DE102020201665A1 - Mold device - Google Patents
Mold device Download PDFInfo
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- DE102020201665A1 DE102020201665A1 DE102020201665.8A DE102020201665A DE102020201665A1 DE 102020201665 A1 DE102020201665 A1 DE 102020201665A1 DE 102020201665 A DE102020201665 A DE 102020201665A DE 102020201665 A1 DE102020201665 A1 DE 102020201665A1
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- Prior art keywords
- pressure
- molding
- subchamber
- low
- molding device
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- 238000000465 moulding Methods 0.000 claims abstract description 102
- 150000001875 compounds Chemical class 0.000 claims abstract description 25
- 238000002347 injection Methods 0.000 claims abstract description 19
- 239000007924 injection Substances 0.000 claims abstract description 19
- 230000000903 blocking effect Effects 0.000 claims description 24
- 238000005192 partition Methods 0.000 claims description 21
- 230000008878 coupling Effects 0.000 claims description 12
- 238000010168 coupling process Methods 0.000 claims description 12
- 238000005859 coupling reaction Methods 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 239000003990 capacitor Substances 0.000 description 6
- 239000013078 crystal Substances 0.000 description 6
- 238000003825 pressing Methods 0.000 description 6
- 239000010453 quartz Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000001746 injection moulding Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000001721 transfer moulding Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000013519 translation Methods 0.000 description 2
- 239000000969 carrier Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0046—Details relating to the filling pattern or flow paths or flow characteristics of moulding material in the mould cavity
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
- B29C45/1468—Plants therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2701—Details not specific to hot or cold runner channels
- B29C45/2703—Means for controlling the runner flow, e.g. runner switches, adjustable runners or gates
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
- B29C45/77—Measuring, controlling or regulating of velocity or pressure of moulding material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0046—Details relating to the filling pattern or flow paths or flow characteristics of moulding material in the mould cavity
- B29C2045/0049—Details relating to the filling pattern or flow paths or flow characteristics of moulding material in the mould cavity the injected material flowing against a mould cavity protruding part
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0046—Details relating to the filling pattern or flow paths or flow characteristics of moulding material in the mould cavity
- B29C2045/0051—Flow adjustment by throttles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
- B29C2045/14163—Positioning or centering articles in the mould using springs being part of the positioning means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
- B29C2045/14672—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame moulding with different depths of the upper and lower mould cavity
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2701—Details not specific to hot or cold runner channels
- B29C2045/2722—Nozzles or runner channels provided with a pressure sensor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C2045/279—Controlling the flow of material of two or more nozzles or gates to a single mould cavity
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Die Erfindung betrifft eine Mold-Vorrichtung. Die Mold-Vorrichtung weist wenigstens zwei Werkzeugteile auf. Die Werkzeugteile umschließen gemeinsam einen Hohlraum, in dem ein Schaltungsträger mit darauf angeordneten elektronischen Bauelementen ummoldet werden kann. Ein Werkzeugteil der Werkzeugteile weist einen Trennsteg auf, welcher angeordnet und ausgebildet ist, auf den Schaltungsträger aufzusetzen und den Hohlraum zwischen dem Schaltungsträger und dem Werkzeugteil in wenigstens zwei oder nur zwei Teilräume, nämlich wenigstens einen Niederdruckteilraum und wenigstens einen Hochdruckteilraum, aufzuteilen. Die Mold-Vorrichtung ist bevorzugt weiter ausgebildet, den wenigstens einen Hochdruckteilraum mit Mold-Masse zu befüllen, und den wenigstens einen Niederdruckteilraum mit einem kleineren Einfülldruck mit Mold-Masse zu befüllen, als den Hochdruckteilraum. Die Mold-Vorrichtung weist bevorzugt eine Einschussöffnung für den Niederdruckteilraum auf, und eine Einschussöffnung für den Hochdruckteilraum. Die Mold-Vorrichtung weist bevorzugt im Bereich der Einschussöffnung für den Niederdruckteilraum ein Sperrventil auf und ist ausgebildet, das Sperrventil in Abhängigkeit eines vorbestimmten Mold-Druckes, insbesondere eines Einschussdruckes, für die Mold-Masse zu verschließen.The invention relates to a molding device. The mold device has at least two tool parts. The tool parts together enclose a cavity in which a circuit carrier with electronic components arranged thereon can be molded. A tool part of the tool parts has a separating web which is arranged and designed to be placed on the circuit carrier and to divide the cavity between the circuit carrier and the tool part into at least two or only two sub-chambers, namely at least one low-pressure sub-chamber and at least one high-pressure sub-chamber. The molding device is preferably further designed to fill the at least one high-pressure subchamber with molding compound and to fill the at least one low-pressure subchamber with molding compound with a lower filling pressure than the high-pressure subchamber. The molding device preferably has a shot opening for the low-pressure subchamber, and a shot opening for the high pressure subchamber. The molding device preferably has a shut-off valve in the area of the injection opening for the low-pressure subchamber and is designed to close the shut-off valve as a function of a predetermined molding pressure, in particular an injection pressure, for the molding compound.
