DE10203827A1 - Circuit board device for electronic components, has stacked layer segments including internal conductor, intermediate insulating layer and external conductor for receiving electrical components - Google Patents

Abstract

The circuit board device includes a circuit board element (20) comprising at least two circuit board segments (30,40), each consisting of a layer stack (31,41) of at least one internal conductor (32,42), at least one external conductor (34,44), and at least one intermediate insulating layer (33,43). The circuit board segments are connected together. At least one external conductor is adapted to receive at least one electrical component. Independent claims are also included for: (1) a circuit board system; and (2) an electronic component

Description

The present invention initially relates to a circuit board arrangement at least one semiconductor component according to the preamble of Claim 1. The invention further relates to a circuit board system and a electrical component.

Printed circuit board arrangements consist, for example, of a printed circuit board element, which in turn consists of a layer stack of electrically conductive layers and insulation layers. On an outer layer of the layer stack is then the at least one semiconductor component is arranged. Such Printed circuit board arrangement is described for example in EP-A 0 376 100. Around the semiconductor components located on the outer layer with the im To contact circuit board element located electrically conductive layers, this known circuit board arrangement has a number of bores, which in mounting surfaces for the semiconductor components located on the outer layer open and the flat conductor tracks in the circuit board touch electrically conductive layers. The holes are made with an electric conductive material filled, so that an electrical and thermal contact between the semiconductor component and the electrically conductive. layers arises.

However, the known circuit board arrangement has a number of disadvantages. So this is initially complex to manufacture, since corresponding holes in introduced the circuit board element and then with a molten Medium, for example a solder, must be filled. Furthermore, the known solution a proper contacting of the semiconductor devices not easily guaranteed with the electrically conductive layers, since in the molten medium within the holes defects such as gas bubbles, blowholes and the like can occur.

From EP 0 942 505 a circuit board arrangement is also known which Has the function of a busbar. This PCB assembly consists of a layer sequence of alternately laminated one above the other Conductor layers (busbars) and insulating layers. Every track is included connected to a contact flag, the contact flags via corresponding Recesses in the insulating layers and sometimes also in the others Busbars are routed to the outside. The disadvantage of this known solution is however, that this initially has a complicated structure, especially what concerns the passage of the contact lugs through the individual layers. Furthermore, problems arise with the known solution in relation to the Thermal management, especially with regard to the uniform removal of the in the heat generated by the circuit board arrangement.

In addition, only an arrangement of semiconductor Building elements provided on one side of the circuit board assembly, so that only a limited number of semiconductor devices per circuit board arrangement is sensibly possible. If in the known solution a large number of Semiconductor components to be placed on the circuit board arrangement would have to the outer layer intended for receiving has a large area, which however again problems related to power distribution and Temperature.

The present invention is based on the cited prior art The object of the present invention is to provide a printed circuit board arrangement which is suitable for high Current carrying capacity is simple and inexpensive to manufacture. Furthermore, a accordingly improved circuit board system and an electrical component to be provided.

This object is achieved with the circuit board arrangement the features according to independent claim 1, the Printed circuit board system with the features according to the independent claim 10 and the electrical component with the features according to the independent Claim 12. Further advantages, features, details, aspects and effects of Invention result from the dependent claims, the description and the Drawings. Features and details related to the Circuit board arrangement are described, of course, also apply to the circuit board system and / or the electrical component, and vice versa.

According to the first aspect of the invention, a printed circuit board arrangement for a provided electronic component, comprising at least one Printed circuit board element, consisting of a layer stack of at least one electrically conductive layer and at least one insulation layer, one being electrically conductive layer formed outer layer of the layer stack for Recording at least one electronic component is formed. The Circuit board arrangement is characterized in that the Printed circuit board element is formed from at least two printed circuit board segments that each circuit board segment a layer stack of at least one inner conductor, at least one outer conductor and at least one arranged in between Insulation layer has that the circuit board segments connected to each other are and that at least one outer conductor for receiving at least one electronic component is formed.

The invention is not limited to certain types of electronic components limited. For example, but not exclusively, the electronic ones Components can be designed in the form of semiconductor components. For example can be components for power semiconductor stages, for example Transistors such as MOSFET transistors and the like. If it’s the Semiconductor components, for example around low-voltage MOSFET transistors this is particularly advantageous due to the low impedance level. This form of electronic components will be described later in the description explained in more detail in some places, without the invention being specific to these Embodiments would be limited.

The circuit board arrangement according to the invention makes it possible to use electronic Components that are or will be connected to the circuit board arrangement simple way to supply electrical energy. At the same time, the the heat generated can be dissipated particularly easily and, above all, evenly.

A basic idea of the present invention is that now at least two circuit board segments are provided, which in a special way and Way connected. That way, here, compared to the solution known from the prior art, much more electronic Components can be realized on the circuit board arrangement, which is an increased Current carrying capacity and higher performance through improved Electricity heat transport than previously possible.

