DE10314179A1 - Breaking device for separating ceramic circuit boards - Google Patents

Abstract

Crushing device (2) for separating ceramic circuit boards (18) along weakening lines (20) on a ceramic circuit board (18), comprising a crushing trap (4, 6) with support plates (10, 12) which can be displaced relative to one another and which can be moved from a starting position in which the support plates (10, 12) adjoin one another at a break line (14) and form an essentially flat support surface (16), can be displaced into a break position in which the support plates (10, 12) are arranged at an angle to one another, and a hold-down device (52, 8) which is designed such that it positions the ceramic circuit board (18) against the support plates (10, 12) for a breaking process, DOLLAR A characterized in, DOLLAR A that the crushing trap (4, 6) two Has support plates (10, 12) which adjoin one another at a breaking line (14), DOLLAR A that the holding-down device (52, 8) has an elongate and narrow engagement area (58, 6 0), and DOLLAR A that the breaking device (2) has a positioning element (44) which is designed such that it can position the weakening lines (20) one after the other in alignment with and above the breaking line (14).

Description

The present invention relates to a breaking device for the separation of ceramic circuit boards along lines of weakness on a ceramic circuit board, comprising a crushing trap with relative to one another relocatable support plates, which from a starting position, in which adjoin the support plates at a fault line and form a substantially flat contact surface in a breaking position can be relocated in which the support plates are arranged at an angle to each other, and a hold-down device configured in such a way that them for a break the ceramic circuit board against the support plates positioned or specified.

Such a breaking device is out US-A-5 069 195 known. In particular, the breaking device described in this document has a multiplicity of support plates which can be displaced relative to one another and which adjoin one another at a multiplicity of parallel and rectangular fracture lines and are connected to one another. An arrangement of a plurality of, for example, spring-loaded stamps is provided above the support plates, so that a stamp is provided for each support plate. Furthermore, a relatively complicated drive device is provided, by means of which the individual support plates can be displaced relative to one another. In operation, a ceramic circuit board is positioned on the crushing trap, the stamp arrangement is moved downward, so that each stamp presses against the ceramic circuit board with a certain preload. In the further course, the individual support plates are moved relative to one another, the stamps ensuring that the ceramic circuit board bends and breaks along the break lines. The stamps press centrally on the individual hybrid circuits. There is a very high risk of damage to the electronic components or the hybrid circuit as a whole. A hold-down device with such stamps is therefore highly undesirable.

Such crushing devices are used for the separation of so-called hybrid circuits. These are electronic components on ceramic substrates, as are used in particular for high-temperature applications, for example as engine controls in the engine compartments of motor vehicles or as engine controls for electric motors. Printed conductors and / or resistors are often applied to the surfaces of the substrates in the printing process, while the electronic components are applied and soldered in the SMD process. Often, "open" electronic components, such as processors, are used, which are attached and bonded to the surface of the ceramic substrates and only then cast with a resin, for example. Such hybrid circuits are correspondingly sensitive. Accordingly, it is a disadvantage of US-A-5 069 195 to place a spring-loaded stamp centrally on the hybrid circuits. There is a risk that individual components or soldered connections will be damaged. Another disadvantage with US-A-5 069 195 consists in the fact that only hybrid circuits of the same size can be broken with this breaking device, since the size of the platen determines the grid dimension of the hybrid circuits that can be broken. Conversion is practically impossible or only possible with considerable effort.

In practice it is the case that well over 90% of the Ceramic circuit boards are broken by hand. The lines of weakness are fundamental either carved, for example using a diamond, or in the type of perforation that is typically not through the substrate goes through, made by a laser. So there is one Preferred direction for breaking depending on which side of the ceramic circuit board the line of weakness was applied. This preferred direction is referred to below as the "breaking direction". The The reason for this, that still a very big one Proportion of these ceramic circuit boards is separated by hand, is because that the mechanical breaking of this brittle material often too produces a lot of rejects because the slightest damage completely destroys one Ceramic circuit board with the entire hybrid substrates to be separated can result. Since the individual hybrid circuits are generally very expensive, such a committee is intolerable.

With such ceramic materials Two different errors typically occur when breaking on. On the one hand, these are "wild Breaks "and on the other hand" shell breaks ". Wild breaks run wildly over the Substrate, independent from the given lines of weakness. The ceramic material is not a homogeneous material, which is why wild breaks favored become. clam breaks are outbreaks or flaking at the break edges. It is obvious that for wild breaks the affected hybrid circuits become unsuitable. Shell breaks often do not result to an immediate failure, but to a failure in operation for a long time before the actual lifespan. To avoid such breakages it most desirable, the refractive powers to apply locally to the fault lines and not anywhere on one Hybrid circuit.

In DE 299 19 961 and DE 100 07 642 A1 describes a breaking device of the kind known to the skilled applicant as one of the few actually used to a significant extent for separating ceramic circuit boards. This breaking device has an elastic compliant, continuous platen, which is formed for example from a rubber material. In order to hold the ceramic circuit boards securely in place of the stamp arrangement US-A-5 069 195 a suction device is provided which has a plurality of rows of suction openings which are connected together in series, a suction opening being provided for each individual hybrid circuit on the ceramic circuit board. A crushing sword manipulated by a robot arm is positioned over the weakening line to be broken and then moved downwards. It presses against the weakening line and at this weakening line presses the ceramic circuit board against the rubber pad until it breaks. When breaking, the energy stored in the rubber pad is suddenly released, which introduces additional forces and, as a result, breaks in the ceramic circuit boards. In a first breaking step, a plurality of elongated rows are broken out of a plurality of hybrid circuits arranged in a row from a ceramic circuit board. These circuits have to be gripped and transported to a further singulation station, at which they are broken along the weakening lines which are provided in the longitudinal direction one after the other in this row in order to separate the individual hybrid circuits from one another. In principle, this second breaking device works exactly like the first and is constructed in a corresponding manner. One problem is the transportation of the rows of hybrid circuits from the first breaking device to the second breaking device. The rows cannot be gripped from their long sides, since there are no gaps between the individual fragments of the ceramic circuit board that a gripper could reach into. Accordingly, the rows must be gripped from their ends. However, these crushing devices often break across the row, so that the row cannot be gripped at the longitudinal ends and can be transported to the next crushing device. Such a row that has not been properly processed must be tracked by hand, for example.

