DE102020130750A1 - Printed circuit board assembly, method of manufacturing a printed circuit board assembly and control unit - Google Patents

Abstract

Printed circuit board arrangement (100, 200, 300, 400, 500, 600, 702) for an electronic circuit, the printed circuit board arrangement (100, 200, 300, 400, 500, 600, 702) having at least one first printed circuit board (102, 202, 302, 402, 502) with at least one electrically conductive first contact point (106) on a first contact area (108) of the at least one first printed circuit board (102, 202, 302, 402, 502) and at least one second printed circuit board (104, 204 , 304, 404, 504) with at least one electrically conductive second contact point (110) on a second contact surface (112) of the at least one second printed circuit board (104, 204, 304, 404, 504), the at least one electrically conductive first contact point (106) of the at least one first printed circuit board (102, 202, 302, 402, 502) and the at least one electrically conductive second contact point (110) of the at least one second printed circuit board (104, 204, 304, 404, 504) are electrically conductively connected , and wherein the at least one first ladder board (102, 202, 302, 402, 502) and the at least one second printed circuit board (104, 204, 304, 404, 504) via a connection (118, 212, 316, 410, 506), such as an adhesive connection (118, 212 , 316, 410, 506) and/or Velcro connection (118, 212, 316, 410, 506) and/or fusion connection and/or solder connection and/or press connection, and control unit (700) with such a printed circuit board arrangement ( 100, 200, 300, 400, 500, 600, 702) and methods for producing such a circuit board assembly (100, 200, 300, 400, 500, 600, 702).

Description

The invention relates to a printed circuit board arrangement for an electronic circuit, which has at least two printed circuit boards which are electrically conductively connected to one another. The invention also relates to a method for producing a printed circuit board arrangement. Furthermore, the invention relates to a control device with a printed circuit board arrangement.

Electronic controls or the electronics of an electrical device, such as an automotive controller, may be implemented on one or more individual circuit boards. Depending on the space available and/or the complexity of the electronic circuit to be implemented, it may be necessary to reduce the geometry of a printed circuit board. By reducing the board size, it may be necessary to increase the number of individual circuit boards so that the electronic circuitry can be implemented. The electronic circuit then has to be divided up and distributed to the individual printed circuit boards. For the correct function of the electronic circuit, the individual printed circuit boards are connected to one another in an electrically conductive manner. The individual printed circuit boards are usually electrically connected by means of plug connectors, for example board-to-board plug connectors, flexible lines, foil connectors, flexible circuit boards or the like. During assembly by hand or by machine, the printed circuit boards are then connected to one another, in particular plugged in. In addition, it may be necessary to cool the electronics. This is typically done with heat sinks that are connected to the electronics using thermally conductive materials.

The use of connectors, flex lines or the like is very expensive and labor intensive. In addition, the introduction of connectors inevitably leads to additional space being required. The connectors can also only be attached to the printed circuit board where the wiring harness can be installed or the printed circuit boards can be plugged together without complications. Furthermore, when using connectors, flexible cables or the like between the printed circuit boards, there is a risk of an impermissible influence in the area of electromagnetic compatibility (EMC) and damage to the signal integrity. Both can lead to a failure of the electrical component or result in the failure of an EMC test. The efficiency of thermally connected heat sinks is also often unsatisfactory. The greater the thermal power to be dissipated, the larger the heat sink will usually be. The use of bulky heat sinks leads to a large space requirement and high costs.

From the document DE 199 12 519 A1 For example, a printed circuit board arrangement is known which has two printed circuit boards which are electrically connected to one another by a plurality of flexible, separate, metallic connecting elements and are aligned in different planes.

From the document EP 1 160 921 A2 discloses a connector for connecting electrical lines to a printed circuit board, which has a housing that can be fastened to the printed circuit board and a slide-in element that can be inserted into the housing.

From the document EP 2 709 212 A1 discloses an arrangement for connecting printed circuit boards by means of a plug-in connection, which has a tab receptacle attached to a first printed circuit board and a contact blade that can be pushed into the tab receptacle and is provided on a second printed circuit board.

From the document DE 10 2017 126 724 A1 a method for connecting a first component to a second component is known, in which a multiplicity of nanowires is provided on a first contact area of the first component, the first component and the second component are brought together so that the multiplicity of nanowires are connected to a second contact area of the second component is brought into contact and at least the second contact surface is heated to a temperature of at least 150°C.

From the document DE 102 49 436 A1 a heat sink for cooling a power component on a circuit board is known, which is formed from heat-conducting material and has a plurality of cooling fins, the heat sink being able to be placed on the circuit board fitted with the power component.

The object of the invention is to structurally and/or functionally improve a printed circuit board arrangement as mentioned at the outset. The invention is also based on the object of improving the structure and/or functionality of a control unit mentioned at the outset. In addition, the invention is based on the object of functionally improving a method for producing a printed circuit board arrangement as mentioned at the outset.

In particular, the invention is based on the object of designing a printed circuit board arrangement for an electronic circuit to be more compact and more robust against EMC interference and damage to the signal integrity. A further object of the invention is to significantly increase the efficiency of cooling the electronics.

The task is solved with a circuit board arrangement with the features of claim 1. The task is also solved with a control unit with the features of claim 14. The task is also solved with a method with the features of claim 15. Advantageous embodiments and/or or developments are the subject of the dependent claims.

A printed circuit board arrangement can serve or be provided for an electronic circuit, in particular a single electronic circuit. The printed circuit board arrangement can serve or be provided for a number of electronic circuits.

The printed circuit board arrangement can have at least one first printed circuit board. The at least one first printed circuit board can have at least one electrically conductive first contact point. The at least one first printed circuit board can have several, such as two, three, four, etc., electrically conductive first contact points. The plurality of electrically conductive first contact points can be arranged separately and/or at a distance from one another. The at least one first printed circuit board can have at least one first contact surface. The at least one first printed circuit board can have several, such as two, three, four, etc., first contact surfaces. The at least one electrically conductive first contact point of the at least one first printed circuit board can be arranged or provided on the first contact area of the at least one first printed circuit board.

The printed circuit board arrangement can have at least one second printed circuit board. The at least one second printed circuit board can have at least one electrically conductive second contact point. The at least one second printed circuit board can have several, such as two, three, four, etc., electrically conductive second contact points. The plurality of electrically conductive second contact points can be arranged separately and/or at a distance from one another. The at least one second printed circuit board can have at least one second contact surface. The at least one second printed circuit board can have several, such as two, three, four, etc., second contact areas. The at least one electrically conductive second contact point of the at least one second printed circuit board can be arranged or provided on the second contact area of the at least one second printed circuit board.

The printed circuit board arrangement can have several, such as two, three, four, etc., first and/or second printed circuit boards. The first and second circuit boards or multiple circuit boards may form a stack, such as board stacks or board quads. The circuit board assembly may be a stack, such as board stacks. The at least one first printed circuit board and/or the at least one second printed circuit board and/or the printed circuit board arrangement can be essentially rectangular, square, triangular, round or elliptical or essentially have the shape of a cuboid. The at least one first printed circuit board and/or the at least one second printed circuit board and/or the printed circuit board arrangement can have a geometry that matches the respective application and/or the respective installation space capacities.