The performance of an electronic device designed as a semiconductor component Component on a circuit board is created by the operation Current heat, the permissible limit temperature of the semiconductor crystal, and that of Component itself and via the mounting surface and electrical connections to the Environment derived heat flows determined.

In addition to various interface effects, even the best limit Thermal conductor materials (e.g. copper) as mounting surfaces, with a material-specific (mass, e.g. volume-related, specific) Thermal conductivity is the transport of electricity into the solid volume below the Mounting surface. An increase in the effective cross-sectional areas A of a Electricity heat transport involved line volume V therefore reduces the area-related heat flow density dQ / dA for an emerging heat flow dQ / dt.

The ladder arrangement according to the invention in the room allows economical Realization of electrical and thermal line structures for electronic Components in larger array solutions at a high level of performance. An array is characterized in that it advantageously has a number of electronic Components which is larger, in particular much larger than two.

A total heat flow is divided into many across all individual semiconductors in the array Partial heat flows on. Because of the larger sum of the effective ones Cross-sectional areas A of the current heat dissipation of the individual semiconductors involved line volumes in the mounting base plate results in a reduced Heat flow density dQ / dA for the single semiconductor, resulting in a lower leads to thermal stress of the single semiconductor in the array.

With the circuit board arrangement according to the invention can be by some details very large, almost arbitrarily scalable arrays Realize power semiconductors reproducibly.

By designing the circuit board segments in space as possible Low induction, symmetrical arrangements, with short path, very low-impedance connection contact of the individual semiconductor elements, can Different signal propagation times of the interconnection within the array extension minimized, a precise switching behavior, as a mandatory requirement for one correct electrical function of identical individual elements in large arrays, largely ensured. This will be discussed later in the description explained in more detail.

A uniform current distribution of the total array current to the Individual elements is only for a very even tempering of Single semiconductors of the same type can be achieved within an array. Through the Offset mounting of the single semiconductors on the front and back of the PCB segments, each on a very good heat conductor, the Leveled temperature differences in the array that are exponentially temperature dependent Channel resistances, and thus the load current distribution, each other approximated.

The significantly enlarged ones available for semiconductor assembly Surfaces also provide considerably more favorable conditions for a Convection cooling. Any additional heat sinks that may be required may result from this. can be dimensioned smaller or, depending on the operating mode, can now be completely eliminated.

Basically, the invention is not limited to a certain number PCB elements per PCB arrangement as well as a certain number of Single layers per circuit board segment limited. A circuit board segment consists in its simplest form of an inner conductor, a Outer conductor and an insulation layer arranged between them. Are natural refinements are also conceivable, in each of which more than one inner conductor and / or more than one outer conductor and / or more than one insulation layer is provided.

Furthermore, the circuit board element consists of at least two Printed circuit board segments which are designed as described above. Of course, the circuit board element can also have more than two Have circuit board segments.

It is only important that the circuit board segments are connected to each other. For this purpose it can be provided, for example, that the printed circuit board segments over one of their inner conductor layers is directly connected to one another. A the resulting double-layer inner layer of inner conductor layers advantageously form two flat conductor structures, each facing a surface, which are suitable, for example, for single-ended topologies and push-pull topologies with central tapping of the load, advantageously touch the entire surface inside at the same electrical potential. It However, it is also conceivable that the circuit board segments over one of each Inner conductor layers are indirectly connected to each other by between the Inner conductor layers at least one further insulation layer is provided. A such separation of the inner conductor layers is, for example, for others Circuit topologies quite conceivable.

Furthermore, the circuit board segments must have at least one outer conductor have, on which the at least one electronic component is arranged.

The circuit board arrangement according to the invention forms as above described embodiment, for example, a conductor structure in the form of a Multilayer combination of preferably two outer conductors on the outer layers and preferably a double layer of inner conductors and two each insulation layers in between. This circuit board arrangement is around equipping on both sides with electronic components, for example Power semiconductors, supplemented on the outer conductors acting as outer layers.

To produce such a circuit board arrangement, for example be provided that the individual layers are first manufactured separately and then be put together to the circuit board elements that finally be assembled to the PCB arrangement. The connection of the individual layers can be created using a lamination process, adhesive process, Sintering, soldering, welding and the like realized become. Of course, it is also conceivable that individual layers, for example the Inner conductor layers and the insulation layers executed as a single component are, this component then around the at least one outer conductor is added. The double layer on inner conductor layers and insulation layers can therefore advantageous as a single component, as a flexible printed circuit board as rigid-flexible Combination or the like can be performed. The outer conductor surfaces In such a case (outer conductor) can also be designed flexibly.

By adding additional rigid outer conductor surfaces on the same electrical potential, the thermal thermal conductivity can be compared to a flexible circuit board alone significantly increase.

Is of particular advantage in the circuit board arrangement according to the invention in particular, that the scalability of the arrangement over the number of - in particular connected in parallel - electronic components while maintaining identical conductor lengths in the load circuit for the central leads.

As a further advantage in the circuit board arrangement according to the invention Driver modules for the electronic components, for example for semiconductor Components, very advantageous - with the shortest possible cable lengths to the electronic components - directly above the electronic components to be assembled. Non-exclusive examples of this will be given later the description explained in more detail.

