DE102019133043A1 - Circuit board and fluid heater - Google Patents

Abstract

Disclosed are a circuit board with a heating strand formed from conductor tracks and a heater designed with such a circuit board.

Description

The invention relates to a circuit board according to the preamble of claim 1 and a fluid heater designed with such a circuit board.

Such fluid heaters are preferably used for heating gaseous or liquid media, for example air or water. The basic structure of these fluid heaters is for example in the document going back to the applicant DE 10 2016 122 767 A1 explained. This fluid heater designed to heat air has a heating element designed as a tubular heating element, the heat of which is transferred to the fluid to be heated via a heat exchanger, also called a heat distribution element. Specifically in the DE 10 2016 122 767 A1 This heat distribution element is designed as a metal sponge or wire mesh / wire mesh, the pores or channels formed thereby being flowed through by the fluid. Of course, other heat distribution elements, for example extruded profiles or corrugated fins, can also be used for heat exchange. The heating element is activated via control and power electronics, the circuit of which is formed on a circuit board / printed circuit board and which is arranged in an electronics housing that is attached to a housing that accommodates the heating element and the heat distribution element. An inlet and an outlet for the fluid to be heated are also formed on this.

In the pamphlet DE 10 2012 209 936 A1 describes a thick-film heater in which conductor tracks are applied to a substrate using an additive method. These conductor tracks form a heating resistor of a heating device.

In the also going back to the applicant DE 10 2018 106 354 A1 it is proposed to use power semiconductors arranged on the board as heating elements, so that the heat generated during operation of the power semiconductors is transferred to the fluid to be heated via a heat distribution element.

The problem with this solution is that the heat generated via the power semiconductors is only generated selectively in relation to the entire heat exchange surface, so that considerable effort is required in order to enable two-dimensional heat transfer through a corresponding design of the heat distribution element. In addition, the technical complexity of this solution is considerable, since the interconnection of the power semiconductors, which are essentially used for heating, is complex compared to conventional solutions with tubular heaters or PTC heating elements, and also expensive due to the comparatively high price of the semiconductors.

In contrast, the invention is based on the object of developing the circuit board provided with a circuit forming control or power electronics and a heater implemented therewith in such a way that effective heating of a fluid is made possible with less effort, in particular less circuitry effort.

This object is achieved with regard to the circuit board by the combination of features of patent claim 1 and with regard to the heater by the features of the independent patent claim 10.

Advantageous further developments of the invention are the subject of the subclaims.

The circuit board / printed circuit board embodied according to the invention is embodied with at least one heating section which is designed for a predetermined heating power for heating a fluid. This heating strand is formed by means of a subtractive method, for example by etching, the cross-section, length and material of which is designed according to the heating resistance required for the heating output. The material is accordingly selected so that it can be processed by means of a subtractive method, for example by etching or milling.

According to the invention, the circuit board / printed circuit board is thus initially designed with a continuous layer / layer formed from the material of the conductor track, from which the areas that do not form a conductor track are then removed by etching or milling.

Such a solution makes it possible, through the suitable choice of the cross section and the geometry of the heating strand, to easily adapt to different heating powers, the circuitry complexity being considerably reduced compared to the solution described above with power semiconductors specially designed for heating. According to the invention, such power semiconductors are at most required for controlling or regulating the heating circuit. According to the invention, the parasitic side effect is thus used when the conductor track is energized, which results from the fact that the conductor track sections heat up as a result of the energization.

According to the invention, the board is designed with a heat distribution layer for heat transfer to the fluid. This heat distribution layer can be designed, for example, as a molded part that is shown in FIG the layer structure of the board is integrated and optimized with regard to fluid flow and heat transfer. By integrating the heat distribution layer into the circuit board / circuit board structure, the outlay on equipment is reduced compared to conventional solutions in which a separate heat distribution element, for example heat exchange surfaces or the like, has to be attached.

The circuit board is preferably designed as an IMS (Insulated Metal Substrate) circuit board in which a heat distribution layer is already conceptually integrated.

