DE102020107240A1 - Composite connection of two components - Google Patents

Abstract

A method for connecting a first component (2) to a second component (3), comprising: a) providing a plurality of nanowires (1) on a contact surface (4) of the first component (2), b) applying an adhesive (6) on the contact surface (4) of the first component (2) and / or on a contact surface (5) of the second component (3), c) merging the first component (2) and the second component (3) so that the plurality of Nanowires (1) are brought into contact with the contact surface (5) of the second component (3) and the contact surfaces (4, 5) are connected to one another by the adhesive (6).

Description

The present invention relates to a method for connecting a first component to a second component and to an arrangement of two components connected to one another, in particular with regard to components from electronics.

In the most varied of applications, there is a requirement to connect bodies to one another. For example, two metallic bodies or two bodies made of different materials can be connected to one another. This is particularly the case in electronics. A wide variety of methods are known from the prior art for forming such connections. In particular, methods are known which, for example, connect electrical conductors or bodies made of copper by welding, hard or soft soldering, gluing, screwing, riveting or stamping. In such methods, prepared surfaces are precisely aligned with one another and connected to one another. The bodies to be connected must therefore be clearly geometrically determined and prepared in terms of their length and their connection location. Furthermore, the preparations for establishing the connection must be made in advance, such as drilling holes or providing appropriate connecting elements. The connection techniques of gluing, screwing and riveting are room temperature processes. Welding, soft and hard soldering, on the other hand, are hot processes in which liquid metal is generated, which fills the volume and inserts itself into the joint in a metallically interacting manner.

Due to its considerable temperature input of regularly up to 1400 ° C, welding has the disadvantage that, on the one hand, it heats the affected bodies to a considerable extent, so that there is a risk of flammable materials starting a fire. Optical changes to the surface of the bodies to be connected can also occur, which can be problematic in particular in the case of pretreated surfaces with lacquers, foils or coatings. In addition, many materials cannot be welded.

Brazing of copper, for example, can also cause the components involved in the connection to heat up considerably (in particular above 400 ° C.) due to its considerable thermal energy input. This can cause flammable materials to ignite.

Soft soldering of copper, for example, can have the disadvantage that, on the one hand, the shear strength of the connection is lower than required and, on the other hand, that with soft solders, temperature fluctuations lead to the segregation of the metal and thus to an embrittlement of the connection. This can lead to failure of the connection. Furthermore, soft solders have the disadvantage that they have a significantly higher contact resistance of the connection than, for example, pure copper. Another disadvantage of soft solder connections is their low mechanical fatigue strength, which usually only exists up to around 120 ° C. The corrosion resistance of such a connection to acidic media is also often inadequate.

When screwing and riveting, the parts must be joined together particularly precisely. The required hole and the structure through the screw or rivet connection regularly leads to an optical impairment of the optical and mechanical appearance of the overall construction. Furthermore, it must be structurally ensured that it is known in advance at which exact point the connection is to be made. This can make it difficult or impossible to use components that are not defined in length. Furthermore, with such a connection there is usually a residual gap between the components. Capillary action can lead to moisture entering the remaining gap and subsequent corrosion. Corrosion can damage the connection. A thermal contact resistance of the connection can also increase. Furthermore, a hole for a screw or rivet can cause leaks in the area of the connection. This can make the use of such a connection more difficult, for example for vessels or pressure systems, in particular because additional sealing means are required.

Proceeding from this, it is the object of the present invention to solve or at least reduce the technical problems described in connection with the prior art. In particular, a method for connecting a first component to a second component and an arrangement of two components connected to one another are to be presented in which a particularly mechanically stable and particularly good electrically and / or thermally conductive connection between the components is particularly safe and simple is or is formed.

These objects are achieved with a method and with an arrangement according to the features of the independent patent claims. Further advantageous refinements are specified in the patent claims, which are formulated as dependently in each case. The features listed individually in the patent claims can be combined with one another in any technologically sensible manner and can be obtained from the description by means of explanatory facts are supplemented, with further design variants of the invention are shown.

