DE10350648A1 - transponder - Google Patents
transponder Download PDFInfo
- Publication number
- DE10350648A1 DE10350648A1 DE2003150648 DE10350648A DE10350648A1 DE 10350648 A1 DE10350648 A1 DE 10350648A1 DE 2003150648 DE2003150648 DE 2003150648 DE 10350648 A DE10350648 A DE 10350648A DE 10350648 A1 DE10350648 A1 DE 10350648A1
- Authority
- DE
- Germany
- Prior art keywords
- substrate
- wetting
- vacuum system
- vacuum
- data storage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
- H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Computer Hardware Design (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Credit Cards Or The Like (AREA)
- Radar Systems Or Details Thereof (AREA)
Abstract
Bei einem Verfahren zur Herstellung eines Transponders mit zumindest einer Antenne und zumindest einer auslesbaren Datenspeicherstruktur wird die vorgesehene Umrißgestalt der Antenne in einer Vakuumanlage mittels einer Walze auf ein Substrat durch Benetzung des umliegenden Bereichs aufgezeichnet und nachfolgend das Substrat einem Materialstrom ausgesetzt, wobei sich dieses Material auf dem unbenetzten Bereich niederschlägt (Fig. 1).In a method for producing a transponder with at least one antenna and at least one readable data storage structure, the intended outline shape of the antenna is recorded in a vacuum system by means of a roller on a substrate by wetting the surrounding area and subsequently exposing the substrate to a material flow, this material being deposited on precipitates the unwetted area (Figure 1).
Description
Die Erfindung betrifft ein Verfahren zur Herstellung eines Transponders nach dem Oberbegriff des Anspruchs 1.The The invention relates to a method for producing a transponder according to the preamble of claim 1.
Transponder umfassen einen Datenspeicher und eine Übertragungseinrichtung, welche die Möglichkeit eröffnet, gespeicherte Daten von einem Empfänger auslesen zu lassen. In der Regel umfasst der Empfänger die Spannungsquelle, so dass der Transponder sehr klein und leicht gehalten werden kann. Für die gewünschte Durchsetzung zukünftiger Großserienanwendungen, etwa bei der Verwendung in Produktetiketten, um beispielsweise Haltbarkeitsdaten oder Identifizierungen auszulesen, ist eine billige Massenfertigung von Transpondern unabdingbare Voraussetzung.transponder comprise a data memory and a transmission device, which the possibility opened, to read stored data from a receiver. In usually includes the recipient the voltage source, making the transponder very small and light can be held. For the desired Enforcement of future High-volume applications, for example, when used in product labels, for example, shelf life data or read out identifications is a cheap mass production of transponders indispensable requirement.
Es
ist bekannt, metallische Leiterbahnen auf dünnen Substraten unterschiedlicher
Konsistenz, etwa Kunststoffolien oder Papier, aufzubringen. Die
Der Erfindung liegt die Aufgabe zugrunde, eine möglichst kostengünstige Massenherstellung von auf flexiblen Substraten aufbauenden Transpondern und/oder integrierter Schaltkreise zu ermöglichen.Of the Invention is the object of a cost-effective mass production of on flexible substrates building transponders and / or integrated To enable circuits.
Die Erfindung löst dieses Problem durch ein Verfahren mit den Merkmalen des Anspruchs 1 bzw. 3. Hinsichtlich vorteilhafter Ausgestaltungen der Erfindung wird auf die weiteren Ansprüche 2 und 4 bis 11 verwiesen.The Invention solves this problem by a method having the features of the claim 1 and 3. With regard to advantageous embodiments of the invention will affect the other claims 2 and 4 to 11 referenced.
Mit dem erfindungsgemäßen Verfahren kann in einer einzigen Anlage sowohl das Aufzeichnen der gewünschten Strukturen der Antenne und/oder des integrierten Schaltkreises durch deren Bildung auf dem Substrat durch entsprechenden Materialauftrag erreicht werden. Die Herstellung ist damit erheblich vereinfacht und beschleunigt.With the method according to the invention can record both the desired Structures of the antenna and / or the integrated circuit by their formation on the substrate achieved by appropriate application of material become. The production is thus considerably simplified and accelerated.
Insbesondere wenn der Materialstrom, der die Struktur der Antenne und/oder einer Lage des integrierten Schaltkreises bilden soll, durch Bedampfung oder Sputtern erzeugt wird, kann das Verfahren serientechnisch in Vakuumanlagen betrieben werden, wobei die Herstellung gleichzeitig in derselben Vakuumanlage erfolgen kann.Especially if the material flow, the structure of the antenna and / or a Location of the integrated circuit should form, by evaporation or sputtering is generated, the method can be used in series technology Vacuum systems are operated, the production being simultaneous can be done in the same vacuum system.
