DE10355003B4 - Inductive sensor and method for its production - Google Patents
Inductive sensor and method for its production Download PDFInfo
- Publication number
- DE10355003B4 DE10355003B4 DE2003155003 DE10355003A DE10355003B4 DE 10355003 B4 DE10355003 B4 DE 10355003B4 DE 2003155003 DE2003155003 DE 2003155003 DE 10355003 A DE10355003 A DE 10355003A DE 10355003 B4 DE10355003 B4 DE 10355003B4
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- coil
- sensor according
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- sensor
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- 230000001939 inductive effect Effects 0.000 title claims abstract description 9
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 238000000034 method Methods 0.000 title claims description 11
- 239000004020 conductor Substances 0.000 claims abstract description 14
- 230000005291 magnetic effect Effects 0.000 claims description 17
- 238000001746 injection moulding Methods 0.000 claims description 9
- 238000005507 spraying Methods 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 1
- 238000011156 evaluation Methods 0.000 description 4
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- XVIZMMSINIOIQP-UHFFFAOYSA-N 1,2-dichloro-3-(2-chlorophenyl)benzene Chemical compound ClC1=CC=CC(C=2C(=CC=CC=2)Cl)=C1Cl XVIZMMSINIOIQP-UHFFFAOYSA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 210000001331 nose Anatomy 0.000 description 2
- 238000012549 training Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000005294 ferromagnetic effect Effects 0.000 description 1
- -1 ferrous metals Chemical class 0.000 description 1
- 239000004413 injection moulding compound Substances 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000010327 methods by industry Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
- H03K17/945—Proximity switches
- H03K17/95—Proximity switches using a magnetic detector
- H03K17/9505—Constructional details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
- G01D5/14—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
- G01D5/20—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying inductance, e.g. by a movable armature
- G01D5/2006—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying inductance, e.g. by a movable armature by influencing the self-induction of one or more coils
- G01D5/2013—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying inductance, e.g. by a movable armature by influencing the self-induction of one or more coils by a movable ferromagnetic element, e.g. a core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/08—Magnetic details
- H05K2201/083—Magnetic materials
- H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Switches That Are Operated By Magnetic Or Electric Fields (AREA)
Abstract
Induktiver Sensor mit wenigstens einer auf einem Schaltungsträger (16; 116) angeordneten Leiterbahn (14), die wenigstens eine Spule (12; 112) bildet sowie mit einem der Spule (12; 112) zugeordnetem Spulenkern (18; 118), dadurch gekennzeichnet, dass der Schaltungsträger (16; 116) als ebene Leiterplatte (16; 116) ausgebildet ist und wenigstens einen Durchbruch (28; 128.1, 128.2, 128.3) aufweist, der von dem Spulenkern (18; 118) durchsetzt ist und der Spulenkern (18) eine U-Form oder eine Halbtoroidform aufweist.inductive Sensor with at least one on a circuit carrier (16; 116) arranged conductor track (14), the at least one coil (12; 112) and one of the coil (12; 112) associated with the coil core (18; 118), characterized in that the circuit carrier (16; 116) is designed as a planar printed circuit board (16, 116) and at least has a breakthrough (28; 128.1, 128.2, 128.3), which differs from the Spool core (18, 118) is interspersed and the spool core (18) a U-shape or a Halbtoroidform has.
Description
Die Erfindung betrifft einen induktiven Sensor gemäß dem Oberbegriff des Anspruchs 1.The The invention relates to an inductive sensor according to the preamble of the claim 1.
Ein solcher induktiver Näherungssensor weist in der Regel einen LC-Schwingkreis, einen Signalauswerter und einen Schaltverstärker auf. Die Spule dieses Schwingkreises erzeugt ein hochfrequentes, elektromagnetisches Wechselfeld. Dieses Feld tritt an der aktiven Fläche des Sensors aus. Nähert sich ein bedämpfendes Material der aktiven Fläche, so werden bei Nichteisenmetallen Wirbelströme erzeugt. Bei ferromagnetischen Metallen entstehen zusätzlich Ummagnetisierungsverluste. Diese Verluste entziehen dem Schwingkreis Energie und dämpfen die Schwingung. Die Dämpfung des Schwingkreises bewirkt eine Veränderung des Oszillatorstroms. Der Signalauswerter erkennt diese Veränderung und setzt dies in ein Schaltsignal um.One such inductive proximity sensor has usually an LC resonant circuit, a signal evaluator and a switching amplifier on. The coil of this resonant circuit generates a high-frequency, electromagnetic alternating field. This field occurs at the active area of the sensor. approaches a dampening one Material of the active surface, Thus, eddy currents are generated in non-ferrous metals. For ferromagnetic In addition, metals are created Hysteresis losses. These losses escape the resonant circuit Energy and steam the vibration. The damping of the resonant circuit causes a change in the oscillator current. The signal evaluator recognizes this change and puts this into action Switching signal to.