1. a) Bereitstellen einer Vielzahl von Nanodrähten auf einer Kontaktfläche des ersten Bauteils,
2. b) Aufbringen eines Klebstoffs auf die Kontaktfläche des ersten Bauteils und/oder auf eine Kontaktfläche des zweiten Bauteils,
3. c) Zusammenführen des ersten Bauteils und des zweiten Bauteils, so dass die Vielzahl der Nanodrähte mit der Kontaktfläche des zweiten Bauteils in Kontakt gebracht wird und die Kontaktflächen durch den Klebstoff miteinander verbunden werden.

According to the invention, a method for connecting a first component to a second component is presented. The procedure includes:

1. a) providing a multiplicity of nanowires on a contact surface of the first component,
2. b) applying an adhesive to the contact surface of the first component and / or to a contact surface of the second component,
3. c) bringing the first component and the second component together, so that the plurality of nanowires is brought into contact with the contact surface of the second component and the contact surfaces are connected to one another by the adhesive.

With the method described, the components can be connected to one another at a particularly low temperature and / or with a particularly low application of force. In particular, the regularly asked requirement that the temperature of the components does not exceed 250 ° C. during the process and that the components are acted on with a maximum pressure of 20 MPa can be met. It is not necessary that chemically aggressive substances are used. The advantages mentioned are made possible by the formation of a connection via a large number of nanowires.

The first component and the second component are preferably electronic components such as semiconductor components, computer chips, microprocessors or circuit boards. The first component and / or the second component are preferably at least partially electrically and / or thermally conductive. With the method described, an electrically and / or thermally conductive connection can be obtained between the two components.

An electrical and / or thermal conductivity in the sense used here is present in particular with metals such as copper, which are generally referred to as “electrically conductive” or equivalent as “electrically conductive” or “thermally conductive” or “thermally conductive”. In particular, materials that are generally considered to be electrically or thermally insulating should not be viewed here as being electrically or thermally conductive.

The method described is not restricted to applications in the field of electronics. For example, it is also possible to mount a component such as a sensor (as a first component) on a wall or bracket (as a second component) according to the method described. The method described enables, in particular, a mechanically stable and electrically and / or thermally conductive connection to be formed between the first component and the second component. The method described can thus be used in all areas in which a corresponding connection between two components is required. The method described is also not limited to a specific size of the components. For example, the method described is suitable for use in the field of electronics, in particular microelectronics, or for connecting significantly larger components on a macroscopic level.

The components can be connected to one another via respective contact surfaces. A contact area is, in particular, a spatially distinctive area of a surface of the respective component. In particular, it is preferable that the contact areas are distinguished by forming the connection. This means that the contact surface does not initially differ from the rest of the surface of the component and only emerges when the connection is formed in such a way that the contact surface is the surface on which the connection is formed. In this case, the contact area is initially only conceptually delimited from the remaining part of the surface of the component. In the area of the contact surfaces, the nanowires and the adhesive can come into contact with the respective component.

The contact surfaces are preferably each simply connected areas of the surface of the respective component. Alternatively, it is possible for the respective contact surface of the first component and / or of the second component to be subdivided into several separate sub-areas of the surface of the respective component. Thus, a contact surface can comprise two or more separate sections of the surface of the respective component. The contact surfaces are preferably electrically and / or thermally conductive.

The components are preferably designed to be rigid or have at least one rigid surface on which the respective contact surface is provided. This means in particular that the components (or at least the contact surfaces) are preferably not flexible. With rigid components or contact surfaces, a connection can be formed particularly well according to the method described. For example, if one of the components were designed to be flexible, the connection could break due to stress on the nanowires. Depending on the precise circumstances, the method described can also be used advantageously with flexible components or contact surfaces.

In the method described, the connection between the components or their contact surfaces is formed on the one hand via a large number of nanowires and on the other hand via an adhesive.

A nanowire is understood here to mean any material body that has a wire-like shape and a size in the range from a few nanometers to a few micrometers. For example, a nanowire can have a circular, oval or polygonal base. In particular, a nanowire can have a hexagonal base area. All of the nanowires involved in the connection are preferably formed from the same material.

It is preferred that the nanowires are formed from a metal. It is particularly preferred that the nanowires are formed from the material of one of the contact surfaces. It is also preferred that both contact surfaces are formed from the same material. In this case, it is preferred that the nanowires are formed from the same material as the two contact surfaces.