Der Aufwand der Vorbehandlung des Substrats ist minimiert, wenn für dieses eine Polyesterfolie oder auch eine vorbehandelte Polypropylen- Folie verwendet wird.Of the The cost of pretreatment of the substrate is minimized if for this a polyester film or a pretreated polypropylene film used becomes.
Die Strukturen können sehr genau gezeichnet werden, wenn zur Benetzung der Bereich, auf denen sich keine Material niederschlagen soll, ein im Vakuum gut verdampfendes Öl verwendet wird. Dabei muß im Unterschied zu einem Farbauftrag das Öl nicht abgewaschen oder anderweitig abgetragen werden, sondern dieses verdampft im Vakuum selbständig und erfordert somit keinen weiteren Bearbeitungsschritt. Durch die Dampfschicht ist gleichzeitig der Niederschlag an den zuvor mit Öl benetzten Bereichen verhindert.The Structures can be drawn very accurately when wetting the area on which should not precipitate any material, a good in a vacuum vaporizing oil is used. It must be in the Unlike a paint application, the oil is not washed off or otherwise be removed, but this vaporizes in a vacuum independently and thus requires no further processing step. Through the vapor layer is at the same time the precipitate on the previously wetted with oil Areas prevented.
Dabei kann für eine geschwindigkeitsoptimierte Herstellung das Substrat in der Vakuumanlage abgewickelt und nach Benetzen und Bedampfen in derselben Vakuumanlage aufgewickelt werden. Besonders vorteilhaft wird dabei das Substrat in der Vakuumanlage in einem kontinuierlichen Durchlauf bearbeitet.there can for a speed optimized production of the substrate in the Vacuum system unwound and after wetting and steaming in the same Vacuum system to be wound up. It is particularly advantageous the substrate in the vacuum plant in a continuous pass processed.
Zwischen der Benetzung eines Abschnitts des Substrats etwa mit dem genannten Öl und dessen Aussetzen eines Materialniederschlags vergeht weniger als eine halbe Sekunde, typisch nur etwa eine Zehntelsekunde, so dass der Herstellungsprozess eine sehr hohe Geschwindigkeit erreicht und sich ein für Massenproduktion geeigneter großer Ausstoß ergibt.Between the wetting of a portion of the substrate about with said oil and its Exposing a material precipitate takes less than half an hour Second, typically only about a tenth of a second, so that the manufacturing process Achieved a very high speed and become one for mass production suitable large output results.
Insbesondere für mehrschichtige Strukturen ist das Aufbringen von isolierenden Zwischenschichten über einen Atomizer vorteilhaft möglich.Especially for multi-layered Structures is the application of insulating interlayers over one Atomizer advantageous possible.
Weitere Vorteile und Merkmale der Erfindung ergeben sich aus einem nachfolgend beschriebenen und in der Zeichnung zumindest schematisiert dargestellten Ausführungsbeispiel des Gegenstandes der Erfindung.Further Advantages and features of the invention will become apparent from a below described and shown in the drawing at least schematically embodiment the subject of the invention.
In der Zeichnung zeigt:In the drawing shows:
Das
erfindungsgemäße Verfahren
kann insgesamt in einer zusammenhängenden Vakuumanlage
Das
für das
Verfahren vorgesehene Substrat
Die
so abgewickelte Folie, Papier oder anderes Substrat
Der
Kühlrolle
Die
Druckrolle
Die
das Substrat
Der Ölauftrag
durch die Rolle
Mit
dem geschilderten Verfahren läßt oder lassen
sich beispielsweise eine oder mehrere als Antenne dienende Induktionsschleife(n)
auf dem Substrat
Will
man hingegen neben der Antenne auch eine Datenspeicherstruktur als
integrierten Schaltkreis (IC) erfindungsgemäß anfertigen, kann man nach
dem Erstel len einer ersten Strukturlage in der oben geschilderten
Weise auf diese Lage anschließend
einen Isolator, etwa aus Acryl, aufbringen, etwa dadurch, dass der
Niederschlagseinrichtung
Um leitende Verbindungen zwischen den einzelnen Lagen herzustellen, kann beispielsweise die Acrylisolierung nur selektiv aufgebracht werden, so dass punktuell Kontakte bestehen, oder es können anschließend zum Beispiel mit einer Nadelwalze Einstiche erzeugt werden. Die Datenspeicherstrukturen, die so erzeugt werden, sind – anders als ein nachträglich aufgebrachter Chip – vergleichbar flach wie die Antenne.Around to make conductive connections between the individual layers, For example, the acrylic insulation can only be applied selectively so that there are contacts on a selective basis, or it can then to Example with a needle roller punctures are generated. The data storage structures, which are thus produced are - different as an afterthought applied chip - comparable flat as the antenna.