With this described breaking device Hybrid circuits of a certain degree can be found in the prior art Size relative separate easily. The failures that occur are also all in one tolerable framework. A disadvantage of this breaking device is, however in being for certain hybrid circuit sizes designed is. Hybrid circuits that have significantly different dimensions, however, must be based on special Breaking devices are broken because the valve arrangements etc. are no longer compatible. A changeover to other hybrid circuit formats is therefore not easily possible with this device. Also kick Problems if the individual hybrid circuits are too small, e.g. less than 15 mm in one direction. As a result of compliance of the document then relatively high forces be applied to the lines of weakness to break the hybrid circuits. The smaller the hybrid circuits, the greater the forces become free when the elastic material becomes broken after breaking moved back to its starting position. It can happen that the suction forces are not it is no longer sufficient to hold isolated rows on the underground, and, as a result, the individual hybrid circuits can break uncontrollably and on the contact surface be distributed.

All breaking devices of the prior art have in common that they can only break in one direction, ie relative to the electronic components mounted on top of the ceramic circuit board, the breaking is always in the same direction. So at US-A-5 069 195 breaking by bending part of the ceramic circuit board downward while at DE 299 19 961 and DE 100 07 642 A1 breaking occurs in that the two fragments of the ceramic circuit board are bent upward relative to one another. It has already been described above how the weakening lines are produced on the ceramic circuit boards. All these lines of weakness have in common that they have to be bent in a certain direction in order to achieve a clean break. So with US-A-5 069 195 the line of weakness may be placed on top of the ceramic circuit board to achieve a clean break while at DE 299 19 961 and DE 100 07 642 A1 the line of weakness must be located on the back of the ceramic circuit board. Accordingly, it must be clear in which direction to break at the end of this manufacturing process before equipping the ceramic circuit board with the electronic components.

With the described problems of the stand the technology is the object of the present invention, a To provide crushing device of the type described that simple is built, with the hybrid circuits of various sizes can be and where the breaking forces are as possible on the line of weakness limited to the ceramic circuit boards can be applied.

According to the invention, this task is performed at a Breaking device of the type described solved in that the crushing trap has two support plates, which on a break line adjoin each other so that the hold-down device has an elongated and preferably transverse to the longitudinal direction Has narrow engagement area, and that the breaking device Positionierein direction, which is designed such that the weakening lines Position one after the other in alignment with and above the fault line can.

The elongated engagement area of the hold-down device is designed in such a way that it can be applied in the edge area of the individual hybrid circuits or chips and there the necessary ones Powers up. Typically, an edge area of approximately 0.5 to 0.6 mm up to the first components is present on each chip. It is an essential characteristic of the present invention to use this edge area of the chips for fixing or positioning. For this purpose, the holding-down device has an elongated engagement area, which is preferably narrow transversely to its longitudinal direction and preferably has a knife-edge-like shape. It is particularly preferred if the engagement area is narrower than 1.5 mm, in particular narrower than 1 mm, in particular 0.1 to 0.8 mm narrow and particularly preferably 0.5 to 0.7 mm narrow. An intervention area that is 0.6 mm narrow has proven itself in tests. It may be expedient to form the contact surface of the engagement area of the hold-down device or the breaker sword with a friction-increasing or elastically flexible material, e.g. B. to provide a coating with such a material. The resilient material can compensate for irregularities on the ceramic circuit board to a certain extent. So a rubber-like material has proven to be cheap. The hold-down device can also be formed from several individual elements, which are distributed, for example, over the longitudinal direction. For example, it can have a comb-like shape.

The hold-down device can Positioning the ceramic circuit board either on the line of weakness, along which should be broken, positioned or also on parallel weakening lines or chip edges. The hold-down device can be resilient be trained and passively move the movement of the Plates join in or it can be actively driven and for the Move the crushing plates to the breaking process. It can also be a combination provided by active drive and resilient construction his.

Another advantage of this construction is that the ceramic circuit board for breaking only in one direction must be positioned exactly on the support plate, i.e. she must be positioned so that the line of weakness to be broken is above the Break line of the crush trap comes to rest. It is therefore sufficient the positioning element work against one end of the ceramic circuit board to let, i.e. it is sufficient to have a sufficiently wide positioning element to ensure that the feed direction is perfectly aligned Ceramic PCB ensures and the correct position of the line of weakness above the Break line starts. This results in tilting and lateral friction of the ceramic circuit board excluded at guide stops, whereby unwanted breaks almost completely when positioning can be excluded. The positioning element can also move the ceramic circuit board by any desired distance, which is adjustable, for example. As a result, with a breaking device ceramic circuit boards with different arranged lines of weakness isolated can be. A complete changeover of the Breaking device to a different grid dimension is not required.

Another advantage of this type of gradual positioning is that even when it occurs of wild breaks the positioning device simply removes these fragments in question pushes on, the fragments are then possibly further isolated, and only the actual faulty hybrid circuits have to be sorted out.

The support plates preferably have ends of the fault line adjacent to the fault line, the crushing trap is designed in such a way that the ends of the fault lines can optionally be Can be moved up or down to a break position can. It is particularly convenient if the fault line ends are moved to a fault position down an engagement area of the hold-down device over the Fault line is positioned. That represents a very powerful input exactly at the line of weakness to be broken for sure. On the other hand, it is convenient two parallel engagement areas of the hold-down device on the the line of weakness to be broken neighboring line of weakness or the next one Arrange the edge of the ceramic circuit board parallel to the fault line. Alternatively, could one imagine the ceramic circuit board by means of the positioning device to be determined by entering areas of the positioning device weakening lines are arranged, e.g. perpendicular to the line of weakness to be broken run. It can then be cheap be to design the positioning device such that it essentially parallel to the surface of the support plates when Breaking with can move.

The support plates can be moved actively, for example by driving the support plates, which is positioned, for example, with the movement of the engagement areas of the hold-down device. Alternatively, the engagement area (s) of the positioning device of the support plates can be displaced against an elastically yielding force. It is advantageous to provide a device which brings the support plates back into the starting position. It has been found that, unlike the prior art described above DE 299 19 961 and DE 100 07 642 A1 the movement path up to the break position is a very uncritical value. It is usually sufficient to move the platen from its starting position by a few tenths of a millimeter to a few millimeters. A further shift beyond the break point has no negative effects on the ceramic circuit board. In contrast to the prior art described, a very precise adjustment is therefore not necessary.

Due to the possibility of optional Verla tion of the support plate of the crushing trap downwards or upwards, it is possible to break ceramic circuit boards with one and the same breaking device, regardless of which side, ie on the side of the components or on the back, the lines of weakness are arranged. Rather, it is even possible to break ceramic circuit boards that have lines of weakness on the front or rear side of a ceramic circuit board.