The nanowires preferably have a length in the range from 100 nm [nanometers] to 100 μm [micrometers], in particular in the range from 500 nm to 30 μm. Furthermore, the nanowires preferably have a diameter in the range from 10 nm to 10 μm, in particular in the range from 30 nm to 2 μm. The term diameter refers to a circular base area, with a comparable definition of a diameter being used for a base area that differs therefrom. It is particularly preferred that all nanowires used have the same length and the same diameter.

The connection is preferably formed in particular in that the plurality of nanowires is provided between the respective contact surfaces to be connected. Due to the size of the nanowires in the nanometer range, the surface area of the connection (i.e. the area over which forces such as the Vander Waals force act at the atomic level) is particularly large. The connection can thus be particularly good electrically and / or thermally conductive. The nanowires can also contribute to the mechanical stability of the connection. The mechanical stability is, however, also and preferably even mainly obtained via the adhesive. It is even possible that the mechanical stability is achieved exclusively through the adhesive. For a connection that is particularly good electrically and / or thermally conductive, it is preferred that the nanowires are formed from an electrically and / or thermally conductive material. The use of copper is particularly preferred here. The contact surfaces are also preferably formed from an electrically and / or thermally conductive material, in particular from copper. As described above, the use of copper is not possible, especially for welded connections. Due to the large surface area of the connection obtained by the method described, not only an electrical but also a thermal conductivity of the connection can be particularly high. This can, for example, improve the cooling of the components involved in the connection. The use of copper for the nanowires and / or for the contact surfaces is particularly preferred for this purpose.

The connection described can also be made particularly simple and without tools. In order to connect the contact surfaces via the nanowires, the contact surfaces to be connected only have to be brought together. Pressure can be applied optionally, but is not absolutely necessary. The formation of the connection via the adhesive takes place by simply applying the adhesive to one or both contact surfaces and also by bringing the two contact surfaces together. When the contact surfaces are brought together, they are connected to one another both via the nanowires and via the adhesive.

In step a) of the described method, a multiplicity of nanowires is provided on the contact surface of the first component and thus on at least part of the surface of the first component. This can be done in particular by galvanic growth of the nanowires. In this context, providing is to be understood, on the one hand, to mean that the nanowires are applied to the contact surface of the first component as part of the method. On the other hand, the provision also includes using a first component on which the nanowires are already provided on the contact surface. For example, a correspondingly prepared first component can be obtained from a supplier and used for the use of the method described. Such a covering of a prepared first component is also a provision of the nanowires in the sense used here. The method described has the particular advantage that the nanowires only have to be provided on one of the contact surfaces involved and not on both.

The nanowires are preferably provided on the contact surface of the first component in such a way that they are essentially perpendicular (preferably perpendicular) to the contact surface. The entirety of the nanowires provided in accordance with step a) can in particular be referred to as a lawn of nanowires. the However, nanowires can also be provided in any orientation on the contact surface of the first component. It is also possible for the contact surface of the first component to be subdivided into a plurality of subregions (connected to one another or separated from one another), the nanowires being oriented differently in the various subregions. The nanowires can thus make a particularly large contribution to the mechanical stability of the connection, because the nanowires can also withstand shear forces particularly well. Furthermore, it is possible for the nanowires to be designed differently at different points on the contact surface of the first component, in particular with regard to their length, diameter, material and density (the density of the nanowires indicating how many nanowires are provided per area).

In step b) of the method described, an adhesive is applied to the contact surface of the first component and / or to a contact surface of the second component.

