DE10345768A1 - Anschlussmittel und Verfahren zum Kontaktieren des Anschlussmittels - Google Patents

Anschlussmittel und Verfahren zum Kontaktieren des Anschlussmittels Download PDF

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Publication number
DE10345768A1
DE10345768A1 DE2003145768 DE10345768A DE10345768A1 DE 10345768 A1 DE10345768 A1 DE 10345768A1 DE 2003145768 DE2003145768 DE 2003145768 DE 10345768 A DE10345768 A DE 10345768A DE 10345768 A1 DE10345768 A1 DE 10345768A1
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DE
Germany
Prior art keywords
terminal device
hollow body
electrically insulating
mantle
thermally conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE2003145768
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English (en)
Other versions
DE10345768B4 (de
Inventor
Rainer Kreutzer
Karl-Heinz Schaller
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Siemens AG
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Siemens AG
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Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE2003145768 priority Critical patent/DE10345768B4/de
Publication of DE10345768A1 publication Critical patent/DE10345768A1/de
Application granted granted Critical
Publication of DE10345768B4 publication Critical patent/DE10345768B4/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)

Abstract

Um ein Anschlussmittel (1a, 1b) zu schaffen, das zur einfachen Kontaktierung von Kontaktflächen (6, 7) eines Halbleiters (2a, 2b) geeignet ist und eine effiziente thermische Leitfähigkeit aufweist, ist ein mit einer Innenmantelfläche (3), mit einer Außenmantelfläche (4) und mit zwei Stirnflächen (5, 6) versehener Hohlkörper aus einem elektrisch isolierenden und thermisch leitenden Basismaterial vorgesehen, wobei der Hohlkörper zum einen an seiner Innenmantelfläche (3) und an seiner Außenmantelfläche (4) jeweils mit einer elektrisch leitenden Struktur versehen ist und zum anderen an seiner ersten und an seiner zweiten Stirnfläche (5, 6) das Basismaterial aufweist, wobei der Hohlkörper an zumindest einer seiner beiden Stirnflächen (5, 6) durch Größe und Form einer mittels eines Isolationselements (9) voneinander getrennten inneren und/oder äußeren Kontaktfläche (7 und/oder 8) des anschließbaren Halbleiters (2a, 2b) definiert ist.
DE2003145768 2003-10-01 2003-10-01 Anschlussmittel und Verfahren zum Kontaktieren des Anschlussmittels Expired - Fee Related DE10345768B4 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE2003145768 DE10345768B4 (de) 2003-10-01 2003-10-01 Anschlussmittel und Verfahren zum Kontaktieren des Anschlussmittels

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2003145768 DE10345768B4 (de) 2003-10-01 2003-10-01 Anschlussmittel und Verfahren zum Kontaktieren des Anschlussmittels

Publications (2)

Publication Number Publication Date
DE10345768A1 true DE10345768A1 (de) 2005-05-04
DE10345768B4 DE10345768B4 (de) 2006-07-27

Family

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Family Applications (1)

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DE2003145768 Expired - Fee Related DE10345768B4 (de) 2003-10-01 2003-10-01 Anschlussmittel und Verfahren zum Kontaktieren des Anschlussmittels

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2194577A1 (de) * 2008-12-03 2010-06-09 LS Industrial Systems Co., Ltd Leistungshalbleitermodul
US7995356B2 (en) 2005-08-26 2011-08-09 Siemens Aktiengesellschaft Power semiconductor module comprising load connection elements applied to circuit carriers
DE102015121680B4 (de) 2015-01-08 2022-01-27 Infineon Technologies Ag Leistungshalbleitermodul, das eine flexible leiterplattenverbindung mit einer niedrigen gate-treiberinduktivität aufweist und verfahren zum herstellen

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19704930A1 (de) * 1996-02-12 1997-09-25 Zierick Mfg Corp An der Oberfläche zu befestigende Verbinder, die die Kapillarwirkung fördern
DE10045534A1 (de) * 2000-09-13 2002-04-04 Infineon Technologies Ag Elektronisches Bauteil mit Außenanschlußelementen

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10200372A1 (de) * 2002-01-08 2003-07-24 Siemens Ag Leistungshalbleitermodul

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19704930A1 (de) * 1996-02-12 1997-09-25 Zierick Mfg Corp An der Oberfläche zu befestigende Verbinder, die die Kapillarwirkung fördern
DE10045534A1 (de) * 2000-09-13 2002-04-04 Infineon Technologies Ag Elektronisches Bauteil mit Außenanschlußelementen

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7995356B2 (en) 2005-08-26 2011-08-09 Siemens Aktiengesellschaft Power semiconductor module comprising load connection elements applied to circuit carriers
DE112005003653B4 (de) * 2005-08-26 2013-05-16 Siemens Aktiengesellschaft Leistungshalbleitermodul mit auf Schaltungsträger aufgebrachten Lastanschlusselementen und Anschlussklemmelementen
EP2194577A1 (de) * 2008-12-03 2010-06-09 LS Industrial Systems Co., Ltd Leistungshalbleitermodul
US8223506B2 (en) 2008-12-03 2012-07-17 Ls Industrial Systems Co., Ltd. Power semiconductor module
DE102015121680B4 (de) 2015-01-08 2022-01-27 Infineon Technologies Ag Leistungshalbleitermodul, das eine flexible leiterplattenverbindung mit einer niedrigen gate-treiberinduktivität aufweist und verfahren zum herstellen

Also Published As

Publication number Publication date
DE10345768B4 (de) 2006-07-27

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OP8 Request for examination as to paragraph 44 patent law
8364 No opposition during term of opposition
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee

Effective date: 20140501