The at least one first printed circuit board and/or the at least one second printed circuit board can be a printed circuit board, circuit board, printed circuit board and/or a “printed circuit board” (PCB). The at least one first printed circuit board and/or the at least one second printed circuit board can be rigid and/or flexible. The at least one first printed circuit board and/or the at least one second printed circuit board can be, for example, a printed circuit board foil, in particular made of polyimide, or a ceramic foil. The at least one first printed circuit board and/or the at least one second printed circuit board can be a carrier for electronic components/parts. The at least one first printed circuit board and/or the at least one second printed circuit board can be used for the mechanical and/or electrical connection of electronic components. The at least one first printed circuit board and/or the at least one second printed circuit board can be made of electrically insulating material, eg substrate material, with conductive connections such as conductor tracks adhering thereto. Plastic, in particular fiber-reinforced plastic, can serve as the electrically insulating material. The conductive connections, such as conductor tracks, can be etched from a thin layer of copper. The conductive connections can be isolated from each other. The conductive connections can serve to carry and/or transmit the same or different potentials and/or signals. In addition, a GND connection line or ground connection line, such as mass or earth, can be provided, which can be assigned zero potential. The at least one first printed circuit board and/or the at least one second printed circuit board can have soldering areas, such as soldering pads, and/or soldering eyes. The soldering areas and/or soldering eyes can be arranged or provided on electrically conductive contact points of the at least one first circuit board and/or the at least one second circuit board. Electronic components can be operatively connected, such as soldered, and/or arranged at the pads and/or pads. The soldering surfaces and/or soldering eyes of the at least one first printed circuit board can be arranged on the side facing and/or facing away from the at least one second printed circuit board. The soldering pads and / or pads of the at least one second printed circuit board can on the at least be arranged facing and/or facing away from a first printed circuit board.

The at least one electrically conductive first contact point of the at least one first printed circuit board and the at least one electrically conductive second contact point of the at least one second printed circuit board can be electrically conductively connected.

The at least one first printed circuit board and the at least one second printed circuit board can be connected to one another via a connection. The at least one first printed circuit board and the at least one second printed circuit board can be connected to one another directly, in particular electrically and/or thermally and/or extensively, for example by means of the connection. The at least one electrically conductive first contact point of the at least one first printed circuit board and the at least one electrically conductive second contact point of the at least one second printed circuit board can be connected to one another via the connection. The at least one electrically conductive first contact point of the at least one first printed circuit board and the at least one electrically conductive second contact point of the at least one second printed circuit board can be connected to one another directly, in particular electrically and/or thermally and/or extensively, for example by means of the connection. The at least one first contact surface of the at least one first printed circuit board and the at least one second contact surface of the at least one second printed circuit board can be connected to one another via the connection. The at least one first contact surface of the at least one first printed circuit board and the at least one second contact surface of the at least one second printed circuit board can be connected to one another directly, in particular electrically and/or thermally and/or extensively, for example by means of the connection.

The connection can be an adhesive connection. The connection can be a Velcro connection. The connection may be a fusion connection. The connection can be a solder connection. The connection can be a press connection. The connection can have one or more of the group adhesive connection, Velcro connection, fusion connection, solder connection and press connection.

The connection can be electrically and/or thermally conductive. The thermal and/or electrical conductivity of the connection can be greater than the thermal and/or electrical conductivity of the material or substrate material of the at least one first printed circuit board and/or the at least one second printed circuit board.

The adhesive connection may include or be formed from an adhesive, glue and/or adhesive material. The adhesive material may include the glue and/or glue. The glue, adhesive and/or adhesive material may comprise a plastic material, for example a polymer, and/or a conductive material, for example particles such as metal particles. The conductive material can be a conductive micro- or nano-material, for example micro- or nano-wires, multi-layered micro- or nano-structures or micro- or nano-tubes. The adhesive, adhesive and/or adhesive material may be or include a conductive plastic material.

The Velcro connection can have Velcro structures. The Velcro structures can be electrically and/or thermally conductive. The Velcro connection and/or the Velcro structures can have an electrically conductive surface. The Velcro structures can be hooked together to form the Velcro connection. The Velcro structures can, for example, have flexible fibers or wires, such as plastic fibers or metal wires. The fibers can be made of an electrically conductive material or of an electrically insulating material whose surface is metallized or coated with a metal. The Velcro connection and/or the Velcro structures can be or will be effectively connected, for example electrically, to the at least one first printed circuit board and/or the at least one second printed circuit board. The Velcro connection and/or the Velcro structures can be effectively, for example electrically, connected to the at least one electrically conductive first contact point of the at least one first circuit board and/or to the at least one electrically conductive second contact point of the at least one second circuit board. The Velcro connection and/or the Velcro structures can be effectively connected, for example electrically, to the at least one first contact surface of the at least one first circuit board and/or to the at least one second contact surface of the at least one second circuit board. The printed circuit boards to be connected can be guided to one another or to one another, in particular at the points of the Velcro structures, so that a Velcro connection is formed between the printed circuit boards.

The Velcro connection can have or be a nanoconnection, such as a nanowire connection. The nanowire connection may include or be formed by a plurality of nanowires. A nanowire can have a wire-like shape and/or a size in the range from a few nanometers to a few micrometers. A nanowire can be substantially angular, polygonal (such as triangular, quadrangular, or have a hexagonal), circular or oval base or be designed in this way in cross section. Additionally or alternatively, microwires can be provided. Analogously to a nanowire, a microwire can be understood to mean a body that has a wire-like shape and/or a size in the range from a few micrometers to a few millimeters. The microwires can essentially be formed like the nanowires and/or can be or will be arranged accordingly.

The nanowires can all be made of the same material. The nanowire connection can be electrically and/or thermally conductive. The nanowires can be formed from an electrically and/or thermally conductive material such as metal. For example, the nanowires can be formed from copper. The nanowire connection can be or become operatively, for example electrically, connected to the at least one first circuit board and/or the at least one second circuit board. The nanowire connection can be effectively, for example electrically, connected to the at least one electrically conductive first contact point of the at least one first circuit board and/or to the at least one electrically conductive second contact point of the at least one second circuit board. The nanowire connection can be effectively, for example electrically, connected to the at least one first contact surface of the at least one first printed circuit board and/or to the at least one second contact surface of the at least one second printed circuit board.

A plurality of nanowires may be attached to the at least one first circuit board and/or to the at least one second circuit board. A multiplicity of nanowires can be attached to the at least one electrically conductive first contact point of the at least one first circuit board and/or to the at least one electrically conductive second contact point of the at least one second circuit board. A large number of nanowires can be attached to the at least one first contact area of the at least one first circuit board and/or to the at least one second contact area of the at least one second circuit board. The nanowires can be arranged essentially perpendicularly and/or essentially parallel to one another be arranged. The nanowires may be substantially perpendicular to whatever surface they are attached to. The printed circuit boards to be connected can be guided to one another or to one another, in particular at the points of the nanowires, so that a nanowire connection is formed between the printed circuit boards.

The fusible connection can be a solder connection. The fusible link may be a direct connection of the at least one first circuit board and the at least one second circuit board. The fusible connection can be produced by melting, for example heating. The fusible connection can be produced by melting, for example heating, at least a portion of the at least one first printed circuit board and/or at least a portion of the at least one second printed circuit board. The fusible connection can be achieved by bringing at least one section of the at least one first printed circuit board and at least one section of the at least one second printed circuit board together, such as laying them together and/or laying them flat on top of each other, and melting, such as heating, at least the at least one section of the at least one first printed circuit board and/or of the at least one section of the at least one second printed circuit board can be produced.

The soldered connection can produce a direct connection of the at least one first printed circuit board and the at least one second printed circuit board. The soldered connection can be produced by means of a soldering process. The solder connection may include a solder, such as solder paste. The solder can be a mixture of solder metal powder and flux. The solder can be a soft solder. The solder may include or be lead, tin, zinc, silver and/or copper. The soldered connection can be made by soft soldering, hard soldering, reflow soldering, dip soldering, wave soldering, furnace soldering, resistance soldering, induction soldering, laser soldering or iron soldering.

The press connection can be produced by, in particular direct, pressing together, such as pressing, or by joining, such as joining together. The press connection can be produced by directly pressing one another, such as pressing one another, or by joining at least one section of the at least one first circuit board and at least one section of the at least one second circuit board. The press connection can be a direct connection of the at least one first circuit board and the at least one second circuit board. The press connection can be a press fit. The press connection can be made by a Velcro connection. The press connection can have pins and/or needles and/or can be produced by pins and/or needles. The press connection can be produced by a pin cushion and/or a plurality of needles aligned with one another.

