DE102020107311A1 - Process for the fine structuring of metal-containing layers and ceramic multilayer components - Google Patents

Abstract

The invention relates to a method for the fine structuring of coarsely structured, pasty, metal-containing layers 3, comprising the following steps:
- Application of a metal-containing layer 3, which has a coarse structure and comprises a pasty material, on a surface. The main components of the pasty material are one or more metals and an organic solvent.
- Scanning the position and surface of the metal-containing layer 3 and generating a data record from the recorded data.
- Evaluation of the data set by comparison with specified values.
- Determination of critical sections of the metal-containing layer 3 which deviate from the specified values.
Decomposition of the critical sections by laser irradiation into a metal-containing powder, the coarsely structured metal-containing layer 3 being converted into a desired finely structured layer 3.

Description

The present invention relates to a method for the fine structuring of coarsely structured, pasty metal-containing layers. The invention further relates to a ceramic multilayer component which comprises finely structured metal-containing layers.

A large number of electronic components include ceramic layers with structured metal-containing layers applied to them. The metal-containing layers are structured in such a way that sections of integrated electronic elements result. The ceramic and metal-containing layers can be stacked to form multi-layer components. It is important to ensure that they are precisely stacked so that sections of integrated electronic elements that belong together are on top of one another. These can then be connected by vias in the ceramic layers.

In addition, the electronic components can include further technical arrangements such as antennas, for example, which are insulated from the metal-containing layers. In order to avoid capacitive and / or inductive interactions between current-carrying metal-containing layers and other technical arrangements, the distance between them must not fall below a required minimum distance.

Furthermore, for example, the distance between an antenna and the structured metal-containing layer should not vary in order to avoid interference signals and an influence on the impedance in the antenna. This applies within a metal-containing layer, but in particular also when the antenna extends over several metal-containing layers.

In order to maintain the required accuracy in structuring the applied metal-containing layers, the dimensions of such layers and the stack height of an electronic component and the size of the integrated electronic elements are limited in the case of manufacturing processes that have been customary up to now.

An industrial process for applying a metal-containing layer to a ceramic layer is the screen printing process.

With such a method, sections of integrated electronic elements less than 50 µm in width cannot be mass-produced. The number of possible electronic elements on a ceramic layer of a certain dimension is therefore limited.

On the other hand, the sections of the integrated electronic elements can only be applied to a ceramic layer with a limited accuracy. Position inaccuracies of up to +/- 30 µm in serial production have so far not been avoided. On the one hand, this can lead to layer misalignments within such integrated electronic elements that extend over several stacked metal-containing and ceramic layers. This can result in undesirable electrical losses. On the other hand, this can lead to different distances between the integrated electronic elements and other technical arrangements such as antennas, which results in undesirable electrical losses and interference signals.

Because of this limited accuracy, only metal-containing layers up to a certain maximum dimension can be produced with the usual methods. If this maximum dimension is exceeded, the influence of positional inaccuracies of the integrated electrical elements becomes too great.

The points mentioned stand in the way of the increasingly higher performance requirements for such electronic components. Previous approaches focus on the use of new materials and printing processes. However, this is associated with disadvantages in processing, such as a limited number of layers in the stacking. Furthermore, these components cannot replace the function of the ceramic multilayer components in an equivalent manner.

It is therefore an object of the present invention to find a way to further improve the structuring of metal-containing layers, in particular with regard to structural accuracy.

This object is at least partially achieved by the method disclosed in claim 1.

• - Aufbringen einer metallhaltigen Schicht, die eine Grobstruktur aufweist und ein pastöses Material umfasst, auf eine Oberfläche. Die Hauptkomponenten des pastösen Materials sind ein oder mehrere Metalle und ein organisches Lösemittel.

The present invention discloses a method for the fine structuring of coarsely structured, pasty metal-containing layers. The procedure consists of the following steps:

• - Application of a metal-containing layer, which has a coarse structure and comprises a pasty material, on a surface. The main components of the pasty material are one or more metals and an organic solvent.

The coarsely structured and pasty metal-containing layer can already have a defined structure. The metal-containing layer can form a coherent area on the surface or comprise several flat sections which lie within the same plane and have the same height but are not connected to one another. the In one embodiment, individual flat sections have a length and a width of in each case at least 50 μm.

