DE1080838B - Alloy for soft soldering - Google Patents

Alloy for soft soldering

Info

Publication number
DE1080838B
DE1080838B DEL29447A DEL0029447A DE1080838B DE 1080838 B DE1080838 B DE 1080838B DE L29447 A DEL29447 A DE L29447A DE L0029447 A DEL0029447 A DE L0029447A DE 1080838 B DE1080838 B DE 1080838B
Authority
DE
Germany
Prior art keywords
alloy
soft
soft soldering
soldering
metals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DEL29447A
Other languages
German (de)
Inventor
Dipl-Ing Gerhard Hempel
Klaus Bergmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Licentia Patent Verwaltungs GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Priority to DEL29447A priority Critical patent/DE1080838B/en
Publication of DE1080838B publication Critical patent/DE1080838B/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Joining Of Glass To Other Materials (AREA)

Description

Legierung zum Weichlöten Bei der Verbindung von Metallen durch Löten unterscheidet man zwischen Hart- und Weichloten. Bei der Gruppe der Hartlote liegt der Schmelzpunkt durchweg über 500° C. Diese Lote zeigen gute Fertigkeitseigenschaften. Sie haben jedoch den Nachteil, daß die Werkstücke ziemlich stark erhitzt werden müssen. Bei den Weichloten liegt die obere Schmelzgrenze etwa bei 300° C. Für Weichlotlegierungen lassen sich im allgemeinen nur Metalle einsetzen, die ziemlich schlechte Festigkeitswerte und eine ausgesprochene Neigung zum Kriechen haben.Alloy for soft soldering When joining metals by soldering A distinction is made between hard and soft solders. In the group of brazing alloys lies the melting point consistently above 500 ° C. These solders show good craftsmanship properties. However, they have the disadvantage that the workpieces are heated quite strongly have to. For soft solders, the upper melting limit is around 300 ° C. For soft solder alloys In general, only metals with rather poor strength values can be used and have a pronounced tendency to creep.

Die Metalle Zinn, Cadmium, Zink, Wismut und Blei bilden die Grundlage für eine große Zahl von Weichlotlegierungen. Zur Erzielung besonderer Eigenschaften sind auch Speziallegierungen entwickelt worden, die allerlei Zusätze von edleren Metallen enthalten. So setzt man beispielsweise Silber oder Kupfer zu, um die Lösefähigkeit dieser Metalle im geschmolzenen Lot zu verringern. Der Zusatz von Antimon dient zur Steigerung der Härte. Indiumhaltiges Lot kann für Lötungen an Glas verwendet werden und ist alkalifest. Durch die Verwendung von Wismut erreicht man extrem tiefe Schmelztemperaturen.The metals tin, cadmium, zinc, bismuth and lead form the basis for a large number of soft solder alloys. To achieve special properties Special alloys have also been developed that contain all sorts of additions of more noble Contain metals. For example, silver or copper is added to reduce the dissolving power of these metals in the molten solder. The addition of antimony is used to increase the hardness. Solder containing indium can be used for soldering to glass become and is alkali-resistant. By using bismuth you can get extremely deep Melting temperatures.

Alle diese Speziallote haben den Nachteil, daß sie keine hohe Dauerstandfestigkeit besitzen. Obwohl Kurzzeitmessungen Festigkeitswerte bis zu 20 kg/mm2 ergeben haben, sinken diese Werte bei Dauerbelastung auf den zwanzigsten Teil ab.All of these special solders have the disadvantage that they do not have a high creep strength own. Although short-term measurements have shown strength values of up to 20 kg / mm2, These values drop to a twentieth part with continuous load.

Der vorliegenden Erfindung liegt die Aufgabe zugrunde, Legierungen mit wesentlich besserer Dauer-Standfestigkeit zu erschmelzen. Ausgangspunkt ist eine Legierung zum Weichlöten, die aus den Komponenten Zinn, Antimon, Indium und Kupfer oder Silber zusammengesetzt ist.The present invention is based on the object of alloys to melt with much better permanent stability. Starting point is an alloy for soft soldering, made up of the components tin, antimony, indium and Composed of copper or silver.

Erfindungsgemäß besteht die Weichlotlegierung aus 2 bis 611/o Antimon, 0,5 bis 5% Indium, 1 bis 411/o Kupfer oder Silber und einem Rest von mehr als 85% Zinn. Die bei Einhaltung des obgengenannten Mischungsverhältnisses auftretenden Festigkeitswerte liegen überraschend hoch.- Hervorzuheben sind auch die sehr geringen Ermüdungserscheinungen bei Dauerbelastung. Das angegebene Lot läßt sich gut verarbeiten und zeigt eine gute Korrosionsfestigkeit.According to the invention, the soft solder alloy consists of 2 to 611 / o antimony, 0.5 to 5% indium, 1 to 411 / o copper or silver and a remainder of more than 85% Tin. Those that occur when the above-mentioned mixing ratio is adhered to Strength values are surprisingly high. The very low ones should also be emphasized Signs of fatigue under constant load. The specified solder can be processed well and shows good corrosion resistance.

