DE10344454A1 - Klebstoffauftragevorrichtung für flexible bandartige Trägersubstrate - Google Patents

Klebstoffauftragevorrichtung für flexible bandartige Trägersubstrate Download PDF

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Publication number
DE10344454A1
DE10344454A1 DE10344454A DE10344454A DE10344454A1 DE 10344454 A1 DE10344454 A1 DE 10344454A1 DE 10344454 A DE10344454 A DE 10344454A DE 10344454 A DE10344454 A DE 10344454A DE 10344454 A1 DE10344454 A1 DE 10344454A1
Authority
DE
Germany
Prior art keywords
adhesive
straightedge
areas
elements
substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE10344454A
Other languages
English (en)
Other versions
DE10344454B4 (de
Inventor
Matthias Kloos
Hans-Peter Monser
Gunter Fischenich
Sven Hochmann
Dieter Bergmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Muehlbauer GmbH and Co KG
Original Assignee
Muehlbauer GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Muehlbauer GmbH and Co KG filed Critical Muehlbauer GmbH and Co KG
Priority to DE10344454A priority Critical patent/DE10344454B4/de
Publication of DE10344454A1 publication Critical patent/DE10344454A1/de
Application granted granted Critical
Publication of DE10344454B4 publication Critical patent/DE10344454B4/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29199—Material of the matrix
    • H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Abstract

Die Erfindung betrifft eine Klebstoffauftragevorrichtung zum stellenweisen Auftragen von Klebstoff auf eine Oberfläche (11a) eines flexiblen bandartigen Trägersubstrates (11) für Mikrochipmodule mittels einer Klebstoffzuführeinrichtung (5), wobei mindestens zwei linealartige Elemente (8, 9) zum flächenmäßigen Verstreichen des der Oberfläche (11) zugeführten Klebstoffes parallel zur Oberfläche (11a) des Trägersubstrats (11) ober- und/oder innerhalb einer schablonenartigen Einrichtung (10) verschiebbar angeordnet sind.
DE10344454A 2003-09-25 2003-09-25 Klebstoffauftragevorrichtung für flexible bandartige Trägersubstrate Expired - Fee Related DE10344454B4 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE10344454A DE10344454B4 (de) 2003-09-25 2003-09-25 Klebstoffauftragevorrichtung für flexible bandartige Trägersubstrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10344454A DE10344454B4 (de) 2003-09-25 2003-09-25 Klebstoffauftragevorrichtung für flexible bandartige Trägersubstrate

Publications (2)

Publication Number Publication Date
DE10344454A1 true DE10344454A1 (de) 2005-05-04
DE10344454B4 DE10344454B4 (de) 2006-04-27

Family

ID=34398934

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10344454A Expired - Fee Related DE10344454B4 (de) 2003-09-25 2003-09-25 Klebstoffauftragevorrichtung für flexible bandartige Trägersubstrate

Country Status (1)

Country Link
DE (1) DE10344454B4 (de)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3823200C1 (de) * 1988-07-08 1990-03-08 Gerhard 4800 Bielefeld De Klemm
DE4139357A1 (de) * 1991-11-29 1993-06-03 Vdo Schindling Vorrichtung zum aufbringen von lotpaste auf leiterplatten
DE29509412U1 (de) * 1995-06-08 1995-11-09 Siemens Ag Rakel zum Aufbringen von Lotpaste auf Leiterplatten
US5971227A (en) * 1995-11-22 1999-10-26 Speedline Technologies, Inc. Liquid dispensing system with improved sealing augering screw and method for dispensing
DE19909245A1 (de) * 1999-02-22 2000-08-24 Siemens Ag Rakeleinrichtung

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3823200C1 (de) * 1988-07-08 1990-03-08 Gerhard 4800 Bielefeld De Klemm
DE4139357A1 (de) * 1991-11-29 1993-06-03 Vdo Schindling Vorrichtung zum aufbringen von lotpaste auf leiterplatten
DE29509412U1 (de) * 1995-06-08 1995-11-09 Siemens Ag Rakel zum Aufbringen von Lotpaste auf Leiterplatten
US5971227A (en) * 1995-11-22 1999-10-26 Speedline Technologies, Inc. Liquid dispensing system with improved sealing augering screw and method for dispensing
DE19909245A1 (de) * 1999-02-22 2000-08-24 Siemens Ag Rakeleinrichtung

Also Published As

Publication number Publication date
DE10344454B4 (de) 2006-04-27

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8364 No opposition during term of opposition
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee

Effective date: 20140401