Description
Stand der TechnikState of the art
Die Erfindung betrifft eine Mold-Vorrichtung zum Erzeugen eines Mold-Moduls.The invention relates to a mold device for producing a mold module.
Offenbarung der ErfindungDisclosure of the invention
Die Mold-Vorrichtung weist wenigstens zwei Werkzeugteile, insbesondere Werkzeughälften auf. Die Werkzeugteile umschließen gemeinsam einen Hohlraum, in dem ein Schaltungsträger mit darauf angeordneten elektronischen Bauelementen ummoldet werden kann.The molding device has at least two tool parts, in particular tool halves. The tool parts together enclose a cavity in which a circuit carrier with electronic components arranged thereon can be molded.
Ein Werkzeugteil der Werkzeugteile weist einen Trennsteg auf, welcher angeordnet und ausgebildet ist, auf den Schaltungsträger aufzusetzen und den Hohlraum zwischen dem Schaltungsträger und dem Werkzeugteil in wenigstens zwei oder nur zwei Teilräume, nämlich wenigstens einen Niederdruckteilraum und wenigstens einen Hochdruckteilraum, aufzuteilen. Die Mold-Vorrichtung ist bevorzugt weiter ausgebildet, den wenigstens einen Hochdruckteilraum mit Mold-Masse zu befüllen, und den wenigstens einen Niederdruckteilraum mit einem kleineren Einfülldruck mit Mold-Masse zu befüllen, als den Hochdruckteilraum. Die Mold-Vorrichtung weist bevorzugt eine Einschussöffnung für den Niederdruckteilraum auf, und eine Einschussöffnung für den Hochdruckteilraum. Die Mold-Vorrichtung weist bevorzugt im Bereich der Einschussöffnung für den Niederdruckteilraum ein Sperrventil auf und ist ausgebildet, das Sperrventil in Abhängigkeit eines vorbestimmten Mold-Druckes, insbesondere eines Einschussdruckes, für die Mold-Masse zu verschließen. So kann der Niederdruckteilraum vorteilhaft für einen Mold-Druck größer als der vorbestimmte Molddruck verschlossen sein. Vorteilhaft kann so der Niederdruckteilraum von einer Druckvorrichtung, welche ausgebildet ist, die Mold-Masse in dem Hohlraum unter Druck zu setzen, getrennt werden. Der Druck wirkt dann nach der Trennung nur noch auf den Hochdruckteilraum. Die Mold-Vorrichtung ist bevorzugt dazu ausgebildet, den Mold-Druck für den Hochdruckteilraum nach dem Verschließen oder Abtrennen des Niederdruckteilraums von dem Drucksystem weiter zu steigern, insbesondere bis zu 200 Bar. Vorteilhaft können so in dem Niederdruckteilraum ummoldete elektronische druckempfindliche Bauelemente, beispielsweise Elektrolytkondensatoren, Schwingquarze oder Sensoren, nicht durch den hohen Druck beim Molden zerstört werden.A tool part of the tool parts has a separating web which is arranged and designed to be placed on the circuit carrier and to divide the cavity between the circuit carrier and the tool part into at least two or only two sub-chambers, namely at least one low-pressure sub-chamber and at least one high-pressure sub-chamber. The molding device is preferably further designed to fill the at least one high-pressure subchamber with molding compound and to fill the at least one low-pressure subchamber with molding compound with a lower filling pressure than the high-pressure subchamber. The molding device preferably has a shot opening for the low-pressure subchamber, and a shot opening for the high pressure subchamber. The molding device preferably has a shut-off valve in the area of the injection opening for the low-pressure subchamber and is designed to close the shut-off valve as a function of a predetermined molding pressure, in particular an injection pressure, for the molding compound. Thus, the low-pressure sub-space can advantageously be closed for a molding pressure greater than the predetermined molding pressure. In this way, the low-pressure subchamber can advantageously be separated from a pressure device which is designed to pressurize the molding compound in the cavity. After the separation, the pressure then only acts on the high-pressure subchamber. The molding device is preferably designed to further increase the mold pressure for the high-pressure subchamber after the low-pressure subchamber has been closed or separated from the pressure system, in particular up to 200 bar. Quartz crystals or sensors cannot be destroyed by the high pressure during molding.
