DE29919961U1 - Device for separating electrical or electronic substrates from multiple substrates having a plurality of such substrates - Google Patents

Device for separating electrical or electronic substrates from multiple substrates having a plurality of such substrates

Info

Publication number
DE29919961U1
DE29919961U1 DE29919961U DE29919961U DE29919961U1 DE 29919961 U1 DE29919961 U1 DE 29919961U1 DE 29919961 U DE29919961 U DE 29919961U DE 29919961 U DE29919961 U DE 29919961U DE 29919961 U1 DE29919961 U1 DE 29919961U1
Authority
DE
Germany
Prior art keywords
breaking
tool
substrates
individual substrates
station
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE29919961U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Baumann GmbH
Original Assignee
Baumann GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Baumann GmbH filed Critical Baumann GmbH
Priority to DE29919961U priority Critical patent/DE29919961U1/en
Publication of DE29919961U1 publication Critical patent/DE29919961U1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending

Description

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßtThe description text was not recorded electronically

Claims (15)

1. Vorrichtung zum Vereinzeln von elektrischen oder elektronischen Substraten aus eine Vielzahl solcher Substrate aufweisenden Mehrfachsubstraten (1), welche die Einzelsubstrate (4) jeweils auf einer gemeinsamen Isolier- und/oder Tragplatte (2) aufweisen, die zwischen den Einzelsubstraten (4) mit den Sollbruchlinien (6, 7) versehen ist, und zwar durch Brechen entlang der Sollbruchlinien, gekennzeichnet durch wenigstens einen Brechplatz (19, 20) mit einer elastischen oder nachgiebigen Auflage (39, 39a) zum Auflegen des jeweiligen Mehrfachsubstrates (1) oder eines Teils (R1-R10) hiervon, durch wenigstens ein Brechwerkzeug (23), welches mit einer Brechkante (24) an der der Auflage (39, 39a) gegenüberliegenden Oberflächenseite der Isolier- und/oder Trägerplatte (2) im Bereich einer Sollbruchlinie (6, 7) positionierbar ist, sowie durch Mittel zur Zustellung des Werkzeugs (23) in Richtung Auflage (39, 39a) und zum Anpressen des Werkzeugs (23) mit der Werkzeugkante (24) gegen die Isolier- und Trägerschicht (2), so daß die Isolier- und Trägerschicht (2) verformt wird und entlang der Sollbruchlinie (6, 7) bricht.1. Device for separating electrical or electronic substrates from a plurality of such substrates having multiple substrates ( 1 ), which have the individual substrates ( 4 ) each on a common insulating and / or support plate ( 2 ), which between the individual substrates ( 4 ) the predetermined breaking lines ( 6 , 7 ) is provided, namely by breaking along the predetermined breaking lines, characterized by at least one breaking site ( 19 , 20 ) with an elastic or resilient support ( 39 , 39 a) for placing the respective multiple substrate ( 1 ) or one Part thereof (R1-R10), by at least one breaking tool ( 23 ), which has a breaking edge ( 24 ) on the surface side of the insulating and / or carrier plate ( 2 ) opposite the support ( 39 , 39 a) in the area of a predetermined breaking line ( 6 , 7 ) can be positioned, as well as by means for feeding the tool ( 23 ) in the direction of the support ( 39 , 39 a) and for pressing the tool ( 23 ) with the Tool edge ( 24 ) against the insulating and carrier layer ( 2 ), so that the insulating and carrier layer ( 2 ) is deformed and breaks along the predetermined breaking line ( 6 , 7 ). 2. Vorrichtung nach Anspruch 1, dadurch gekennzeichnet, daß das Brechwerkzeug (23) eine durchgehende Brechkante (24) aufweist.2. Device according to claim 1, characterized in that the breaking tool ( 23 ) has a continuous breaking edge ( 24 ). 3. Vorrichtung nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß das Brechwerkzeug ein schwertartiges Brechwerkzeug (23) ist.3. Apparatus according to claim 1 or 2, characterized in that the breaking tool is a sword-like breaking tool ( 23 ). 4. Vorrichtung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß das Brechwerkzeug (23) oder dessen Brechkante (24) eine Länge aufweist, die wenigstens gleich der Länge oder Breite des Brechplatzes (19, 20) ist.4. Device according to one of the preceding claims, characterized in that the breaking tool ( 23 ) or its breaking edge ( 24 ) has a length which is at least equal to the length or width of the crushing station ( 19 , 20 ). 5. Vorrichtung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß zur Verarbeitung von Mehrfachsubstraten (1), die die Einzelsubstrate (4) in mehreren Reihen (R1-R10) aufweisen, das wenigstens eine Brechwerkzeug (23) eine Breite aufweist, die wenigstens gleich der Breite einer Reihe (R1- R10) ist.5. Device according to one of the preceding claims, characterized in that for processing multiple substrates ( 1 ) which have the individual substrates ( 4 ) in several rows (R1-R10), the at least one breaking tool ( 23 ) has a width which is at least is equal to the width of a row (R1-R10). 