Aus
der
Die
Ausgehend von diesem Stand der Technik ist es Aufgabe der Erfindung, einen Sensor der eingangs genannten Art bereitzustellen, der insbesondere einfacher, in weniger Arbeitsschritten und damit kostengünstiger herzustellen ist und der eine kleinere Bauform ermöglicht.outgoing From this prior art, it is an object of the invention to provide a To provide sensor of the type mentioned, in particular easier, in fewer steps and thus more cost-effective is to produce and allows a smaller design.
Diese Aufgabe wird gelöst durch einen Sensor mit den Merkmalen des Anspruchs 1 sowie ein Herstellverfahren mit den Merkmalen der Ansprüche 9 oder 10.These Task is solved by a sensor having the features of claim 1 and a manufacturing method with the features of claims 9 or 10.
Erfindungsgemäß weist der induktive Sensor wenigstens eine auf einem Schaltungsträger angeordnete Leiterbahn auf, die wenigstens eine Spule bildet und einen der Spule zugeordnetem Spulenkern, wobei der Schaltungsträger als ebene Leiterplatte ausgebildet ist und wenigstens einen Durchbruch aufweist, der von dem Spulenkern durchsetzt ist.According to the invention the inductive sensor at least one arranged on a circuit carrier Track on which forms at least one coil and one of the coil associated coil core, wherein the circuit carrier as a flat circuit board is formed and has at least one breakthrough of the spool core is interspersed.
In dieser neuen Anordnung kann auf eine dreidimensionale Ausbildung des Schaltungsträgers verzichtet werden, wodurch erheblich Bauraum gewonnen wird. Außerdem ist ein ebener Schaltungsträger, also eine Leiterplatte, eine Standard-Handelsware und dementsprechend kostengünstig in der Anschaffung und in der Handhabung.In This new arrangement can be applied to a three-dimensional training of the circuit board omitted become, whereby considerable space is gained. Besides that is a planar circuit carrier, So a printed circuit board, a standard commodity and therefore inexpensive in the acquisition and handling.
Um den Spulenkern definiert der Spule zuzuordnen, ist ein Durchbruch in dem Schaltungsträger vorgesehen, der von dem Spulenkern durchsetzt ist. Damit ist eine sehr einfache und kostengünstige Zuordnung geschaffen und die bisherige Trennung von Spulenkern und der sonstigen auf dem Schaltungsträger angeordneten Elektronik aufgehoben, so dass eine automatisierte, kostengünstige Fertigung des kompletten Sensors möglich ist.Around Assigning the bobbin to the bobbin is a breakthrough provided in the circuit carrier, which is interspersed by the coil core. This is a very simple one and cost-effective Allocation created and the previous separation of coil core and the other arranged on the circuit board electronics lifted, allowing an automated, cost-effective production of the complete Sensors possible is.
Um den Spulenkern einfach in den Durchbruch einbringen zu können und das Magnetfeld des Sensors nach außen richten zu können, weist der Spulenkern eine U-Form oder eine Halbtoroidform auf.Around the coil core can easily bring in the breakthrough and to be able to direct the magnetic field of the sensor to the outside, has the coil core on a U-shape or a Halbtoroidform.
Damit der Spulenkern fest und unverrückbar in dem Durchbruch gehalten ist, ist in Weiterbildung der Erfindung vorgesehen, dass der Spulenkern über einen Klemmsitz gehalten ist, wozu der Durchbruch bevorzugt Klemmnasen oder dergleichen aufweist.In order to the bobbin firm and immovable in the breakthrough is in development of the invention provided that the coil core over a Clamping is held, including the breakthrough prefers clamping lugs or the like.
