DE102020113323B4 - Production line for embedding samples and processing the embedded samples - Google Patents

Abstract

Production line (310) for automatically embedding and subsequent surfacing of specimens, comprising:an automatic embedding press (110) for programmatically embedding and ejecting a plurality of specimens (142) one by one,an automatic surfacing device (210) for programmatically machining the specimen underside (142a) of the A plurality of the specimens (142) embedded by the embedding press (110) one after the other, and having a specimen removal position (214) and a specimen depositing position (284), a first conveyor device (312) for conveying the embedded specimens (142 ) to the sampling position (214) of the surfacing device (210), program controllers (111, 211) for controlling the automatic mounting press (110) and the automatic surfacing device (210).

Description

field of invention

The invention relates to an automatic production line for embedding a large number of samples and for processing the samples embedded in this way by grinding and/or polishing samples in a program-controlled overall system which includes an automatic embedding press and an automatic surface treatment device, in particular an automatic grinding and polishing device .

Background and general description of the invention

In order to carry out material tests on samples, smaller sample pieces are often embedded in a cylindrical body made of plastic material. The samples embedded in this way are then ground flat and, if necessary, polished in order to be able to carry out material tests, e.g.

1. 1. Verschluss öffnen und Zylinder in die obere Position fahren,
2. 2. Probe einlegen und Zylinder nach unten fahren,
3. 3. Einbettgranulat mit einer Schaufel in den Zylinder schaufeln,
4. 4. Verschluß schließen und Pressvorgang starten,
5. 5. Einbettvorgang abwarten (mehrere Minuten, je nach eingestellten Parametern),
6. 6. Verschluss öffnen,
7. 7. Zylinder nach oben fahren, sodass die Probe entnommen werden kann.

A simple embedding press has a cylinder with a plunger and a manual lock. For embedding, the small specimens are placed in a cylinder with embedding granules, for example made of a thermoplastic material, and hot-pressed, typically under a maximum pressure of about 250 to 350 bar, at a maximum temperature of about 200°C and over a duration of several minutes. Such an embedding press has a controller with which the heating temperature, times of heating and cooling and the pressing pressure can be set. With such an embedding press, the specimen embedding proceeds as follows:

1. 1. Open the breech and move the cylinder to the upper position,
2. 2. Insert the sample and move the cylinder down,
3. 3. Shovel embedding granules into the cylinder with a shovel,
4. 4. Close the shutter and start the pressing process,
5. 5. Wait for the embedding process (several minutes, depending on the parameters set),
6. 6. open the shutter,
7. 7. Move the cylinder up so that the sample can be taken.

The operator manually repeats this process for each individual sample. The total duration of the process for embedding a sample is typically around 15 minutes, depending on the parameters set.

A modular embedding press from ATM Qness GmbH is known under the name Opal X-Press, see www.gatm.com. The basic structure and function of the Opal X-Press is similar to the embedding press described above. However, several presses, possibly with different specimen diameters, can be combined here and operated at the same time. Each cylinder with plunger has a lever-operated locking mechanism at the top end, with which the press-in cavity in the press cylinder can be closed and locked with a flick of the wrist. This modular embedding press has the advantage that the sample throughput can be increased accordingly. However, the operator still has to be present essentially all the time in order to fill the individual embedding presses and to remove the embedded specimens.

A dual press with a dosing system is also known. The operation of the dual press is similar to that of the embedding presses described above, but the embedding granules can be introduced via a dosing device. This is swiveled by hand over the press cylinder and the embedding granules are dosed into the cylinder. This press has a dual design, i.e. there are two press cylinders via which the dosing device can be pivoted alternately by hand.

All of the systems described have the disadvantage that the operator must essentially be present at all times. The embedding is a time-consuming work, partly because of the waiting time during the embedding pressing process, i.e. when pressing typically under high pressure and high temperature, which costs the skilled worker in the laboratory valuable time. Furthermore, embedding represents a certain bottleneck in the overall sample production process, since embedding typically requires the most working time in the overall sample production process. This applies in particular to laboratories with a high sample throughput, i.e. when a large number of samples are to be hot-pressed.

After the specimen has been mounted, it is typically ground flat using a laboratory grinder with a rotating grinding wheel, and then polished. Typically, such laboratory disk grinding devices are designed as combined grinding and polishing devices, ie a polishing disk can also be mounted on the grinding disk in order to alternatively provide a polishing function. Such laboratory disc grinders, as are known, for example, from ATM Qness GmbH under the brand names Saphir and Rubin, cf. www.gatm.com, are typically used for surface grinding and, if necessary, polishing the underside of embedded samples for material testing, especially hardness testing and structural analysis.

Such grinding/polishing devices are available with one or more spindles. Manual grinding/polishing devices essentially have a housing with a tub, a drive motor and a grinding disc. With simple grinding/polishing devices, the embedded sample can be pressed and ground by hand. Semi-automatic grinding/polishing devices also have a device head, sometimes referred to as a polishing head, with a rotating pressure stamp and a specimen holder, in which typically four to six embedded specimens can be placed and, if necessary, clamped. With single contact pressure, the specimens are only placed in the specimen holder and taken along by it. Each individual sample is pressed against the sanding pad with a pneumatic cylinder or a spring. With the central contact pressure, the entire sample holder is pressed against the sanding plate and the samples are clamped firmly in the sample holder. In automatic systems, the specimens are typically clamped, as they usually work with central contact pressure.

The insertion and, if necessary, clamping of the samples is a manual activity and the disadvantage is that the samples have to be aligned very precisely and flat in a corresponding device, which is associated with a corresponding expenditure of time.

A conventional semi-automatic grinding/polishing device has a magazine for e.g. 16 grinding wheels, which can be placed on the grinding plate for the individual processing steps by an automatic changing system. First you start with a coarser abrasive grain, which then becomes finer, and finally polishing wheels follow. Typically 4 to 6 grinding and polishing steps are required to produce the finished sample surface. After each processing step, one or two cleaning steps are carried out with water, methanol or in an ultrasonic bath.

Advantageously, this device is relatively compact and inexpensive. The disadvantage, however, is that only 6 samples are automatically produced in one sample holder, then the sample holder is changed. Furthermore, the grinding and polishing wheels are changed between the grinding and polishing steps after each step. In addition, the samples are manually clamped and aligned in the sample holder.

In another, fundamentally similar variant, the samples are clamped in a holder and the grinding wheels are also changed. However, more than one sample holder can be loaded and the machine has two cleaning stations. The disadvantage of this machine, however, is the increasing size.

A grinding and polishing machine with several grinding/polishing stations is known from ATM Qness GmbH. This machine can be modularly equipped with several grinding/polishing discs, with cleaning stations and a plane grinding device for dressing the samples. There is also a magazine with various grinding and polishing wheels. The machine includes two polishing heads, each capable of holding one specimen holder and simultaneously processing two specimen holders with multiple specimens. The machine has a sample holder magazine that can hold up to 12 sample holders. The 12 sample holders are automatically taken over or changed and clamped by the machine. However, the samples have to be manually clamped in the sample holder and aligned flat. Due to the modular design, the machine can be set up with 4 but also with 6 or 8 stations. A high sample throughput can advantageously be achieved with this automatic grinding/polishing machine and the automatic grinding/polishing machine can be easily adapted to user requirements due to its modular design. However, the purchase is associated with relatively high investment costs. Furthermore, the machine requires quite a large amount of space.

Another machine is known in which several sample holders are stored on a feed belt and conveyed into a first device. There they are first dressed (planned) using a whetstone, cleaned and then the first fine grinding process takes place. The sample holder is then conveyed to a second device, in which two polishing steps with intermediate and final cleaning then take place. Both workstations work simultaneously, i.e. while the first sample holder is being polished in the second device, the first device is already working on the next sample holder.

This machine is also modular and any number of devices can be combined. Disadvantages are high acquisition costs and a very large space requirement, especially when several devices are combined.

In the CN1 08020453A describes a sample preparation device in which acrylic powder and water from two silos are mixed in a mixer. The device further includes a dispensing mechanism having a belt.

In the CN101708590B describes a grinding and polishing device with a combined grinding and polishing wheel, with samples being clamped in drill chucks. six drill chucks can be fixed in radial grooves of a plate.

In the CN104330294A describes a preparation device for metallographic samples with grinding and polishing mechanisms.

It is an object of the present invention to simplify the production of embedded specimens, prepared ready for hardness testing, structural analysis or other metallurgical investigations.

A further aspect of the object of the present invention is to provide a production system which is able, without operator intervention between the samples, to automatically both embed the samples and then to process the underside of the embedded samples, in particular to grind it and, if necessary, to grind it .to be polished.

Another aspect of the object of the present invention is to provide a production system for embedding, grinding and, if necessary, polishing a large number of samples, which is efficient in terms of the required working time of the operator on the one hand and low space requirements in the laboratory and low costs on the other reconciles with each other.

The object of the invention is solved by the subject matter of the independent claims. Preferred embodiments are subject of the dependent claims.

The invention relates to an automatic production line that can carry out both the embedding of the samples and the subsequent surface processing of the embedded samples automatically under program control, in particular without operator intervention, and which can carry out the samples from embedding to completion with a prepared, i.e. ground and possibly polished sample underside run through automatically.

The production line includes an automatic embedding press for embedding and ejecting a plurality of samples consecutively by program and an automatic surface processing apparatus for processing the sample bottom of the plurality of samples consecutively by the embedding press by program. The surface processing device further has a sample-removing position for the embedded samples delivered from the embedding press and a sample depositing position for depositing the surface-processed embedded samples. The underside of the sample is processed as abrasive processing, in particular grinding and/or polishing. The surface treatment device is therefore in particular a grinding and/or polishing device with which the underside of the sample can be ground and/or polished.

At the end of the production line, i.e. after the surface treatment device, there can be a sample collection device for collecting the large number of embedded samples embedded by the embedding press and ground and/or polished by the grinding and/or polishing device, for removal and further use by the operator.

The samples embedded and ejected by the embedding press are automatically conveyed one after the other by a first conveying device to the sample-removal position of the grinding and/or polishing device. The embedded samples ground and/or polished by the grinding and/or polishing device can optionally be conveyed from the sample deposit position into the sample collection device by means of a second conveying device. Accordingly, the embedded samples are automatically fed to the grinding and/or polishing device and/or automatically removed from it again.

The embedding press and the grinding and/or polishing device are automatically controlled by program controls, so that the embedding press and the grinding and/or polishing device can both embed and grind and/or polish a large number of samples consecutively under program control.

With the production line, a large number of samples can advantageously be embedded, ground and, if necessary, polished in one go under program control and without operator intervention, which represents an enormous increase in efficiency compared to conventional devices.

The samples are preferably not only embedded individually, but the embedded samples are further processed individually in the entire production line and in particular without a sample holder. In particular, the first and/or second conveying device convey the embedded samples individually and loosely. Furthermore, the embedded samples are individually ground and/or polished in the grinding and/or polishing device and/or are individually placed in the sample storage position after grinding and/or polishing and/or the embedded ground and possibly polished samples lie after the run individually and loosely in the sample collection through the production line leinrichtung, such as a magazine with a variety of storage locations for each embedded ground and possibly polished sample ready for removal by the operator. From there, the embedded samples that are ready in the sample collection device can be used directly, for example, in an analysis device such as a hardness tester, a microscope, a macroscope or a similar analysis device, or microstructural analyzes or other metallurgical analyzes can be used, in particular without further surface processing steps on the actual material sample.

This advantageously saves the operator from having to clamp and unclamp several samples, e.g. 6 samples, in a sample holder, which is necessary with many conventional devices, which advantageously simplifies the combined embedding and surface treatment process and increases the efficiency of the manufacturing process of embedded ground and, if necessary, polished samples.

Chutes or motor-driven conveyor belts, for example, can be used to convey the individual, loosely mounted specimens from the mounting press to the grinding and/or polishing device and/or from there to the collection station. Since the embedded specimens continue to move individually through the production line after the embedding press, the conveyor belts, but also the grinding and/or polishing device, can be designed to be relatively compact. The conveyor belts only require a clear conveying width that corresponds to the diameter of a single embedded sample, which can be in the range from 15 mm to 100 mm, preferably in the range from 25 mm to 50 mm.

In particular, the entire production line, including the automatic embedding press and the grinding and/or polishing device, can be constructed so compactly that it can be set up on a laboratory base cabinet. The base area of the production line has a size of preferably at most 800 cm×150 cm, preferably at most 600 cm×120 cm, preferably at most 400 cm×90 cm.

The automatic embedding press preferably comprises a press unit with the press cylinder, a dosing device for dosing in embedding material, e.g. plastic granulate, and a sample loading table with a large number of loading places on which the operator can place a sample to be embedded. In a preparatory work step, the operator can load a large number of loading locations with a sample to be embedded, e.g. several ten samples to be embedded. After this typically only manual preparatory work step, the operator can start the production line using the program control and the production line then automatically embeds one sample after the other, automatically successively conveys one sample embedded in this way after the other to the grinding and/or polishing device and the grinding and/or polishing device automatically grinds and, if necessary, polishes successively the specimen underside of the embedded specimens one after the other and conveys the specimens embedded and ground and/or polished in this way to the specimen collection device, preferably as a individual loosely embedded samples without the need for a sample holder.

For embedding the samples, the press cylinder preferably has a lower, first and an upper, second opening. The sample to be embedded is introduced from the respective placement location into the press cylinder, preferably through the lower first opening, and the embedding material is metered into the press cylinder through the upper second opening.

The spatial separation of the introduction of the sample to be embedded and the embedding granules in the press cylinder is structurally advantageous and can contribute to a further increase in efficiency in the automatic, program-controlled embedding of the samples with the press cylinder.

After the embedding process, the embedded sample is preferably moved upwards out of the upper second opening of the pressing cylinder and the pressing unit includes a sample ejector which programmatically ejects the embedded sample from the pressing unit onto the first conveyor.

The automatic sample ejector contributes to the degree of automation of the production line, and the spatial separation of the sample introduction into the press cylinder and the sample ejection of the embedded sample from the press cylinder is structurally advantageous for the automatic production line.

After the embedding process, the plunger preferably moves up in the pressure cylinder and, in the process, moves the embedded sample up and out of the pressure cylinder. The sample ejector, which is e.g. designed as a motor-operated slide, can then push the embedded sample from the pressing piston onto the first conveyor device transversely to the axis of the pressing cylinder, i.e. essentially horizontally. The motor drive of the slide can, for example, include an electric motor, a pneumatic or hydraulic drive.

Thereby, the surface adhesion between the embedding material and the press cylinder can be overcome and the routes of the embedded samples can be kept short, which can contribute to the compactness and constructive simplicity of the production line.

• eine Schleifstation mit einem Schleifteller und einer Schleifscheibe zum Schleifen der Probenunterseite und eine Polierstation mit einem Polierteller zum Polieren der Probenunterseite. Bevorzugt ist das Oberflächenbearbeitungsgerät also ein kombiniertes Schleif-und Poliergerät mit entsprechenden Schleif- und Polierstationen. Vorzugsweise sind sogar mehrere Schleifstationen und ggf. mehrere Polierstationen in ein- und demselben Gerät vorhanden, so dass alle erforderlichen Schleifvorgänge mit unterschiedlichen Körnungen und alle erforderlichen Poliervorgänge ggf. mit unterschiedlichen Poliersuspensionen in ein- und demselben Gerät durchgeführt werden können. Jede Schleifstation weist vorzugsweise eine eigene Schleifwanne, einen eigenen Schleifteller und eine eigene auf dem zugehörigen Schleifteller aufgebrachte Schleifscheibe auf und jede Polierstation weist vorzugsweise eine eigene Polierwanne und einen eigenen Polierteller ggf. mit einer Polierscheibe, welche auch ein Poliertuch umfassen kann.