In einer bevorzugten Ausführungsform ist die Mold-Vorrichtung ausgebildet, die Teilräume gleichzeitig mit der Mold-Masse zu befüllen. Vorteilhaft kann so der Mold-Prozess aufwandsgünstig mit nur einem Werkzeug, und weiter bevorzugt mit nur einem Druckzylinder, auch Plunger genannt, zu befüllen.In a preferred embodiment, the molding device is designed to fill the subspaces with the molding compound at the same time. The molding process can thus advantageously be filled with only one tool, and more preferably with only one pressure cylinder, also called a plunger, at low cost.
In einer bevorzugten Ausführungsform ist die Mold-Vorrichtung ausgebildet, den Hochdruckteilraum mit einem Einfülldruck zwischen 50 und 200 Bar, bevorzugt zwischen 80 und 150 Bar, besonders bevorzugt 100 Bar mit Mold-Masse zu füllen. Die Mold-Vorrichtung ist bevorzugt ausgebildet, den Niederdruckteilraum mit einem Einfülldruck von weniger oder gleich 20 Bar mit Mold-Masse zu füllen. Die Mold-Vorrichtung kann dazu vorteilhaft ausgebildet sein, den Einfülldruck für beide Teilräume mittels eines Druckkolbens allmählich zu steigern, bis der Einfülldruck
Die Mold-Vorrichtung ist bevorzugt weiter ausgebildet, in Abhängigkeit des Einfülldruckes, insbesondere bei Erreichen des Einfülldruckes von 20 Bar, den Niederdruckteilraum von dem Druckzylinder abzukoppeln, und dazu den Niederdruckteilraum, insbesondere eine Einfüllöffnung, zu verschließen. Die Mold-Vorrichtung weist dazu bevorzugt ein Ventil auf. Die Mold-Vorrichtung ist bevorzugt weiter ausgebildet, nach einem Verschließen des Niederdruckteilraums den Prozessdruck für den Hochdruckteilraum weiter bis zu einem vorbestimmten Druckwert, insbesondere zwischen 50 und 200 Bar, bevorzugt zwischen 80 und 150 Bar, weiter bevorzugt 100 Bar zu steigern und dort zu halten.The molding device is preferably further designed, depending on the filling pressure, in particular when the filling pressure of 20 bar is reached, to decouple the low-pressure subchamber from the pressure cylinder and to close the low-pressure subchamber, in particular a filler opening. For this purpose, the mold device preferably has a valve. The molding device is preferably further designed to increase the process pressure for the high pressure subchamber further up to a predetermined pressure value, in particular between 50 and 200 bar, preferably between 80 and 150 bar, more preferably 100 bar, and to keep it there after the low pressure subchamber has been closed .
In einer bevorzugten Ausführungsform ist der Trennsteg entlang einer Bewegungsachse verschiebbar gelagert. Weiter bevorzugt ist der Trennsteg federnd gelagert. Dazu kann der Trennsteg bevorzugt mittels einer Feder gegen das Werkzeugteil abstützen. Vorteilhaft kann die Mold-Vorrichtung so Schaltungsträger mit zueinander verschiedenen Dickenerstreckungen ummolden. Der Trennsteg kann dadurch beim Aufsetzen auf den Schaltungsträger federnd nachgeben, wenn die Mold-Vorrichtung, insbesondere die Werkzeugteile, miteinander verschlossen werden.In a preferred embodiment, the separating web is mounted displaceably along an axis of movement. More preferably, the separating web is resiliently mounted. For this purpose, the separating web can preferably support against the tool part by means of a spring. In this way, the molding device can advantageously encapsulate circuit carriers with mutually different thicknesses. The separating web can thus yield resiliently when it is placed on the circuit carrier when the molding device, in particular the tool parts, are closed with one another.