The metal-containing layer comprises a pasty material which contains one or more metals and an organic solvent as the main component. In addition, the metal-containing layer can contain a plastic powder.

The metals are in powder form in the form of metal grains that can be chemically or physically bonded.

Possible metals are, for example, copper or silver. For applications at high temperatures, Osram, for example, can be used as an alternative. The proportion of metal grains in the pasty metal-containing layer can be more than 70% of the volume of the layer. In one embodiment, the proportion of metal grains can be more than 83% of the volume.

In addition to the metal-containing, powdery solid, the metal-containing layer contains an organic solvent, which gives the metal-containing layer its pasty properties. In addition, the metal-containing layer can contain a plastic powder. The proportion of the organic solvent and the plastic powder in the paste-like metal-containing layer can, taken together, amount to 10% to 30% of the volume of the layer.

• - Scannen der Lage und Fläche der metallhaltigen Schicht und Generieren eines Datensatzes aus den erfassten Daten.

The organic solvent can form chemical or physical bonds with the metal grains. The processability of a paste to be applied or already applied can be adjusted with the type and viscosity of the solvent.

• - Scanning of the position and surface of the metal-containing layer and generation of a data record from the recorded data.

• - Auswerten des Datensatzes durch Vergleich mit vorgegebenen Werten.

The position and area of all sections of the metal-containing layer can be optically recorded by a scanner suitable for this purpose and stored in a data record. For example, a scanner can be used for this, which optically scans the entire surface covered with pasty, metal-containing material.

• - Evaluation of the data set by comparison with specified values.

• - Ermitteln kritischer Abschnitte der metallhaltigen Schicht, die von den vorgegebenen Werten abweichen.

From the data set obtained by scanning, the position and area of each section of the metal-containing layer can be determined and compared with predetermined target values. With regard to the position, a local or a global coordinate system can be defined for this, for example. A global coordinate system assigns a coordinate to every point on the surface. A local coordinate system describes a position in relation to a selected fixed point within the surface, such as a fixed technical arrangement. Such an arrangement can be an antenna, for example.

• - Determination of critical sections of the metal-containing layer that deviate from the specified values.

If the position and area of a section of the metal-containing layers do not match the specified target values, this is referred to as critical. In the present method, only those critical sections are taken into account that exceed the specified dimensions in terms of shape and area.

If the dimensions of an area are too small, this cannot be corrected with the present method. In order to avoid too small dimensions, when applying the metal-containing layer, one can preferably work with dimensions which slightly exceed the setpoint values. The exact dimensions can then be adjusted in the course of the procedure.

• - Zersetzen der kritischen Abschnitte per Laserbestrahlung in ein metallhaltiges Pulver, wobei die grobstrukturierte metallhaltige Schicht in eine gewünschte feinstrukturierte Schicht überführt wird.

If the position and / or area of a section is classified as critical by comparison with the setpoint values, this section is recorded as critical and its position and area are stored in a critical data record.

• Decomposition of the critical sections by laser irradiation into a metal-containing powder, the coarsely structured metal-containing layer being converted into a desired finely structured layer.

The area and position of the critical sections of the metal-containing layer are stored in the critical data set. A laser is aligned according to this critical data set and moved over the metal-containing layer in such a way that it is directed at one of the critical sections and irradiates it. As a result of the laser irradiation, the pasty metal-containing layer is broken down into a metal-containing powder within the critical section. The reason for this is the warming up of the metal-containing layer with continuous irradiation. This leads to the volatilization of the organic solvent and the breaking of the bonds between the individual grains of the pasty metal-containing layer.

The pasty property of the metal-containing layer thus decreases and the metal-containing layer decomposes into a metal-containing powder. In the metal-containing powder, the individual metal grains and non-metal grains such as plastic grains hardly form bonds with one another. is If the metal-containing layer of a critical section decomposes, the laser can be moved further and the next critical section can be irradiated.

To accelerate the method, several lasers can be used at the same time in one embodiment.

The method enables the shape and area of the sections of the metal-containing layer to be matched to predetermined target values.

In this way, the dimensions of the individual sections of the metal-containing layer can be reduced and the layer can be converted into a finely structured metal-containing layer. In one embodiment, the dimension of a single section of the metal-containing layer can be reduced to less than 30 μm. In a preferred embodiment, the dimension of a single section can be reduced to less than 20 µm. The disclosed method thus enables an increased degree of fine structuring of the metal-containing layer.