In contrast to integrated power modules, with the general problem a concentration of the resulting electricity heat outputs to a very small one Mounting area, as well as with the need to go beyond the limited Thermal conductivity capabilities of even the best heat conductors, element cooling by Having to ensure the heat transfer of very powerful cooling systems the circuit board arrangement according to the invention reduces the heat flow density already in the beginning and thereby alleviates this problem considerably.

The circuit board element can advantageously be formed from two circuit board segments be, wherein the circuit board element has a symmetrical structure. By this symmetrical structure of the circuit board element from two identical assembled circuit board segments are the advantages described above the circuit board arrangement achieved even better. This applies in particular to the Uniform current distribution structure that can be achieved according to the invention uniform current run times as well as the achievable uniform Temperature characteristics.

If the two circuit board segments directly over two of their inner conductor layers are connected to each other, the double-layer structure in this case consists of two Inner conductors advantageously two, one surface of the circuit board element facing, flat conductor structures, which are advantageous for single-ended topologies and push-pull topologies with central tapping of the load, on the same inside Touch the electrical potential across the surface.

The additional axial symmetry in the case of a symmetrical structure also guarantees the same signal propagation times in the line system of the Load circuit. It also ensures that the often by Parasitic effects also affect the switching times of the individual electronic components are almost the same here, an identical one Driver control required. As a result, it becomes uniform Switching behavior within the entire array of electronic components ensured.

In a further embodiment, the circuit board element can have a planar structure have planar individual layers. Such individual layers can be opened up manufacture simple and inexpensive way. If it is electronic Components are transistors, the low impedance is one low-inductance planar conductor splinting of drain and source High current applications for overvoltage control extremely important.

The inner conductor and / or the insulation layers of the PCB segments should be flexible. In this case, the inner conductor and the insulation layers can be designed as a so-called "flexible printed circuit board".

The invention is limited to non-specific materials for the inner conductor. It is only important that the inner conductor is made of an electrically conductive material, for example made of copper, aluminum or the like.

Likewise, the invention is not limited to specific materials for the insulation layers limited. It is only important that the materials have an electrically insulating effect. For example, the insulation layers made of FR4 material, Silicone / glass fabric, as polyamide film, Teflon film, Kapton film, polystyrene film or other electrical insulation materials. Especially The insulation materials advantageously also have good thermal properties Conductivity on.

The outer conductors can also be flexible. They are advantageous However, the outer conductor is rigid, so that this rigid outer layer of Form circuit board elements and thus the entire circuit board arrangement. The Outer conductors are in turn advantageously made of electrically highly conductive material such as Copper, aluminum or the like is formed.

The circuit board arrangement can advantageously have a number of N Have circuit board elements, where N is greater than / equal to 2. In extension of one double conductor structure, in which one formed from printed circuit board segments Printed circuit board element is provided, can be used when more than two PCB elements also a multi-arm, spatially fanned out PCB arrangement can be achieved.

The circuit board elements can advantageously be connected to one another, the invention being not limited to certain types of connections. For example, it is conceivable that the individual circuit board elements are screwed together, be folded, riveted, welded or the like.

The circuit board arrangement can be particularly advantageous three circuit board elements have, the circuit board elements preferably star-shaped with each other are connected.

The preferably rigid outer conductors provide an advantageous one Multiple benefits. First of all, it is possible to have a mechanically self-supporting To create structure so that other support structures are unnecessary. Farther can use the outer conductor as a planar conductor for an electrical and thermal Favorable direct housing contact of the electronic components at high Streams and services are used. In addition, such Arrangement of the circuit board elements as a thermal management of the Electronic component serving system for flat power distribution and Conduct heat within the overall structure. After all, there is one Convection cooling by the surrounding air, or the transfer of Electricity heat possible to a cooling system provided for this purpose.

Through the on the front and back of each leg - for example in Offset arrangement distributed - arranged electronic components Peak temperatures avoided as best as possible, because the temperature differences in the entire array should be leveled if possible. If the electronic components as semiconductor components, such as MOSFET transistors this in turn has a beneficial effect on the exponential of temperature dependent channel resistance of each MOSFET, for which in addition to the Mask geometry and the manufacturing process always the temperature-dependent Carrier mobility plays a crucial role. An even one Thermal in the array is therefore very important for the even distribution of the total load current on the channel resistances of all semiconductor components.

The comparatively large areas of the star-shaped arrangement Printed circuit board elements, especially the large areas of advantageously rigid and solidly trained outer conductors, also take over very well Function of a heat sink, via which in the electronic components heat can be dissipated.

The mechanical structure of three printed circuit board elements is star-shaped are aligned, the individual legs each having an angle of 120 ° include, and which are interconnected, also for in the axial direction longer geometries are self-supporting.

According to a second aspect of the invention, a printed circuit board system for at least one electronic component provided, which according to the invention two or more of the present invention as described above Printed circuit board arrangements exist. In this way, any size and contoured networks of circuit board arrangements can be realized.