In a first preferred embodiment, the adhesive is only applied to the contact surface of the first component. In that case, it is preferred that the adhesive is applied to the contact surface of the first component in such a way that the nanowires are arranged perpendicular to the contact surface even after the adhesive has been applied. Applying the adhesive does not tip over the nanowires. This can be achieved, for example, by using a sufficiently thin-bodied adhesive through which correspondingly low forces are exerted on the nanowires during application. Alternatively, the adhesive or a chemical precursor thereof can already be applied to the contact surface of the first component during the growth of the nanowires. Steps a) and b) can therefore be carried out at the same time. Because both the adhesive and the nanowires are provided on the same surface, the connection in step c) can be formed in a particularly reliable manner. It is not to be expected that the nanowires will tip over, kink or shift when the two components are brought together, and in particular due to the adhesive. The adhesive, which is already located between the nanowires before the two components are brought together, stabilizes the nanowires. The ends of the nanowires can also reach the contact surface of the second component in a particularly reliable manner in order to come into contact therewith. If the adhesive were not only provided on the contact surface of the first component, the nanowires would have to be immersed in the adhesive in step c). The adhesive could prevent the ends of the nanowires from reaching the contact surface of the second component. This applies in particular when the adhesive is present as a layer with too great a thickness on the contact surface of the second component. However, if the adhesive is present in a sufficiently small amount on the contact surface of the second component, the ends of the nanowires can reach the contact surface of the second component. This enables the two preferred embodiments described below.

In a second preferred embodiment, the adhesive is only applied to the contact surface of the second component. It is preferred that in step a) nanowires are only provided on the contact surface of the first component. In that case, the adhesive and the nanowires are provided on different of the two contact surfaces. This embodiment allows the method to be carried out in a particularly simple manner because neither of the two contact surfaces has to be provided with both the adhesive and the nanowires. Steps a) and b) can therefore be carried out independently of one another. If the components are brought together in step c), the nanowires can be pressed into the adhesive until the ends of the nanowires come into contact with the second contact surface. For this purpose, it is preferred that the adhesive is applied to the contact surface of the second component with a sufficiently small layer thickness.

In a third preferred embodiment, the adhesive is applied both to the contact surface of the first component and to the contact surface of the second component. As a result, the advantages of the first and second preferred embodiment can be combined with one another. Thus, the adhesive can be applied to the contact surface of the second component with a smaller thickness than would be required according to the second preferred embodiment. This reduces the risk that the ends of the nanowires will not reach the contact surface of the second component due to the adhesive. Likewise, the amount of adhesive to be applied to the contact surface of the first component is less. Compared to the first embodiment, this makes it easier to carry out the method because less adhesive has to be applied to the contact surface of the first component with the nanowires than would be necessary in accordance with the first preferred embodiment. Furthermore, it is particularly preferred in the third preferred embodiment that a two-component adhesive is used. In that case, a first component of the two-component adhesive can be applied to the contact surface of the first component and a second component of the two-component adhesive can be applied to the contact surface of the second component. Only when the components are brought together do the two components of the two-component adhesive come into contact with one another. Through this premature curing of the two-component adhesive can be prevented.

In step c) of the method described, the components or the contact surfaces are brought together, that is to say moved towards one another. The nanowires on the contact surface of the first component thereby come into contact with the contact surface of the second component. It is preferred here that the ends of the nanowires that are remote from the contact surface of the first component come into contact with the contact surface of the second component. After the connection has been formed, the nanowires are therefore connected to the contact area of the first component via a first end and to the contact area of the second component via a second end. The connection between the first component and the second component can already be completely formed by step c). This is particularly the case with a fast-curing adhesive.

Process steps a) to c) are preferably carried out in the specified order, in particular one after the other. In particular, steps a) and b) are preferably carried out and in particular completed before the start of step c). Steps a) and b) can, however, also be carried out completely or partially in a temporally overlapping manner. In particular, steps a) and b) can also be carried out independently of one another, provided that the adhesive in step b) is not applied to a contact surface on which nanowires are also provided. In that case, step b) can also be carried out before step a).

In addition to the adhesive, the connection is also established via the nanowires. This takes place in that the nanowires, in particular their ends facing the contact surface of the second component, are connected to this contact surface. This connection is formed at the atomic level. The atomic process is similar to that during sintering. The connection obtained can in particular be so tight for gases and / or liquids that corrosion of the connection and / or the interconnected components in the area of the connection can be prevented or at least restricted. This can be reinforced by the adhesive. In particular, the connection formed can be viewed as being fully metallic. The formation of the connection via the nanowires can also be referred to as "Velcro welding". This expresses that the connection is obtained by a large number of nanowires and thus by a large number of elongated, hair-like structures. Due to the large number of nanowires, unevenness and roughness of the contact surfaces can be compensated for. Together with the formation of the connection via the adhesive, the process can also be referred to as "Velcro glueing".