Furthermore, positional inaccuracies of the sections of the metal-containing layer can be corrected by means of this method. If the distance between two current-carrying sections of the metal-containing layer is too small, capacitive and / or inductive interactions can occur, both of which are dependent on the distance between the sections. In addition, the functional reliability can be endangered by possible electrical flashovers or short circuits.

The same applies to a small distance between a current-carrying section of the metal-containing layer and a technical arrangement such as an antenna. If the distance is too short, interference signals can occur in the antenna.

For example, it is desirable that the distance between an integrated antenna and the metal-containing layer is the same in every direction and greater than a defined minimum distance.

By decomposing a critical section, the respective distance between the individual sections of a metal-containing layer or the distance to further technical arrangements can be increased.

The disclosed method thus enables an increased degree of accuracy in the fine structuring of the metal-containing layer.

In a preferred embodiment, the metal-containing layer is applied to the surface of a ceramic layer.

The ceramic layer can comprise a ceramic, the main constituent of which can be, for example, aluminum oxide or zirconium oxide. The ceramic layer can be cuboid and have a defined height and a defined base area. The base can have a square shape of a certain dimension. A common dimension for a side length of the base area of the ceramic layer can be more than 5 cm and less than 30 cm. A dimension for a side length can preferably be more than 10 cm and less than 25 cm. Even more preferably, the dimension for a side length is approximately 10 cm.

In one embodiment, the height of the ceramic layer in the sintered state can be between 10 μm and 1 mm. In a preferred embodiment, the height of the ceramic layer can be between 20 μm and 200 μm. In the non-sintered state, the height of the ceramic layer is roughly double.

If a section of the ceramic surface is irradiated with a laser during the process, the structure of the ceramic, unlike that of the metal-containing layer, does not change. The reason for this can be, for example, a high radiation permeability, such as that exhibited by glass ceramics, for example, or a good thermal conductivity of the ceramic layer.

In one embodiment, the metal-containing layer can be printed onto the surface.

In a preferred embodiment, the metal-containing layer is printed onto the surface of the ceramic layer by screen printing.

In screen printing, a metal or plastic screen is used as a template by sealing selected meshes of the screen with foil or varnish. Subsequently, printing ink is printed through the open mesh of the screen onto a metal-containing layer previously applied evenly to the ceramic layer. The printing ink protects the printed sections in the subsequent etching process, so that the printed sections of the metal-containing layer are retained after the etching. A large number of different metal-containing structures can thus be produced in parallel on the surface of the ceramic layer.

In one embodiment, the ceramic layer comprises a green sheet. This means that the ceramic layer is in an unsintered state.

This makes sense insofar as, after the pasty, metal-containing layer has been applied, a sintering step can be carried out to harden the metal-containing layer. Thus can Ceramic layer and metal-containing layer can be sintered in one step.

In one embodiment, the ceramic layer comprising the metal-containing layer applied thereon is sintered after fine structuring has taken place. During sintering, the ceramic and the metal are heated to a certain temperature and held so that a desired structure is established in the ceramic or in the metal.

The structure of the material influences properties such as the hardness and durability of the material. During the sintering process, the organic solvent evaporates within the pasty metal-containing layer. The pasty property of the metal-containing layer thus decreases and a solid, hardened metal-containing layer is formed.

In one embodiment, several ceramic layers, each with applied metal-containing layers, are stacked after fine structuring and before sintering to form a ceramic multilayer component. The component solidifies and sinters together in the subsequent sintering process.

In one embodiment, the metal-containing layer comprises sections of integrated electronic elements. The integrated electronic elements are electronic components that are formed by defined sections of one or more metal-containing layers.

A single portion of the metal-containing layer can be an integrated electronic element. On the other hand, an integrated electronic element can comprise a plurality of sections of the metal-containing layer or a plurality of metal-containing layers.

Sections that lie in different metal-containing layers, but together form an integrated electronic element, can be connected by vias, i.e. electrical plated-through holes. The vias are contained in the ceramic layers arranged between the metal-containing layers.

An integrated electronic element can be, for example, a conductor track, a resistor, a coil, a capacitor or an electronic coupling.