The circuit board arrangements are advantageously parallel via central derivatives connected. The parallel connection can preferably be made by central derivatives be realized with the same line path lengths in electrical symmetry. With Parallel connection of several circuit board arrangements, especially if this as described above can be advantageous - again taking into account the symmetry conditions for the derivatives and controls - also very large "mega arrays" of electronic Components are formed, which are then also suitable for applications with very high load currents.

The circuit board arrangement according to the invention as described above or enables the circuit board system according to the invention for example the comparatively simple realization of larger semiconductor arrays also for use in electronic power levels in single-ended, push-pull or bridge topologies through the mastery of some thermal structures and key electrical parameters. For this are the circuit board arrangements preferably star-shaped, made of double planar ladder Structures formed. These planar leader structures consist of each two printed circuit board segments.

According to a third aspect of the invention, an electrical component provided with an inventive as described above PCB assembly or one as described above Printed circuit board system according to the invention, with at least one outer conductor at least one electronic component is arranged. The electronic component can advantageous as a semiconductor component in the form described above be trained. An array can be particularly preferred on the outer conductor electronic components can be arranged.

Preferably, at least one electronic can be in a circuit board element Component mutually offset on the outer conductor of a circuit board segment (interleave) to at least one electronic component on the outer conductor another circuit board segment connected to this circuit board segment be arranged. So that the total available Mounting surfaces can be optimally used. Overall, one can be advantageous even number of electronic components can be provided. This arrangement the electronic components advantageously ensures a uniform Temperature distribution within the circuit board element, with a certain Leveling of local temperature minima and maxima.

In a further embodiment, at least one in a circuit board element electronic component via a contacting device with an inner conductor of the PCB segment to be connected. If it is the electronic Component is a transistor, the inner conductor can be the source for the Represent transistor. The invention is not limited to certain types of Contacting devices limited. A short and / or wide one is preferred and / or extremely low impedance and / or within a circuit board element identically designed connection with respect to the - in particular identical in construction - electronic individual components realized.

Below are some non-exclusive examples of suitable ones Contacting devices described. For example, it is conceivable that the Contacting device at least partially connected to the inner conductor Has contact flag. This creates a very even, extremely low-impedance contacting of the often parallel connected electronic Components, for example the semiconductor components of the array with the Load circuit. The minimum and particularly advantageous are identical conductor lengths possible between the inner conductors and the electronic components, with which some important prerequisites for the Function and controllability of larger arrays made of electronic Components in high current circuits can be achieved.

It is advantageous through the configuration of the contacting device in the form of a Contacting lug a wide-area, low-induction contacting of the electrical Connections of the electronic components realized. With these connections can it is for example contact pins or the like. It is the same naturally also conceivable that the electronic components in one corresponding housing are integrated and that the contact via the Housing is done.

The contact tab can be punched out of the inner conductor, for example, the contact lug advantageously punched out of the inner conductor on three edges or cut out. The contact tab can be on a fourth edge continue to be connected to the inner conductor via a bending line, as a result of which the Contacting flag towards the outside in the direction of the electronic components can be bent. In another embodiment, it is conceivable that the Contact tab as a contact tongue protruding laterally over the inner conductor or contact tab is formed. Of course, too other designs for the contact flag are possible.

In an advantageous embodiment, the at least one insulation layer can be a Have recess for passing the contacting device. At a such a recess can be, for example, an edge Recess or around a hole in the insulation layer or act a breakthrough. Similar recesses can be made depending on the design the outer conductor can also be provided in these. The recesses have that Task, the contact lug leading away from the inner conductor through the insulation layer and / or pass the outer conductor through, so that it can then be connected to the electronic component can be connected. Depending on the design of the Insulation layer and / or the outer conductor and / or the contacting elements of the electronic component, it can also be provided that the Contact flags completely outside the boundary lines of these individual layers be guided past, so that in such a case no recess is required.

The circuit board arrangement according to the invention described above and the circuit board system according to the invention can be particularly preferred for the pulsed short-circuit operation of powerful fuel cell Stacks within an electronic approach to regeneration of the Use fuel cell stacks after carbon monoxide poisoning.

In a fuel cell, for example a PEM fuel cell, a chemical reaction generates electricity. This is a fuel such as Hydrogen, and an oxidizing agent such as oxygen from the air electrical energy and a reaction product such as water converted. A fuel cell essentially consists of an anode part, a membrane (electrolyte) and a cathode part. The membrane consists of a gastight and proton conductive material and is between the anode and the Cathode arranged to exchange ions. On the side of the anode, the Fuel supplied while on the side of the cathode the oxidant is fed. At the anode, protons, or hydrogen ions generated, which through the membrane to Move cathode. The hydrogen ions react with the at the cathode Oxygen, and water forms. The electrons released during the reaction can be conducted as electrical current through a consumer.

