DE102021110210A1 - Method of manufacturing an optical module and optical module - Google Patents

Abstract

The present invention relates to a method for producing an optical module (26) with a functional structure (13) and an optical element (24) connected thereto, in which a first curable mass (A) and a second curable mass (B) are provided, wherein the first mass (A) comprises at least one functional filler (K3) selected from the group consisting of dyes, pigments, electrochromic materials, conductive fillers and combinations thereof. The functional structure (13) is formed from the first mass (A) and the optical element (24) is formed from the second mass (B). An optical module (26) is also specified.

Description

FIELD OF THE INVENTION

The invention relates to a method for producing an optical module and an optical module.

TECHNICAL BACKGROUND

Laser-based measuring systems such as LiDAR (abbreviation for "Light detection and ranging") and ToF (abbreviation for "Time of Flight") for distance and speed measurement, as well as projection systems for 3D object recognition often have a laser-optical module. If an external force acts on this measuring system, a lens of the measuring system can be damaged in the worst case. As a result, a laser beam emitted by the measuring system can freely enter a human eye of a nearby user if there is no shut-off mechanism. This poses a risk to the user, especially in the case of widespread laser-optical measuring systems such as in smartphones or laser pointers.

Such switch-off mechanisms are implemented in the prior art by electrical circuits or by additional measuring systems within the module, such as in FIG U.S. 2020 0 049 911 A1 disclosed. The latter use a transmitter and receiver diode to evaluate the scattering behavior of light on an opposite lens and indicate changed currents as soon as a cover is damaged. The disadvantage of this approach is that more space is required for the corresponding diodes within the module. This stands in the way of ongoing miniaturization.

the U.S. 2019 0 278 104 A1 describes an optical module with a protective device, which has conductor tracks integrated in the side walls. In order to scatter the light of the emitting element, a cover with an appropriately structured optic is applied. Conductor tracks are also integrated in this cover, which are contacted with the conductor tracks of the side walls in order to measure a reference resistance. If the optics are damaged, the measured resistance changes and the light source is switched off.

A lithographic process is usually used to produce conductive structures at the wafer or panel level. A conductor layer is applied to a substrate. In a next step, a positive photoresist is coated, usually by spin coating, and exposed through a mask. Then, in the next process step, the photoresist is dissolved and rinsed off at the exposed areas with a developer solution. The open areas in which the photoresist has been removed are then removed in an etching process so that only the resist layer remains on the underlying conductor tracks. The remaining paint is removed by a solvent washing process. What remains is a substrate with conductor tracks onto which optical structures can be applied using various processes. Such processes are correspondingly complicated and expensive.

the U.S. 10,155,872 B2 describes an optical device that is produced using the 3D printing process. The conductive structures are inkjet printed with a conductive nanocomposite ink and the optics are printed with a transparent nanocomposite ink. Acrylate formulations are intended specifically for the optical masses, which can be disadvantageous in a laser-based measuring system with continuous exposure to laser light. They tend to yellow or discolour.

What all approaches have in common is that either expensive materials or inks, for example based on indium tin oxide (ITO), and/or complex manufacturing processes must be used.

SUMMARY OF THE INVENTION

The object of the invention is to overcome the disadvantages of the prior art and to provide a method that can provide a one-piece and cost-effective optical module in a few method steps. In particular, the aim of the invention is to simplify the manufacturing process while at the same time achieving high yields and reduced manufacturing costs.

The object of the invention is achieved by a method for producing an optical module according to claim 1 and by an optical module according to claim 12.

Further embodiments of the invention are specified in the dependent claims, which can optionally be combined with one another.

The optical module according to the invention comprises an optical element and at least one functional structure which is connected to the optical element and has electrical conductivity and/or an aperture function.

• a1) Dosieren einer ersten härtbaren Masse (A) auf ein Substrat unter Ausbildung eines der Funktionsstruktur entsprechenden Musters, wobei die erste härtbare Masse (A) mindestens einen Funktionsfüllstoff (K3) umfasst, der ausgewählt ist aus der Gruppe bestehend aus Farbstoffen, Pigmenten, leitfähigen Füllstoffen, elektrochromen Materialien und Kombinationen davon;
• a2) wahlweise wenigstens teilweises Härten der ersten Masse (A) unter Bildung der Funktionsstruktur;
• a3) Dosieren einer zweiten härtbaren Masse (B) auf die erste Masse (A); und
• a4) anschließendes Aushärten der zweiten Masse (B) und wahlweise der ersten Masse (A) durch Licht und/oder Wärme unter Bildung des mit der Funktionsstruktur verbundenen optischen Elements.

According to the invention, the optical module is produced by:

• a1) Metering a first curable composition (A) onto a substrate to form a pattern corresponding to the functional structure, the first curable composition (A) comprising at least one functional filler (K3) selected from the group consisting of dyes, pigments, conductive fillers, electrochromic materials, and combinations thereof;
• a2) optionally at least partially curing the first mass (A) to form the functional structure;
• a3) dosing a second hardenable composition (B) onto the first composition (A); and
• a4) subsequent curing of the second mass (B) and optionally the first mass (A) by light and/or heat to form the optical element connected to the functional structure.

• b1) Dosieren und Aushärten der zweiten härtbaren Masse (B) unter Bildung des optischen Elements;
• b2) Dosieren der ersten Masse (A) auf das optische Element unter Ausbildung eines der Funktionsstruktur entsprechenden Musters; und
• b3) anschließendes Aushärten der ersten Masse (A) durch Licht und/oder Wärme unter Ausbildung der mit dem optischen Element verbundenen Funktionsstruktur.

Alternatively, the optical module is manufactured by:

• b1) dosing and curing of the second curable composition (B) to form the optical element;
• b2) metering the first mass (A) onto the optical element, forming a pattern corresponding to the functional structure; and
• b3) subsequent curing of the first mass (A) by light and/or heat with formation of the functional structure connected to the optical element.

The use of the first composition (A), which includes a functional filler (K3) and can be easily processed as a resin before curing, allows a high degree of flexibility in the formation of the functional structure, so that the manufacturing process is simplified and can be carried out cost-effectively. Likewise, the second mass (B) can be processed and structured in a simple manner as a resin before curing.

Because either the first compound (A) is metered onto the already formed optical element from the second compound (B) and then cured, or the second compound (B) is applied to the already formed functional structure or a pattern corresponding to the functional structure from the first Mass (A) is dosed and then cured, resulting in a simple manufacturing process for the optical module.

In particular, the mass applied second can be applied to the previously metered and optionally hardened mass in a simple manner complementary to the already formed functional structure or to the already formed optical element without the formation of defects or empty spaces.

The function that the functional structure assumes in the manufactured optical module is determined by the selection of the functional filler (K3) in the first compound (A).

In one variant, the functional structure is electrically conductive. In other words, the functional structure forms a conductor structure or a conductor track of the optical module. An electrically conductive functional structure is obtained when the functional filler (K3) comprises a conductive filler.

An electrically conductive functional structure makes it possible to detect damage to the optical module electrically, for example due to a change in the current flow or the interruption of a circuit in which the functional structure is contained.

In a further variant, the functional structure is at least partially impermeable to electromagnetic radiation, in particular to electromagnetic radiation with a wavelength in the visible and infrared range. In this variant, the functional structure serves as an aperture. Such a functional structure is obtained when the functional filler (K3) comprises a dye and/or a pigment.

This variant makes it possible for the electromagnetic radiation to be shaped when it emerges from the optical module, specifically from the optical element, in order to create projections and patterns.

Of course, functional structures can also be provided which are both electrically conductive and at least partially impermeable to electromagnetic radiation.

The metering of the first mass (A) to form the pattern corresponding to the functional structure can be done by means of stencil printing, screen printing, ink jetting, jetting or needle metering. The term “pattern corresponding to the functional structure” means that the pattern essentially corresponds to the desired geometry of the functional structure, which is obtained from the pattern by at least partially curing the first mass (A).

In one variant, a monolithic optical module is obtained after curing by exposure to actinic radiation and/or heating. Monolithic modules are particularly desirable with regard to a desirable miniaturization of optical modules, for example to save installation space.

By using two curable and mutually compatible masses, the first mass (A) having the functional filler (K3) suitable for the desired application, such monolithic optical modules can be obtained with little effort, since the flexible formation of the functional structure and the optical element Using a first compound (A) or second compound (B) that has not yet cured allows structuring of the functional structure or the optical element that is adapted to the intended application, while at the same time the compounds can be easily connected to one another to form a monolithic component through final curing .

In the monolithic optical module, the functional structure is present as an integral functional structure. In other words, the functional structure is an integral part of the monolithic optical module and is embedded in the optical element in such a way that when the optical module is handled, a change in the alignment of the functional structure and the optical element to one another can be ruled out: In particular, the functional structure can be optical module complete flush with a surface of the optical element, so that no parts of the functional structure protrude over the optical element. The flush arrangement protects the functional structure from the optical element in such a way that detachment is not possible.

The use of two hardenable masses to produce the optical module enables a variable process control, depending on whether the optical element is formed first and then the functional structure is produced on the optical element, or whether a pattern corresponding to the functional structure is dosed and optionally hardened first and then the optical element is generated on the pattern or the functional structure.

• a1) Dosieren der ersten Masse (A) auf ein Substrat unter Ausbildung eines der Funktionsstruktur entsprechenden Musters;
• a2) wenigstens teilweises Härten der ersten Masse (A) unter Bildung der Funktionsstruktur;
• a3) Dosieren der zweiten Masse (B) auf die erste Masse (A); und
• a4) abschließendes Aushärten der zweiten Masse (B) und der wenigstens teilgehärteten ersten Masse (A) durch Licht und/oder Wärme unter Bildung des mit der Funktionsstruktur verbundenen optischen Elements.

