DE102020212307B4 - Solder foil for vacuum interrupters - Google Patents

Abstract

Solder foil (10) for vacuum interrupters (5) with an annular processing mold (20), with a ring diameter (25), characterized in that the annular processing mold (20) is formed from a one-piece elongated production mold (30, 30`) by folding.

Description

The invention relates to a solder foil for vacuum interrupters, the use of such solder foils and a method for producing a vacuum interrupter.

Ring-shaped solder foils are known from the prior art, which are removed in one piece from a foil strip, in particular punched out.

For ring diameters of the solder foil that are larger than the foil strip, individual ring segments are usually removed from the foil strip and these are then joined together using either spot welding or laser welding of a circular ring foil.

This results in the disadvantage that the segments of the circular soldering foil have to be joined together to form a circular ring before the vacuum interrupter is processed, and in particular have to be positioned and connected in a complex manner.

For example, describes the US 5,222,651 A a ring-shaped solder foil with solder spacers distributed over the solder foil, which are fixed to the solder foil by laser welding, caulking or with various types of dents.

The object of the invention is therefore to provide a solder foil which eliminates the disadvantages of the prior art.

The task is solved according to independent claim 1 and the claims dependent on it.

One embodiment relates to a solder foil for vacuum interrupters having an annular processing mold with a ring diameter, the annular processing mold being formed from a one-piece elongated production mold by folding.

It is preferred that the annular processing shape is formed by folding a one-piece, elongated production shape detached from a film strip.

It is particularly preferred that the process of removing the one-piece elongated production form from the film strip takes place by means of punching, cutting, in particular laser cutting, embossing and/or eroding.

It is also preferred that the ring diameter of the solder foil in the processing form is larger than the width of a foil strip from which the solder foil is removed.

It is also preferred that the ring diameter of the annular processing mold is larger than a width of the one-piece elongated production mold. It is further preferred that the one-piece elongated production mold has a first open end and a second open end.

In particular, it is preferred that after folding the one-piece elongated production mold into the annular processing mold, the first open end and the second open end at least partially overlap and these overlapping areas are connected.

In particular, it is preferred that the overlapping areas are connected in a cohesive or non-positive manner.

It is also preferred that the one-piece, elongated production mold forms a closed curved path. In other words, the one-piece, elongated production form has no open ends.

It is also preferred that the one-piece elongated production mold is structured in areas of folds and/or overlapping areas such that the folded areas and/or the overlapping areas are not thicker than unfolded areas and/or non-overlapping areas.

It is also preferred that the one-piece elongated production mold is designed in areas of folds and/or overlapping areas such that the areas and/or the overlapping areas are thicker than non-folded areas and/or non-overlapping areas.

A further exemplary embodiment relates to the use of a solder foil according to the above statements, in particular to a solder foil in which the one-piece elongated production form is designed in areas of folds and/or overlapping areas such that the folded areas and/or the overlapping areas are thicker as unfolded areas and/or non-overlapping areas, wherein the solder foil is placed between structures of a vacuum interrupter to be soldered, the vacuum interrupter is placed in a vacuum oven, the vacuum oven is evacuated, and gas from the vacuum interrupter through gaps through the unfolded areas and/or non-overlapping areas are formed when the vacuum oven is evacuated.

A method for producing a vacuum interrupter is also preferred, wherein a solder foil according to one of the above embodiments is placed between structures of a vacuum interrupter to be soldered.

It is also preferred that a one-piece elongated production form is converted into an annular processing form by folding.

It is further preferred that the one-piece elongated production mold is removed from a film strip, the film strip having a width that is less than a ring diameter of the annular processing mold.

• 1: Zwei getrennte Kreisringsegmente zur Bildung einer Lotfolie aus dem Stand der Technik;
• 2: Kreisringförmige Lotfolie aus dem Stand der Technik;
• 3: Folienband mit erfindungsgemäßer einstückiger langgestreckter Produktionsform mit geschlossener Kurvenbahn;
• 4: Ringförmige Verarbeitungsform einer Lotfolie, gebildet aus der einstückigen langgestreckten Produktionsform der 3;
• 5: Erfindungsgemäße einstückige langgestreckte Produktionsform mit einem ersten offenen Ende und einem zweiten offenen Ende;
• 6: Ringförmige Verarbeitungsform, gebildet aus der einstückigen langgestreckten Produktionsform gemäß 5;
• 7: Einstückige langgestreckte Produktionsform mit Faltbereichen und Überlappungsbereichen;
• 8: Vergrößerung des Faltbereiches aus der 7;
• 9: Einstückige langgestreckte Produktionsform mit alternativen Faltbereichen und einem ersten offenen Ende und einem zweiten offenen Ende;
• 10: Ringförmige Verarbeitungsform, erzeugt durch Falten der einstückigen langgestreckten Produktionsform aus 9;
• 11: Einstückige langgestreckte Produktionsform mit einem weiteren alternativen Faltbereich;
• 12: Schnitt durch die Faltkante aus 11;
• 13: Einstückige langgestreckte Produktionsform mit Faltbereichen;
• 14: Ringförmige Verarbeitungsform, erzeugt durch Falten der einstückigen langgestreckten Produktionsform aus 13.