In order to produce integrated electronic elements that comprise sections of several metal-containing layers, several ceramic layers with metal-containing layers applied thereon are stacked. For this purpose, the sections that belong together can be contacted via associated vias in the ceramic layers intervening ceramic layers. The associated sections in the various metal-containing layers and the associated vias in the ceramic layers can lie on top of one another. Contact points of the sections preferably lie precisely over associated vias. In this way, unwanted electrical losses can be minimized.

The disclosed method enables a higher degree of accuracy of the fine structuring of the metal-containing layers than methods of the prior art. The method thus enables the formation of cross-layer integrated electronic elements, between the individual sections of which there is a closed contact so that undesired electrical losses are minimized.

The precise arrangement of the individual sections of the integrated electronic elements further minimizes the misalignment of related sections of the same integrated electronic elements in different layers, such as, for example, several turns of a coil. The low layer offset enables a large number of layers to be stacked.

In order to efficiently produce several components at the same time, ceramic layers of correspondingly large dimensions can be used in the production process, onto which sections of integrated electronic elements of several components can be applied. Several such ceramic layers can then be stacked. The resulting multi-layer substrate can then be separated into individual multi-layer components of smaller dimensions. The separation can be done e.g. by sawing.

The number of possible multilayer components that a multilayer substrate comprises depends on the one hand on the fine structuring of the integrated electronic elements. This can be improved by the method described.

On the other hand, the number of multilayer components depends on the dimensions of the multilayer substrate. With the use of larger ceramic layers, the positional inaccuracies of the portions of the integrated electronic elements thereon increase. The method described allows these positional inaccuracies to be minimized and thus the production of comparatively larger ceramic layers.

In one embodiment, the metal-containing layer is scanned and the data record obtained during scanning is evaluated automatically by an automatic optical inspection system (AOI system).

By using an AOI system, the scanning process and the evaluation process can be automated and accelerated. Critical sections of the metal-containing layer can be registered more effectively, faster and more precisely. This also enables a more precise and effective use of the laser for irradiating and decomposing the critical sections of the metal-containing layer.

In one embodiment, the metal-containing powder released by the laser irradiation is removed from the surface of the ceramic layer by suction. The metal-containing powder is formed during the decomposition of the metal-containing layer by laser irradiation. The powder consists of a loose collection of individual metal grains that hardly form bonds with one another. Furthermore, the powder can comprise plastic granules. The suction can take place, for example, with the aid of a vacuum pump.

In one embodiment, the metal-containing layer contains a non-metal-containing material, such as a ceramic material, as a secondary component. The non-metal containing material is in the form of grains. A grain can contain both metal-containing and non-metal-containing material. Examples of non-metal-containing materials can be ceramics or glass ceramics and plastics.

If the pasty metal-containing layer is irradiated with a laser, the metal heats up. The rise in temperature leads to the volatilization of the organic solvent and the breaking of the bonds between the grains. The pasty property of the metal-containing layer thus decreases and the metal-containing layer decomposes into a metal-containing powder. In the metal-containing powder, the individual metal-containing and non-metal-containing grains hardly form bonds with one another.

The invention further comprises a ceramic multilayer component which is manufactured according to the method described. The multilayer component comprises several ceramic layers and each finely structured, metal-containing layers arranged between them. The ceramic layers include vias that are used for electrical through-plating. The metal-containing layers comprise sections of integrated electronic elements such as coils, couplings, capacitors or conductor tracks.

The ceramic layers and the metal-containing layers are stacked on top of one another in such a way that integrated electronic elements that extend over several layers are formed. Contact surfaces of related sections of integrated electronic elements in different metal-containing layers are electrically connected with an exact fit via an associated via.

If an integrated electronic element is a coil, each metal-containing layer can, for example, comprise half a turn of the coil. Two metal-containing layers lying one on top of the other then encompass an entire turn of the coil. Each section of the coil has contact surfaces at both ends. With the aid of the disclosed method, the contact surfaces can be applied precisely to the vias. The individual sections of the coil, which are in different planes and thus in different metal-containing layers, can thus be connected by vias in the ceramic layers lying in between.

The minimum distance between two integrated electronic elements in the same metal-containing layer is less than 30 µm.

This means that more integrated electronic elements can be applied to the surface of a ceramic layer than has been the case up to now in the prior art. The disclosed method makes the smaller minimum distance between the integrated electronic elements possible.

