DE112006003763A5 - Coating plant for wafers - Google Patents

Coating plant for wafers Download PDF

Info

Publication number
DE112006003763A5
DE112006003763A5 DE112006003763T DE112006003763T DE112006003763A5 DE 112006003763 A5 DE112006003763 A5 DE 112006003763A5 DE 112006003763 T DE112006003763 T DE 112006003763T DE 112006003763 T DE112006003763 T DE 112006003763T DE 112006003763 A5 DE112006003763 A5 DE 112006003763A5
Authority
DE
Germany
Prior art keywords
wafers
coating plant
plant
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112006003763T
Other languages
German (de)
Inventor
Klaus Thiel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of DE112006003763A5 publication Critical patent/DE112006003763A5/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
DE112006003763T 2005-12-23 2006-11-12 Coating plant for wafers Withdrawn DE112006003763A5 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE200520020274 DE202005020274U1 (en) 2005-12-23 2005-12-23 Coating plant for wafers
DE202005020274.6 2005-12-23
PCT/DE2006/001980 WO2007076739A2 (en) 2005-12-23 2006-11-12 Coating installation for wafers

Publications (1)

Publication Number Publication Date
DE112006003763A5 true DE112006003763A5 (en) 2008-11-27

Family

ID=36012288

Family Applications (2)

Application Number Title Priority Date Filing Date
DE200520020274 Expired - Lifetime DE202005020274U1 (en) 2005-12-23 2005-12-23 Coating plant for wafers
DE112006003763T Withdrawn DE112006003763A5 (en) 2005-12-23 2006-11-12 Coating plant for wafers

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE200520020274 Expired - Lifetime DE202005020274U1 (en) 2005-12-23 2005-12-23 Coating plant for wafers

Country Status (2)

Country Link
DE (2) DE202005020274U1 (en)
WO (1) WO2007076739A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202010015018U1 (en) * 2010-11-07 2011-04-14 Bohnet, Hans Arrangement for producing structured substrates

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60109229A (en) * 1983-11-18 1985-06-14 Hitachi Ltd Spin treatment device
JPS60193339A (en) * 1984-03-14 1985-10-01 Fujitsu Ltd Method of coating resist film
JPH0444216Y2 (en) * 1985-10-07 1992-10-19
JP2527318B2 (en) * 1986-12-25 1996-08-21 関東化学 株式会社 Method and apparatus for recovering and reusing resist composition
KR100248565B1 (en) * 1993-03-30 2000-05-01 다카시마 히로시 Resist processing method and apparatus
JP3360365B2 (en) * 1993-07-29 2002-12-24 クロリンエンジニアズ株式会社 Method for regenerating tetraalkylammonium hydroxide
US5916368A (en) * 1997-02-27 1999-06-29 The Fairchild Corporation Method and apparatus for temperature controlled spin-coating systems
US5869219A (en) * 1997-11-05 1999-02-09 Taiwan Semiconductor Manufacturing Co. Ltd. Method for depositing a polyimide film
JP3913869B2 (en) * 1997-11-21 2007-05-09 沖電気工業株式会社 Substrate processing equipment
US20050048208A1 (en) * 2003-09-02 2005-03-03 Yao-Hwan Kao Resist supply apparatus with resist recycling function, coating system having the same and method of resist recycling

Also Published As

Publication number Publication date
WO2007076739A2 (en) 2007-07-12
WO2007076739A3 (en) 2007-09-07
DE202005020274U1 (en) 2006-02-23

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Legal Events

Date Code Title Description
8181 Inventor (new situation)

Inventor name: THIEL, KLAUS, 64405 FISCHBACHTAL, DE

8110 Request for examination paragraph 44
8139 Disposal/non-payment of the annual fee