DE102020110680A1 - Dual interface chip card module arrangement and chip card - Google Patents

Abstract

A dual interface chip card module arrangement (200) is provided. The dual interface chip card module arrangement (200) has a dual interface chip card module (222) which has a chip (442), which is arranged on a first side (222S1) of the chip card module, a first contact pad arrangement electrically conductively connected to the chip (334, 336) with at least four contact pads, which are arranged on the first side of the chip card module, several vias (440) which run through the chip card module from the first side to a second side (222S2) of the chip card module opposite the first side, and has a second contact pad arrangement (450) which is electrically conductively connected to the chip, is arranged on the second side of the chip card module and is set up in accordance with ISO 7816, the second contact pad arrangement being electrically conductively connected to the chip by means of the vias, at least a light source (106) which is arranged on or in the chip card module, and an antenna arrangement (10 2, 108), which is arranged on or in the chip card module, the antenna arrangement having a first antenna (102) which is electrically conductively connected to two contact pads (336) of the first contact pad arrangement, the first antenna for contactless communication is set up with the chip and / or power supply of the chip, and a second antenna (108) which is electrically conductively connected to the at least one light source and to two other contact pads (334) of the first contact pad arrangement, the second antenna for the Energy supply of the at least one light source is set up.

Description

The invention relates to a dual interface chip card module arrangement and a chip card.

At present, more and more chip cards are being marketed that have additional equipment elements. One of the most recent developments is a smart card that lights up during a transaction or an authentication process.

In a contact-based chip card according to the prior art, a light-emitting diode (LED) can be connected to contact surfaces, e.g. module contact surfaces according to ISO 7816, for example to a VDD and a VSS (or GND) pad. In this case, the LED can light up when the chip card is operated in a contact-based manner.

However, contactless operation of the LED is not possible with this design.

1 shows a schematic plan view of a contactless interface chip card module arrangement 100 according to a state of the art. Such a contactless interface chip card module arrangement 100 can for example be integrated in a chip card.

In this design, the contactless interface has a chip card module arrangement 100 two antennas 102 , 108 on, namely a first antenna 102 to operate the chip (not shown), for example by means of contact surfaces 104 can be connected, and a second antenna 108 to operate the LEDs 106 .

An easy-to-manufacture or inexpensive combination of both contactless and contact-based lighting in conjunction with contactless or contact-based communication between a reader and a chip (which may have electromagnetic compatibility) is currently not available, however.

In various exemplary embodiments, a dual-interface chip card module arrangement is provided which enables both contactless and contact-based lighting in conjunction with contactless or contact-based communication between a reader and a chip. When it lights up, it can indicate the presence of an authentication terminal.

In various exemplary embodiments, an additional antenna, which is provided for supplying energy to at least one LED, is connected directly to contacts (e.g. VSS and VDD) for supplying energy to the chip. The at least one LED can thus be operated both contactlessly and contact-based.

In other words, when a chip card is started up by means of a contact-based interface, both the chip and the at least one LED can be supplied with energy. In addition, when the chip card is started up, both the chip and the at least one LED can be supplied with energy by means of a contactless interface.

In various exemplary embodiments, an additional antenna, which is electrically conductively connected to at least one LED, can be set up in contactless operation of a dual-interface chip card module arrangement to act as an antenna which provides the energy for operating the at least one LED. In the case of contact-based operation, the antenna can be set up to act as a galvanic contact between contact pads and the at least one LED.

In various exemplary embodiments, a dual-interface chip card module arrangement with an independent light source (e.g. LED) circuit is provided which has an antenna that is directly connected in an electrically conductive manner to a VSS and a VDD contact of a contact-based interface. Accordingly, the light source can be operated and light up both in a contactless operating mode and in a contact-based operating mode.

In a dual-interface chip card module arrangement, at least one light source, one chip and two antennas are provided in various exemplary embodiments. The antennas are set up to work independently of one another during the contactless operating mode. One of the antennas absorbs energy from an external magnetic field to operate the light source (e.g. LED), with internal structures on the chip between a VSS and a VDD contact of a contact-based interface being used to ensure galvanic contact of the antenna circuit. The second antenna is connected to a contactless interface on the chip. The second antenna supplies the chip with energy and enables communication by means of the magnetic field, for example in a standardized manner known in the prior art.