According to a first variant of the method, the optical module is produced by

• a1) dosing the first mass (A) onto a substrate to form a pattern corresponding to the functional structure;
• a2) at least partial hardening of the first mass (A) to form the functional structure;
• a3) dosing the second mass (B) onto the first mass (A); and
• a4) final curing of the second compound (B) and the at least partially cured first compound (A) by light and/or heat to form the optical element connected to the functional structure.

The first mass (A) is preferably metered onto a temporary substrate, with the temporary substrate being able to be detached from the optical module in a non-destructive manner, in particular after a final curing of the functional structure and the optical element. When using a planar temporary substrate a monolithic optical module can be obtained in a simple manner, in which the functional structure and the optical element are flush with one another.

The temporary substrate serves to simplify the handling of the first mass (A) during the manufacturing process of the optical module, specifically during the formation of the functional structure. Furthermore, the temporary substrate can mechanically stabilize the first mass (A) before curing, so that complicated patterns and geometries can be applied to the temporary substrate, which are reflected in the functional structure after the first mass (A) has cured.

The term "final curing" refers to the final curing process that the first mass (A) and the second mass (B) go through during the manufacturing process of the optical module. After the final curing, the first and the second mass have reached their respective final strength.

In a variant of the method described above, in step a2) the first mass (A) can be partially cured by light and/or heat to form the functional structure. As a result, a certain mechanical stability of the functional structure can already be generated, which enables handling in intermediate processes before further method steps are carried out. In this way, manufacturing tolerances can be minimized and the manufacturing process can be designed flexibly. A partially hardened functional structure can also serve particularly advantageously as a template for applying the second mass (B). This method also includes the use of curable masses (A) which essentially completely cure in step a2) but still post-cure due to the treatment for curing the second mass (B) taking place in step a4).

In a further variant of the method, a so-called “wet-on-wet process” is provided, in which step a2) is omitted and the second mass (B) is applied directly to the pattern formed from the first mass (A). In this process variant, the two masses (A) and (B) are then cured together in step a4). In this way, further process steps and associated costs can be saved.

• b1) Dosieren und Aushärten der zweiten härtbaren Masse (B) unter Bildung des optischen Elements;
• b2) Dosieren der ersten Masse (A) auf das optische Element unter Ausbildung eines der Funktionsstruktur entsprechenden Musters; und
• b3) anschließendes Aushärten der ersten Masse (A) durch Licht und/oder Wärme unter Ausbildung der mit dem optischen Element verbundenen Funktionsstruktur

According to a further variant of the method according to the invention, the optical module is produced by:

• b1) dosing and curing of the second curable composition (B) to form the optical element;
• b2) metering the first mass (A) onto the optical element, forming a pattern corresponding to the functional structure; and
• b3) subsequent curing of the first mass (A) by light and/or heat with formation of the functional structure connected to the optical element

According to this variant, the optical element is first produced from the second mass (B), for example by known stamping processes.

The optical element can have an optical structure on one side. Furthermore, at least one cutout, into which the functional structure engages, can optionally be formed on the side on which the optical structure is located and/or on a side of the optical element opposite to the optical structure.

In other words, the at least one recess is designed to be complementary to the functional structure, so that the functional structure can be accommodated by the recess.

This can be achieved in that the first mass (A) is metered into the at least one recess of the optical element that has already been formed and is then cured. A monolithic optical module with a flush arrangement of functional structure and optical element can also be produced in this way.

The recess has, for example, a rectangular, curved or V-shaped cross section.

The optical structure can have any geometry required for the intended application of the optical module. For example, the optical structure is convex or concave, planar, latticed, spherical, aspheric, free form, stepped, fresnel shaped or metal lens shaped. The optical structure can have a regular or pseudo-random geometry.

The optical structure and/or the at least one recess can be produced by stamping and/or dosing the second mass (B) onto a structured carrier substrate.

In particular, the second mass (B) is applied to the structured carrier substrate, a stamp is then pressed onto the second mass (B) and the second mass (B) is cured. This makes it possible to remove the structured substrate and/or the stamp without deforming the optical element produced in this way.

A combination of the process variants described above is also possible. For example, in terms of the first variant of the method, an optical element can be connected to a functional structure, for example a conductor structure, at the level of the carrier substrate. The intermediate product produced in this way can then be further processed in the sense of steps b2) and b3) described above and provided with a further functional structure, for example a screen structure, on the surface opposite the carrier substrate.

In all of the method variants described above, the functional structure and the optical element can be present after the final curing in a precursor of the optical module, from which the optical module is produced by separating the precursor. The optical module thus forms the smallest structural unit that can be multiplied as desired using the method according to the invention. In other words, a large number of in particular identical optical modules can be obtained from the precursor, for example a wafer or a panel. In this way, the production speed or the production quantity of the optical modules can be increased.

Depending on how the precursor is separated, different arrangements of the functional structure relative to the optical element can be achieved. If the functional structure is severed when the precursor is separated, an optical module is produced in which the functional structure is only surrounded by the optical element on two adjoining sides. In the case of a conductive functional structure, this results in different possibilities for contacting. If the separation is carried out in such a way that only the hardened mass (B) forming the optical element is severed, the functional structure remains enclosed by the hardened mass (B) except for the area adjoining the carrier substrate. As a result, microstructures can also be reliably stabilized.

Composition of masses (A) and (B)

The first mass (A) and the second mass (B) each comprise a resin (K1) and a hardener and/or initiator (K2). The first composition (A) also includes a functional filler (K3).

In principle, the same resin (K1) can be used in the first mass (A) and the second mass (B), or different resins (K1) can be used.

Likewise, in principle the same hardener and/or initiator (K2) can be used in the first compound (A) and the second compound (B), or different hardeners and/or initiators (K2) can be used.

The hardeners and/or initiators (K2) used in the respective compositions (A) and (B) are selected such that they can cure the resin (K1) used in the first composition (A) or the second composition (B). .

The first composition (A) and the second composition (B) are liquid at room temperature and are preferably present as one component. They can each be cured by actinic radiation and/or heat.

The individual components of the first mass (A) and the second mass (B) are described in detail below.

Component (K1): resin

As resin (K1) it is possible to use compounds which can be cured by cationic polymerization and/or free-radical polymerization and/or by nucleophilic addition polymerization and/or anionic polymerization.

The resin (K1) preferably comprises at least one cationically polymerizable compound.

The resin (K1) can be selected from the group consisting of epoxides (K1-1), oxetanes (K1-2), vinyl ethers (K1-3), maleimides (K1-4), isocyanates (K1-5), (meth ) acrylates (K1-6), hybrid compounds (K1-7) and combinations thereof.

Epoxies (K1-1)

The resin (K1) can be or comprise an epoxide (K1-1). Epoxides (K1-1) are preferably used as cationically curable components in the resin (K1).

The resins from the group of epoxides comprise one or more at least difunctional epoxide-containing compounds, which are structurally not further restricted. "At least difunctional" means that the epoxide-containing compound contains at least two epoxide groups.

Component (K1-1) particularly preferably comprises an at least difunctional aliphatic and/or cycloaliphatic epoxide. Likewise, all fully or partially hydrogenated analogues of aromatic epoxy resins can be used as cycloaliphatic epoxy compounds.

Aromatic epoxy resins can be used as a further epoxy compound as an alternative or in addition to aliphatic and/or cycloaliphatic epoxides.

Isocyanurates and other heterocyclic compounds substituted with epoxide-containing groups can also be used. Examples include triglycidyl isocyanurate and monoallyl diglycidyl isocyanurate.

In addition, it is possible to use polyfunctional epoxy resins of all of the resin groups mentioned, tough elasticized epoxy resins and mixtures thereof.

Also within the meaning of the invention is a combination of several epoxide-containing compounds, of which preferably at least one is difunctional or higher.

In addition to the at least difunctional epoxide-containing compounds, monofunctional epoxides can also be used as reactive diluents.

Examples of commercially available epoxide-containing compounds of the substance classes listed are products sold under the trade names CELLOXIDE™ 2021P, CELLOXIDE™ 8000 by Daicel Corporation, Japan, as EPIKOTE™ RESIN 828 LVEL, EPIKOTE™ RESIN 166, EPIKOTE™ RESIN 169 by Hexion B.V., Netherlands , as Eponex 1510 from Hexion, as Epilox™ resins of the series A, T and AF from Leuna Harze, Germany, or as EPICLON™ 840, 840-S, 850, 850-S, EXA850CRP, 850-LC from DIC K.K., Japan, Omnilane 1005 and Omnilane 2005 from IGM Resins B.V., Syna Epoxy 21 and Syna Epoxy 06 from Synasia Inc., TTA21, TTA26, TTA60 and TTA128 from Jiangsu Tetra New Material Technology Co. Ltd. are available.

Oxetanes (K1-2)

The resin (K1) may be or comprise an oxetane (K1-2). Oxetanes (K1-2) can serve as cationically curable components in the resin (K1).

Processes for the preparation of oxetanes are in particular from US 2017/0198093 A1 known.

Oxetanes (K1-2) are used in particular in addition to an epoxide (K1-1) in the first composition (A) and/or the second composition (B).

