DE112010001158B8 - Heisswasserkühlvorrichtung - Google Patents

Heisswasserkühlvorrichtung Download PDF

Info

Publication number
DE112010001158B8
DE112010001158B8 DE112010001158T DE112010001158T DE112010001158B8 DE 112010001158 B8 DE112010001158 B8 DE 112010001158B8 DE 112010001158 T DE112010001158 T DE 112010001158T DE 112010001158 T DE112010001158 T DE 112010001158T DE 112010001158 B8 DE112010001158 B8 DE 112010001158B8
Authority
DE
Germany
Prior art keywords
hot water
water cooler
cooler
hot
water
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE112010001158T
Other languages
English (en)
Other versions
DE112010001158B4 (de
DE112010001158T5 (de
Inventor
Hiromichi Kuno
Yasuji Taketsuna
Hideo Nakamura
Takeshi Yamazaki
Koichi Suzuki
Osamu Kawanami
Mikio Shirai
Yoshiyuki Abe
Yasuhisa Shinmoto
Haruhiko Ohta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Motor Corp
Original Assignee
Toyota Motor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Motor Corp filed Critical Toyota Motor Corp
Publication of DE112010001158T5 publication Critical patent/DE112010001158T5/de
Application granted granted Critical
Publication of DE112010001158B4 publication Critical patent/DE112010001158B4/de
Publication of DE112010001158B8 publication Critical patent/DE112010001158B8/de
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20936—Liquid coolant with phase change
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE112010001158T 2009-03-10 2010-03-09 Heisswasserkühlvorrichtung Expired - Fee Related DE112010001158B8 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009056086A JP4766132B2 (ja) 2009-03-10 2009-03-10 沸騰冷却装置
JP2009-056086 2009-03-10
PCT/JP2010/053910 WO2010104080A1 (ja) 2009-03-10 2010-03-09 沸騰冷却装置

Publications (3)

Publication Number Publication Date
DE112010001158T5 DE112010001158T5 (de) 2012-05-10
DE112010001158B4 DE112010001158B4 (de) 2013-01-31
DE112010001158B8 true DE112010001158B8 (de) 2013-04-18

Family

ID=42728369

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112010001158T Expired - Fee Related DE112010001158B8 (de) 2009-03-10 2010-03-09 Heisswasserkühlvorrichtung

Country Status (5)

Country Link
US (1) US20120111550A1 (de)
JP (1) JP4766132B2 (de)
CN (1) CN102349152B (de)
DE (1) DE112010001158B8 (de)
WO (1) WO2010104080A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5714429B2 (ja) * 2011-06-24 2015-05-07 株式会社豊田中央研究所 沸騰冷却装置
CN103796494B (zh) * 2014-01-28 2016-02-03 华进半导体封装先导技术研发中心有限公司 密闭性温度控制装置
WO2016117342A1 (ja) * 2015-01-21 2016-07-28 パナソニックＩｐマネジメント株式会社 冷却装置およびこれを搭載した電子機器
DE112015006041B4 (de) * 2015-01-22 2021-03-11 Mitsubishi Electric Corporation Halbleiteranordnung
WO2017046986A1 (ja) * 2015-09-15 2017-03-23 パナソニックＩｐマネジメント株式会社 冷却装置およびこれを搭載した電子機器

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0923081A (ja) * 1995-07-05 1997-01-21 Nippondenso Co Ltd 沸騰冷却装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0223081A (ja) * 1988-07-11 1990-01-25 Matsushita Electric Ind Co Ltd 速度制御装置
JPH0339453A (ja) * 1989-07-06 1991-02-20 Sumitomo Light Metal Ind Ltd Ｖｔｒシリンダー用アルミニウム合金鋳造棒の製造方法
JPH09139453A (ja) * 1995-11-16 1997-05-27 Toshiba Corp 半導体冷却装置
JP2005268658A (ja) * 2004-03-19 2005-09-29 Denso Corp 沸騰冷却装置
JP4699820B2 (ja) 2005-06-28 2011-06-15 本田技研工業株式会社 パワー半導体モジュール

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0923081A (ja) * 1995-07-05 1997-01-21 Nippondenso Co Ltd 沸騰冷却装置

Also Published As

Publication number Publication date
DE112010001158B4 (de) 2013-01-31
JP4766132B2 (ja) 2011-09-07
JP2010212402A (ja) 2010-09-24
US20120111550A1 (en) 2012-05-10
WO2010104080A1 (ja) 2010-09-16
CN102349152B (zh) 2013-01-09
CN102349152A (zh) 2012-02-08
DE112010001158T5 (de) 2012-05-10

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Legal Events

Date Code Title Description
R012 Request for examination validly filed
R018 Grant decision by examination section/examining division
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0023427000

Ipc: H01L0023420000

Effective date: 20120927

R083 Amendment of/additions to inventor(s)
R020 Patent grant now final

Effective date: 20130501

R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee

Effective date: 20131001