DE112008000175T5 - Conductor assembly and method of making same - Google Patents

Abstract

A conductor assembly in which a plurality of conductor wires are integrated, wherein each of the conductor wires has a cross section of one of parts, into which an entire cross section of the conductor assembly is divided, comprising:
an insulating cover layer for covering and insulating an entirety of a wire arrangement of the conductor wires,
wherein the conductor wires are adhered to each other by an insulating adhesive layer.

Description

Technical area

The present disclosure relates to ladder arrangements having a configuration, in which several conductor wires are integrated, as well as method for making the same.

Technical background

By Bundling and integrating several conductor wires formed conductor arrangements have been proposed as magnet wires, in coils for electromagnetic machines and devices be used.

• Patentschrift 1: ungeprüfte japanische Patentanmeldungsveröffentlichung 11-203948

Patent Document 1, for example, discloses a self-fusing twisted wire cable in which an insulating tape is spirally wound around the outer circumference of a strand formed by grasping, twisting and twisting a plurality of self-fusing enameled rectangular wires, and the self-fusing enameled rectangular wires are self-lubricating and self-fusing enameled rectangular ones Wires are. Patent Literature 1 explains that, in the self-fusing twisted electric wires, the element wires can have excellent mutual lubricity in manufacturing the twisted wires and coil winding, and the element wires can be firmly thermally welded to each other during thermal welding of the cable to the coil.

• Patent document 1: unaudited Japanese Patent Application Publication 11-203948

Summary

To be solved by the invention issues

In Recently, conductor arrangements have been used as magnet wires for Engines of electric vehicles considerable attention given. In the conductor arrangements for the motors is It required both the area for better engine performance to enlarge, which occupies the leading part, d. H. the ladder space factor in its sectional area, as also to maintain the insulating property of the conductor assemblies. It is found that the insulating property of the conductor assemblies depends on the thickness of the insulating part surrounding the conductive Part and the like is provided, and accordingly stand an increase in the conductor space factor and maintaining the insulating property in a compromise relationship.

18 FIG. 12 is a cross-sectional view showing a state in which conventional conductor assemblies. FIG 110 in slots S of a stator core forming an engine 120 are arranged, and 19 is a perspective view of one of the conductor assemblies 110 ,

The conductor arrangement 110 includes as in 19 shown several conductor wires 103 including a conductor element wire 101 with a rectangular cross-section and a so provided Isolierelementdrahtabdeckschicht 102 in that they are the conductor element wire 101 covered, a Verschweißschicht 104 for welding the several conductor wires 103 with each other and thus provided insulating outer peripheral cover layer 106 that a wire assembly 105 is covered, in which the several conductor wires 103 through the welding layer 104 are integrated.

The stator core 120 has a cylindrical shape, and as in 18 shown are several grooves (the slots S) and several burrs 120a alternately and circumferentially formed in its outer or inner peripheral wall.

Here is the outer circumference cover layer 106 by spirally winding a band-shaped resin film, such as in FIG 19 shown in overlapping manner for preventing damage coming in contact with a corner C of a ridge 120a when setting the conductor arrangement 110 in a slot S of the stator core 120 and to maintain the insulating property against the crests (wire bridging parts J) of the ridges 120a educated. It is found that when bending the conductor assembly 110 for forming a coil, a difference in length between its outer peripheral part and its inner peripheral part can be effected, which can create a gap at the overlapping point of the resin film. Therefore, the side end portions of the resin film for maintaining the insulating property of the conductor assembly must overlap each other to some extent.

As with the conductor arrangement 110 the side end portions of the resin film as described above are lappt, a helical projection is formed on its surface. For this reason, a configuration of the conductor arrangements 110 in the slots S of the stator core 120 create dead space, for example, between the surfaces of the conductor assemblies 110 and the surfaces of the ridges 120a (the inner walls of the slots S) and between the surfaces of adjacent conductor assemblies 110 , This can reduce the ratio of the cross-sectional area of the conductor assemblies 110 with respect to the cross-sectional area of the slots S occupies, ie the space factor of the wires in the slots S.

Also if, furthermore, the measure for preserving the insulating property a conductor arrangement by a spiral described above Winding the insulating tape, such as a Polyimdfilms to the Wire assembly with the formed overlap on the Practice has been reduced, their feasibility is low and it takes care of unnecessary space when winding the insulating tape to build. This can be a non-uniform Isolation property of the conductor arrangement and a decrease in the conductor space factor to lead.

The The present invention has been made in light of the above, and their task is to preserve the insulating property and the ladder space factor in a ladder arrangement as much as possible to raise.

Means for releasing the problems

To the Achieve the above object in the present invention Conductor wires, which form a conductor arrangement by a Adhesive layer isolated from each other, and the entirety of the wire assembly of Conductor wires is covered by an insulating cover isolated.

in the Individual is a conductor arrangement according to the invention a ladder assembly integrating multiple conductor wires are, wherein each of the conductor wires has a cross section of a of parts, in which an entire cross section of the conductor arrangement is divided. The conductor arrangement comprises an insulating covering layer for covering and insulating a whole of a wire assembly the conductor wires, wherein the conductor wires through an insulating adhesive layer to be adhered to each other.

There in the above configuration, the conductor wires through the adhesive layer are insulated from each other, wherein the conductor wires can be adhered to each other, the conductor space factor the conductor arrangement is increased compared to the case be in which both an insulating layer and an adhesive layer between present the conductor wires. As the whole continues the wire arrangement of the conductor wires through the insulating Covering layer is insulated, the insulating property between the conductor arrangements are respected. It is stated that in general conductor arrangements, electrical current in conductor wires flows in the longitudinal direction and accordingly the Isolation property between the conductor assemblies a larger one Importance is attributed as the isolating property between the Conductor wires. Thus, in the conductor arrangement, the insulating property be maintained and the ladder space factor can be raised as much as possible become.

Of the Cross section of each of the conductor wires may be rectangular.

at the above configuration in which the cross section of each of Conductor wires is rectangular, the conductor wires easily in the width direction and the height direction be arranged by the sides of the conductor wires to Concerns are brought together, causing the ladder space factor the conductor arrangement is increased.

The Adhesive layer may be formed on side surfaces of a conductor wire which are in the wire arrangement of the conductor wires located.

There in the above configuration, the adhesive layer is not on the Outside peripheral surface of the wire assembly formed is, in which the conductor wires are integrated, is the conductive surface as the outer peripheral surface the wire assembly free. Accordingly, the insulating Covering layer by electroplating around the outer peripheral surface the wire assembly are formed.

The Insulating cover layer can be formed by electroplating.

In the above configuration, in which the insulating cover layer is formed by plating, only an adaptation of the applied electric voltage during galvanization allows uniform formation of a thick insulating cover layer of, for example, 20 μm to 30 μm times. With respect to the formation of the insulating cover layer by dip coating, a single dip coating may form a layer of at most 2 μm to 3 μm thick, and therefore, dip coating for forming a 20 μm to 30 μm thick insulating cover layer such as the above insulating cover layer around the outer peripheral surface of the wire assembly must be approximately be repeated ten times. In the case where the insulating cover layer is formed by spirally winding an insulating tape made of a polyimide tape or the like (tape winding) in a spiral manner, it is difficult to provide a uniform insulating property on the outer circumferential surface of the wire assembly.

Between The conductor wires and the adhesive layer can be an insulating Thin film can be provided.

at The above configuration is the insulating thin film and the adhesive layer, both of which have the insulating property, layered in turn on each conductor wire. Thus, the Insulating property of the conductor wires to be improved and the insulating thin film as the underlying Film can serve the adhesive layer, the adhesion can be improve the adhesive layer on the conductor wires.

Of the Insulating thin film can be formed by galvanizing become.

at the above configuration in which the insulating thin film is formed by electroplating, allows for galvanizing only the adaptation of the applied electrical voltage a uniform Formation of a thin insulating thin film of for example, 0.5 microns to 1.5 microns, causing a decrease the conductor space factor of the conductor wires is prevented. In contrast, when the insulating cover layer by dip coating is formed, the film thickness is 2 microns to 3 microns, whereby the conductor space factors of the conductor wires and the Ladder arrangement are lowered.

The Conductor wires can be integrated in an untwisted way become.

at the above configuration in which the conductor wires not twisted, can the formation of dead space and the occurrence an eddy current in the conductor arrangement can be prevented.

One Method for producing a conductor arrangement according to present invention is a method for manufacturing a conductor arrangement, in which several conductor wires are integrated, each one the conductor wires have a cross section of one of parts, into which an entire cross-section of the conductor arrangement is divided. The method includes a wire formation forming step of Forming - by forming an adhesive layer by applying an insulating adhesive on the plurality of conductor wires - a wire assembly, in which the conductor wires integrated by the adhesive layer and a step of forming an insulating cover layer for forming an insulating cover layer around those in the wire assembly forming step Cover formed wire assembly.

at The above method isolates the adhesive layer formed was to the conductor wires in the wire assembly forming step to stick together, the conductor wires from each other, with the result that the ladder space factor of the ladder arrangement compared with the case because both an insulating layer and an adhesive layer are present between the conductor wires are raised can. Further, in the step of forming the insulating Cover layer formed insulating cover the entirety Insulate the wire assembly of the conductor wires to the insulating property between the conductor arrangements. It is stated that in general conductor arrangements electrical current in conductor wires flows in the longitudinal direction and accordingly the Isolation property between the conductor assemblies a larger one Importance is attributed as the isolating property between the Conductor wires. Thus, in the conductor arrangement, the insulating property be respected and the ladder space factor can be as much as possible be raised.

Of the Cross section of each of the conductor wires may be rectangular, and the adhesive may be in the wire assembly forming step applied to side surfaces of conductor wires while in the wire assembly the insulating cover layer by electroplating in the step forming the insulating cover layer can.

There according to the above method, the adhesive layer not on the outer peripheral surface of the wire assembly is formed, in which the conductor wires are integrated, the conductive surface is the outer peripheral surface the wire assembly free. Accordingly, the insulating Covering layer by electroplating around the outer peripheral surface the wire assembly are formed.

There Further, the insulating cover layer formed by electroplating is, allows for galvanizing only an adjustment the applied electrical voltage is a uniform Formation of a thick insulating cover layer of, for example 20 μm to 30 μm at once. In terms of the formation of the insulating cover layer by dip coating For example, a single immersion coating can be a maximum of 2 μm to 3 microns thick layer, and therefore must the dip coating for forming a 20 μm to 30 μm thick insulating Cover layer as the above insulating cover layer the outer peripheral surface of the wire assembly about be repeated ten times. In the case where the insulating cover layer by spirally winding an insulating tape from one Polyimide tape or the like (tape winding) in a spiral Is formed, it is difficult to get a uniform Insulating property on the outer peripheral surface of the To provide wire arrangement.