Another essential advantage of the solution according to the invention is that the suitable surface extension of the heating strands / conductor tracks ensures uniform heat distribution for heating the fluid.

In one embodiment of the invention, a control circuit and / or power electronics are formed in addition to the heating section on the circuit board / circuit board, which control circuit is designed, for example, to control the heating section or other electronic components.

According to a preferred exemplary embodiment of the invention, a plurality of heating lines that can be individually controlled are formed on the circuit board.

Each IMS board can be designed in multiple layers with at least two functional layers, in each of which a heating element and / or the control circuit and / or power electronics can be formed. Accordingly, one layer of the IMS board can be designed as a heating element and another layer can form a control circuit or power electronics. Of course, mixed forms can also be implemented in which one layer is effective both as a heating element and in the sense of controlling components. In principle, the IMS board can also have a single layer, this layer fulfilling the function of both a heating element and a control circuit / power electronics.

The heat transfer is further improved if the heating section is designed, at least in sections, by meandering conductor tracks. Alternatively, however, the conductor tracks can also be connected in series and / or in parallel in a parallel arrangement or the like.

The production of the circuit board and its connection elements is particularly simple if the latter and other functional elements are formed by bending over tabs or edge sections of the IMS circuit board. For example, it is possible to lead a conductor track end section to such an edge section and then to form a contact tab or the like by bending it over.

Furthermore, it is possible for at least one heating strand to be formed in the bent-over section, which heating element is contacted via sections of the conductor track that are routed over the bent areas. It is also possible to have at least one heating section run in sections in the bent area.

The heater according to the invention has a heating element designed with a circuit board of the type described above.

The conductor track can be designed in a meander shape or bifilar.

It is particularly preferred if the board delimits a fluid channel through which the fluid flows or a fluid space receiving the fluid at least in sections. In other words, in such a variant, the board forms part of the fluid channel / fluid space. This concept, with a fluid space delimited in sections by the board, is the subject of a patent application filed in parallel by the applicant.

• 1 eine dreidimensionale Darstellung eines ersten Ausführungsbeispiels eines erfindungsgemäßen Fluidheizers;
• 2 den Fluidheizer gemäß 1 mit abgenommenen Deckel;
• 3 eine Prinzipdarstellung einer IMS-Leiterplatte des Fluidheizers gemäß den 1 und 2;
• 4 eine Detaildarstellung der IMS-Leiterplatte gemäß 3;
• 5 eine schematische Darstellung des Querschnittes einer derartigen IMS-Leiterplatte;
• 6 eine Darstellung zur Verdeutlichung der Geometrie zweier Heizstränge einer IMS-Leiterplatte gemäß den 4 und 5;
• 7 einen Schnitt entlang der Linie A-A in 1;
• 8 einen entsprechenden Schnitt eines weiteren Ausführungsbeispiels eines Fluidheizers;
• 9 eine Einzeldarstellung eines Formteils zur Fluidführung in einem erfindungsgemäßen Heizer und
• 10a, 10b stark schematisierte Darstellungen von Ausführungsbeispielen, bei denen die erfindungsgemäße Platine durch Umbiegen Anschlusselemente und/oder einen Fluidraum ausbildet.

Preferred exemplary embodiments of the invention are explained in more detail below with reference to schematic drawings. Show it:

• 1 a three-dimensional representation of a first embodiment of a fluid heater according to the invention;
• 2 the fluid heater according to 1 with the lid removed;
• 3rd a schematic diagram of an IMS circuit board of the fluid heater according to FIGS 1 and 2 ;
• 4th a detailed representation of the IMS circuit board according to 3rd ;
• 5 a schematic representation of the cross section of such an IMS circuit board;
• 6th a representation to clarify the geometry of two heating strands of an IMS circuit board according to the 4th and 5 ;
• 7th a section along the line AA in 1 ;
• 8th a corresponding section of a further embodiment of a fluid heater;
• 9 an individual representation of a molded part for fluid guidance in a heater according to the invention and
• 10a , 10b highly schematic representations of exemplary embodiments in which the circuit board according to the invention forms connection elements and / or a fluid space by bending.