According to a preferred embodiment of the method, at least some of the nanowires are in contact with the adhesive after the connection has been formed.

The connection is preferably formed in such a way that the nanowires are arranged in the area of the adhesive. So the nanowires and the adhesive overlap. The connection is thus not formed in such a way that the nanowires are arranged in a first area and the adhesive is arranged in a second area adjoining the first area or at a distance from the first area. Rather, the first area and the second area overlap one another at least partially, preferably even completely. If the first and second areas partially overlap, the nanowires are in contact with the adhesive in the overlap area. If the first and second areas completely overlap, the distinction between the first and second areas is no longer necessary. In this case, the nanowires and the adhesive are arranged in the same area. All of the nanowires are then in contact with the adhesive. If the nanowires are surrounded by the adhesive, the adhesive can protect the nanowires and thus the connection particularly well, in particular against corrosion.

As an alternative to the present embodiment, it is preferred that the connection is formed in such a way that the nanowires are arranged in a first area and the adhesive is arranged in a second area adjoining the first area or spaced apart from the first area. It is particularly preferred that the second area surrounds the first area. In this case too, the adhesive can protect the nanowires and, in this respect, the connection, in particular against corrosion.

According to a further preferred embodiment of the method, the adhesive is liquid when applied in step b).

• - ein Acyrlat
• - ein Epoxidklebstoff,
• - ein vernetzender Klebstoff,
• - ein durch UV-Licht aktivierbarer Klebstoff,
• - ein thermisch aktivierbarer Klebstoff,
• - ein Zweikomponentenklebstoff.

Liquid adhesive can be distributed particularly easily around the nanowires, so that the spaces between the nanowires can be particularly easily filled with the adhesive. On the one hand, this applies to the event that the adhesive is applied to the contact surface of the first component. In this case, liquid adhesive can be distributed particularly easily around the nanowires when it is applied. On the other hand, however, this also applies in the event that the adhesive is applied to the contact surface of the second component. In that case, the nanowires can be incorporated into the adhesive particularly easily so that the adhesive is distributed around the nanowires when the two components are brought together in step c). According to a further preferred embodiment of the method, the adhesive is one of the following:

• - an acylate
• - an epoxy adhesive,
• - a cross-linking adhesive,
• - an adhesive that can be activated by UV light,
• - a thermally activated adhesive,
• - a two-component adhesive.

The adhesive is preferably of low viscosity. The adhesive preferably withstands a peal force of 1 N / mm.

A mixture of one or more of the adhesives mentioned can also be used. It has been found that the adhesives mentioned are particularly suitable for the method described. With all of the adhesives mentioned, a particularly mechanically stable connection can be obtained between the two components, while at the same time the nanowires are affected very little by the adhesive. In particular, it has been found that with the adhesives mentioned, the risk is particularly low that the nanowires are tipped over, kinked or displaced due to the joining of the two components and due to the adhesive.

According to a further preferred embodiment of the method, a plurality of nanowires is also provided on the contact surface of the second component in step a). The components are brought together in step c) in such a way that the nanowires on the contact surface of the second component are brought into contact with the contact surface of the first component.

For the provision of the nanowires on the contact surface of the second component, the above statements regarding the provision of the nanowires on the contact surface of the first component apply accordingly.

In this embodiment, the connection through the nanowires takes place in that the nanowires of the contact surface of the first component come into contact with the contact surface of the second component and that the nanowires of the contact surface of the second component come into contact with the contact surface of the first component. Compared to an embodiment in which nanowires are only provided on the contact surface of the first component, the present embodiment produces a reinforced connection by means of the nanowires. As a result, the connection can be particularly good electrically and / or thermally conductive. The contribution of the nanowires to the mechanical stability of the connection can also be particularly large.

In this embodiment it is preferred that the adhesive is applied to both contact surfaces. As a result, only a comparatively small amount of the adhesive is required on each contact surface. Alternatively, it is preferred that the adhesive is only applied to one of the two contact surfaces. This makes it easier to carry out the method because both adhesive and nanowires are provided on only one of the two contact surfaces.