There is also the option to break either "up" or "down" for such problem cases relevant where not reliable can be broken in one direction. In such problem cases it cheap be to first break the ceramic circuit board in one direction or bend and then break in the other direction or to bend to safely separate the individual chips. You will typically work in such a way that when kinking up the two engagement areas of the hold-down device with weakening lines / edge areas arranged parallel to the fault line the ceramic circuit board are engaged. For breaking or kinking one of the two engagement areas will then be removed downwards, z. B. fold down, and then with the second engagement area in the Kind of a sword on the break point and the ceramic circuit board kink or break down. In principle, it is possible first to break up or break down first. Such a problem case is given, for example, if the Ceramic printed circuit board made of metal, for example copper the edges of the individual chips. If you break such a ceramic circuit board down first (because that's the breaking direction of the line of weakness) are typical the individual chips are still connected to each other by the conductor tracks. A subsequent one Kinking upward, applies tensile stress to the conductor track and leads to tear off the Trace and finally for complete isolation along the line of weakness.

Intervention areas are preferred the hold-down device can be displaced relative to one another. At a Hold-down device with parallel engagement areas makes this possible an adjustment of the distance between the engagement area and thus an adaptation to the distances of the individual fault lines. The shift can be done manually, for example automatic shifting is preferred, so that the breaking device automatically the engagement areas for can move the correct distance.

The hold-down device preferably has a crushing sword, which is connected to the crushing device in this way is that it is over the Break line positioned and towards the break line and about that can be moved, the platen so resilient are arranged so that the fault line ends of the support plate in the course of the movement of the crushing sword down over the Move the fault line down to the break position. So For example, an engagement area of the hold-down device or the engagement areas of the hold-down device as a breaker sword be designed. It can be cheap be to make the engaging edge of the crowbar even thinner than usually a Engagement area of the hold-down device is formed.

It should be noted that if Previously, there was talk that the fault line ends of the platen can be shifted up or down, this statement as a relative statement is to be understood and in particular also includes the case that the support plates relative to the fault line up or down can be pivoted below and the fault line ends essentially maintain their position.

Preferably, the fault line ends of the Plates of the crushing trap are shifted upwards, and continue the support plates are preferably arranged such that when the break line ends of the support plates move upwards a gap between them is enlarged and accordingly operational between the fragments a gap is enlarged in a ceramic plate. A basically at Isolated problem of ceramic circuit boards is that it is common problematic is the fragments to be transported further because the individual fragments are so narrow lying side by side that it is practically not possible with a gripper or otherwise grab between the fragments. At the breaking device according to the present Invention, this problem is solved in that the bearing surfaces of the Crush trap typically from the break position to a tapping position to be shifted up, over is the starting position. This upward movement makes the Gap between the contact surfaces and accordingly also significantly enlarged between the fragments. If the gap big enough you can reach into the gap to continue the fragment to transport. The crush trap of the present invention has corresponding to four work cycles: (i) contact surface is in the starting position; the positioning element positions the ceramic circuit board over the Fault line. (ii) The crush trap is moved to the break position, and the ceramic circuit board breaks along the line of weakness. (iii) The support plates of the crushing trap are moved upwards over the Starting position raised so that a gap between the fault line ends the support plates are created. (iv) The crush trap is in the tapping position, and the broken fragment of the ceramic circuit board is tapped and transported away, and the platen brought back to the starting position.

The breaking device preferably has Transport element, which is designed such that it can be operationally placed in the enlarged gap between the fragments of a ceramic printed circuit board and can then be moved to remove a fragment. The transport element can, for example, be an elongated slide, the lower edge of the slide being operationally brought into contact with the edge or the edge of the part of the transport plate to be removed. The positioning element is preferably also the transport element at the same time, and particularly preferably an engagement area of the hold-down device serves simultaneously as a positioning element and as a transport element. The hold-down device can, for example, be attached to the arm of a processing robot. Such processing robots work very precisely and are relatively easily able to position the ceramic circuit boards with the weakening lines above the break lines, break the ceramic circuit board exactly at the weakening line and plunge or intervene in the gap between the fragments in the tapping position the ceramic circuit board is formed to remove one of the fragments.

A coupling device is preferably such with the contact surfaces connected to the crushing trap that it synchronizes the operation of the contact surface. The efficiency of the crush trap is best when both platen the crush trap essentially the same way to the break position return, i.e. whose movement is synchronized. Is particularly cheap it when the path of the crowbar is essentially along the bisector of the obtuse angle between the two contact surfaces of the Crush trap runs.

A control for the breaking device is preferred provided which the movements of the crushing trap, the crushing sword, the positioning element and / or the transport element and / or the breaking direction (crush trap "down" or "up") coordinated and preferably an input interface has about which the dimensions the ceramic circuit boards to be separated and the positions and / or the distances the lines of weakness arranged on it can be entered. The ceramic circuit boards to be broken typically include one Variety of hybrid circuits that line and row on the Ceramic circuit boards are arranged. Often, the ceramic circuit boards side edges still continuous on all four sides of the ceramic circuit board, which act as a frame or supporting edge for the previous ones Manufacturing steps serve and prevent the ceramic circuit board into individual fragments in previous steps the line of weakness decays. Such ceramic circuit boards are referred to as "benefits". Typical sizes of such Benefits are 5.5 × 7.5 inches, 5 × 7 Inches and 4 × 6 Inch. Hybrid circuits of the same size are typically on such a panel arranged, which have different sizes depending on the circuit can. Such hybrid circuits can a size of 30 × 25 mm down to 15 × 15 mm and smaller. With the inventive device, everyone can Ceramic circuit boards independent of their size, the Presence of a border or regardless of the size of the individual Hybrid circuits are isolated. All that is required is enter the individual dimensions into the control of the breaking device. The Positioning element then positions the PCB correctly in the right position. additionally can Sensors can be provided, for example optical sensors or Buttons that determine whether a circuit board is on the right one Position is, for example with the line of weakness above the break line. It is particularly beneficial to provide a sensor device with which before the first break a ceramic circuit board can be checked, whether this ceramic circuit board has the specified dimensions. This can be avoided be that a ceramic circuit board, for example in the A supporting edge has broken off during the course of the production process the crusher completely is broken wildly.