Further is in the wire assembly, in which the conductor wires integrated are, after bending a length difference between theirs Outside peripheral part and its inner peripheral part produces what makes it difficult to restore the wire arrangement. are the conductor wires once integrated, must therefore the insulating cover layer formed without bending the wire assembly become. However, plating can change the film thickness by just fitting control the applied voltage and can at once form a thick film, thereby resulting in effective exhaustion the advantages of the present invention leads. To dip by dip coating the insulating cover layer without bending the wire assembly to Forming, dipping and drying must be repeated many times which leads to an extremely long production line.

at the wire assembly forming step, the adhesive layer by thermal curing of the adhesive are formed, and in the step of forming the insulating cover layer the thermally cured adhesive layer during heat treatment the insulating cover layer hold a shape of the wire assembly.

If according to the above method, for example a thermosetting adhesive with a high Tg (Glass transition temperature) on the conductor wires can be applied in the wire assembly forming step the adhesive layer, which can hold the shape of the wire assembly, in the step of forming the insulating cover layer is practical be formed without detachment.

Around The above object is further achieved in the present Invention an outer peripheral cover layer for covering and Isolating a wire assembly with a cylindrical body formed with the surface of the wire assembly through Inherent elasticity is in close contact.

in the Individual comprises another invention according to the invention Conductor assembly a wire assembly in which several conductor wires are integrated, wherein each of the conductor wires has a cross section having one of parts into which an entire cross-section of the conductor arrangement is divided, and an outer peripheral covering layer for covering and insulating the wire assembly, wherein the outer peripheral cover layer formed by a cylindrical body that passes through Inherent elasticity in close contact with a surface the wire assembly is.

There in the above configuration, the cylindrical outer peripheral cover layer with the surface of the wire assembly by inherent elasticity is in close contact, spreading of the outer peripheral cover layer be prevented to the outside. This can be the thickness of the Outer periphery cover layer, which is the entirety of the conductor arrangement isolated, reduce, with the result that the insulating property the conductor arrangement can be maintained and the ladder space factor can be raised as much as possible. If continue the conductor arrangement is arranged in a slot of a stator core is between the surface of the conductor assembly and the inner wall of the slot (and between the surfaces of adjacent Conductor arrangements in which multiple conductor arrangements in one single slot) are formed. Thus, the space factor the wires in the slot as far as possible be raised.

Of the cylindrical body can be made with a resin heat shrunk tube are formed.

at the above configuration isolates the thermally shrunk, made of resin hose, the cylindrical body forms, the wire arrangement, d. H. the whole of the ladder arrangement, what to practice the advantages of the present invention leads.

Of the Hose can be made of fluororesin.

There Fluororesin is a material with a generally low coefficient of friction is, in the above configuration, the surface can the conductor arrangement have a favorable sliding property. Even when the conductor arrangement in setting the conductor arrangement in a Slot of the stator core in contact with a corner of a stator core comes, the conductor assembly slides accordingly easily away from the corner of the stator core, causing damage the conductor arrangement is prevented.

Of the Cross section of each of the conductor wires may be rectangular.

at the above configuration in which the cross section of each of Conductor wires is rectangular, the conductor wires easily in the width direction and the height direction be arranged by the sides of the conductor wires together be brought to the concern, whereby the conductor space factor of the conductor arrangement is raised.

Everyone the conductor wires can with a welding layer for welding the conductor wires together be covered.

at the above configuration, wherein the plurality of conductor wires integrated by the intervening welding layer are, the wire arrangement forming the conductor arrangement can be practical be formed.

The Conductor wires can be integrated in an untwisted way become.

at the above configuration in which the conductor wires are arranged in a non-twisted manner, the formation of dead space and the occurrence of an eddy current in the conductor arrangement be prevented.

One Another method for producing a conductor arrangement is a Method for producing a conductor arrangement comprising a wire arrangement, in which several conductor wires are integrated, each one the conductor wires have a cross section of one of parts, into which an entire cross-section of the conductor arrangement is divided, and an outer peripheral cover layer for covering and insulating the wire assembly comprises. The method comprises an insertion step inserting the wire assembly in a heat shrinkable Tube to form an introducer, and a heating step of heating in the Insertion step formed Einführköpers, to thermally shrink the tube, whereby the outer peripheral cover layer in close contact with a surface of the wire assembly is formed.

at In the above method, the wire assembly is in the insertion step introduced into the heat-shrinkable tube and becomes in the heating step for thermal shrinkage the hose outside the insertion body This brings about the inherent elasticity the outer peripheral cover layer formed with the heat-shrinkable tube in close contact with the surface of the wire assembly, whereby spreading of the outer peripheral covering layer after be prevented outside. The thickness of the outer peripheral cover layer, which isolates the entirety of the conductor arrangement can accordingly be reduced become. Thus, in the conductor arrangement, the insulating property be respected and the ladder space factor can be as much as possible be raised. If furthermore the conductor arrangement in a slot a stator core is placed between the surface the conductor assembly and the inner wall of the slot (and between the surfaces of adjacent conductor arrangements, in which several conductor arrangements are arranged in a single slot) less dead space formed. This can be the space factor of the wires in the slot as far as possible.

Everyone the conductor wires of the wire assembly can with a weld layer for welding the conductor wires together may be covered, and in the heating step, the weld layer be re-welded to the outer peripheral cover layer to be in close contact.

There in the above method, each of the conductors forming the conductor assembly conductive wires covered with the weld layer is the surface of the wire assembly into which the integrated with several conductive wires, with the welding layer covered. Accordingly, the weld layer becomes on the surface of the wire assembly during thermal shrinkage the hose outside the insertion body by heating the insertion body rewelded to the heating step. This Can the close contact between the inner wall of the hose, the forming the outer peripheral covering layer, and the surface increase the wire arrangement.

To the Realizing the above object is also in the present Invention, a second insulating film, which in the outer periphery a conductor arrangement arranged second conductor wires covered, thicker than a first insulating film, that in the conductor assembly covered arranged first conductor wires.

in the Individual is a still different invention Conductor assembly a wire assembly in which several conductor wires are integrated, wherein each of the conductor wires has a cross section having one of parts into which an entire cross-section of the conductor arrangement is divided, wherein the plurality of conductor wires more inside arranged first conductor wires and a plurality of such arranged second conductor wires comprise a circumference of the cover several first conductor wires, each of the first Conductor wires is covered with a first insulating film and each of the second conductor wires with a second insulating film is covered, which is thicker than the first insulating film.

There in the above configuration, in which the relatively thin first insulating film between the first conductor wires in the conductor arrangement is provided, the ratio, that is the insulating part in the cross section of the conductor arrangement can be reduced to the conductor space factor of the conductor arrangement to raise. Because of that, between the second conductor wires provided relatively thick second Insulating film is arranged in the peripheral wall of the conductor arrangement, can maintain the insulating property between the conductor assemblies become. It is stated that in general conductor arrangements electric current in conductor wires in the longitudinal direction thereof flows, and accordingly the insulating property becomes greater importance between the conductor arrangements given as the insulating property between the conductor wires. Consequently can be the internal configuration of the conductor assembly, in which the first Conductor wires are arranged, raise the ladder space factor, and the outer peripheral configuration of the conductor assembly, in which the second conductor wires are arranged, the True isolating property. As a result, in the conductor arrangement the Isolation property can be maintained and the ladder space factor can be raised as much as possible.

The first insulating layer may be a binder for bonding the first Be conductor wires together.

at In the above configuration, the first insulating film is made a binding material, and accordingly, the binding material for bonding the first conductor wires to each other, the insulating property the first conductor wires true. This can be the ladder space factor the conductor arrangement compared to the case where an insulating film, a bonding material and an insulating film between the first conductor wires to True, the insulating property of the first conductor wires layered are, lift.

Of the first insulating film may be an insulating thin film for Cover and isolate each of the first conductor wires and a binding material for bonding with the insulating thin film covered first conductor wires together.

at the above configuration in which the insulating thin film and the binding material in turn on the conductor wires layered, the insulating property of the conductor wires be improved, and the insulating thin film, as can serve the underlying film of the binding material, the Binding force of the binding material with respect to the conductor wires improve.

Of the Insulating thin film can be formed by galvanizing become.

at the above configuration in which the insulating thin film formed by electroplating, allows only customization the applied electrical voltage in the galvanizing a uniform training of a thin insulating thin film of, for example, 0.5 μm up to 1.5 μm. This can increase the ladder space factor prevent the wire assembly, which by forming the insulating Thin film is caused.

Of the second insulating film may be an insulating thick film for covering and isolating each of the second conductor wires and a Tying material for bonding the one covered with the insulating thick film comprise second conductor wires together.

There in the above configuration, the insulating thick film and the binding material in turn on the second conductor wires layered, the insulating property of the second conductor wires be improved.

Of the Insulating thick film can be formed by electroplating.

There in the above configuration, the insulating thick film through Galvanizing is formed, allows only an adjustment the applied electrical voltage in the galvanizing a uniform formation of a thick insulating Thick film of, for example, about 10 μm to 20 μm at once, thereby preserving the insulating property of the conductor assembly becomes.

One Cross section of each of the second conductor wires may be smaller as a cross section of each of the first conductor wires.

There in the above configuration, the cross-sectional area the second conductor wires smaller than the first conductor wires is the ratio that the second insulating film to the Preserving the insulating property of the conductor arrangement, low in the cross section of the conductor arrangement, whereby the conductor space factor the ladder assembly is raised.

One Cross section of each of the first conductor wires may be smaller as a cross section of each of the second conductor wires.

There in the above configuration, the cross-sectional area the first conductor wires smaller than the second conductor wires is the area of the conductive part that is the first one Conductor wires form, in the conductor arrangement large. Even in an environment where electricity is flowing through the Skin effect to focus on the surface of the conductive part maintains, the electrical current can flow with low loss.

The Conductor wires can be arranged so that interfaces between the first conductor wires not with interfaces coincide between the second conductor wires.

There in the above configuration, the interfaces between the first conductor wires not with the interfaces can coincide between the second conductor wires a peeling of the conductor wires when bending the conductor arrangement compared with the case, because the interfaces between the first conductor wires with the interfaces between the second conductor wires coincide, be prevented.

Of the Cross section of each of the conductor wires may be rectangular.

There in the above configuration, the cross section of each of the conductor wires rectangular, the conductor wires can easily arranged in the width direction and the height direction by connecting the sides of the conductor wires together Concerns are brought, whereby the conductor space factor of the conductor arrangement is raised.