Diese Eigenschaften erschließen dem Weichlöten neue Anwendungsmöglichkeiten. Besonders gute Ergebnisse traten bei der Lötung hochwertiger Verbindungen, z. B. bei der Befestigung von Spannbändern, auf.These properties open up new application possibilities for soft soldering. Particularly good results were obtained when soldering high-quality connections, e.g. B. when fastening straps.

Claims (1)

PATENTANSPRUCH: Weichlot mit hoher Dauerstandsfestigkeit, dadurch gekennzeichnet, daß es aus 2 bis 6% Antimon, 0,5 bis 5% Indium, 1 bis 4% Kupfer oder Silber und einem Rest mehr als 85% Zinn besteht.PATENT CLAIM: Soft solder with high durability, thereby characterized in that it consists of 2 to 6% antimony, 0.5 to 5% indium, 1 to 4% copper or silver and a balance greater than 85% tin.
DEL29447A 1958-01-13 1958-01-13 Alloy for soft soldering Pending DE1080838B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DEL29447A DE1080838B (en) 1958-01-13 1958-01-13 Alloy for soft soldering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DEL29447A DE1080838B (en) 1958-01-13 1958-01-13 Alloy for soft soldering

Publications (1)

Publication Number Publication Date
DE1080838B true DE1080838B (en) 1960-04-28

Family

ID=7264879

Family Applications (1)

Application Number Title Priority Date Filing Date
DEL29447A Pending DE1080838B (en) 1958-01-13 1958-01-13 Alloy for soft soldering

Country Status (1)

Country Link
DE (1) DE1080838B (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0351462A1 (en) * 1987-06-29 1990-01-24 J.W. Harris Company, Inc. Solder composition and method of use
WO1990014947A1 (en) * 1989-06-01 1990-12-13 Olin Corporation Metal and metal alloys with improved solderability shelf life and method of preparing the same
EP0568952A1 (en) * 1992-05-04 1993-11-10 The Indium Corporation Of America Lead-free alloy containing tin, silver and indium
EP0612578A1 (en) * 1993-02-22 1994-08-31 AT&T Corp. An Article comprising a pb-free solder having improved mechanical properties
EP0629463A1 (en) * 1993-06-16 1994-12-21 International Business Machines Corporation Lead-free, high-temperature, tin based multi-component solder
EP0629464A1 (en) * 1993-06-16 1994-12-21 International Business Machines Corporation Lead-free, tin, antimony, bismuth, copper solder alloy
WO1995018696A1 (en) * 1994-01-06 1995-07-13 Qualitek International, Inc. Soldering composition
EP0695373A1 (en) * 1993-04-29 1996-02-07 SEELIG, Karl F. Lead-free and bismuth-free tin alloy solder composition

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0351462A1 (en) * 1987-06-29 1990-01-24 J.W. Harris Company, Inc. Solder composition and method of use
WO1990014947A1 (en) * 1989-06-01 1990-12-13 Olin Corporation Metal and metal alloys with improved solderability shelf life and method of preparing the same
EP0568952A1 (en) * 1992-05-04 1993-11-10 The Indium Corporation Of America Lead-free alloy containing tin, silver and indium
US5580520A (en) * 1992-05-04 1996-12-03 The Indium Corporation Of America Lead-free alloy containing tin, silver and indium
EP0612578A1 (en) * 1993-02-22 1994-08-31 AT&T Corp. An Article comprising a pb-free solder having improved mechanical properties
US5762866A (en) * 1993-02-22 1998-06-09 Lucent Technologies Inc. Article comprising a Pb-free solder having improved mechanical properties
EP0695373A1 (en) * 1993-04-29 1996-02-07 SEELIG, Karl F. Lead-free and bismuth-free tin alloy solder composition
EP0695373A4 (en) * 1993-04-29 1996-04-17 Karl F Seelig Lead-free and bismuth-free tin alloy solder composition
EP0629463A1 (en) * 1993-06-16 1994-12-21 International Business Machines Corporation Lead-free, high-temperature, tin based multi-component solder
EP0629464A1 (en) * 1993-06-16 1994-12-21 International Business Machines Corporation Lead-free, tin, antimony, bismuth, copper solder alloy
WO1995018696A1 (en) * 1994-01-06 1995-07-13 Qualitek International, Inc. Soldering composition

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