If you want the fuel cell with an easily available or storable one Operate fuel such as natural gas, methanol, gasoline, diesel or the like the hydrocarbon in an arrangement for generating / processing a First convert the fuel into a hydrogen-rich gas. In doing so, this will essentially decomposed to hydrogen and carbon dioxide. Still arises also carbon monoxide, which is a gas that is harmful to the fuel cell, since it makes the catalyst on the anode side ineffective and therefore before entry of the fuel in the fuel cell must be removed.

In the fuel cell, carbon monoxide can be used, but also for others Fuel cell harmful substances, from a certain concentration cause that the power output by the fuel cell decreases and consequently the Efficiency of the fuel cell is greatly reduced.

To such a harmful influence of carbon monoxide on the fuel cell To prevent a fuel cell is described in WO 98/42038, in which Performance loss due to absorbed on the anode catalyst Contamination should be avoided. This is achieved in that the Fuel cell is connected to means that unite the anode of the fuel cell Imprint positive voltage pulse. By stamping the voltage pulse a pulsed change in the anode potential is brought about. Through this Pulse-shaped changes in the anode potential is achieved in that Carbon monoxide located in the fuel cell is oxidized (detoxification of the Fuel cell). With a component of these means to impress more positive Voltage pulses can be the invention described above Printed circuit board arrangement or the printed circuit board system according to the invention act as the structural basis of a very powerful switching semiconductor array.

The invention will now be described using exemplary embodiments with reference to the accompanying drawing explained. Show it:

Fig. 1 shows a schematic, perspective view of an inventive circuit board member;

FIG. 2 shows a schematic cross-sectional view of the circuit board element according to the invention according to FIG. 1;

Fig. 3 shows a schematic, perspective view of a first embodiment of a printed circuit board assembly according to the invention with semiconductor components;

FIG. 4 shows a schematic cross-sectional view of the circuit board arrangement with semiconductor components according to FIG. 3;

FIG. 5 is a schematic, perspective view of another embodiment of a circuit board assembly according to the invention with semiconductor components;

Fig. 6 different embodiment possibilities of circuit board assemblies;

Figures 7a to 7d different embodiment variants of the printed circuit board systems consisting of a number of printed circuit board assemblies. and

Fig. 8 to 11, various circuit Stop homologies with the inventive printed circuit board assemblies.

In Figs. 1 and 2, a printed circuit board element 20 is shown, which (not shown) for receiving electronic components, in the case of semiconductor devices is used. The circuit board element 20 consists of two circuit board segments 30 and 40 . The printed circuit board segment 30 has a layer stack 31 made of planar individual layers. The individual layers are an inner conductor 32 , an insulation layer 33 and an outer conductor 34 . Likewise, the printed circuit board segment 40 consists of a layer stack 41 with an inner conductor 42 , an insulation layer 43 and an outer conductor 44 .

The two printed circuit board segments 30 and 40 are connected to one another via the inner conductors 32 and 42 . The circuit board element 20 has a symmetrical structure. In the present example, this symmetry is related to the layer sequence, the assembly to be carried out with semiconductor components, with regard to the connections of the individual semiconductor components within a printed circuit board segment and with respect to the rotational symmetry about an axis of symmetry XX '(see FIG. 5) given.

The circuit board element 20 forms a double, planar conductor structure in the form of a multilayer combination of preferably two rigid conductors on the outer layers (outer conductors 34 , 44 ) and preferably a double layer of flexible film conductors (inner conductors 32 , 42 ). The outer conductors serve both as current conductors and as current heat conductors. Depending on the implementation of different circuit topologies, the inner conductors 32 , 42 can be connected directly to one another. In this case, the double-layer film inner layer forms two flat conductor structures, each facing a surface, which, for example for single-ended topologies or push-pull topologies with center tapping of the load, advantageously have full contact inside on the same electrical potential. It is also conceivable that the inner conductors 32 , 42 are separated from one another by at least one further insulating intermediate layer (not shown).

Both the outer conductor and the inner conductor are advantageously made of copper. Between the conductor layers there are two insulation layers 33 , 43 as inner layers, which are formed, for example, from FR4 circuit boards or other electrical insulation materials. The insulation layers 33 , 43 furthermore preferably have good thermal conductivity.

The inner double conductor layer and the inner insulation layers can advantageously also be designed as a single component, as a so-called flexible printed circuit board, as a rigid-flexible combination or the like. In this case, the outer conductors 34 , 44 can also be made flexible. The flexible conductors can be designed, for example, as laminates. It can also be advantageously provided that the outer conductors 34 , 44 are designed as rigid outer conductors. Such an embodiment is described by way of example below. Of course, it is also conceivable that, in addition to a flexible outer conductor, a further, additional rigid outer conductor surface is added at the same electrical potential, as a result of which the thermal thermal conductivity can be further increased compared to the flexible outer conductor plate alone.