The surface treatment device, which is preferably a grinding and polishing device for surface grinding and polishing the specimen underside of the embedded specimens, preferably has the following:

• a grinding station with a grinding plate and a grinding wheel for grinding the underside of the sample and a polishing station with a polishing plate for polishing the underside of the sample. The surface treatment device is therefore preferably a combined grinding and polishing device with corresponding grinding and polishing stations. Preferably there are even several grinding stations and possibly several polishing stations in one and the same device, so that all necessary grinding processes with different grits and all necessary polishing processes, if necessary with different polishing suspensions, can be carried out in one and the same device. Each grinding station preferably has its own grinding trough, its own grinding plate and its own grinding wheel applied to the associated grinding plate, and each polishing station preferably has its own polishing trough and its own polishing plate, if necessary with a polishing wheel, which can also include a polishing cloth.

The embedded samples are preferably picked up by a sample gripper from the sample removal position, in that the sample gripper grips a single loosely embedded sample there and then moves it from station to station in order to carry out the respective surface processing steps on the underside of the sample there. In other words, the sample gripper grabs a single sample and then moves it to one of the grinding stations to carry out a first grinding process. The sample gripper can then move the same embedded sample to the next grinding station, e.g. to carry out a grinding process with a finer grit. Subsequently, the sample gripper can move the same sample to a polishing station to perform a polishing operation, etc. Preferably, about 4 to 6 grinding and polishing operations are performed on each sample with different grinding and polishing media, with each grinding and polishing operation being performed at a separate station .

This has the advantage that replacing the grinding wheels and/or polishing wheels between the grinding and/or polishing operations, ie during the ongoing process, can be avoided unless the grinding wheels have to be replaced due to wear. This enables high efficiency of the grinding and polishing process.

If necessary, the grinding and/or polishing device can also include a cleaning container and the sample gripper moves the embedded samples into a cleaning station after each grinding and polishing process in order to rinse off and clean the embedded sample.

After all desired grinding and polishing processes and, if necessary, cleaning processes have been carried out, the grinding/polishing head moves the sample with the sample gripper to the sample storage position and the sample gripper places the sample there.

As already stated, the embedded samples are also processed individually and preferably loosely in the grinding and/or polishing device, i.e. the sample gripper is prepared to grip an embedded sample individually without a sample holder, and the individual sample gripped in this way by the grinding station to drive to the grinding station, from grinding station to polishing station and from polishing station to polishing station, if necessary with the interposition of the cleaning stations, through all grinding and polishing processes and, if necessary, cleaning processes.

In this way, on the one hand, a clamping and unclamping of the specimens into and out of a specimen holder can be avoided. On the other hand, the handling of individual specimens and the omission of multiple specimen holders for the interim storage of the embedded specimens between the embedding press and the grinding and polishing device and for final storage in the specimen collection device and for transport on the conveyor belts contribute to space savings. In addition, however, the grinding stations, the polishing stations and/or the cleaning stations can also be designed to be small in size, which synergistically contributes to the compactness and cost savings of the production line. Previous antipodes in the production of embedded samples, namely a high degree of automation and high efficiency on the one hand and low space requirements and low costs on the other hand, can be reconciled with one another.

The grinding/polishing head preferably has a drive shaft which is driven in rotation by a motor. The sample gripper is arranged on the drive shaft so that the sample gripper rotates about an axis of rotation. If during the grinding and polishing operations, in addition to the rotation of the grinding wheel or rotates to the rotation or vibration of the polishing wheel, a high-quality grinding or polishing result can be achieved. The axis of symmetry of the sample preferably runs coaxially to the axis of rotation of the sample gripper when the embedded sample is gripped by the sample gripper, so that the embedded sample rotates about its axis of symmetry.

As part of the automatic production line, it is advantageous if the same grinding and/or polishing device has at least two or more grinding stations, e.g. 2, 3, 4, 5, 6, 7, 8 or more grinding stations, each with its own grinding plate and grinding wheel . In this way, different grinding wheels with different grit sizes can be kept available at the different grinding stations, so that for grinding the underside of the sample with several different grit sizes, e.g. with 2, 3, 4, 5, 6, 7, 8 or more different grit sizes, in particular with all grit sizes with where the embedded specimens are ground, no grinding wheels need to be changed. All grinding wheels with different grit sizes required for grinding a production run of embedded samples, e.g. several ten samples, are mounted in the various grinding stations at the same time, so that the grinding wheels do not have to be changed between the grinding processes of the embedded samples, but the samples one after the other be moved from grinding station to grinding station without changing the grinding wheels in between. In other words, one and the same grinding and/or polishing device includes at least so many grinding stations that there is a separate grinding station for each grit and all of these grinding stations belong to the same grinding and/or polishing device or can be approached with the same sample gripper.

The same can apply to the polishing stations, of which at least one, but preferably at least two or more, e.g. 2, 3, 4 or more polishing stations are present in the grinding and polishing device. Each polishing station can be assigned to a specific polishing agent, e.g. a specific polishing suspension. This may avoid changing the polishing pads or cleaning the polishing stations completely between samples. Here, too, preferably all the polishing agents required for grinding a production run of embedded samples, e.g. several tens of samples, are available at the same time in different polishing stations, so that during the polishing of the large number of embedded samples, the polishing wheels and/or polishing suspensions do not have to be changed, but rather the samples be moved one after the other from polishing station to polishing station without having to change the polishing wheels and/or polishing suspensions in between. In other words, one and the same grinding and polishing device includes at least so many polishing stations that there is a separate polishing station for each polishing wheel or polishing suspension and all of these polishing stations belong to the same grinding and polishing device or can be approached with the same sample gripper.

This means in particular that all grinding stations with the grinding wheels required for an embedded sample and all polishing cloths and/or polishing suspensions required for the same sample belong to the same grinding and polishing device or can be approached with the same sample gripper. Each embedded sample is therefore gripped once by the sample gripper and then all required grinding stations (e.g. 2, 3, 4, 5, 6, 7, 8 or more) and/or all required polishing stations (e.g. 1, 2 , 3, 4 or more) in order to carry out the respective grinding and/or polishing processes there with different grits and possibly different polishing cloths and/or polishing suspensions, with the embedded sample remaining gripped by the sample gripper during all grinding and/or polishing processes .

The grinding and/or polishing device can also contain at least one cleaning container, preferably two or more cleaning containers, which are approached by the grinding/polishing head or the sample gripper and in which the embedded sample gripped in each case before, between and/or after the Grinding and polishing processes is immersed in order to clean them.

1. a) Bereitstellen einer Vielzahl von einzubettenden Proben an einer Einbettpresse in einem vorbereitenden Schritt, ggf. durch manuelles Ablegen der Proben auf jeweils einem Bestückungsplatz eines Probenbestückungstisches durch den Bediener,
2. b) Pressen der ersten der einzubettenden Proben mit Einbettmaterial in einem Presszylinder der Einbettpresse zum Herstellen der ersten eingebetteten Probe,
3. c) Auswerfen der ersten eingebetteten Probe aus dem Presszylinder,
4. d) Fördern der ersten eingebetteten Probe von der Einbettpresse zu einem Oberflächenbearbeitungsgerät,
5. e) Greifen der ersten eingebetteten Probe mit einem Probengreifer des Oberflächenbearbeitungsgeräts und zwar einzeln,
6. f) Anfahren zumindest einer, vorzugsweise konsekutiv mehrerer Oberflächen-Bearbeitungsstationen, z.B. einer oder mehrerer Schleifstationen und/oder einer oder mehrerer Polierstationen desselben Oberflächenbearbeitungsgeräts, mit demselben Probengreifer zum vorzugsweise konsekutiv mehrfachen Bearbeiten der Probenunterseite der ersten eingebetteten Probe in der bzw. den verschiedenen Oberflächen-Bearbeitungsstationen mit unterschiedlichem Schleif- und/oder Poliermittel,
7. g) Anfahren einer Probenablageposition mit dem Probengreifer und Ablegen der ersten eingebetteten Probe an der Probenablageposition,
8. h) vielfaches Wiederholen der Schritte b) bis d) und e) bis g) zum automatischen Herstellen einer Vielzahl von eingebetteten Proben mit einer oberflächenbearbeiteten Probenunterseite, wobei alle fertigen eingebetteten mit einer oberflächenbearbeiteten Probenunterseite automatisch einzeln einer Probensammeleinrichtung zugeführt werden, um dort zur Entnahme durch den Bediener bereit zu liegen. Dabei werden die Schritte b) bis h) automatisch programmgesteuert durchgeführt und zwar automatisch nacheinander für alle Proben, insbesondere ohne dass zwischendurch ein Bedienereingriff notwendig ist. Die Wiederholungszyklen der Schritte b) bis d) und e) bis g) können dabei unabhängig voneinander oder synchronisiert sein, wobei die eingebetteten Proben zwischen der Einbettpresse und dem Oberflächenbearbeitungsgerät zwischengepuffert werden können. Insbesondere wenn die Wiederholungszyklen der Schritte b) bis d) und e) bis g) unabhängig voneinander sind und die Einbettung einen Vorlauf von mehr als einer eingebetteten Probe haben sollte, werden die eingebetteten Proben zwischen der Einbettpresse und dem Oberflächenbearbeitungsgerät zwischengepuffert.

One aspect of the invention relates to an automatic method for producing a large number of embedded samples with a ground and/or polished underside of the sample, in particular with the production line described above, with the following steps, optionally with the interposition of further steps:

1. a) Provision of a large number of samples to be embedded on an embedding press in a preparatory step, if necessary by the operator manually depositing the samples on a loading station of a sample loading table,
2. b) pressing the first of the samples to be embedded with embedding material in a press cylinder of the embedding press to produce the first embedded sample,
3. c) ejecting the first embedded sample from the press cylinder,
4. d) conveying the first mounted sample from the mounting press to a surface preparation device,
5. e) gripping the first embedded sample individually with a sample gripper of the surface treatment device,
6. f) Approaching at least one, preferably consecutively several surface processing stations, eg one or more grinding stations and/or one or more polishing stations of the same surface processing device, with the same sample gripper for preferably consecutive multiple processing of the sample underside of the first embedded sample in the or the different surface Processing stations with different grinding and/or polishing agents,
7. g) moving to a sample storage position with the sample gripper and depositing the first embedded sample at the sample storage position,
8. h) Repeating steps b) to d) and e) to g) multiple times to automatically produce a large number of embedded samples with a surface-processed underside of the sample, all finished embedded samples with a surface-processed underside of the sample being automatically fed individually to a sample collection device in order to be removed there by ready to lie to the operator. In this case, steps b) to h) are carried out automatically under program control, namely automatically one after the other for all samples, in particular without operator intervention being necessary in between. The repetition cycles of steps b) to d) and e) to g) can be independent of one another or synchronized, with the embedded samples being able to be temporarily buffered between the embedding press and the surface treatment device. In particular, if the repetition cycles of steps b) to d) and e) to g) are independent of one another and the embedding should have a lead time of more than one embedded sample, the embedded samples are temporarily buffered between the embedding press and the surface treatment device.

After the grinding and/or polishing processes, the sample gripper preferably also moves to a cleaning container under program control and dips the embedded sample gripped by the sample gripper into the cleaning container in order to rinse off or clean the embedded sample.

Embodiments of the embedding press, the grinding and/or polishing device and the associated methods are described in even more detail below.

Automatic embedding press

The disclosure further relates to an embedding press for embedding specimens in embedding material. The diameter of such embedded samples can be in a range of 20 mm to 60 mm, for example, in order to be able to handle small pieces of metal for carrying out material tests such as hardness tests or structure analyzes and the corresponding preparation steps better.

The embedding press comprises a pressing unit with a sample receiving position for a sample to be embedded and a press cylinder in which the sample is pressed with e.g is. A piston rod, for example, which is driven by a spindle drive or hydraulically, can be used as the piston drive. The press cylinder is preferably heated in order to carry out the embedding process at high temperature, in particular to melt the plastic embedding material, which can take place, for example, in the range between 100°C and 300°C. The press cylinder can also be cooled in order to achieve faster cooling.

Furthermore, the embedding press includes a metering device for metering the embedding material into the press cylinder. When dosing the embedding material, the sample to be embedded lies loosely on the piston in the press cylinder and the embedding material is trickled down onto the sample and the piston as embedding granules, in particular plastic granules. The dosing device can be connected to one or more storage containers from which the embedding granules are conveyed into the dosing device, e.g. each with a screw conveyor.

The embedding press also includes a specimen placement table with a large number of placement locations on which the operator can place a specimen to be embedded, i.e. a specimen intended for embedding. The sample loading table can be, for example, a rotary indexing table with a large number of loading places on its outer circumference.

• Taktschritt a): Die Steuereinrichtung steuert den Probenbestückungstisch an, so dass dieser einen der Bestückungsplätze mit einer der einzubettenden Proben an die Probenaufnahmeposition der Presseinheit fährt.
• Taktschritt b): Nachfolgend steuert die Steuereinrichtung die Presseinheit dahingehend, dass diejenige einzubettende Probe, deren Bestückungsplatz im Taktschritt a) an die Probenaufnahmeposition gefahren wurde, automatisch aus der Probenaufnahmeposition in den Presszylinder eingeführt wird. Ferner steuert die Steuereinrichtung die Dosiereinrichtung dahingehend, dass automatisch das Einbettmaterial in den Presszylinder auf die einzubettende Probe eindosiert wird.
• Taktschritt c): Nachfolgend steuert die Steuereinrichtung die Presseinheit dahingehend, dass der Einbettpressvorgang unter Druck und ggf. erhöhter Temperatur durchgeführt wird, um eine eingebettete Probe herzustellen.
• Taktschritt d): Nachfolgend steuert die Steuereinrichtung die Presseinheit dahingehend, dass die im Taktschritt c) hergestellte eingebettete Probe aus dem Presszylinder ausgeworfen wird.

Furthermore, a control device is included, which automatically controls the embedding press under program control, specifically preferably at least the sample loading table, the pressing unit and the dosing device in such a way that a large number of embedding processes can be carried out fully automatically one after the other without intermediate operator intervention, in particular after the sample loading table has been fitted with a large number of samples to be embedded. For this purpose, the control device is designed to automatically control the embedding press in a large number of clock cycles, each of which has the following clock steps:

• Cycle step a): The control device controls the sample loading table so that it moves one of the loading locations with one of the samples to be embedded to the sample receiving position of the pressing unit.
• Cycle step b): The control device then controls the pressing unit such that the sample to be embedded whose placement location was moved to the sample receiving position in cycle step a) is automatically introduced from the sample receiving position into the pressing cylinder. Furthermore, the control device controls the dosing device in such a way that the embedding material is automatically dosed into the press cylinder onto the sample to be embedded.
• Cycle step c): The control device then controls the pressing unit in such a way that the embedding pressing process is carried out under pressure and, if necessary, at elevated temperature in order to produce an embedded sample.
• Cycle step d): The control device then controls the pressing unit in such a way that the embedded sample produced in cycle step c) is ejected from the press cylinder.

The control device then controls the embedding press in such a way that the clock cycle with the clock steps a) to d) is automatically repeated until all the samples that were placed on the placement locations have been embedded. In this case, the sample loading table is controlled by the control device in such a way that it advances one loading location with each clock cycle. If necessary, a control device can be provided which, before the program-controlled insertion of the sample to be embedded into the press cylinder, checks whether the loading location that is currently located at the sample receiving position is actually loaded. If not, the control device can automatically control the sample loading table such that clock steps b) to d) are omitted for this clock cycle and the next loading station is moved to the sample receiving position. When all specimens have been embedded, the control device can switch off the embedding press automatically, e.g. when as many clock cycles have been processed as there are placement locations.

In the case of the embedding press, the operator only needs to load the sample loading table with a large number of samples, e.g. If necessary, this can still be done manually, but does not require any waiting time and can therefore be completed relatively quickly in one go. The operator then starts the control program of the control device, which then automatically executes a large number of the clock cycles described above in order to automatically embed one sample after the other without operator intervention. In such embedding processes, each clock cycle requires a certain amount of time, e.g. around 15 minutes, so that the embedding of e.g. 32 samples in 32 clock cycles can take a total of e.g. 8 hours, i.e. a whole shift. However, no operator intervention is required during the automatic execution of the clock cycles, so that the operator can load the sample loading table and start the control program in the evening, for example, and find all the samples already embedded the next morning. In this way, an enormous saving of qualified working time can be achieved.