1 shows a three-dimensional representation of a first embodiment of a fluid heater according to the invention 1 , for example a high-voltage heater that is used, for example, to heat water or another liquid. The fluid heater 1 has a multi-part housing 2 with a middle part 4th and one in the view according to 1 upper and lower lids 6th , 8th . This case 2 delimits a fluid space that receives the fluid to be heated and which will be discussed below. Two fluid connections open into this fluid space 10 , 12th , for example the fluid connection 10 as the inlet and the fluid connection 12th can be designed as an outlet. Both connections 10 , 12th are connected to a line system that carries the fluid to be heated. In the illustrated embodiment, the fluid connections 10 , 12th as a connecting piece on the middle part 4th educated. Of course, these connections can also be provided on the cover side.

The housing according to the invention 2 also takes at least one circuit board 14th (please refer 2 ), which is designed with at least one heating circuit for heating the fluid and can have additional electronic components for controlling this heating circuit and other heater components. To power these control and / or power electronics and the electronic components, the in 1 illustrated embodiment on the middle part 4th a low-voltage plug 16 and a high-voltage plug 18th formed, the latter being used for high-voltage power supply and the low-voltage plug also for signal transmission. In order to compensate for pressure fluctuations occurring during operation in an electronics compartment accommodating the control and power electronics, an in 1 with the reference number 20th provided pressure compensation element provided. The housing components can be made from suitably coated plastic or from a suitable metal alloy, for example with a view to EMC problems.

2 shows the case 2 according to 1 , with the top lid 6th is removed. You can then see the electronics room mentioned above 22nd in which the board 14th is arranged, through which on the one hand a control and / or power electronics and on the other hand the actual heating of the fluid heater 1 can be formed. In the embodiment shown, the board is 14th with two heating circuits 24 , 26th trained, the specific structure of which is later based on the 3rd to 6th is explained. As shown in 2 the electronics room fills 22nd not the entire interior of the case 2 but is, for example, from an approximately L-shaped outer space in this exemplary embodiment 28 encompassed, in which further components of the fluid heater, for example cabling, can be added.

Between the removed top cover 6th and the board 14th as well as between the lower lid 8th and possibly another board or the board 14th there remains an in 2 invisible free space in which, for example, an additional control board or other components, such as a temperature sensor or the like, can be accommodated.

In a manner known per se, the in 2 visible front edges of the middle part 4th Sealing contours 30th formed, which are used to fix the position of a seal. Corresponding contours are also on the upper cover 6th and the lower lid 8th formed so that the housing 2 can be closed fluid-tight. The bracing of the middle part 4th with the two lids 6th , 8th takes place using screws that are inserted into corresponding threaded holes 32 of the middle part 4th be screwed in. Of course, instead of such a screw connection, the housing 2 can also be firmly connected.

3rd shows a single representation of the in the housing 2 recorded board 14th . This is designed as an IMS board - the basic structure of such IMS boards 14th will be based on later 5 explained.

In the illustrated embodiment (see also 4th ) is the circuit board 14th - as mentioned above - with the two heating circuits 24 , 26th formed, the heating circuit 24 to a heating power of, for example, 2 KW and the heating circuit 26th is designed for a heating power of, for example, 1 KW. The power supply for the two heating circuits 24 , 26th takes place via terminal lugs protruding from the board level 34 , 36 (Heating circuit 24 ) or 38, 40 (heating circuit 26th ), whereby the switching on and off of the heating lines described in more detail below via switching elements 42 , 44 takes place, which are designed for example as IGBT modules and part of the board 14th trained circuit are. The connections of these switching elements 42 , 44 are shown in accordance with 3rd with the reference numerals 46 , 48 , 50 , 52 , 53 Mistake. On the board 14th are according to 3rd even more electronic components 54 , 56 the control and / or power electronics executed. In principle, it can go through the board 14th implemented circuit, a sensor for detecting the fluid temperature can also be integrated.