The Conductor wires can be integrated in an untwisted way become.

at the above configuration in which the conductor wires not twisted, can the formation of dead space and the occurrence an eddy current in the conductor arrangement can be prevented.

At The first conductor wires may have a relatively high electrical Voltage applied while on the second conductor wires a relatively low electrical voltage can be applied.

at the above configuration is applied to the first conductor wires, which form the interior of the conductor arrangement, a relatively high electrical Voltage applied, and to the second conductor wires, the form the peripheral wall of the conductor assembly is a relatively small applied electrical voltage. This can be the potential difference between the conductor arrangement and, for example, a slot of a Stator core, which accommodates the conductor assembly, reduce with that Result that electrical performance and reliability the conductor arrangement can be improved.

Advantages of the invention

According to the invention be preserved in the conductor arrangement, the insulating property and the ladder space factor can be raised as much as possible become.

Brief description of the drawings

1 is a perspective view of a conductor arrangement 10a according to the embodiment 1.

2 is a cross-sectional view of conductor wires 1 ( 1a to 1e ), which is the conductor arrangement 10a form.

3 shows a schematic configuration of a conductor assembly manufacturing apparatus 40 for producing the conductor arrangement 10a ,

4 is a schematic view of a coating apparatus 31 (roll coater 31a ) containing the conductor assembly manufacturing apparatus 40 forms.

5 is a schematic view of a coating apparatus 31 (impregnated felts 31b ) containing the conductor assembly manufacturing apparatus 40 forms.

6 is a schematic view of a coating apparatus 31 (Sprühstrahle 31c ) containing the conductor assembly manufacturing apparatus 40 forms.

7 is a cross-sectional view of the conductor wire 1a on which an adhesive 3 is applied.

8th is a perspective view of a conductor arrangement 10b according to embodiment 2.

9 is a perspective view of a conductor arrangement 10c according to embodiment 3.

10 FIG. 12 is a cross-sectional view showing a state in the conductor assemblies. FIG 10c in slots S of a stator core 120 are arranged.

11 is a perspective view of an insertion body 17 in an insertion step in manufacturing the conductor assembly 10c ,

12 is a perspective view of a conductor arrangement 10d according to embodiment 4.

13 is a perspective view of a conductor arrangement 10e according to embodiment 5.

14 is a perspective view of a conductor arrangement 10f according to embodiment 6.

15 is a perspective view of a conductor arrangement 10g according to embodiment 7.

16 is a perspective view of a conductor arrangement 10h according to embodiment 8.

17 is a cross-sectional view of a conductor arrangement 10f according to embodiment 9.

18 FIG. 12 is a cross-sectional view showing a state in which conventional conductor assemblies. FIG 110 in the slots S of the stator core 120 are arranged.

19 is a perspective view showing the conventional conductor arrangement 110 shows.

20 is a cross-sectional view of a conventional conductor arrangement 110a ,

21 is a cross-sectional view of a conventional conductor arrangement 110b ,

Best method to perform the invention

below become embodiments of the present invention with reference to the accompanying drawings. The present invention is not limited to the following embodiments.

<Embodiment 1>

1 to 7 show a ladder assembly and a method of manufacturing the same according to Embodiment 1 of the present invention.

1 is a perspective view of a conductor arrangement 10a of the present embodiment.

The conductor arrangement 10a includes as in 1 shown in its cross section a plurality of conductor wires 1 which are arranged in an untwisted manner in, for example, 6 rows (in the drawing, the horizontal direction) by 3 columns (in the drawing, the vertical direction), one between the conductor wires 1 provided adhesive layer 3a and a thus provided insulating cover layer 4 in that it comprises the entirety of a wire arrangement of the conductor wires 1 covered. Here are the conductor wires 1 adapted to adhere to each other through the adhesive layer formed on their surfaces 3a to be integrated.

Each of the conductor wires 1 has a rectangular cross-section and is formed in a straight line with a material having conductivity, for example, copper, aluminum, silver, iron, gold or an alloy thereof. The cross section of the conductor wire 1 is one of parts in which the entirety of the rectangular cross-section of the conductor arrangement 10a is divided.

The conductor wires 1 each having the rectangular cross section are selected from, for example, a conductor wire 1a with a square cross section, like in 2 (a) shown corners at right angles, a conductor wire 1b with an oblong cross-section, which is like in 2 B) shown corners at right angles, a conductor wire 1c with a substantially square cross section, as in 2 (c) shown rounded corners, a conductor wire 1d with a substantially elongated cross section, as in 2 (d) shown comprises rounded corners, and a conductor wire 1e with a raceway-like cross section having a pair of sides facing each other in parallel and the other pair of bent sides facing each other, as in FIG 2 (d) will be shown.

Also, further, in view of the conductor space factor, the productivity, and the like, the cross-sectional shape of each conductor wire 1 is preferably rectangular, it may be polygonal, for example, triangular, hexagonal and the like. Because here are the conductor wires 1 flat, rectangular wires with a comparatively small area, the surface may be the adhesive layer 3a occupies, be reduced, and the conductor wires 1 can be adapted to different sizes.

The respective conductor wires 1 not necessarily have the same cross-sectional shape along their longitudinal direction and may have analogous shapes that widen or contract in their longitudinal direction.

When the conductor wires 1 further arranged in m rows by n columns (m and n are natural numbers), the length of the longer sides being 1 to 1.5 times (preferably 1 to 1.2 times) the length of the shorter sides is fixed, the ladder space factor can be raised, and an insulated conductor having a large area can be obtained. This may realize a reduction in the size and weight of engines used in electric vehicles, for example, hybrid-powered automobiles.

Regarding the size, each side of the conductor wires 1 for example, be 0.05 mm to 2 mm (preferably 0.05 mm to 1 mm) in size. It is sufficient if the size corresponds to a round wire of 0.03 mm diameter to 2.0 mm diameter. The size also corresponds to a cross-sectional area of 0.0007 mm ² to 4 mm ² .

It is found that the conductor wires 1 the conductor arrangement 10a not necessarily the same shape and a combination of the conductor wires 1a with a square cross section and the conductor wires with a triangular cross section and the like.

The adhesive layer 3a has an electrical insulating property and is formed with a thermosetting adhesive of, for example, an epoxy resin, a polyimide resin, a phenolic resin, an unsaturated polyester resin, a urethane resin, or the like. In particular, in view of heat resistance, it is preferable that the adhesive layer 3a of an epoxy resin or a polyimide resin (adhesive) of a high glass transition temperature (Tg) having a glass transition temperature of, for example, 100 ° C or higher (preferably 150 ° C or higher). The thickness of the adhesive layer 3a may be about 0.5 μm to 5 μm (preferably 1 to 3 μm) on one side of the coated surfaces. The adhesive layer 3a may have an insulating property against an AC of about 5V to 10V.

The insulating cover layer 4 For example, it may be formed by electroplating with an acrylic resin, an epoxy resin, a polyester resin, a urethane resin, a polyimide resin, or the like. Alternatively, it may be formed by dip coating with an amidimide resin, a urethane resin, an esterimide resin, a polyimide resin, or the like. In particular, the formed by electroplating insulating cover layer 4 preferably made of an acrylic resin excellent insulating property, and the formed by dip coating insulating cover layer 4 is preferably made of an amide-imide resin which is a general material of excellent heat resistance. The thickness of the insulating cover layer 4 is about 5 microns to 50 microns (preferably 20 microns to 30 microns), and the insulating cover layer 4 may have an insulating property against an AC of 1 kV or higher (preferably 2 kV or higher).

Several ladder configurations configured in this way 10a For example, they are placed on each other in the slot notches formed in a stator core constituting a motor.

Next, an exemplary method of making the conductor assembly will be described 10a described. Here shows 3 a schematic configuration of a ladder assembly manufacturing apparatus 40 for producing the conductor arrangement 10a , The present embodiment relates to a manufacturing method comprising the conductor wires 1a with a square cross section as the conductor wires 1 used.

The conductor assembly manufacturing apparatus 40 includes as in 3 shown several discharge rollers 30 , several coating devices 31 , a leader 32 , a first form 33a , a second form 33b , a first drying chamber 34 , a galvanizing chamber 35 , a second drying chamber 36 and a cutting device 37 in this order from left to right in the drawing.

The discharge rollers 30 are configured so that they have the conductor wires wound thereon 1a advance to the coating devices 31 transport.

The coating devices 31 become, for example, roller coaters 31a that like in 4 shown the glue 3 from their outer peripheral surfaces, impregnated felting 31b that like in 5 shown the glue 3 deliver from their contact surfaces, spraying 31c that like in 6 shown the glue 3 supply of nozzles, and the like chosen suitably, so that the adhesive 3 on predetermined side surfaces of the conductor wires 1a is applied, which are located inside, when the conductor wires 1a are arranged, namely, three surfaces of the right and left side surface and the lower side surface of a conductor wire 1a , as in 7 (a) is shown, two surfaces of the right side surface and the lower side surface of a conductor wire 1a , as in 7 (b) and four surfaces of the right and left side surfaces and the upper and lower side surfaces of a conductor wire 1a , as in 7 (c) is shown. 4 to 6 show devices for applying the adhesive 3 on the two side surfaces of a conductor wire 1a , For applying the adhesive to three or four of the side surfaces of a conductor wire 1a For example, but can the number of roll coaters 31a that impregnated felts 31b or the spray jet 31a be raised according to the number of surfaces to be coated. In the case where the adhesive on all four sides of a conductor wire 1a is applied, the adhesive can be applied by dip coating.

The leadership 32 leads the conductor wires 2a that of the coating devices 31 be supplied and where the adhesive 3 is applied to the first form 33a ,

The first form 33a and the second form 33b are correction devices, each having a rectangular through-hole, which is an integrated bundle of the conductor wires 1a for correcting a plurality of conductor wires 1a lets go of the leadership 32 be supplied and where the adhesive 3 is applied, to an arrangement which is aligned in the width direction and the height direction by making the side surfaces of the integrated bundle come into contact with the through hole.

The first drying chamber 34 includes a heater (not shown) for drying and thermal curing by heating the adhesive 3 under the arranged conductor wires 1a ,

The plating chamber 35 comprises a galvanizing tank (not shown) for storing, for example, a water-dispersed varnish of an epoxy-modified acrylic resin.

The second drying chamber 36 comprises a heating device for drying and heat treatment by heating an electrodeposited film.

The cutting device 37 includes a cutting machine (not shown) for cutting the conductor wires 10a to a predetermined length.

A method of making the conductor assembly 10a using the conductor thus constructed North-voltage production device 40 will be described next.