The at least one first printed circuit board and the at least one second printed circuit board can be arranged opposite one another, for example substantially parallel to one another and/or spaced vertically. The at least one first printed circuit board and the at least one second printed circuit board can be arranged so that they overlap one another. The at least one electrically conductive first contact point of the at least one first printed circuit board and the at least one electrically conductive second contact point of the at least one second printed circuit board can be arranged opposite one another, for example essentially parallel to one another and/or spaced vertically. The at least one electrically conductive first contact point of the at least one first printed circuit board and the at least one electrically conductive second contact point of the at least one second printed circuit board can be arranged overlapping one another, for example partially or completely. The first contact surface of the at least one first printed circuit board and the second contact surface of the at least one second printed circuit board can be arranged opposite one another, for example essentially parallel to one another and/or spaced apart vertically. The first contact surface of the at least one first printed circuit board and the second contact surface of the at least one second printed circuit board can be arranged so that they overlap one another, for example partially or completely.

The printed circuit board arrangement can have at least one spacer structure. The at least one spacer structure can be arranged between the at least one first circuit board and the at least one second circuit board. The at least one spacer structure can be arranged between the at least one electrically conductive first contact point of the at least one first circuit board and the at least one electrically conductive second contact point of the at least one second circuit board. The at least one spacer structure can be arranged between the first contact surface of the at least one first printed circuit board and the second contact surface of the at least one second printed circuit board. The spacer structure can have at least one connecting surface. The spacer structure may have two opposing connecting surfaces. The two opposing connecting surfaces can be arranged essentially parallel to one another and/or spaced apart vertically. The spacer structure can have a plurality of, for example two, three, etc., connecting surfaces which are arranged offset to one another in one, in particular horizontal, plane. At least one further plane/layer can be arranged between the connecting surfaces. The at least one first printed circuit board and the spacer structure and/or its at least one connection surface can be connected to one another via the connection, such as an adhesive connection and/or Velcro connection and/or fusion connection and/or soldered connection and/or press connection. The at least one second printed circuit board and the spacer structure and/or its at least one connection surface can be connected to one another via the connection, such as an adhesive connection and/or Velcro connection and/or fusion connection and/or soldered connection and/or press connection. The spacer structure and/or its at least one connection surface and the at least one electrically conductive first contact point of the at least one first printed circuit board and/or the at least one electrically conductive second contact point of the at least one second printed circuit board can be connected via the connection, such as an adhesive connection and/or Velcro connection and/or or fusion connection and/or solder connection and/or press connection. The spacer structure and/or its at least one connection surface and the first contact surface of the at least one first printed circuit board and/or the second contact surface of the at least one second printed circuit board can be connected via the connection, such as an adhesive connection and/or Velcro connection and/or fusion connection and/or solder connection and/or or press connection, be connected to each other.

The spacer structure may be a spacer element. The spacer element can have a substantially angular, such as rectangular or triangular, round or oval shape. The spacer element can be essentially ring-shaped. The spacer element can be designed as a rectangular, square or circular ring. The spacer element can be a connecting element, connecting ring, circuit board ring or circuit board ring. The spacer element can be a printed circuit board, such as a circuit board. The spacer element can be designed in one layer or in multiple layers. The spacer element can have several, for example two, three or more, layers and/or planes. The spacer element can have conductor tracks. The spacer element can have electronic components. The spacer element can have or implement circuits and/or circuit functions. The spacer element can be designed like the first or second printed circuit board. The spacer element can essentially have the external dimensions, in particular in the longitudinal and/or transverse extension, and/or the geometry, such as the external geometry, of the printed circuit board arrangement and/or the at least one first and/or second printed circuit board. The spacer element can have a height or thickness which essentially corresponds to the height or thickness of the electronic components arranged on the at least one first and/or second printed circuit board or can be correspondingly higher or thicker.

The spacer structure can completely or at least partially through the at least be formed a first and / or second circuit board. The spacer structure and the first or second printed circuit board can be formed in one piece. The spacer structure can be produced by milling, such as milling out, the at least one first and/or second printed circuit board.

The spacer structure can have at least one via. The spacer structure may have multiple vias. The via may be a "vertical interconnect access" (VIA). The via can be a vertical electrical connection, in particular between the planes/layers, for example the connection surfaces, of the spacer structure. In a multi-level spacer structure, such as a multi-level spacer, the via may only pass through one, multiple, or all levels/layers of the multi-level spacer structure. The spacer structure can have a plurality of vias, in particular provided in different planes/layers of the spacer structure. For example, the connection areas of the spacer structure can each have at least one via. The vias can be connected to one another, in particular electrically, via conductor tracks or the like. The through-connection can be formed by a recess or bore, which is metallized on the inside, for example, in the spacer structure. The via can run on at least one edge of the spacer structure. The via can be or have a rivet, such as a metal rivet, or a pin, such as a metal pin. The via can be permanently installed and/or cannot be detached. The via can connect the top and bottom of the spacer structure, in particular electrically. The via can connect several levels/layers of the spacer structure, in particular electrically. The via can be designed and/or intended to electrically conductively connect the two connecting surfaces of the spacer structure. The via can be designed to electrically conductively connect the at least one electrically conductive first contact point of the at least one first printed circuit board and the at least one electrically conductive second contact point of the at least one second printed circuit board. The via can be designed to transmit signals from the at least one first or second printed circuit board to the at least one second or first printed circuit board. The via can thus transmit signals from one board to another, for example the next board.

The at least one first printed circuit board can be fitted with one or more electronic components. The one or more electronic components of the at least one first printed circuit board can be arranged on the side facing and/or facing away from the at least one second printed circuit board. The at least one second printed circuit board can be equipped with one or more electronic components. The one or more electronic components of the at least one second printed circuit board can be arranged on the side facing and/or facing away from the at least one first printed circuit board. Electronic components can be, for example, electrical resistors, capacitors, coils, IC (integrated circuit) components, processors, memory elements, surface-mounted components such as SMD components (surface-mounted device), wired components such as THT components (through-hole technology components), or something like that. The electronic components can be or will be effectively attached by soldering. The top and/or bottom of the at least one first and/or second printed circuit board can each be equipped with one or more electronic components. The one or more electronic components of the at least one first printed circuit board can be offset on a plane defined by the first contact surface of the at least one first printed circuit board, for example the first contact surface/plane, or on a offset to the first contact surface of the at least one first printed circuit board, in particular vertically arranged level be arranged. The one or more electronic components of the at least one second circuit board can be offset on a plane defined by the second contact surface of the at least one second circuit board, for example the second contact surface/plane, or on a plane relative to the second contact surface of the at least one second circuit board, in particular vertically arranged level be arranged. The at least one first printed circuit board and/or the at least one second printed circuit board can be milled out, in particular at the points provided for the electronic components. The milling can reach down to a lowest level, such as a copper level. The at least one first printed circuit board and/or the at least one second printed circuit board can be milled out flat. The cutout can form a lower level or surface. The electronic components can be arranged or equipped on the lower level or surface.

The lower plane or surface can be the plane that is arranged offset, in particular vertically, with respect to the first or second contact surface of the at least one first or second printed circuit board. The electronic components can be integrated and/or countersunk in the at least one first printed circuit board and/or in the at least one second printed circuit board. The electronic components can be arranged according to a previously determined placement concept. The electronic construction parts of a printed circuit board can protrude into existing component gaps on the other printed circuit board.

A cavity can be formed between the interconnected printed circuit boards. The cavity can be formed and/or enclosed by the at least one first printed circuit board, the at least one second printed circuit board and/or by the spacer structure. The electronic components of the at least one first printed circuit board and/or the at least one second printed circuit board can be arranged in the cavity or protrude into it. The printed circuit board arrangement can have several cavities.