The components described are located - as explained above - on the circuit board 14th so that their power loss is also given off to the fluid in the form of heat to the fluid. Such a solution, in which the electronic components, for example semiconductor components, are designed as heating elements, is described in the introduction DE 10 2018 106 354 A1 explained. In contrast to this solution, the heating lines of the two heating circuits are formed by conductor tracks 24 , 26th designed with regard to the heat output to be transferred. As explained at the beginning, the circuit board according to the invention is not limited to an exemplary embodiment in which the conductor tracks are provided together with control elements and / or power electronics - in principle it is sufficient if on the circuit board 14th only one heating section formed by at least one conductor track is designed, which is designed with a view to heating a fluid.

4th shows the area of the circuit board occupied by the aforementioned electronic components 14th out 3rd in a detailed view. It can be seen quite clearly in this illustration that in this exemplary embodiment the two heating circuits 24 , 26th - as mentioned above - by heating strands formed from conductor tracks 58 , 60 are realized, the conductor tracks each meandering on the board 14th are trained. This will be based on later 6th made clear.

As mentioned at the beginning, the board is 14th designed as an IMS board. This has according to 5 a heat distribution layer in a manner known per se 62 , which usually consists of a metal, for example aluminum or copper, and whose layer thickness can vary between 0.3 mm and 10 mm. A layer thickness of around 1.5 mm has established itself as the standard.

On this heat distribution layer designed with a view to optimal heat transfer to the fluid to be heated 62 is an integrated insulating layer 64 applied, which typically has a layer thickness of 75 microns to 200 microns and consists of an electrically good insulating material, preferably plastic. On this insulating layer 64 then becomes the actual heating section 58 , 60 training track 66 upset. This consists of a material that can be machined by etching or milling, such as copper, zinc, silver, gold or nickel, with copper being preferred.

Like in the DE 10 2018 106 354 A1 explained, a conductor track layer is first applied over the entire surface and then the meander-shaped or bifilar structure of the heating strands explained in more detail below 58 , 60 and the conductor track sections leading to the aforementioned components / switching elements are produced by an etching process, so that the in the 4th and 6th indicated heating line structure results.

This etched IMS circuit board can then be used for electrical insulation and moisture protection 14th In a further work step, an insulating layer, for example a layer of solder mask 68 are applied, which covers the conductor track structure. Such areas are left out on which the above-mentioned switching elements in a subsequent assembly operation - for example in the SMD process 42 , 44 and electronic components 54 , 56 be applied. After this assembly according to an assembly plan, the formation of the external shape of the IMS board then takes place in a fourth work step 14th by punching, milling and / or sawing out.

The structure of the heating strands 58 , 60 is designed with regard to the desired heating output. The heating resistance of the two heating lines is determined here 58 , 60 essentially from the material, the length and the cross section of the conductor tracks arranged, for example, in a meandering or bifilar manner 66 . The conductor track width b and the layer thickness d of the conductor track are correspondingly 66 and their length selected so that the heating resistance required for the predetermined heating output results. The heating resistance can also be changed locally by varying the cross-section (b, d). This local variation of the heating resistance can deliberately generate hotspots that form a kind of fuse and melt when there is an excessive temperature development or current supply. Likewise, zones with fewer conductor tracks, thus lower power density, can be generated locally. The spacing a of the individual conductor tracks also has an influence on the power density 66 the meander structure.

6th shows the basic structure of the heating circuit with a higher heating output 24 , which in principle consists of two heating strands 58a, 58b, which via the above-mentioned switching elements 42 , 44 and electronic components 54 , 56 can be controlled individually or together. As explained, each heating strand 58a, 58b in this exemplary embodiment is formed by a meandering conductor track 66 formed, with longer conductor track sections 70 , 72 via diversions 74 are connected to each other.