In einer bevorzugten Ausführungsform ist das Sperrventil ausgebildet, den Einschusskanal oder die Einschussöffnung oder einen Einschusskanal zu dem Niederdruckteilraum hin in Abhängigkeit eines auf das Sperrventil wirkenden Mold-Druckes zu verschließen. Vorteilhaft kann das Sperrventil so mechanisch, insbesondere ohne weitere elektrische, das Sperrventil bewegende Komponenten, durch Druckbeaufschlagung auf das Ventil selbst verschlossen werden.In a preferred embodiment, the shut-off valve is designed to close the shot channel or the shot opening or a shot channel towards the low-pressure subchamber as a function of a mold pressure acting on the shut-off valve. The shut-off valve can thus advantageously be closed mechanically, in particular without further electrical components moving the shut-off valve, by applying pressure to the valve itself.
In einer bevorzugten Ausführungsform ist das Sperrventil durch eine schwenkbar und bevorzugt federnd gelagerte Tür gebildet. Die Tür ist im Bereich der Einschussöffnung des Niederdruckteilraums angeordnet und ausgebildet, in Abhängigkeit von dem auf die Tür wirkenden Mold-Druck, insbesondere bei Überschreiten eines vorbestimmten Mold-Druckes, die Einschussöffnung zu verschließen. Vorteilhaft kann das Sperrventil so aufwandsgünstig und mechanisch einfach durch eine schwenkbare Tür oder Klappe bereitgestellt sein.In a preferred embodiment, the shut-off valve is formed by a pivotable and preferably resiliently mounted door. The door is arranged and designed in the area of the entry opening of the low-pressure subchamber, depending on the Mold pressure acting on the door, in particular when a predetermined mold pressure is exceeded, to close the entry opening. Advantageously, the shut-off valve can thus be provided inexpensively and mechanically in a simple manner by means of a pivotable door or flap.
In einer bevorzugten Ausführungsform ist das Sperrventil durch ein quer zu der Einschussöffnung, oder Einschussleitung, angeordnetes Sperr-Schott gebildet. Die Mold-Vorrichtung ist bevorzugt ausgebildet, das Sperr-Schott in Abhängigkeit des Mold-Druckes, insbesondere bei Überschreiten eines vorbestimmten Mold-Druckes, in den Einschusskanal oder vor die Einschussöffnung zu bewegen, und den Einschusskanal beziehungsweise die Einschussöffnung zu verschließen. Die Mold-Vorrichtung weist dazu bevorzugt einen Drucksensor auf, welcher ausgebildet ist, den Mold-Druck im Bereich des Druckkolbens, oder im Bereich des Niederdruckteilraumes zu erfassen, und ein Steuersignal zum Verschließen des Sperr-Schott zu erzeugen. Die Mold-Vorrichtung ist ausgebildet, in Abhängigkeit des Steuersignals das Sperr-Schott zu bewegen und so die Einschussöffnung zu verschließen.In a preferred embodiment, the shut-off valve is formed by a shut-off bulkhead arranged transversely to the shot opening or shot line. The molding device is preferably designed to move the blocking bulkhead as a function of the molding pressure, in particular when a predetermined molding pressure is exceeded, into the injection channel or in front of the injection opening, and to close the injection channel or the injection opening. For this purpose, the molding device preferably has a pressure sensor which is designed to detect the molding pressure in the area of the pressure piston or in the area of the low-pressure subchamber and to generate a control signal for closing the blocking bulkhead. The molding device is designed to move the blocking bulkhead as a function of the control signal and thus to close the entry opening.