1 and 2, the circuit board element 20 according to FIGS. 1 and 2 is then equipped with semiconductor components 50 on both sides with semiconductor components 50 , as shown in connection with FIGS. 3 and 4, in order to utilize the total available mounting area on the - preferably rigid - outer conductors 34 , 44 is. The semiconductor components are, for example, power semiconductors. Here, the printed circuit board element in FIGS. 3 and 4 shown has 20 identical in construction to that shown in Figs. 1 and printed circuit board element 20 described 2 so that identical components are given the same reference numerals, and relative to the base structure of the circuit board member 20 of the above, is taken and hereby referred.

In the exemplary embodiment according to FIGS. 3 and 4, use is preferably made of a mutual offset arrangement (interleave) of equipping with semiconductor components 50 on the respective outer conductors 34 , 44 , with an even number of semiconductor components in total. This arrangement of the semiconductor components 50 ensures a uniform temperature distribution within the array of semiconductor components 50 or within the circuit board element 2 D, with a certain leveling of the local temperature maxima and minima via the spatial coordinate of the longitudinal axis L (scaling axis) of the planar semiconductor array.

In the exemplary embodiment according to FIGS. 3 and 4, the printed circuit board element 20 shown in FIGS. 1 and 2 is equipped on both sides with semiconductor components 50 on the preferably rigid outer conductors 34 , 44 , utilizing the available mounting area. The semiconductor components are designed as so-called MOSFET transistors. For these transistors, the inner conductors 32 , 42 represent the source busbar S, while the outer conductors 34 , 44 here as drain busbar D are in direct contact with the drain connection areas on the underside of the housing of the semiconductor components 50 . The semiconductor components 50 are controlled via their individual gate connections G by driver modules 55 located above them.

For electrical contacting, the semiconductor components 50 are first connected to the electrically conductive outer conductor 34 , 44 . Furthermore, the semiconductor components 50 are electrically connected to the inner conductors 32 and 42 via a contacting device 60 . For this purpose, the semiconductor components 50 initially each have a number of contact pins 51 . These contact pins 51 are connected to the contact device 60 . For this purpose, the contacting device 60 has a contacting lug 61 for each semiconductor component 50 , which are punched out of the inner conductor 32 , 42 on three sides along a punching line 62 . The contact lugs 61 are still connected to the inner conductors 32 , 42 via a bending line 63 (fourth side), so that the contact lugs 61 can be bent up in the direction of the contact pins 51 of the semiconductor component 50 . This enables wide-area, low-induction contacting of the contact pins 51 of the semiconductor components 50 .

The contact lugs 61 are insulated and fixed by an insulation potting 64 , preferably using silicone.

This enables very advantageous, uniform, extremely low-impedance contacting of the discrete semiconductor components 50 of the entire array, which are often connected in parallel, of the entire array in the load circuit, with only minimal, particularly advantageously identical conductor lengths being present between all semiconductor components 50 and the respective inner conductors 32 , 42 . An important prerequisite for the function and controllability of larger semiconductor arrays in high-current circuits is thus achieved. It is particularly advantageous here that the arrangement can be scaled over the number of semiconductor components 50 connected in parallel and while maintaining identical conductor lengths in the load circuit for the central derivatives in each case at one point.

In Figs. 1 to 4 printed circuit board elements 20 are shown, which have a double, that is, from two board segments 30, 40 existing Planarleiterstruktur. However, it is also conceivable that a circuit board arrangement consisting of a plurality of circuit board elements 20 is formed. Such a circuit board arrangement 10 is shown in FIG. 5.

The printed circuit board arrangement 10 shown in FIG. 5 consists of a total of three printed circuit board elements 20 , which are each formed from two printed circuit board segments 30 and 40 . The structure of each printed circuit board element 20 corresponds to the exemplary embodiment described in connection with FIGS. 1 to 4, so that in this respect reference is made to the above statements and reference is hereby made. The three printed circuit board elements 20 according to FIGS. 3 and 4 are composed in a star shape, each printed circuit board element 20 forming one leg of this star. The star-shaped arrangement of planar printed circuit board elements 20 results along an axis of symmetry XX 'in space (see FIG. 5), formed from three identical printed circuit board elements 20 in the form of angle plates, with an opening angle of 120 degrees each. The individual circuit board elements 20 are connected to one another, for example, by means of screwing, riveting or the like.

The central derivatives of all drain connections d1, d2, d3 and source connections s1, s2, s3 end with symmetrical cable lengths in one point D, S.

In such a configuration of the circuit board arrangement 10 , the respective outer conductors of the circuit board elements 20 are preferably rigid and made of copper sheet. In this way, the outer conductors provide an advantageous multiple benefit, which has already been explained in detail above in connection with the general description of the invention.

• a) als mechanisch selbsttragende Struktur (andere Tragstrukturen sind entbehrlich);
• b) als planarer Stromleiter, für die elektrisch und thermisch besonders günstige, direkte Gehäusekontaktierung der Halbleiter-Bauelemente bei hohen Strömen und Leistungen;
• c) als ein dem thermalen Management der Halbleiter-Bauelemente dienendes System zur flächigen Stromwärmeverteilung und Wärmeleitung innerhalb der Gesamtstruktur;
• d) sowie zur Konvektionskühlung durch die umgebende Luft, oder die Weiterleitung der Stromwärme an dafür prädestinierte Kühlsysteme.