• 1 zeigt im Querschnitt ein keramisches Vielschichtbauteil, umfassend Keramikschichten, metallhaltige Schichten und integrierte elektronische Elemente.
• 2 zeigt in der Draufsicht eine beispielhafte Keramikschicht mit aufgebrachter, grobstrukturierter metallhaltiger Schicht.
• 3 zeigt in der Draufsicht die beispielhafte Keramikschicht mit aufgebrachter, feinstrukturierter metallhaltiger Schicht.
• 4 zeigt in der Draufsicht drei metallhaltige Schichten einer Ausführungsform eines Vielschichtbauteils mit integrierten elektronischen Elementen.
• 5 zeigt in der Draufsicht eine Ausführungsform einer Keramikschicht mit aufgebrachter, feinstrukturierter metallhaltiger Schicht.

In the following, exemplary embodiments of the invention are to be explained in more detail with reference to schematic figures. The invention is not restricted to the exemplary embodiments disclosed. Identical or similar elements in the figures are provided with the same reference symbols.

• 1 shows in cross section a ceramic multilayer component comprising ceramic layers, metal-containing layers and integrated electronic elements.
• 2 shows a plan view of an exemplary ceramic layer with an applied, coarsely structured metal-containing layer.
• 3 shows a top view of the exemplary ceramic layer with an applied, finely structured metal-containing layer.
• 4th shows a plan view of three metal-containing layers of an embodiment of a multilayer component with integrated electronic elements.
• 5 shows a plan view of an embodiment of a ceramic layer with an applied, finely structured metal-containing layer.

1 shows an embodiment of a ceramic multilayer component 1 according to the present invention. The multi-layer component 1 has a bottom 1A and a top 1B . The multi-layer component 1 comprises eight ceramic layers 2 . On seven of these ceramic layers 2 is a metal-containing layer 3 upset. So there is always between two ceramic layers 2 a metal-containing layer 3 . At the bottom 1A and top 1B there is a ceramic layer in each case 2 before.

The multi-layer component 1 was singulated from a multilayer substrate. The separation was carried out by means of saws. The multilayer substrate can have a large number of multilayer components 1 of the same size and quality. The dimensions of a surface of a ceramic layer in the multilayer substrate are between 20 cm and 25 cm in length and width. The height of a ceramic layer is approx. 50 µm in the unsintered state and approx. 25 µm after sintering.

The metal-containing layers 3 include built-in electronic elements 4th . In 1 are various examples of integrated electronic elements 4th shown. In order to avoid unwanted capacitive and / or inductive interactions, a minimum distance is required between the individual integrated electronic elements 4th adhered to.

An example of an integrated electronic element 4th is the coil 4A with a total of 1.5 turns from the second bottom to the fourth bottom metal-containing layer of the multilayer component 1 extends. Each of these layers comprises a portion of the coil 4A which corresponds to half a turn. Between the three sections of the coil 4A are ceramic layers 2 before. The respective ends of the sections of the coil 4A indicate contact points 5 on. The respective corresponding contact points 5 are through the ceramic layer 2 through via vias 6th electrically contacted.

Furthermore, the multilayer component 1 in the second lowest metal-containing layer 3 two conductor tracks 4B on. The conductor tracks are at a distance of 30 µm on the bottom ceramic layer 2 upset.

It also includes the multilayer component 1 further technical arrangements, such as an antenna 7th . In order to avoid interfering signals, a minimum distance is required between the integrated electronic elements 4th and the antenna 7th adhered to.

2 shows an exemplary ceramic layer in a plan view 2 of a multilayer component 1 on which a pasty and coarsely structured metal-containing layer 3 is upset. The ceramic layer 2 includes, for example, alumina. The metal-containing layer 3 comprises a pasty material. The main component of this pasty material here are silver grains. In addition, the pasty material comprises a solvent and optionally an organic binder.

The metal-containing layer 3 includes various built-in electronic elements 4th . One of those built-in electronic elements 4th is the coil 4A . The exemplary metal-containing layer comprises a first portion of the coil 4A which corresponds to three quarters of a turn. There is a contact point at the end of the section of the coil 5 . Here is the coil 4A with a via 6th contacted. The sink 4A is by means of a conductor track 4B with a compact metal-containing layer 4C tied together.