According to an exemplary embodiment, the sample loading table is designed as an indexing table, preferably as a rotary indexing table, with the assembly locations being arranged in a peripheral ring area of the rotary indexing table and the rotary indexing table being rotated further by a predefined angular step with each clock cycle in order to move the next assembly location to the sample receiving position.

The press cylinder preferably has a lower first opening and an upper second opening. As a result, the sample can be automatically introduced and the embedding material dosed at the two axially opposite ends of the press cylinder, which has design advantages. The sample is preferably introduced into the press cylinder from below, ie through the lower first opening, and the embedding material is metered into the press cylinder from above, ie through the upper second opening.

The pressing unit preferably has an upper closing slide, and the control device is designed to activate the upper closing slide in such a way that the upper closing slide automatically closes the upper second opening of the press cylinder after the embedding material has been metered in, in order to be able to subsequently carry out the embedding pressing process n, i.e. after bar step b) and before bar step c).

According to a preferred aspect of the disclosure, a piston, which is designed as a compression piston for the compression cylinder, is located in each of the placement locations as a deposit for the sample to be embedded. For this purpose, a recess can be formed in the upper side of the sample loading table at the placement locations, for example, and a lower storage surface can be provided in the recess, e.g. an annular surface as a storage edge with a central opening. The pistons placed in the sample loading table therefore have a dual function, namely they serve on the one hand as a storage area on which the operator places the samples during preparatory loading and on the other hand as a pressing piston for the respective embedding process. The pressing unit preferably has a piston drive, e.g. with a piston rod, with the piston drive or the piston rod being coupled to the piston in the sample receiving position in the sample receiving position in order to lift the piston with the sample to be embedded lying on it out of the placement area and from below, inserted through the lower first opening into the press cylinder, with the respective piston acting as a press piston during the subsequent embedding process. In other words, each sample has its own plunger onto which it is placed in the preliminary mounting step.

The pressing unit preferably has an automatic sample ejector. After the embedding process, the then embedded sample is moved upwards out of the pressing cylinder by the piston drive or the piston rod and the piston, and the control device controls the sample ejector in such a way that the sample ejector automatically ejects the embedded sample, which has been moved upwards out of the pressing cylinder, out of the pressing unit.

Preferably, the sample ejector pushes the embedded sample down radially to the axis of the press cylinder by the piston that is moved up, in order to eject the embedded sample. For this purpose, the piston preferably moves up so far that the embedded sample is completely moved out of the press cylinder, but the piston is still radially secured in order to be able to overcome any adhesion between the embedding material and the piston surface.

After the sample has been ejected, the control device controls the embedding press in such a way that the piston drive or the piston rod with the piston moves down again and the empty piston is placed back in the loading space of the sample loading table before the next loading space with the next piston and the next Sample is moved to the sample pickup position to begin the next clock cycle.

The embedding press has an insertion opening for the specimen loading table in the lower area. In the case of a rotary indexing table, the insertion opening is preferably U-shaped, in that the embedding press has a laterally open recess under the press cylinder. In the case of a linear sample mounting table, the insertion opening can also be formed as a through opening through which the linear sample mounting table is pushed. The sample loading table can move at least partially in the recess of the embedding press and cyclically introduce the loading locations with the samples to be embedded into the laterally open recess in order to move one sample to be embedded after the other under the press cylinder.

According to a preferred embodiment, the embedding press comprises at least a first and a second storage container for storing different first and second embedding material. Both reservoirs are connected to the dosing device, so that the dosing device can dose embedding material from both the first and the second reservoir into the press cylinder, and the dosing of the first and second embedding material is controlled by the control device in order to supply the first and/or second embedding material, preferably one after the other, in each case automatically dosed in a predefined quantity into the press cylinder. In this way, a two-layer embedding can be produced without operator intervention, e.g. in the lower area from a higher-quality embedding material and in the upper area from a more economical embedding material. The embedding material can be introduced into the metering lock from the first and/or second storage container, e.g. by means of a first and/or second screw conveyor. The storage containers with the embedding material are preferably each equipped with an automatic filling level monitor that communicates with the control device. If there is no more embedding material in one of the storage containers, an associated level sensor reports this status to the control device, which in response stops the machine and preferably issues an error message (e.g. no embedding granules in the container) to the operator via a display and, if necessary, also a red signal light turns on.

• Taktschritt a): Einer der Bestückungsplätze wird mit der zuvor darauf abgelegten einzubettenden Probe programmgesteuert an eine Probenaufnahmeposition einer Presseinheit gefahren.
• Taktschritt b) Die Probe aus Schritt a) wird programmgesteuert von dem Bestückungsplatz an der Probenaufnahmeposition in einen Presszylinder der Presseinheit eingeschoben und es wird programmgesteuert Einbettmaterial in den Presszylinder eindosiert.
• Taktschritt c): Das Einbettmaterial und die Probe werden programmgesteuert in dem Presszylinder gepresst, um eine eingebettete Probe herzustellen.
• Taktschritt d): Die eingebettete Probe wird programmgesteuert aus dem Presszylinder ausgeworfen.

One aspect of the disclosure relates to a method for embedding a plurality of samples in Embedding material with an embedding press, in which case a sample loading table, which has a large number of loading places, is loaded with a large number of samples to be embedded in a preparatory step, if necessary manually. After the sample loading table has been loaded with the large number of samples to be embedded, the samples are automatically embedded one after the other under program control in clock cycles with the following clock steps:

• Cycle step a): One of the placement locations, with the sample to be embedded previously placed thereon, is moved under program control to a sample receiving position of a pressing unit.
• Cycle step b) The sample from step a) is pushed under program control from the loading station at the sample receiving position into a press cylinder of the press unit and embedding material is metered into the press cylinder under program control.
• Cycle step c): The embedding material and the sample are program-controlled pressed in the press cylinder in order to produce an embedded sample.
• Step d): The embedded sample is ejected from the press cylinder under program control.

The clock cycle with steps a) to d) is repeated under program control until a large number of samples are embedded.

The samples are preferably introduced into the press cylinder from below and the embedding material is metered into the press cylinder from above.

Preferably, after the embedding material has been metered in, the press cylinder is automatically closed at its upper end under program control in order to then automatically carry out the embedding press process under program control.

In the preparatory fitting step, the samples to be embedded are preferably each placed on a separate piston at the fitting locations, with the piston acting as a pressing piston in the pressing cylinder during the subsequent embedding process. In cycle step b), the respective sample is pushed axially from below into the press cylinder together with its own plunger, e.g. by coupling a piston rod under the press cylinder to the respective plunger and pushing the respective plunger with the respective sample upwards into the press cylinder.

After cycle step c), the piston with the now embedded sample is moved upwards, with the embedded sample being moved out of the press cylinder in order to be pushed down by the sample ejector radially to the axis of the press cylinder from the piston in cycle step d) in order to eject sample.

After clock step d), the empty piston is moved down again and placed back on the loading station before the next loading station with the next piston and the next sample is moved to the sample pickup position to begin the next clock cycle.

Preferably, the sample loading table, controlled by the control device, moves the loading locations with the pistons and the samples to be embedded on them cyclically one after the other under the press cylinder in order to then insert the respective piston with the sample axially into the press cylinder from below. After the embedding process, the piston is moved axially downwards out of the press cylinder and placed back on the loading station before the next loading station with the next piston and the next sample moves under the pressing cylinder in the next cycle to be inserted into the pressing cylinder.

Preferably, at least two different embedding materials are metered into the press cylinder automatically one after the other under program control in order to produce a two-layer embedding.

• einen Presszylinder mit einer vertikalen Achse,
• einen Kolben auf welchen eine einzubettende Probe ablegbar ist, und
• eine Dosiereinrichtung zum Eindosieren des Einbettmaterials in den Presszylinder,
  • wobei der Presszylinder eine untere erste Öffnung und eine obere zweite Öffnung aufweist und die einzubettende Probe mit dem Kolben durch die untere erste Öffnung in den Presszylinder eingeschoben wird und das Einbettmaterial durch die obere zweite Öffnung in den Presszylinder eindosiert wird.

One aspect of the disclosure relates to an embedding press for embedding samples in embedding material, in particular having the features described above

• a press cylinder with a vertical axis,
• a piston on which a sample to be embedded can be placed, and
• a dosing device for dosing the embedding material into the press cylinder,
  • wherein the press cylinder has a lower first opening and an upper second opening and the sample to be embedded is pushed into the press cylinder with the piston through the lower first opening and the embedding material is metered into the press cylinder through the upper second opening.

In fact, it has proved fundamentally advantageous to introduce the sample with its own piston into the press cylinder from one axial side, namely from below, and to dose the embedding material from the other axial side, namely from above. This constructive design can be used together with, but also independently of the other features described above simplify the embedding process, even if it can be a little more complex in terms of construction than inserting the sample and embedding granules from above.

• Einschieben eines Kolbens mit einer zuvor darauf abgelegten einzubettenden Probe in einen Presszylinder durch eine untere erste Öffnung eines Presszylinders,
• Eindosieren des Einbettmaterials durch eine obere zweite Öffnung des Presszylinders auf den Kolben mit der darauf liegenden Probe,
• Schließen der oberen zweiten Öffnung des Presszylinders und Pressen der Probe mit dem Einbettmaterial in dem Presszylinder, und
• Auswerfen der eingebetteten Probe aus dem Presszylinder.

Accordingly, the disclosure also relates to a method for embedding samples in embedding material, in particular with the features described above, with the following steps:

• Inserting a piston with a sample to be embedded previously placed thereon into a press cylinder through a lower first opening of a press cylinder,
• Metering of the embedding material through an upper second opening of the press cylinder onto the piston with the sample lying on it,
• closing the upper second opening of the press cylinder and pressing the sample with the embedding material in the press cylinder, and
• Ejecting the embedded sample from the press cylinder.

• eine Presseinheit mit einem Presszylinder,
• einen Kolbenantrieb zum Antreiben eines Kolbens zum Durchführen eines Einbettpressvorgangs in dem Presszylinder,
• einen Probenbestückungstisch mit einer Vielzahl von Bestückungsplätzen, und
• vorzugsweise eine Vielzahl von Kolben mit einer Kolbenoberseite und ausgebildet als Presskolben für den Presszylinder,
  • wobei die Kolben jeweils in einem der Bestückungsplätze mit der Kolbenoberseite als Ablagefläche ablegbar sind, derart, dass der Bediener jeweils eine einzubettende Probe auf der Kolbenoberseite ablegen kann,
  • wobei der Kolbenantrieb wechselweise an die Kolben ankoppelbar ist, um eine Vielzahl von Proben in Taktzyklen einzubetten, indem der Kolbenantrieb je Taktzyklus an einen der Kolben ankoppelt, und die jeweils einzubettende Probe für den Einbettpressvorgang mit ihrem eigenen Kolben in den Presszylinder einführt.

A further aspect of the disclosure relates to an embedding press for embedding samples in embedding material, in particular having the features described above

• a press unit with a press cylinder,
• a piston drive for driving a piston for performing an embedding operation in the press cylinder,
• a sample mounting table having a plurality of mounting locations, and
• preferably a large number of pistons with a piston top and designed as a pressing piston for the pressing cylinder,
  • wherein the pistons can each be placed in one of the placement locations with the top of the piston as a storage area, such that the operator can place a sample to be embedded on the top of the piston,
  • wherein the piston drive can be coupled to the pistons alternately in order to embed a large number of samples in clock cycles, in that the piston drive couples to one of the pistons per clock cycle, and the sample to be embedded is introduced into the press cylinder with its own piston for the embedding pressing process.

grinding and/or polishing equipment

The disclosure further relates to an automatic grinding and/or polishing device on a laboratory scale for surface grinding and/or polishing the underside of a sample, in particular an embedded sample. The grinding and/or polishing serves in particular to prepare for test measurements and the embedded specimen, e.g. for hardness test measurements on embedded specimens in particular.

The grinding and/or polishing device includes a device housing in which, for example, drive motors for grinding and/or polishing discs, control devices, etc. can be accommodated and on the top of which troughs can be formed in which the grinding and/or polishing discs can be arranged . Furthermore, the housing can accommodate a machine frame on which a movable device head, often referred to as a grinding/polishing head, can be suspended so that it can move horizontally.

According to one aspect of the disclosure, the device housing contains at least one surface processing station for abrasive processing of the underside of the sample, which is designed in particular as a grinding station or as a polishing station, i.e. a rotating and/or vibrating grinding plate with a grinding wheel for grinding the underside of the sample or a rotating and /or has a vibrating polishing plate for polishing the underside of the sample.

Furthermore, a sample feed with a sample removal position for feeding and preparing the samples for a grinding and/or polishing process is included. The samples are provided individually and loosely, in particular successively sample by sample one after the other. The embedded samples are therefore preferably processed individually and are preferably not clamped in groups in a sample holder. The sample feed can be designed, for example, as a chute or a conveyor belt, by means of which embedded samples automatically slide or are conveyed one after the other to the sample-taking position in order to be able to be taken one after the other.

Furthermore, a sample storage position for storing the samples after the grinding and/or polishing process is included, in which the samples can be stored individually after the end of the grinding and/or polishing process in the grinding and/or polishing station. The sample storage position can, for example, in turn be designed as part of a chute or another conveyor belt, so that the samples also automatically leave the sample storage position one after the other in order to be collected, for example, in a sample collection device. However, it is also possible for the grinding and/or polishing device to have a large number of sample-taking positions and/or a large number of sample depositing positions, with the grinding/polishing head then having one sample-taking position and one sample depositing position each after the other to process all the samples one after the other.

The grinding/polishing head includes a specimen gripper for gripping and manipulating a specimen, preferably a single embedded specimen.

In order to grind and/or polish the embedded sample, the grinding/polishing head with the sample gripper first moves to the sample removal position under program control and the sample gripper preferably grips a single embedded sample there and holds it.

The grinding/polishing head then moves with the sample gripper to the at least one surface processing station under program control and feeds the embedded sample to the at least one surface processing station so that the underside of the sample can be processed abrasively in the surface processing station, in particular ground or polished. The sample gripper holds the individual embedded sample and, if necessary, rotates itself, in addition to the rotation and/or vibration of the grinding wheel or polishing wheel of the abrasive surface processing station.

After grinding or polishing and, if necessary, further surface processing steps, the grinding/polishing head moves with the sample gripper to the sample deposit position under program control in order to feed the individual embedded sample to the sample deposit position and finally releases the embedded sample at the sample deposit position under program control in order to turn it on the sample storage position.

The entire machining process, from gripping the embedded sample to placing it down, runs automatically under program control without the operator having to intervene between the samples.

The grinding and/or polishing device preferably has a displacement device, e.g. with a motor-driven linear slide controlled by the program control, which is e.g. suspended on the machine frame and by means of which the grinding/polishing head is displaced horizontally in order to move between the sample-taking position of the at least a surface processing station and the deposit position.

Furthermore, the grinding/polishing head preferably has a linear displacement device, e.g. with a motor-driven linear slide controlled by the program control, by means of which the sample gripper is moved vertically in order to pick up the embedded sample in the sample removal position, in order to pick up the embedded sample on the at least one surface - Lower the processing station and press against the grinding wheel or polishing wheel and deposit the embedded sample at the sample placement position. This can be implemented with a spindle drive, for example.

Advantageously, the grinding and/or polishing device can handle one embedded sample after the other fully automatically and grind and/or polish the underside thereof so that the operator does not have to intervene during the ongoing grinding and/or polishing process of a large number of successively processed embedded samples needs. The operator can equip the grinding and/or polishing device, e.g. with a desired quantity of embedded samples, the total processing time of which can take several hours, in the evening and the next morning all embedded samples are ready and ready for removal in the sample collection device. For the operator, this means high efficiency and comfort when grinding and/or polishing embedded samples.