The printed circuit board arrangement can have at least one inlet opening for supplying a coolant. The printed circuit board arrangement can have at least one outlet opening for discharging the coolant. The at least one first printed circuit board and the at least one second printed circuit board can form a channel for the coolant. The at least one first circuit board and the at least one second circuit board can form a channel from the inlet opening to the outlet opening. The channel may be formed between the interconnected circuit boards. The channel can be formed and/or enclosed by the at least one first printed circuit board, the at least one second printed circuit board and/or by the spacer structure. The at least one first printed circuit board and/or the at least one second printed circuit board and/or the spacer structure can be shaped and/or joined together in such a way that the channel and/or the inlet opening and/or the at least one first printed circuit board and the at least one second printed circuit board or the outlet opening is formed. The inlet opening and/or outlet opening can be produced by milling, drilling, punching, lasering, such as laser cutting, or cutting. The inlet opening and/or outlet opening can have a round or angular shape. The circuit board arrangement can have multiple channels. The cavity can form the channel completely or at least in sections. The electronic components of the at least one first printed circuit board and/or the at least one second printed circuit board can be arranged in the channel or protrude into it. The channel can be fluid-tight. The channel can be effectively, in particular fluidly, connected to the inlet opening and/or outlet opening. The channel can have the inlet opening and/or outlet opening. The inlet opening and outlet opening can be arranged opposite one another. The inlet opening and outlet opening can be arranged on the same side of the circuit board assembly. The inlet opening and outlet opening can be offset from one another, in particular in the horizontal and/or vertical direction. The inlet opening and outlet opening can be arranged in such a way that the channel leads through the printed circuit board arrangement once or several times in an essentially S-shape. The channel can be designed in a meandering shape and/or can lead through the printed circuit board arrangement in a meandering shape. The channel can go through one or more circuit board levels. The channel can be designed so that the coolant flows through the channel, in particular from the inlet opening to the outlet opening. The channel and/or the inlet opening and outlet opening can/can be designed in such a way that a single or multiple essentially S-shaped and/or meandering flow of coolant takes place.

The coolant can be electrically insulating or non-conductive. The coolant can have an electrical conductivity of ≦10 ^-8 S/m (Siemens per meter). The coolant can be in, in particular direct, contact with the electrical contact surfaces and/or electronic components. Cooling can take place by coolant flowing through the channel and/or interior of the printed circuit board arrangement and/or by evaporating the coolant at the heat source, for example at the electronic components.

A control unit can have at least one printed circuit board arrangement. The at least one printed circuit board arrangement can be configured as described above and/or below. The control unit may be for a machine, plant, such as an industrial plant, or a vehicle, such as an automobile or trailer. The control unit can be intended and/or set up for use in a machine, a plant, such as an industrial plant, or a vehicle, such as a motor vehicle or trailer. The vehicle can be a motor vehicle, such as a car or truck. The vehicle can be a trailer or the like. The control unit can be a control device.

• Bereitstellen wenigstens einer zweiten Leiterplatte, die zumindest eine elektrisch leitende zweite Kontaktstelle auf einer zweiten Kontaktfläche der wenigstens einen zweiten Leiterplatte aufweist. Die wenigstens eine zweite Leiterplatte kann oberhalb der wenigstens einen ersten Leiterplatte bereitgestellt werden. Die wenigstens eine zweite Leiterplatte kann wie vorstehend und/oder nachfolgend beschrieben ausgebildet sein oder werden. Das Verfahren kann ferner den Schritt umfassen:
  • Verbinden der wenigstens einen ersten Leiterplatte mit der wenigstens einen zweiten Leiterplatte mittels einer Verbindung. Das Verbinden kann mittels einer Klebeverbindung und/oder Klettverbindung und/oder Schmelzverbindung und/oder Lötverbindung und/oder Pressverbindung erfolgen. Die Verbindung kann eine Klebeverbindung und/oder Klettverbindung und/oder Schmelzverbindung und/oder Lötverbindung und/oder Pressverbindung sein. Die Klebeverbindung und/oder Klettverbindung und/oder Schmelzverbindung und/oder Lötverbindung und/oder Pressverbindung kann wie vorstehend und/oder nachfolgend beschrieben ausgebildet sein oder werden.

A method for producing a printed circuit board arrangement for an electronic circuit can include the step: providing at least one first printed circuit board which has at least one electrically conductive first contact point on a first contact area of the at least one first printed circuit board. The at least one first printed circuit board can be designed as described above and/or below. The method may further include the step:

• Providing at least one second printed circuit board, which has at least one electrically conductive second contact point on a second contact area of the at least one second printed circuit board. The at least one second circuit board can be provided above the at least one first circuit board. the at least one second printed circuit board can be designed as described above and/or below. The method may further include the step:
  • Connecting the at least one first printed circuit board to the at least one second printed circuit board by means of a connection. The connection can take place by means of an adhesive connection and/or Velcro connection and/or fusion connection and/or soldered connection and/or press connection. The connection can be an adhesive connection and/or Velcro connection and/or fusion connection and/or soldered connection and/or press connection. The adhesive connection and/or Velcro connection and/or fusion connection and/or soldered connection and/or press connection can be designed as described above and/or below.

The at least one electrically conductive first contact point of the at least one first printed circuit board and the at least one electrically conductive second contact point of the at least one second printed circuit board can be connected to one another via the connection, such as an adhesive connection and/or Velcro connection and/or fusion connection and/or soldered connection and/or press connection get connected. The first contact surface of the at least one first printed circuit board and the second contact surface of the at least one second printed circuit board can be connected to one another via the connection, such as an adhesive connection and/or Velcro connection and/or fusion connection and/or solder connection and/or press connection.

The at least one first printed circuit board and the at least one second printed circuit board can be arranged opposite one another. The at least one electrically conductive first contact point of the at least one first printed circuit board and the at least one electrically conductive second contact point of the at least one second printed circuit board can be arranged opposite one another. The first contact area of the at least one first printed circuit board and the second contact area of the at least one second printed circuit board can be arranged opposite one another.

The at least one first printed circuit board and the at least one second printed circuit board can be arranged essentially parallel to one another and/or vertically. The at least one electrically conductive first contact point of the at least one first printed circuit board and the at least one electrically conductive second contact point of the at least one second printed circuit board can be arranged essentially parallel to one another and/or vertically. The first contact surface of the at least one first printed circuit board and the second contact surface of the at least one second printed circuit board can be arranged essentially parallel to one another and/or vertically.

The method can also include the step of providing at least one spacer structure, in particular between the at least one first printed circuit board and the at least one second printed circuit board. The spacer structure can be provided before the at least one second printed circuit board is provided, for example above the at least one first printed circuit board. The spacer structure can be arranged between the at least one first circuit board and the at least one second circuit board. The spacer structure can be provided and/or arranged between the first contact surface of the at least one first printed circuit board and the second contact surface of the at least one second printed circuit board. The spacer structure can be designed as described above and/or below. At least one connection surface of the spacer structure and the at least one first and/or second printed circuit board can be connected to one another via the connection, such as an adhesive connection and/or Velcro connection and/or fusion connection and/or soldered connection and/or press connection. At least one connection surface of the spacer structure and the first contact surface of the at least one first printed circuit board and/or the second contact surface of the at least one second printed circuit board can be connected to one another via the connection, such as an adhesive connection and/or Velcro connection and/or fusion connection and/or soldered connection and/or press connection get connected.

The spacer structure can be produced by milling, such as milling out, the at least one first and/or second printed circuit board.

The method can further include the step: providing an adhesive material and/or a Velcro structure and/or a nanowire connection and/or solder on the at least one first and/or second printed circuit board and/or on the at least one first and/or second electrically conductive contact point and/or on the at least one first and/or second contact surface and/or on the at least one spacer structure. The adhesive material, the Velcro structure, the nanowire connection and/or the solder can be designed as described above and/or below.