Examples of commercially available oxetanes are bis(3-ethyl-3-oxetanylmethyl)ether (DOX), 3-allyloxymethyl-3-ethyloxetane (AQX), 3-ethyl-3-(phenoxymethyl)oxetane (POX), 3-ethyl -3-hydroxymethyl-oxetanes (OXA), 1,4-bis[(3-ethyl-3-oxetanylmethoxy)methyl]benzene (XDO), 3-ethyl-3-[((2-ethylhexyl)oxy)methyl]oxetanes (EHOX). The above oxetanes are available from TOAGOSEI CO.,LTD. commercially available.

vinyl ether (K1-3)

The resin (K1) can be or comprise a vinyl ether (K1-3). Vinyl ether compounds can also serve as a cationically curable component in the resin (K1).

Vinyl ethers (K1-3) are used in particular in addition to an epoxide (K1-1) and optionally an oxetane (K1-2) in the first composition (A) and/or the second composition (B).

Suitable vinyl ethers are trimethylolpropane trivinyl ether, ethylene glycol divinyl ether and cyclic vinyl ethers and mixtures thereof. Furthermore, vinyl ethers of polyfunctional alcohols can be used.

Maleimides (K1-4)

The resin (K-1) may be or comprise a maleimide. Maleimides serve as a component in the resin (K1) which can be cured by free radicals and/or by nucleophilic addition.

Preference is given to using so-called bismaleimides which contain two maleimide functionalities which are separated from one another by linear, optionally branched, aliphatic hydrocarbons.

Examples of commercially available bismaleimides are BMI-1500 or BMI-1700 available from Designer Molecules. More maleimide structures and their synthesis can U.S. 6,034,194 and the U.S. 6,521,731 be removed.

isocyanates (K1-5)

The resin (K-1) can be or comprise an isocyanate (K1-5). Isocyanates (K1-5) serve as components in the resin (K1) that can be cured by nucleophilic addition.

The isocyanate (K1-5) is preferably an aliphatic, cycloaliphatic, heterocyclic or aromatic polyisocyanate.

Examples of suitable polyisocyanates are: hexamethylene diisocyanates (HDI), 1-isocyanato-3,3,5-trimethyl-5-isocyanatomethylcyclohexane (isophorone diisocyanate, IPDI), bis(isocyanatomethyl)cyclohexane (HXDI), diphenylmethane 2,2'-, 2,4'- and/or 4,4'-diisocyanate (MDI), dimeric 2,4-diisocyanatotoluene, dimeric 4,4'-diisocyanatodiphenylmethane, 3,3'-diisocyanato-4,4'-dimethyl-N,N '-diphenylurea, the isocyanurate of isophorone diisocyanate, 1,4-phenylene diisocyanate, naphthalene-1,5-diisocyanate, and addition products of diisocyanates with short-chain diols such as 1,4-butanediol or 1,2-ethanediol. Dimeric 2,4-diisocyanatotoluene, dimeric 4,4'-diisocyanatodiphenylmethane, 3,3'-diisocyanato-4,4'-dimethyl-N,N'diphenylurea and/or the isocyanurate of isophorone diisocyanate are preferred.

The isocyanates (K1-5) can be used alone or in a mixture of two or more of the polyisocyanates.

Optionally, the isocyanate (K1-5) can also be present in the compositions in passivated form. For passivation, the surface of the isocyanate can be covered with an inert particle layer, or as in the EP 0 153 579 A2 or the EP 0 100 508 B1 be deactivated by reaction with amines to form urea groups. Such passivated, latently reactive isocyanate formulations are in the DE 10 2018 102 916 A1 described.

(Meth)acrylates (K1-6)

The resin (K-1) can be or comprise a (meth)acrylate (K1-6). (Meth)acrylates (K1-6) serve as components in the resin (K1) which can be cured by free radicals and/or by nucleophilic addition.

The (meth)acrylates (K1-6) are not further restricted in their chemical structure. For example, both aliphatic and aromatic (meth)acrylates can be used.

Both the derivatives of acrylic acid and of methacrylic acid and combinations and mixtures thereof are referred to here and below as (meth)acrylates.

The compound (K1-6) is preferably at least difunctional.

The following compounds are suitable, for example: isobornyl acrylate, stearyl acrylate, tetrahydrofurfuryl acrylate, cyclohexyl acrylate, 3,3,5-trimethylcyclohexanol acrylate, behenyl acrylate, 2-methoxyethyl acrylate and other mono- or polyalkoxylated alkyl acrylates, isobutyl acrylate, isooctyl acrylate, lauryl acrylate, tridecyl acrylate, isostearyl acrylate, 2-( o-phenylphenoxy)ethyl acrylate, acryloylmorpholine, N,N-dimethylacrylamide, 4-butanediol diacrylate, 1,6-hexanediol diacrylate, 1,10-decanediol diacrylate, tricyclodecanedimethanol diacrylate, dipropylene glycol diacrylate, tripropylene glycol diacrylate, polybutadiene diacrylate, cyclohexanedimethanol diacrylate, diurethane acrylates of monomeric, oligomeric or polymeric diols and polyols, trimethylolpropane triacrylate (TMPTA), and dipentaerythritol hexaacrylate (DPHA), and combinations thereof.

Higher functional acrylates derived from multiply branched or dendrimeric alcohols can also be used advantageously

The analogous methacrylates are also within the meaning of the invention.

Urethane acrylates based on polyesters, polyethers, polycarbonate diols, polybutadiene diols and/or hydrogenated polybutadiene diols can be used as higher molecular weight compound (K1-6).

A combination of several compounds (K1-6) is also suitable for use as the resin component for the two compositions in the process of the invention.

Other components of the resin (K1)

Hybrid Compounds (K1-7)

Hybrid compounds (K1-7) can be used in the resin (K1). In addition to at least one of the cationically polymerizable groups mentioned, these also contain radically and/or anionically and/or by nucleophilic addition curable groups.

In particular, epoxy-(meth)acrylate hybrid compounds are within the meaning of the invention.

Examples of commercially available epoxy (meth)acrylates are CYCLOMER M100 from Daicel, UVACURE 1561 from UCB, Miramer PE210HA from Miwon Europe GmbH, epoxy acrylate Solmer SE 1605 and Solmer PSE 1924 from Soltech Ltd. Oxetane-(meth)acrylates such as Eternacoll OXMA from UBE Industries LTD can also be used as a hybrid compound.

Other radically curable compounds

Also suitable are compounds with allyl groups, such as 1,3,5-triazine-2,4,6(1H,3H,5H)-trione, which is commercially available as ^TAICROS® .

Unhydrogenated polybutadienes with free double bonds, such as the Poly ^BD® types, can also be used as free-radically curable compounds.

alcohols

In the case of cationic curing of the resin (K1), the resin (K1) can comprise one or more at least dihydric alcohols, which are used as chain transfer agents.

High molecular weight polyols in particular can be used to make cationic masses flexible. Suitable polyols are available, for example, based on polyethers, polyesters, polycaprolactones, polycarbonates, polybutadiene diols or hydrogenated polybutadiene diols.

Examples of commercially available polyols of higher molecular weight are products sold under the trade names Eternacoll UM-90 (1/1), Eternacoll UHC50-200 from UBE Industries Ltd., as Capa™ 2200, Capa™ 3091 from Perstorp, as Liquiflex H from Petroflex, as Merginol 901 from HOBUM Oleochemicals, as Placcel 305, Placcel CD 205 PL from Daicel Corporation, as Priplast 3172, Priplast 3196 from Croda, as Kuraray Polyol F-3010, Kuraray Polyol P-6010 from Kuraray Co., Ltd., as Krasol LBH-2000, Krasol HLBH-P3000 from Cray Valley or as Hoopol S-1015-35 or Hoopol S-1063-35 from Synthesia Technology SLU.

Component (K2): Hardener and/or initiators

Amines (K2-1), anhydrides (K2-2), thiols (K2- 3), alcohols (K2-4), peroxides (K2-5), photoinitiators for free-radical polymerization (K2-6) and/or initiators for cationic polymerization (K2-7) are used.

The hardeners and/or initiators (K2) used in each case in the compositions (A) and (B) can be the same or different. The hardeners and/or initiators (K2) are selected in such a way that curing of the resin (K1) used in each case with the hardener and/or initiator (K2) used therein is made possible.

The resins (K1) and hardeners and/or initiators (K2) described can be combined with one another in a suitable manner for both compositions. Hybrid formulations which contain differently polymerizable resins (K1) are also within the meaning of the invention.

Amines (K2-1)

Amines and nitrogen-containing compounds derived therefrom can be used as hardeners for the epoxy-containing or isocyanate-containing resin components.

Examples of suitable nitrogen-containing compounds include, in particular, aliphatic polyamines, arylaliphatic polyamines, cycloaliphatic polyamines, aromatic polyamines and heterocyclic polyamines, as well as imidazoles, cyanamides, polyureas, Mannich bases, polyetherpolyamines, polyaminoamides, phenalkamines, sulfonamides, aminocarboxylic acids or combinations of the substance classes mentioned. Reaction products of epoxides and/or anhydrides and the nitrogen-containing compounds mentioned above can also be used as curing agents.

If an amine (K2-1) is used in the hardener and/or initiator (K2), in particular no initiator for the cationic polymerization (K2-7) is contained in the respective composition.

Anhydrides (K2-2)

Specific examples of anhydrides which can be used in the present compositions as hardeners (K2) for epoxides include the anhydrides of dibasic acids such as phthalic anhydride (PSA), succinic anhydride, octenyl succinic anhydride (OSA), pentadodecenyl succinic anhydride and other alkenyl succinic anhydrides, maleic anhydride (MA ), itaconic anhydride (ISA), tetrahydrophthalic anhydride (THPA), hexahydrophthalic anhydride (HHPA), methyltetrahydrophthalic anhydride (MTHPA), methylhexahydrophthalic anhydride (MHHPA), nadic anhydride, 3,6-endomethylenetetrahydrophthalic anhydride, methylenedomethylenetetrahydrophthalic anhydride (METH, NMA), tetrabromophthalic anhydride and trimellitic anhydride, as well as the anhydrides of aromatic tetraprotic acids, such as biphenyltetracarboxylic dianhydrides, naphthalenetetracarboxylic dianhydrides, diphenylethertetracarboxylic dianhydrides, butanetetracarboxylic dianhydrides, cyclopentanetetracarb onic acid dianhydrides, pyromellitic anhydrides and benzophenone tetracarboxylic dianhydrides. These compounds can be used alone or in combinations of two or more thereof.