A braking device is preferred provided that the of the ceramic circuit board from the positioning element mediated impulse brakes. Typically the friction is between the support plates and the ceramic circuit board are relatively small. It can be that the printed circuit board moved by the positioning element through the impulse that you convey from the positioning element was moved a little further after positioning. To do that avoid and safe and correct positioning of the ceramic circuit board to ensure in any case, it is beneficial to provide a braking device. The braking device can for example consist of a number of suction openings exist, for example, located near the fault line and through which air is sucked out by a pump. The air flow through these suction openings can during the operation of the crushing device kept substantially constant are so that no particularly complex regulation is required here is. These suction openings have the effect of holding the ceramic circuit board against the pad pull and thus an increased Ensure friction. The friction is still low enough for that the positioning element is able to the ceramic circuit board to be transported and positioned further. You can set this be sure that the ceramic circuit board slides over the actual positioning is prevented.

The breaking device preferably has a rotating device by means of which the ceramic printed circuit board to be processed and / or the fragments thereof can be rotated about an axis that is perpendicular to the contact surfaces. The The rotating device can be, for example, a turntable onto which the ceramic circuit board or the fragments are pushed. The rotating device can also be a gripper that lifts, rotates and sets down the ceramic circuit board or the fragments. Alternatively, it can also be imagined to make the breaker sword rotatable about its vertical axis and to turn the ceramic circuit board or the fragments with this breaker sword. The idea behind the rotation is based on the fact that typically several hybrid circuits are arranged side by side in columns and in rows. This means that only the individual rows are separated during the first break. The hybrid circuits are still connected in a row. In order to separate them as well, you can, for example, turn them and break them on the same crushing trap on which the separation into the individual rows was carried out. For example, you can imagine breaking a ceramic circuit board into the individual rows at the crushing trap and then pushing the rows essentially parallel to each other on a turntable. For example, if all the rows are separated and are on the turntable, you can turn the turntable, for example, by 90 °, depending on the angle at which the lines of weakness of the rows and columns are arranged on the ceramic circuit board, and then individually or together back over the To move the crushing trap and thereby separate the rows into the individual hybrid circuits.

A second crushing trap is preferred provided, which is arranged in the crushing device such that their fault line, viewed in the plane of the contact surfaces, with a Angle arranged relative to the break line of the first crushing trap is. Typically this angle will be 90 °, i.e. the angle, which also the lines of weakness are arranged on the ceramic circuit board. The isolated rows individual hybrid circuits can then transported away from the break line of the first crushing trap by simply pushing them aside. Then you can are positioned by the same or a further positioning device in such a way that the lines of weakness the series of hybrid circuits one after the other over the fault line the second crushing trap and the associated crushing sword be separated. The crushing traps are preferably essentially trained identically. The second crushing trap can be made narrower than the first vomit trap. It may be convenient to use the positioning element the holding-down device and / or the transport device of the first crushing trap for the corresponding work processes on the second crushing trap to use. It can be particularly favorable with or Engagement areas of the hold-down device all positioning, crushing and perform transport tasks. It can also increase the cycle time Cheap be for to provide each crushing trap with its own facilities.

• (a) Bereitstellen einer Brechfalle mit zwei relativ zueinander verlagerbaren Auflageplatten, die aus einer Ausgangsposition, in der die Auflageplatten an einer Bruchlinie aneinander grenzen und eine im Wesentlichen ebene Auflagefläche bilden, in eine Bruchposition verlagert werden können, in der die beiden Auflageplatten mit einem Winkel zueinander angeordnet sind,
• (b) Positionieren einer Keramikleiterplatte derart auf den Auflageplatten in der Ausgangsposition, dass eine Schwächungslinie, entlang derer gebrochen werden soll, im Wesentlichen über der Bruchlinie liegt;
• (c) Absenken einer Niederhaltevorrichtung, die zwei längliche, Eingriffsbereiche aufweist, derart auf die Keramikleiterplatte, dass diese im Bereich zweier Schwächungslinien, die der Schwächungslinie, entlang derer gebrochen werden soll, benachbart sind, eine Niederhaltekraft auf die Keramikleiterplatte ausüben;
• (d) Brechen der Keramikleiterplatte durch Anheben der Bruchlinienenden der Auflageplatten der Brechfalle nach oben in die Bruchposition;
• (e) Anheben der Niederhaltevorrichtung und Freigeben der Bruchstücke der Keramikleiterplatte;
• (f) Zurückverlagern der Auflageplatten in die Ausgangsposition;
• (g) Positionieren der Keramikleiterplatte derart auf den Auflageplatten, dass eine weitere Schwächungslinie, entlang derer gebrochen werden soll, im Wesentlichen über der Bruchlinie liegt; und
• (h) Wiederholen der Schritte (c) bis (g) bis die Keramikleiterplatte entlang der Schwächungslinien, entlang derer gebrochen werden soll, gebrochen wurde.

The invention further relates to a method for separating ceramic circuit boards along weakening lines on a ceramic circuit board, comprising the following steps:

• (a) Providing a crushing trap with two support plates which can be displaced relative to one another and which can be displaced from a starting position in which the support plates adjoin one another at a break line and form a substantially flat contact surface to a fracture position in which the two support plates are at an angle are arranged to each other
• (b) positioning a ceramic circuit board on the support plates in the starting position such that a weakening line along which it is to be broken lies substantially above the break line;
• (c) lowering a hold-down device, which has two elongated engagement areas, onto the ceramic circuit board in such a way that they exert a hold-down force on the ceramic circuit board in the region of two weakening lines which are adjacent to the weakening line along which it is to be broken;
• (d) breaking the ceramic circuit board by lifting the breaking line ends of the support plates of the breaking trap up to the breaking position;
• (e) lifting the hold-down device and releasing the fragments of the ceramic circuit board;
• (f) moving the platen back to the starting position;
• (g) positioning the ceramic circuit board on the support plates in such a way that a further weakening line along which it is to be broken lies substantially above the break line; and
• (h) repeating steps (c) through (g) until the ceramic circuit board has been broken along the lines of weakness along which it is to be broken.