In a contact-based mode of operation, the light source circuit and the chip are connected in parallel to the VSS and VDD contact of the contact-based interface. Because the antenna serves as a galvanic connection, the light source can light up.

In various exemplary embodiments, a chip card module is provided which is used in the dual interface chip card module arrangement. The chip card module makes it possible to connect the known chip antenna and also to connect the light source / antenna circuit described herein, since all four required contact pads are exposed on the same side (eg the underside) of the chip card module.

Exemplary embodiments of the invention are shown in the figures and are explained in more detail below.

• 1 eine schematische Draufsicht einer Kontaktlos-Interface Chipkartenmodul-Anordnung gemäß einem Stand der Technik;
• 2 eine schematische Draufsicht einer Dual Interface Chipkartenmodul-Anordnung gemäß verschiedenen Ausführungsbeispielen;
• 3 ein Schaltbild einer Dual Interface Chipkartenmodul-Anordnung gemäß verschiedenen Ausführungsbeispielen;
• 4 eine schematische Darstellung einer Dual Interface Chipkartenmodul-Anordnung gemäß verschiedenen Ausführungsbeispielen mit vergrößerten Darstellungen einzelner Bereiche;
• 5 eine schematische Draufsicht und eine schematische Querschnittsansicht eines Dual Interface Chipkartenmoduls für eine Dual Interface Chipkartenmodul-Anordnung gemäß verschiedenen Ausführungsbeispielen; und
• 6 eine schematische Draufsicht und eine Querschnittsansicht einer Chipkarte gemäß verschiedenen Ausführungsbeispielen.

Show it

• 1 a schematic plan view of a contactless interface chip card module arrangement according to a prior art;
• 2 a schematic plan view of a dual interface chip card module arrangement according to various embodiments;
• 3 a circuit diagram of a dual interface chip card module arrangement according to various embodiments;
• 4th a schematic representation of a dual interface chip card module arrangement according to various exemplary embodiments with enlarged representations of individual areas;
• 5 a schematic plan view and a schematic cross-sectional view of a dual interface chip card module for a dual interface chip card module arrangement according to various exemplary embodiments; and
• 6th a schematic plan view and a cross-sectional view of a chip card according to various embodiments.

In the following detailed description, reference is made to the accompanying drawings, which form a part hereof, and in which there is shown, for purposes of illustration, specific embodiments in which the invention may be practiced. In this regard, directional terminology such as "top", "bottom", "front", "back", "front", "back", etc. is used with reference to the orientation of the character (s) being described. Because components of embodiments can be positioned in a number of different orientations, the directional terminology is used for purposes of illustration and is in no way limiting. It goes without saying that other embodiments can be used and structural or logical changes can be made without departing from the scope of protection of the present invention. It goes without saying that the features of the various exemplary embodiments described herein can be combined with one another, unless specifically stated otherwise. The following detailed description is therefore not to be taken in a limiting sense, and the scope of the present invention is defined by the appended claims.

In the context of this description, the terms “connected”, “connected” and “coupled” are used to describe both a direct and an indirect connection, a direct or indirect connection and a direct or indirect coupling. In the figures, identical or similar elements are provided with identical reference symbols, insofar as this is appropriate.

2 is a schematic plan view of a dual interface chip card module arrangement 200 according to different embodiments, 3 a circuit diagram of a dual interface chip card module arrangement 200 according to different embodiments, 4th a schematic plan view of a dual interface chip card module arrangement 200 according to various exemplary embodiments with enlarged representations of individual areas, 5 a schematic representation and a schematic cross-sectional view of a dual interface chip card module 222 for a dual interface chip card module arrangement 200 according to various embodiments and 6th a schematic plan view and a cross-sectional view of a chip card 600 according to various embodiments.

The dual interface chip card module arrangement 200 can be a dual interface chip card module 222 exhibit. the 4th shows detailed views of an exemplary chip card module 222 , with the chip card module in the upper and lower left illustration 222 is shown from above, and the lower right illustration the chip card module 222 from below shows. The chip card module 222 can have a chip 442 have on a first side 222S1 of the chip card module 222 , for example on an underside, can be arranged.

The chip 442 can be a semiconductor chip 442 which can be set up for contact-based communication and for contactless communication. The chip 442 can be set up essentially like a chip known from the prior art for a dual interface chip module and, for example, have a microcontroller, for example a security controller.