Before and / or after connecting and / or providing the at least one first printed circuit board with the at least one second printed circuit board, the at least one first printed circuit board and / or the at least one second printed circuit board with one or be equipped with several electronic components. The top and/or bottom of the at least one first and/or second printed circuit board can each be equipped with one or more electronic components. The one or more electronic components of the at least one first printed circuit board can be arranged on a plane defined by the first contact surface of the at least one first printed circuit board or on a plane offset from the first contact surface of the at least one first printed circuit board, in particular vertically. The one or more electronic components of the at least one second printed circuit board can be arranged on a plane defined by the second contact surface of the at least one second printed circuit board or on a plane offset from the second contact surface of the at least one second printed circuit board, in particular vertically. The at least one first printed circuit board and/or the at least one second printed circuit board can be milled out, in particular at the points provided for the electronic components. The milling can reach down to a lowest level, such as a copper level. The at least one first printed circuit board and/or the at least one second printed circuit board can be milled out flat. The cutout can form a lower level or surface. The electronic components can be arranged or equipped on the lower level or area. The lower plane or surface can be the plane that is arranged offset, in particular vertically, with respect to the first or second contact surface of the at least one first or second printed circuit board. The electronic components can be integrated and/or countersunk in the at least one first printed circuit board and/or in the at least one second printed circuit board. An intelligent placement concept can be determined. The electronic components can be arranged according to the previously determined placement concept.

The method can also include the step, in particular before connecting the printed circuit boards: turning the at least one first printed circuit board and/or at least one second printed circuit board, for example in such a way that the populated top side of the respective printed circuit board is downwards, in particular in the direction of the top side of the respective other circuit board is aligned. Additionally or alternatively, the method can include the step of arranging the electronic components of the at least one first printed circuit board and the electronic components of the at least one second printed circuit board opposite one another.

The method can also include the step of forming a channel and/or cavity between the at least one first printed circuit board and the at least one second printed circuit board, in particular by connecting the at least one first printed circuit board to the at least one second printed circuit board. The channel and/or cavity can be designed as described above and/or below, in particular in such a way that a coolant can flow through.

The method can also include the step of forming at least one inlet opening for supplying a coolant and/or at least one outlet opening for discharging the coolant. The at least one inlet opening and/or at least one outlet opening can be formed by connecting the at least one first circuit board to the at least one second circuit board. The at least one inlet opening and/or at least one outlet opening can be formed by milling, drilling, punching, lasering, such as laser cutting, or cutting the circuit board arrangement and/or the at least one first circuit board and/or the at least one second circuit board and/or of the spacing structure. The at least one inlet opening and/or the at least one outlet opening can be designed as described above and/or below.

The method described above can be part of a computer program product that causes a device to carry out the method for producing a printed circuit board arrangement.

In summary and presented in other words, the invention thus results, among other things, in a circuit board cuboid, such as a circuit board arrangement, with at least two circuit boards, the circuit boards being directly electrically connected. The direct connection can be made by means of a connection such as adhesive and/or Velcro technology. The circuit board cuboid can have cooling. Cooling can take place by means of coolant flowing through the interior of the circuit board block, such as "circuit board cubes", and/or by evaporating the coolant at the heat source, for example at the electronic components.

With the invention, different circuit boards, for example with different layer structures or geometries, can be electrically connected directly to one another simply and securely, in particular without using conventional connection technologies such as plug connectors, lines, flexible circuit boards, film connectors or the like. Furthermore, conventional heat sinks are no longer necessary. The manufacturing costs can be significantly reduced as a result. The space requirement can be reduced and the available installation space can be optimally utilized. The likelihood of EMC interference and signal integrity violations can be significantly reduced. This can be a significant advantage over previous connection technologies, especially in areas where EMC is critical, such as camera applications in the vicinity of glass antennas or in the area of GPS antennas. Furthermore, the efficiency of the cooling can be increased significantly.

• 1 eine Leiterplatten-Anordnung im unmontierten Zustand;
• 2 die Leiterplatten-Anordnung gemäß 1 im montierten Zustand;
• 3 eine Leiterplatten-Anordnung im unmontierten Zustand;
• 4 die Leiterplatten-Anordnung gemäß 3 mit aufgebrachter Klebe- und/oder Klettverbindung;
• 5 die Leiterplatten-Anordnung gemäß 3 und 4 im montierten Zustand;
• 6 eine Leiterplatten-Anordnung im unmontierten Zustand;
• 7 die Leiterplatten-Anordnung gemäß 6 mit aufgebrachter Klebe- und/oder Klettverbindung;
• 8 die Leiterplatten-Anordnung gemäß 6 und 7 im montierten Zustand;
• 9 eine Leiterplatten-Anordnung im unmontierten Zustand;
• 10 die Leiterplatten-Anordnung gemäß 9 im montierten Zustand;
• 11 ein Leiterplatten-Anordnung als Leiterplattenstapel;
• 12 verschiedene Herstellungszustände einer Leiterplatten-Anordnung mit Kühlung;
• 13 eine Steuereinheit mit einer Leiterplatten-Anordnung; und
• 14 ein Flussdiagramm eines Verfahrens zum Herstellen einer Leiterplatten-Anordnung.

Exemplary embodiments of the invention are described in more detail below with reference to figures, which show schematically and by way of example:

• 1 a printed circuit board assembly in the unassembled state;
• 2 according to the circuit board arrangement 1 in assembled condition;
• 3 a printed circuit board assembly in the unassembled state;
• 4 according to the circuit board arrangement 3 with applied adhesive and/or Velcro connection;
• 5 according to the circuit board arrangement 3 and 4 in assembled condition;
• 6 a printed circuit board assembly in the unassembled state;
• 7 according to the circuit board arrangement 6 with applied adhesive and/or Velcro connection;
• 8th according to the circuit board arrangement 6 and 7 in assembled condition;
• 9 a printed circuit board assembly in the unassembled state;
• 10 according to the circuit board arrangement 9 in assembled condition;
• 11 a printed circuit board arrangement as a printed circuit board stack;
• 12 various states of manufacture of a printed circuit board assembly with cooling;
• 13 a control unit with a circuit board assembly; and
• 14 a flow chart of a method for producing a printed circuit board arrangement.

1 shows a circuit board arrangement 100 for an electronic circuit in the unmounted state and 2 shows the printed circuit board arrangement 100 in the assembled or connected state. The printed circuit board arrangement 100 has a first printed circuit board 102 and a second printed circuit board 104 .

The first circuit board 102 has at least one electrically conductive first contact point 106 on a first contact surface 108 . The second circuit board 104 has at least one electrically conductive second contact point 110 on a second contact surface 112 . The at least one electrically conductive first contact point 106 of the first printed circuit board 102 and the at least one electrically conductive second contact point 110 of the second printed circuit board 104 are arranged opposite one another. The first contact surface 108 of the first printed circuit board 102 and the second contact surface 112 of the second printed circuit board 104 are arranged opposite one another and parallel to one another. the inside 1 shown arrow illustrates the mounting direction.

The circuit board arrangement 100 also has a spacer structure 114 embodied as a spacer element 114 . In this exemplary embodiment, the spacer element 114 is implemented as a circuit board ring. The spacer element 114 is arranged between the first circuit board 102 and the second circuit board 104 . The spacer element 114 has two connecting surfaces 116 arranged opposite one another and parallel to one another. A connection 118, here for example an adhesive connection 118 and/or Velcro connection 118, is applied to the connection surfaces 116. The adhesive connection 118 and/or Velcro connection 118 is electrically conductive.

As in 2 As can be seen, the lower connecting surface 116 of the spacer element 114 is effectively connected to the first contact point 106 and the first contact surface 108 of the first printed circuit board 102 by means of the adhesive connection 118 and/or Velcro connection 118 . Likewise, the upper connecting surface 116 of the spacer element 114 is effectively connected to the second contact point 110 and the second contact surface 112 of the second printed circuit board 104 by means of the adhesive connection 118 and/or Velcro connection 118 . The spacer element 114 also has a plurality of vias 120 extending vertically through the spacer element 114, which protrude towards the respective adhesive connection 118 and/or Velcro connection 118 and are electrically connected to this. The vias 120 therefore connect the at least one electrically conductive first contact point 106 of the first printed circuit board 102 and the at least one electrically conductive second contact point 110 of the second printed circuit board 104 to one another in an electrically conductive manner. The first printed circuit board 102 is thus directly and electrically connected to the second printed circuit board 106 by means of the adhesive connection 118 and/or Velcro connection 118 .