Another advantage is the possibility of a compact design, among other things when several different surface treatment stations, e.g. a grinding station and a polishing station or even several grinding stations with different abrasive grains and/or e.g. several polishing stations with different polishing suspensions are installed in the same device housing and are controlled by the same grinding /polishing head are approached one after the other. Preferably, all grinding and polishing stations are built into the same machine and are preferably serviced by the same grinding/polishing head. However, a device could also have two or more grinding/polishing heads, each with a sample gripper, which alternately approach the same surface processing stations in the same device.

Preferably, the sample gripper is designed to grip embedded samples individually without multiple sample holders, specifically automatically under program control, in particular without user intervention.

With regard to sample throughput, it may initially seem counterproductive to handle the embedded samples individually. However, particularly when all grinding and polishing steps are carried out fully automatically one after the other, preferably in the same device, a high sample throughput can still be achieved, namely in particular when the grinding and/or polishing device is used over a longer period of time, e.g. overnight, works fully automatically without user intervention. In particular, high efficiency can be achieved in relation to the ratio of sample throughput to the effective working time of the user.

Furthermore, particularly if the embedded samples are individually and directly gripped by the sample gripper and held during the entire machining process, the embedded samples may not need to be dressed with a grinding stone or planing, which further simplifies the process.

In particular, an advantageous synergy can be achieved from low costs and low space requirements on the one hand, while still having a high working time efficiency and high sample throughput on the other hand, which is an advantageous parameter in laboratory operation, e.g. when preparing embedded samples for hardness testing or microstructure analysis.

The sample gripper can be designed, for example, as a finger gripper with at least three gripping fingers, with the gripping fingers being radially movable and gripping and holding the embedded sample on the peripheral lateral surface of the embedding plastic by the gripping fingers being radially closed. Finger grippers, e.g., three-finger grippers, have been found suitable for gripping single embedded specimens.

Preferably, the gripping fingers each have a horizontal shoulder, so that the shoulders of the gripping fingers act as vertical stops against the upper side of the sample when the sample gripper is lowered, in order to grip the embedded sample as horizontally as possible.

As a result, the embedded sample can advantageously be gripped precisely, which can contribute to the fact that dressing can be omitted if necessary. Furthermore, the shoulders on the sample gripper also form a counter bearing against the contact pressure during grinding and/or polishing, so that the radial gripping force can be kept within acceptable limits and undesired slipping of the embedded sample during grinding and/or polishing can be avoided.

The sample gripper preferably rotates during the grinding and/or polishing process. For this purpose, the grinding/polishing head has a drive shaft which is driven in rotation by a motor and the sample gripper is attached to the lower end of the drive shaft. The rotation of the sample gripper is preferably also activated under program control, in particular for the grinding and/or polishing process under program control, after the embedded sample has been gripped in the sample removal position, and is preferably ended again under program control before the embedded sample is placed in the sample deposit position.

The axis of symmetry of the embedded sample preferably runs coaxially to the axis of rotation of the sample gripper when the embedded sample is gripped by the sample gripper, so that the embedded sample rotates about its axis of symmetry.

As a result, relatively small grinding and/or polishing wheels can be used, which has an advantageous effect on the size of the grinding and/or polishing device and, moreover, the abrasive of the grinding wheels can be used efficiently if necessary. Preferably, the grinding wheels and/or the polishing wheels in the surface treatment stations have a diameter of less than or equal to 300 mm, preferably less than or equal to 250 mm, preferably in the range of 80 mm to 250 mm, preferably in the range of 200 mm +/- 50mm In the case of polishing stations with a horizontally oscillating vibrating plate, the polishing discs can be even smaller, e.g. have a diameter of at least 50 mm, preferably between 50 mm and 200 mm, preferably between 120 mm and 200 mm.

Preferably, the embedded samples are automatically and individually fed to the grinding and/or polishing device in order to be able to be gripped one after the other by the sample gripper. For this purpose, the grinding and/or polishing device preferably has an automatic sample feed, via which the individual embedded samples automatically successively enter the sample removal position. When the sample gripper grabs and removes the embedded specimen currently in the sampling position, the next embedded specimen is automatically tracked to the sampling position and is there ready for the specimen gripper when the grinding and/or polishing process of the previous embedded specimen is completed.

This advantageously contributes to the efficiency of the overall process.

The automatic feeding device can, for example, comprise a chute, in which the embedded samples successively slide independently by gravity in the direction of the sampling position, or a conveyor belt, which automatically successively feeds the embedded samples to the sampling position, with a sample stop possibly defining the sampling position, or a Sample magazine, in which, for example, a variety of embedded samples is used stacked. A separator can be provided in front of the sample-removal position, which separates the embedded samples, and/or the lower part of the chute can be pivoted into the horizontal position to remove the sample, so that the sample can be picked up horizontally by the sample gripper. The separator separates the samples a little from each other and/or prevents further samples from slipping down while the sample to be gripped is being panned and/or gripped. The bottom sample can also be pushed into the sampling position using a sample pusher.

According to a particularly preferred embodiment, the grinding and/or polishing device has a plurality of surface processing stations for processing the underside of the sample, with each of the surface processing stations having its own rotating and/or vibrating grinding disk with a grinding wheel for grinding the underside of the sample or its own rotating and/or or has a vibrating polishing plate for polishing the underside of the sample. In a particularly advantageous manner, the grinding/polishing head with the gripped embedded sample moves to at least two, preferably more than two, e.g. depending on the desired surface, 2 to 10, preferably 3 to 8, preferably 3 to 6 surface processing stations in succession in order to To automatically grind and polish the sample one after the other, and/or to grind it one after the other with different grit sizes and/or to polish it one after the other with different polishing agents. Preferably, the embedded sample does not have to be re-clamped, but is processed with all surface processing steps in one and the same grinding and/or polishing device, or remains on the same grinding/polishing head or sample gripper during all surface processing steps.

This can have advantages in terms of size, workflow efficiency and/or the quality of the result achieved.

The grinding and/or polishing device therefore preferably has at least a first grinding station with a first grinding wheel and a first polishing station with a first polishing wheel. The grinding/polishing head preferably moves with the embedded sample gripped by the sample gripper first to the first grinding station and then, in particular without re-clamping the embedded sample, and preferably with the interposition of a cleaning station, to the first polishing station in order to move the same embedded sample in the same grinding and/or or polishing device to first grind and then polish automatically under program control.

The grinding and/or polishing device preferably has at least two, preferably even more than two grinding stations, each with a grinding wheel, e.g. a first grinding station with a first grinding wheel, a second grinding station with a second grinding wheel, a third grinding station with a third grinding wheel and possibly further grinding stations, each with further grinding wheels, and/or has at least two or more polishing stations, each with a polishing wheel, e.g., a first polishing station with a first polishing wheel and a second polishing station with a second polishing wheel. The grinding/polishing head preferably moves to at least two, three or more grinding stations and/or at least one polishing station, at least two or more polishing stations in succession with the gripped embedded sample without reclamping, in order to automatically process the same embedded sample in the same grinding and/or polishing device program-controlled to grind one after the other with different grit sizes and/or to polish them afterwards, possibly one after the other with different polishing agents.

According to a preferred embodiment, the grinding and/or polishing device has at least one cleaning container or cleaning bath, which is approached in a program-controlled manner by the grinding/polishing head and in which or in which the gripped embedded sample is in front of, between and/or immersed after the grinding and/or polishing operations. The at least one cleaning container preferably has a liquid inlet and/or liquid outlet in order to be able to automatically fill and/or empty the cleaning container under program control.

The grinding and/or polishing device preferably has at least one gas nozzle, in particular on the cleaning container, in order to automatically and programmatically blow dry the gripped embedded sample before, between and/or after the grinding and/or polishing processes. The embedded sample can therefore first be ground by the gripper in a grinding station, then immersed in the cleaning bath to rinse off grinding debris, then blown dry in the cleaning bath above the level of the cleaning liquid and then polished, all program-controlled with the same grinding/polishing head or same sample gripper, in particular without having to grip the embedded sample.

The grinding and/or polishing device preferably has one or more liquid nozzles for metering cooling liquid and/or rinsing liquid, for example water, in order to meter in the cooling liquid and/or rinsing liquid during the grinding process at a grinding station. Furthermore, polishing suspension, for example a diamond particle suspension, can also be metered in via one of the liquid nozzles at a polishing station.

For this purpose, the liquid nozzles for the cooling liquid, rinsing liquid and/or polishing suspension are preferably arranged on the grinding/polishing head in order to move with the grinding/polishing head and thus with the embedded sample from surface processing station to surface processing station, among other things with it several surface treatment stations can be operated with the same or the same liquid nozzles. As a result, the grinding and/or polishing device only needs to have one set of liquid nozzles per grinding/polishing head, regardless of the number of surface treatment stations. At least two liquid nozzles are preferably arranged on the grinding/polishing head, namely at least one liquid nozzle for cooling and rinsing liquid for the grinding process and at least one liquid nozzle for polishing suspension for the polishing process, so that cooling and/or Rinsing liquid and polishing suspension at the polishing stations can be dosed automatically under program control. However, more than two liquid nozzles can also be provided, e.g. for several different cooling and rinsing liquids, in particular for different polishing suspensions.

According to one possible embodiment, the surface processing stations and, if applicable, the at least one cleaning container are arranged along a linear arrangement in the grinding and/or polishing device. The grinding/polishing head is preferably suspended in a linearly displaceable manner along this linear arrangement by means of a linear guide in order to be able to approach the various surface processing stations one after the other by moving the grinding/polishing head along the linear guide over the surface processing stations and, if necessary, the cleaning container and automatically stops at the respective station under program control and lowers the embedded sample with the gripper, e.g. for grinding onto the grinding wheel in the grinding station, for cleaning into the cleaning bath and/or for polishing onto the polishing wheel in the polishing station. Such a linear arrangement can be advantageous in terms of space requirements in the laboratory.

In order to further make good use of the space available in a laboratory, the surface processing stations and the at least one cleaning container, if applicable, can also be arranged in a two-dimensional arrangement in the horizontal plane. For example, 2 grinding stations and 2 polishing stations can be arranged in a 2x2 arrangement, 3 grinding stations and 2 polishing stations in a 3x2 arrangement or even more surface treatment stations. The cleaning tank or tanks are preferably also arranged between the grinding and/or polishing stations, optionally offset laterally. Such arrangements can have advantages with regard to the paths when approaching the surface processing stations and the cleaning containers, if applicable, which can be beneficial to the process speed. In a two-dimensional arrangement, the grinding/polishing head is also independently suspended in two dimensions, i.e. e.g. independently displaceable in the x-direction and in the y-direction, in order to be able to approach all points in the horizontal plane. This can be achieved, for example, by means of a portal arrangement, similar to a container crane, in order to be able to approach all surface processing stations and the cleaning container(s) in the two dimensions of the x-direction and the y-direction. For this purpose, the grinding/polishing head can be suspended from a U-shaped bridge, for example, and the grinding/polishing head is suspended from the bridge so that it can be displaced in a linear direction x or y. The bridge itself stands on linear guides, which enable the bridge to be moved in the other linear direction y or x.

The housing of the grinding and/or polishing device preferably has a safety enclosure, e.g. in the form of a protective grille, in which all moving parts, such as the gripper, the grinding/polishing head and/or all grinding and/or polishing stations are housed. to avoid the risk of injury. The safety housing can be open at the front, with the front opening being secured against intervention by a light barrier, e.g. to access the sample gripper, a grinding station, a polishing station or a cleaning tank.

In order to move the sample gripper vertically, the grinding/polishing head preferably has a vertical linear slide on which the sample gripper and/or the motor for driving the sample gripper in rotation is suspended for longitudinal displacement in the z-direction (perpendicular to the table plane). The vertical linear slide can, for example, have a spindle drive for moving the sample gripper vertically. This enables the sample gripper to be moved vertically and rotated at the same time, so that the sample gripper automatically per program-controlled i) with the grinding/polishing head the sample removal position(s), the grinding station(s), the polishing station(s), the cleaning container(s) and/or the sample storage position(s), ii) there for picking up and gripping the embedded sample is lowered for grinding, polishing, rinsing and/or depositing the embedded sample and iii) rotates for example during grinding, polishing and/or rinsing and iv) is then raised again before the next process step. Each embedded sample is preferably individually and successively gripped by the sample gripper from being fed into the grinding and/or polishing device to the finish ground, polished and cleaned embedded sample. with several polishing steps and, if necessary, through the cleaning process, if necessary with several cleaning steps, in particular in one and the same device. Nevertheless, the grinding and/or polishing device can be built in a relatively compact manner, if necessary even as a table-top device. The embedded sample which has been ground, polished and cleaned can then be subjected directly, for example to a hardness test measurement using a hardness tester, for example a hardness tester from the Applicant's Q series, or a microstructure analysis can be carried out.

Preferably, the embedded specimens are loosely present as individual embedded specimens at the specimen removal position and do not need to be manually clamped in special specimen holders, in particular for multiple embedded specimens. Furthermore, it is also advantageous if the same grinding and/or polishing head with the same sample gripper, in particular automatically under program control, can approach several grinding stations and/or several polishing stations, if necessary with different abrasives and/or polishing agents, without the embedded sample having to be re-clamped .

For grinding and/or polishing the embedded sample, it is advantageous if the grinding/polishing head has a force sensor which measures the pressure force of the sample gripper with the embedded sample on the grinding wheel or polishing wheel, and a control circuit which measures the pressure force of the embedded sample adjusted to a predetermined value by means of the drive, preferably a spindle drive, of the vertical linear slide.

More preferably, the distance covered by the sample gripper vertically (z-direction) is measured. For this purpose, the grinding/polishing head preferably has an odometer, by means of which the linear travel of the sample gripper or its vertical linear carriage is measured in the z-direction. This means that, for example, during the grinding process, a layer thickness that can be set by the operator can be automatically removed under program control. For this purpose, the vertical linear slide places the embedded sample against the grinding wheel until contact with the grinding wheel is detected by the force sensor and stored as the zero position for the displacement path. The grinding of the embedded sample then continues automatically under program control until the value for the grinding thickness previously set by the operator in the program control is reached. The zero point for grinding off a predetermined layer thickness can accordingly be determined by means of the force sensor.

• a) Anfahren einer Probenentnahmeposition mit dem Schleif-/Polierkopf sowie Absenken des Probengreifers und Greifen einer insbesondere losen einzelnen eingebetteten Probe mit dem Probengreifer in der Probenentnahmeposition,
• b) Anfahren einer Schleifstation, sowie Absenken des Probengreifers mit der Probe und Andrücken der Probe mit einer vordefinierten Andruckkraft auf eine rotierende Schleifscheibe der Schleifstation, insbesondere unter Rotation des Probengreifers, ggf. unter Zudosierung von Kühlflüssigkeit, sowie Anheben des Probegreifers mit der Probe,
• c) ggf. Anfahren und Eintauchen der von dem Probengreifer gegriffenen Probe in einen Reinigungsbehälter (Probenbad) sowie Anheben der Probe aus dem Reinigungsbehälter und ggf. Trockenblasen der Probe,
• d) ggf. Wiederholung des Schrittes b), aber an einer anderen Schleifstation insbesondere mit einer anderen Schleifscheibe als im Schritt b),
• e) ggf. Wiederholung des Schrittes c), wobei die Schrittfolge d) und/oder e) ggf. noch weitere Male, insbesondere an anderen Schleifstation mit anderen Schleifscheiben wiederholt wird,
• f) Anfahren einer Polierstation, sowie Absenken des Probengreifers mit der Probe und Andrücken der Probe mit einer vordefinierten Andruckkraft auf eine Polierscheibe der Polierstation ggf. unter Rotation des Probengreifers, ggf. unter Zudosierung von Poliersuspension, sowie Anheben des Probegreifers mit der Probe,
• g) ggf. Anfahren eines Reinigungsbehälters und Eintauchen der von dem Probengreifer gegriffenen Probe in den Reinigungsbehälter (Probenbad) sowie Anheben der Probe aus dem Reinigungsbehälter und ggf. Trockenblasen der Probe,
• h) ggf. Wiederholung des Schrittes f), aber an einer anderen Polierstation, ggf. mit einem anderen Poliermittel, z.B. unter Zudosierung einer anderen Poliersuspension als im Schritt f),
• i) ggf. Wiederholung des Schrittes g), wobei die Schrittfolge h) und/oder i) ggf. noch weitere Male, insbesondere an anderen Schleifstation mit anderen Poliermitteln, z.B. anderen Poliersuspensionen wiederholt wird,
• h) Anfahren einer Probenablageposition mit dem Schleif-/Polierkopf, sowie Ablegen der Probe mit dem Probengreifer an der Probenablageposition, insbesondere durch Absenken des Probengreifers und Loslassen der Probe mit dem Probengreifer.