After the conductor wires 1a from the diverting rollers 30 to which the conductor wires 2a Wrapped in advance, the adhesive is first applied 3 For example, which is made of an epoxy resin, on the predetermined side surfaces of the conductor wires 1a in the coating devices 31 ( 31a . 31b or 31c ) applied.

Next, pass through the several conductor wires 1a on which the glue is 3 is applied, the leadership role 32 and go into the through hole of the first form 33a and the through hole of the second form 33b , whereby they are arranged to an arrangement.

Further, the integrated bundle of the conductor wires arranged in the arrangement becomes 1a in the first drying chamber 34 for drying and thermal curing of the adhesive 3 under the conductor wires 1a heated, causing the adhesive layer 3a formed and a wire arrangement 5 are formed, in which the conductor wires 1a through the glue 3 (a wire arrangement forming step) are integrated.

Subsequently, for example, an acrylic resin on the side surfaces of the wire assembly 5 in the galvanizing chamber 35 galvanically deposited. Then the wire arrangement 5 on which the acrylic resin was electrodeposited, in the second drying chamber 36 heated to dry and heat treat the film of the acrylic resin, whereby the insulating cover layer 4 (a step of forming an insulating cover layer) is formed.

Finally, the wire assembly 5 (the conductor arrangement 10a ) on which the insulating cover layer 4 is formed by the cutting device 37 cut to a predetermined length.

In this way, the conductor arrangement 10a getting produced.

In the conductor arrangement 10a and the method for producing the same according to the present embodiment as described above, since the wire-array forming step for adhering the conductor wires 1 trained adhesive layer 3a the conductor wires 1 isolated from each other, the conductor space factor of the conductor arrangement 10a as compared with the case where both an insulating layer and an adhesive layer come between the conductor wires, are raised. Further, the insulating cover layer formed in the step of forming the insulating cover layer isolates 4 the entirety of the wire arrangement 5 the lead wires 1 , with the result that the insulating property between the conductor arrangements 10 can be maintained. It is noted that in common conductor arrangements, electric current flows in conductor wires in their longitudinal direction, and hence the insulation property between the conductor arrangements is given greater importance than the insulating property between the conductor wires. Thus, in the conductor arrangement 10a the isolating feature can be maintained and the ladder space factor can be raised as much as possible.

Furthermore, in the conductor arrangement 10a and the method of manufacturing the same according to the present embodiment, the cross section of each of the conductor wires 1 rectangular. Accordingly, the conductor wires 1 be easily arranged in the width direction and the height direction by the sides of the conductor wires 1 be brought to the concern, whereby the conductor space factor of the conductor arrangement 10a is raised.

In the conductor arrangement 10a and the method for producing the same according to the present embodiment, the adhesive layer 3a not on the outer peripheral surface of the wire assembly 5 formed, in which the conductor wires 1 are integrated, and the conductive surface is located as the outer peripheral surface of the wire assembly 5 free. This allows the formation of the insulating cover layer 4 on the outer peripheral surface of the wire assembly 5 by galvanizing. As the insulating cover layer 4 can be formed by electroplating, allows only an adaptation of the voltage applied during electroplating a uniform formation of a thick insulating cover layer 4 from, for example, 20 μm to 30 μm at once.

In addition, in the conductor arrangement 10a and the method of manufacturing the same according to the present embodiment, the conductor wires 1 not twisted, and accordingly, in the conductor arrangement 10a Less dead space can be formed and the occurrence of an eddy current can be prevented.

Furthermore, in the conductor arrangement 10a and the method for producing the same after present embodiment after bending the wire assembly 5 into which the conductor wires 1 are integrated, creates a difference in length between its outer peripheral part and its inner peripheral part, which makes it difficult to wire arrangement 5 restore. For this reason, once the conductor wires 1 Once integrated, the insulating cover layer 4 be formed so that the wire assembly 5 not bent. In plating, however, the film thickness can be controlled only by adjusting the applied electric voltage, and a film can be made thick at once. Here, the advantages of the present invention can be effectively implemented.

Furthermore, in the conductor arrangement 10a and the method of manufacturing the same according to the present embodiment, for example, a high Tg thermosetting material as the adhesive 3 applied in the wire assembly forming step. Thus, the shape of the wire assembly 5 without detaching the conductor wires 1 in the step of forming the insulating cover layer.

The method of making the conductor assembly 10a According to the present embodiment, a method of forming the insulating cover layer utilizes 4 by electroplating, but the insulating cover layer 4 are formed in the present invention by dip coating.

<Embodiment 2>

8th is a perspective view of a conductor arrangement 10b of the present embodiment. In the present embodiment, the same components as in FIG 1 to 7 the same reference numerals are assigned, and a detailed description thereof is omitted.

At the in 8th shown conductor arrangement 10b is between the conductor wires 1 and the adhesive layer 3a an insulating thin film 2 educated. Here is the ladder arrangement 10b be prepared so that in the method described in Example 1 for producing the conductor arrangement 10a an acrylic resin film having a thickness of about 0.5 μm to 1 μm, for example, by electroplating using a mask to form the insulating thin film 2 on predetermined side surfaces of the conductor wires 1 ( 1a ) is formed before the adhesive 3 on the predetermined side surfaces of the conductor wires 1 ( 1a ) is applied.

In the conductor arrangement 10b and the method for manufacturing the same according to the present embodiment, the insulating property can be maintained as in Embodiment 1, and the conductor space factor can be increased as much as possible. Further, the insulating thin film 2 and the adhesive layer 3a , each having an insulating property, in turn on the conductor wires 1 layered, and accordingly, the insulating property of the conductor wires 1 be improved, and the insulating thin film 2 , the underlying film of the adhesive layer 3a can serve, the adhesion of the adhesive layer 3a on the conductor wires 1 improve.

As continue with the conductor arrangement 10b and the method for producing the same according to the present embodiment, the insulating thin film 2 is formed by electroplating, only an adaptation of the applied electrical voltage during galvanizing the insulating thin film 2 of, for example, 0.5 μm to 1.5 μm uniformly and thinly, whereby a decrease in the conductor space factor of the conductor wires 1 is prevented.

<Embodiment 3>

9 to 11 show a ladder assembly and a method of manufacturing the same according to Embodiment 3 of the present invention.

9 is a perspective view of a conductor arrangement 10c of the present embodiment.

The conductor arrangement 10c includes as in 9 shown in a cross section a plurality of conductor wires 13 which are arranged in a non-twisted manner in, for example, 6 rows (the horizontal direction in the drawing) by 3 columns (the vertical direction in the drawing), a welding layer 14 To cover each of the conductor wires 13 is provided, and an outer peripheral cover layer 16 for covering a wire assembly 15 is provided, in which the conductor wires 13 together through the weld layer 14 are integrated. Here are the several conductor wires 13 through the welding layer 14 , which is formed on their respective surfaces, welded and integrated.

Each conductor wire 13 is a conductor element wire 11 with a rectangular cross-section and is formed in a straight line with a conductivity-having material, for example copper, aluminum silver, iron, gold or an alloy thereof. The cross section of each of the conductor wires 13 (the conductor element wires 11 ) is one of parts in which the entirety of the rectangular cross-section of the conductor arrangement 10c is divided.

The conductor wires 13 each having the rectangular cross section, that is, the conductor element wires 11 , are chosen from, for example, a conductor wire 11a with a square cross section, like in 2 (a) shown corners at right angles, a conductor wire 11b with an oblong cross-section, which is like in 2 B) shown corners at right angles, a conductor wire 11c with a substantially square cross section, as in 2 (c) shown rounded corners, a conductor wire 11d with a substantially elongated cross section, as in 2 (d) shown comprises rounded corners, and a conductor wire 11e with a raceway-like cross section having a pair of sides facing each other in parallel and the other pair of bent sides facing each other, as in FIG 2 (d) will be shown. In the 2 (a) to 2 (e) The respective shapes shown may be formed by drawing a mother wire through a die or machined and formed by a machining and molding apparatus such as a rolling machine. Alternatively, an in 2 (e) shown conductor wire having a racetrack-like cross-section formed by rolling a circular mother wire in one direction and formed.

Also, further, in view of the conductor space factor, the productivity, and the like, the sectional shape of each of the conductor element wires 11 is preferably rectangular, it may be polygonal, for example, triangular, hexagonal and the like.

Since here the conductor element wires 11 flat, rectangular wires with a comparatively small area, the surface can be the welding layer 14 takes, be reduced, and the conductor element wires 11 can be adapted to different sizes.

Each conductor element wire 11 not necessarily have the same cross-sectional shape along its longitudinal direction and may have analogous shapes that widen or contract in their longitudinal direction.

When the conductor element wires 11 further arranged in m rows by n columns (m and n are natural numbers), the length of the longer sides being 1 to 1.5 times (preferably 1 to 1.2 times) the length of the shorter sides is fixed, the ladder space factor can be raised, and an insulated conductor having a large area can be obtained. This may realize a reduction in the size and weight of engines used in electric vehicles, for example, hybrid-powered automobiles.

Regarding the size, each side of the conductor element wires 11 for example, be 0.05 mm to 2 mm (preferably 0.05 mm to 1 mm) in size. It is sufficient if the size corresponds to a round wire of 0.03 mm diameter to 2.0 mm diameter. The size also corresponds to a cross-sectional area of 0.0007 mm ² to 4 mm ² .

It is stated that the conductor element wires 11 the conductor arrangement 10c not necessarily have the same shape and a combination of the conductor element wires 1a each having a square cross section and the conductor element wires having a triangular cross section and the like.

The welding layer 14 has an electrical insulation property and is made of a resin having heat sealability, for example, a polyvinyl butyral resin, a polyamide resin, an epoxy resin, a polyester resin, or the like. Here is the weld layer 14 made of such a resin and therefore serves as an insulating layer for insulating the conductor element wires 11 from each other in the conductor arrangement 10c ,

The thickness of the weld layer 14 is about 0.5 microns to 3 microns. Here are the conductor element wires 11 in the conductor arrangement 10c the same potential, and between adjacent conductor element wires 11 hardly any electric current flows. Therefore, the weld layer needs 14 not necessarily on the surface of the conductor element wires 11 be formed uniformly, as long as the conductor element wires 11 in the conductor arrangement 10c can be attached.

The outer peripheral cover layer 16 is with a cylindrical body with an electrical insulation formed by thermal shrinkage of a tube, which consists for example of PTFE (polytetrafluoroethylene) is obtained. Alternatively, the outer peripheral cover layer 16 by thermally shrinking a heat-shrinkable tube made of fluorine resin such as FEP (perfluoroethylene-propylene copolymer), PFA (perfluoroalkoxy-alkane polymer) and the like, a polyolefin resin, a polyvinyl chloride resin, a polyvinylidene fluoride resin, an ethylene-propylene rubber, a silicone rubber , an elastic neoprene or the like, besides PTFE, are formed.

