DE102021206477B4 - Hermetisch verkappte, optische Projektionsanordnung und Verfahren zum Herstellen derselben - Google Patents

Hermetisch verkappte, optische Projektionsanordnung und Verfahren zum Herstellen derselben Download PDF

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Publication number
DE102021206477B4
DE102021206477B4 DE102021206477.9A DE102021206477A DE102021206477B4 DE 102021206477 B4 DE102021206477 B4 DE 102021206477B4 DE 102021206477 A DE102021206477 A DE 102021206477A DE 102021206477 B4 DE102021206477 B4 DE 102021206477B4
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DE
Germany
Prior art keywords
substrate
arrangement
cover
optical projection
prism
Prior art date
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Active
Application number
DE102021206477.9A
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German (de)
English (en)
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DE102021206477A1 (de
Inventor
Wolfgang Reinert
Vanessa Stenchly
Hans Joachim Quenzer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
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Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV filed Critical Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Priority to DE102021206477.9A priority Critical patent/DE102021206477B4/de
Priority to PCT/EP2022/066987 priority patent/WO2022268870A2/fr
Priority to EP22734955.2A priority patent/EP4359845A2/fr
Publication of DE102021206477A1 publication Critical patent/DE102021206477A1/de
Application granted granted Critical
Publication of DE102021206477B4 publication Critical patent/DE102021206477B4/de
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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/18Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for optical projection, e.g. combination of mirror and condenser and objective
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261Processes for packaging MEMS devices
    • B81C1/00317Packaging optical devices
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10Scanning systems
    • G02B26/101Scanning systems with both horizontal and vertical deflecting means, e.g. raster or XY scanners
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10Beam splitting or combining systems
    • G02B27/14Beam splitting or combining systems operating by reflection only
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/0225Out-coupling of light
    • H01S5/02255Out-coupling of light using beam deflecting elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/0233Mounting configuration of laser chips
    • H01S5/02345Wire-bonding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00Specific applications of microelectromechanical systems
    • B81B2201/04Optical MEMS
    • B81B2201/042Micromirrors, not used as optical switches
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00Forming microstructural systems
    • B81C2203/03Bonding two components
    • B81C2203/031Anodic bondings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/02208Mountings; Housings characterised by the shape of the housings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/0225Out-coupling of light
    • H01S5/02253Out-coupling of light using lenses
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/40Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4012Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/40Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4087Array arrangements, e.g. constituted by discrete laser diodes or laser bar emitting more than one wavelength
    • H01S5/4093Red, green and blue [RGB] generated directly by laser action or by a combination of laser action with nonlinear frequency conversion

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Optical Couplings Of Light Guides (AREA)
DE102021206477.9A 2021-06-23 2021-06-23 Hermetisch verkappte, optische Projektionsanordnung und Verfahren zum Herstellen derselben Active DE102021206477B4 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE102021206477.9A DE102021206477B4 (de) 2021-06-23 2021-06-23 Hermetisch verkappte, optische Projektionsanordnung und Verfahren zum Herstellen derselben
PCT/EP2022/066987 WO2022268870A2 (fr) 2021-06-23 2022-06-22 Dispositif de projection optique recouvert hermétiquement et procédé de production correspondant
EP22734955.2A EP4359845A2 (fr) 2021-06-23 2022-06-22 Dispositif de projection optique recouvert hermétiquement et procédé de production correspondant

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102021206477.9A DE102021206477B4 (de) 2021-06-23 2021-06-23 Hermetisch verkappte, optische Projektionsanordnung und Verfahren zum Herstellen derselben

Publications (2)

Publication Number Publication Date
DE102021206477A1 DE102021206477A1 (de) 2022-12-29
DE102021206477B4 true DE102021206477B4 (de) 2023-01-12

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
DE102021206477.9A Active DE102021206477B4 (de) 2021-06-23 2021-06-23 Hermetisch verkappte, optische Projektionsanordnung und Verfahren zum Herstellen derselben

Country Status (3)

Country Link
EP (1) EP4359845A2 (fr)
DE (1) DE102021206477B4 (fr)
WO (1) WO2022268870A2 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022134473A1 (de) 2022-12-22 2024-06-27 Pepperl+Fuchs Se Scanner zum Nachweisen von Objekten in einem Überwachungsbereich

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100302513A1 (en) 2009-05-29 2010-12-02 Yoshitaka Takahashi Projection-type image displaying apparatus

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008003345A1 (de) * 2008-01-07 2009-07-09 Robert Bosch Gmbh Mikrospiegelvorrichtung und Herstellungsverfahren für eine Mikrospiegelvorrichtung
DE102008012384A1 (de) * 2008-03-04 2009-09-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Deckel für Mikro-Systeme und Verfahren zur Herstellung eines Deckels
JP2014056199A (ja) * 2012-09-14 2014-03-27 Hitachi Media Electoronics Co Ltd 走査型投影装置
US10901216B2 (en) * 2017-10-23 2021-01-26 Google Llc Free space multiple laser diode modules
US10714891B2 (en) * 2018-07-06 2020-07-14 Himax Technologies Limited Projector, electronic device having projector and associated manufacturing method
EP4294767A1 (fr) * 2021-02-19 2023-12-27 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Procédé de production d'un substrat de couverture, procédé de production d'un composant optoélectronique hermétiquement fermé et composant optoélectronique hermétiquement fermé

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100302513A1 (en) 2009-05-29 2010-12-02 Yoshitaka Takahashi Projection-type image displaying apparatus

Also Published As

Publication number Publication date
DE102021206477A1 (de) 2022-12-29
EP4359845A2 (fr) 2024-05-01
WO2022268870A2 (fr) 2022-12-29
WO2022268870A3 (fr) 2023-03-23

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