Among these anhydrides, preference is given to using compounds which are liquid at room temperature, such as methylhexahydrophthalic anhydride (MHHPA), methyltetrahydrophthalic anhydride (MTHPA), methylendomethylenetetrahydrophthalic anhydride (METH, NMA) and its hydrogenation product as hardener (K2).

The preferred anhydrides for use as hardeners are commercially available, for example, under the following trade names: MHHPA, for example, under the trade names HN-5500 (Hitachi Chemical Co., Ltd.) and MHHPA (Dixie Chemical Company, Inc.), METH under the trade names NMA (Dixie Chemical Company, Inc.), METH/ES (Polynt SpA) and MHAC (Hitachi Chemical Co., Ltd.).

Thiols (K2-3)

When using a hardener for epoxides or isocyanates based on thiols, this includes at least one compound with at least two thiol groups (-SH) in the molecule. The thiols are not further restricted in their chemical structure and preferably include aromatic and aliphatic thiols and combinations thereof.

Preferably, the at least difunctional thiol is selected from the group consisting of ester-based thiols, polyethers having reactive thiol groups, polythioethers, polythioether acetals, polythioether thioacetals, polysulfides, thiol-terminated urethanes, thiol derivatives of isocyanurates, and glycoluril, and combinations thereof.

Examples of commercially available ester-based thiols based on 2-mercaptoacetic acid include trimethylolpropane trimercaptoacetate, pentaerythritol tetramercaptoacetate and glycol dimercaptoacetate available under the brand names Thiocure™ TMPMA, PETMA and GDMA from Bruno Bock.

Other examples of commercially available ester-based thiols include trimethylolpropane tris(3-mercaptopropionate), pentaerythritol tetrakis(3-mercaptobutyrate), glycol di(3-mercaptopropionate), and tris[2-(3-mercaptopropionyloxy)ethyl]isocyanurate, which are listed under are available under the brand names Thiocure™ TMPMP, PETMP, GDMP and TEMPIC from Bruno Bock.

Examples of commercially available thioethers include DMDO (1,8-dimercapto-3,6-dioxaoctanes) available from Arkema S.A., DMDS (dimercaptodiethylsulfide) and DMPT (2,3-di((2-mercaptoethyl)thio)-1 -propanethiol), both available from Bruno Bock.

The use of ester-free thiols is particularly preferred with reference to increased resistance of the cured masses to temperature and moisture. Examples of ester-free thiols can JP 2012 153 794 A be removed.

Particular preference is given to using tris(3-mercaptopropyl)isocyanurate (TMPI) as the trifunctional ester-free thiol.

Ester-free thiols based on a glycoluril compound are from the EP 3 075 736 A1 known. These can also be used as hardeners (K2), alone or mixed with other at least difunctional thiols.

Higher functional thiols, which can be obtained, for example, by oxidative dimerization processes of at least difunctional thiols, can also be used.

The above list is to be seen as an example and not exhaustive.

Alcohols (K2-4)

In addition to thiols and amines, at least difunctional alcohols can also be used as hardeners for isocyanates. These are not further restricted in their chemical structure.

The alcohol preferably comprises a long-chain polyol with an average molecular weight M _n of 400 to 20,000 g/mol. Examples of suitable long-chain polyols are polyether-based polyols, commercially available as ^Acclaim® types, polyesters and polycarbonates, available as ^Kuraray® or Priplast™ types, and also polybutadiene-based and hydrogenated polybutadiene-based polyols, available as Krasol ^® - Polyvest ^® - or Nisso-PB ^® types.

Long-chain polyols with an average molecular weight of 2000 to 20,000 g/mol are particularly suitable for the production of compounds which, after curing, have high flexibility at low temperatures and a low glass transition temperature.

A low-molecular polyol with a molecular weight of up to 400 g/mol, such as glycol, glycerol, 1,4-butanediol or 2-ethyl-1,3-hexanediol, can serve as chain extender.

Peroxides (K2-5)

Peroxy compounds of the perester, diacyl peroxide, peroxy(di)carbonate and/or hydroperoxide type in particular can be used as free-radical initiators for the (meth)acrylates or maleimides described in the compositions according to the invention. Hydroperoxides are preferably used. Cumene hydroperoxide, tert-amylperoxy-2-ethylhexanoate and di-(4-tert-butyl-cyclohexyl)-peroxydicarbonate are used as particularly preferred peroxides.

Photoinitiators for radical polymerization (K2-6)

The first material (A) and/or the second material (B) can also contain a photoinitiator for the free-radical polymerization (K2-6), in particular for the free-radical polymerization of the (meth)acrylate-containing compound (K1-6).

Photoinitiators (K2-6) which can be used are the customary, commercially available compounds, for example α-hydroxyketones, benzophenone, α,α'-diethoxyacetophenone, 4,4-diethylaminobenzophenone, 2,2-dimethoxy-2-phenylacetophenone , 4-isopropylphenyl 2-hydroxy-2-propyl ketone, 1-hydroxycyclohexyl phenyl ketone, isoamyl p-dimethylaminobenzoate, methyl 4-dimethylaminobenzoate, methyl o-benzoylbenzoate, benzoin, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, 2-hydroxy -2-methyl-1-phenylpropan-1-one, 2-isopropylthioxanthone, dibenzosuberone, 2,4,6-trimethylbenzoyldiphenylphosphine oxide and bisacylphosphine oxides, where the photoinitiators mentioned can be used alone or in combination of two or more of the compounds mentioned.

For example, the Omnirad™ types from IGM Resins can be used as UV photoinitiators, such as the types Omnirad 184, Omnirad 500, Omnirad 1173, Omnirad 2959, Omnirad 754, Omnirad 651, Omnirad 369, Omnirad 907, Omnirad 819, Omnirad 819DW , Omnirad 2022, Omnirad 2100, Omnirad 784, Omnirad TPO, Omnirad TPO-L, Omnirad MBF and Omnirad 4265.

The photoinitiator (K2-6) which can be used in the compositions can preferably be activated by actinic radiation with a wavelength of from 200 to 400 nm, particularly preferably from 250 to 365 nm.

Cationic Polymerization Initiators (K2-7)

The first material (A) and/or the second material (B) can contain an initiator for the cationic polymerization (K2-7).

This can be activated in particular by actinic radiation and includes, for example, initiators based on metallocenium and/or onium compounds.

An overview of various metallocenium salts is given in EP 0 542 716 B1 disclosed.

Examples of different anions of the metallocenium salts are HSO ₄ ^- , PF ₆ ^- , SbF ₆ ^- , AsF ₆ ^- , Cl ^- , Br ^- , I ^- , ClO ₄ ^- , PO ₄ ^- , SO ₃ CF ₃ -, OTs ^- (tosylate ), aluminates and borate anions such as BF ₄ ^- and B(C ₆ F ₅ ) ₄ ^- .

The initiator for the cationic polymerization (K2-7) based on a metallocenium compound is preferably selected from the group of the ferrocenium salts.

Such ferrocenium salts are commercially available, for example, as R-gen 262 from Chitec.

Preferred onium compounds are selected from the group consisting of arylsulfonium salts, aryliodonium salts and combinations thereof and are described in the prior art.

The cationic polymerization initiator (K2-7) may be a photolatent acid.

Photoinitiators based on triarylsulfonium which are commercially available as photolatent acids are under the brand names Chivacure 1176, Chivacure 1190 from Chitech, Omnicat 432, Omnicat 270 and Omnicat 320 from IGM Resins, Irgacure 290 and Irgacure GSID 26-1 from BASF, Speedcure 976 and Speedcure 992 from Lambson, TTA UV-692, TTA UV-694 from Jiangsu Tetra New Material Technology Co., Ltd. or UVI-6976 and UVI-6974 available from Dow Chemical Co.

Photoinitiators based on diaryliodonium which are commercially available as photolatent acids are available, inter alia, under the trade names UV1242 or UV2257 from Deuteron and Bluesil 2074 from Bluestar.

The photolatent acids used in the compositions can preferably be activated by irradiation with actinic radiation having a wavelength of from 200 to 480 nm.

If an initiator for the cationic polymerization (K2-7) is used in the hardener and/or initiator (K2), in particular no amine (K2-1) is contained in the respective mass.

In addition to or instead of the photoinitiator for the cationic polymerization, the composition (A) and/or the composition (B) can also contain a thermal initiator for the cationic polymerization.

Quaternary N-benzylpyridinium salts and N-benzylammonium salts, for example, are suitable as thermal acid generators, as are described in EP 0 343 690 or WO 2005 097 883 be revealed. In addition, heat-latent sulfonium salts, as in the WO 2019 043 778 A1 described, are used as acid generators.

Commercially available products are available under the designations K-PURE CXC-1614 or K-PURE CXC-1733 from King Industries Inc.; SAN-AID SI-80L and SAN-AID SI-100L are available from SAN-SHIN Chemical Industry Co. Ltd.

