DE10346576A1 - layout measures - Google Patents

layout measures Download PDF

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Publication number
DE10346576A1
DE10346576A1 DE2003146576 DE10346576A DE10346576A1 DE 10346576 A1 DE10346576 A1 DE 10346576A1 DE 2003146576 DE2003146576 DE 2003146576 DE 10346576 A DE10346576 A DE 10346576A DE 10346576 A1 DE10346576 A1 DE 10346576A1
Authority
DE
Germany
Prior art keywords
region
area
component
micromechanical
micromechanical component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE2003146576
Other languages
German (de)
Inventor
Matthias Fuertsch
Heribert Weber
Detlef Gruen
Andreas Duell
Christoph Schelling
Klaus Eberle-Goubet
Joerg Baisch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE2003146576 priority Critical patent/DE10346576A1/en
Priority to PCT/DE2004/001954 priority patent/WO2005044720A1/en
Publication of DE10346576A1 publication Critical patent/DE10346576A1/en
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0067—Mechanical properties
    • B81B3/0072—For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)

Abstract

Die Erfindung beschreibt ein mikromechanisches Bauelement bzw. ein Verfahren zur Herstellung eines mikromechanischen Bauelements, welches wenigstens einen ersten, einen zweiten und einen dritten Bereich aufweist. Der erste und der zweite Bereich des mikromechanischen Bauelements weisen dabei vorteilhafterweise den gleichen Schichtaufbau auf. Zwischen dem ersten und dem zweiten Bereich ist der dritte Bereich angeordnet. Während der Nutzung des mikromechanischen Bauelements beispielsweise als Halterung eines Sensorelements können auf dem Bauelement Risse entstehen. Diese Risse können sich unter ungünstigen Umständen auf der Oberfläche des mikromechanischen Bauelements vergrößern bzw. ausbreiten. Beim Aufbau der drei Bereiche ist dabei vorgesehen, dass der dritte Bereich im Vergleich zu dem ersten und/oder zweiten Bereich höhere Anfälligkeit der Rissausbreitung aufweist. Erfindungsgemäß sind der dritte Bereich und die beiden anderen Bereiche derart gestaltet, dass die Rissausbreitung vorzugsweise im dritten Bereich an vorgebbaren Positionen auf dem Bauelement gestoppt wird.The invention describes a micromechanical component or a method for producing a micromechanical component which has at least a first, a second and a third region. The first and the second region of the micromechanical component advantageously have the same layer structure. Between the first and the second area, the third area is arranged. During the use of the micromechanical component, for example as a holder of a sensor element, cracks can be produced on the component. These cracks can increase or spread under unfavorable circumstances on the surface of the micromechanical device. In the construction of the three areas, it is provided that the third area has a higher susceptibility to crack propagation compared to the first and / or second area. According to the invention, the third region and the two other regions are designed such that the crack propagation is preferably stopped in the third region at predeterminable positions on the component.

DE2003146576 2003-10-07 2003-10-07 layout measures Ceased DE10346576A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE2003146576 DE10346576A1 (en) 2003-10-07 2003-10-07 layout measures
PCT/DE2004/001954 WO2005044720A1 (en) 2003-10-07 2004-09-03 Layout measures for limiting the propagation of surface cracks in mems

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2003146576 DE10346576A1 (en) 2003-10-07 2003-10-07 layout measures

Publications (1)

Publication Number Publication Date
DE10346576A1 true DE10346576A1 (en) 2005-05-04

Family

ID=34399340

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2003146576 Ceased DE10346576A1 (en) 2003-10-07 2003-10-07 layout measures

Country Status (2)

Country Link
DE (1) DE10346576A1 (en)
WO (1) WO2005044720A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012217404A1 (en) * 2012-09-26 2013-05-16 Siemens Aktiengesellschaft Measuring transducer for process instrumentation, has sensor for detecting physical or chemical dimension and for generating measuring signal, where sensor has sensor element, which is arranged on substrate
DE102012109325A1 (en) * 2012-10-01 2014-05-15 Endress + Hauser Gmbh + Co. Kg Pressure sensor with cover layer

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9102514B2 (en) 2013-03-22 2015-08-11 Freescale Semiconductor, Inc Inhibiting propagation of surface cracks in a MEMS Device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4906840A (en) * 1988-01-27 1990-03-06 The Board Of Trustees Of Leland Stanford Jr., University Integrated scanning tunneling microscope
US5345213A (en) * 1992-10-26 1994-09-06 The United States Of America, As Represented By The Secretary Of Commerce Temperature-controlled, micromachined arrays for chemical sensor fabrication and operation
ATE269588T1 (en) * 1993-02-04 2004-07-15 Cornell Res Foundation Inc MICROSTRUCTURES AND SINGLE MASK, SINGLE CRYSTAL PRODUCTION PROCESS

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012217404A1 (en) * 2012-09-26 2013-05-16 Siemens Aktiengesellschaft Measuring transducer for process instrumentation, has sensor for detecting physical or chemical dimension and for generating measuring signal, where sensor has sensor element, which is arranged on substrate
DE102012109325A1 (en) * 2012-10-01 2014-05-15 Endress + Hauser Gmbh + Co. Kg Pressure sensor with cover layer
US9689766B2 (en) 2012-10-01 2017-06-27 Endress + Hauser Gmbh + Co. Kg Pressure sensor with cover layer

Also Published As

Publication number Publication date
WO2005044720A1 (en) 2005-05-19

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8110 Request for examination paragraph 44
R002 Refusal decision in examination/registration proceedings
R003 Refusal decision now final

Effective date: 20120224