The dual interface chip card module arrangement 200 can one with the chip 442 electrically conductively connected first contact pad arrangement 334 , 336 with at least four contact pads 334 , 336 have, which on the first page 222S1 of the Chip card module 222 is arranged. Each of the at least four contact pads 334 , 336 can be formed as part of a metallization plane. Each of the at least four contact pads 334 , 336 may have a contact pad surface that is suitable for interfacing with an antenna pad surface of a respective associated antenna pad 220 respectively. 104 to be connected in an electrically conductive manner, for example soldered or glued using an electrically conductive adhesive (this is in 5 for example as a connecting element 552 shown).

In various exemplary embodiments, the dual interface chip card module arrangement 200 also vias 440 have, which by the chip card module 222 from the first side 222S1 to a second side 222S2 of the chip card module opposite the first side 222S1 222 (for example a top) run. The vias 440 can be made by a dielectric material 554 , for example polyimide, which can form a chip module body, and can be formed in a manner known in the art.

The dual interface chip card module arrangement 200 can also be one with the chip 442 electrically conductively connected second contact pad arrangement 450 have on the second side 222S2 of the chip card module 222 can be arranged and set up in accordance with ISO 7816. The second contact pad arrangement 450 can by means of the vias 440 with the chip 442 be electrically connected. For example, a C1 contact pad of the second contact pad arrangement 450 according to ISO 7816, which is typically set up to provide a positive operating voltage, by means of one of the vias 440 with the chip 442 be electrically connected. Is in 5 shown as an example. Furthermore, for example, a C5 contact pad of the second contact pad arrangement 450 according to ISO 7816, which is typically set up to provide a ground contact (GND), by means of one of the vias 440 with the chip 442 be electrically connected. In other words, two contact pads 334 the first contact pad arrangement 334 , 336 a contact pad 334 having that with a VSS contact pad 450 , C5 , GND of the second contact pad arrangement by means of one of the vias 440 is electrically connected, and another contact pad 334 that with a VDD contact pad 450 , C1 , VDD of the second contact pad arrangement by means of another of the vias 440 is electrically connected.

In various exemplary embodiments, the dual interface chip card module arrangement 200 furthermore at least one light source 106 have on or in the chip card module 222 is arranged. The at least one light source 106 can for example have or consist of at least one light emitting diode, or another type of light source 106 for use as part of a dual-interface chip card module arrangement 200 suitable is.

The at least one light source 106 can for example have two light sources (eg LEDs) 106 connected in anti-parallel. It can thus be made possible that in each phase position (or both in a positive phase position and in a negative phase position) of the one in the antenna 108 induced AC voltage signal (see below) one of the anti-parallel connected light sources 106 can shine.

In the figures the light source is as in the antenna 108 shown integrated. In various exemplary embodiments, the antenna 108 in or on the chip card module 222 be arranged.

In various exemplary embodiments, the dual interface chip card module arrangement 200 furthermore an antenna arrangement 102 , 108 have on or in the chip card module 222 is arranged.

The antenna arrangement 102 , 108 can be a first antenna 102 that have two contact pads 336 the first contact pad arrangement 334 , 336 is electrically connected. The antenna 102 can have two antenna pads 104 have, which can be formed so that they have a slight electrically conductive connection to the contact pads 336 for example, the LA and LB pads of the chip 442 can be, enable. As in 6th shown, the antenna pads 104 for example in a chip card body 660 a chip card 600 arranged and in a receiving opening for the dual interface chip card module arrangement 200 be exposed so that the contact pads 336 when arranging the dual interface chip card module arrangement 200 in the receiving opening of the chip card body 660 by means of an electrically conductive connecting element 662 , for example an electrically conductive adhesive such as a solder or a conductive adhesive, with the antenna pads 104 can be brought into electrically conductive connection.

The first antenna 102 can be used for contactless communication with the chip 442 and / or for a power supply of the chip 442 be set up.

Regarding an operation of the chip 442 can use the dual interface chip card module arrangement 200 thus be designed similar to a dual interface chip card module arrangement according to the prior art: In a contact-based mode, the chip 442 by means of the second contact pad arrangement 450 , the vias 440 and two contact pads 334 the first contact pad arrangement 334 , 336 be supplied with energy and communicate. In a contactless mode, the chip can 442 by means of the first antenna 102 (including the antenna pads 104 ) and two contact pads 336 the first contact pad arrangement 334 , 336 be supplied with energy and communicate.