1. a) Bereitstellen einer ersten Vielzahl von Nanodrähten auf einer Kontaktfläche des ersten Bauteils und einer zweiten Vielzahl von Nanodrähten auf einer Kontaktfläche des zweiten Bauteils,
2. b) Aufbringen eines Klebstoffs auf die Kontaktfläche des ersten Bauteils und/oder auf die Kontaktfläche des zweiten Bauteils,
3. c) Zusammenführen des ersten Bauteils und des zweiten Bauteils, so dass die erste Vielzahl der Nanodrähte mit der Kontaktfläche des zweiten Bauteils in Kontakt gebracht wird, die zweite Vielzahl der Nanodrähte mit der Kontaktfläche des zweiten Bauteils in Kontakt gebracht wird und die Kontaktflächen durch den Klebstoff miteinander verbunden werden.

In this embodiment, steps a) to c) are preferably carried out as follows:

1. a) providing a first plurality of nanowires on a contact surface of the first component and a second plurality of nanowires on a contact surface of the second component,
2. b) applying an adhesive to the contact surface of the first component and / or to the contact surface of the second component,
3. c) bringing the first component and the second component together so that the first plurality of nanowires is brought into contact with the contact surface of the second component, the second plurality of nanowires is brought into contact with the contact surface of the second component and the contact surfaces are brought into contact with the adhesive be connected to each other.

According to a further preferred embodiment of the method, at least the contact surface of the second component is heated to a temperature of at least 90 ° C. and / or a maximum of 270 ° C. in step c).

In step c), at least the contact surface of the second component is preferably heated to a temperature in the range from 150.degree. C. to 270.degree.

On the one hand, the heating can harden the adhesive. On the other hand, the connection between the nanowires and the contact surface of the second component can be strengthened by the heating. Accordingly, it is sufficient that only the contact surface of the second component is heated. In practice, with such heating, it is usually not possible to distinguish whether the contact surface of the first component, the contact surface of the second component, the nanowires, the adhesive, the first component are partially or entirely and / or the second component is partially or entirely heated. This is particularly the case when thermally conductive materials are used. For the formation of the connection between the nanowires a (co-) heating of other components than the contact surface of the second component is not necessary, but also not a hindrance. To cure the adhesive, (co-) heating of components other than the adhesive is not necessary, but it is also not a hindrance. In step c), at least the contact surface of the second component and the adhesive are preferably heated to a temperature in the range from 150.degree. C. to 270.degree.

The heating according to step c) can in particular take place in that the first component and the second component as a whole including the nanowires and the adhesive are heated, for example in an oven. Alternatively, however, it is also possible to introduce heat locally into the area of the connection, in particular into the area of the contact surface of the second component.

For the formation of the connection it can be sufficient that the minimum temperature of 150 ° C described is reached once at least for a short time. It is not necessary to maintain the minimum temperature. However, it is preferred that the temperature at which the heating is carried out in step c) is maintained for at least ten seconds, preferably at least 30 seconds. It can thus be ensured that the connection is formed as desired. Maintaining the temperature for a longer period is generally not harmful.

It is sufficient that the components are brought together in step c). Pressure does not have to be exerted, in particular because the adhesive can pull the two components towards one another. According to a preferred embodiment of the method, however, the first component and the second component are pressed towards one another in step c) with a pressure of at least 2 MPa, in particular at least 10 MPa, and / or of at most 200 MPa, in particular at most 20 MPa.

The pressure used is preferably in the range from 2 to 200 MPa, in particular in the range from 10 to 70 MPa. A pressure of 15 MPa is particularly preferred.

By exerting the pressure, on the one hand, the connection through the adhesive can be made particularly mechanically stable. On the other hand, the connection via the nanowires can be strengthened by applying the pressure.

If the heating described is carried out, the pressure is preferably above the specified lower limit at least in a period of time in which the temperature exceeds the lower limit mentioned for this. In this respect, at least the nanowires and the contact surface of the second component are exposed to both a corresponding pressure and a corresponding temperature, at least in this time segment. As a result, the connection can be formed by the action of pressure and temperature.

• - ein Acyrlat
• - ein Epoxidklebstoff,
• - ein vernetzender Klebstoff,
• - ein durch UV-Licht aktivierbarer Klebstoff,
• - ein thermisch aktivierbarer Klebstoff,
• - ein Zweikomponentenklebstoff.