The preferably rigid outer conductor surfaces 34 , 44 made of copper sheet provide an advantageous multiple use:

• a) as a mechanically self-supporting structure (other supporting structures are unnecessary);
• b) as a planar current conductor, for the electrically and thermally particularly favorable, direct housing contact of the semiconductor components at high currents and powers;
• c) as a system for the thermal management of the semiconductor components for the areal current heat distribution and heat conduction within the overall structure;
• d) as well as for convection cooling by the surrounding air, or the forwarding of the current heat to cooling systems predestined for it.

In the example according to FIG. 5, N = 3 Cu angles are connected to one another, which form a unit, namely with one another, with the insulation layers, with the discrete semiconductor components (here, for example 18 pieces of MOSFET transistors) and with the 3 (here: for example) common source connection foils) inner conductors in double layer.

Thus, for this example of a three-armed 120 ° star structure, all are located Source connections on the one hand and the drain connections of the MOSFETs on the other hand, very advantageously connected to each other at low impedance and in a particularly advantageous manner (Rotation) symmetry for the conductor lengths of the central derivatives of source and Drain, in one connection point each.

As a further advantage, with this arrangement the driver modules 55 for the semiconductor components 50 ( FIG. 3) can be mounted here very advantageously — with the shortest possible line lengths to the semiconductor components — for example by means of a printed circuit card — directly above the semiconductor components themselves.

The invention is not restricted to a specific number of printed circuit board elements per printed circuit board arrangement. Rather, the printed circuit board arrangement can generally have N printed circuit board elements, with N greater than or equal to 1. A number of different configuration options for printed circuit board arrangements are shown in FIG. 6, the number N of printed circuit board elements here being varied between 1 and 6.

Larger circuit board systems 70 , which are then also suitable for applications with very high load currents, can advantageously be formed with parallel connection of a plurality of such circuit board arrangements, in particular taking into account the symmetry conditions for derivatives and controls. Examples of parallel structures, which are also particularly suitable for the advantageous implementation of extensive, microscopic and macroscopic cellular structures - using appropriately dimensioned semiconductor components - are shown in FIG. 7. Fig. 7a and 7c show this cellular structures in parallel, each with two three board members 20, six printed circuit board elements 20. FIG. 7b shows a cellular parallel structure with a total of 3 × 3 = 9 circuit board elements 20 , while FIG. 7d shows a cellular parallel structure with 4 × 4 = 16 circuit board elements 20 .

The applications of semiconductor arrays on printed circuit board elements 20 or printed circuit board arrangements 10 for single-ended topologies shown and described in FIGS. 1 to 7 can advantageously also be expanded to power electronic push-pull topologies and bridge circuits. In FIGS. 8 and 9, two examples for single ended circuit topologies are illustrated 80 by which a single-ended operation of circuit board assemblies 10, in the present case of star-shaped (N = 3) printed circuit board assemblies 10 is possible.

For the simple case of a push-pull half-bridge circuit 90 , as shown in FIGS. 10 and 11, a plurality of individual printed circuit board arrangements 10 , which are mounted isolated from one another and driven in phase opposition - which preferably have a star structure (N = 3) - can also be used implement push-pull operation.

In the expansion of such half-bridge circuits, double-phase full bridges can also be realized by multiplication, and poly-phase bridge circuits can also be realized by multiplication. In addition to this form of interconnection of star-shaped printed circuit board arrangements 10 , there is also the very advantageous possibility, in particular for multiphase applications in converter technology or for multi-channel analog power stages, that each angular leg of the star structure, that is to say each printed circuit board element, has one power stage in half-bridge topology for each electrical phase is assigned.

• a) die Vor- und Rückseite je eines Winkelschenkels (Leiterplattenelements) wird vorteilhaft jeweils für die Realisierung von Teil-Arrays, entsprechend entweder dem oberen oder dem unteren Halbleiter-Bauelement eines Halbbrückenzweigs einer Phase genutzt; oder
• b) die symmetrische, in axialer Länge vorteilhaft skalierbare Array-Struktur eines Sterns (beispielsweise in Form einer Leiterplattenanordnung mit N = 3 Leiterplattenelementen) wird vorteilhaft in zwei gegeneinander isolierte, axial "gestapelte" Teilsterne untergliedert. Je einer der beiden isolierten Teilsterne trägt hierbei dann die Halbleiter-Bauelemente des oberen oder des unteren Halbbrückenzweigs.

For the implementation of push-pull power levels, for example, there are two different solutions for dividing the upper and lower semiconductor element arrays:

• a) the front and back of each angled leg (circuit board element) is advantageously used in each case for the realization of partial arrays, corresponding to either the upper or the lower semiconductor component of a half-bridge branch of a phase; or
• b) the symmetrical, advantageously axially scalable array structure of a star (for example in the form of a circuit board arrangement with N = 3 circuit board elements) is advantageously subdivided into two axially “stacked” partial stars that are insulated from one another. One of the two isolated partial stars then carries the semiconductor components of the upper or lower half-bridge branch.