In various exemplary embodiments, the dual interface chip card module arrangement 200 also a second antenna 108 have that with the at least one light source 106 and with two other contact pads 334 the first contact pad arrangement 334 , 336 is electrically connected.

The antenna 108 can have two antenna pads 220 have, which can be formed so that they have a slight electrically conductive connection to the contact pads 334 enable. As in 6th shown, the antenna pads 220 for example in a chip card body 660 a chip card 600 arranged and in a receiving opening for the dual interface chip card module arrangement 200 be exposed so that the contact pads 334 when arranging the dual interface chip card module arrangement 200 in the receiving opening of the chip card body 660 by means of an electrically conductive connecting element 662 , for example an electrically conductive adhesive such as a solder or a conductive adhesive, with the antenna pads 220 can be brought into electrically conductive connection.

The second antenna 108 can for the energy supply of the at least one light source 106 be set up. The light source 106 can be connected in series with the second antenna in various exemplary embodiments 108 .

In a contact-based mode, the at least one LED 106 by means of the second contact pad arrangement 450 , the vias 440 and two contact pads 334 the first contact pad arrangement 334 , 336 be supplied with energy. In that case the antenna can 108 a galvanic contact and an electrically conductive connection to the at least one LED 106 form.

In a contactless mode, the at least one LED 106 by means of the second antenna 108 (including the antenna pads 220 ) and two contact pads 336 the first contact pad arrangement 334 , 336 be supplied with energy. That means the second antenna 108 can be used as an energy source when an electromagnetic field, for example by means of an external reader, is provided. Is in 3 shown as a wave symbol and "+/-".

The dual interface chip card module arrangement 200 can furthermore be a diode according to various exemplary embodiments 332 having that with two of the contact pads 334 can be electrically connected. This is exemplary in 3 shown. The diode 332 can close the circuit in the case of contactless operation.

If the system - in the current view the at least one light emitting diode 106 - is supplied with energy by means of the magnetic field, the induced voltage is provided as alternating voltage, i.e. with positive and negative wave phases. Is in 3 indicated as the wave symbol. At the diode 332 and one in parallel with the diode 332 schematically indicated resistance 334 (of the chip 442 ) relevant areas of the alternating voltage are indicated as hatched areas of the wave symbols.

The negative component of the alternating voltage (see the illustration in the central area of the 3 ; the positive voltage can be applied to the contact pad connected to C5 / GND 334 can be applied for the at least one LED 106 can be regarded as a standard power supply similar to the power supply in the contact-based case.

The one with the contact pads too 334 electrically conductively connected chip 442 can be used in the second antenna if there is a concern 108 induced voltage try to ramp up and can thus act as a voltage-dependent resistance 338 be considered (which is the circuit for the voltage supply of the at least one LED 106 can close). However, the chip can 442 because of the AC voltage signal does not start up, so that the contactless interface, which is from the first antenna 102 and the contact pads 336 is provided, the energy supply of the chip 442 takes over.

Becomes a positive component of the alternating voltage on the contact pad connected to C5 / GND 334 provided, the equivalent circuit can act as a diode. In this case, a diode provided as protection against electrostatic discharge (ESD) can be used 332 to be activated. The positive voltage can be passed through when a threshold voltage of the ESD diode 332 is exceeded. This enables the at least one light source 106 to be supplied with energy even during the positive phase position of the alternating voltage. When providing opposing diodes connected in parallel 106 , such as in 3 shown, can thus illuminate the LEDs in both Phase positions are made possible during contactless operation.

Tests have shown that with two LEDs connected in anti-parallel 106 that are connected to the GND / VDD contacts of the contact-based module 450 and with the second antenna 108 connected, the LEDs 106 (or one of the two LEDs) both in contact-based operation and in contactless operation light up and communication with the chip 442 is possible at the same time.

In various exemplary embodiments, a chip card 600 provided. The chip card 600 has a chip card body 660 and a dual interface chip card module arrangement 200 according to various embodiments. The dual interface chip card module arrangement 200 can in the chip card body 660 be embedded.

The dual interface chip card module arrangement 200 can be formed in various exemplary embodiments by means of forming the first antenna 102 and the second antenna 108 in the chip card body 660 .