In einer bevorzugten Ausführungsform weist die Mold-Vorrichtung einen Elektroantrieb auf, welcher mit dem Sperr-Schott wirkverbunden und ausgebildet ist, das Sperr-Schott in Abhängigkeit eines empfangenen Sperrsignals zu bewegen, insbesondere zu schließen. Vorteilhaft kann das Sperr-Schott so sicher vor die Einschussöffnung bewegt werden.In a preferred embodiment, the molding device has an electric drive which is operatively connected to the blocking bulkhead and is designed to move the blocking bulkhead, in particular to close it, as a function of a received blocking signal. The blocking bulkhead can thus advantageously be moved safely in front of the entry opening.
In einer bevorzugten Ausführungsform weist die Mold-Vorrichtung eine Koppelvorrichtung auf. Die Koppelvorrichtung ist mit einem den Mold-Druck erzeugenden Presskolben der Mold-Vorrichtung, und mit dem Sperr-Schott wirkverbunden. Die Koppelvorrichtung ist ausgebildet, eine Bewegung des Presskolbens auf das Sperr-Schott zu übertragen, und das Sperr-Schott so zu schließen. Vorteilhaft kann das Sperr-Schott so mechanisch gesteuert durch den Druckkolben, oder eine Druckkolbenbewegung, mechanisch verschlossen werden.In a preferred embodiment, the molding device has a coupling device. The coupling device is operatively connected to a plunger of the molding device that generates the mold pressure, and to the blocking bulkhead. The coupling device is designed to transmit a movement of the plunger to the blocking bulkhead and thus to close the blocking bulkhead. The blocking bulkhead can advantageously be mechanically closed in this way, controlled mechanically by the pressure piston or a pressure piston movement.
Die Erfindung betrifft auch ein Verfahren zum Erzeugen eines Mold-Moduls. Bei dem Verfahren werden in einem Mold-Werkzeug zueinander verschiedene Teilräume mit Mold-Masse gefüllt. Bei dem Verfahren werden weiter ein Niederdruckteilraum mit einem kleineren Mold-Druck mit Mold-Masse befüllt, als ein dazu benachbarter Hochdruckteilraum. Die Teilräume sind bevorzugt mittels einer insbesondere federnd und beweglich gelagerten Trennwand voneinander getrennt. Die Teilräume werden bevorzugt gleichzeitig mit Mold-Masse befüllt, wobei der Mold-Druck auf beide Teilräume wirkt, und in Abhängigkeit eines vorbestimmten Mold-Drucks der Niederdruckteilraum im Bereich einer Einschussöffnung verschlossen wird, sodass der Mold-Druck weiterhin nur noch auf den Hochdruckteilraum wirken kann.The invention also relates to a method for producing a mold module. In the method, different partial spaces are filled with molding compound in a mold tool. In the method, a low-pressure subchamber is also filled with molding compound with a lower mold pressure than a high-pressure subchamber adjacent to it. The sub-spaces are preferably separated from one another by means of an in particular resiliently and movably mounted partition. The subspaces are preferably filled with molding compound at the same time, the mold pressure acting on both subspaces, and depending on a predetermined mold pressure, the low pressure subchamber is closed in the area of an injection opening, so that the mold pressure continues to only act on the high pressure subchamber can.
In einer bevorzugten Ausführungsform werden die Teilräume vor dem Einfüllen der Mold-Masse durch Bewegen, insbesondere Schwenkbewegen oder Translationsbewegen, einer Trennwand in den von dem Mold-Werkzeug umschlossenen Hohlraum gebildet.In a preferred embodiment, the sub-spaces are formed prior to the filling of the molding compound by moving, in particular pivoting or translating, a partition into the cavity enclosed by the molding tool.
Die Moldvorrichtung kann zum Transfermolden oder zum DIM (DIM = Direct-Injection-Molding) ausgebildet sein. Das Moldverfahren kann mittels Transfermolden oder mittels DIM (DIM = Direct-Injection-Molding) durchgeführt werden.The molding device can be designed for transfer molding or for DIM (DIM = direct injection molding). The molding process can be carried out using transfer molding or using DIM (DIM = Direct Injection Molding).
Die Erfindung wird nun im Folgenden anhand von Figuren und weiteren Ausführungsbeispielen erläutert. Weitere vorteilhafte Ausführungsvarianten ergeben sich aus einer Kombination der in den Figuren und abhängigen Ansprüchen beschriebenen Merkmale.