In addition, various metal chelate complexes based on titanium or aluminum can be used as heat-latent acids

Component (K3): functional filler

In addition to the components described above, the first mass (A) also contains a functional filler (K3) from the group of dyes (K3-1), pigments (K3-2), conductive fillers (K3-3), electrochromic materials (K3 -4) and combinations thereof.

Dyes (K3-1) and pigments (K3-2)

Organic or inorganic compounds can be used as dyes (K3-1) or pigments (K3-2).

Examples of organic dyes (K3-1) which may be mentioned are azo, cyanine, dioxazine, methine, indigoid, nitro and nitroso, anthraquinone dyes.

Examples of inorganic pigments (K3-2) are carbon black, chromium antimony titanate, cobalt aluminate blue, manganese antimony titanate, cobalt titanate green, iron oxides, bismuth vanadates, chromium oxides and titanium dioxide.

If the functional structure in the optical module assumes the function of an aperture, the functional filler (K3) is preferably carbon black.

Conductive fillers (K3-3)

In principle, all elements or compounds that are compatible with the masses used in each case and have sufficient electrical conductivity for the particular application can serve as conductive fillers (K3-3). More specifically, the conductive fillers are selected from the group consisting of Group 4 to 14 metals and their oxides, nitrides, carbides, borides and alloys, conductive carbon compounds, and combinations thereof.

Metals from groups 4 to 14 include, in particular, titanium, zirconium, iron, ruthenium, osmium, cobalt, rhodium, iridium, nickel, palladium, platinum, copper, silver, gold, zinc, cadmium, mercury, boron, aluminum, gallium, indium, Thallium, germanium, tin and lead into consideration, as well as their oxides, nitrides, carbides, borides, alloys or combinations thereof.

Glass or polymer spheres coated with the metals mentioned can also be used.

Silver, nickel or gold, particularly preferably silver, is preferably used as the conductive functional filler (K3-3).

Commercial sources of the mentioned metal fillers are METALOR Technologies SA, TECHNIC Inc, or H.C. Starck Tungsten GmbH.

Optionally, conductive modifications of the carbon such as CNTs (carbon nanotubes) can also be used as conductive functional filler (K3-3).

Electrochromic Materials (K3-4)

The use of electrochromic materials (K3-4) is also conceivable, particularly in the event that the functional structure assumes the function of a screen. These can be switched by applying an electrical voltage and allow switching states with different transmissions. With an appropriate application, different aperture geometries can also be implemented dynamically through different switching states.

Suitable organic-based electrochromic materials include PEDOT:PSS as described in US Pat U.S. 7,342,708 B2 disclosed, diarylcyclopentenes from U.S. 2018 0 339 995 A1 , N-phenylaniline compounds from the CN 111 607 386 A or in organic compounds suspended polyiodides from the U.S. 4,877,313A .

Component (K4): Additives

The first mass (A) and the second mass (B) can also contain optional components as additives.

The additives are preferably from the group of fillers, aging inhibitors, fluorescent agents, stabilizers, polymerization accelerators, sensitizers, adhesion promoters, drying agents, crosslinkers, flow improvers, wetting agents, thixotropic agents, diluents, flexibilizers, polymeric thickeners, flame retardants, corrosion inhibitors, plasticizers, optical modifiers, and tackifiers Combinations thereof selected.

Optical Modifiers (K4-1)

In particular, the second mass (B) for forming the optical element can contain additives as optical modifiers for adjusting the optical properties of the mass, in particular the refractive index. It is possible to increase the refractive index by adding nanoparticulate additives based on metal oxides such as zirconium dioxide or titanium dioxide. Such additives can be dispersed in a corresponding resin matrix. Suitable dispersions based on zirconium dioxide are, for example, in U.S. 2015 0 203 989 A1 disclosed. High-index materials based on titanates are used in the U.S. 2017 0 200 919 A1 described. In addition to metal oxides, it is also possible to use corresponding monomers or resins which intrinsically have a high refractive index. So reveals the U.S. 2018 0 079 761 A1 high refractive index phenyl-substituted siloxane monomers that can optionally be combined with other nanoparticulate fillers.

Fluorinated or partially fluorinated resins are particularly suitable for setting a low refractive index. Suitable resin components can U.S. 7,537,828 B2 be removed.

Formulations of the first mass (A)

In a first embodiment, the first mass (A) comprises a resin (K1), a hardener (K2), but no initiator for cationic and/or free-radical polymerization, a functional filler (K3) and optionally at least one additive (K4).

In this embodiment, the resin component (K1) is present in the first composition (A), based on the total weight of the first composition (A), in particular in a proportion of 5 to 50% by weight, preferably in a proportion of 10 to 35% wt%.

In the first embodiment, the hardener (K2) is present in the first composition (A), based on the total weight of the first composition (A), in particular in a proportion of 5 to 50% by weight, preferably in a proportion of 10 to 35% by weight.

In a second embodiment, the first mass (A) comprises a resin (K1), an initiator (K2) for cationic and/or free-radical polymerization, but no curing agent, a functional filler (K3) and optionally at least one additive (K4).

In this embodiment, the resin component (K1) is present in the first composition (A), based on the total weight of the first composition (A), in particular in a proportion of 5 to 95% by weight, preferably in a proportion of 10 to 35% wt%.

In the second embodiment, the initiator for the cationic and/or free-radical polymerization (K2) is present in the first composition (A), based on the total weight of the first composition (A), in particular in a proportion of 0.001 to 5% by weight , preferably in a proportion of 0.01 to 5 wt .-%.

In a third embodiment, the first composition (A) comprises a resin (K1), a hardener and an initiator (K2) for cationic and/or free-radical polymerization, a functional filler (K3) and optionally at least one additive (K4).

In this embodiment, the resin component (K1) is present in the first composition (A), based on the total weight of the first composition (A), in particular in a proportion of 5 to 50% by weight, preferably in a proportion of 10 to 35% wt%.

In the third embodiment, the hardener (K2) is present in the first composition (A), based on the total weight of the first composition (A), in particular in a proportion of 5 to 50% by weight, preferably in a proportion of 10 to 35% by weight.

In the third embodiment, the initiator (K2) for the cationic and/or free-radical polymerization is present in the first composition (A), based on the total weight of the first composition (A), in particular in a proportion of 0.001 to 5% by weight , preferably in a proportion of 0.01 to 3 wt .-%.

In all of the embodiments, the first composition (A) also includes a functional filler (K3). If an electrically conductive filler (K3-3) is used, it is present in particular in a proportion of at least 50% by weight, preferably in a proportion of at least 70% by weight, based in each case on the total weight of the first composition (A ). When an electrically conductive filler (K3-3) is used, the functional filler (K3) is present in particular in a proportion of at most 90% by weight, based on the total weight of the first composition (A).

If dyes (K3-1), pigments (K-2) or electrochromic materials (K3-4) are used as functional fillers (K3), in particular for producing a diaphragm structure, the proportion of the functional filler can be in a range from 0.1 to 50 Weight percent are preferably 0.5 to 30 weight percent, based in each case on the total weight of the first composition (A).

If one or more additives (K4) are present in the embodiments of the first composition (A), these are present, based on the total weight of the first composition (A), in particular in a proportion of 0 to 50% by weight, preferably in one Proportion of 1 to 30% by weight.

The first mass (A) can consist of the respective components (K1) to (K4).

The resin (K1) of the first composition (A) is preferably selected from the group consisting of epoxides (K1-1), oxetanes (K1-2), isocyanates (K1-5) and combinations thereof, particularly preferably from the group consisting of epoxides (K1-1), isocyanates (K1-5) and combinations thereof.

The hardener and/or initiator (K2) of the first mass (A) is preferably selected from the group consisting of amines (K2-1), anhydrides (K2-2), thiols (K2-3), initiators for cationic polymerization ( K2-7) and combinations thereof, particularly preferably selected from the group consisting of amines (K2-1) or initiators for cationic polymerization (K2-7). A hardener (K2) based on nitrogen-containing compounds is very particularly preferred.

The hardener (K2) based on a nitrogen-containing compound is preferably present in solid form in the first composition (A) and has a melting point of less than 150° C., preferably less than 110° C.

1. a) 10 bis 40 Gew.-% einer additionsvernetzenden Komponente, wobei das Harz (K1) bevorzugt mindestens difunktionelle Epoxide (K1-1) oder Isocyanate (K1-5) sowie Kombinationen davon umfasst;
2. b) 10 bis 40 Gew.-% eines Härters (K2) auf Basis von stickstoffhaltigen Verbindungen;
3. c) mindestens 50 Gew.-% des Funktionsfüllstoffes (K3) auf Basis eines Metalls ausgewählt aus der Gruppe bestehend aus Aluminium, Kupfer, Nickel, Silber, Gold und Kombinationen davon; und
4. d) 0 bis 30 Gew.-% Additive (K4).

In a preferred embodiment, the first mass (A) comprises or consists of the following components, each based on the total weight of the first mass (A):

1. a) 10 to 40% by weight of an addition-crosslinking component, the resin (K1) preferably comprising at least difunctional epoxides (K1-1) or isocyanates (K1-5) and combinations thereof;
2. b) 10 to 40% by weight of a hardener (K2) based on nitrogen-containing compounds;
3. c) at least 50% by weight of the functional filler (K3) based on a metal selected from the group consisting of aluminum, copper, nickel, silver, gold and combinations thereof; and
4. d) 0 to 30% by weight of additives (K4).

In this embodiment, the at least difunctional epoxide (K1-1) preferably has at least 10% by weight of an aliphatic and/or cycloaliphatic epoxide, based on the total weight of the first composition (A).