For example, the first antenna 102 with the antenna pads 104 , the second antenna 108 with the antenna pads 220 and at least one in series with the second antenna 108 switched light source 106 be formed on an antenna carrier, for example an antenna carrier film, for example in a manner known in principle in the prior art. The antenna carrier can then be connected to the first antenna 102 , the second antenna 108 and the at least one light source 106 into the chip card body 660 be embedded, for example laminated into further layers or foils. The first antenna 102 and the second antenna 108 can thus be in a common plane within the chip card body 660 be arranged.

Then in the chip card body 660 a chip card module receiving area 664 for the dual interface chip card module arrangement 200 are formed, for example in a manner known in the art, for example by means of milling.

When forming the chip card module receiving area 664 can the contacts 104 the first antenna 102 and the contacts 220 the second antenna 108 in the recording area 664 be exposed.

The chip card module can then 222 the chip card module arrangement in the chip card module receiving area 664 be arranged such that the contacts 104 the first antenna 102 with two of the contact pads 336 the first contact pad arrangement 334 , 336 are electrically connected, and the contacts 220 the second antenna 108 with two other contact pads 334 the first contact pad arrangement 334 , 336 are electrically connected.

The arrangement (also referred to as implantation) can essentially take place in a manner known in the prior art, for example by means of gluing or by means of a combination of diffusion soldering and gluing.

For the implantation, existing devices (e.g. a so-called T-Connect machine or a device for forming ACF hot-melt adhesive connections) can be used to form a direct antenna connection for dual-interface chip cards, which only need to be adapted to the effect that four contacts are formed at the same time instead of just two.

Some exemplary embodiments are summarized below.

Embodiment 1 is a dual interface chip card module arrangement. The dual interface chip card module arrangement has a dual interface chip card module which has a chip that is arranged on a first side of the chip card module, a first contact pad arrangement that is electrically conductively connected to the chip and has at least four contact pads that are on the first side of the chip card module is arranged, a plurality of vias which run through the chip card module from the first side to a second side of the chip card module opposite the first side, and has a second contact pad arrangement which is electrically conductively connected to the chip and which is arranged on the second side of the chip card module and is set up according to ISO 7816, wherein the second contact pad arrangement is electrically conductively connected to the chip by means of the vias, at least one light source which is arranged on or in the chip card module, and an antenna arrangement which is arranged on or in the chip card module, wherein the ante Inner arrangement a first antenna which is electrically conductively connected to two contact pads of the first contact pad arrangement, the first antenna being set up for contactless communication with the chip and / or power supply of the chip, and a second antenna connected to the at least one Light source and is electrically conductively connected to two other contact pads of the first contact pad arrangement, wherein the second antenna is set up for the energy supply of the at least one light source.

Embodiment 2 is a dual interface chip card module arrangement according to embodiment 1, the two other contact pads having a third contact pad that is electrically conductively connected to a VSS contact pad of the second contact pad arrangement by means of one of the vias, and a fourth contact pad that is connected to a VDD contact pad of the second contact pad arrangement is electrically conductively connected by means of another of the vias.

Embodiment 3 is a dual interface chip card module arrangement according to embodiment 2, wherein the VSS contact pad is a C5 contact pad of the second contact pad arrangement set up in accordance with ISO 7816, and the VDD contact pad is a C1 contact pad of the second contact pad set up in accordance with ISO 7816 Arrangement is.

Embodiment 4 is a dual interface chip card module arrangement in accordance with one of the embodiments 1 to 3, which furthermore has a diode which is electrically conductively connected to the two other contact pads.

Embodiment 5 is a dual interface chip card module arrangement according to one of the embodiments 1 to 4, which is set up to supply the chip and the light source with energy by means of the second contact pad arrangement in a contact operating mode, and the chip in a contactless operating mode to supply energy by means of the first antenna and the light source by means of the second antenna.

Embodiment 6 is a dual interface chip card module arrangement according to one of the embodiments 1 to 5, the light source being connected in series with the second antenna.

Exemplary embodiment 7 is a dual interface chip card module arrangement according to one of exemplary embodiments 1 to 6, the at least one light source having at least one light-emitting diode (LED).

Embodiment 8 is a chip card. The chip card has a chip card body and a dual interface chip card module arrangement according to one of the exemplary embodiments 1 to 7, which is embedded in the chip card body.