In the ceramic layer 2 there are six antennas 7th integrated. The antennas 7A and 7B lie within the compact layer 4C . In the present embodiment, for example, an antenna can be formed by a plurality of metal-containing vias arranged coaxially one above the other. The coaxially superimposed vias result in an antenna that extends seamlessly over several superimposed ceramic layers 2 and metal-containing layers 3 extends. An antenna can extend over all layers of a multilayer component 1 and extend beyond.

The minimum required distance between these antennas 7A and 7B and the compact metal-containing layer 4C can be adhered to.

The metal-containing layer 3 is screen printed on the ceramic layer 2 applied. Due to the inadequacies of the printing process, there are portions of the metal-containing layer 3 partly imprecise on the ceramic layer 2 upset. These sections, the dimensions of which deviate from the nominal values in area and position, are referred to as critical sections.

For example, as shown, the required minimum distances between the metal-containing layer are here 3 and the antennas 7A not adhered to. This can occur when current flows in the metal-containing layer 3 for example on interference signals and influencing the impedance in the antennas 7A to lead.

Furthermore, the conductor track 4B cannot be printed as narrow as desired. The dimensions of a conductor track that is applied by screen printing is limited to a minimum width of approx. 50 µm.

The contact point also covers one another 5 the coil 4A does not fit perfectly with the via 6th . The reason for this is again the insufficient accuracy of the screen printing process. Due to this positional inaccuracy of the contact point 5 can cause undesirable electrical losses.

3 shows the exemplary ceramic layer 2 the end 2 with applied metal-containing layer 3 after the metalliferous layer 3 was finely structured by laser irradiation.

The coarsely structured metal-containing surface was used for this purpose 3 scanned by an AOI system and the previously described critical sections, the dimensions and positions of which deviate from the nominal values, are stored in a corresponding data record.

The critical sections are then irradiated with a laser so that the critical sections heat up. A laser with a suitable wavelength and power is selected for this. For example, a laser with a wavelength between 900 nm and 1100 nm and a power between 4 W and 6 W is selected. The spot diameter of the laser is preferably less than 30 μm.

The pasty material of the metal-containing layer heats up when the laser is irradiated 3 . This leads to the volatilization of the organic solvent. Furthermore, the physical or chemical bonds between the individual silver grains dissolve. The pasty material thus decomposes into a silver powder.

The silver powder can then be removed from the ceramic surface 2 be sucked off.

Thus, the in 3 The fine structure shown has been preserved.

This is due to the removal of the respective critical sections of the compact area 4C the minimum distance between the antennas 7A and the compact area 4C now complied with. This leads to a decrease in electrical interactions and the resulting interference signals.

The conductor track 4B has been shrunk to a width of, for example, 30 µm by means of laser irradiation. Smaller dimensions allow a higher number of conductor tracks on a ceramic surface of the same size. Thus, the performance of such ceramic layers 2 built-up multilayer component 1 can be increased.

The contact point 5 has been made more precise by means of laser irradiation. The contact point now almost precisely overlaps the via 6th . This leads to a reduction in unwanted electrical losses.

Made of several ceramic layers 2 with printed metal-containing layers 3 a multi-layer component can be stacked after the fine structuring has been carried out and described. The stacking is carried out so that contact points 5 of sections of associated integrated electronic elements 4th as precisely as possible over the associated vias 6th are positioned to avoid electrical losses. One via 6th contacts two contact points at a time 5 associated sections of an integrated electronic element 4th through a ceramic layer 2 through.

4th shows schematically a multilayer component 1 an embodiment in a plan view. In the example shown there are three ceramic layers 2 , which are each printed with metal-containing layers 3A, 3B and 3C, stacked one on top of the other. It is only the ceramic layer on which the lowermost metal-containing layer 3C is based 2 shown. The overlying ceramic layers 2 have been neglected for reasons of clarity. The metal-containing layers 3A to 3C of the illustrated multilayer component 1 were screen-printed onto the respective ceramic layer 2 upset.

The multi-layer component shown 1 contains various integrated electronic elements such as a coil 4A and vias 4D who have favourited sections in multiple metal-containing layers 3 include. In 4th three metal-containing layers 3A, 3B and 3C, which lie one above the other, are shown by way of example.

Due to the positional inaccuracies of the screen printing process, the sections that belong together are located in the various metal-containing layers 3 offset forward. This misalignment leads to undesirable electrical losses and interference effects. When a large number of metal-containing layers are stacked on top of one another, such positional errors can multiply and the function of the multilayer component can be considerably restricted. This is particularly true of the vias 4D It is easy to see that in the individual metal-containing layers are all slightly offset from one another and are therefore no longer arranged or aligned with one another in a precisely fitting manner.