The invention is described below using figures:

• 1 : Two separate circular ring segments to form a solder foil from the prior art;
• 2 : Circular solder foil from the prior art;
• 3 : Film tape with a one-piece elongated production form according to the invention with a closed curved track;
• 4 : Ring-shaped processing form of a solder foil, formed from the one-piece elongated production form 3 ;
• 5 : One-piece elongated production mold according to the invention with a first open end and a second open end;
• 6 : Annular processing mold formed from the one-piece elongated production mold according to 5 ;
• 7 : One-piece elongated production mold with folding areas and overlapping areas;
• 8th : Enlargement of the folding area from the 7 ;
• 9 : One-piece elongated production mold with alternative fold areas and a first open end and a second open end;
• 10 : Ring-shaped processing mold created by folding the one-piece elongated production mold 9 ;
• 11 : One-piece elongated production form with another alternative folding area;
• 12 : Cut through the folded edge 11 ;
• 13 : One-piece elongated production mold with folding areas;
• 14 : Ring-shaped processing mold created by folding the one-piece elongated production mold 13 .

The 1 shows two ring segments 12 of a solder foil ring from the prior art. The two ring segments 12 of the solder foil ring each have two overlap areas 14, which serve for fastening when forming the annular solder foil.

The 2 shows an annular solder foil 10, consisting of two ring segments 12, which overlap in the overlap areas 14 and are or can be connected to one another there.

The 3 shows a solder foil 10 according to the invention, which is formed from a one-piece elongated production form 30. The one-piece elongated production form 30 is removed from the foil strip 15. The width 17 of the foil strip is smaller than the ring diameter (not shown) of the ring-shaped processing form 20 produced by folding with the ring diameter 25. The one-piece elongated production form 30 has folding areas 40. By folding the one-piece elongated production form 30 after it has been removed from the foil strip 15, the 4 shown ring-shaped processing form 20.

The 4 shows the annular processing mold 20 formed by folding the one-piece elongated production mold 30 of the 3 was generated. The four folding areas 40 of the one-piece elongated production mold 30 from the 3 are in the 4 still vaguely recognizable and marked as folding areas 40.

The 5 shows a further embodiment of a one-piece elongated production mold 30 with a first open end 32 and a second open end 34. Overlapping regions 36 are provided at the first open end 32 and the second open end 34. The one-piece elongated production mold 30 is transferred into the annular processing mold 20 by folding in the folding areas 40, the overlapping regions 36 in the annular processing mold 20 overlapping and serving for joining or fastening. The one-piece elongated production form 30 of 5 has a width of 35.

The 6 shows an annular processing mold 20 which is formed by folding the in 5 shown one-piece elongated production mold 30 is formed. The annular processing form 20 of the solder foil 10 becomes non-positive or positive in the overlapping area 36 put together so that a closed annular processing form 20 results.
The undesignated diameter of the solder foil 10 in the closed annular processing mold 20 is larger than the width 35 of the one-piece elongated production mold 30 5 , which enables more efficient use of solder foil sheets and also larger diameters of the solder foil 10 6 can be made cost-effective.

The 7 shows a further variant of a one-piece elongated production mold 30 with a first open end 32 and second open end 34. The one-piece elongated production mold 30 has at least one, in 7 a folding area 40, which preferably has a folding facility, for example a fold or perforation, as in 8th shown. The one-piece elongated production mold 30 can be folded into a solder ring in such a way that the overlap area 36 of the first open end 32 and the overlap area 36 of the second open end 34 overlap. In an advantageous embodiment, the overlap area 36 of the first open end 32 and the second open end 34 are connected to one another. The type of connection can be a positive connection and/or a material connection and/or a non-positive connection; welding methods such as spot welding or laser welding are particularly preferred. In the case of the positive connection, for example, there can be a recess on the overlap area 36 of the first open end 32 and on the overlap area 36 of the second open end 34, which can be plugged into one another and thus lead to a positive connection. Alternatively, can an adhesive be used? or another fastening technique can be used.

Furthermore, the one-piece elongated production mold 30 can optionally have one or more punchings 46, which are designed so that a part of the material can be bent out of the plane of the one-piece elongated production mold 30 and folded over by 180 °. This creates, analogous to the folding areas 40 and/or the overlapping areas 36, a thickening of the soldering foil 10 perpendicular to the diameter of the soldering foil 10, which can be helpful when later evacuating the workpieces to be soldered.

The 9 shows a one-piece elongated production mold 30 with alternative folding areas 40 and a first open end 32 and a second open end 34. The one-piece elongated production mold 30 of 9 has three ring segments, as does the one-piece elongated production mold 30 of the 5 . In contrast to 5 has the one-piece elongated production mold 30 9 alternative folding areas 40. A folding edge 41 is shown as an example to illustrate where the folding must be carried out in order to obtain from the one-piece elongated production mold 30 9 to the annular processing mold 20 of 10 to get. The overlapping areas 36 of the first open end 32 and the second open end 34 can be connected again by the above-mentioned connections and/or connection methods.

