DE1085261B - Halbleitervorrichtung fuer grosse Leistungen - Google Patents

Halbleitervorrichtung fuer grosse Leistungen

Info

Publication number
DE1085261B
DE1085261B DEG22285A DEG0022285A DE1085261B DE 1085261 B DE1085261 B DE 1085261B DE G22285 A DEG22285 A DE G22285A DE G0022285 A DEG0022285 A DE G0022285A DE 1085261 B DE1085261 B DE 1085261B
Authority
DE
Germany
Prior art keywords
layer
semiconductor device
semiconductor body
insulating material
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DEG22285A
Other languages
German (de)
English (en)
Inventor
Conrad Henry Zierdt Jun
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of DE1085261B publication Critical patent/DE1085261B/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Bipolar Transistors (AREA)
DEG22285A 1956-06-12 1957-06-11 Halbleitervorrichtung fuer grosse Leistungen Pending DE1085261B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US590901A US2887628A (en) 1956-06-12 1956-06-12 Semiconductor device construction

Publications (1)

Publication Number Publication Date
DE1085261B true DE1085261B (de) 1960-07-14

Family

ID=24364199

Family Applications (1)

Application Number Title Priority Date Filing Date
DEG22285A Pending DE1085261B (de) 1956-06-12 1957-06-11 Halbleitervorrichtung fuer grosse Leistungen

Country Status (5)

Country Link
US (1) US2887628A (US08197722-20120612-C00042.png)
DE (1) DE1085261B (US08197722-20120612-C00042.png)
FR (1) FR1175953A (US08197722-20120612-C00042.png)
GB (1) GB822770A (US08197722-20120612-C00042.png)
NL (2) NL101297C (US08197722-20120612-C00042.png)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1514055A1 (de) * 1964-11-13 1969-08-21 Ibm Kuehlvorrichtung mit mindestens zwei zueinander parallel verlaufenden Kuehlblechen,insbesondere fuer Injektionslaser
DE2248159A1 (de) * 1971-10-01 1973-04-19 Gen Electric Eingekapselter metalloxidvaristor
DE2755404A1 (de) * 1977-12-13 1979-06-21 Bosch Gmbh Robert Halbleiteranordnung