The first circuit board 102 and the second circuit board 104 are each equipped with a plurality of electronic components 122, the electron ical components 122 of the first printed circuit board 102 are arranged on the side facing the second printed circuit board 104 and the electronic components 122 of the second printed circuit board 104 are arranged on the side facing away from the first printed circuit board 102 . Furthermore, the electronic components 122 of the first printed circuit board 102 are arranged or fitted on an assembly level 124 defined by the first contact surface 108 . In the connected state of the circuit board assembly 100 (see 2 ) form the first printed circuit board 102, the second printed circuit board 104 and the spacer element 114 a cavity 126 in which the electronic components 122 of the first printed circuit board 102 are arranged and find space.

3 until 5 show a printed circuit board arrangement 200 in different states of assembly. Show like this 3 and 4 the unmounted or unconnected state of the circuit board arrangement 200 and 5 the mounted or connected state of the printed circuit board assembly 200. The printed circuit board assembly 200 has a first printed circuit board 202 and a second printed circuit board 204.

In contrast to the printed circuit board arrangement 100 according to 1 until 2 , the printed circuit board arrangement 200 has no separate spacer element, but rather a spacer structure 206 which is formed in sections by the first printed circuit board 202. The spacer structure 206 is realized by milling out the first printed circuit board 202, as a result of which a connection surface 208 and an assembly level 210 are formed. For this purpose, the first printed circuit board 202 is milled out at the locations of the electronic components down to the lowest copper level. The electronic components of the first printed circuit board 202 are arranged countersunk on the assembly level 210, which is vertically offset relative to the first contact surface of the first printed circuit board 202 (illustrated in 4 and by the short arrows pointing downwards in 3 ). In this exemplary embodiment, the first contact surface of the first printed circuit board 202 corresponds to the connection surface 208 of the spacer structure 206.

As in 4 As can be seen, a connection 212, here for example an adhesive and/or Velcro connection 212, is applied to the connection surface 208 of the spacer structure 206 of the first circuit board 202, by means of which the first circuit board 202 is directly and electrically connected to the second circuit board 204 or is (see 5 ). In the connected state of the printed circuit board arrangement 200, the first printed circuit board 202 and the second printed circuit board 204 form a cavity 214 in which the electronic components of the first printed circuit board 202 are arranged and have space.

Incidentally, in addition, in particular 1 until 2 and the associated description.

6 until 8th show a printed circuit board arrangement 300 in different states of assembly. Show like this 6 and 7 the unmounted or unconnected state of the circuit board arrangement 300 and 8th the assembled or connected state of the printed circuit board arrangement 300. The printed circuit board arrangement 300 has a first printed circuit board 302 and a second printed circuit board 304.

In contrast to the printed circuit board arrangement 200 according to 3 until 5 the printed circuit board arrangement 300 additionally has a second spacer structure 306 which is formed in sections by the second printed circuit board 304. The second spacer structure 306 is implemented by milling out the second printed circuit board 304, as a result of which a second connection area 308 and a second assembly level 310 are formed. For this purpose, the second printed circuit board 304 is milled out at the locations of the electronic components down to the lowest copper level. The electronic components of the second printed circuit board 304 are arranged countersunk on the assembly level 310, which is vertically offset relative to the second contact surface of the second printed circuit board 304 (illustrated by the short arrows pointing downwards in 6 ). In this exemplary embodiment, the second contact surface of the second printed circuit board 304 corresponds to the second connection surface 308 of the second spacer structure 306.

Before connecting the two circuit boards 302, 304, the second circuit board 304 is rotated (illustrated by the curved arrow in 6 ), in particular by 180°, so that the top side of the second printed circuit board 304 fitted with electronic components and the second connecting surface 308 of the second spacer structure 306 face the top side of the first printed circuit board 302 fitted with electronic components and the first connecting surface 312 of the first spacer structure 314 ( please refer 7 ). As in 7 As can be seen, a connection 316, here for example an adhesive and/or Velcro connection 316, is applied to the first connecting surface 312 of the first spacing structure 314 of the first circuit board 302, by means of which the first circuit board 302 is connected directly and electrically to the second circuit board 304 is connected. In the connected state (see 8th ) of the printed circuit board arrangement 300, the first printed circuit board 302 and the second printed circuit board 304 form a cavity 318 in which the electronic components of the first printed circuit board 302 and the second printed circuit board 304 are arranged and accommodated.

Incidentally, in addition, in particular 1 until 5 and the associated description.

9 shows a circuit board arrangement 400 for an electronic circuit in the unmounted state and 10 shows the printed circuit board arrangement 400 in the mounted or connected state. The printed circuit board arrangement 400 has a first printed circuit board 402, a second printed circuit board 404 and a spacer element 408 arranged therebetween.

The printed circuit board arrangement 400 essentially corresponds to the printed circuit board arrangement 100 according to FIG 1 and 2 , but with the difference that the second printed circuit board 404 is rotated before connecting the two printed circuit boards 402, 404 (illustrated by the curved arrow in 9 ), in particular by 180°, so that the upper side of the second printed circuit board 404 equipped with electronic components is the upper connecting surface 412 of the spacer element 408 provided with the connection 410, here for example with an adhesive connection 410 and/or Velcro connection 410, and the electronic components equipped side facing the first printed circuit board 402 (see 9 and 10 ).

As in 10 shown, the side of the second printed circuit board 404 fitted with electronic components faces the side of the first printed circuit board 402 fitted with electronic components in the connected state. The electronic components of the circuit boards 402, 404 are arranged according to a previously determined intelligent placement concept, so that electronic components of a circuit board can protrude into existing component gaps 414 of the other circuit board.

Incidentally, in addition, in particular 1 until 8th and the associated description.

11 shows schematically a circuit board arrangement 500 designed as a circuit board stack. The circuit board arrangement 500 can have several, for example six, circuit boards. In the present exemplary embodiment, the circuit board arrangement 500 has five first circuit boards 502 and a second circuit board 504, which were connected by means of the connection 506, here for example by means of the adhesive and/or Velcro connection 506, to form a cuboid stack.

For example, the five first printed circuit boards 502 and the one second printed circuit board 504 can essentially correspond to the first printed circuit board 302 or second printed circuit board 304 of the exemplary embodiment 6 until 8th correspond to. However, any other embodiment is also possible. Depending on the application in particular, different versions can also be combined with one another.

Incidentally, in addition, in particular 1 until 10 and the associated description.

12 shows different production states of a printed circuit board arrangement 600 with cooling in different views. The printed circuit board arrangement 600 essentially corresponds to the printed circuit board arrangement 400 according to FIG 9 and 10 . The left view of 12 shows the unmounted or not connected state of the circuit board assembly 600. The middle view of 12 shows the mounted or connected state of the circuit board assembly 600. The right view of 12 shows the mounted or connected state of the printed circuit board arrangement 600 in which the cooling has been implemented.

The printed circuit board arrangement 600 has an inlet opening 602 for supplying a coolant and an outlet opening 604 for discharging the coolant. The inlet opening 602 and the outlet opening 604 are produced by milling and have a substantially rectangular shape. The inlet port 602 and the outlet port 604 are located opposite each other. Between the interconnected circuit boards is formed a channel 606 formed by the cavity between the circuit boards. The channel 606 is operatively, in particular fluidically, connected to the inlet opening 602 and outlet opening 604 . The channel thus opens into the inlet opening 602 on the one hand and into the outlet opening 604 on the other. The electronic components of the printed circuit boards are arranged in the channel 606 or protrude into it. Channel 606 is configured to allow coolant 608 to flow from inlet port 602 through channel 606 to outlet port 604 (illustrated by the arrows in the right view of FIG 12 ). The coolant is electrically insulating and is in direct contact with the electrical contact surfaces and electronic components of the printed circuit boards.