6. Vorrichtung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß ein Brechwerkzeug (23) oder eine Gruppe von wenigstens zwei, mit ihren Brechkanten (24) in einer gemeinsamen Linie angeordnete Brechwerkzeuge (23) an einem Träger (11) vorgesehen ist, der durch wenigstens einen Antrieb für eine gesteuerte Bewegung derart bewegbar ist, daß das Brechen an mehreren Sollbruchlinien (6, 7) jeweils zeitlich nacheinander erfolgt.6. Device according to one of the preceding claims, characterized in that a breaking tool ( 23 ) or a group of at least two, with their breaking edges ( 24 ) arranged in a common line breaking tools ( 23 ) is provided on a carrier ( 11 ) can be moved by at least one drive for a controlled movement in such a way that breaking at several predetermined breaking lines ( 6 , 7 ) takes place successively in time. 7. Vorrichtung nach Anspruch 6, dadurch gekennzeichnet, daß zum zeitlich versetzten Brechen an mehreren Sollbruchlinien (6, 7) das Brechwerkzeug (23, 24) und der wenigstens eine Brechplatz (19, 20) in einer Achsrichtung senkrecht zu den Sollbruchlinien (6, 7) oder zur Brechkante (24) des Brechwerkzeugs (23) relativ zueinander verstellbar sind.7. The device according to claim 6, characterized in that for the time-shifted breaking at several predetermined breaking lines ( 6 , 7 ), the breaking tool ( 23 , 24 ) and the at least one breaking station ( 19 , 20 ) in an axial direction perpendicular to the predetermined breaking lines ( 6 , 7 ) or relative to the breaking edge ( 24 ) of the breaking tool ( 23 ). 8. Vorrichtung nach Anspruch 7, dadurch gekennzeichnet, daß bei ortsfestem Brechplatz (19, 20) das Brechwerkzeug (23) in der Achsrichtung senkrecht zu den Sollbruchlinien (6, 7) oder zur Brechkante (24) des Brechwerkzeugs (23) ver- oder zustellbar ist.8. The device according to claim 7, characterized in that at a stationary crushing station ( 19 , 20 ) the breaking tool ( 23 ) in the axial direction perpendicular to the predetermined breaking lines ( 6 , 7 ) or to the breaking edge ( 24 ) of the breaking tool ( 23 ) or is deliverable. 9. Vorrichtung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß zum Verarbeiten von Mehrfachsubstraten (1), bei denen Einzelsubstrate in mehreren Reihen (R1-R10) mit jeweils wenigstens zwei Einzelsubstraten (4) vorgesehen sind, wenigstens zwei Brechplätze (19, 20) vorgesehen sind, und zwar zum Brechen des Mehrfachsubstrates (1) in Substratreihen (R1-R10) an einem ersten Brechplatz (19) und zum Brechen der Substratreihen (R1-R10) in Einzelsubstrate (4) an einem zweiten Brechplatz (20).9. Device according to one of the preceding claims, characterized in that for processing multiple substrates ( 1 ), in which individual substrates are provided in several rows (R1-R10) each with at least two individual substrates ( 4 ), at least two crushing stations ( 19 , 20th ) are provided, namely for breaking the multiple substrate ( 1 ) in rows of substrates (R1-R10) at a first breaking point ( 19 ) and for breaking the rows of substrates (R1-R10) into individual substrates ( 4 ) at a second breaking point ( 20 ). 10. Vorrichtung nach Anspruch 9, gekennzeichnet durch Mittel zum Umsetzen jeder Substratreihe (R1-R10) von dem ersten Brechplatz (19) auf den zweiten Brechplatz (20).10. The device according to claim 9, characterized by means for converting each row of substrates (R1-R10) from the first breaking station ( 19 ) to the second breaking station ( 20 ). 11. Vorrichtung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß der wenigstens eine Brechplatz (19, 20) auf der Auflage (39, 39a) Mittel zum Fixieren des Mehrfachsubstrates (1) oder des Teils hiervon aufweist.11. Device according to one of the preceding claims, characterized in that the at least one breaking station ( 19 , 20 ) on the support ( 39 , 39 a) has means for fixing the multiple substrate ( 1 ) or part thereof. 12. Vorrichtung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß das Brechwerkzeug (23) Teil eines Mehrfunktionswerkzeuges (12) ist, an dem wenigstens ein Greifer (21, 22) für das Mehrfachsubstrat, für die durch Abbrechen erzeugten Substratteile- oder reihen (R1-R10) und/oder für die Einzelsubstrate (4) vorgesehen ist.12. Device according to one of the preceding claims, characterized in that the breaking tool ( 23 ) is part of a multi-function tool ( 12 ) on which at least one gripper ( 21 , 22 ) for the multiple substrate, for the substrate parts or rows generated by breaking ( R1-R10) and / or for the individual substrates ( 4 ) is provided. 13. Vorrichtung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß das Brechwerkzeug (23) oder ein dieses Brechwerkzeug aufweisendes Mehrfunktionswerkzeug (12) an einem Roboterarm (11) vorgesehen ist.13. Device according to one of the preceding claims, characterized in that the breaking tool ( 23 ) or a multi-function tool ( 12 ) having this breaking tool is provided on a robot arm ( 11 ). 14. Vorrichtung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß sie Bestandteil eines Automaten zum Vereinzeln von Einzelsubstraten aus Mehrfachsubstraten (1) ist.14. Device according to one of the preceding claims, characterized in that it is part of an automatic machine for separating individual substrates from multiple substrates ( 1 ). 15. Vorrichtung nach Anspruch 14, dadurch gekennzeichnet, daß der Automat zugleich ein Bestückungsautomat zum Bestücken von Bauelementen, Baugruppen, Geräten usw. mit den Einzelsubstraten (4) ist.15. The apparatus according to claim 14, characterized in that the machine is also an automatic placement machine for loading components, assemblies, devices, etc. with the individual substrates ( 4 ).
DE29919961U 1999-11-15 1999-11-15 Device for separating electrical or electronic substrates from multiple substrates having a plurality of such substrates Expired - Lifetime DE29919961U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE29919961U DE29919961U1 (en) 1999-11-15 1999-11-15 Device for separating electrical or electronic substrates from multiple substrates having a plurality of such substrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE29919961U DE29919961U1 (en) 1999-11-15 1999-11-15 Device for separating electrical or electronic substrates from multiple substrates having a plurality of such substrates