• a) Bereitstellen einer Brechfalle mit zwei relativ zueinander verlagerbaren Auflageplatten, die aus einer Ausgangsposition, in der die Auflageplatten an einer Bruchlinie an einander grenzen und eine im Wesentlichen ebene Fläche bilden, in eine Bruchposition verlagert werden können, in der die beiden Auflageplatten mit einem Winkel zueinander angeordnet sind;
• b) Positionieren einer Keramikleiterplatte derart auf den Auflageplatten in der Ausgangsposition, dass eine Schwächungslinie, entlang derer gebrochen werden soll, im Wesentlichen über der Bruchlinie liegt;
• (c) Brechen der Keramikleiterplatte durch Absenken eines Brechschwerts das im Wesentlichen mit der Schwächungslinie ausgerichtet ist, gegen die Schwächungslinie und gegen eine vorgegebene Kraft der Auflageplatten und dabei nach unten Verlagern der Auflageplatten in die Bruchposition;
• (d) Anheben des Brechschwerts;
• (e) Zurückverlagern der Auflageplatten in die Ausgangsposition;
• (f) Positionieren der Keramikleiterplatte derart auf den Auflageplatten, dass eine weitere Schwächungslinie, entlang derer gebrochen werden soll, im Wesentlichen über der Bruchlinie liegt; und
• (g) Wiederholen der Schritte (c) bis (f) bis die Keramikleiterplatte entlang der Schwächungslinien, entlang derer gebrochen werden soll, gebrochen wurde.

The invention further relates to an alternative method for separating ceramic circuit boards along weakening lines on a ceramic circuit board, comprising the following steps:

• a) Providing a crushing trap with two support plates which can be displaced relative to one another and which can be displaced from a starting position in which the support plates adjoin one another at a fracture line and form a substantially flat surface to a fracture position in which the two support plates are at an angle are arranged to each other;
• b) positioning a ceramic printed circuit board on the support plates in the starting position in such a way that a weakening line along which it is to be broken lies substantially above the break line;
• (c) breaking the ceramic circuit board by lowering a breaker bar that is substantially aligned with the line of weakness against the line of weakness and against a predetermined force of the support plates and thereby moving the support plates downward into the breaking position;
• (d) raising the crushing sword;
• (e) moving the platen back to the starting position;
• (f) positioning the ceramic circuit board on the support plates in such a way that a further weakening line, along which it is to be broken, lies substantially above the break line; and
• (g) repeating steps (c) through (f) until the ceramic circuit board has been broken along the lines of weakness along which it is to be broken.

The method preferably has further the step of moving the support surfaces upwards into a tapping position to enlarge the gap between the fragments a ceramic circuit board.

The method preferably has further reaching into the gap between the fragments and Remove one of the fragments. It should be noted that in this context "grasping" is not necessarily gripping with a gripper means from two sides. Much more this term should also include one-sided pushing.

The movements are preferred of the contact surfaces executed synchronously.

The invention and refinements the invention are described below using an exemplary embodiment explained. Show it:

1 a side view of a breaking device according to the invention;

1 a perspective view of a breaking device according to the invention according to an alternative embodiment;

2 a side view of the breaking device of 2 ; and

3 a plan view of the breaking device.

1 shows a breaking device according to the invention 2 , having a first crushing trap 4 and a second crush trap 6 , A hold-down device can also be seen 52 which is connected to a robot cell (not shown). The hold-down device 52 is preferably connected to this manipulation arm. Such manipulation arms can carry out translational movements in all spatial directions within their range. To a certain extent, you can also perform rotational movements. Such robot cells are able to handle the tools connected to the robot arm, such as the hold-down device 52 to position very precisely. Such robot cells can be programmed, for example, from conventional PCs via a suitable interface. A robot cell that is particularly suitable for the present application, for example, is the "baumann-ro | box" with the integrated Bosch Scara robot. One can see that the vomiting trap 4 two support plates 10 and 12 has at a break line 14 adjoin each other and form a substantially flat contact surface in an initial state. In the 1 is the crush trap 4 shown in a breaking position, in which the two support plates 10 and 12 at their the break line 14 adjacent fault line ends 54 . 56 are raised up to the break position. The support plates 10 and 12 are made of any material. It is advantageous if this material is relatively wear-resistant since the material of the ceramic circuit boards is very abrasive. It is preferred if it is an antistatic material, an electrostatic charging of the ceramic circuit boards as a result of the displacements of the ceramic circuit boards on the surface of the support plates 10 . 12 to avoid. Electrostatic charging would increase the risk of damage to components on the ceramic circuit board. Suitable materials are, for example, steel, in particular ground steel, but certain plastic materials are also conceivable.

In the 1 and better in 2 you can also see a ceramic circuit board 18 with one of their lines of weakness 20 in alignment with and above the fault line 14 is positioned. The hold-down device 52 places the ceramic circuit board 18 stuck in this position. In particular, the hold-down device 52 two areas of intervention 58 . 60 which are elongated elements that taper to the bottom. The areas of intervention 58 . 60 are on refraction lines 20 that are parallel to the line of weakness to be broken or attack the narrow edge area of a hybrid circuit. It can also be seen that the engagement areas 58 . 60 the hold-down device 52 are arranged displaceable relative to each other. Drive motors can be seen in particular 62 . 64 , the position of the engagement areas via a displacement screw device 58 . 60 can adjust. In particular, the drive motors 62 . 64 formed, for example in the manner of servomotors, that each of the engagement areas 58 . 60 can drive to a precisely specified position in the room.

Furthermore, a coupling device can be seen, the following with reference to the 3 will be described in more detail, as well as a drive 28 for moving the support plates 10 and 12 ,

In the in 1 shown representation has the drive 28 the drive plates 10 and 12 and thus the ceramic circuit board 18 raised from the starting position to the breaking position. there became the line of weakness 20 at the break line 14 Broken. The movement of the platen 10 and 12 is against an elastically yielding force of the hold-down device 52 he follows. It is theoretically also possible to use the platen 10 and 12 to be arranged so that they move around the from the engagement areas 58 and 60 pivot point formed by the 58 and 60 formed pivot points can rotate, so that an elastic flexibility of the hold-down device 52 is not required.

In the 2 and 3 is an alternative embodiment of the breaking device 2 shown. Corresponding elements of the individual crushing devices 2 are given the same reference numerals. Basically, the features described with reference to one of the embodiments can be provided accordingly in the other embodiments. In particular, the hold-down device 52 in this embodiment can be configured essentially as in the embodiment according to 1 , The crushing sword shown in this embodiment 8th corresponds to the hold-down device 52 , or is part of it. In particular, the crushing sword 8th one of the engagement areas 58 . 60 form the hold-down device. The second engagement area of the hold-down device 52 is then preferably moved to the side so that it functions as a crowbar 8th or the other area of intervention. Alternatively, the second engagement area can also be removed.

You can see in the 2 that the crushing sword 8th in alignment with and above the fault line 14 is positioned.