Embodiment 9 is a chip card according to embodiment 8, the dual interface chip card module arrangement being formed by forming the first antenna and the second antenna in the chip card body, exposing contacts of the first antenna and contacts of the second antenna in a chip card module receiving area, and arranging them of the chip card module of the dual interface chip card module arrangement in the chip card module receiving area in such a way that the contacts of the first antenna are electrically conductively connected to the two contact pads of the first contact pad arrangement, and the contacts of the second antenna are connected to the two other contact pads of the first contact pad arrangement are electrically connected.

Embodiment 10 is a chip card according to embodiment 8 or 9, the first antenna and the second antenna being arranged in a common plane within the chip card body.

Further advantageous configurations of the device emerge from the description of the method and vice versa.

Claims (10)

Dual interface chip card module arrangement (200), comprising: a dual interface chip card module (222), comprising: • a chip (442) which is arranged on a first side (222S1) of the chip card module (222); • a first contact pad arrangement (334, 336) which is electrically conductively connected to the chip (442) and has at least four contact pads, which is arranged on the first side (222S1) of the chip card module (222); • several vias (440) which run through the chip card module (222) from the first side (222S1) to a second side (222S2) of the chip card module (222) opposite the first side (222S1); • a second contact pad arrangement (450) electrically conductively connected to the chip (442), which is arranged on the second side (222S2) of the chip card module (222) and is set up in accordance with ISO 7816, the second contact pad arrangement (450) is electrically conductively connected to the chip (442) by means of the vias (440); at least one light source (106) which is arranged on or in the chip card module (222); and an antenna arrangement (102, 108) which is arranged on or in the chip card module (222), the antenna arrangement (102, 108) having: • a first antenna (102) which is electrically conductively connected to two contact pads (336) of the first contact pad arrangement (334, 336), the first antenna (102) for contactless communication with the chip (442) and / or power supply of the chip (442) is established; and • a second antenna (108) which is electrically conductively connected to the at least one light source (106) and to two other contact pads (334) of the first contact pad arrangement (334, 336), the second antenna (108) for the energy supply the at least one light source (106) is set up. Dual interface chip card module arrangement (200) according to Claim 1 , wherein the two other contact pads (334) have a third contact pad that is connected to a VSS contact pad (C5) of the second Contact pad arrangement (450) is electrically conductively connected by means of one of the vias (440), and a fourth contact pad which is electrically conductive with a VDD contact pad (C1) of the second contact pad arrangement (450) by means of another of the vias (440) connected is. Dual interface chip card module arrangement (200) according to Claim 2 , wherein the VSS contact pad is a C5 contact pad of the second contact pad arrangement set up in accordance with ISO 7816, and the VDD contact pad is a C1 contact pad of the second contact pad arrangement set up in accordance with ISO 7816. Dual interface chip card module arrangement (200) according to one of the Claims 1 until 3 , further comprising: a diode (332) which is electrically conductively connected to the two other contact pads (334). Dual interface chip card module arrangement (200) according to one of the Claims 1 until 4th which is set up: • to supply the chip (442) and the light source (106) with energy by means of the second contact pad arrangement (450) in a contact operating mode; and • in a contactless operating mode, to supply the chip (442) with energy by means of the first antenna (102) and the light source (106) by means of the second antenna (108). Dual interface chip card module arrangement (200) according to one of the Claims 1 until 5 wherein the light source (106) is connected in series with the second antenna (108). Dual interface chip card module arrangement (200) according to one of the Claims 1 until 6th wherein the at least one light source (106) has at least one light emitting diode (LED). Chip card (600), comprising: a chip card body (660); and • a dual interface chip card module arrangement (200) according to one of the Claims 1 until 7th , which is embedded in the chip card body (660). Chip card (600) according to Claim 8 , wherein the dual interface chip card module arrangement (200) is formed by: • forming the first antenna (102) and the second antenna (108) in the chip card body (660); Exposing contacts (104) of the first antenna (102) and of contacts (220) of the second antenna (108) in a chip card module receiving area (664); and • arranging the chip card module (222) in the chip card module receiving area (664) such that the contacts (104) of the first antenna (102) are electrically conductively connected to the two contact pads (336) of the first contact pad arrangement (334, 336) , and the contacts (220) of the second antenna (108) are electrically conductively connected to the two other contact pads (334) of the first contact pad arrangement (334, 336). Chip card (600) according to Claim 8 or 9 wherein the first antenna (102) and the second antenna (108) are arranged in a common plane within the chip card body (660).

Images