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1 zeigt ein Ausführungsbeispiel für eine Mold-Vorrichtung, bei der ein vom Moldwerkzeug umschlossener Teilraum von einem Sperrventil druckabhängig verschlossen werden kann; -
2 zeigt ein Ausführungsbeispiel für einen Druckverlauf beim Molden mit zwei Teilräumen, wobei ein Niederdruckteilraum der Teilräume druckabhängig bei Überschreiten eines vorbestimmten Molddruckes verschlossen wird; -
3 zeigt ein Ausführungsbeispiel für eine Mold-Vorrichtung, bei der ein vom Moldwerkzeug umschlossener Teilraum von einem Sperrventil druckabhängig verschlossen werden kann, wobei das Sperrventil druckabhängig und elektrisch gesteuert verschlossen werden kann.
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1 shows an exemplary embodiment of a molding device in which a sub-space enclosed by the molding tool can be closed by a shut-off valve as a function of pressure; -
2 shows an exemplary embodiment for a pressure curve during molding with two sub-spaces, a low-pressure sub-space of the sub-spaces being closed as a function of pressure when a predetermined molding pressure is exceeded; -
3 shows an exemplary embodiment of a molding device in which a partial space enclosed by the molding tool can be closed by a shut-off valve as a function of pressure, wherein the shut-off valve can be closed as a function of pressure and in an electrically controlled manner.
Das Werkzeugteil
Die Mold-Vorrichtung
Die Schwenkklappe
Sowohl die Einschussöffnung
Die Moldvorrichtung
Während eines daran anschließenden Zeitintervalls
Beim Erreichen des vorbestimmten Druckwertes, in diesem Ausführungsbeispiel
Der Niederdruckteilraum
Die Mold-Vorrichtung
Die Mold-Vorrichtung
Die Mold-Vorrichtung
Zum Erzeugen eines Mold-Moduls kann der Schaltungsträger
Der Presskolben
Das kraftbegrenzende Federelement
In einer anderen Ausführungsform weist die Mold-Vorrichtung
Die Verarbeitungseinheit
Die Mold-Vorrichtung
Claims (10)
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DE102020201665.8A DE102020201665A1 (en) | 2020-02-11 | 2020-02-11 | Mold device |
JP2022548715A JP7441322B2 (en) | 2020-02-11 | 2021-01-20 | molding equipment |
CN202180014211.9A CN115104180A (en) | 2020-02-11 | 2021-01-20 | Molding device |
PCT/EP2021/051190 WO2021160391A1 (en) | 2020-02-11 | 2021-01-20 | Mould device |
KR1020227030490A KR20220140545A (en) | 2020-02-11 | 2021-01-20 | mold device |
EP21701297.0A EP4104204A1 (en) | 2020-02-11 | 2021-01-20 | Mould device |
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DE102009053549A1 (en) | 2009-11-18 | 2011-05-19 | Deutsches Zentrum für Luft- und Raumfahrt e.V. | Process for producing a fiber composite component |
DE102018100576A1 (en) | 2018-01-11 | 2019-07-11 | QIN-Form GmbH & Co. KG | Method for producing a molded part with a visible surface with different surface areas |
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DE102010063048A1 (en) * | 2010-12-14 | 2012-06-21 | Robert Bosch Gmbh | Method for producing an electronic assembly with molded bodies |
DE102011004381A1 (en) * | 2011-02-18 | 2012-08-23 | Robert Bosch Gmbh | Mold module with sensor element |
US9484228B2 (en) * | 2014-10-01 | 2016-11-01 | Apple Inc. | Simultaneous independently controlled dual side PCB molding technique |
NL2013978B1 (en) * | 2014-12-15 | 2016-10-11 | Besi Netherlands Bv | Device and method for controlled moulding and degating of a carrier with electronic components and moulded product. |
JP6907044B2 (en) * | 2017-06-19 | 2021-07-21 | アピックヤマダ株式会社 | Resin molding device and resin molding method |
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DE102009053549A1 (en) | 2009-11-18 | 2011-05-19 | Deutsches Zentrum für Luft- und Raumfahrt e.V. | Process for producing a fiber composite component |
DE102018100576A1 (en) | 2018-01-11 | 2019-07-11 | QIN-Form GmbH & Co. KG | Method for producing a molded part with a visible surface with different surface areas |
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