Runs the crushing sword 8th down, so it hits the line of weakness 20 the ceramic circuit board 18 and pushes it against the fault line 14 the crush trap 4 down to the break position.

In the 1 is the initial state of the crushing trap 4 shown in which the platen 10 and 12 an essentially flat contact surface 16 form.

The first and the second crushing trap 4 and 6 are essentially identical. The second crushing trap 6 in the present embodiment is arranged at an angle of 90 ° relative to the first crushing trap, ie the break lines 14 of the two crushing traps form an angle of 90 °.

This angle is determined by the angle of the lines of weakness 20 on the ceramic circuit board 18 , which is typically 90 °. In theory, other angles are also conceivable for special applications. It can then be advantageous to arrange the second crushing trap at a corresponding angle to the first crushing trap. Because of the second crushing trap 6 only strips or rows of hybrid circuits of the ceramic circuit board 18 must be broken, this is significantly narrower than the first crushing trap in the embodiment shown 4 , However, there may also be situations where the second crushing trap is beneficial 6 to be approximately as wide or even wider than the first crushing trap 4 ,

The 3 shows a side view of the breaking device 2 according to 2 , You can see the crushing sword again 8th , the first crushing trap 4 and the second crush trap 6 , The support plates can also be seen 10 and 12 the first crush trap 4 , It can be seen that the platen 10 and 12 at 22 and 24 are rotatably mounted. The first and second platen can rotate around the pivot points 22 and 24 move relative to each other. One recognizes in particular that in the 3 the first and the second platen 10 and 12 at the break line 14 are shifted down. In particular, they are in the 3 shifted to the break position in which the two support plates 10 and 12 do not form a flat support surface, but are arranged at an angle to each other. A relatively short distance is sufficient between the starting position and the breaking position, since the refractive power depends on the breaking sword 8th immediately on the line of weakness 20 is applied and accordingly the breakage even with a relatively small change in the angle of the support plates 10 and 12 he follows. From the comparison of the 2 and 3 you can also see that the vomit sword 8th down to the fault line 14 can be moved in the starting position and over the break line 14 can be moved further down in the starting position. The crushing sword presses during this further movement 8th the ceramic circuit board 18 in the area of the line of weakness 20 against the free ends of the platen 10 and 12 and push those free ends down. So that this movement of the contact surfaces 10 and 12 is a controlled facility 26 provided that provides a certain counterforce, so that the downward movement is flexible against a counterforce. The facility 26 can work according to different principles. It is convenient if the establishment 26 is designed so that it does not suddenly release the energy that may be stored after the break. Rather, the platen should 10 . 12 after the fracture, either remain in the fracture position until they are actively moved again, or they should only gradually move back to the starting position. For example, springs that are coupled to damping elements or pneumatic devices can be used. However, a drive is preferred 28 for example in the manner of providing a servo linear motor or a linear actuator which can be moved downward against a predetermined counterforce on the one hand and at the same time the drive of the support plates 10 . 12 can accomplish. Another advantage of such a drive motor is that the exact position of the platen 10 . 12 always via the servo linear motor 28 be determined can and vice versa an exact positioning in space is possible.

in this context it should be noted that the movement path of the crushing trap 4 and 6 to the breaking position on the breaking device 2 According to the present invention, it is very uncritical, which is a decisive advantage in relation to the prior art, since no complex adjustment work is required for commissioning.

In the 3 can also be seen a coupling device 30 , by means of which the support plates 10 . 12 the crush trap 4 are connected, so the movements of the platen 10 . 12 to synchronize. The coupling device has in particular a link guide 32 on, in the with the platen 10 . 12 connected pins 34 . 36 are led. The coupling device 30 itself is connected in such a way that it only has degrees of freedom of movement up and down, but cannot be tilted or twisted. This is a synchronization of the movement of the platen 10 . 12 ensured. The coupling device 30 can also be realized mechanically in another way, for example by means of two lever connections that are provided by the drive 28 to the platen 10 or to the platen 12 go and are articulated on both sides. It is also possible to use the platen 10 and 12 each with its own drive motor and electronically couple them with each other in such a way that only essentially synchronous movements of the support plates 10 . 12 possible are.

In the 3 you can also see a fragment 38 the ceramic circuit board 18 which has already been canceled. After lifting the crowbar 8th from the in 2 shown position and after moving the platen back 10 . 12 is in the starting position between the ceramic circuit board 18 and the fragment 38 just an extremely narrow gap that is not enough to break the fragment 38 towards the left in the representation of the 3 to move. One could consider providing a gripper with which the fragment 38 is gripped at its longitudinal ends and transported further. This is disadvantageous, however, since it occasionally breaks across the longitudinal direction of the fragment 38 can come. Such a broken piece 38 can not be easily transported further and would significantly interfere with the operation of the crushing device in such a design of a transport element. In the inventive breaking device 2 it is therefore preferred to drive 28 for the platen 10 . 12 designed so that it has the free ends of the platen 10 . 12 can raise above the starting position in such a way that a gap between the free ends of the support plates 10 . 12 and accordingly between the fragment 38 and the ceramic circuit board 18 arises. A transport element, for example one of the engagement areas, can enter this gap 58 . 60 or the crushing sword 8th or immerse another suitable transport element and the fragment 38 from its long side to the left in the representation of the 3 move. From there, the fragment 38 be taken over for further processing.

4 shows the top view of a breaking device 2 according to the present invention. In particular, the first and second crushing trap arranged at a 90 ° angle to one another can be seen 4 . 6 , You can see the contact surfaces 10 . 12 the first crush trap and you can see the break line 14 , A ceramic circuit board can also be seen very clearly 18 , which in this form is also referred to as "benefit". One benefit typically has multiple rows and columns of individual hybrid circuits 40 on, each by lines of weakness 20 are separated from each other. In many cases there is an additional support margin around the rows and columns of hybrid circuits 40 arranged, the additional strength or the ceramic circuit board for the previous processing steps 18 gives. In the 4 such a support edge is not shown. The support edge is also typically with lines of weakness 20 arranged. The support edge can also be used with a breaking device 2 canceled according to the present invention. It should be noted that the integration in the hybrid circuits 40 has now progressed so far that some of the individual components are already arranged 0.4 to 0.6 mm from the breaking edge. That is, the hold-down device 52 respectively. 8th must be designed and moved so precisely that it is reliable in this very narrow area between two rows of hybrid circuits 40 can immerse and there the ceramic circuit board 18 can break, or fix the ceramic circuit board there. The positioning of the ceramic circuit board must also be correspondingly precise 18 take place, ie the position of the line of weakness must be correspondingly 20 after positioning the ceramic circuit board 18 be determinable. It is a braking device 42 provided that in the present embodiment in the form of a series of suction openings in the region of the free ends of the support plates 10 . 12 near the fault line 14 are provided. A certain volume of air is essentially continuously sucked through these suction openings, so that the ceramic circuit board 18 as soon as they are in the area of the braking device 42 reaches, with a certain suction force against the platen 10 . 12 is sucked and thus braked. On the one hand, this is important in order to stimulate the ceramic circuit board 18 to slow down, which is conveyed to her by the movement when positioning. On the other hand, after positioning, the position of the ceramic circuit board 18 ensured, for example, against vibrations and shocks that occur during the operation of the crushing contraption 2 occur or which are otherwise applied to the system. The suction power of the braking device 42 is preferably set so that a certain amount of air is continuously sucked through the suction openings. Alternatively, it is also possible, for example, to switch off the suction device after breaking to a fragment 38 or the ceramic circuit board 18 move on.