Of course, as mentioned above, instead of the meandering structure, other structures can also be used, for example parallel conductor tracks arranged in parallel or in series, bifilar structures or mixed forms of these structures. The in 6th The illustrated embodiment are the deflections 74 than across the conductor track sections 70 , 72 running straight elements. The in 4th The embodiment shown are the deflections 74 rounded (see also dashed line in 6th ).

The single heating line 60 of the second heating circuit 26th has a corresponding structure, the heating output of the individual heating lines 58a, 58b and 60 being designed in accordance with the desired maximum heating output in the illustrated embodiment.

7th shows a section along the line AA in 1 . In this sectional view you can see the circumferential walls of the middle part 4th on which the upper lid is sealed 6th and the lower lid 8th are put on. In the illustrated embodiment, the middle part carries 4th an IMS board designed as described above 14th , which is designed with at least one heating circuit and can also carry components of the control and power electronics. This board 14th is located in the area leading from the top lid 6th is overstretched.

In the one from the lower lid 8th In the overstretched area, a further plate 14 'is formed which corresponds to the plate 14th can be designed with a heating circuit and / or other components of the control and / or power electronics. In principle it is also possible to use the board 14th to be designed with several heating circuits as a “heating board”, while the further board 14 'accommodates the electronic components required for control and regulation, ie the components of the control and power electronics, so that each board 14th , 14 'is optimized with regard to the respective function (heating - control, regulation). The boards 14th , 14 'are via suitable sealing elements 76 , 78 sealing on the middle part 4th held so by the sinkers 14th , 14 'and the middle section 4th a fluid space 80 is formed through which the fluid to be heated flows or in which the fluid to be heated is received. The boards according to the invention 14th , 14 'thus delimit the fluid space 80 directly. This is an essential difference from the solution according to DE 10 2018 106 354 A1 , in which the board is attached to the circumferential walls of the fluid space, so that no direct heat input from the board into the fluid occurs.

The in 7th illustrated embodiment protrudes into the fluid space 80 the temperature sensor mentioned at the beginning 82 into it. The pressure compensation element can also be seen 20th , which in the representation according to 7th only exemplary coaxial to the axis of the temperature sensor 82 runs. As explained at the beginning, this is an optional pressure compensation element 20th ensures that pressure fluctuations in the above or below the fluid space 80 arranged free spaces 85 , 87 that form a kind of electronics room.

The arrangement of the boards 14th , 14 'takes place in such a way that the previously described heat distribution layers 62 delimit the fluid space in sections, while the electronic components and the heating strands 58a, 58b, 60 with the conductor tracks 66 to the two spaces 85 , 87 are arranged pointing out. As mentioned above, in these spaces 85 , 87 further, not shown here boards or other elements of the control / power electronics can be arranged.

In the cut according to 7th you can also see part of the base 2 explained outside space 28 , in which, for example, cabling can be routed and the one with the two free spaces 85 , 87 connected is. In the case where the fluid space 80 is traversed by the fluid, can in the area of the fluid space 80 Fluid guide elements 84 provided (see 8th ).

The in 7th The illustrated embodiment is the fluid space 80 in the middle between the two boards 14th , 14 'arranged. In principle, it is also possible to mount the circuit boards rotated by 180 ° so that the heat distribution layers 62 each to the upper lid 6th or to the lower cover 8th point out and then accordingly with the respective cover 6th , 8th two fluid spaces are limited which are in fluid communication with each other. In such a variant, not shown, the components of the control or power electronics and also the heating lines 58a, 58b, 60 are then to the common central space between the boards 14th , 14 'arranged pointing out. The pressure compensation element would then have to be accordingly 20th are in operative connection with the central room, while the temperature sensor 82 at least in one of the lids 6th , 8th limited spaces.