As a further aspect, an arrangement is presented which comprises a first component and a second component, a contact surface of the first component and a contact surface of the second component being connected to one another by means of an adhesive and by means of a plurality of nanowires. The adhesive is preferably one of the following:

• - an acylate
• - an epoxy adhesive,
• - a cross-linking adhesive,
• - an adhesive that can be activated by UV light,
• - a thermally activated adhesive,
• - a two-component adhesive.

The particular advantages and design features of the method described above can be used and transferred to the described arrangement, and vice versa. The arrangement described is preferably obtained by the method described. In the arrangement, at least some of the nanowires are in contact with the adhesive. All nanowires are particularly preferably in contact with the adhesive.

According to a preferred embodiment of the arrangement, spaces between the nanowires are filled with the adhesive.

The nanowires are preferably sheathed with the adhesive. This means that the outer surfaces of the nanowires are completely covered with the adhesive. The end faces of the nanowires are not in contact with the adhesive, but with the contact surfaces.

According to a further preferred embodiment of the arrangement, the contact surfaces are connected to one another in an electrically and / or thermally conductive manner by the nanowires.

An electrically and / or thermally conductive connection between the two contact surfaces can be achieved via the nanowires in particular in that the nanowires are formed from an electrically and / or thermally conductive material and the nanowires extend over the entire distance between the two contact surfaces. The latter means that a respective first end of the nanowires is in contact with the contact surface of the first component and that a respective second end of the nanowires is in contact with the contact surface of the second component.

This is possible in particular in the preferred embodiment of the arrangement in which the contact surfaces are aligned parallel to one another and the nanowires are aligned perpendicular to the contact surfaces.

In this embodiment in particular, it is therefore possible for the nanowires to extend over the entire distance between the two contact surfaces. The contact surfaces and therefore also the components can be brought into contact with one another via the nanowires.

• 1: eine Darstellung eines erfindungsgemäßen Verfahrens zum Verbinden zweier Bauteile, und
• 2: eine Darstellung einer erfindungsgemäßen Anordnung von zwei gemäß dem Verfahren aus 1 miteinander verbundenen Bauteilen.

The invention and the technical environment are explained in more detail below with reference to the figures. The figures show particularly preferred exemplary embodiments to which, however, the invention is not limited. In particular, it should be pointed out that the figures and in particular the size relationships shown are only schematic. They show schematically:

• 1 : an illustration of a method according to the invention for connecting two components, and
• 2 : a representation of an inventive arrangement of two according to the method 1 interconnected components.

1. a) Bereitstellen einer Vielzahl von Nanodrähten 1 auf einer Kontaktfläche 4 des ersten Bauteils 2 und optional auch auf einer Kontaktfläche 5 des zweiten Bauteils 3,
2. b) Aufbringen eines Klebstoffs 6 auf die Kontaktfläche 4 des ersten Bauteils 2 und/oder auf eine Kontaktfläche 5 des zweiten Bauteils 3, wobei der Klebstoff 6 vorzugsweise beim Aufbringen flüssig ist, wobei als Klebstoff vorzugsweise einer der folgenden verwendet wird:
   • - ein Acyrlat
   • - ein Epoxidklebstoff,
   • - ein vernetzender Klebstoff,
   • - ein durch UV-Licht aktivierbarer Klebstoff,
   • - ein thermisch aktivierbarer Klebstoff,
   • - ein Zweikomponentenklebstoff.
3. c) Zusammenführen des ersten Bauteils 2 und des zweiten Bauteils 3, so dass die Vielzahl der Nanodrähte 1 mit der Kontaktfläche 5 des zweiten Bauteils 3 in Kontakt gebracht wird und die Kontaktflächen 4,5 durch den Klebstoff 6 miteinander verbunden werden. Dabei wird vorzugsweise zumindest die Kontaktfläche 5 des zweiten Bauteils 3 auf eine Temperatur von mindestens 150°C und/oder von maximal 270°C erwärmt. Vorzugsweise werden das erste Bauteil 2 und das zweite Bauteil 3 mit einem Druck von mindestens 2 MPa und/oder von höchstens 200 MPa aufeinander zu gedrückt.