1. a) 10 bis 99,9 Gew.-% einer kationisch polymerisierbaren Komponente, wobei das Harz (K1) bevorzugt mindestens difunktionelle Epoxide (K1-1) oder Oxetane (K1-2) sowie Kombinationen davon umfasst;
2. b) 0,001 bis 5 Gew.-% eines Initiators (K2) für die kationische Polymerisation, insbesondere einer photolatenten und/oder wärmelatenten Säure;
3. c) 50 bis 90 Gew.-% des leitfähigen Funktionsfüllstoffes (K3-3) auf Basis eines Metalls ausgewählt aus der Gruppe bestehend aus Aluminium, Kupfer, Nickel, Silber, Gold und Kombinationen davon, oder 0,1 bis 30 Gew.-% eines Füllstoffs aus der Gruppe der Farbstoffe, Pigmente und elektrochromen Materialien; und
4. d) 0 bis 30 Gew.-% Additive (K4).

In a further preferred embodiment, the first mass (A) comprises or consists of the following components, each based on the total weight of the first mass (A):

1. a) 10 to 99.9% by weight of a cationically polymerizable component, the resin (K1) preferably comprising at least difunctional epoxides (K1-1) or oxetanes (K1-2) and combinations thereof;
2. b) 0.001 to 5% by weight of an initiator (K2) for cationic polymerization, in particular a photolatent and/or heat-latent acid;
3. c) 50 to 90% by weight of the conductive functional filler (K3-3) based on a metal selected from the group consisting of aluminum, copper, nickel, silver, gold and combinations thereof, or 0.1 to 30% by weight a filler from the group of dyes, pigments and electrochromic materials; and
4. d) 0 to 30% by weight of additives (K4).

In this embodiment, the at least difunctional epoxide (K1-1) preferably has at least 10% by weight of an aliphatic and/or cycloaliphatic epoxide, based on the total weight of the first composition (A).

Formulations of the second mass (B)

In a first embodiment, the second composition (B) comprises a resin (K1), an initiator (K2) for the cationic and/or free-radical polymerization, but no hardener and optionally at least one additive (K4).

In this embodiment, the resin component (K1) is present in the second mass (B), based on the total weight of the second mass (B), in particular in a proportion of 10 to 99.99% by weight, preferably in a proportion of 10 up to 80% by weight.

In the second embodiment, the initiator for the cationic and/or free-radical polymerization (K2) is present in the second composition (B), based on the total weight of the second composition (B), in particular in a proportion of 0.001 to 5% by weight , preferably in a proportion of 0.01 to 5 wt .-%.

In contrast to the first mass (A), the second mass (B) has no functional filler (K3) that is electrically conductive or fulfills a diaphragm function.

If one or more additives (K4) are contained in the embodiments of the second mass (B), these are present in a proportion of 0 to 80% by weight, based on the total weight of the second mass (B), preferably in a proportion of 1 to 45% by weight.

The second mass (B) can consist of the components (K1), (K2) and (K4).

The resin (K1) of the second mass (B) is preferably selected from the group consisting of epoxides (K1-1), oxetanes (K1-2), (meth)acrylates (K1-6) and combinations thereof, particularly preferably from the Group consisting of epoxides (K1-1), (meth)acrylates (K1-6) and combinations thereof.

1. a) 67 bis 98,7 Gew.-% eines mindestens difunktionellen Epoxids (K1-1), das mindestens ein aliphatisches und/oder cycloaliphatisches Epoxid enthält, oder eines (Meth)acrylats (K1-6);
2. b) 0,3 bis 3 Gew.-% eines Initiators (K2) für die kationische Polymerisation, ausgewählt aus der Gruppe der Sulfonium-, lodonium- oder Metalloceniumsalze, oder eines Initiators (K2) für die radikalische Polymerisation;
3. c) 1 bis 45 Gew.-% Additive (K4).

In a preferred embodiment, the second mass (B) comprises or consists of the following components, each based on the total weight of the first mass (B):

1. a) 67 to 98.7% by weight of an at least difunctional epoxide (K1-1) which contains at least one aliphatic and/or cycloaliphatic epoxide, or of a (meth)acrylate (K1-6);
2. b) 0.3 to 3% by weight of an initiator (K2) for cationic polymerization, selected from the group of sulfonium, iodonium or metallocenium salts, or an initiator (K2) for free-radical polymerization;
3. c) 1 to 45% by weight of additives (K4).

In this embodiment, the at least difunctional epoxide (K1-1) preferably has at least 20% by weight of an aliphatic and/or cycloaliphatic epoxide, based on the total weight of the second composition (B).

In the hardened state, the second composition (B) has in particular a transmission of more than 90%, preferably more than 95%, in the spectral range of 380-2500 nm, measured at a layer thickness of about 200 μm. The transmission is preferably measured at a defined wavelength which corresponds to the wavelength desired for the respective optical application or is in the wavelength range of the desired optical application.

Combinations of the first mass (A) and the second mass (B)

The same components (K1) and (K2) and optionally (K4) are preferably used in the compositions (A) and (B). It is particularly preferred to use a cationically polymerizable composition both for the first (A) and for the second composition (B).

When using different components (K1) and (K2), the combinations given in Table 1 under Nos. 2 to 6 are preferred. Table 1: Preferred combinations of components of the first (A) and second composition (B). No. First mass (A) Second mass (B) 1 (K1): epoxide + optionally oxetane (K1): epoxide + optionally oxetane (K2): Initiator for the cationic polymerization (K2): Initiator for the cationic polymerization 2 (K1): isocyanate + optionally (meth)acrylate (K1): epoxide + optionally oxetane (K2): amine (K2): Initiator for the cationic polymerization 3 (K1): epoxide + optionally (meth)acrylate (K1): epoxide + optionally oxetane (K2): initiator for cationic polymerization + optional photoinitiator for radical polymerization (K2): Initiator for the cationic polymerization 4 (K1): epoxy (K1): (meth)acrylate (K2): amine (K2): Photoinitiator for radical polymerization 5 (K1): epoxide + optionally oxetane (K1): (meth)acrylate (K2): Initiator for the cationic polymerization (K2): Photoinitiator for radical polymerization 6 (K1): isocyanate + optionally (meth)acrylate (K1): (meth)acrylate (K2): amine (K2): Photoinitiator for radical polymerization

Combinations nos. 1, 2 and 6 are particularly preferred for the purposes of the invention.

If the optical element is first formed on the basis of a cationically polymerizable epoxy compound (A) and is fully cured, it is also conceivable to use an epoxy-amine-based compound (B) for the functional structure.

The object of the invention is also achieved by an optical module that can be obtained using the method described above, comprising a functional structure and an optical element connected to the functional structure with an optical structure, the functional structure having electrical conductivity and/or an aperture function. The functional structure in the optical module is preferably arranged flush with a surface of the optical element.

The optical module can be used in an optical device, the optical device additionally comprising a light-emitting element assigned to the optical module.

If the functional structure is electrically conductive, in the event of a malfunction of the optical device, the optical module can in particular interrupt the flow of electrical current and thus switch off the light-emitting element.

A malfunction can be understood, for example, as damage in the form of a break or a partial or complete loss of contact between the optical module and at least one other component of the optical device.

If the functional structure assumes the function of a diaphragm, the functional structure can form a beam path of the light-emitting element to create patterns or projections.

character list

• - 1a bis 1h schematische Querschnittsansichten der Fertigungsschritte einer ersten Ausführungsform eines erfindungsgemäßen Verfahrens zum Herstellen eines optischen Moduls,
• - 2a bis 2e schematische Querschnittsansichten der Fertigungsschritte einer zweiten Ausführungsform eines erfindungsgemäßen Verfahrens zum Herstellen eines optischen Moduls,
• - 3a bis 3c schematische Draufsichten der Funktionsstrukturen verschiedener Geometrien wie sie im erfindungsgemäßen Verfahren nach 1a bis 1h bzw. 2a bis 2e erzeugt werden,
• - 4a bis 4c schematische Querschnittsansichten verschiedener vereinzelter optischer Module wie sie durch das erfindungsgemäße Verfahren nach 1a bis 1h bzw. 2a bis 2e hergestellt werden können,
• - 5a bis 5c schematische Querschnittsansichten weiterer vereinzelter optischer Module wie sie durch das erfindungsgemäße Verfahren nach 1a bis 1h bzw. 2a bis 2e hergestellt werden können,
• - 6a bis 6c schematische Draufsichten weiterer vereinzelter optischer Module mit Funktionsstrukturen in verschiedenen Mustern, wie sie im erfindungsgemäßen Verfahren nach 1a bis 1h bzw. 2a bis 2e hergestellt werden können;
• - 7a bis 7e schematische Querschnittsansicht weiterer vereinzelter optischer Module wie sie durch das erfindungsgemäße Verfahren nach 1a bis 1h bzw. 2a bis 2e hergestellt werden können; und
• - 8 schematisch eine optische Vorrichtung mit einem optischen Modul wie es durch das erfindungsgemäße Verfahren nach 1a bis 1h bzw. 2a bis 2g erhältlich ist.

Show in the attached drawings

• - 1a until 1 hour schematic cross-sectional views of the manufacturing steps of a first embodiment of a method according to the invention for manufacturing an optical module,
• - 2a until 2e schematic cross-sectional views of the manufacturing steps of a second embodiment of a method according to the invention for manufacturing an optical module,
• - 3a until 3c schematic top views of the functional structures of different geometries as in the method according to the invention 1a until 1 hour or. 2a until 2e be generated,
• - 4a until 4c schematic cross-sectional views of various isolated optical modules as by the method according to the invention 1a until 1 hour or. 2a until 2e can be produced
• - 5a until 5c schematic cross-sectional views of further isolated optical modules as they are determined by the method according to the invention 1a until 1 hour or. 2a until 2e can be produced
• - 6a until 6c schematic plan views of further isolated optical modules with functional structures in different patterns, as in the method according to the invention 1a until 1 hour or. 2a until 2e can be produced;
• - 7a until 7e schematic cross-sectional view of further isolated optical modules as by the method according to the invention 1a until 1 hour or. 2a until 2e can be produced; and
• - 8th schematically an optical device with an optical module as by the method according to the invention 1a until 1 hour or. 2a until 2g is available.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

In the following, the invention is described in detail and by way of example on the basis of preferred embodiments, which, however, should not be understood in a limiting sense.