The thickness of the outer peripheral cover layer 16 is about 30 μm to 50 μm, and the outer peripheral cover layer 16 may have an insulating property against an AC of 1 kV or higher (preferably 2 kV or higher).

As in 10 Shown are several so configured conductor arrangements 10c on each other, for example in slots S, in the stator core forming a motor 120 are formed, set. Even if in 10 the stator core 120 having a curved surface shown by converting the curved surface into a flat surface is the stator core 120 formed in a cylindrical shape and has a plurality of grooves (the slots S) and a plurality of burrs 120a alternately circumferentially on the outer peripheral wall or the inner peripheral wall of the stator core 120 are formed.

An example of a method for manufacturing the thus configured conductor arrangement 10c will be described next.

First, a conductor element wire 11 pulled so that it has a square cross-section, in which each side, for example, 0.3 mm long.

Next, for example, an epoxy paint is applied to the surface of the drawn conductor element wire 11 applied by dip coating to the weld layer 14 to form, and then the conductor element wire 11 cut into pieces, each having a length of for example 5 m.

Furthermore, there are several conductor element wires 11 with surfaces on which the welding layer 14 is formed, arranged in an untwisted manner and are heated at a temperature of about 200 ° C for welding and integrating the Verschweißschichten 14 on adjacent conductor element wires 11 subjected, resulting in a wire assembly 15 of for example 1 mm in height, 2 mm in width and 5 m in length is formed.

Subsequently, as in 11 shown the wire arrangement 15 in a heat shrinkable hose 16a For example, of PTFE and with an inner diameter of 3 mm, an outer diameter of 3.1 mm and a length of 5 m, introduced to an introducer 17 (an insertion step).

Finally, the introducer becomes 17 heated to about 330 ° C to 340 ° C to the hose 16a to shrink, whereby the outer peripheral cover layer 16 (Heating step) is formed. The heat shrinkage ratio of the hose 16a (Inner diameter after shrinking / inner diameter before shrinking) is preferably 1 / 1.5 to 1/10, more preferably 1/2 to 1/5.

In this way, the conductor arrangement 10c of the present embodiment.

When Next will be a practical experiment described.

More specifically, conductor arrangements having the same configuration as the conductor arrangement described in the above embodiment have been described 10c were prepared as Experimental Example 1 and Experimental Example 2, and were inserted into a slit S having a width of 1.2 mm, a depth of 4.5 mm and a length of 50 mm. Then, their wire space factor, breakdown voltage characteristic, resistance to damage, workability, flexibility and heat resistance were examined.

In addition, as Experimental Example 3 and Experimental Example 4, conductor patterns were formed by spirally winding band-shaped resin films on wire assemblies ( 15 ), which formed the conductor arrangements of Experimental Example 1 and Experimental Example 2, were produced and inserted into a slot S having a width of 1.2 mm, a depth of 4.5 mm and a length of 50 mm, similarly to FIG Case of Experimental Example 1 and Experimental Example 2. Then, their Wire space factor, breakdown voltage characteristic, resistance to damage, machinability, flexibility and heat resistance tested. Here, the width of the resin films wound on the wire assemblies was 5 mm, and the side end portions of the resin films overlapped by 1 mm.

„o”, „Δ” und „x” besonders gut, allgemein vorteilhaft, etwas schlechter bzw. sehr schlecht.Table 1 below shows the test results of the experimental examples. In Table 1

"O", "Δ" and "x" are particularly good, generally advantageous, slightly worse or very bad.

[Table 1]

In terms of of wire space factor was Experimental Example 1, which describes the heat shrinkable tube with a thickness of 0.038 mm used, advantageous. It is found that the wire space factor is 100% is if only one conductor arrangement (a wire arrangement) without an outer peripheral covering layer that conforms to the shape of the Slot corresponds, is arranged in the slot.

In terms of the breakdown voltage characteristic were all experimental Examples over 1 kV and were beneficial. The breakdown voltage characteristic is a value between a conductor assembly and the slot is measured.

The Resistance to damage was in Experimental Example 1, which was the heat shrinkable Hose made of PTFE used, due to its lubricious Surface advantageous. In the experimental example 2 is the resistance to damage advantageous because it has a thick outer peripheral covering layer having.

In terms of workability (when forming the outer peripheral cover layer) were experimental example 1 and the experimental example 2, which used the heat-shrinkable tube, advantageous.

In terms of flexibility was experimental example 1 and experimental Example 2 using the heat-shrinkable tube advantageous. In experimental example 3 and experimental Example 4, whose outer peripheral cover layer by winding film was formed, film displacement was caused by bending.

In terms of the heat resistance was the experimental one Example 1, showing the heat-shrinkable tube made of PTFE and Experimental Example 3 using a polyimide film used, advantageous.

Thus, it was confirmed that Experimental Example 1 that the heat-shrinkable tube made of PTFE, was advantageous in wire space factor and, in addition, was advantageous in the other aspects such as breakdown voltage, resistance to damage, workability, flexibility and heat resistance.

As described above, in the conductor arrangement 10c and the method of manufacturing the same according to the present embodiment after inserting the wire assembly 15 in the insertion step in the heat-shrinkable tube 16a the hose 16a outside the introducer 17 thermally shrunk by its heating in the heating step, so that the with the thermally shrunk tube 16a formed outer peripheral cover layer 16 by their elasticity in close contact with the surface of the wire assembly 15 stands. Thus, spreading of the outer peripheral cover layer may occur 16 be prevented to the outside. This may be the thickness of the outer peripheral cover layer 16 reduce the totality of the conductor assembly 10c isolated, thereby preserving the insulating property and the ladder space factor in the conductor arrangement 10c is raised as much as possible. If continue the ladder arrangements 10c in the slot S of the stator 120 are arranged between the surfaces of the conductor arrangements 10c and the inner wall of the slot S and between the surfaces of adjacent conductor assemblies 10c less dead space formed. Thus, the wire space factor in the slot S can be increased as much as possible.

As in accordance with the conductor arrangement 10c and the method of manufacturing the same according to the present embodiment, the hose 16a containing the outer perimeter cover layer 16 forms, consists of fluorine resin (PTFE) with a low coefficient of friction, the surface of the conductor assembly 10c glide advantageous. Even if, accordingly, when setting the conductor arrangement 10c in a slot S of the stator core 120 the conductor arrangement 10c with a corner C of the stator core 120 comes into contact, the conductor arrangement 10c from the corner C of the ladder core 120 slide away, causing damage to the conductor assembly 10c is prevented.

As continue with the conductor arrangement 10c and the method of manufacturing the same according to the present embodiment, the hose 16a containing the outer perimeter cover layer 16 formed of fluorine resin (PTFE) is excellent in electrical insulating property, the surface of the conductor assembly 10c a favorable insulating property. Thus, the insulating property between the conductor assembly 10c and the bridge parts J of the ridges 120a of the stator core 120 be granted.

In the conductor arrangement 10c and the method of manufacturing the same according to the present embodiment, the cross section of each of the conductor wires 13 (the conductor element wires 11 ) rectangular. Accordingly, the conductor wires 13 (the conductor element wires 11 ) can be easily arranged in the width direction and the height direction by the sides of the conductor wires 13 (the conductor element wires 11 ) are brought into contact with each other, with the result that the conductor space factor of the conductor arrangement 10c can be raised.

As continue with the conductor arrangement 10c and the method of manufacturing the same according to the present embodiment, the conductor wires 13 (the conductor element wires 11 ) are arranged in an untwisted manner, the formation of dead space and the occurrence of an eddy current in the conductor arrangement 10c be prevented.

In the conductor arrangement 10c and the method of manufacturing the same according to the present embodiment, each of the conductor wires 13 (the conductor element wires 11 ), which is the wire arrangement 15 form, with the welding layer 14 covered, and therefore also the surface of the wire assembly 15 , into the several conductor wires 13 (the conductor element wires 11 ) are integrated with the welding layer 14 covered. Accordingly, the weld layer becomes 14 on the surface of the wire assembly 15 during heating of the introducer 17 in the heating step for thermally shrinking the hose 16a outside the introducer 17 re-welded, resulting in close contact between the inner wall of the hose 16a that the outer peripheral cover layer 16 forms, and the surface of the wire assembly 15 is enlarged.

Furthermore, according to the conductor arrangement 10c and the method of manufacturing the same according to the present embodiment, a product configuration satisfying electrical characteristics and having a high space factor can be obtained. Accordingly, a high-performance motor can be manufactured.

In the conductor arrangement 10c and the method of manufacturing the same according to the present embodiment, the outer peripheral cover layer 16 with the heat-shrinkable hose 16a educated. Even with a change in the shape of the wire assembly 15 that the ladder arrangement 10c forms, therefore, the hose can 16a the shape of the wire arrangement 15 follow and reliable with the wire arrangement 15 be in close contact. Thus, stable productivity can be maintained.

According to the conductor arrangement 10c and the method of manufacturing the same according to the present embodiment, only the insertion of the wire assembly 15 in the heat-shrinkable tube 16a and heating the introducer 17 the outer peripheral cover layer 16 form. This can remarkably reduce the processing cost as compared with the conventional insulating method by winding a band-shaped resin film, resulting in a lowering of the manufacturing cost.

<Embodiment 4>

12 is a perspective view of a conductor arrangement 10d according to the present embodiment. In the present embodiment, the same components as in FIG 2 and 9 to 11 the same reference numerals assigned, and their detailed description is omitted.

At the in 12 shown conductor arrangement 10d include the conductor wires 13 each the conductor element wire 11 and an element wire cover layer 12 provided therearound and having an insulating property.

Examples of the material of the element wire cover layer 12 For example, when formed by dip coating, polyamideimide resins, polyesterimide resins, polyester resins, urethane resins, acrylic resins, epoxy resins, polyimide resins, polyvinyl formal resins and the like, and when formed by electroplating include acrylic resins, polyester resins, polyimide resins, epoxy resins, urethane resins, and the like. In particular, in the case where heat resistance should be considered, the material is preferably selected from polyimide resins, polyamide-imide resins and the like. In the case where a connection should be considered by soldering, furthermore, urethane resin which easily decomposes thermally is preferable. Further, in the case that a following ability of deformation such as bending or the like should be taken into consideration, the material is preferably selected from acrylic resins. In addition, the element wire cover layer 12 an oxide film formed by oxidizing the surface of the conductor element wire 11 is obtained.