With the aid of the disclosed method, it is possible to identify positional inaccuracies and the resulting positional misalignment of sections of the same integrated electronic components 4th to minimize. In this way, undesired electrical losses and interference effects can also be reduced.

5 shows a further embodiment of a ceramic layer 2 of a multilayer component 1 . on the ceramic layer 2 is again a metal-containing layer 3 applied. The metal-containing layer 3 includes integrated electronic elements 4th . This includes the conductor track 4E. In the present example, the conductor track 4E is characterized in that it has a width of 30 μm on its narrow side. This breadth was achieved using the disclosed method.

For this purpose, a large-area, compact, metal-containing layer was used 4C by means of a laser along two paths 8th removes the metal-containing material. The metal-containing layer was used for this purpose 4C in the area of the railways 8th decomposed by laser irradiation and the resulting powder is then sucked off. The two adjacent tracks 8th are arranged in parallel, the distance between the two closest edges of the two tracks being only 30 µm. The one between the two tracks 8th Remaining metal-containing strips 4E functions as a conductor path, the small width of which, here 30 μm, could not be produced solely with the printing process but only with the process according to the invention.

List of reference symbols

1

Multilayer component

1A

Underside of the multilayer component 1

1B

Upper side of the multilayer component 1

2

Ceramic layer

3

metalliferous layer

4th

integrated electronic element

4A

Kitchen sink

4B, E

Conductor tracks

4C

compact metal-containing layer

4D

Via

5

Contact point

6th

Via

7th

antenna

7A, B

Antennas within the compact layer 4C

8th

Track, free of metal-containing layer 3

Claims (11)

Method for the fine structuring of coarsely structured, pasty, metal-containing layers 3, comprising the following steps: - Application of a metal-containing layer 3, which has a coarse structure and comprises a pasty material, the main components of which are one or more metals and an organic solvent, on a surface, - Scanning the position and surface of the metal-containing layer 3 and generating a data record from the recorded data, - Evaluation of the data set by comparison with specified values, - Determination of critical sections of the metal-containing layer 3 that deviate from the specified values, Decomposition of the critical sections by laser irradiation into a metal-containing powder, the coarsely structured metal-containing layer 3 being converted into a desired finely structured layer 3. Procedure according to Claim 1 , the metal-containing layer 3 being applied to the surface of a ceramic layer 2. Procedure according to Claim 2 , the metal-containing layer 3 being applied to the surface of the ceramic layer 2 by screen printing. Procedure according to Claim 2 or 3 , wherein the ceramic layer 2 comprises a green sheet. Procedure according to Claim 4 , wherein the ceramic layer 2 comprising the applied metal-containing layer 3 is sintered after fine structuring has taken place. Procedure according to Claim 5 , wherein several ceramic layers 2 with applied metal-containing layers 3 are stacked after fine structuring and before sintering to form a ceramic multilayer component 1. Method according to one of the Claims 1 until 6th wherein the metal-containing layer 3 comprises sections of integrated electronic elements 4. Method according to one of the Claims 1 until 5 , whereby the scanning and the evaluation of the data record obtained are automated by an automatic optical inspection system (AOI system). Method according to one of the Claims 1 until 8th , wherein the metal-containing powder is removed from the surface of the by suction. Method according to one of the Claims 1 until 9 wherein the metal-containing layer 3 comprises non-metal-containing materials, in particular ceramic materials, as a secondary component. Ceramic multilayer component 1, which by a method according to one of Claims 1 until 10 is manufactured and which comprises several ceramic layers 2 and each finely structured, metal-containing layers 3 arranged between them, wherein: the ceramic layers 2 comprise vias 6 for electrical through-plating, the metal-containing layers 3 comprise sections of integrated electronic elements 4, and - the ceramic layers 2 and the metal-containing layers 3 are stacked on top of one another in such a way that integrated electronic elements 4 are formed which extend over several metal-containing layers 3, wherein - contact surfaces 5 of associated sections integrated electronic elements 4 in different metal-containing layers 3 are electrically connected with an accurate fit via an associated via 6, and the minimum distance between two integrated electronic elements 4 in the same metal-containing layer 3 is less than 30 μm.

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