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3142791A (en) * 1955-12-07 1964-07-28 Motorola Inc Transistor and housing assembly
GB827117A (en) * 1958-01-03 1960-02-03 Standard Telephones Cables Ltd Improvements in or relating to semi-conductor devices
GB818464A (en) * 1956-03-12 1959-08-19 Gen Electric Co Ltd Improvements in or relating to semiconductor devices
US2984774A (en) * 1956-10-01 1961-05-16 Motorola Inc Transistor heat sink assembly
US3089067A (en) * 1957-09-30 1963-05-07 Gen Motors Corp Semiconductor device
US3113252A (en) * 1958-02-28 1963-12-03 Gen Motors Corp Means for encapsulating transistors
US3150298A (en) * 1958-04-16 1964-09-22 Motorola Inc Stud-mounted rectifier
US3058041A (en) * 1958-09-12 1962-10-09 Raytheon Co Electrical cooling devices
BE584431A (US08197722-20120612-C00042.png) * 1959-02-09
NL266908A (US08197722-20120612-C00042.png) * 1959-05-15
US3005867A (en) * 1959-10-30 1961-10-24 Westinghouse Electric Corp Hermetically sealed semiconductor devices
US3025437A (en) * 1960-02-05 1962-03-13 Lear Inc Semiconductor heat sink and electrical insulator
NL268169A (US08197722-20120612-C00042.png) * 1960-09-20
US3250963A (en) * 1961-03-16 1966-05-10 Texas Instruments Inc Sensor device and method of mounting
DE1251871B (US08197722-20120612-C00042.png) * 1962-02-06 1900-01-01
NL294340A (US08197722-20120612-C00042.png) * 1962-07-27 1900-01-01
US3209065A (en) * 1962-08-02 1965-09-28 Westinghouse Electric Corp Hermetically enclosed electronic device
US3265802A (en) * 1963-11-18 1966-08-09 Mitronics Inc Cap for hermetically sealed semiconductor
US3271722A (en) * 1963-12-03 1966-09-06 Globe Union Inc Electrical component and thermally improved electrical insulating medium therefor
US3457476A (en) * 1965-02-12 1969-07-22 Hughes Aircraft Co Gate cooling structure for field effect transistors
US3515952A (en) * 1965-02-17 1970-06-02 Motorola Inc Mounting structure for high power transistors
US3506886A (en) * 1965-03-08 1970-04-14 Itt High power transistor assembly
GB1147645A (en) * 1965-07-01 1969-04-02 English Electric Co Ltd Housings for semi-conductor devices
US3377525A (en) * 1965-12-03 1968-04-09 Gen Electric Electrically insulated mounting bracket for encased semicon-ductor device
US3462654A (en) * 1966-10-05 1969-08-19 Int Rectifier Corp Electrically insulating-heat conductive mass for semiconductor wafers
US3419763A (en) * 1966-10-31 1968-12-31 Itt High power transistor structure
US3522491A (en) * 1967-05-31 1970-08-04 Wakefield Eng Inc Heat transfer apparatus for cooling semiconductor components
US3716759A (en) * 1970-10-12 1973-02-13 Gen Electric Electronic device with thermally conductive dielectric barrier
US4222373A (en) * 1977-07-26 1980-09-16 Davis Michael A Ceramic solar collector
US4303935A (en) * 1977-12-13 1981-12-01 Robert Bosch Gmbh Semiconductor apparatus with electrically insulated heat sink
US4299715A (en) * 1978-04-14 1981-11-10 Whitfield Fred J Methods and materials for conducting heat from electronic components and the like
JPS5550646A (en) * 1978-10-06 1980-04-12 Hitachi Ltd Integrated circuit device
US4301357A (en) * 1979-08-23 1981-11-17 Kv33 Corporation Electrically heated wax spatula using a diode as the heating element
US4602678A (en) * 1983-09-02 1986-07-29 The Bergquist Company Interfacing of heat sinks with electrical devices, and the like
JPS6066843A (ja) * 1983-09-22 1985-04-17 Hitachi Ltd 集積回路パツケ−ジ
US6616999B1 (en) * 2000-05-17 2003-09-09 Raymond G. Freuler Preapplicable phase change thermal interface pad
US6652705B1 (en) 2000-05-18 2003-11-25 Power Devices, Inc. Graphitic allotrope interface composition and method of fabricating the same
US6672378B2 (en) * 2001-06-07 2004-01-06 Loctite Corporation Thermal interface wafer and method of making and using the same
US6483707B1 (en) 2001-06-07 2002-11-19 Loctite Corporation Heat sink and thermal interface having shielding to attenuate electromagnetic interference

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2820929A (en) * 1958-01-21 Transistor holders
US2740075A (en) * 1956-03-27 Metal rectifier assemblies
US2738452A (en) * 1950-06-30 1956-03-13 Siemens Ag Dry multi-pellet rectifiers
US2725505A (en) * 1953-11-30 1955-11-29 Rca Corp Semiconductor power devices
US2825014A (en) * 1953-11-30 1958-02-25 Philips Corp Semi-conductor device
CH328594A (fr) * 1954-07-03 1958-03-15 Csf Dispositif électronique comportant un élément semi-conducteur
NL110715C (US08197722-20120612-C00042.png) * 1954-12-16 1900-01-01

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
None *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1514055A1 (de) * 1964-11-13 1969-08-21 Ibm Kuehlvorrichtung mit mindestens zwei zueinander parallel verlaufenden Kuehlblechen,insbesondere fuer Injektionslaser
DE2248159A1 (de) * 1971-10-01 1973-04-19 Gen Electric Eingekapselter metalloxidvaristor
DE2755404A1 (de) * 1977-12-13 1979-06-21 Bosch Gmbh Robert Halbleiteranordnung

Also Published As

Publication number Publication date
NL217849A (US08197722-20120612-C00042.png)
GB822770A (en) 1959-10-28
FR1175953A (fr) 1959-04-03
NL101297C (US08197722-20120612-C00042.png)
US2887628A (en) 1959-05-19

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