DE112015007167A5 - Anordnung für ein leistungselektronisches Bauelement - Google Patents
Anordnung für ein leistungselektronisches Bauelement Download PDFInfo
- Publication number
- DE112015007167A5 DE112015007167A5 DE112015007167.9T DE112015007167T DE112015007167A5 DE 112015007167 A5 DE112015007167 A5 DE 112015007167A5 DE 112015007167 T DE112015007167 T DE 112015007167T DE 112015007167 A5 DE112015007167 A5 DE 112015007167A5
- Authority
- DE
- Germany
- Prior art keywords
- arrangement
- electronic component
- power electronic
- power
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Junction Field-Effect Transistors (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/DE2015/100513 WO2017092722A1 (de) | 2015-12-02 | 2015-12-02 | Anordnung für ein leistungselektronisches bauelement |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE112015007167A5 true DE112015007167A5 (de) | 2018-08-16 |
Family
ID=55221202
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE112015007167.9T Granted DE112015007167A5 (de) | 2015-12-02 | 2015-12-02 | Anordnung für ein leistungselektronisches Bauelement |
Country Status (2)
| Country | Link |
|---|---|
| DE (1) | DE112015007167A5 (de) |
| WO (1) | WO2017092722A1 (de) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2021158B2 (de) * | 1970-04-30 | 1972-07-13 | Licentia Patent Verwaltungs GmbH, 6000 Frankfurt | Halbleiteranordnung mit einem scheibenfoermigen gehaeuse und einem in dieses eingespannten halbleiterelement |
| JP5323895B2 (ja) * | 2011-06-23 | 2013-10-23 | 本田技研工業株式会社 | 半導体装置 |
| CN103368539B (zh) * | 2012-03-26 | 2016-08-31 | 通用电气公司 | 开关元件和开关系统 |
-
2015
- 2015-12-02 DE DE112015007167.9T patent/DE112015007167A5/de active Granted
- 2015-12-02 WO PCT/DE2015/100513 patent/WO2017092722A1/de active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017092722A1 (de) | 2017-06-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R012 | Request for examination validly filed | ||
| R082 | Change of representative |
Representative=s name: BOEHMERT & BOEHMERT ANWALTSPARTNERSCHAFT MBB -, DE |
|
| R016 | Response to examination communication | ||
| R016 | Response to examination communication | ||
| R018 | Grant decision by examination section/examining division |