Incidentally, in addition, in particular 1 until 11 and the associated description.

13 FIG. 1 schematically shows a control unit 700. The control unit 700 is embodied as a control unit 700 that is set up for use in a motor vehicle. The control unit 700 has at least one printed circuit board arrangement 702 with an electronic circuit. The at least one circuit board arrangement 702 can be designed as described above and/or below.

Incidentally, in addition, in particular 1 until 12 and the associated description.

14 FIG. 8 shows a flow diagram of a method 800 for producing a printed circuit board arrangement for an electronic circuit.

In a step 802 at least one first printed circuit board is provided, wherein the at least one first printed circuit board has at least one electrically conductive first contact point on a first contact area of the at least one first printed circuit board. The at least one first printed circuit board can be designed as described above and/or below.

In a step 804 at least one second printed circuit board is provided, wherein the at least one second printed circuit board has at least one electrically conductive second contact point on a second contact area of the at least one second printed circuit board. The at least one second printed circuit board can be designed as described above and/or below.

In a step 806, the at least one first printed circuit board is connected to the at least one second printed circuit board by means of a connection, such as an adhesive connection and/or Velcro connection and/or fusion connection and/or solder connection and/or press connection. The connection, for example the adhesive connection and/or Velcro connection and/or fusion connection and/or soldered connection and/or press connection, can be designed as described above and/or below.

Incidentally, in addition, in particular 1 until 13 and the associated description.

The above with reference to 14 The method described can be part of a computer program product that causes a device to carry out the method for producing a printed circuit board arrangement.

In particular, optional features of the invention are denoted by “I<ann”. Accordingly, there are also developments and/or exemplary embodiments of the invention which additionally or alternatively have the respective feature or features.

If necessary, isolated features can also be selected from the combinations of features disclosed here and used in combination with other features to delimit the subject matter of the claim, eliminating any structural and/or functional relationship that may exist between the features.

Reference List

100

PCB arrangement

102

first circuit board

104

second circuit board

106

first point of contact

108

first contact surface

110

second point of contact

112

second contact surface

114

Spacer structure / spacer element

116

connecting surfaces

118

Adhesive and/or Velcro connection

120

vias

122

electronic components

124

assembly level

126

cavity

200

PCB arrangement

202

first circuit board

204

second circuit board

206

spacing structure

208

interface

210

assembly level

212

Adhesive and/or Velcro connection

214

cavity

300

PCB arrangement

302

first circuit board

304

second circuit board

306

second spacer structure

308

second interface

310

second assembly level

312

first interface

314

first spacing structure

316

Adhesive and/or Velcro connection

318

cavity

400

PCB arrangement

402

first circuit board

404

second circuit board

408

spacer element

410

Adhesive and/or Velcro connection

412

upper interface

414

component gaps

500

circuit board stack

502

first circuit boards

504

second circuit board

506

Adhesive and/or Velcro connection

600

PCB arrangement

602

intake port

604

exhaust port

606

channel

608

coolant

700

control unit

702

PCB arrangement

800

Process for manufacturing a printed circuit board assembly

802

Step to deploy the first circuit board

804

Step of providing the second circuit board

806

Step to connect the circuit boards

QUOTES INCLUDED IN DESCRIPTION

This list of the documents cited by the applicant was generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Patent Literature Cited

• DE 19912519 A1 [0004]
• EP 1160921 A2 [0005]
• EP 2709212 A1 [0006]
• DE 102017126724 A1 [0007]
• DE 10249436 A1 [0008]

Claims (22)