The subject of the disclosure is also a method for automatically grinding and/or polishing the underside of, in particular, embedded samples, automatically controlled by a program control, in particular with the grinding and/or polishing device described above, the program control operating the grinding/polishing head with an in automatically controls the sample gripper that can be moved in the z-direction with at least the following steps, in particular without re-clamping the sample:

• a) Approaching a sample-taking position with the grinding/polishing head and lowering the sample gripper and gripping a particularly loose individual embedded sample with the sample gripper in the sample-taking position,
• b) Approaching a grinding station, as well as lowering the sample gripper with the sample and pressing the sample with a predefined pressure force onto a rotating grinding wheel of the grinding station, in particular while rotating the sample gripper, if necessary with the addition of cooling liquid, and lifting the sample gripper with the sample,
• c) If necessary, approach and immerse the sample gripped by the sample gripper in a cleaning container (sample bath) and lift the sample out of the cleaning container and, if necessary, blow dry the sample,
• d) repeat step b), if necessary, but at a different grinding station, in particular with a different grinding wheel than in step b),
• e) repeat step c), if necessary, with the sequence of steps d) and/or e) being repeated further times, if necessary, in particular at other grinding stations with other grinding wheels,
• f) Approaching a polishing station, as well as lowering the sample gripper with the sample and pressing the sample with a predefined pressure force onto a polishing disk of the polishing station, possibly with rotation of the sample gripper, if necessary with dosing of polishing suspension, as well as lifting the sample gripper with the sample,
• g) If necessary, moving to a cleaning container and immersing the sample gripped by the sample gripper in the cleaning container (sample bath) and lifting the sample out of the cleaning container and, if necessary, blowing the sample dry,
• h) if necessary, repeat step f), but at a different polishing station, if necessary with a different polishing agent, e.g. metering in a different polishing suspension than in step f),
• i) repeating step g), if necessary, with the sequence of steps h) and/or i) being repeated a further number of times, in particular at other grinding stations with other polishing agents, e.g. other polishing suspensions,
• h) Approaching a sample storage position with the grinding/polishing head and depositing the sample with the sample gripper at the sample storage position, in particular by lowering the sample gripper and releasing the sample with the sample gripper.

• ein Gerätegehäuse,
• einen Probengreifer zum Greifen einer Probe, wobei der Probengreifer ausgebildet ist, eine einzelne eingebettete Probe zu greifen, und
• zumindest eine oder mehrere der folgenden Stationen oder Kombinationen daraus:
  • eine Schleifstation mit einem Schleifteller und einer Schleifscheibe zum abrasiven Bearbeiten in Form von Schleifen der Probenunterseite der eingebetteten Probe,
  • eine Reinigungsstation zum Reinigen der Probenunterseite der eingebetteten Probe,
  • eine Polierstation mit einem Polierteller zum abrasiven Bearbeiten in Form von Polieren der Probenunterseite der eingebetteten Probe, und/oder
  • eine Ätzstation, zum Ätzen der Probenunterseite der eingebetteten Probe,
  • wobei die eingebettete Probe von dem Probengreifer gegriffen wird und der Probengreifer die gegriffene eingebettete Probe einer oder mehreren der Stationen zuführt, um die Probenunterseite der eingebetteten Probe in der jeweiligen Station zu bearbeiten oder die eingebettete Probe zu reinigen.

The disclosure also relates to a grinding/polishing and/or etching device for processing the underside of an embedded sample, in particular as described above, comprising:

• a device case,
• a specimen gripper for gripping a specimen, the specimen gripper configured to grip a single embedded specimen, and
• at least one or more of the following stations or combinations thereof:
  • a grinding station with a grinding plate and a grinding wheel for abrasive processing in the form of grinding the underside of the embedded sample,
  • a cleaning station for cleaning the underside of the embedded sample,
  • a polishing station with a polishing plate for abrasive processing in the form of polishing the underside of the embedded sample, and/or
  • an etching station for etching the underside of the embedded sample,
  • wherein the embedded specimen is gripped by the specimen gripper and the specimen gripper delivers the gripped embedded specimen to one or more of the stations to process the specimen underside of the embedded specimen in the respective station or to clean the embedded specimen.

The gripping of individual embedded specimens has proven advantageous in terms of an automated workflow. Furthermore, manual clamping in a sample holder and, if necessary, dressing can be omitted. In addition, the device can be built with relatively small dimensions and can be inexpensive.

The invention is explained in more detail below using exemplary embodiments and with reference to the figures, in which identical and similar elements are sometimes provided with the same reference symbols and the features of the various exemplary embodiments can be combined with one another.

character list

• 1 eine dreidimensionale Darstellung der automatischen Einbettpresse,
• 2 einen Querschnitt durch die Einbettpresse aus 1,
• 3 eine dreidimensionale teilweise aufgeschnittene Ansicht der Einbettpresse aus 1,
• 4 eine schematische Schnittdarstellung der Einbettpresse aus 1 im Startzustand,
• 5 wie 4 beim Eindosieren des Einbettgranulats,
• 6 wie 4 beim Einbettpressvorgang,
• 7 wie 4 beim Auswerfen der eingebetteten Probe,
• 8 einen Querschnitt durch eine beispielhaft eingebettete Probe,
• 9 eine dreidimensionale Darstellung eines automatischen Schleif- und Poliergeräts,
• 10 eine Ausschnittvergrößerung der Zuführrutsche aus 9,
• 11 wie 9, aber mit einem Zuführband,
• 12 eine Ausschnittvergrößerung des Zuführbandes aus 11,
• 13 wie 9, aber mit einem vertikalen Zuführmagazin,
• 14 eine Ausschnittsvergrößerung des Zuführmagazins aus 13,
• 15 der Schleif- und Poliergerät aus 9 mit einer Sicherheitseinhausung,
• 16 eine teilweise geschnittene Darstellung einer Schleifstation des Polier- und Schleifgeräts aus 15,
• 17 eine dreidimensionale Darstellung der Schleifstation aus 16,
• 18 einen vertikalen Querschnitt durch ein Reinigungsbad,
• 19 eine dreidimensionale Darstellung des Schleif- und Polierkopfes ohne Gehäuse,
• 20 eine vertikale Querschnittsdarstellung durch den Schleif- und Polierkopf entlang der Schnittlinie A-A in 19,
• 21 eine vertikale Querschnittsdarstellung durch den Schleif- und Polierkopf entlang der Schnittlinie B-B in 19,
• 22 eine dreidimensionale Darstellung eines automatischen Schleif- und Poliergeräts mit Ätzmodul,
• 23 eine dreidimensionale Darstellung des Ätzmoduls aus 22,
• 24 eine dreidimensionale aufgeschnittene Darstellung des Ätzmoduls aus 22,
• 25 ein schematischer Schnitt durch das Ätzmodul aus 22,
• 26 eine dreidimensionale Darstellung einer vollautomatischen Einbett-, Schleif- und Polierstraße auf einem Laborunterschrank,
• 27 eine dreidimensionale Darstellung einer weiteren Ausführungsform der vollautomatischen Einbett-, Schleif- und Polierstraße,
• 28 die Einbett-, Schleif- und Polierstraße aus 27 mit einer Sicherheitseinhausung,
• 29 ein beispielhafter Verfahrensablauf für das Einbetten von Proben mit einer Einbettpresse gemäß den 1 bis 7,
• 30 ein beispielhafter Verfahrensablauf für das Schleifen und Polieren mit einem Schleif-und Poliergerät gemäß den 9 bis 21,
• 31 ein beispielhafter Verfahrensablauf für das Herstellen von eingebetteten Proben mit einer Produktionsstraße gemäß den 26 bis 28.

Show it:

• 1 a three-dimensional representation of the automatic embedding press,
• 2 a cross section through the embedding press 1 ,
• 3 a three-dimensional, partially cutaway view of the embedding press 1 ,
• 4 a schematic sectional view of the embedding press 1 in the starting state,
• 5 how 4 when dosing the embedding granules,
• 6 how 4 during the embedding process,
• 7 how 4 when ejecting the embedded sample,
• 8th a cross-section through an exemplary embedded sample,
• 9 a three-dimensional representation of an automatic grinding and polishing device,
• 10 an enlargement of the feed chute 9 ,
• 11 how 9 , but with a feed belt,
• 12 an enlargement of the infeed conveyor 11 ,
• 13 how 9 , but with a vertical feed magazine,
• 14 an enlargement of a section of the feed magazine 13 ,
• 15 the grinder and polisher 9 with a safety enclosure,
• 16 a partially sectioned representation of a grinding station of the polishing and grinding device 15 ,
• 17 a three-dimensional representation of the grinding station 16 ,
• 18 a vertical cross section through a cleaning bath,
• 19 a three-dimensional representation of the grinding and polishing head without housing,
• 20 a vertical cross-sectional view through the grinding and polishing head along section line AA in 19 ,
• 21 a vertical cross-sectional view through the grinding and polishing head along section line BB in 19 ,
• 22 a three-dimensional representation of an automatic grinding and polishing device with an etching module,
• 23 a three-dimensional representation of the etching module 22 ,
• 24 a three-dimensional cutaway representation of the etching module 22 ,
• 25 shows a schematic section through the etching module 22 ,
• 26 a three-dimensional representation of a fully automatic embedding, grinding and polishing line on a laboratory cabinet,
• 27 a three-dimensional representation of another embodiment of the fully automatic embedding, grinding and polishing line,
• 28 the embedding, grinding and polishing line 27 with a safety enclosure,
• 29 an exemplary procedure for the embedding of samples with an embedding press according to 1 until 7 ,
• 30 an exemplary procedure for grinding and polishing with a grinding and polishing device according to the 9 until 21 ,
• 31 an exemplary process flow for the production of embedded samples with a production line according to 26 until 28 .

Detailed description of the exemplary embodiments

1. Automatic embedding press

Referring to 1 until 7 An example of an automatic mounting press 110 is shown. The embedding press 110 has a housing 112 on which, in this example, there are three reservoirs 114 for plastic granules as embedding material, with different embedding granules being held in stock in the various reservoirs 114 . By means of a dosing device 115, the respectively desired quantity of the different embedding granules can be dosed into the press cylinder in a program-controlled manner without user intervention. For this purpose, the reservoirs 114 are connected via connecting pipes 116 to a common hopper 118 so that the respectively desired embedding granules can be metered from the respective reservoir 114 via the hopper 118 into the press cylinder.

Referring to the 5 the embedding granules 117 are conveyed by dosing screws 120 in the connecting pipes 116 from the respective storage container 114 into the hopper 118, which has a dosing sluice 119 at the outlet.

Referring to 1 and 3 the embedding press 110 has a sample loading table 122 with a large number of loading positions 124, in the present example 32 loading positions 124. In this example, the sample loading table 122 is designed as a rotary indexing table and the loading positions 124 are arranged circumferentially in a peripheral ring area 123 of the sample loading table 112. Each mounting location 124 includes a cylindrical bore 127 in the sample mounting table 122 and a piston 128 in the form of a metal cylinder seated in the bore. The piston 128 rests on a rim 130 at the bottom and can be pushed out of the bore in an upward direction. The pistons 128 are designed as pressing pistons for the heated pressing cylinder 132 of the pressing unit 134 .

In a preparatory work step, the operator equips part or all of the mounting locations 124 with a sample 126 to be embedded, which is 1 is symbolized in each case as a screw cut in half, in that the operator places the samples 126 to be embedded on the piston top 128b of the respective piston 128. For this purpose, the operator places each of the samples 126 to be embedded individually, piece by piece, on one of the placement locations 124 . The pistons 128 lying in the loading locations 124 are countersunk somewhat in the sample loading table 122, which facilitates the positioning of the samples 126 to be embedded when they are placed on the pressing piston 128.

After this manual preparatory work step, the operator can start a program-controlled, fully automatic embedding process for all deposited samples 126 to be embedded. The control device or program control 111 controls the embedding process of the samples 126 along clock cycles. With each clock cycle, the sample loading table 122 moves, under program control, one loading location 124 with the plunger 128 located therein and the sample 126 to be embedded placed thereon into the sample holder meposition 136 of the press unit 134, i.e. under the press cylinder 132.

the 4 until 7 show schematically the clock steps of a clock cycle during hot embedding pressing of one of the samples 126 to be embedded.

In 4 the sample 126 to be embedded, which is placed on its plunger 128 and is intended for embedding, is located in the sample receiving position 136 under the press cylinder 132. A piston drive 138, in the present example in the form of a piston rod, moves upwards, couples to the plunger 128 from below and pushes the plunger 128 through a lower opening 132a of the press cylinder 132 into its cavity 135 . The piston rod 138 can, for example, be part of a hydraulic cylinder or be driven by a motorized spindle, which is not shown in detail in the figures.

Referring to 5 one or more, possibly different, embedding granules 117 are now metered into the cavity 135 onto the sample 126 and the plunger 128 by means of the metering device 115 through an upper opening 132b of the press cylinder 132 . The dosing opening 132b of the press cylinder 132 is then closed with the closing slide 140 by the closing slide 140 being pushed horizontally over the press cylinder 132 .

Referring to 6 the sample 126 is then hot-pressed with the piston rod 138 and the plunger 128 while heating the press cylinder 132 under high pressure between the plunger 128 and the closing slide 140 with the embedding granules 117.

In the present example, two different embedding granules 117 were metered in, first a higher-quality one, which then surrounds the sample 126 on its sample underside and a more economical embedding granulate 117 in the upper area.

After the hot embedding process is complete, the shutter slide 140 is pulled sideways again to open the press cylinder 132 at the top. The plunger 128 is then moved upwards by the plunger drive, with the sample 142 now embedded being moved out of the press cylinder 132 through the upper opening 132b.

Referring to 7 the embedded sample 142 is now automatically pushed to the side by the sample ejector 144 horizontally by the plunger 128, the embedded sample 142 in this example being pushed out of a lateral ejection opening 147 from the pressing unit 134 and reaching a sample chute 148, on which the embedded Sample 142 slips into a collection container 150 ( 1 ). in the in 1 until 7 In the illustrated example of the embedding press 110 , the embedded samples 142 are collected in the collection container 150 .

Subsequently, the piston rod 138 moves the plunger 128 downwards again in order to place the plunger 128 back in its mounting location 124 and the piston rod 138 is uncoupled from the plunger 128 again. For this purpose, the piston rod 138 is locked in the respective pressing piston 128 (not shown), so that the pressing piston 128 cannot become detached from the piston rod 138 when it is pulled out of the pressing mold or the pressing cylinder 132 . The locking is designed in such a way that it can be activated and released via the control device or program control 111 . This is advantageous if the plunger 128 is decoupled from the piston rod 138 when it is placed in the sample loading table 122 and the piston rod 138 is moved a little further down so that the sample loading table 122 places the next sample 126 to be embedded in the pressing unit 134 or under the pressing cylinder 132 can retract.

The cycle for embedding the first sample has now ended and the next clock cycle can begin in the same way, in that the sample loading table 122 moves the next loading station 124 into the sample receiving position 136 under the press cylinder 132 .

In the illustrated example of embedding press 110, sample loading table 122 is designed as a rotary indexing table, which is further rotated by one position with each clock cycle by a drive device 151 clocked by program control 111, in order to then move piston rod 138 to the next pressing piston 128 with sample 126 to be embedded lying on it to dock.