The 10 shows an annular processing mold 20 produced by folding the one-piece elongated production mold 30 from FIG 9 . Overlapping areas 36 of the first open end 32 and the second open end 34 lie one above the other and can be connected to one another. The folding areas 40 of the one-piece elongated production mold 30 are marked.

The 11 shows a one-piece elongated production mold 30 with a further alternative folding area 40, a folding edge 42, and a first open end 32 with an overlapping area 36 and a second open end 34 with an overlapping area 36.

The 12 shows an example of a section through the folded edge 42 11 . Perforations, holes, folds, embossings and/or geometric designs 44 are arranged along the fold edge, here on both sides. A one-sided arrangement of the perforations, holes, folds, embossing and/or geometric designs 44 to simplify folding is also possible, but not shown here.

The 13 shows a variant of a closed, one-piece, elongated production mold 30' which has no open ends. The closed, one-piece, elongated production mold 30' shown here has four folding areas 40. The closed, one-piece, elongated production mold 30 'here has two inward-facing ring segments 31 with adjacent folding areas 40, which enable these inward-facing ring segments 31 to be folded outwards and thus the annular processing mold 20 14 form.

The 14 shows an annular processing mold 20 formed from the closed one-piece elongated production mold 30' by folding in the folding areas 40. In this form, the ring segments 31 no longer point inwards, but rather form part of the ring of the annular processing mold 20.

List of reference symbols:

5

vacuum interrupter;

10

solder foil;

12

Ring segment of a solder foil ring;

14

Overlap area of the ring segments 12 of a solder foil ring;

15

foil tape;

17

width of the foil tape 15;

20

form of processing;

25

ring diameter;

30

one-piece elongated production form;

30'

closed one-piece elongated production form;

31

Ring segments of the closed one-piece elongated production mold 30` or the processing mold 20;

32

first open end of a one-piece elongated production mold 30;

34

second open end of a one-piece elongated production mold 30;

36

overlapping areas or areas of overlap of a one-piece elongated production mold 30;

35

width of the one-piece elongated production mold 30;

40

Folding areas of the one-piece elongated production mold 30, 30';

41

Folding edge of the one-piece elongated production mold 30;

42

Folding edge of the one-piece elongated production mold 30;

44

Perforation, punching, folding, embossing or geometric design of the one-piece elongated production form 30;

46

punchings.

Claims (14)

Solder foil (10) for vacuum interrupters (5) with an annular processing mold (20), with a ring diameter (25), characterized in that the annular processing mold (20) is formed from a one-piece elongated production mold (30, 30`) by folding. solder foil (10). Claim 1 , characterized in that the annular processing mold (20) is formed by folding a one-piece, elongated production mold (30) detached from a film strip (15). solder foil (10). Claim 1 or 2 , characterized in that the ring diameter (25) of the solder foil (10) in the processing form (20) is larger than the width of a foil strip (15) from which the solder foil (10) is detached. Solder foil (10) according to one of the preceding claims, characterized in that the ring diameter (25) of the annular processing mold (20) is larger than a width (35) of the one-piece elongated production mold (30). Solder foil (10) according to one of the preceding claims, characterized in that the one-piece elongated production mold (30) has a first open end (32) and a second open end (34). solder foil (10). Claim 5 , characterized in that after folding the one-piece elongated production mold (30) into the annular processing mold (20), the first open end (32) and the second open end (34) at least partially overlap and these overlapping areas (36) are connected . solder foil (10). Claim 6 characterized in that the areas (36) overlapping these are connected in a material or non-positive manner. Solder foil (10) according to one of the Claims 1 until 4 , characterized in that the one-piece elongated production mold (30) forms a closed curved path. Solder foil (10) according to one of the Claims 1 until 8th , characterized in that the one-piece elongated production mold (30) is structured in areas of folds and/or overlapping areas (36) in such a way that the folded areas and/or the overlapping areas (36) are not thicker than non-folded areas and/ or non-overlapping areas. Solder foil (10) according to one of the Claims 1 until 8th , characterized in that the one-piece elongated production mold (30) is designed in areas of folds and / or overlapping areas (36) such that the folded areas and / or the overlapping areas (36) are thicker than non-folded areas and / or non-overlapping areas. Using a soldering foil (10). Claim 10 , characterized in that solder foil (10) is placed between structures of a vacuum interrupter (5) to be soldered, the vacuum interrupter is placed in a vacuum oven, the vacuum oven is evacuated, and gas from the vacuum interrupter through gaps through the unfolded areas and / or non-overlapping areas are formed when evacuating the vacuum oven. Method for producing a vacuum interrupter (5) characterized in that a solder foil (10) according to one of the Claims 1 until 10 is placed between structures of a vacuum interrupter (5) to be soldered. Method for producing a solder foil (10) for vacuum interrupters (5), characterized in that a one-piece elongated production mold (30) is converted into an annular processing mold (20) by folding. Method for producing a solder foil (10). Claim 13 , characterized in that the one-piece elongated production mold (30) is removed from a film strip (15), the film strip having a width that is smaller than a ring diameter (25) of the annular processing mold (20).

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