Measurement methods and definitions used

"One-component" or "one-component mass" means in the context of the invention that the components of the mass are present together in one packaging unit.

In the context of the invention, “liquid” means that at 23° C. the loss modulus G″ determined by viscosity measurement is greater than the storage modulus G′ of the mass in question.

"Moisture" is defined as 50% relative humidity at room temperature, or the moisture on substrate surfaces at those conditions, unless otherwise specified.

If the indefinite article "a" or "an" is used, the plural form "one or more" is also included, unless this is expressly excluded.

“At least difunctional” means that two or more units of the functional group mentioned in each case are present per molecule.

Unless otherwise stated, all of the weight proportions listed relate to the total weight of the respective compound.

Method of manufacturing an optical module

Optical modules with a diameter of around 1 to 4000 micrometers are mainly manufactured at the wafer/panel level. This means that between 8 and 10,000 optical module units are manufactured per wafer/panel and then separated using a sawing process, for example.

A sequence of a first embodiment of the method according to the invention is shown schematically in FIGS 1a until 1 hour shown, wherein a schematic cross-sectional view of a precursor with, for example, two optical module units is shown.

First, a temporary substrate 10 is provided (cf. 1a) .

The temporary substrate is in particular made of metal, glass, silicone and/or a plastic. For example, the temporary substrate is a foil, in particular made of polyethylene terephthalate (PET) or a glass substrate, in particular a glass substrate with a non-stick coating. Backings, in particular flexible or rigid backings, with a temporary adhesive material or a removable mass can also be used as a temporary substrate. The temporary adhesive material or the removable compound is based, for example, on a (meth)acrylate.

The first mass (A) is metered onto the temporary substrate 10 to form a pattern 12 (cf. 1b) .

The first mass (A) can be applied to the temporary substrate 10 in the form of the predefined pattern 12 by means of stencil printing, screen printing, ink jetting, jetting or needle dosing.

If the first mass (A) is applied by means of stencil printing, a squeegee made of metal, preferably stainless steel, a squeegee speed in the range from 10 to 350 mm/s, preferably 40 to 60 mm/s, and a squeegee pressure in the range from 0.1 to 5 bar, preferably from 1.0 to 1.4 bar, are used.

In the case of screen printing, a squeegee made of polyurethane (PUR), silicone and/or other plastics is used in particular, preferably a squeegee made of PUR, with a squeegee speed in the range from 10 to 350 mm/s, preferably from 80 to 120 mm/s, and a squeegee pressure in the range from 0.1 to 5 bar, preferably 1.8 to 2.2 bar. A coating thickness of the first composition (A) in a range from 5 to 500 μm, preferably from 10 to 20 μm, can be achieved with screen printing.

Jetting (also known as "non-contact dispensing") can use a pneumatic valve or a valve driven by a piezo actuator. The nozzle used can have a diameter in the range from 30 to 600 μm and in particular can be heated to a temperature of up to 100.degree. The metering pressure at the first mass (A) is in particular in the range of up to 50 bar, preferably up to 6 bar. In particular, a frequency of up to 1000 Hz is used as the dosing frequency.

If the first mass (A) is applied by means of needle dosing, a cylindrical or conical needle is used in particular, preferably a conical needle. The inner needle diameter is in particular in the range from 50 μm to 1 mm. In particular, a needle pressure in the range from 0.1 to 10 bar, preferably from 0.1 to 5 bar, and an application speed in the range from 0.5 to 100 mm/s are used.

After the first mass (A) has been applied, it is cured at least partially, preferably completely, to form a functional structure 13 (cf. 1c ). Curing can take place thermally or by actinic radiation.

For thermal curing, the temporary substrate with the applied first composition (A) is heated to a temperature in the range from 60° C. to 150° C. in a circulating air oven or by means of a hotplate for a period of 1 to 120 minutes. For example, thermal curing takes place for 30 minutes at a temperature of 80°C.

For curing by means of actinic radiation, the first composition (A) is irradiated with an Hg radiator or an LED lamp, in particular with a surface lamp of the corresponding type. A suitable commercially available LED lamp is available under the name DELOLUX 20 from DELO. Irradiation can be carried out with a wavelength in the range from 320 to 480 nm, preferably 365 nm, and an intensity in the range from 20 to 2000 mW/cm ² , preferably from 180 to 220 mW/cm ² . The irradiation time is in particular in the range from 1 to 300 s, preferably from 55 to 65 s.

The second mass (B) is then metered in the form of a cover layer 14 onto the temporary substrate 10 and the functional structure 13 (cf. 1c ).

This can be done, for example, by means of a "puddle dispense" method, as is known from the field of wafer treatment. The dosing of the second mass (B) can be done as a direct dosing from a storage cartridge depending on pressure and time, volumetrically via a dosing screw or gravimetrically. The dosage is preferably controlled volumetrically. The amount of second mass (B) to be metered depends on the size of the temporary substrate 10 used and the desired layer thickness of the cover layer 14 and is typically in the range from 0.5 to 100 mL.

Alternatively, the cover layer 14 can be applied in a spin coating process, with speeds in the range from 500 to 10,000 rpm being used in particular, preferably speeds in the range from 500 to 4,000 rpm, with a total duration in the range from 10 to 120 s.

A precursor 18 is then produced by pressing a stamp 16 onto the cover layer 14 and curing the second mass (B) (cf. 1d ).

The stamp 16 has cavities 20 which produce a multiplicity of optical structures 22 on a first side of the cover layer 14 and thus of the precursor 18 .

The stamp 16 can be made of polydimethylsiloxane (PDMS), a (meth)acrylate, a hybrid polymer, glass or metal, preferably made of PDMS or a (meth)acrylate.

In addition, the stamp 16 can have a non-stick coating in order to make it easier to detach the stamp 16 later without destroying it.

The stamp 16 can, as in 1d 1, may be a flat plate apart from the cavities 20 or part of a roll which is brought into contact with the cover layer 14. FIG.

It is also possible for the cavities 20 to be at least partially filled with the second compound (B) before the stamp 16 is pressed onto the cover layer 14 . This is done in particular by jetting or dosing with a needle, as described above for applying the first mass (A) to the temporary substrate 10 .

After the formation of the optical structures 22 by means of the stamp 16, the second compound (B) is cured. Curing can take place thermally or by actinic radiation.

In principle, the same curing processes and conditions can be used as for curing the first composition (A). If the plunger 16 can be heated, the heating of the second mass (B) can, however, also take place via the plunger 16 .

After the second mass (B) has hardened, the stamp 16 is separated from the precursor 18 manually or automatically (cf. 1e) and the temporary substrate 10 is detached (cf. 1f) .

In the embodiment shown, the precursor 18 is obtained, from which a plurality of optical modules 26 can be obtained by separating, each of which has an optical element 24 formed from the hardened second mass (B) and a functional structure 13 connected to the optical element 24 is formed from the hardened first mass (A) and has an electrical conductivity and/or an aperture function (cf. 1f until 1 hour) .

The separation can be done, for example, by sawing. At the in 1g In the embodiment shown, the separation takes place along the line shown in dashed lines, so that only the hardened second mass (B) is severed. The functional structure 13 remains enclosed by the hardened compound (B) except for the area originally adjoining the temporary substrate 10 . As a result, micro- or nanostructures can also be reliably stabilized.

However, it is also possible for the functional structure 13 to be severed when the precursor 18 is separated. This results in an optical module (not shown) in which the functional structure 13 is surrounded by the optical element 24 only on two adjacent sides. In the case of a conductive functional structure 13, this results in different possibilities for contacting.

Of course, instead of a precursor 18, the process shown as an example can also be used to produce the individual optical module 26 directly. In this case, the cover layer 14 would be cured directly to form the optical element 24 .

The optical module 26 obtained is monolithic. In other words, the functional structure 13 is firmly anchored in the optical module 26 or integrated into the optical module 26, so that the optical module 26 can be handled as a whole. The functional structure 13 is arranged in the optical module in particular flush with the surface of the optical element 24 which was formed during the production of the optical module 26 by applying and curing the second mass (B) on the temporary substrate.

A sequence of a second embodiment of the method according to the invention is shown schematically in FIGS 2a until 2e shown. The second embodiment essentially corresponds to the first embodiment, so that only the differences are discussed below. Reference is made to the above explanations.

In the second embodiment, a partial precursor 27 is first produced, which corresponds to the precursor 18 without a functional structure, and from which the optical element 24 results after separation. The partial precursor 27 is a wafer, for example, which carries a multiplicity of optical structures 22 .

To produce the partial precursor 27, the second mass (B) is applied as a cover layer 14 to a structured carrier substrate 28, the structured substrate having projections 30 which are complementary to recesses 32 to be produced on the first or second side of the partial precursor 27 for the functional structure 13 are.

The structured carrier substrate 28 can be made of the same materials as the temporary substrate 10 or the stamp 16 of the first embodiment.

The optical structures 22 are then formed by means of the stamp 16 on the side of the cover layer 14 opposite the structured carrier substrate 28 and the second mass (B) is cured to form the partial precursor 27 (cf. 2a) .