The pressing unit 134 is formed in a generally U-shape in cross section ( 2 , 4 until 6 ) and has an insertion opening 152 under the heated and possibly cooled press cylinder 132. The placement locations 124 with the samples 126 to be embedded and the associated plunger 128 are introduced step by step laterally into the insertion opening 152, which in this example is designed as a laterally open recess. In the present example, this is done by rotating the rotary indexing table by an angular segment corresponding to the distance between the placement locations 124. However, it is also conceivable to use a linear sample placement table 122 in order to rotate the sample placement table 122 with each cycle Continue to cycle position so that the next press ram 128 can be inserted into the press cylinder 132. The insertion opening 152 of the press unit 134 can also be secured against tampering (not shown) if desired.

The embedding press 110 is therefore, apart from the preparatory manual loading step, a fully automatic embedding press 110 in the sense that the embedding press process and the ejection of the samples for a large number of samples 126 to be embedded are carried out consecutively piece by piece fully automatically under program control. In other words, in the preparatory work step, the operator loads the loading stations 124 with all specimens 126 to be embedded, starts the embedding press 110 and from this point in time the embedding process for all specimens 126 to be embedded runs fully automatically, so that the operator can load the embedding press 110 in the evening, for example, and can start and the next morning in the collection container 150 finds all the samples in embedded form. 8th shows a cross section through an example of an embedded sample 142.

• Schritt 404: Bewegen des Probenbestückungstisches 122, wobei einer der Bestückungsplätze 124 mit einem der Pressstempel 128 und der darauf abgelegten einzubettenden Proben 126 in die Probenaufnahmeposition 136 unter dem Presszylinder 132 der Presseinheit 134 gefahren wird.
• Schritt 406: Bewegen des Kolbenantriebs 138 an den Pressstempel 128 und Ankoppeln des Kolbenantriebs 138 an den Pressstempel 128 in dem Bestückungsplatz 124 in der Probenaufnahmeposition 136.
• Schritt 408: Einschieben des Pressstempels 128 mit der darauf abgelegten einzubettenden Probe 126 mittels des Kolbenantriebs 138 von unten in die Kavität 135 des Presszylinders 132.
• Schritt 410: Eindosieren eines oder mehrerer Einbettgranulate 117 durch eine obere Öffnung 132b in den Presszylinder 132 auf den Pressstempel 128 und die darauf abgelegte einzubettende Probe 126.
• Schritt 412: Schließen der oberen Öffnung 132b des Presszylinders 132.
• Schritt 414: Heißpressen der Probe mit dem Einbettgranulat 117 unter Druck und Temperaturbeaufschlagung in dem Presszylinder 132.
• Schritt 416: Öffnen des Presszylinders 132.
• Schritt 418: Herausfahren der eingebetteten Probe 142 aus dem Presszylinder 132.
• Schritt 420: Auswerfen der eingebetteten Probe 142 aus der Presseinheit 134.
• Schritt 422: Herausziehen des Pressstempels 128 aus der Kavität 135 des Presszylinders 132 und Ablegen des Pressstempels 128 auf einem Ablageplatz, insbesondere auf dem Bestückungsplatz 124 aus Schritt 406.
• Schritt 424: Abkoppeln des Kolbenantriebes 138 von dem Presskolben 128.

Referring to 29 includes an embodiment of the embedding process initially in a preparatory process step by an operator, namely the loading of a sample loading table with a large number of samples to be embedded in a step 402 and then the execution of clock cycles, each with the following program-controlled process steps:

• Step 404: Moving the sample loading table 122, one of the loading locations 124 with one of the press dies 128 and the samples 126 to be embedded placed thereon being moved into the sample receiving position 136 under the press cylinder 132 of the press unit 134.
• Step 406: Moving the piston drive 138 to the ram 128 and coupling the piston drive 138 to the ram 128 in the loading place 124 in the sample receiving position 136.
• Step 408: Insertion of the press plunger 128 with the sample 126 to be embedded placed thereon by means of the piston drive 138 from below into the cavity 135 of the press cylinder 132.
• Step 410: Metering one or more embedding granules 117 through an upper opening 132b into the press cylinder 132 onto the press ram 128 and the sample 126 to be embedded placed thereon.
• Step 412: Closing the upper opening 132b of the press cylinder 132.
• Step 414: Hot pressing of the sample with the embedding granules 117 under pressure and temperature in the press cylinder 132.
• Step 416: Opening of the press cylinder 132.
• Step 418: Moving the embedded sample 142 out of the press cylinder 132.
• Step 420: Eject the embedded sample 142 from the pressing unit 134.
• Step 422: Withdrawing the press ram 128 from the cavity 135 of the press cylinder 132 and depositing the press ram 128 on a storage location, in particular on the assembly location 124 from step 406.
• Step 424: Uncoupling the piston drive 138 from the plunger 128.

Programatically repeat the clock cycles multiple times with steps 404-424.

In summary, with the embedding press 110 described above, the embedding process can be carried out fully automatically after the preparatory loading step, without the presence of the operator for all samples 126 to be embedded. The construction is nevertheless relatively simple and inexpensive, so that the investments for the automatic embedding press 110 in can be amortized in a short time.

2. Grinding and polishing machine

Referring to the 9 until 21 an example of a fully automatic grinding and polishing device 210 (grinding and polishing machine) is shown. The automatic grinding and polishing apparatus 210 has a sample feeder 212 for feeding embedded samples 142 to a sampling position 214 one by one. The sample feed 212 can be designed, for example, as a sample chute, as is shown in 9 and 10 shown, or as a motorized conveyor belt with a stop 213 to define the sampling position, as shown in Fig 11 and 12 is shown, or as a sample magazine, as in 13 and 14 is shown. The individual embedded samples 142 can thus be transported, collected or stored in different solutions and can optionally be automatically taken over by an upstream embedding press 110 .

Referring to 9 and 10 the bottom embedded sample 142 can optionally be pushed into the sample removal position 214 by means of a sample pusher 215 . Alternatively, the lowermost part of the sample chute, where the embedded sample 142 is ready for removal, can be made to pivot around the embedded sample 142 for gripping with the sample gripper 222 in a horizontal position. As the embedded specimen 142 to be gripped pivots, the remaining embedded specimens 142 on the specimen chute are preferably retained to prevent them from sliding down. This can be done with a separator, for example. A separator 217 can also be used with a conveyor belt 212 in order to be able to grip the embedded sample 142 lying in the sample removal position 214 better individually.

In accordance with a sample magazine 13 and 14 For example, the bottom sample can also be pushed into the sample removal position 214 using a sample pusher 215 .

What these sample feeders 212 or feed devices have in common is that they successively convey the embedded samples 142 individually, in particular one after the other, into the sample removal position 214, so that the embedded sample 142 lying there can be removed and the next embedded sample 142 is automatically conveyed. Furthermore, regardless of the method of sample delivery, the embedded samples 142 generally lie preferably horizontally in the sample removal position 214 for precise gripping with the sample gripper 222.

The automatic grinder and polisher 210 has a grinder and polisher head 216 which in the present example is suspended from a frame or bridge 218 and is displaceable in the horizontal x-y plane in both horizontal dimensions x and y. For this purpose, the grinding and polishing head 216 can be displaced in the x-direction along the frame 218 and the frame 218 is displaced in the y-direction with a linear guide 220 . Both are motor-driven and program-controlled. The grinding and polishing device 210 shown here can therefore be designed as a portal construction. However, other movement mechanisms for the sample gripper can also be used, for example with a cantilever.

The grinding and polishing head 216 includes a sample gripper 222 configured to grip a single embedded sample 142 without a sample holder. The sample gripper 222 is designed as a three-finger gripper in the present example. The sample gripper 222 has gripping fingers 224 that can be moved radially--three in the present example--which grip the embedded sample 142 on its radially circumferential lateral surface 142c and hold it in place in a non-positive manner. The gripping fingers 224 have a step 226 or an inwardly pointing shoulder, which forms a stop against the sample upper side 142b and ensures that the embedded sample 142 can be gripped by the sample gripper 222 as horizontally as possible.

Referring to 19-21 the sample gripper 222 is arranged at the lower end of a ball-bearing drive shaft 228, which is driven by a drive motor 232 via a belt drive 230, so that the sample gripper 222 can be rotated about its axis of symmetry A during the grinding and polishing processes. The drive motor 232 for rotating the sample gripper 222 is coupled to the belt drive 230 via a gear 244 and a clutch 246 . Furthermore, the grinding and polishing head 216 has a linear slide 234, by means of which the sample gripper 222 can be displaced axially in the z-direction, i.e. vertically, in order to position the gripped embedded sample 142 against the grinding wheels or polishing wheels. The axial displacement of the sample gripper 222 is also automatically program-controlled and motorized by means of a motor 236. In the present example, the drive shaft 228 is designed with two deep holes 252, 254 in order to feed pneumatic gas to the sample gripper 222 and away again, in order to guide it along radial guides 238 to be able to open and close radially. To this end, each gripping finger 224 has a corresponding radial drive slide 238 and can be moved radially inward or outward to grip or release the embedded specimen 142, respectively. However, other drive mechanisms for the gripping fingers 224 to grip the embedded sample 142 are also possible.

Accordingly, the embedded samples 142 do not have to be clamped in a sample holder, since they are gripped and held individually by means of the sample gripper 222, in the present case designed as a three-finger gripper. The sample gripper 222 rotates the gripped embedded sample 142 about the axis of symmetry of the embedded sample 142, which is coaxial with the axis of rotation A of the sample gripper 222. Accordingly, during grinding, both the grinding disc and the gripped embedded sample 142, offset axially, rotate.

The linear travel of the problem gripper 222 in the z-direction is monitored by means of an optical probe 240 and an associated optical tape measure 242, so that a path measuring system 240, 242 for the displacement of the sample gripper 222 in the z-direction is formed.

Furthermore, the grinding and polishing head 216 for the sample gripper 222 has a force sensor 248, by means of which the contact pressure of the embedded sample 142 gripped by the problem gripper 222 against the grinding wheel or polishing wheel can be measured. With the force sensor 248, on the one hand, with a predefined contact pressure be ground and polished, the operator being able to input the desired pressing force into the program control 211 beforehand. The contact point of the embedded sample 142 when moving down onto the grinding wheel can also be detected via the force sensor 248, and a predetermined material removal previously entered by the operator into the program control 211 can then be carried out under program control using the displacement measuring system 240, 242. The grinding and polishing head 216 therefore detects the contact point of the embedded sample 142 on the grinding wheel or polishing wheel, measures the actual contact pressure and/or can measure the axial travel of the sample gripper 222 in the z-direction when grinding the embedded sample 142 by one or more feed back these measured values to the program control 211 in order to regulate the grinding processes and/or polishing processes in relation to the contact pressure force and/or in relation to the layer thickness of the abrasive removal with a control circuit.

In other words, the z-axis of the grinding and polishing head 216 is equipped with a path measuring system 240, 242, which makes it possible to automatically remove a predetermined layer thickness previously set in the program control 211 from the embedded sample 142 (target preparation). The force sensor 248 is used to determine the zero point in the target preparation, by means of which it is detected when the gripped embedded sample 142 touches the respective grinding wheel.

The gas for the pneumatic actuation of the gripper fingers 224 is routed via a rotary feedthrough 250 to the drive spindle 228, through which the pneumatic gas is supplied to the linear slides 238 of the gripper fingers 224 via a gas supply line 252. The pneumatic gas is discharged again via a gas discharge 254 . In this example, the rotary feedthrough 250 is designed as a two-channel rotary feedthrough for the pneumatic drive of the sample gripper 222 .

Referring to the 9 until 12 For example, an exemplary embodiment of the automatic grinding and polishing device 210 has four grinding stations 256, with each grinding station 256 having its own grinding disc 258, sometimes also referred to as a spindle, and a trough 260 in which the respective grinding disc 258 rotates. Abrasive material and/or coolant can be collected in the grinding tub 260 and discharged via a drain.

A grinding wheel 262 is mounted on each grinding plate 258 . Each of the four grinding stations 256 is preferably equipped with a different grinding wheel with a different grit, so that the sample gripper 222 holds the embedded sample 142, once it has been gripped, throughout the grinding process and moves it from grinding station to grinding station in order to successively first coarse and then finer grind. The grinding wheels 262 do not have to be changed between the grinding processes with different grit sizes, since there is a separate grinding station 256 with the corresponding grinding wheel 262 for each desired grit size embedded sample 142 once gripped. Accordingly, the grinding and polishing head 216 first moves to the sample removal position 214, where the sample gripper 222 is lowered and grips a single, loose, embedded sample 142. The sample gripper 222 then moves up again and the grinding and polishing head 216 moves to the first grinding station 256, typically with the coarsest grinding wheel 262. Once there, the sample gripper 222 is lowered in the z-direction until the gripped embedded sample 142 touches the grinding wheel 262, which can be detected with the force sensor 248. Subsequently, the first grinding process is carried out with feedback using a control loop, controlled by force and, if necessary, distance, with simultaneous rotation of the grinding wheel 262 and the sample gripper 222 . When the first grinding process is completed, the sample gripper 222 moves up again. The grinding and polishing head 216 then preferably moves to a cleaning station 268 . There the sample gripper 222 moves down again in this example in order to immerse the gripped embedded sample 142 in a cleaning bath. The sample gripper 222 then moves up again. The grinding and polishing head 216 with the sample gripper 222 then preferably moves to the next grinding station 256 with another grinding wheel 262 with a different grain size, typically finer grain size, and the sample gripper 222 is lowered there again and the next grinding process is carried out, preferably in the same way as described above. In the grinding and polishing device 210 shown here, up to four different grinding stations 256 with corresponding four different grinding wheels 262 can be approached successively, preferably in the same way.

Referring to the 17 In the present example, the grinding and polishing head 216 has liquid nozzles 264, 266. Cooling liquid is metered in via the liquid nozzle 264 during the grinding process in order to perform wet grinding. Advantageously, the liquid nozzles 264, 266 are located on the grinding and polishing head 216 and are therefore used together with the sample gripper 222 and the gripped embedded sample 142 are moved from grinding station 256 to grinding station 256, so that each grinding station 256 does not require its own coolant nozzle. The cooling liquid can be discharged in a known manner via the respective grinding vat 260 together with the grinding debris.

Referring to the 9 , 11 and 18 has the automatic grinding and polishing device 210 two cleaning stations 268 with cleaning containers 269, which are approached by the sample gripper 222 between the grinding processes. For this purpose, after the end of a grinding process, the grinding and polishing head 216 moves to the cleaning container 269, which is filled with a cleaning liquid 270, and immerses the sample in the cleaning liquid 270 in order to rinse and clean it. Water or alcohol, for example, can be used as the cleaning liquid 270 in the cleaning stations 268 . If desired, the sample gripper 222 with the embedded sample 142 can rotate and/or an ultrasonic device 271 can be provided, so that the cleaning station 268 is designed as an ultrasonic bath. The cleaning containers 269 can optionally be automatically emptied and filled with new cleaning liquid.

Air nozzles 272 are mounted radially in the upper area above the cleaning liquid 270 in the cleaning containers 269 and can be used to dry the embedded sample 142 after rinsing or cleaning with cold air and/or warm air. After sufficient cleaning, the sample gripper 222 with the embedded sample 142 moves back up and the embedded sample 142 is blown dry by means of the air nozzles 272 . After the cleaning process in the cleaning station 268, the next grinding station 256 can then be approached by the sample gripper 222.

