DE1060055B - Verfahren zur Herstellung der elektrischen Anschluesse von Halbleiteranordnungen - Google Patents

Verfahren zur Herstellung der elektrischen Anschluesse von Halbleiteranordnungen

Info

Publication number
DE1060055B
DE1060055B DES55904A DES0055904A DE1060055B DE 1060055 B DE1060055 B DE 1060055B DE S55904 A DES55904 A DE S55904A DE S0055904 A DES0055904 A DE S0055904A DE 1060055 B DE1060055 B DE 1060055B
Authority
DE
Germany
Prior art keywords
electrodes
connections
electrical
alloyed
semiconductor arrangements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DES55904A
Other languages
German (de)
English (en)
Inventor
Dipl-Phys Reimer Emais
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to NL231899D priority Critical patent/NL231899A/xx
Priority to NL112316D priority patent/NL112316C/xx
Application filed by Siemens Corp filed Critical Siemens Corp
Priority to DES55904A priority patent/DE1060055B/de
Priority to FR1204972D priority patent/FR1204972A/fr
Priority to GB35551/58A priority patent/GB863010A/en
Priority to CH6595458A priority patent/CH365454A/de
Publication of DE1060055B publication Critical patent/DE1060055B/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01032—Germanium [Ge]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01044—Ruthenium [Ru]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrodes For Compound Or Non-Metal Manufacture (AREA)
  • Electrodes Of Semiconductors (AREA)
DES55904A 1957-11-15 1957-11-15 Verfahren zur Herstellung der elektrischen Anschluesse von Halbleiteranordnungen Pending DE1060055B (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
NL231899D NL231899A (enrdf_load_stackoverflow) 1957-11-15
NL112316D NL112316C (enrdf_load_stackoverflow) 1957-11-15
DES55904A DE1060055B (de) 1957-11-15 1957-11-15 Verfahren zur Herstellung der elektrischen Anschluesse von Halbleiteranordnungen
FR1204972D FR1204972A (fr) 1957-11-15 1958-10-21 Procédé de fixation des connexions de courant des dispositifs semi-conducteurs
GB35551/58A GB863010A (en) 1957-11-15 1958-11-05 Improvements in or relating to the production of semi-conductor devices
CH6595458A CH365454A (de) 1957-11-15 1958-11-08 Verfahren zur Befestigung von Stromanschlüssen an Halbleiteranordnungen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES55904A DE1060055B (de) 1957-11-15 1957-11-15 Verfahren zur Herstellung der elektrischen Anschluesse von Halbleiteranordnungen

Publications (1)

Publication Number Publication Date
DE1060055B true DE1060055B (de) 1959-06-25

Family

ID=7490746

Family Applications (1)

Application Number Title Priority Date Filing Date
DES55904A Pending DE1060055B (de) 1957-11-15 1957-11-15 Verfahren zur Herstellung der elektrischen Anschluesse von Halbleiteranordnungen

Country Status (5)

Country Link
CH (1) CH365454A (enrdf_load_stackoverflow)
DE (1) DE1060055B (enrdf_load_stackoverflow)
FR (1) FR1204972A (enrdf_load_stackoverflow)
GB (1) GB863010A (enrdf_load_stackoverflow)
NL (2) NL231899A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1149826B (de) * 1961-04-19 1963-06-06 Siemens Ag Verfahren zum Anbringen eines elektrischen Anschlusses an einer Halbleiteranordnung
DE1162485B (de) * 1959-10-16 1964-02-06 Monsanto Chemicals Halbleitergleichrichter zur Verwendung bis zu Temperaturen von etwa 1000íÒ mit einemHalbleiterkoerper aus Borphosphid
DE1232268B (de) * 1962-05-12 1967-01-12 Telefunken Patent Vorrichtung zum Kontaktieren der Legierungselektroden von Halbleiterbauelementen
DE1245500B (de) * 1962-09-15 1967-07-27 Telefunken Patent Verfahren zum sperrfreien Kontaktieren eines Halbleiterkoerpers

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3266137A (en) * 1962-06-07 1966-08-16 Hughes Aircraft Co Metal ball connection to crystals

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB499900A (en) * 1936-09-24 1939-01-31 Naonori Uchida Improvements in or relating to an electrical apparatus for the transmitter of printing telegraphs or like devices
CH229963A (de) * 1942-03-27 1943-11-30 Philips Nv Verfahren zum Anschluss eines elektrischen Zuführungsleiters an einen Teil eines elektrischen Gerätes, insbesondere eines Sperrschichtgleichrichters.
DE1749114U (de) * 1954-08-27 1957-07-25 Siemens Ag Selengleichrichterplatte mit druckkontakten.

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB499900A (en) * 1936-09-24 1939-01-31 Naonori Uchida Improvements in or relating to an electrical apparatus for the transmitter of printing telegraphs or like devices
CH229963A (de) * 1942-03-27 1943-11-30 Philips Nv Verfahren zum Anschluss eines elektrischen Zuführungsleiters an einen Teil eines elektrischen Gerätes, insbesondere eines Sperrschichtgleichrichters.
DE1749114U (de) * 1954-08-27 1957-07-25 Siemens Ag Selengleichrichterplatte mit druckkontakten.

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1162485B (de) * 1959-10-16 1964-02-06 Monsanto Chemicals Halbleitergleichrichter zur Verwendung bis zu Temperaturen von etwa 1000íÒ mit einemHalbleiterkoerper aus Borphosphid
DE1162486B (de) * 1959-10-16 1964-02-06 Monsanto Chemicals Leistungs-Halbleitergleichrichter zur Verwendung bis zu Temperaturen von etwa 1000íÒC mit einem Halbleiterkoerper aus kubischem Borphosphid
DE1149826B (de) * 1961-04-19 1963-06-06 Siemens Ag Verfahren zum Anbringen eines elektrischen Anschlusses an einer Halbleiteranordnung
DE1232268B (de) * 1962-05-12 1967-01-12 Telefunken Patent Vorrichtung zum Kontaktieren der Legierungselektroden von Halbleiterbauelementen
DE1245500B (de) * 1962-09-15 1967-07-27 Telefunken Patent Verfahren zum sperrfreien Kontaktieren eines Halbleiterkoerpers

Also Published As

Publication number Publication date
CH365454A (de) 1962-11-15
FR1204972A (fr) 1960-01-29
GB863010A (en) 1961-03-15
NL112316C (enrdf_load_stackoverflow)
NL231899A (enrdf_load_stackoverflow)

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