The film thickness of the element wire cover layer 12 is about 1 μm to 5 μm (preferably 1 μm to 3 μm) when formed by plating and is about 1 μm to 10 μm when formed by dip coating. Electroplating can produce a uniform thin film of about 1 μm on the surface of the conductor element wire 11 form. This may be the cross-sectional area of the element wire cover layer 12 can reduce and reduce the conductor space factor of the conductor wires 13 Lift. When formed by electroplating, further, the formation of the element wire cover layer 12 be ensured, even at the corners of the conductor element wire 11 , Specifically, the element wire cover layer becomes 12 designed so that the thickness of the element wire cover layer 12 at the end parts in the width direction of the conductor element wire 11 the same as that of the element wire cover layer 12 at the middle part in the width direction of the conductor element wire 11 is. This may be the insulating property between the conductor element wires 11 the conductor arrangement 10d improve, without the conductor space factor of the conductor arrangement 10d to lower.

Here is the ladder arrangement 10d are manufactured in such a way that in the method for producing the conductor arrangement described in the embodiment 3 10c the element wire cover layer 12 on the surfaces of the conductor element wires 11 by forming an acrylic resin film having a thickness of about 0.5 μm to 1 μm by, for example, plating or the like before the sealing layer 14 on the surfaces of the conductor element wires 11 is formed.

According to the conductor arrangement 10d and the method for producing the same according to the present embodiment, the insulating property can be maintained as in Embodiment 3, and the conductor space factor can be used in the conductor arrangement 10d be raised as much as possible. The wire space factor in the slot S can also be increased as much as possible. Furthermore, since the element wire cover layer 12 and the weld layer 14 , each having an insulating property, in turn on the conductor element wires 11 layered, the insulating property of the conductor element wires 11 be improved.

<Embodiment 5>

13 is a perspective view of the conductor arrangement 10e according to the present Ausfüh approximately, for example.

The conductor arrangement 10e includes as in 13 shown in a cross section a plurality of first conductor wires 21 which are arranged in an untwisted manner in, for example, 5 rows (the horizontal direction in the drawing) by 2 columns (the vertical direction in the drawing), a binding material 22 that between the first conductor wires 21 is provided, a plurality of second conductor wires 23 which are arranged in an untwisted manner so that they have a wire arrangement of the first conductor wires 21 , which are arranged in 5 rows by 2 columns, surround a thus provided insulating thick film 24 that he has every second conductor wire 23 covered, and a binding material 25 that between the second conductor wires 23 is provided with the insulating thick film 24 are covered. Here are the first conductor wires 21 through the binding material 22 connected to each other, which is formed on the surfaces thereof. Further, the second conductor wires 23 through the binding material 25 connected to each other on the insulating thick film 24 formed on the surfaces thereof, and are connected to the wire assembly of the first conductor wires 21 connected in 5 rows by 2 columns, whereby they are integrated.

Each of the first conductor wires 21 and the second conductor wires 23 has a rectangular cross-section and is formed in a rectilinear shape with a material having conductivity, for example, copper, aluminum, silver, iron, gold or an alloy thereof. Each cross section of the first conductor wires 21 and the second conductor wires 23 forms one of parts, in which the entirety of the rectangular cross-section of the conductor arrangement 10e is divided.

The first conductor wires 21 (and the second conductor wires 23 ) having the rectangular cross section are selected, for example, from a conductor wire 21a with a square cross section, like in 2 (a) shown having corners at right angles, a conductor wire 21b with an oblong cross-section, which is like in 2 B) shown corners at right angles, a conductor wire 21c with a substantially square cross section, as in 2 (c) shown rounded corners, a conductor wire 21d with a substantially elongated cross section, as in 2 (d) shown comprises rounded corners, and a conductor wire 21e with a raceway-like cross section having a pair of sides facing each other in parallel and the other pair of bent sides facing each other, as in FIG 2 (d) will be shown.

Even if the cross-sectional shapes of the first conductor wires 21 and the second conductor wires 23 preferably, in terms of conductor space factor, productivity and the like, may be polygonal, such as triangular, hexagonal and the like.

The first conductor wires 21 and the second conductor wires 23 not necessarily have the same cross-sectional shape along their longitudinal direction and may have analogous shapes that widen or contract in their longitudinal direction.

When the first conductor wires 21 and the second conductor wires 23 further arranged in m rows by n columns (m and n are natural numbers), the length of the longer sides being 1 to 1.5 times (preferably 1 to 1.2 times) the length of the shorter sides is fixed, the ladder space factor can be raised, and an insulated conductor having a large area can be obtained. This may realize a reduction in the size and weight of engines used in electric vehicles, for example, hybrid-powered automobiles.

Regarding the size, each side of the first conductor wires 21 and the second conductor wires 23 for example, 0.003 to 2 mm (preferably 0.05 mm to 1 mm) in size. It is sufficient if the size corresponds to a round wire of 0.03 mm diameter to 2.3 mm diameter. The size also corresponds to a cross-sectional area of 0.0007 mm ² to 4 mm ² .

It is found that each of the first conductor wires 21 and the second conductor wires 23 the conductor arrangement 10e not necessarily the same shape and a combination of the conductor wires 21a with a square cross section and the conductor wires with a triangular cross section and the like can be.

Examples of the material of the binding materials 22 and 25 For example, as heat-adhesive adhesives, resins such as polyamide resins, polyvinyl butyral resins, epoxy resins, polyester resins and the like, and alcohol-meltable resins such as polyamide resins and the like modified to be alcohol-soluble, include epoxy resins, polyimide resins as adhesives ze, phenolic resins, polyester resins, urethane resins and the like. It is stated that the binding materials 22 and 25 are made of a resin having an insulating property as above, and accordingly, the insulating property between the first conductor wires 21 and the second conductor wires 23 the conductor arrangement 10e can be improved.

The thickness of the binding materials 22 and 25 is 0.5 μm to 5 μm (preferably 1 μm to 3 μm). The above welding agent is applied by dip coating or the like. Alternatively, the above adhesive is applied by roll coaters 31a that remove the glue from its outer peripheral walls (see 4 ), impregnated felts 31b that remove the adhesive from their contact surfaces (see 5 ), spraying 31c that the glue from nozzles (see 6 ), or the like. Here are the binding materials 22 and 25 not necessarily evenly on the surfaces of the first conductor wires 21 and the second conductor wires 23 be formed with the insulating thick film 24 are covered, as long as the first conductor wires 21 and the second conductor wires 23 in the conductor arrangement 10e can be attached. For example, the binding materials 22 and 25 partially in a punctiform or striped manner on the surfaces of the first conductor wires 21 and the surfaces of the second conductor wires 23 be formed with the insulating thick film 24 are covered. In this case, see the between the first conductor wires 21 and between the second conductor wires 23 formed spaces an insulation between the first conductor wires 21 or between the second conductor wires 23 in front. Furthermore, the first conductor wires receive 21 that the ladder arrangement 10e form the same potential, and accordingly, electric current hardly flows between the first conductor wires 21 , Therefore, according to the use of the conductor arrangement 10e the insulating property between the first conductor wires 21 be low.

The insulating thick film 24 is formed by, for example, plating with an acrylic resin, an epoxy resin, a polyester resin, a urethane resin, a polyamide resin or the like. Alternatively, it is formed by dip coating with an amidimide resin, a urethane resin, an esterimide resin, a polyimide resin or the like. In particular, the insulating thick film formed by electroplating is 24 preferably made of an acrylic resin excellent insulating property, and the formed by dip coating insulating thick film 24 is preferably made of an amide-imide resin which is a general material of excellent heat resistance. The thickness of the insulating thick film 24 is about 5 μm to 30 μm (preferably 10 μm to 20 μm), and the insulating thick film 24 may have an insulating property against an AC of 1 kV or higher (preferably 2 kV or higher).

Several ladder configurations configured in this way 10e For example, they are placed on each other in slot notches formed in a stator core constituting a motor.

Next, an example of a method of manufacturing the thus configured conductor assembly 10e described.

First, for example, copper wires are drawn around the first conductor wire 21 for example, with a square cross section where each side is, for example, 0.30 mm long, and the second conductor wire 23 with a square cross-section where each side is 0.27 mm long.

Next, for example, an epoxy paint is applied to the surface of the generated first conductor wire 21 applied by dip coating to a thickness of about 2 microns to the binding material 22 to form, and then becomes the first conductor wire 21 cut into pieces, each having a length of for example 5 m.

Subsequently, for example, an acrylic varnish having a thickness of about 15 μm is formed on the surface of the generated second conductor wire 23 applied by electroplating to the insulating thick film 24 to build. After application by dip coating, for example, an epoxy paint having a thickness of about 2 μm as a welding agent on the surface of the second conductor wire 23 on which the insulating thick film 24 is formed to the binding material 25 continues to form the second conductor wire 23 cut into pieces, each having a length of for example 5 m.

After that, as in 13 shown ten first conductor wires 21 on whose surface the binding material 22 is formed, arranged in an untwisted manner in 5 rows by 2 columns, and then 18 second conductor wires 23 on whose surface the binding material 25 with the insulating thick film set in between 24 is formed, arranged in an untwisted manner around the configured wire assembly. Then, heating at a temperature of about 200 ° C is performed to bind the binding materials 22 on the first conductor wires 21 and the binding material 25 on the second conductor wires 23 that are adjacent to each other, to be welded together and integrated.

In this way, the conductor arrangement 10e of the present embodiment.

As described above in the ladder arrangement 10e of the present embodiment, the binding material 22 as a relatively thin first insulating film between the first conductor wires 21 in the conductor arrangement 10e is provided, the ratio that the insulating part in the cross section of the conductor assembly 10e decreases, to the conductor space factor of the conductor arrangement 10e to raise. Furthermore, the insulating thick film 24 and the binding material 25 as a relatively thick second insulating film between the second conductor wires 23 in the peripheral wall of the conductor arrangement 10e are provided, the insulating property between the conductor assemblies 10e be granted. It is noted that in common conductor arrangements, electric current flows in conductor wires in their longitudinal direction, and hence the insulation property between the conductor arrangements is given greater importance than the insulating property between the conductor wires. Thus, the internal configuration of the conductor arrangement 10e in which the first conductor wires 21 are arranged to raise the ladder space factor, and the outer circumference configuration of the ladder arrangement 10e in which the second conductor wires 23 ordered, can preserve the insulating property. Thus, in the conductor arrangement 10e the insulating property can be maintained, and the ladder space factor can be raised as much as possible.

Further, according to the ladder arrangement 10e of the present embodiment, the binding material 22 for binding the first conductor wires 21 to each other, the insulating property of the first conductor wires 21 , Thus, the conductor space factor of the conductor arrangement can be compared with the case where, for example, the insulating property of the first conductor wires 21 by laminating an insulating film, a binding material and an insulating film between the first conductor wires 21 is raised.