In the illustrated example, the automated grinder and polisher also includes two polishing stations 276 . The example shown therefore has four grinding stations 256, two cleaning stations 268 and two polishing stations 276. However, it is clear that a different number and/or arrangement of the stations 256, 268, 276 is also possible, e.g. three grinding stations 256, two cleaning stations 268 and three polishing stations 276 or, for example, three grinding stations 256, two cleaning stations 268 and two polishing stations 276, such as in 13 shown, or any other desired number and/or arrangement. The polishing stations 276 each have a polishing plate 278, each of which is arranged in a polishing trough 280 and on which a polishing wheel 282 is fastened in each case, with the polishing wheel 282 also being able to comprise a polishing cloth. When all desired grinding operations have been completed and the embedded sample 142 has been cleaned and rinsed after the last grinding operation, the grinding and polishing head 216 moves with the sample gripper 222 and the gripped embedded sample 142 to the first polishing station 276 in order to take the sample underside 142a with it polish with a first polishing agent. Polishing suspension for the polishing process can be dosed via the liquid nozzle 266 of the grinding and polishing head 216 . During the polishing process, the contact pressure is preferably also regulated in a feedback manner by means of the force sensor 248 in order to polish with a defined contact pressure, which can be specified by the user in the program control, for example.

Accordingly, the metering of the water cooling for the grinding processes and/or the metering of the polishing suspensions for the polishing processes takes place by supply from the grinding and polishing head 216 . In this way, the required liquids can be metered from the grinding and polishing head 116 at each surface treatment station 256, 276, without these having to be provided separately at each surface treatment station 256, 276. In other words, the liquid nozzles 264, 266 move along with the sample gripper 222 or with the gripped embedded sample 142.

When the first polishing operation is completed in the first polishing station 276, the grinding and polishing head 216, with the sample gripper 222 and gripped embedded sample 142, moves to a cleaning station 268 for cleaning and rinsing as described above in connection with the grinding operations . It is expedient to use the first cleaning station 268 for the grinding processes and the second cleaning station 268 for the polishing processes, so that grinding debris and polishing suspensions do not contaminate each other and the cleaning stations do not have to be refilled too often. After the embedded sample 142 has been cleaned and rinsed in the second cleaning station 268, a second polishing station 276 can also be approached in order to polish with a different polishing agent, for example a different polishing suspension. The other polishing suspension can either be metered in via the same liquid nozzle 266, or further liquid nozzles, e.g. 2, 3, 4, 5, 6 or more liquid nozzles for cooling liquid and/or polishing suspensions can be provided on the grinding and polishing head 216, which Move sample gripper 222 from station 256, 268, 276 to station 256, 268, 276.

In the present example, an embedded sample 142 is therefore gripped once by the sample gripper 222 and then successively ground in several, in the present example four, grinding stations 256 with different grit sizes and rinsed and cleaned in a cleaning bath 268, 270 between the respective grinding processes. In addition, the same embedded sample 142 is successively polished using the same sample gripper 222 in one or more, in the present example in two, polishing stations 276 with different polishing agents. Here, too, the embedded sample 126 can be rinsed and cleaned in a cleaning station 268 between the polishing processes. The entire process of grinding, polishing and cleaning is fully automatic and program-controlled, without the involvement of an operator.

In the examples shown, the samples are processed individually and pass through the respective stations 256, 276, 268, where they are always held by the same sample gripper 222.

The grinding and polishing head 216 can adjust the height of the sample gripper 222 with the gripped embedded sample 142 (z-axis) and press it against the respective grinding wheel 262 or against the respective polishing cloth or the respective polishing disk 282 or into the respective cleaning container 269 immerse If preferably the grinding and polishing head 216 is provided with the force sensor 248, the respective grinding wheel 262 can be probed with the gripped embedded sample 142 and the force with which the gripped embedded sample 142 is pressed against the grinding wheel 262 or the polishing wheel 282 to be measured and regulated in a feedback control circuit by means of the measured value to a value previously set in the program controller 211.

At the end of the grinding and polishing processes, the grinding and polishing head 216 moves to a sample deposit position 284 and places the finished ground, polished and cleaned embedded sample 142 there, so that this embedded sample can be used immediately without further processing steps, e.g. for material analyses, such as hardness tests or structural analyses , can be used.

Referring to 9 a sample storage position 284 with a few individual storage locations are shown schematically. Referring to 11 the sample storage position 284 is designed as part of a conveyor device, in the example as a motor-driven conveyor belt, by means of which the fully prepared embedded samples 142 are transported on to a sample collection device.

In 9 and 11 the surface processing stations, ie the grinding stations 256 and the polishing stations 276 are arranged in a rectangular 3 x 2 arrangement and the two cleaning stations 268 are located between the surface processing stations 256, 276. The dimensions of the exemplary grinding and polishing machine 210 with the 3 x 2 array is approximately 1.0 to 1.2 m in length and approximately 0.8 to 0.9 m in depth, allowing it to be placed in a standard lab row (90 cm depth). However, the grinding and polishing device 210 can also be designed as an integrated stand-alone device, in which case the controller, reservoir for the liquids, dosing systems, etc. can be located under the grinding and polishing device 210 . The surface treatment stations 256, 276 are all arranged in the same device housing 208 from which the grinding/polishing head 216 is also suspended, ie they all belong to the same grinding and/or polishing device 210.

For example, a touch display can be used as the GUI, which is integrated in the grinding and polishing device 210 or is attached by means of an adjustable support arm (not shown).

Referring to the 13 A substantially linear arrangement of the surface processing stations 256, 276 and the cleaning stations 268 can also be provided. This has the advantage that the grinding/polishing head 216 only needs to be moved in one dimension (x). In return, the overall length of the grinding and polishing device 210 is somewhat greater, or fewer stations 256, 268, 276 fit in. The number of surface processing stations 256, 276 and the cleaning stations 268 and their spatial two-dimensional arrangement in the xy plane can be designed according to the respective customer requirements.

Referring to 15 the automatic grinding and polishing device 210 can be housed in a safety housing 286 with a front access opening 288, the front access opening 288 being protected by means of a laser light grid 290 as access protection, so that the grinding and polishing device is automatically switched off in an emergency if a person during the Operation should reach into the safety enclosure 286.

• Schritt 502: Anfahren einer Probenentnahmeposition 214 mit dem Schleif- und Polierkopf 216 sowie Absenken des Probengreifers 222 und Greifen der eingebetteten Probe 142 mit dem Probengreifer 222 in der Probenentnahmeposition 214.
• Schritt 504: Anfahren einer ersten Schleifstation 256, sowie Absenken des Probengreifers 222 mit der gegriffenen eingebetteten Probe 142 und Andrücken der eingebetteten Probe 142 mit einer vordefinierten Andruckkraft auf eine rotierende erste Schleifscheibe 262 der ersten Schleifstation 256 mit einer ersten Körnung unter Rotation des Probengreifers 222 unter Zudosierung von Kühlflüssigkeit, sowie Anheben des Probegreifers 222 mit der gegriffenen eingebetteten Probe 142.
• Ggf. Schritt 506: Anfahren eines ersten Reinigungsbehälters 269 und Eintauchen der von dem Probengreifer 222 gegriffenen eingebetteten Probe 142 in den ersten Reinigungsbehälter 269 sowie Anheben der eingebetteten Probe 142 aus dem ersten Reinigungsbehälter 269 und ggf. Trockenblasen der gegriffenen eingebetteten Probe 142.
• Schritt 508: Anfahren einer zweiten Schleifstation 256, sowie Absenken des Probengreifers 222 mit der gegriffenen eingebetteten Probe 142 und Andrücken der eingebetteten Probe 142 mit einer vordefinierten Andruckkraft auf eine rotierende zweite Schleifscheibe 262 der zweiten Schleifstation 256 mit einer zweiten Körnung unter Rotation des Probengreifers 222 unter Zudosierung von Kühlflüssigkeit, sowie Anheben des Probegreifers 222 mit der gegriffenen eingebetteten Probe 142.
• Ggf. Schritt 510: Anfahren des ersten oder eines anderen Reinigungsbehälters 269 und Eintauchen der von dem Probengreifer 222 gegriffenen eingebetteten Probe 142 in den Reinigungsbehälter 269 sowie Anheben der eingebetteten Probe 142 aus dem Reinigungsbehälter 269 und ggf. Trockenblasen der gegriffenen eingebetteten Probe 142.
• Schritt 512: Anfahren einer dritten Schleifstation 256, sowie Absenken des Probengreifers 222 mit der gegriffenen eingebetteten Probe 142 und Andrücken der eingebetteten Probe 142 mit einer vordefinierten Andruckkraft auf eine rotierende dritte Schleifscheibe 262 der dritten Schleifstation 256 mit einer dritten Körnung unter Rotation des Probengreifers 222 unter Zudosierung von Kühlflüssigkeit, sowie Anheben des Probegreifers 222 mit der gegriffenen eingebetteten Probe 142.
• Ggf. Schritt 514: Anfahren des ersten oder eines anderen Reinigungsbehälters 269 und Eintauchen der von dem Probengreifer 222 gegriffenen eingebetteten Probe 142 in den Reinigungsbehälter 269 sowie Anheben der eingebetteten Probe 142 aus dem Reinigungsbehälter 269 und ggf. Trockenblasen der gegriffenen eingebetteten Probe 269.
• Schritt 516: Anfahren einer ersten Polierstation 276, sowie Absenken des Probengreifers 222 mit der gegriffenen eingebetteten Probe 142 und Andrücken der eingebetteten Probe 142 mit einer vordefinierten Andruckkraft auf eine rotierende oder vibrierende erste Polierscheibe 282 der ersten Polierstation 276 unter Rotation des Probengreifers 222 unter Zudosierung einer ersten Poliersuspension, sowie Anheben des Probegreifers 222 mit der gegriffenen eingebetteten Probe 142.
• Ggf. Schritt 518: Anfahren eines zweiten oder eines anderen Reinigungsbehälters 269 und Eintauchen der von dem Probengreifer 222 gegriffenen eingebetteten Probe 142 in den Reinigungsbehälter 269 sowie Anheben der eingebetteten Probe 142 aus dem Reinigungsbehälter 269 und Trockenblasen der gegriffenen eingebetteten Probe 142.
• Schritt 520: Anfahren einer zweiten Polierstation 276, sowie Absenken des Probengreifers 222 mit der gegriffenen eingebetteten Probe 142 und Andrücken der eingebetteten Probe 142 mit einer vordefinierten Andruckkraft auf eine rotierende oder vibrierende zweite Polierscheibe 282 der zweiten Polierstation 276 unter Rotation des Probengreifers 222 unter Zudosierung einer zweiten Poliersuspension, sowie Anheben des Probegreifers 222 mit der gegriffenen eingebetteten Probe 142.
• Ggf. Schritt 522: Anfahren des zweiten oder eines anderen Reinigungsbehälters 269 und Eintauchen der von dem Probengreifer 222 gegriffenen eingebetteten Probe 142 in den Reinigungsbehälter 269 sowie Anheben der eingebetteten Probe 142 aus dem Reinigungsbehälter 169 und ggf. Trockenblasen der gegriffenen eingebetteten Probe 142.
• Schritt 524: Anfahren einer Probenablageposition 284 mit dem Schleif-/Polierkopf 216 sowie Ablegen der eingebetteten Probe 142 mit dem Probengreifer 222 an der Probenablageposition 284.

Referring to 30 an exemplary embodiment of the grinding and polishing method includes the following program-controlled method steps:

• Step 502: Approach a sample-taking position 214 with the grinding and polishing head 216 and lower the sample gripper 222 and grip the embedded sample 142 with the sample gripper 222 in the sample-taking position 214.
• Step 504: Approaching a first grinding station 256 and lowering the sample gripper 222 with the gripped embedded sample 142 and pressing the embedded sample 142 with a predefined pressing force onto a rotating first grinding wheel 262 of the first grinding station 256 with a first grain size while rotating the sample gripper 222 Dosing of cooling liquid and lifting of the sample gripper 222 with the gripped embedded sample 142.
• If necessary, step 506: Approach a first cleaning container 269 and immerse the embedded sample 142 gripped by the sample gripper 222 into the first cleaning container 269 and lift the embedded sample 142 out of the first cleaning container 269 and, if necessary, blow dry the gripped embedded sample 142.
• Step 508: Approaching a second grinding station 256 and lowering the sample gripper 222 with the gripped embedded sample 142 and pressing the embedded sample 142 with a predefined pressing force onto a rotating second grinding wheel 262 of the second grinding station 256 with a second grit while rotating the sample gripper 222 below Dosing of cooling liquid and lifting of the sample gripper 222 with the gripped embedded sample 142.
• If necessary, step 510: Approach the first or another cleaning container 269 and immerse the embedded sample 142 gripped by the sample gripper 222 into the cleaning container 269 and lift the embedded sample 142 out of the cleaning container 269 and, if necessary, blow dry the gripped embedded sample 142.
• Step 512: Approaching a third grinding station 256 and lowering the sample gripper 222 with the gripped embedded sample 142 and pressing the embedded sample 142 with a predefined pressing force onto a rotating third grinding wheel 262 of the third grinding station 256 with a third grain size while rotating the sample gripper 222 Dosing of cooling liquid and lifting of the sample gripper 222 with the gripped embedded sample 142.
• If necessary, step 514: Approach the first or another cleaning container 269 and immerse the embedded sample 142 gripped by the sample gripper 222 into the cleaning container 269 and lift the embedded sample 142 out of the cleaning container 269 and, if necessary, blow dry the gripped embedded sample 269.
• Step 516: Approaching a first polishing station 276 and lowering the sample gripper 222 with the gripped embedded sample 142 and pressing the embedded sample 142 with a predefined contact force onto a rotating or vibrating first polishing wheel 282 of the first polishing station 276 while rotating the sample gripper 222 while metering in a first polishing suspension, and lifting the sample gripper 222 with the gripped embedded sample 142.
• If necessary, step 518: Approach a second or another cleaning container 269 and immerse the embedded sample 142 gripped by the sample gripper 222 into the cleaning container 269 and lift the embedded sample 142 out of the cleaning container 269 and blow dry the gripped embedded sample 142.
• Step 520: Approaching a second polishing station 276 and lowering the sample gripper 222 with the gripped embedded sample 142 and pressing the embedded sample 142 with a predefined contact force onto a rotating or vibrating second polishing wheel 282 of the second polishing station 276 while rotating the sample gripper 222 while metering in a second polishing suspension, and lifting the sample gripper 222 with the gripped embedded sample 142.
• If necessary, step 522: Approach the second or another cleaning container 269 and immerse the embedded sample 142 gripped by the sample gripper 222 into the cleaning container 269 and lift the embedded sample 142 out of the cleaning container 169 and, if necessary, blow dry the gripped embedded sample 142.
• Step 524: Approach a sample storage position 284 with the grinding/polishing head 216 and deposit the embedded sample 142 with the sample gripper 222 at the sample storage position 284.

Programmatically repeat steps 502-524 multiple times.

• - Die eingebetteten Proben 142 brauchen ggf. nicht in einen Probenhalter eingespannt zu werden.
• - Der gesamte Prozess des Schleifens, Polierens und Reinigens kann ggf. vollautomatisch ohne manuellen Eingriff ablaufen.
• - Das Schleif- und Poliergerät 210 zeichnet sich durch geringe Investitionskosten aus, die schnell amortisiert werden können.
• - Das Schleif- und Poliergerät 210 zeichnet sich durch kompakte Abmessungen aus und kann in eine herkömmliche Laborzeile integriert werden.
• - Das Schleif- und Poliergerät 210 ist flexibel einsetzbar.

Advantageously, the embodiment of the grinding and polishing device 216 features the following:

• - The embedded specimens 142 may not need to be clamped in a specimen holder.
• - The entire process of grinding, polishing and cleaning can, if necessary, run fully automatically without manual intervention.
• - The grinding and polishing device 210 is characterized by low investment costs, which can be amortized quickly.
• - The grinder and polisher 210 is characterized by its compact dimensions and can be integrated into a conventional laboratory line.
• - The grinding and polishing device 210 can be used flexibly.