Je nachdem in welcher Anwendung der Sensor eingesetzt werden soll, kann es wünschenswert sein, ein speziell geformtes Magnetfeld des Sensors zu erhalten, so dass der Spulenkern mehrschenklig ausgebildet sein kann, um einen gewünschten Verlauf des Magnetfeldes zu erreichen. Über den Verlauf des Magnetfeldes lässt sich beispielsweise der Schaltabstand des Sensors beeinflussen.ever according to which application the sensor should be used, it may be desirable to obtain a specially shaped magnetic field of the sensor, so that the spool core can be designed multi-legged to a desired Course of the magnetic field to achieve. About the course of the magnetic field let yourself For example, affect the switching distance of the sensor.
Wenn der Spulenkern mehrschenklig ausgebildet ist, können vorteilhafterweise in dem Schaltungsträger mehrere Durchbrüche vorgesehen sein.If the spool core is formed mehrschenklig, can advantageously in the circuit carrier several breakthroughs be provided.
Zum Schutz von Schaltungsträger und Spulenkern sollte bevorzugt ein Gehäuse vorgesehen sein, in dem diese gehalten sind.To the Protection of circuit carriers and spool core should preferably be provided a housing in which these are held.
Für eine kostengünstige Massenfertigung ist das Gehäuse in Spritzgusstechnik hersteilbar.For a cost-effective mass production is the case can be produced by injection molding.
In Weiterbildung der Erfindung kann der Spulenkern aus einem Kunststoff bestehen, der weichmagnetische Eigenschaften besitzt. Daraus ergäbe sich die besonders vorteilhafte Möglichkeit, auch den Spulenkern in Spritzgusstechnik herzustellen und in den Durchbruch einzuspritzen, was in Massenfertigung weitere Kostenersparnis ergibt.In a further development of the invention, the coil core may consist of a plastic which has soft magnetic properties. This would result in the particularly advantageous possibility to produce the spool core in injection molding and injecting into the breakthrough, resulting in Massenferti additional cost savings.
Verfahrenstechnisch wird die Aufgabe gelöst durch ein Verfahren zur Herstellung eines solchen Sensors, bei dem in einem ersten Verfahrensschritt ein ebener Schaltungsträger mit aus einer Leiterbahn bestehenden Spule und mit einem Durchbruch bereitgestellt wird und dann in den Durchbruch der Spulenkern eingebracht und fixiert wird und schließlich der komplette Schaltungsträger in einem Gehäuse angeordnet wird.process engineering the task is solved by a method for producing such a sensor, wherein in a first process step with a planar circuit carrier from a conductor existing coil and with a breakthrough is provided and then introduced into the breakthrough of the coil core and is fixed and finally the complete circuit carrier arranged in a housing becomes.
In einem alternativen Verfahren wird in einem ersten Verfahrensschritt zunächst wiederum der ebene Schaltungsträger mit aus einer Leiterbahn bestehenden Spule und Durchbruch bereitgestellt und dann jedoch der Spulenkern in Spritzgusstechnik aus einem ersten Kunststoff, der weichmagnetische Eigenschaften besitzt, hergestellt und in dem gleichen Spritzprozess das Gehäuse aus einem zweiten Kunststoff hergestellt wird. Es handelt sich hier also um eine an sich bekannte Zweikomponenten-Spritztechnik, wodurch der Herstellaufwand weiter reduziert werden kann, da zur Herstellung des Sensors lediglich der Schaltungsträger zu bestücken ist und danach in nur einem Spritzprozess der Spulenkern und das Gehäuse herstellbar sind.In an alternative method is used in a first method step first in turn, the planar circuit carrier provided with a conductor track coil and breakthrough and then, however, the spool core in injection molding from a first Plastic having soft magnetic properties produced and in the same injection process, the housing of a second plastic will be produced. It is therefore a known per se Two-component injection technique, whereby the production costs continue can be reduced, as for the production of the sensor only the circuit carrier to equip is and then in just one injection process of the bobbin and the casing can be produced.
Im Folgenden wird die Erfindung anhand von Ausführungsbeispielen unter Bezugnahme auf die Zeichnung im Einzelnen erläutert. In der Zeichnung zeigen:in the The invention will be described below with reference to exemplary embodiments explained in detail on the drawing. In the drawing show:
Eine
erste Ausführungsform
eines in
Die
Spule
Des
Weiteren weist der Sensor
Sämtliche
Komponenten des Sensors
In
dem ersten Ausführungsbeispiel
(
Der
Spulenkern
In
einem zweiten Ausführungsbeispiel
Zur
Anordnung eines derartigen Spulenkerns
Die
restliche Elektronik, also insbesondere die Auswerteschaltung
Sämtliche
Elemente des Sensors
Weitere Ausführungsformen mit anderen Anordnungen von Spulenkernen, Leiterbahnen, Spulen und Durchbrüchen sind im Rahmen der Erfindung möglich.Further embodiments with other arrangements of coil cores, tracks, coils and breakthroughs are possible within the scope of the invention.