The positioning of a panel or a ceramic circuit board 18 on the crush trap 4 and accordingly also on the crushing trap 6 is done as follows. The use 18 is from a previous processing station in a conventional manner on the crushing trap 4 spent. The in the 4 shown twisted position of benefit 18 is already a very extreme position that will practically not come about operationally. The use 18 then lies on the platen 10 the crush trap 4 or on one of these upstream positioning surfaces. A positioning element 44 , it engages with the benefit 18 a substantially elongated element is substantially perpendicular to its longitudinal direction on the panel 18 to move and touch it first on the corner 46 , As a result of the further movement, it brings a torque force to the corner 46 on, which tends to seek the benefit 18 to be aligned so that it extends over the entire end edge 48 in contact with the positioning element 44 comes. Once the area of the front corner 50 in the area of the braking device 42 arrives, this area is additionally braked, which increases the torque and the orientation of the benefit 18 is additionally supported. This ensures that the benefits 18 is correctly positioned as soon as the first line of weakness 20 over the break line 14 is positioned. The braking device 42 keeps the benefit 18 then in position for the actual breaking process. It may be beneficial to use the crowbar 8th as a positioning element 44 to use. It may also be convenient to have a braking device 42 further away from the fault line 14 to position, especially when this braking device 42 can support positioning at such a position.

There can be multiple braking devices 42 over the contact surfaces 10 . 12 be provided distributed. Possibly. can also have one or more braking devices on an upstream positioning surface 42 be provided.

A severed strip or fragment 38 with multiple hybrid circuits is from a transport element or from the crushing sword 8th to the left onto the second crushing trap 6 transported and positioned there in essentially the same way and then broken. The individual hybrid circuits are then further processed or packaged. Instead of the second crushing trap 6 or in addition to the second crushing trap 6 a rotating device can be provided. This can either be a surface, for example on the flat surface 16 the first crush trap 4 in the starting position and which can be rotated by any angle, preferably 90 °, about the perpendicular to this surface. This allows four lines of weakness to be created on a crushing trap 20 can be broken, which are not parallel to each other, and it can especially with a crush trap 4 the right-angled lines of weakness 20 with a benefit 18 , as in 4 shown to be broken.

It should also be noted that the representations are 1 on the one hand and 2 to 4 on the other hand, does not necessarily have to be different embodiments. It can also be a single embodiment of the breaking device 2 Be designed to be a ceramic circuit board 18 can break both by moving up to a breaking position and by moving down to a breaking position, in particular depending on how the line of weakness on the ceramic circuit board 18 is arranged and how the direction of break of the ceramic circuit board. It should also be pointed out that a thin elastic, for example rubber-like positioning mat can also be provided as the positioning device, by means of which the ceramic printed circuit board 18 relative to the crushing trap and the hold-down device 52 . 8th is relocatable. This is particularly preferred if, for various reasons, the ceramic circuit board is displaced 18 should be avoided on a surface if possible. It can also be cheap instead of the positioning mat relative to the crushing trap and the hold-down device 52 . 8th to shift, the latter both to be displaced relative to the positioning mat defined in the room, ie crushing trap 4 and hold-down device 52 . 8th are relative to the positioning mat and the ceramic circuit board 18 shifted from line of weakness to line of weakness.

Claims (20)