1 shows a method for connecting a first component 2 with a second component 3 . The reference symbols used relate to 2 . The procedure includes:

1. a) Providing a large number of nanowires 1 on a contact surface 4th of the first component 2 and optionally also on a contact surface 5 of the second component 3 ,
2. b) applying an adhesive 6th on the contact surface 4th of the first component 2 and / or on a contact surface 5 of the second component 3 , the glue 6th is preferably liquid when applied, one of the following preferably being used as the adhesive:
   • - an acylate
   • - an epoxy adhesive,
   • - a cross-linking adhesive,
   • - an adhesive that can be activated by UV light,
   • - a thermally activated adhesive,
   • - a two-component adhesive.
3. c) Merging the first component 2 and the second component 3 so that the multitude of nanowires 1 with the contact surface 5 of the second component 3 is brought into contact and the contact surfaces 4.5 by the adhesive 6th be connected to each other. In this case, at least the contact area is preferably 5 of the second component 3 heated to a temperature of at least 150 ° C and / or a maximum of 270 ° C. Preferably the first component 2 and the second component 3 pressed towards each other with a pressure of at least 2 MPa and / or at most 200 MPa.

2 shows an arrangement 7th that came with the procedure 1 can be obtained. The order 7th comprises a first component 2 and a second component 3 . The two components 2, 3 each have a contact surface 4, 5. The contact surfaces 4, 5 are by means of an adhesive 6th and by means of a multitude of nanowires 1 connected with each other. Gaps between the nanowires 1 are with the glue 6th filled. All nanowires 1 stand with the glue 6th in contact. The contact areas 4, 5 are through the nanowires 1 electrically and thermally connected to one another. The contact surfaces 4, 5 and the nanowires are aligned parallel to one another 1 are aligned perpendicular to the contact surfaces 4.5.

List of reference symbols

1

Nanowire

2

first component

3

second component

4th

Contact surface of the first component

5

Contact surface of the second component

6th

adhesive

7th

arrangement

Claims (11)

A method for connecting a first component (2) to a second component (3), comprising: a) providing a multiplicity of nanowires (1) on a contact surface (4) of the first component (2), b) applying an adhesive (6) to the contact surface (4) of the first component (2) and / or to a contact surface (5) of the second component (3), c) bringing the first component (2) and the second component (3) together, so that the plurality of nanowires (1) is brought into contact with the contact surface (5) of the second component (3) and the contact surfaces (4, 5) are connected to one another by the adhesive (6). Procedure according to Claim 1 wherein at least some of the nanowires are in contact with the adhesive after the connection is formed. Method according to one of the preceding claims, wherein the adhesive (6) is liquid when applied in step b). A method according to any one of the preceding claims, wherein the adhesive is one of the following: - an acylate - an epoxy adhesive, - a cross-linking adhesive, - an adhesive that can be activated by UV light, - a thermally activated adhesive, - a two-component adhesive. Method according to one of the preceding claims, wherein in step a) a plurality of nanowires (1) is further provided on the contact surface (5) of the second component (3), and wherein the components (2, 3) are brought together in this way in step c) that the nanowires (1) on the contact surface (5) of the second component (3) are brought into contact with the contact surface (4) of the first component (2). Method according to one of the preceding claims, wherein in step c) at least the contact surface (5) of the second component (3) is heated to a temperature of at least 90 ° C and / or a maximum of 270 ° C. Method according to one of the preceding claims, wherein the first component (2) and the second component (3) are pressed towards one another in step c) with a pressure of at least 2 MPa and / or of at most 200 MPa. Arrangement (7), comprising a first component (2) and a second component (3), wherein a contact surface (4) of the first component (2) and a contact surface (5) of the second component (3) by means of an adhesive (6) and are connected to one another by means of a multiplicity of nanowires (1). Arrangement (7) according to Claim 8 , the spaces between the nanowires (1) being filled with the adhesive (6). Arrangement (7) according to Claim 8 or 9 wherein the contact surfaces (4, 5) are connected to one another in an electrically and / or thermally conductive manner by the nanowires (1). Arrangement (7) according to one of the Claims 8 until 10 , wherein the contact surfaces (4,5) are aligned parallel to one another and the nanowires (1) are aligned perpendicular to the contact surfaces (4,5).

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