Der
erfindungsgemäße Sensor
lässt sich
auf erfindungsgemäße Art wie
folgt herstellen:
In einer ersten Herstellungsvariante wird
zunächst ein
PCB bereitgestellt, auf dem die notwendigen elektronischen Komponenten
und insbesondere die die Spule oder Spulen bildende Leiterbahn sowie
der bzw. die Durchbrüche
vorgesehen sind. In einem weiteren Schritt wird der Spulenkern in
den Durchbruch eingeführt
und gegebenenfalls mechanisch fixiert, beispielsweise mittels der
oben beschriebenen Klemmnasen. Schließlich wird das PCB mit allen elektronischen
Komponenten und dem Spulenkern in ein Gehäuse eingesetzt. Das Gehäuse kann
auch um die genannten Sensorelemente gespritzt werden. Dann könnte die
Spritzgussmasse den Spulenkern in dem Durchbruch fixieren. Eine
gesonderte mechanische Fixierung über Klemmnasen oder dergleichen wären nicht
notwendig.The sensor according to the invention can be produced according to the invention as follows:
In a first production variant, a PCB is initially provided on which the necessary electronic components and in particular the conductor track forming the coil or coils as well as the opening (s) are provided. In a further step, the spool core is inserted into the opening and optionally mechanically fixed, for example by means of the clamping noses described above. Finally, the PCB with all electronic components and the coil core is inserted into a housing. The housing can also be injected around the mentioned sensor elements. Then the injection molding compound could fix the spool core in the opening. A separate mechanical fixation via clamping lugs or the like would not be necessary.
In einer zweiten Herstellungsvariante wird zunächst ebenfalls das PCB mit den elektronischen Komponenten bestückt und mit der die Spule bzw. Spulen bildenden Leiterbahn bzw. Leiterbahnen versehen und bereitgestellt. Dann wird in einem ersten Spritzgussschritt der Spulenkern aus einem weichmagnetischen Kunststoff gespritzt. Ein weichmagnetischer Kunststoff kann beispielsweise gebildet sein durch ein mit einem magnetisierbaren Material, beispielsweise ein Ferritpulver, durchsetztem Kunststoff. Der Durchbruch könnte dann relativ klein gehalten sein, beispielsweise geringfügig kleiner als die Querschnittsabmessungen des Spulenkerns, so dass der fertig gespritzte Spulenkern selbsttätig in dem Durchbruch gehalten ist. In einem zweiten Spritzgussschritt wird das Gehäuse aus einem anderen, also nicht weichmagnetischen Kunststoff gespritzt. Eine solche Spritzgusstechnik ist auch als Zweikomponenten-Spritzgusstechnik bekannt.In In a second production variant, the PCB is also initially included equipped with the electronic components and with the coil or coils provided and provided forming conductor track or conductor tracks. Then, in a first injection molding step, the spool core is made of a soft magnetic plastic sprayed. A soft magnetic plastic For example, it may be formed by a magnetizable one Material, such as a ferrite powder, interspersed plastic. The breakthrough could then be kept relatively small, for example, slightly smaller than the cross-sectional dimensions of the bobbin, so that the finished sprayed coil core automatically held in the breakthrough. In a second injection molding step becomes the case from another, so not injected soft magnetic plastic. Such an injection molding technique is also known as a two-component injection molding technique known.