The very advantageous division and use of the individual angled legs (printed circuit board elements) of the star-shaped printed circuit board arrangement for multi-phase applications is fully retained. In this embodiment, the entire circuit board arrangement advantageously remains small and compact. REFERENCE SIGNS LIST 10 PCB assembly
20 circuit board element
30 circuit board segment
31 layers of layers
32 inner conductor
33 insulation layer
34 outer conductor
40 circuit board segment
41 layers stack
42 inner conductor
43 insulation layer
44 outer conductor
50 semiconductor device
51 contact pin
55 driver module
60 contaminating device
61 Contact flag
62 punching line
63 bending line
64 Insulation potting
70 PCB system
80 circuit topology (single-ended)
90 circuit topology (push-pull)
D drain busbar
S Source busbar
G gate connection
L longitudinal axis

Claims (18)

1. Circuit board arrangement ( 10 ) for at least one electronic component ( 50 ), comprising at least one circuit board element ( 20 ) consisting of a layer stack of at least one electrically conductive layer and at least one insulation layer, wherein an outer layer of the layer stack designed as an electrically conductive layer for receiving at least of an electronic component ( 50 ), characterized in that the printed circuit board element ( 20 ) is formed from at least two printed circuit board segments ( 30 , 40 ), that each printed circuit board segment ( 30 , 40 ) has a layer stack ( 31 , 41 ) made from at least one inner conductor ( 32 , 42 ), at least one outer conductor ( 34 , 44 ) and at least one insulation layer ( 33 , 43 ) arranged between them, that the circuit board segments ( 30 , 40 ) are connected to each other and that at least one outer conductor ( 34 , 44 ) for receiving at least of an electronic component is formed. 2. Printed circuit board arrangement according to claim 1, characterized in that the printed circuit board segments ( 30 , 40 ) via one of their inner conductor layers ( 32 , 42 ) are connected directly to one another. 3. Printed circuit board arrangement according to claim 1, characterized in that the printed circuit board segments ( 30 , 40 ) via one of their inner conductor layers ( 32 , 42 ) are indirectly connected to one another, at least one further insulation layer being provided between the inner conductor layers ( 32 , 42 ). 4. Circuit board arrangement according to one of claims 1 to 3, characterized in that the circuit board element ( 20 ) has a planar structure with planar individual layers. 5. Circuit board arrangement according to one of claims 1 to 4, characterized in that the inner conductor ( 32 , 42 ) and / or the insulation layers ( 33 , 43 ) of the circuit board segments ( 30 , 40 ) are flexible. 6. Circuit board arrangement according to one of claims 1 to 5, characterized in that the outer conductors ( 34 , 44 ) are rigid. 7. Printed circuit board arrangement according to one of claims 1 to 6, characterized in that it has a number of N printed circuit board elements ( 20 ), with N greater than / equal to 2. 8. Circuit board arrangement according to claim 7, characterized in that the circuit board elements ( 20 ) are interconnected. 9. Circuit board arrangement according to one of claims 1 to 8, characterized in that it has three circuit board elements ( 20 ) and that the circuit board elements ( 20 ) are connected in a star shape. 10. Printed circuit board system ( 70 ) for at least one electronic component ( 50 ) consisting of two or more printed circuit board arrangements ( 10 ) according to one of claims 1 to 9. 11. Printed circuit board system according to claim 10, characterized in that the printed circuit board arrangements ( 10 ) are connected in parallel via central derivatives. 12. Electrical component, with a circuit board arrangement ( 10 ) according to one of claims 1 to 9 or with a circuit board system ( 70 ) according to claim 10 or 11, wherein on at least one outer conductor ( 34 ; 44 ) at least one electronic component ( 50 ) is arranged , 13. Electrical component according to claim 12, characterized in that the electronic component ( 50 ) is designed as a semiconductor component. 14. Electrical component according to claim 12 or 13, characterized in that an array of electronic components ( 50 ) is arranged on the outer conductor ( 34 ; 44 ). 15. Electrical component according to one of claims 12 to 14, characterized in that in a circuit board element ( 20 ) at least one electronic component ( 50 ) on the outer conductor ( 34 , 44 ) of a circuit board segment ( 30 ) mutually offset to the at least one electronic component ( 50 ) is arranged on the outer conductor ( 44 ) of another circuit board segment ( 40 ) connected to this circuit board segment ( 30 ). 16. Electrical component according to one of claims 12 to 15, characterized in that in a circuit board element ( 20 ) at least one electronic component ( 50 ) via a contacting device ( 60 ) with an inner conductor ( 32 , 42 ) of the circuit board segment ( 30 , 40 ) connected is. 17. Electrical component according to claim 16, characterized in that the contacting device ( 60 ) has an at least partially connected to the inner conductor ( 32 , 42 ) contacting tab ( 61 ). 18. Electrical component according to claim 16 or 17, characterized in that the at least one insulation layer ( 33 , 43 ) has a recess for passing the contacting device ( 60 ).