Sofern
die Lagen durch Polymerschichten erzeugt werden, bleibt die Flexibilität des Substrats
- 11
- Vakuumanlagevacuum system
- 22
- Substratsubstratum
- 33
- Vorratsrollesupply roll
- 44
- Umlenkrolleidler pulley
- 55
- Kühlrollechill roll
- 66
- Umlenkrolleidler pulley
- 77
- Aufnahmerolleup roll
- 88th
- Druckrollepressure roller
- 99
- Übertragungsrolletransfer roller
- 1010
- DosiereinrichungDosiereinrichung
- 1111
- Wirkbereicheffective range
- 1212
- NiederschlagseinrichtungPrecipitator
- 1313
- Materialmaterial
- 1414
- AtomizerAtomizer
Claims (11)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2003150648 DE10350648A1 (en) | 2003-10-29 | 2003-10-29 | transponder |
PCT/EP2004/012315 WO2005043965A2 (en) | 2003-10-29 | 2004-10-29 | Method for production of a transponder |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2003150648 DE10350648A1 (en) | 2003-10-29 | 2003-10-29 | transponder |
Publications (1)
Publication Number | Publication Date |
---|---|
DE10350648A1 true DE10350648A1 (en) | 2005-06-16 |
Family
ID=34529909
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE2003150648 Withdrawn DE10350648A1 (en) | 2003-10-29 | 2003-10-29 | transponder |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE10350648A1 (en) |
WO (1) | WO2005043965A2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005018984A1 (en) * | 2005-04-22 | 2006-11-02 | Steiner Gmbh & Co. Kg | Method and device for manufacturing electronic components |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3601040A1 (en) * | 1985-04-26 | 1986-10-30 | Messerschmitt-Bölkow-Blohm GmbH, 8012 Ottobrunn | Method for applying polarisation-selective structures to a reflector of a directional antenna |
GB2213167A (en) * | 1987-12-04 | 1989-08-09 | Nat Res Dev | Deposition of materials on to substrates |
WO2002031214A1 (en) * | 2000-10-09 | 2002-04-18 | Hueck Folien | Metallized film, method for the production thereof, and its use |
EP1291463A1 (en) * | 2001-09-05 | 2003-03-12 | Hueck Folien Gesellschaft m.b.H. | Process for producing a selectively metallized foil, and their products |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5978987A (en) * | 1982-10-29 | 1984-05-08 | マルイ工業株式会社 | Formation of pattern on metal coating |
US4832983A (en) * | 1987-03-05 | 1989-05-23 | Shizuki Electric Co., Inc. | Process for producing metallized plastic film |
US5059454A (en) * | 1989-04-26 | 1991-10-22 | Flex Products, Inc. | Method for making patterned thin film |
-
2003
- 2003-10-29 DE DE2003150648 patent/DE10350648A1/en not_active Withdrawn
-
2004
- 2004-10-29 WO PCT/EP2004/012315 patent/WO2005043965A2/en active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3601040A1 (en) * | 1985-04-26 | 1986-10-30 | Messerschmitt-Bölkow-Blohm GmbH, 8012 Ottobrunn | Method for applying polarisation-selective structures to a reflector of a directional antenna |
GB2213167A (en) * | 1987-12-04 | 1989-08-09 | Nat Res Dev | Deposition of materials on to substrates |
WO2002031214A1 (en) * | 2000-10-09 | 2002-04-18 | Hueck Folien | Metallized film, method for the production thereof, and its use |
EP1291463A1 (en) * | 2001-09-05 | 2003-03-12 | Hueck Folien Gesellschaft m.b.H. | Process for producing a selectively metallized foil, and their products |
Also Published As
Publication number | Publication date |
---|---|
WO2005043965A2 (en) | 2005-05-12 |
WO2005043965A3 (en) | 2005-06-30 |
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Legal Events
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---|---|---|---|
OP8 | Request for examination as to paragraph 44 patent law | ||
8130 | Withdrawal |