In the conductor arrangement 10e of the present embodiment are the insulating thick film 24 and the binding material 25 in turn on the second conductor wires 23 layered. This can be the insulating property of the second conductor wires 23 improve.

Furthermore, the conductor arrangement comprises 10e of the present embodiment, the insulating thick film 24 formed by plating, and accordingly, only an adjustment of the applied electric voltage in plating enables uniform formation of a thick insulating thick film of, for example, 10 μm to 20 μm at a time, thereby improving the insulating property of the conductor arrangement 10e is respected.

As with the conductor arrangement 10e of the present embodiment, the first conductor wires 21 and the second conductor wires 23 have rectangular cross sections, the first conductor wires 21 and the second conductor wires 23 can be easily arranged in the width direction and the height direction by the sides of the first conductor wires 21 and the second conductor wires 23 be brought to the concern, whereby the conductor space factor of the conductor arrangement 10e is raised.

In addition, the first conductor wires 21 and the second conductor wires 23 the conductor arrangement 10e not twisted in the present embodiment. This can be the formation of dead space and the appearance of an eddy current in the conductor assembly 10e prevention.

Furthermore, the conductor arrangement 10e of the present embodiment may be designed such that the first conductor wires 21 a relatively high electrical voltage is supplied and the second conductor wires 23 a relatively low electrical voltage is supplied. This can be the potential difference between the conductor arrangements 10e and, for example, slots of a stator core containing the conductor assemblies 10e absorb, with the result that the electrical performance and reliability of the conductor assemblies can be improved.

<Embodiment 6>

14 is a perspective view of a conductor arrangement 10f according to the present embodiment. In the present embodiment, the same components as in FIG 13 the same reference numerals are assigned, and a detailed description thereof is omitted.

The conductor arrangement 10f includes as in 14 shown in a cross section a plurality of first conductor wires 21 which are arranged in an untwisted manner in, for example, 6 rows (the horizontal direction in the drawing) by 3 columns (the vertical direction in the drawing), a binding material 22 that between the first conductor wires 21 is provided, a plurality of second conductor wires 23 which are provided in an untwisted manner so as to provide a wire arrangement of the first conductor wires 21 , which are arranged in 6 rows by 2 columns, surround a thus provided insulating thick film 24 that he has every second conductor wire 23 covered, and a binding material 25 that between the second conductor wires 23 is provided with the insulating thick film 24 are covered.

The cross section of each of the first conductor wires 21 is square in shape, with each side being about 0.30 mm long, for example. The cross section of each of the second conductor wires 23 is square in shape, with each side being about 0.10 mm long, for example. Accordingly, the cross-sectional area of each second conductor wire 23 smaller than that of each first conductor wire 21 , as in 14 is shown.

The thus configured conductor arrangement 10f can be made by changing the size and number of the respective arranged conductor wires in the embodiment 5, and therefore, a detailed description of the manufacturing method will be omitted.

In the conductor arrangement 10f of the present embodiment is the cross-sectional area of each second conductor wire 23 smaller than that of each first conductor wire 21 , In addition to the advantages obtained in Embodiment 5, accordingly, the ratio of the second insulating film (the thick insulating film 24 and the binding material 25 ), to preserve the insulating property of the conductor assembly 10f contributes, in the cross section of the conductor arrangement 10f can be reduced, which leads to an increase in the conductor space factor of the conductor arrangement.

<Embodiment 7>

15 is a perspective view of a conductor arrangement 10g of the present embodiment.

The conductor arrangement 10g includes as in 15 shown in a cross section a plurality of first conductor wires 21 which are arranged in an untwisted manner in, for example, 10 rows (the horizontal direction in the drawing) by 5 columns (the vertical direction in the drawing), a binding material 22 that between the first conductor wires 21 is provided, a plurality of second conductor wires 23 which are provided in an untwisted manner so as to provide a wire arrangement of the first conductor wires 21 , which are arranged in 10 rows by 5 columns, surround a thus provided insulating thick film 24 that he has every second conductor wire 23 covered, and a binding material 25 that between the second conductor wires 23 is provided with the insulating thick film 24 are covered.

The cross section of each of the first conductor wires 21 is of elongate shape, for example about 0.10 mm in length and about 0.15 mm in width. The cross section of each of the second conductor wires 23 is square in shape, with each side being about 0.25 mm long, for example. Accordingly, the cross-sectional area of each first conductor wire 21 smaller than every other conductor wire 23 , as in 15 is shown.

The thus configured conductor arrangement 10g can be made by changing the size and number of the respective arranged conductor wires in the embodiment 5, and therefore, a detailed description of the manufacturing method will be omitted.

In the conductor arrangement 10g of the present embodiment is the cross-sectional area of each first conductor wire 21 smaller than every other conductor wire 23 , In addition to the advantages obtained in Embodiment 5, accordingly, the surface of the conductive part that the first conductor wires 21 form, in the ladder arrangement 10g be enlarged. This can allow electrical current to flow in a low-loss manner, even in a high-frequency environment in which the electric current is due to a skin effect on the surfaces of the first conductor wires 21 to concentrate.

<Embodiment 8>

16 is a perspective view of the conductor arrangement 10h of the present embodiment.

The conductor arrangement 10h includes as in 16 shown in a cross section a plurality of first conductor wires 21 which are arranged in an untwisted manner in, for example, 6 rows (the horizontal direction in the drawing) by 3 columns (the vertical direction in the drawing), a binding material 22 that between the first conductor wires 21 is provided, a plurality of second conductor wires 23 which are provided in an untwisted manner so as to provide a wire arrangement of the first conductor wires 21 , which are arranged in 6 rows by 3 columns, surround a thus provided insulating thick film 24 that he has every second conductor wire 23 covered, and a binding material 25 that between the second conductor wires 23 is provided with the insulating thick film 24 are covered.

The cross section of each of the first conductor wires 21 is square in shape, with each side being about 0.30 mm long, for example. The cross section of each of the second conductor wires 23 is of elongate shape, for example about 0.18 mm to 0.25 mm in length and about 0.33 mm to 0.45 mm in width, so that the bonding interfaces of the first conductor wires 21 not with the bonding interfaces of the second conductor wires 23 coincide.

The thus configured conductor arrangement 10h can be made by changing the size and number of the respective arranged conductor wires in the embodiment 5, and therefore, a detailed description of the manufacturing method will be omitted.

As in accordance with the conductor arrangement 10h of the present embodiment, in addition to the advantages obtained in Embodiment 5, the bonding interfaces of the first conductor wires 21 not with the bonding interfaces of the second conductor wires 23 can coincide, a detachment of the conductor wires 21 and 23 upon bending of the conductor assembly 10h compared with the case where the bonding interfaces of the first conductor wires 21 with the bonding interfaces of the second conductor wires 23 coincide, be prevented.

<Embodiment 9>

17 is a cross-sectional view of the conductor assembly 10i of the present embodiment.

The conductor arrangement 10i includes as in 17 shown in a cross section a plurality of first conductor wires 21 which are arranged in an untwisted manner in, for example, 4 rows (the horizontal direction in the drawing) by 3 columns (the vertical direction in the drawing), an insulating thin film thus provided 26 that he has every first conductor wire 21 covered, a binding material 22 that between the first conductor wires 21 is provided with the insulating thin film 26 are covered, several second conductor wires 23 which are provided in an untwisted manner so as to provide a wire arrangement of the first conductor wires 21 , which are arranged in 4 rows by 3 columns, surround a thus provided insulating thick film 24 that he has every second conductor wire 23 covered, and a binding material 25 that between the second conductor wires 23 is provided with the insulating thick film 24 are covered.

The insulating thin film 26 For example, it can be formed by electroplating with an acrylic resin, an epoxy resin, a polyester resin, a urethane resin, a polyamide resin or the like. Alternatively, it may be formed by dip coating with an amidimide resin, a urethane resin, an esterimide resin, a polyimide resin or the like. Especially when the insulating thin film 26 is formed by electroplating, the material thereof is preferably an acrylic resin of excellent insulating property. Alternatively, if it is prepared by dip coating, the material thereof is preferably an amide-imide resin which is a general material of excellent heat resistance. The thickness of the insulating thin film 26 is preferably about 0.5 μm to 3 μm (preferably 0.5 μm to 1 μm).

Next, an example of a method of manufacturing the thus configured conductor assembly 10i described.

First, for example, copper wires are drawn around the first conductor wire 21 for example, with a square cross section where each side is, for example, 0.30 mm long, and the second conductor wire 23 with a square cross-section where each side is 0.27 mm long.

Next, for example, an acrylic varnish is applied to the surface of the first conductor wire produced 21 applied by plating at a thickness of about 0.75 μm to the insulating thin film 26 to form, and then becomes the first conductor wire 21 cut into pieces, each having a length of for example 5 m.

Subsequently, for example, an acrylic varnish having a thickness of about 15 μm is formed on the surface of the generated second conductor wire 23 applied by electroplating to the insulating thick film 24 to build. Then the second conductor wire 23 cut into pieces, each having a length of for example 5 m.

Further, for example, an epoxy paint having a thickness of about 2 μm by means of, for example, the roll coater 31a in 4 that impregnated felts 31b in 5 , the spray beam 31c in 6 or the like as an adhesive on predetermined respective side surfaces of the first conductor wires 21 on which the insulating thin film 26 is formed, and the second conductor wires 23 on which the insulating thick film 24 is formed, ie on at least one of adjacent side surfaces of the conductor wires ( 21 and 23 ) of the conductor arrangement 10i applied to the binding material 22 and the binding material 25 to build.

After that, as in 17 shown 12 first conductor wires 21 on whose surface the binding material 22 is formed, arranged in an untwisted manner in 4 rows by 3 columns, and then 18 second conductor wires 23 on whose surface the binding material 25 is formed, in an untwisted manner to a wire assembly than the arranged first conductor wires 21 arranged. Then, heating at a temperature of about 200 ° C is performed to the adjacent binding materials 22 and 25 on the first conductor wires 21 and the second conductor wires 23 to weld and integrate with each other.

In this way, the conductor arrangement 10i of the present embodiment.