8th shows a variant of the embodiment according to 7th , where the two boards 14th , 14 'the middle fluid space 80 delimit in sections and the two lids 6th , 8th with the boards 14th , 14 'each have a free space 85 , 87 form. In this respect, the exemplary embodiment corresponds to FIG 8th according to that 7th . In contrast to 7th is in the embodiment according to 8th to the fluid space 80 facing heat distribution layer of the circuit boards 14th , 14 'each have a fluid guide element 84 , 84 ', which on the one hand improves the heat transfer from the previously described heating strands 58a, 58b to the fluid and on the other hand serves to guide the flow. In the illustrated embodiment, the fluid guide elements 84 , 84 'made of a material with a good Thermal conduction, for example made of aluminum, and are directly thermally conductive to the heat distribution layer 62 of the respective board 14th , 14 'set.

The fluid guiding element 84 , 84 'is in the illustrated embodiment with one to the fluid space 80 pointing continuous base plate 86 formed, from which out to the circuit board 14th , 14 'towards protrusions 88 extend so that the fluid-leading channels between adjacent projections 90 be formed. The flow guidance is chosen so that, for example, the inlet to the fluid heater 1 in fluid communication with the channels 90 stands so that the flow in the channels 90 - as in 8th indicated - takes place away from the viewer and is then deflected via suitable deflection elements, not shown, so that the flow in the fluid space 80 takes place towards the viewer. Of course, a different flow guide can also be implemented. As explained, the heat Q to be transferred to the fluid is in the direction of the arrow from the circuit board 14th , 14 'via the respective fluid guide element 84 , 84 'to the one in the fluid space 80 transferred fluid absorbed.

As in connection with 7th explained, the boards can 14th , 14 'can also be installed rotated by 180 °, so that the fluid guide elements 84 , 84 'to the respective space 85 or. 87 are arranged pointing out and these then form corresponding fluid spaces, while the central space 80 is the electronics space, which is sealed off from the fluid spaces.

9 shows a specific embodiment of a fluid guide element 84 . As stated, this has a base plate 86 from which the projections emerge 88 extend. In the illustrated embodiment, these each have an approximately teardrop-shaped cross-section that optimizes the flow around them 94 . This in 9 fluid guide element shown 84 is made of an aluminum alloy, for example in the die casting or extrusion process.

As explained above, the projections lie 88 with their teardrop-shaped end faces on the heat distribution layer 62 of the respective board 14th , 14 ', a sealing system preferably being selected so that a defined flow within the channels 90 is guaranteed. In principle, however, a certain amount of leakage is not a problem. The fluid space is also sealed in this exemplary embodiment 80 compared to the open spaces 85 , 87 and the outside space 28 through suitable sealing elements 76 , 78 .

As stated, a special feature according to the invention is that, on the one hand, the boards 14th , preferably IMS boards 14th , 14 'are designed as heating elements and, on the other hand, delimit part of a fluid space that receives the heating fluid. Based on 10a , 10b further developments of this concept are explained.

10a shows a variant in which in the edge areas of a board 14th the heat distribution layer 62 somewhat demoted, so this demoted area, as in 10a indicated by dashed lines, for the formation of connecting lugs or other functional elements upwards in the direction of the conductor track 66 receiving side can be bent up. This bending is preferably carried out partially only in those areas in which such functional elements, for example terminal lugs, have to be formed. In the latter case, a conductor track end section can be 66 ' extend into the cut-free area or the area delimited according to the connection lug to be formed, which area is bent over to form the connection lug in a subsequent operation.

In a further development of the invention, a heating section can also be formed completely or in sections in the bent area, in which case the contact is preferably made via the conductor track 66 he follows. In such an exemplary embodiment, the heating section is thus also formed in the narrower, bent-over side walls of the fluid channel. Of course, in such an exemplary embodiment, the contact can also be made via contact lugs bent out of this bent side wall, in the area of which a conductor track end section ( 66 ' ) ends.

In 10b this concept is continued to the effect that the weakened edge areas of the heat distribution layer 62 Have much larger dimensions, so that side walls can be formed by bending them twice by 90 ° 96 and cover walls 98 , 100 are formed, which then jointly at least partially circumferential walls of the fluid space 80 form. In such an exemplary embodiment, there would then only be a circuit board 14th with a heating circuit according to the invention 24 , 26th executed. In this exemplary embodiment, the circumference of a fluid channel is formed at least in sections by the bends described. Of course, it is also possible to have an open structure, for example by bending over side walls 96 train and then run the top wall as a special component. As explained above, conductor track sections or conductor track end sections can also extend into the bent areas in order then to enable contact to be made with other components.