Breaking device ( 2 ) for separating ceramic circuit boards ( 18 ) along lines of weakness ( 20 ) on a ceramic circuit board ( 18 ), having a crush trap ( 4 . 6 ) with support plates that can be moved relative to each other ( 10 . 12 ) from a starting position in which the support plates ( 10 . 12 ) on a break line ( 14 ) adjoin each other and an essentially flat contact surface ( 16 ) form, can be shifted to a breaking position in which the support plates ( 10 . 12 ) are arranged at an angle to each other, and a hold-down device ( 52 . 8th ), which is designed such that the ceramic circuit board ( 18 ) against the support plates ( 10 . 12 ) positioned, characterized in that the crushing trap ( 4 . 6 ) two support plates ( 10 . 12 ) that has a break line ( 14 ) to each other limit that the hold-down device ( 52 . 8th ) an elongated and narrow engagement area transverse to the longitudinal direction ( 58 . 60 ) and that the breaking device ( 2 ) a positioning element ( 44 ) which is designed in such a way that the weakening lines ( 20 ) one after the other in alignment with and above the fault line ( 14 ) can position. Breaking device ( 2 ) according to claim 1, characterized in that the support plates ( 10 . 12 ) the fault line ( 14 ) adjacent ends of the fault line ( 54 . 56 ), the crushing trap ( 4 . 6 ) is designed in such a way that the fault line ends ( 54 . 56 ) can either be moved up to a break position or down to a break position. Breaking device ( 2 ) according to claim 1 or 2, characterized in that the engagement region ( 58 . 60 ) of the hold-down device ( 52 . 8th ) essentially parallel to the fault line ( 14 ) is arranged. Breaking device ( 2 ) according to one of claims 1 to 3, characterized in that the holding-down device ( 52 . 8th ) two parallel engagement areas ( 58 . 60 ) having. Breaking device ( 2 ) according to claim 4, characterized in that the engagement areas ( 58 . 60 ) can be shifted relative to each other. Breaking device ( 2 ) according to one of claims 1 to 5, characterized in that the holding-down device ( 52 . 8th ) a crushing sword ( 8th ), which in this way on the breaking device ( 2 ) is connected over the fault line ( 14 ) positioned and towards the fault line ( 14 ) can be moved to and beyond, the support plates ( 10 . 12 ) are arranged so resiliently that the ends of the fracture line ( 54 . 56 ) of the support plates ( 10 . 12 ) in the course of the movement of the vomit sword ( 8th ) down over the fault line ( 14 ) move down to the break position. Breaking device ( 2 ) according to one of claims 1 to 6, characterized in that the fault line ends ( 54 . 56 ) of the support plates ( 10 . 12 ) the crush trap ( 4 . 6 ) can be shifted upwards so that the support plates ( 10 . 12 ) are arranged in such a way that when the ends of the fault line move ( 54 . 56 ) of the support plates ( 10 . 12 ) upwards a gap between them is enlarged and accordingly also operationally between the fragments of a ceramic plate ( 38 . 18 ) a gap is enlarged. Breaking device ( 2 ) according to claim 7, further comprising a transport element which is designed such that it is operationally in the enlarged gap between the fragments ( 38 ) a ceramic circuit board ( 18 ) can be moved and then relocated to a fraction ( 38 ) to be removed. Breaking device ( 2 ) according to claim 8, characterized in that the positioning element ( 44 ) is also the transport element. Breaking device ( 2 ) according to one of claims 1 to 9, further comprising a coupling device ( 30 ) with the platen ( 10 . 12 ) the crush trap ( 4 . 6 ) is connected to the movements of the support plates ( 10 . 12 ) synchronized. Breaking device ( 2 ) according to one of claims 1 to 10, characterized in that a controller is provided which controls the movements of the crushing trap ( 46 ) with the movements of the other elements ( 52 . 8th . 44 ) of the breaking device ( 2 ) coordinates, and has an input interface via which the dimensions of the ceramic circuit boards to be separated ( 18 ) and the position and / or the distances of the lines of weakness arranged thereon ( 20 ) and / or the breaking direction can be entered. Breaking device ( 2 ) according to one of claims 1 to 11, characterized in that a braking device ( 42 ) for the ceramic circuit board ( 18 ) is provided. Breaking device ( 2 ) according to one of claims 1 to 12, characterized in that a rotating device is provided, by means of which the ceramic circuit board to be machined ( 18 ) and / or their fragments ( 38 ) can be rotated about an axis that is perpendicular to the support plates ( 10 . 12 ) is. Breaking device ( 2 ) according to one of claims 1 to 13, characterized in that a second crushing trap ( 6 ) is provided, which in the crushing device ( 2 ) that their fault line ( 14 ), in the level of the support plates ( 10 . 12 ) viewed at an angle relative to the break line of the first crushing trap ( 4 ) is arranged. Process for separating ceramic circuit boards ( 18 ) along lines of weakness ( 20 ) on a ceramic circuit board ( 18 ), comprising the following steps: (a) providing a crushing trap ( 4 . 6 ) with two support plates that can be moved relative to each other ( 10 . 12 ) from a starting position in which the support plates ( 10 . 12 ) on a break line ( 14 ) adjoin each other and an essentially flat contact surface che ( 16 ) can be moved to a breaking position in which the two support plates ( 10 . 12 ) are arranged at an angle to each other, (b) positioning a ceramic circuit board ( 18 ) in this way on the support plates ( 10 . 12 ) in the starting position that a line of weakness ( 20 ) along which to break, essentially above the break line ( 14 ) lies; (c) lowering a hold-down device ( 52 ), the two elongated, engagement areas ( 58 . 60 ), so on the ceramic circuit board ( 18 ) that these are in the area of two lines of weakness ( 20 ), the line of weakness ( 20 ) along which it is to be broken, a hold-down force on the ceramic circuit board ( 18 ) exercise; (d) breaking the ceramic circuit board ( 18 ) by lifting the fault line ends ( 54 . 56 ) of the support plates ( 10 . 12 ) the crush trap ( 4 . 6 ) up to the break position; (e) lifting the hold-down device ( 52 ) and releasing the fragments ( 38 ) the ceramic circuit board ( 18 ); (f) moving the platen back ( 10 . 12 ) in the starting position; (g) positioning the ceramic circuit board ( 18 ) in this way on the support plates ( 10 . 12 ) that another line of weakness ( 20 ) along which to break, essentially above the break line ( 14 ) lies; and (h) repeating steps (c) to (g) until the ceramic circuit board ( 18 ) along the lines of weakness ( 20 ) along which to break, has been broken. Process for separating ceramic circuit boards ( 18 ) along lines of weakness ( 20 ) on a ceramic circuit board ( 18 ), comprising the following steps: a) providing a crushing trap ( 4 . 6 ) with two support plates that can be moved relative to each other ( 10 . 12 ) from a starting position in which the support plates ( 10 . 12 ) on a break line ( 14 ) border each other and a substantially flat surface ( 16 ) can be moved to a breaking position in which the two support plates ( 10 . 12 ) are arranged at an angle to each other; b) positioning a ceramic circuit board ( 18 ) in this way on the support plates ( 10 . 12 ) in the starting position that a line of weakness ( 20 ) along which to break, essentially above the break line ( 14 ) lies; (c) breaking the ceramic circuit board ( 18 ) by lowering a crushing sword ( 52 . 8th ), essentially with the line of weakness ( 20 ) is aligned against the line of weakness ( 20 ) and against a predetermined force of the support plates ( 10 . 12 ) and thereby moving the platen downwards ( 10 . 12 ) in the break position; (d) lifting the crushing sword ( 52 . 8th ); (e) moving the platen back ( 10 . 12 ) in the starting position; (f) positioning the ceramic circuit board ( 18 ) in this way on the support plates ( 10 . 12 ) that another line of weakness ( 20 ) along which to break, essentially above the break line ( 14 ) lies; and (g) repeating steps (c) to (f) until the ceramic circuit board along the lines of weakness ( 20 ) along which to break, has been broken. The method of claim 15 or 16, further comprising the step of moving the support surfaces ( 10 . 12 ) upwards into a tapping position to close the gap between the fragments ( 38 . 18 ) a ceramic circuit board ( 18 ) to enlarge. The method of claim 17, further comprising gripping the gap between the fragments ( 38 . 18 ) and remove one of the fragments ( 38 ). Method according to one of claims 15 to 18, wherein the movements of the contact surfaces ( 10 . 12 ) are executed synchronously. Method according to one of claims 15 to 19, comprising the step of braking the ceramic circuit board ( 18 ) after positioning.