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2003155003 DE10355003B4 (en) | 2003-11-25 | 2003-11-25 | Inductive sensor and method for its production |
CH19172004A CH697267B1 (en) | 2003-11-25 | 2004-11-22 | Inductive sensor and method for its production. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2003155003 DE10355003B4 (en) | 2003-11-25 | 2003-11-25 | Inductive sensor and method for its production |
Publications (2)
Publication Number | Publication Date |
---|---|
DE10355003A1 DE10355003A1 (en) | 2005-06-23 |
DE10355003B4 true DE10355003B4 (en) | 2008-01-31 |
Family
ID=34609259
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE2003155003 Expired - Fee Related DE10355003B4 (en) | 2003-11-25 | 2003-11-25 | Inductive sensor and method for its production |
Country Status (2)
Country | Link |
---|---|
CH (1) | CH697267B1 (en) |
DE (1) | DE10355003B4 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2241860A2 (en) | 2009-04-17 | 2010-10-20 | BALLUFF GmbH | Inductive sensor module and inductive proximity sensor |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE529127C2 (en) * | 2005-09-02 | 2007-05-08 | Delaval Holding Ab | Detection arrangement and method of magnetic gripping device |
DE102012216101B4 (en) | 2012-09-12 | 2016-03-24 | Festo Ag & Co. Kg | Method for producing a coil integrated in a substrate, method for producing a multilayer printed circuit board and electronic device |
DE102012220022B4 (en) | 2012-11-02 | 2014-09-25 | Festo Ag & Co. Kg | Method of manufacturing a coil and electronic device |
DE102013104001B3 (en) * | 2013-04-19 | 2014-10-16 | Trw Automotive Electronics & Components Gmbh | Proximity sensor and module |
FI20165494A (en) * | 2016-06-14 | 2017-12-15 | Lappeenrannan Teknillinen Yliopisto | POSITION SENSOR |
DE102016211004A1 (en) | 2016-06-21 | 2017-12-21 | Zf Friedrichshafen Ag | Method for producing a sensor system with two inductive sensors |
DE102016114979B4 (en) * | 2016-08-12 | 2019-09-26 | Sick Ag | Sensor with insulating sleeve |
DE102017002464B4 (en) * | 2017-03-15 | 2024-06-13 | Brüel & Kjaer Vibro GmbH | Position measuring chain |
Citations (6)
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---|---|---|---|---|
DE3619226A1 (en) * | 1985-12-10 | 1987-06-11 | Robotron Veb K | Wiring support |
DE19640676A1 (en) * | 1996-04-04 | 1997-10-09 | Bosch Gmbh Robert | Production of micro-coils used as sensor in nozzle arrangements |
DE20001648U1 (en) * | 2000-01-31 | 2000-03-23 | Sick Ag | Device with a coil arrangement and inductive sensor arrangement with such a device |
DE19919031C2 (en) * | 1999-04-27 | 2001-05-10 | Bosch Gmbh Robert | Magnetoelastic sensor and method for its production |
US6486796B2 (en) * | 2000-07-13 | 2002-11-26 | Mitutoyo Corporation | Relative-displacement detecting unit |
DE10139707A1 (en) * | 2001-08-11 | 2003-02-20 | Philips Corp Intellectual Pty | circuit board |
-
2003
- 2003-11-25 DE DE2003155003 patent/DE10355003B4/en not_active Expired - Fee Related
-
2004
- 2004-11-22 CH CH19172004A patent/CH697267B1/en not_active IP Right Cessation
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3619226A1 (en) * | 1985-12-10 | 1987-06-11 | Robotron Veb K | Wiring support |
DE19640676A1 (en) * | 1996-04-04 | 1997-10-09 | Bosch Gmbh Robert | Production of micro-coils used as sensor in nozzle arrangements |
DE19919031C2 (en) * | 1999-04-27 | 2001-05-10 | Bosch Gmbh Robert | Magnetoelastic sensor and method for its production |
DE20001648U1 (en) * | 2000-01-31 | 2000-03-23 | Sick Ag | Device with a coil arrangement and inductive sensor arrangement with such a device |
US6486796B2 (en) * | 2000-07-13 | 2002-11-26 | Mitutoyo Corporation | Relative-displacement detecting unit |
DE10139707A1 (en) * | 2001-08-11 | 2003-02-20 | Philips Corp Intellectual Pty | circuit board |
Non-Patent Citations (1)
Title |
---|
Passeraub, Ph. A. et al.: Inductive proximity sensor with a flat coil and a new differential relaxation oxcillator.In: Sensors and Actuators A 60, 1997, S. 122-126 * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2241860A2 (en) | 2009-04-17 | 2010-10-20 | BALLUFF GmbH | Inductive sensor module and inductive proximity sensor |
DE102009018644A1 (en) * | 2009-04-17 | 2010-10-21 | Balluff Gmbh | Inductive sensor module and inductive proximity sensor |
DE102009018644B4 (en) | 2009-04-17 | 2023-06-22 | Balluff Gmbh | Inductive sensor module and inductive proximity sensor |
Also Published As
Publication number | Publication date |
---|---|
CH697267B1 (en) | 2008-07-31 |
DE10355003A1 (en) | 2005-06-23 |
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