Publications (1)

Publication Number Publication Date
DE29919961U1 true DE29919961U1 (en) 2000-03-23

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DE29919961U Expired - Lifetime DE29919961U1 (en) 1999-11-15 1999-11-15 Device for separating electrical or electronic substrates from multiple substrates having a plurality of such substrates

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Country Link
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1217878A2 (en) * 2000-12-21 2002-06-26 Xerox Corporation Specialized tool adapted for a process for manufacture and interconnection between adjoining printed wiring boards
DE10314179A1 (en) * 2003-03-17 2004-10-07 Baumann Gmbh Breaking device for separating ceramic circuit boards
DE10311693B3 (en) * 2003-03-17 2004-12-02 Baumann Gmbh Breaking unit for separating ceramic circuit boards, supports board on pivoted plates and has positioner aligning breaker bar with lines of weakness

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1217878A2 (en) * 2000-12-21 2002-06-26 Xerox Corporation Specialized tool adapted for a process for manufacture and interconnection between adjoining printed wiring boards
EP1217878A3 (en) * 2000-12-21 2004-04-14 Xerox Corporation Specialized tool adapted for a process for manufacture and interconnection between adjoining printed wiring boards
DE10314179A1 (en) * 2003-03-17 2004-10-07 Baumann Gmbh Breaking device for separating ceramic circuit boards
DE10311693B3 (en) * 2003-03-17 2004-12-02 Baumann Gmbh Breaking unit for separating ceramic circuit boards, supports board on pivoted plates and has positioner aligning breaker bar with lines of weakness

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