The IMS boards can also have multiple layers, so that in each case separated, superposed conductor track layers are formed by insulating layers, which then each form part of a heating strand / heating circuit and / or the control or power electronics. In this case, for example, a passive sensor element can be integrated, one conductor track layer for current distribution and the other conductor track layer being designed essentially as a heating strand. In principle, however, several layers can also be designed as a heating strand, the respective heating power being adapted by varying the cross section, in particular the conductor track thickness d.

In principle, the fluid space 80 in such variants it can also be limited on the one hand by a single-layer board and on the other hand by a multi-layer board with a heating or power distribution function.

Disclosed are a circuit board with a heating strand formed from conductor tracks and a heater designed with such a circuit board.

List of reference symbols

1

Fluid heater

2

casing

4th

Middle part

6th

Lid on top

8th

Lid at the bottom

10

Fluid connection

12th

Fluid connection

14th

circuit board

16

Low voltage plug

18th

High voltage plug

20th

Pressure compensation element

22nd

Electronics room

24

Heating circuit

26th

Heating circuit

28

Outside space

30th

Sealing contour

32

Threaded hole

34

Connection lug

36

Connection lug

38

Connection lug

40

Connection lug

42

Switching element

44

Switching element

46

connection

48

connection

50

connection

52

connection

53

connection

54

electronic component

56

electronic component

58

Heating line

60

Heating line

62

Heat distribution layer

64

Insulating layer

66

Track

66 '

Track end section

68

Solder mask

70

Track section

72

Track section

74

Redirection

76

Sealing element

78

Sealing element

80

Fluid space

82

Temperature sensor

84

Fluid guide element

85

free space

86

Base plate

87

free space

88

head Start

90

channel

94

cross-section

96

Sidewall

98

Ceiling wall

100

Ceiling wall

QUOTES INCLUDED IN THE DESCRIPTION

This list of the documents listed by the applicant was generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Patent literature cited

• DE 102016122767 A1 [0002]
• DE 102012209936 A1 [0003]
• DE 102018106354 A1 [0004, 0032, 0036, 0043]

Claims (11)

Board with at least one conductor track (66), characterized by at least one heating strand (58, 60) which is formed by the conductor track formed using a subtractive process and which is designed for a predetermined heating power for heating a fluid and with a heat distribution layer (62) for heat transfer to the fluid. Board after Claim 1 , with a control circuit and / or power electronics which are in operative connection with the heating section (58, 60) or to which a further conductor track is assigned. Board after Claim 1 or 2 , wherein the heating strand (58, 60) is formed by conductor tracks (66), the cross-section, length and material of which is designed according to the heating resistance required for the heating output. Board according to one of the preceding claims, wherein a fluid guide element (84) is formed adjacent to the heat distribution layer (62). Board according to one of the preceding claims, a plurality of heating strands (58, 60) being formed thereon. Board according to one of the preceding claims, wherein it is designed in multiple layers and at least one heating section (24, 26) and / or a circuit forming the control circuit or the power electronics are provided in each layer. Board according to one of the preceding claims, wherein the heating section (58, 60) is formed by at least one meander-shaped or bifilar conductor track (66). Board according to one of the preceding claims, wherein this is an IMS board (14, 14 '). Board after Claim 8 , wherein functional elements are formed by bending over tabs or edge sections of the board (14, 14 '), at least the conductor track (66) or a conductor track end section (66') being led into the bent area to form a contact tab or a heating strand / heating strand section. Heater with a heating element which is designed to heat a fluid flowing through a fluid space (80) or received therein, characterized by at least one circuit board (14) according to one of the preceding claims. Heater after Claim 10 , wherein the circuit board (14) delimits the fluid space (80) in sections.

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