Printed circuit board arrangement (100, 200, 300, 400, 500, 600, 702) for an electronic circuit, the printed circuit board arrangement (100, 200, 300, 400, 500, 600, 702) comprising: at least one first printed circuit board ( 102, 202, 302, 402, 502) with at least one electrically conductive first contact point (106) on a first contact area (108) of the at least one first circuit board (102, 202, 302, 402, 502); and at least one second printed circuit board (104, 204, 304, 404, 504) with at least one electrically conductive second contact point (110) on a second contact surface (112) of the at least one second printed circuit board (104, 204, 304, 404, 504), wherein the at least one electrically conductive first contact point (106) of the at least one first printed circuit board (102, 202, 302, 402, 502) and the at least one electrically conductive second contact point (110) of the at least one second printed circuit board (104, 204, 304, 404, 504) are electrically conductively connected, characterized in that the at least one first circuit board (102, 202, 302, 402, 502) and the at least one second circuit board (104, 204, 304, 404, 504) via a connection ( 118, 212, 316, 410, 506) are connected to one another, the connection (118, 212, 316, 410, 506) being an adhesive connection (118, 212, 316, 410, 506) and/or Velcro connection (118, 212, 316, 410, 506) and/or fusion bond and/or solder bond and/or pre ssconnection is. PCB arrangement (100, 200, 300, 400, 500, 600, 702) according to claim 1 , characterized in that the at least one electrically conductive first contact point (106) of the at least one first printed circuit board (102, 202, 302, 402, 502) and the at least one electrically conductive second contact point (110) of the at least one second printed circuit board (104, 204, 304, 404, 504) are connected to each other via the connection (118, 212, 316, 410, 506). Printed circuit board arrangement (100, 200, 300, 400, 500, 600, 702) according to at least one of the preceding claims, characterized in that the first contact surface (108) of the at least one first printed circuit board (102, 202, 302, 402, 502 ) and the second contact surface (112) of the at least one second circuit board (104, 204, 304, 404, 504) via the connection (118, 212, 316, 410, 506) are connected to one another. Circuit board arrangement (100, 200, 300, 400, 500, 600, 702) according to at least one of the preceding claims, characterized in that the at least one first circuit board (102, 202, 302, 402, 502) and the at least one second circuit board (104, 204, 304, 404, 504) are arranged opposite one another and/or that the at least one electrically conductive first contact point (106) of the at least one first circuit board (102, 202, 302, 402, 502) and the at least one electrically conductive second contact point (110) of the at least one second printed circuit board (104, 204, 304, 404, 504) are arranged opposite one another and/or that the first contact surface (108) of the at least one first printed circuit board (102, 202, 302, 402 , 502) and the second contact area (112) of the at least one second printed circuit board (104, 204, 304, 404, 504) are arranged opposite one another. Circuit board arrangement (100, 200, 300, 400, 500, 600, 702) according to at least one of the preceding claims, characterized in that the at least one first circuit board (102, 202, 302, 402, 502) and the at least one second Circuit boards (104, 204, 304, 404, 504) are arranged essentially parallel to one another and/or spaced vertically and/or that the at least one electrically conductive first contact point (106) of the at least one first circuit board (102, 202, 302, 402 , 502) and the at least an electrically conductive second contact point (110) of the at least one second circuit board (104, 204, 304, 404, 504) are essentially parallel to each other and/or vertically defined and/or that the first contact area (108 ) the at least one first printed circuit board (102, 202, 302, 402, 502) and the second contact surface (112) of the at least one second printed circuit board (104, 204, 304, 404, 504) essentially parallel to one another and/or vertically are arranged. Circuit board arrangement (100, 200, 300, 400, 500, 600, 702) according to at least one of the preceding claims, characterized in that the connection (118, 212, 316, 410, 506) is electrically and/or thermally conductive. Printed circuit board arrangement (100, 200, 300, 400, 500, 600, 702) according to at least one of the preceding claims, characterized by a spacer structure (114, 206, 306, 314, 408) between the at least one first printed circuit board (102 , 202, 302, 402, 502) and/or the first contact surface (108) and the at least one second circuit board (104, 204, 304, 404, 504) and/or the second contact surface (112) is arranged, wherein at least one connecting surface ( 116, 208, 308, 312, 412) of the spacer structure (114, 206, 306, 314, 408) and the at least one second printed circuit board (104, 204, 304, 404, 504) and/or second contact surface (112) via the Connection (118, 212, 316, 410, 506) are interconnected. PCB arrangement (100, 200, 300, 400, 500, 600, 702) according to claim 7 , characterized in that the spacer structure (114, 206, 306, 314, 408) is a spacer element (114, 206, 306, 314, 408) or at least partially by the at least one first printed circuit board (102, 202, 302, 402, 502) is formed. Circuit board arrangement (100, 200, 300, 400, 500, 600, 702) according to at least one of the preceding Claims 7 until 8th , characterized in that the spacer structure (114, 206, 306, 314, 408) has at least one via (120) which is designed to connect the at least one electrically conductive first contact point (106) of the at least one first printed circuit board (102, 202 , 302, 402, 502) and the at least one electrically conductive second contact point (110) of the at least one second circuit board (104, 204, 304, 404, 504) to connect electrically conductive. Circuit board arrangement (100, 200, 300, 400, 500, 600, 702) according to at least one of the preceding claims, characterized in that the at least one first circuit board (102, 202, 302, 402, 502) with one or more electronic Components (122) is fitted, the one or more electronic components (122) being arranged on the side facing and/or facing away from the at least one second printed circuit board (104, 204, 304, 404, 504). Circuit board arrangement (100, 200, 300, 400, 500, 600, 702) according to at least one of the preceding claims, characterized in that the at least one second circuit board (104, 204, 304, 404, 504) with one or more electronic Components (122) is fitted, the one or more electronic components (122) being arranged on the side facing and/or facing away from the at least one first printed circuit board (102, 202, 302, 402, 502). Circuit board arrangement (100, 200, 300, 400, 500, 600, 702) according to at least one of the preceding Claims 10 until 11 , characterized in that the one or more electronic components (122) of the at least one first or second printed circuit board (102, 202, 302, 402, 502; 104, 204, 304, 404, 504) on a through the first or second contact surface (108; 112) of the at least one first or second circuit board (102, 202, 302, 402, 502; 104, 204, 304, 404, 504) defined level (124) or on a to the first or second Contact surface (108; 112) of the at least one first or second printed circuit board (102, 202, 302, 402, 502; 104, 204, 304, 404, 504), in particular vertically, offset plane (210) are arranged. Circuit board arrangement (100, 200, 300, 400, 500, 600, 702) according to at least one of the preceding claims, characterized in that the circuit board arrangement (100, 200, 300, 400, 500, 600, 702) at least one Has an inlet opening (602) for supplying a coolant (608) and at least one outlet opening (604) for discharging the coolant (608), the at least one first circuit board (102, 202, 302, 402, 502) and the at least one second circuit board (104, 204, 304, 404, 504) form a channel (606) for the coolant (608), in particular a channel (606) from the inlet opening (602) to the outlet opening (604). Control unit (700) comprising a circuit board arrangement (100, 200, 300, 400, 500, 600, 702) according to at least one of the preceding claims. Method (800) for producing a printed circuit board arrangement (100, 200, 300, 400, 500, 600, 702) for an electronic circuit, comprising at least the steps: Providing (802) at least one first printed circuit board (102, 202, 302, 402, 502) which has at least one electrically conductive first contact point (106) on a first contact surface (108) of the at least one first printed circuit board (102, 202, 302, 402 , 502); Providing (804) at least one second printed circuit board (104, 204, 304, 404, 504) which has at least one electrically conductive second contact point (110) on a second contact surface (112) of the at least one second printed circuit board (104, 204, 304, 404 , 504); and Connecting (806) the at least one first printed circuit board (102, 202, 302, 402, 502) to the at least one second printed circuit board (104, 204, 304, 404, 504) by means of a connection (118, 212, 316, 410, 506 ), wherein the connection (806) takes place by means of an adhesive connection (118, 212, 316, 410, 506) and/or Velcro connection (118, 212, 316, 410, 506) and/or fusion connection and/or solder connection and/or press connection . Method (800) according to claim 15 , characterized in that the at least one electrically conductive first contact point (106) of the at least one first printed circuit board (102, 202, 302, 402, 502) and the at least one electrically conductive second contact point (110) of the at least one second printed circuit board (104, 204, 304, 404, 504) are connected to one another via the connection (118, 212, 316, 410, 506) and/or that the first contact surface (108) of the at least one first printed circuit board (102, 202, 302, 402, 502 ) and the second contact surface (112) of the at least one second printed circuit board (104, 204, 304, 404, 504) via the conn tion (118, 212, 316, 410, 506) are connected to each other. Method (800) according to at least one of the preceding Claims 15 until 16 , characterized in that the at least one first printed circuit board (102, 202, 302, 402, 502) and the at least one second printed circuit board (104, 204, 304, 404, 504) are arranged opposite one another and/or that the at least one electrically conductive first contact point (106) of the at least one first printed circuit board (102, 202, 302, 402, 502) and the at least one electrically conductive second contact point (110) of the at least one second printed circuit board (104, 204, 304, 404, 504) each other are arranged opposite one another and/or that the first contact surface (108) of the at least one first printed circuit board (102, 202, 302, 402, 502) and the second contact surface (112) of the at least one second printed circuit board (104, 204, 304, 404, 504) are arranged opposite each other. Method (800) according to at least one of the preceding Claims 15 until 17 , characterized in that the at least one first printed circuit board (102, 202, 302, 402, 502) and the at least one second printed circuit board (104, 204, 304, 404, 504) are arranged essentially parallel to one another and/or spaced apart vertically and /or that the at least one electrically conductive first contact point (106) of the at least one first printed circuit board (102, 202, 302, 402, 502) and the at least one electrically conductive second contact point (110) of the at least one second printed circuit board (104, 204, 304, 404, 504) are arranged essentially parallel to one another and/or vertically spaced and/or that the first contact surface (108) of the at least one first printed circuit board (102, 202, 302, 402, 502) and the second contact surface (112) the at least one second printed circuit board (104, 204, 304, 404, 504) are arranged essentially parallel to one another and/or spaced apart vertically. Method (800) according to at least one of the preceding Claims 15 until 18 , characterized in that a spacing structure (114, 206, 306, 314, 408) between the at least one first printed circuit board (102, 202, 302, 402, 502) and/or the first contact surface (108) and the at least one second printed circuit board ( 104, 204, 304, 404, 504) and/or second contact surface (112) is provided, wherein at least one connecting surface (116, 208, 308, 312, 412) of the spacer structure (114, 206, 306, 314, 408) and the at least one second printed circuit board (104, 204, 304, 404, 504) and/or second contact surface (112) are connected to one another via the connection (118, 212, 316, 410, 506). Method (800) according to claim 19 , wherein the spacing structure (114, 206, 306, 314, 408) is produced by milling the at least one first circuit board (102, 202, 302, 402, 502) or the spacing structure (114, 206, 306, 314, 408) between the at least one first printed circuit board (102, 202, 302, 402, 502) and/or first contact surface (108) and the at least one second printed circuit board (104, 204, 304, 404, 504) and/or second contact surface (112). becomes. Method (800) according to at least one of the preceding Claims 15 until 20 , characterized in that before the at least one first printed circuit board (102, 202, 302, 402, 502) is connected to the at least one second printed circuit board (104, 204, 304, 404, 504), the at least one first printed circuit board (102, 202 , 302, 402, 502) and/or the at least one second printed circuit board (104, 204, 304, 404, 504) is fitted with one or more electronic components (122). Method (800) according to at least one of the preceding Claims 15 until 21 , characterized in that by connecting the at least one first printed circuit board (102, 202, 302, 402, 502) to the at least one second printed circuit board (104, 204, 304, 404, 504) and/or by milling, drilling, punching, Lasering or cutting at least one inlet opening (602) for supplying a coolant (608) and at least one outlet opening (604) for discharging the coolant (608) is formed, the at least one first printed circuit board (102, 202, 302, 402, 502) and the at least one second printed circuit board (104, 204, 304, 404, 504) forms a channel (606) for the coolant (608), in particular a channel (606) from the inlet opening (602) to the outlet opening (604).

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