As in the ladder arrangement above 10i of the present embodiment, the insulating thin film described 26 and the binding material 22 as a relatively thin first insulating film between the first conductor wires 21 in the conductor arrangement 10i are provided, the ratio, which occupies the insulating part, in the cross section of the conductor arrangement 10i be reduced, whereby the conductor space factor of the conductor arrangement 10i is raised. Furthermore, the insulating thick film 24 and the binding material 25 as a relatively thick second insulating film between the second conductor wires 23 in the peripheral wall of the conductor arrangement 10i are provided, the insulating property between the conductor assemblies 10i be granted. It is noted that in common conductor arrangements, electric current flows in conductor wires in their longitudinal direction, and hence the insulation property between the conductor arrangements is given greater importance than the insulating property between the conductor wires. Thus, the internal configuration of the conductor arrangement 10i in which the first conductor wires 21 are arranged to raise the ladder space factor, and the outer circumference configuration of the ladder arrangement 10i in which the second conductor wires 23 can keep the insulating property. Thus, in the conductor arrangement 10i the insulating property can be maintained, and the ladder space factor can be raised as much as possible.

In the conductor arrangement 10i of the present embodiment are further the insulating thin film 26 and the binding material 22 in turn on the first conductor wires 21 layered. This may be the insulating property of the first conductor wires 21 improve. The insulating thin film 26 , the underlying film of the tying material 22 can serve, the binding power of the binding material 22 on the first conductor wires 21 improve. Furthermore, the successive layers of the insulating thin film can 26 and the binding material 22 on the first conductor wires 21 and sequentially layering the insulating thick film 24 and the binding material 25 on the second conductor wires 23 the configuration of each first conductor wire 21 equivalent to that of every other conductor wire 23 causing an imbalance of adhesion (bonding force) between the inner and outer circumference of the conductor assembly 10i is eliminated.

Further, according to the conductor arrangement 10i of the present embodiment, the insulating thin film 26 is formed by electroplating, only an adaptation of the applied voltage during plating allows the uniform formation of a thin insulating thin film 26 from, for example, 0.5 μm to 1.5 μm, thereby decreasing the conductor space factor of the conductor wires 10i by forming the insulating thin film 26 is prevented.

In addition, in the conductor arrangement 10i of the present embodiment, the close contact of the insulating thin film 26 with the conductor wires 21 and the close contact of the insulating thick film 24 with the second conductor wires 23 large. This can prevent detachment during bending.

According to the conductor arrangement 10i of the present embodiment, furthermore, the simple arrangement in which the with the relatively thin insulating thin film 26 covered first conductor wires 21 are arranged inside and with the relatively thick insulating thick film 24 covered second lei terdrähte 23 are located outside, to maintain the insulating property and to raise the ladder space factor. Thus, the conductor assembly can be manufactured at high productivity.

With reference herein to an in 20 shown conductor arrangement 110a as a comparative example, that of the conductor arrangement 10i of the present embodiment is an insulating tape 114 made of polyimide or the like spirally wound in an overlapping manner on a wire assembly formed by bonding a plurality of conductor wires 111 that with an insulating thin film 112 covered by a binder 113 be obtained with each other. The conductor wire 110a makes the workability low and tends to waste space when winding the insulating tape 114 to build. Therefore, the insulating property of the conductor wire 110a possibly uneven and the ladder space factor may decrease. While a thinner insulating tape 114 can facilitate winding to improve machinability, the insulating property of the conductor assembly 110a be worse. Furthermore, at an in 21 shown conductor arrangement 110b as another comparative example, an insulating cover layer 115 of a UV curable resin or the like applied to a wire assembly formed by bonding a plurality of the insulating thin film 112 covered conductor wires 111 through the binder 113 is obtained with each other. In this ladder arrangement 110b maintains the insulating cover layer 115 be thin at the corners, with the result that the insulating property of the conductor assembly 110b can be worse.

Since also in the conductor arrangement 10i neither the insulating tape of the present embodiment 114 nor the insulating cover layer 115 , which limit the shape is formed, a conductor assembly can be provided with high flexibility.

The above embodiments relate to the configurations and manufacturing methods using a welding agent or an adhesive as a bonding material 22 and 25 use. However, the present invention may use a suitable combination of a welding agent and an adhesive, for example, to eliminate imbalance in adhesion between the inner and outer circumference of the conductor assembly. For example, an adhesive for metal may be used as the binding material 22 used while a plastic welding material as a binding material 25 can be used.

Industrial Applicability

As As described above, the present invention can provide the ladder space factor lift a conductor assembly and is therefore for magnetic wires suitable for engines.

Summary

A conductor arrangement ( 10a ), in which several conductor wires ( 1 ), each of the conductor wires having a cross section of one of parts into which an entire cross section of the conductor arrangement is subdivided, comprising an insulating cover layer (FIG. 4 ) for covering and insulating a whole of a wire arrangement of the conductor wires ( 1 ). The conductor wires ( 1 ) are protected by an insulating adhesive layer ( 3a ) adhered to each other.

1, 1a to 1e, 13

conductor wire

2

insulating thin film

3

adhesive

3a

adhesive layer

4

insulating covering

5, 15

wire assembly

10a to 10i

conductor arrangement

11

Conductor element wire

12

Element wire covering

14

sealing layer

16

Outer circumferential covering (cylindrical body)

16a

tube

QUOTES INCLUDE IN THE DESCRIPTION

This list The documents listed by the applicant have been automated generated and is solely for better information recorded by the reader. The list is not part of the German Patent or utility model application. The DPMA takes over no liability for any errors or omissions.

Cited patent literature

• - JP 11-203948 [0003]

Claims (30)

Conductor arrangement in which several conductor wires are integrated, wherein each of the conductor wires has a cross section having one of parts into which an entire cross-section of the conductor arrangement is divided, comprising: an insulating cover layer for Covering and insulating a whole of a wire assembly of Conductor wires, wherein the conductor wires through an insulating adhesive layer are adhered to each other. Conductor arrangement according to Claim 1, characterized that the cross-section of each of the conductor wires is rectangular is. Conductor arrangement according to Claim 1, characterized that the adhesive layer on side surfaces of a conductor wire is formed, which is in the wire arrangement of the conductor wires are located. Ladder arrangement according to Claim 3, characterized the insulating cover layer is formed by electroplating is. Conductor arrangement according to Claim 1, characterized that an insulating thin film between the conductor wires and the adhesive layer is provided. Ladder arrangement according to Claim 5, characterized that the insulating thin film is formed by electroplating is. Conductor arrangement according to Claim 1, characterized that the conductor wires integrated in untwisted manner are. Method for producing a conductor arrangement, in the multiple conductor wires are integrated, each of the Conductor wires has a cross-section of one of parts, into which an entire cross-section of the conductor arrangement is divided, full: a wire arrangement forming step for forming a wire assembly into which the conductor wires through a Adhesive layer are integrated, by forming the adhesive layer by Applying an insulating adhesive on the plurality of conductor wires; and a step of forming an insulating cover layer for forming an insulating cover layer, in order that the in the Wire assembly forming step formed wire assembly covered becomes. Method according to claim 8, characterized in that that: the cross section of each of the conductor wires is rectangular is in the wire assembly forming step, the adhesive applied to side surfaces of the conductor wires is located in the wire assembly, and in the step forming the insulating cover layer, the insulating cover layer is formed by electroplating. Method according to claim 9, characterized that: in the wire assembly forming step, the adhesive layer is formed by thermal curing of the adhesive and in the step of forming the insulating cover layer thermally hardened adhesive layer during heat treatment of insulating cover layer holds a shape of the wire assembly. Ladder arrangement comprising: a wire arrangement, in which several conductor wires are integrated, each one the conductor wires have a cross section of one of parts, into which an entire cross section of the conductor arrangement is divided; and an outer peripheral cover layer for covering and Isolating the wire assembly, wherein the outer peripheral cover layer is formed with a cylindrical body passing through Inherent elasticity in close contact with a surface the wire assembly is. Ladder arrangement according to Claim 11, characterized that the cylindrical body with a through heat Shrunken tube is formed from a resin. Ladder arrangement according to Claim 12, characterized that the hose is made of a fluorine resin. Ladder arrangement according to Claim 11, characterized that the cross-section of each of the conductor wires is rectangular is. Ladder arrangement according to Claim 11, characterized that each of the conductor wires with a welding layer for welding the conductor wires together is covered. Ladder arrangement according to Claim 11, characterized that the conductor wires integrated in untwisted manner are. Method for producing a conductor arrangement with a wire assembly in which integrates several conductor wires are, wherein each of the conductor wires has a cross section of a of parts, in which an entire cross section of the conductor arrangement is divided, and an outer peripheral cover layer to Covering and insulating the wire assembly, comprising: one Insertion step for inserting the wire assembly in a heat-shrinkable tube, around an introducer to build; and a heating step for heating the insertion body formed in the insertion step, to thermally shrink the tube, whereby the outer peripheral cover layer is formed with a surface of the wire assembly is in close contact. Method according to claim 17, characterized in that that: each of the conductor wires of the wire assembly with a welding layer for welding the conductor wires together is covered, and at the heating step, the weld layer is re-welded to be in close contact with the outer peripheral cover layer to stand. Conductor arrangement in which several conductor wires are integrated, wherein each of the conductor wires has a cross section having one of parts into which an entire cross-section of the conductor arrangement is divided, characterized in that: the several Conductor wires a plurality of arranged inside first conductor wires and a plurality of second conductor wires so arranged that they cover a circumference of the plurality of first conductor wires, include, each of the first conductor wires with a first insulating film is covered and each of the second Conductor wires covered with a second insulating film which is thicker than the first insulating film. Ladder arrangement according to Claim 19, characterized the first insulating film is a binder for binding the first Conductor wires is together. Ladder arrangement according to Claim 19, characterized the first insulating film is an insulating thin film for covering and insulating each of the first conductor wires and a binding material for bonding with the insulating thin films covered first conductor wires together. Ladder arrangement according to Claim 21, characterized that the insulating thin film formed by electroplating is. Ladder arrangement according to Claim 19, characterized the second insulating film is an insulating thick film for Cover and isolate each of the second conductor wires and a binding material for bonding the ones covered with the insulating thick film second conductor wires comprises each other. Ladder arrangement according to Claim 23, characterized in that the insulating thick film is formed by electroplating. Ladder arrangement according to Claim 19, characterized a cross section of each of the second conductor wires becomes smaller as a cross section of each of the first conductor wires. Ladder arrangement according to Claim 19, characterized a cross section of each of the first conductor wires becomes smaller as a cross section of each of the second conductor wires. Ladder arrangement according to Claim 19, characterized that the conductor wires are arranged so that interfaces between the first conductor wires not with interfaces coincide between the second conductor wires. Ladder arrangement according to Claim 19, characterized that the cross-section of each of the conductor wires is rectangular is. Ladder arrangement according to Claim 19, characterized that the conductor wires integrated in untwisted manner are. Ladder arrangement according to Claim 19, characterized that a relatively high electrical voltage on the first conductor wires is applied while on the second conductor wires a relatively low electrical Voltage is applied.