The partial precursor 27 with a multiplicity of optical structures 22 is obtained by detaching the structured carrier substrate 28 and the stamp 16, with the recesses 32 on the first and/or second side of the partial precursor 27 becoming accessible (cf. 2 B) . in the in 2 B In the embodiment shown, recesses 32 are provided only on the first side and optical structures 22 are provided only on the second side.

The first mass (A) is then metered into the recesses 32 in the form of a pattern 12 in order to subsequently form the functional structure 13 (cf. 2c ). All the methods that have been described in the first embodiment for applying the first mass (A) to the temporary substrate 10 can be used for this purpose. However, the first mass (A) is preferably introduced into the recesses 32 by means of inkjetting, jetting or needle dosing.

The first mass (A) is then cured to form the functional structure 13, as previously described in the first embodiment.

In this way, analogously to the first embodiment, a precursor 18 is obtained, from which a plurality of optical modules 26 can be obtained by separating, each of which has an optical element 24 formed from the hardened second mass (B) and a functional structure 13 connected to the optical element 24 have, wherein the functional structure 13 is formed from the hardened first mass (A) and has electrical conductivity and/or an aperture function (cf. 2d and 2e) .

Of course, analogous to the first embodiment, the individual optical module 26 can also be produced directly instead of a precursor 18 in the process shown as an example. In this case, the topcoat 14 would be cured directly to the optical element 24 rather than the partial precursor 27. Finally, a monolithic optical module 26 with a flush arrangement of functional structure 13 and optical element 24 can also be obtained with the second embodiment of the method according to the invention. In an embodiment not shown here, it is possible to provide the stamp 16 with projections, so that in addition to the optical structures 22, further recesses are formed in the partial precursor 27, which lie on the side of the optical structures 22 and in which a functional filler is formulated first mass (A) can be dosed. After the first mass (A) has hardened, optical modules 26 can be produced from the precursor 18 produced in this way, which have optical structures 22 and functional structures 13 on the same side.

In the 3a until 3c exemplary functional structures 13 are shown schematically in a plan view.

In the functional structures 13 in 3a and 3c this has a rectangular outer contour, while the functional structure 13 in 2 B has a circular outer contour.

In addition, it can be seen that the functional structure 13 has an opening 34, which in the examples 3a and 3b a circular contour and in the example after 3c has an irregular polygonal contour.

In the optical module 26, the opening 34 is filled by the optical element 24 (cf. 1 hour and 2e) .

The shape of the opening 34 is matched in particular to the optical structure 22 of the optical element 24 . In principle, however, the opening 34 can have a larger, the same size or a smaller extent than the optical structure 22, as in FIGS 4a until 4c shown schematically.

Further exemplary functional structures 13 of the optical module 26 are in 6a until 6c shown in a sectional view through the optical module 26, wherein the direction of representation corresponds to a plan view. The functional structures 13 form different patterns in the manner of conductor tracks and can have one or more contact points 35 .

The optical structure 22 is decisive for the subsequent function of the optical module 26. The optical structure 22 can, for example, be a lens (cf. 5a) , a grating, a microlens array (cf. 5b) , a diffractive optical element (DOE, cf. 5c ) or be a diffuser.

the 7a until 7e show further exemplary embodiments of isolated optical modules 26 in a schematic cross-sectional view, as can be obtained by the method according to the invention, wherein 7a essentially according to the embodiment 1 hour and 2e is equivalent to. The functional structures 13 of the optical modules 26 shown here can be conductor tracks, for example. The functional structure 13 and the optical structure 22 are located on opposite sides of the optical module 26 (cf. 7a) , or the functional structure 13 is arranged on the same side as the optical structure 22 (cf. 7b) . It is also possible to form functional structures 13 and/or optical structures 22 on the two opposite sides of the optical module (cf. 7c until 7e) . In all cases, monolithic optical modules 26 may be present.

Using the optical module

The optical module 26 obtained by the method according to the invention can be provided for a large number of different applications.

For example, the optical module 26 is intended to serve as a receiver unit in an optical device, for example in imaging optics such as cameras or in collecting optics such as sensors.

Alternatively, the optical module 26 can be intended to be used in transmitter optics, for example as illumination optics for changing the beam angle of an LED or as projection optics. The optical module 26 can also be used for beam shaping, in particular for beam shaping of a light beam generated by a laser or a laser-like light source. For example, the optical module 26 can be used to generate a point or line pattern or to enable uniform illumination of a solid angle.

Examples of application areas of the optical module 26 are in devices for 3D recognition such as ToF, LiDAR or stripe projection devices, for example for environmental recognition, face recognition and/or biometric recognition, proximity sensors, color sensors, spectrometers, cameras, in particular for the visible and infrared spectral range, headlights, in particular front headlights in vehicles, signal projection devices, in particular for light signal systems, flash modules and decorative projection devices, in particular in so-called "light carpets".

In 6 an optical device 36 with an optical module 26 according to the invention is shown schematically.

The optical device 36 comprises a light-emitting element 38 and an optical module 26, as can be obtained using the method described above, and a control unit 40 which is electrically connected to the light-emitting element 38 and to the optical module 26.

The functional structure 13 of the optical module 26 is electrically conductive in the embodiment shown.

The light-emitting element 38 is in particular a laser.

The optical module 26 is arranged in such a way that it lies in the beam path 42 of the light emitted by the light-emitting element 38 .

If there is a malfunction in the optical module 26, for example damage that could result in the light emitted by the light-emitting element 38 escaping in an uncontrolled manner, this can be detected via the functional structure 13 and the control unit 40, so that the power of the light-emitting element 38 is reduced or this can be switched off.

QUOTES INCLUDED IN DESCRIPTION

This list of documents cited by the applicant was generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

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Claims (12)

Method for producing an optical module (26) with an optical element (24) and at least one functional structure (13) connected to the optical element (24) and having electrical conductivity and/or an aperture function, the method comprising the following steps : a1) Metering a first curable composition (A) onto a substrate to form a pattern (12) corresponding to the functional structure (13), the first composition (A) comprising at least one functional filler (K3) selected from the group consisting of dyes, pigments, electrochromic materials, conductive fillers, and combinations thereof; a2) optional at least partial hardening of the first mass (A) to form the functional structure (13); a3) dosing a second hardenable composition (B) onto the first composition (A); and a4) subsequent curing of the second mass (B) and optionally the first mass (A) by exposure to actinic radiation and/or heating to form the optical element (24) connected to the functional structure (13); or wherein the optical module (26) is manufactured by b1) dosing and curing of the second hardenable composition (B) to form the optical element (24); b2) dispensing the first mass (A) onto the optical element (24) to form a pattern (12) corresponding to the functional structure (13); and b3) subsequent curing of the first mass (A) by exposure to actinic radiation and/or heating to form the functional structure (13) connected to the optical element (24). procedure after claim 1 , characterized in that the first mass (A) is fully cured in step a2). procedure after claim 1 , characterized in that the first compound (A) is partially cured in step a2) and the second compound (B) is applied to the partially cured compound (A) formed functional structure (13). procedure after claim 1 , characterized in that the first mass (A) remains uncured, the second mass (B) is applied in step a3) to the pattern (12) formed from the uncured mass (A), and in step a4) the first mass and the second mass can be cured together. Method according to one of the preceding claims, characterized in that a monolithic optical module (26) is obtained after curing by exposure to actinic radiation and/or heating. Method according to one of the preceding claims, characterized in that the formation of the functional structure (13) comprises metering the first mass (A) onto a temporary substrate (10), the temporary substrate in particular after a final curing of the functional structure (13) and of the optical element can be detached from the optical module (26) in a non-destructive manner. Method according to one of the preceding claims, characterized in that forming the optical element (24) comprises forming an optical structure (22), and the optical element (24) on a side on which the optical structure (22) is located , and/or is provided on a side of the optical element (24) opposite to the optical structure (22) with at least one recess (32) into which the functional structure (13) engages. procedure after claim 7 , characterized in that the optical structure (22) and/or the at least one recess (30) is or are produced by at least one stamp (16) and/or metering the second mass (B) onto at least one structured carrier substrate (28). . Method according to one of the preceding claims, characterized in that the functional structure (13) and the optical element (22) form a precursor (18) of the optical module (26) after the final curing, from which the optical module (26) by separating of the precursor (18). Method according to one of the preceding claims, characterized in that the first composition (A) comprises a hardenable resin (K1) and a hardener and/or initiator (K2) for the hardenable resin (K1), wherein in the first composition (A) the resin (K1) is selected from the group consisting of epoxides (K1-1), oxetanes (K1-2), isocyanates (K1-5) and combinations thereof, and the hardener and/or initiator (K2) is selected from the group consisting of amines (K2-1), anhydrides (K2-2), thiols (K2-3), initiators for cationic polymerization (K2-7) and combinations thereof . Method according to one of the preceding claims, characterized in that the second mass (B) comprises a curable resin (K1) and a hardener and/or initiator (K2) for the curable resin (K1), wherein in the second mass (B) the resin is selected from the group consisting of epoxides (K1-1), oxetanes (K1-2), (meth)acrylates (K1-6) and combinations thereof and the hardener and/or initiator (K2) is selected from the group consisting of peroxides (K2-5), photoinitiators for free-radical polymerization (K2-6), photoinitiators for cationic polymerization (2-7) and combinations thereof. Optical module obtainable by a method according to one of the preceding claims, comprising a functional structure (13) and an optical element (24) connected thereto with an optical structure (22), the functional structure (13) having electrical conductivity and/or an aperture function.

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