Referring to 22-25 The grinding and polishing device 210 can also include an etching station 756 with an etching bath 758 for etching the ground and/or polished sample underside 142a. In the example shown, the etching station 756 is attached to the grinding and polishing device 210 in a separate etching module 710, with an incoming and an outgoing conveyor device 712, 314 transporting the embedded samples 142 to be etched. A sample gripper 722 grips a single embedded sample 142 at a time, feeds it to the etch station 756, and dips it into the etch bath 758. The sample gripper 722 then supplies the etched embedded sample 142 to a cleaning station 768 and immerses the embedded sample 142 there in a cleaning bath made of a cleaning liquid 770 in a cleaning container 769 . The sample gripper 722 then moves with the embedded sample 142 to a sample deposit position 284, in the example shown on the outgoing conveyor 314, and deposits the embedded sample 142 there.

The etching module 710 also includes a gas-tight sealable housing 708 with a gas-tight door 732 and a vent 734 to suck off the vapors of the etching bath 758 . Furthermore, the etching bath 758 can be closed with a cover 759 in order to prevent the acid in the etching bath 758 from evaporating excessively.

In the example shown, the etching station 756 is attached to the grinding and polishing device 210 in a separate etching module 710 and has a second sample gripper 722 which is preferably constructed like the sample gripper 222 . However, the etching station 756 can also be integrated into the grinding and polishing device 210 (not shown). The grinding/polishing device 210 with an attached etching module 710 or with an integrated etching station 756 can therefore also be referred to as a grinding/polishing and/or etching device 210.

3. Fully automatic production line

Referring to the 26-28 Illustrated are examples of fully automated production lines 310 for embedding, grinding, and polishing specimens. The automatic production line 310 includes, in particular, the automatic mounting press 110 described above and the automatic grinding and polishing device 210 described above.

The samples 142 embedded by the automatic embedding press 110, which are ejected at the sample ejector 147 of the embedding press 110, are transported individually, i.e. not in a multiple sample holder, from the automatic embedding press 110 to the automatic grinding and polishing device 210 with a first conveyor device 312. especially successively one after the other. For this purpose, the first conveyor device 312 can be designed, for example, as a sample chute or a motor-driven conveyor belt. Some of the embedded samples 142 can be buffered on the first conveyor 312 . In any case, the first conveyor device 312 conveys the embedded samples 142 to the sample removal position 214 of the automatic grinding and polishing device 210, so that the embedded samples 142 can be successively gripped there one after the other by the sample gripper 222 in order to perform the grinding, polishing and/or to go through cleaning processes. When an embedded sample 142 has subsequently been prepared, it is deposited by the sample gripper 222 at the sample deposit position 284 .

At the in 26 In the example shown, the fully prepared embedded sample 142 is conveyed from the sample storage position 284 by means of a second conveying device 314 individually, i.e. not in a multiple sample holder, into a sample collection device 316, in particular successively. The second conveyor device 314 can also be designed, for example, as a chute or a motor-driven conveyor belt. Thus, the fully prepared embedded samples 142 are fed one after the other to the sample collection device 316, so that all samples 126 to be embedded that have passed through the automatic production line 310 are embedded and fully prepared individually in the sample collection device 316 and are supplied by the operator to their further determination .

If the fully prepared (ground, polished and/or etched) embedded specimens 142 are to slide on a chute, the fully prepared embedded specimens 142 are preferably either turned beforehand or the chute can be released in the middle so that the fully prepared embedded specimens 142 can only be lie on the outer edge. This can prevent the polished underside of the sample 126 from being damaged by scratches, for example.

Referring to the 27 and 28 can the sample collection device 316 as a magazine 322 can be configured with a large number of sample storage locations 324, with a single fully prepared embedded sample 142 being placed on a sample storage location 324 of the magazine 322 in each case. The magazine 322 can be designed to be movable, e.g. as a sample storage table, in particular with sample storage locations 324 arranged next to one another, with a free sample storage space 324 being moved to the sample storage position 284 under program control, so that each fully prepared embedded sample 142 can be placed on that free sample storage space 324 , which is in the sample depositing position 284 of the grinding and polishing device 210 at this time. The next free sample storage location 324 is then moved to the sample storage position 284 in the next cycle. In other words, the samples are deposited on the sample storage locations 324 with the sample gripper 222 synchronized with the grinding and/or polishing process or in the sample processing cycle of the automatic grinding and polishing device 210 27 and 28 In the example shown, the sample collection device 316 comprises a table-shaped magazine 322, a rotary indexing table with, for example, 32 peripheral sample storage locations 324, corresponding to the sample placement table 122. Of course, an etching module 710 can also be included here.

In a preparatory work step, the operator places all the samples 126 to be embedded at a loading position 124 of the sample loading table 122 and then starts the fully automatic production line 310. In this, the samples are then automatically embedded under program control, first by the embedding press 110, from the first conveyor 312 to the Grinding and polishing device 210 is transported, ground, polished and cleaned there and then transported by the second conveyor 314 to the sample collection device 316 or deposited there. The preparatory assembly step can be carried out by the operator in the evening, for example, and after a complete, fully automatic, program-controlled run, all samples are individually embedded and prepared, i.e. ground, polished and cleaned, in the sample collection device 316 the next morning. During the entire production process, the embedded samples 142 are treated individually and loosely, for example conveyed, gripped, ground, polished, cleaned, etched and/or disposed of.

The entire production line 310 can be controlled via program controls 111, 211 running on a central computer 318, for example.

The dimensions of the exemplary production line 310 are less than 4.8 m in length and less than 90 cm in depth, so that it can be placed in a normal laboratory line (90 cm depth).

Referring to 28 For example, the production line 310 can be enclosed in a safety enclosure 386, with a front access opening 388 being monitored by a laser light grid 390 in order to ensure an emergency shutdown.

• Schritt 604: Heißeinbettpressen einer einzubettenden Probe 126 mit Einbettmaterial 117 in einem Presszylinder 132 einer Einbettpresse 110 zum Herstellen einer eingebetteten Probe 142.
• Schritt 606: Auswerfen der eingebetteten Probe 142 aus dem Presszylinder 132.
• Schritt 608: Fördern der eingebetteten Probe 142 von der Einbettpresse 110 zu einem Oberflächenbearbeitungsgerät 210.
• Schritt 610: Greifen einer einzelnen eingebetteten Probe 142 mit einem Probengreifer 222 des Oberflächenbearbeitungsgeräts 210.
• Schritt 612: Anfahren einer Oberflächenbearbeitungsstation 256, 276 des Oberflächenbearbeitungsgeräts 210 mit dem Probengreifer 222 zum Bearbeiten der Probenunterseite 142a der eingebetteten Probe 142 in der Oberflächenbearbeitungsstation 256, 276 und ggf. Anfahren einer Reinigungsstation 268 des Oberflächenbearbeitungsgeräts 210 mit dem Probengreifer 222 zum Reinigen der eingebetteten Probe 142.
• Ggf. Schritt 614: Ein- oder mehrfaches Wiederholen des Schritts 612 an anderen Oberflächenbearbeitungsstationen 256, 276 des Oberflächenbearbeitungsgeräts 210 und ggf. an anderen Reinigungsstationen 268 des Oberflächenbearbeitungsgeräts 210.
• Schritt 616: Anfahren einer Probenablageposition 284 mit dem Probengreifer 222 und Öffnen des Probengreifers 222 zum Loslassen und Ablegen der eingebetteten oberflächenbearbeiteten Probe 142 an der Probenablageposition 284.

Referring to 31 includes an embodiment of the automatic method for producing a large number of embedded and surface-processed samples 142 in a step 602 the provision of a large number of samples 126 to be embedded and the following program-controlled method steps:

• Step 604: Hot embedding a sample 126 to be embedded with embedding material 117 in a press cylinder 132 of an embedding press 110 to produce an embedded sample 142.
• Step 606: Eject the embedded sample 142 from the press cylinder 132.
• Step 608: Convey the embedded sample 142 from the embedding press 110 to a surfacing device 210.
• Step 610: Grip a single embedded sample 142 with a sample gripper 222 of the surface preparation tool 210.
• Step 612: Approaching a surface processing station 256, 276 of the surface processing device 210 with the sample gripper 222 for processing the sample underside 142a of the embedded sample 142 in the surface processing station 256, 276 and, if necessary, approaching a cleaning station 268 of the surface processing device 210 with the sample gripper 222 for cleaning the embedded sample 142.
• Optionally, step 614: repeating step 612 one or more times at other surface processing stations 256, 276 of the surface processing device 210 and, if necessary, at other cleaning stations 268 of the surface processing device 210.
• Step 616: Approach a sample deposit position 284 with the sample gripper 222 and open the sample gripper 222 to release and deposit the embedded surface-processed sample 142 at the sample deposit position 284.

Programmatically repeating steps 604-608 and steps 610-616 multiple times, leaving the embedded samples between the Steps 608 and 610 can be buffered.

In summary, the present invention relates to an automatic embedding press 110, an automatic grinding and polishing device 210 and an automatic production line 310 with an embedding press 110 and a grinding and polishing device 210. Therefore, all features that are associated with the embedding press 110 and the grinding and and polisher 210 are also disclosed for production line 310 and vice versa. All features that are disclosed in connection with the embedding press also apply to the associated method as disclosed and vice versa. All features that are disclosed in connection with the grinding and/or polishing device are also deemed to be disclosed for the associated method and vice versa.

All features that are disclosed in connection with the production line are also deemed to be disclosed for the associated method and vice versa.

It is obvious to the person skilled in the art that the embodiments described above are to be understood as examples and that the invention is not limited to these, but can be varied in many ways without departing from the scope of protection of the claims. Furthermore, it is evident that the features, regardless of whether they are disclosed in the description, the claims, the figures or otherwise, also individually define essential components of the invention, even if they are described together with other features.

Claims (18)

Production line (310) for automatically embedding and subsequent surfacing of specimens, comprising: an automatic embedding press (110) for the program-controlled embedding and ejection of a large number of specimens (142) one after the other, an automatic surface processing device (210) for program-controlled processing of the sample underside (142a) of the plurality of samples (142) embedded by the embedding press (110) one after the other, and having a sample removal position (214) and a sample depositing position (284), a first conveyor (312) for conveying the embedded samples (142) ejected from the automatic embedding press (110) to the sampling position (214) of the surface treatment device (210), Program controls (111, 211) for controlling the automatic mounting press (110) and the automatic surfacing device (210). production line (310) after claim 1 , comprising sample collecting means (316) for collecting the plurality of samples (142) embedded by the embedding press (110) and processed by the surface treatment device (210). production line (310) after claim 1 or 2 , comprising a second conveying device (314) for conveying the surface treatment device (210) processed embedded samples (142) from the sample deposit position (284) in a sample collection device (316). Production line (310) according to one of the preceding claims, wherein the first and/or second conveyor device (312, 314) conveys the embedded samples (142) individually and/or wherein the embedded samples (142) are surface-treated individually by the surface treatment device (210). and/or wherein the embedded and surface-processed samples (142) are deposited individually in the sample deposit position (284) and/or are individually available in the sample collection device (316) after passing through the production line (310). A production line (310) as claimed in any preceding claim, wherein the first and/or second conveyor means (312, 314) each comprises a chute or conveyor belt for embedded samples (142). The production line (310) of any preceding claim, wherein the production line (310) is sized and adapted to be placed on a laboratory bench. Production line (310) according to one of the preceding claims, wherein the automatic embedding press (110) has a press unit (134) with a press cylinder (132), a dosing device (115) for dosing embedding material (117) and a sample loading table (122) with a plurality of placement locations (124) on which the operator can deposit a sample (126) to be embedded. production line (310) after claim 7 , wherein the impression cylinder (132) has a lower first and an upper second opening (132a, b) and the sample is introduced into the impression cylinder (132) through the lower first opening (132a) and the embedding material (117) through the upper second Opening (132b) is metered into the press cylinder (132). production line (310) after claim 7 or 8th , wherein after the embedding press operation, the embedded sample (142) upwards out of the press cylinder (132) and the pressing unit (134) comprises a sample ejector (144) which programmatically ejects the embedded sample (142) from the pressing unit onto the first conveyor (312). production line (310) after claim 9 , wherein the sample ejector (144) pushes down the embedded sample (142) transversely to the axis of the press cylinder (132) by an upwardly driven press piston (128) onto the first conveyor (312). A production line (310) according to any one of the preceding claims, wherein the surface treatment device (210) is a grinder and polisher for surface grinding and polishing the sample underside of the embedded samples, and comprises: a grinding station (256) with a grinding plate (258) and a grinding wheel (262) for grinding the underside (142a) of the sample, a polishing station (276) with a polishing plate (278) for polishing the underside (142a) of the sample, a grinding/polishing head (216) with a sample gripper (222) for gripping an embedded sample (142), wherein the grinding/polishing head (216) moves to the sample removal position (214) with the sample gripper (222) and the sample gripper (222) grips an embedded sample (142), wherein the grinding/polishing head (216) with the sample gripper (222) feeds the embedded sample (142) to the grinding station (256) and/or the polishing station (276) and grinds the underside (142a) of the sample in the grinding station (256) and/ or is polished in the polishing station (276), and wherein the grinding/polishing head (216) with the sample gripper (222) feeds the embedded sample (142) to the sample storage position (284) after grinding or polishing and, if necessary, further processing steps and the ground and/or polished embedded sample (142) drops there. production line (310) after claim 11 wherein the sample gripper (222) is adapted to individually grip an embedded sample (142). production line (310) after claim 11 or 12 , wherein the grinding/polishing head (216) has a drive shaft (228) which is driven in rotation by a motor (232), and wherein the sample gripper (222) is arranged on the drive shaft (228) such that the sample gripper (222 ) rotates around a rotation axis (A). Production line (310) according to one of Claims 11 - 13 , wherein the grinding and/or polishing device (210) has at least a first grinding station (256) with a first grinding disc (258) and a first grinding wheel (262) with a first grain size, a second grinding station (256) with a second grinding disc (258 ) and a second grinding wheel (262) with a second grit different from the first grit and a first polishing station (276) with a first polishing wheel (272) and wherein the grinding/polishing head (216) with that of the sample gripper (222) gripped embedded sample (142) moves to the first grinding station (256), the second grinding station (256) and the first polishing station (276) in order to sequentially process the same embedded sample (142) in the same grinding and/or polishing device (210) with the first Grind with the second grit, grind and polish with the second grit. Production line (310) according to one of Claims 11 - 14 , wherein the grinding and / or polishing device (210) has at least one cleaning container (269), which is approached by the grinding / polishing head (216) and in which the embedded sample (142) before, between and / or after the grinding - and polishing operations. Method for producing a large number of embedded samples (142) with a ground and/or polished underside (142a) of the sample with the following steps, optionally with the interposition of further steps: a) providing a large number of samples (126) to be embedded on an embedding press (110), b) pressing a first sample to be embedded with embedding material (117) in a press cylinder (132) of the embedding press (110) to produce an embedded sample (142), c) ejecting the first embedded sample (142) from the press cylinder (132), d) conveying the first embedded sample (142) from the embedding press (110) to a surface preparation device (210), e) gripping the single first embedded sample (142) with a sample gripper (222) of the surfacing device (210), f) approaching a processing station (256, 276) of the surface processing device (210) with the sample gripper (222) for processing the sample underside (142a) of the first embedded sample (142) in the processing station (210), g) moving to a sample storage position (284) with the sample gripper (222) and depositing the first embedded sample (142) at the sample storage position (284), h) repeating steps b) through d) and e) through g) a plurality of times to produce a plurality of embedded samples (142) having a surface finished sample underside (142a). procedure after Claim 16 , wherein the sample gripper (222) moves to a cleaning container (269) after processing the sample underside (142a) and of the sample gripper (222) gripped immerses the embedded sample (142) in the cleaning tank (269) to clean the embedded sample (142). procedure after Claim 16 or 17 , wherein the processing station in step f) is a grinding station (256) and the sample underside (142a) of the embedded sample (142) is ground, and the following further steps are carried out: if necessary, moving to a cleaning station (268) to clean the ground embedded Sample (142), moving to a polishing station (276) of the surface treatment device (210) with the sample gripper (222) to polish the sample underside (142a) of the embedded sample (142), and, if necessary, moving to a cleaning station (268) to clean the polished embedded Sample (142).

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