting body and a moving mechanism (131) that moves the mounting body held by the holding portion by moving the holding portion, wherein, in the case of obstruction between the mounting body and the heads, based on the shape of the mounting body held by the holding section and a moving area (R1, R2, R3) of the head unit, a disability preventing position (I2, 14, 15) of the holding body holding the mounting body is obtained and the holding portion is moved by the moving mechanism to the obstruction avoiding position. Picking body working device according to Claim 1 wherein, in the case where work is performed by the movement of a plurality of heads to a disability between a head other than the head and the mounting body, the obstruction avoiding position is obtained, and the holding section is obtained by the moving mechanism is moved into the disability avoiding position. Picking body working device according to Claim 1 or 2 wherein, based on the shape data of the mounting body and the moving area data of the head unit, it is judged whether there is obstruction between the mounting body and plural heads of the head unit, and the disability avoiding position is obtained when disability occurs. Picking body working device according to one of Claims 1 to 3 wherein the holding portion is moved to the obstruction avoiding position by performing at least one operation of rotating, lowering and tilting the holding portion by the moving mechanism. Picking body working device according to Claim 4 wherein the moving mechanism comprises: a lift mechanism portion (131a) that moves the loading body held by the holding portion in a top-bottom direction, a tilting mechanism portion (131b) attached to the lift mechanism portion and rotating the holding portion about a first rotation axis (A2) extends in a direction perpendicular to the direction of movement of the lifting mechanism portion, and a rotation mechanism portion (131c) attached to the tilting mechanism portion and rotates the holding portion about a second rotation axis (A3) extending in a direction perpendicular to the first rotation axis, using performing at least one of the lift mechanism portion, the tilt mechanism portion and the rotation mechanism portion, a process corresponding to a lowering, tilting or rotation of the holding portion, whereby the holding portion is moved to the disability prevention position. Picking body working device according to one of Claims 1 to 5 wherein the mounting body comprises a printed circuit board (8) in three-dimensional form and a plurality of components, which is equipped with the printed circuit board, wherein each assembly of the printed circuit board with a component in the event that it based on the shape of the mounting body including the assembled component and the circuit board and the moving range of the plurality of heads come to a disability between the mounting body and the plurality of heads, the holding portion is moved by the moving mechanism in the disability prevention position. Picking body working device according to one of Claims 1 to 6 wherein the plurality of heads comprises a plurality of placement heads arranged in a straight line and, when a single cycle of placement operations is continuously performed by the plurality of placement heads, during the one cycle the retaining portion is moved to a specific disability avoidance position in which disability between the placement body and the multiple placement heads can be avoided, and so a cycle of assembly operations is performed summarized. Picking body working device according to one of Claims 1 to 7 wherein the head unit includes a height measuring portion (19) that measures a height position (H1) of the mounting body, and in a state of movement of the holding portion in the obstruction avoiding position, the height position of the mounting body is measured by the height measuring portion and it is checked whether the holding portion in the Disability prevention position is arranged.

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