DE112015002690A5 - Verfahren und Vorrichtung für das Abwickeln und Ablegen einer dünnen Folie - Google Patents
Verfahren und Vorrichtung für das Abwickeln und Ablegen einer dünnen Folie Download PDFInfo
- Publication number
- DE112015002690A5 DE112015002690A5 DE112015002690.8T DE112015002690T DE112015002690A5 DE 112015002690 A5 DE112015002690 A5 DE 112015002690A5 DE 112015002690 T DE112015002690 T DE 112015002690T DE 112015002690 A5 DE112015002690 A5 DE 112015002690A5
- Authority
- DE
- Germany
- Prior art keywords
- unwinding
- depositing
- thin film
- thin
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000151 deposition Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000010409 thin film Substances 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0688—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction with foil-type piezoelectric elements, e.g. PVDF
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/857—Macromolecular compositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/88—Mounts; Supports; Enclosures; Casings
- H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Physical Vapour Deposition (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
- Measuring Pulse, Heart Rate, Blood Pressure Or Blood Flow (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102014008165 | 2014-06-06 | ||
DE102014008165.6 | 2014-06-06 | ||
PCT/DE2015/000270 WO2015185027A1 (de) | 2014-06-06 | 2015-06-05 | Verfahren und vorrichtung für das abwickeln und ablegen einer dünnen folie |
Publications (1)
Publication Number | Publication Date |
---|---|
DE112015002690A5 true DE112015002690A5 (de) | 2017-02-23 |
Family
ID=53717857
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE112015002680.0T Withdrawn DE112015002680A5 (de) | 2014-06-06 | 2015-06-05 | Elektromechanischer Wandler |
DE112015002690.8T Withdrawn DE112015002690A5 (de) | 2014-06-06 | 2015-06-05 | Verfahren und Vorrichtung für das Abwickeln und Ablegen einer dünnen Folie |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE112015002680.0T Withdrawn DE112015002680A5 (de) | 2014-06-06 | 2015-06-05 | Elektromechanischer Wandler |
Country Status (2)
Country | Link |
---|---|
DE (2) | DE112015002680A5 (de) |
WO (2) | WO2015185027A1 (de) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5609714A (en) * | 1994-05-10 | 1997-03-11 | Sterling Dry Imaging, Inc. | Apparatus for dry processing of optical print media |
US5431384A (en) * | 1994-05-10 | 1995-07-11 | Polaroid Corporation | Method and apparatus for feeding print media |
DE19914411A1 (de) * | 1999-03-30 | 2000-10-12 | Bosch Gmbh Robert | Piezoelektrischer Aktor |
US6585846B1 (en) * | 2000-11-22 | 2003-07-01 | 3M Innovative Properties Company | Rotary converting apparatus and method for laminated products and packaging |
DE102008003841A1 (de) * | 2008-01-10 | 2009-07-16 | Robert Bosch Gmbh | Piezoelektrisches Aktormodul und Brennstoffeinspritzventil |
JP2014515704A (ja) | 2011-03-07 | 2014-07-03 | バイエル・マテリアルサイエンス・アクチェンゲゼルシャフト | 電気活性層を有する多層複合材料 |
EP2946415A1 (de) | 2013-01-16 | 2015-11-25 | Covestro Deutschland AG | Verfahren zum herstellen eines mehrschichtigen elektromechanischen wandlers |
-
2015
- 2015-06-05 DE DE112015002680.0T patent/DE112015002680A5/de not_active Withdrawn
- 2015-06-05 WO PCT/DE2015/000270 patent/WO2015185027A1/de active Application Filing
- 2015-06-05 DE DE112015002690.8T patent/DE112015002690A5/de not_active Withdrawn
- 2015-06-05 WO PCT/DE2015/000271 patent/WO2015185028A2/de active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2015185027A1 (de) | 2015-12-10 |
DE112015002680A5 (de) | 2017-05-11 |
WO2015185028A3 (de) | 2016-02-04 |
WO2015185028A2 (de) | 2015-12-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R081 | Change of applicant/patentee |
Owner name: TECHNISCHE UNIVERSITAET BERLIN, DE Free format text: FORMER OWNER: HOCHSCHULE OSTWESTFALEN-LIPPE, 32657 LEMGO, DE |
|
R082 | Change of representative |
Representative=s name: ANWALTSKANZLEI EIKEL & PARTNER GBR, DE |
|
R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |