DE102018105354B3 - Test handler for performing functional tests on semiconductor elements - Google Patents

Abstract

A test handler (100) for performing functional tests on semiconductor elements, in particular on ICs (200), comprises a handler unit (34) for providing the semiconductor elements (200) in at least one test position and for sorting the semiconductor elements (200) depending on the result of Functional tests that are supplied with electrical and pneumatic energy. The test handler (100) further comprises a supply unit (40) for supplying the handler unit (34) with the electrical or pneumatic energy. The supply unit (40) and the handler unit (34) are spatially separated and interconnected by cables (45) and / or hoses (46) for supplying electrical and / or pneumatic energy to the handler unit (34).

Description

The invention relates to a test handler for performing functional tests on semiconductor elements, in particular on ICs.

ICs are typically tested for function after fabrication to eliminate functional errors. For these functional tests, certain temperature ranges may be provided, which may range from -60 ° C to + 180 ° C. To perform the function tests, so-called test handlers are known which ensure the handling of the ICs during the functional tests and the corresponding temperature control.

Basically, a distinction is made between test traders who use the pick-and-place principle or the gravity principle. While the pick-and-place principle, for example, moves the ICs by means of gripping arms, gravity handlers are aligned so that the ICs are moved by gravity.

Due to the extensive equipment of test handlers with housing, control electronics, feeding, separating and contacting mechanism, sensors and actuators, test handlers are usually heavy and bulky systems, which are also very expensive to purchase. Test handlers are therefore generally only profitable for large test series, so that for smaller test series usually on a manual testing is used.

The manual testing, however, is relatively expensive, since the IC is usually placed manually on a test socket and brought by means of a slipped hood, which is supplied with a tempered gaseous medium to the desired test temperature. Instead of the air flow, a tempered block can also be applied to the surface of the IC. After performing the test, the test socket is to be heated together with the receiving board in cold tests in order to prevent the formation of icing or condensation. A test handler is for example from the US 2012/0313657 A1 known. The test handler is provided with a temperature control unit that heats the IC by means of a thermally conductive block. The temperature of the IC is measured by means of a temperature sensor.

A method and apparatus for reducing dead time, the so-called index time, in testing system chips, System On-a-Chip (SOC), is disclosed in U.S. Pat DE 10 2006 035 045 A1 described. The device includes a test head, a system board to be tested, Device Under Test (DUT), which has a first bank of DUT test positions and a second bank of DUT test positions and is mounted on the test head, and a handling device for loading - and unload the loading board. To reduce the index time, the test head tests a first set of DUTs in the first bank of DUT test positions while simultaneously loading, by the handler, a second set of DUTs into the second bank of DUT test positions. Thereafter, the second set of DUTs in the second bank are tested for DUT test positions while simultaneously unloading by the handler the first set of DUTs from the first bank of DUT test positions and a third set of DUTs in the first bank of DUT test positions is loaded.

The invention has for its object to provide a test handler, which is relatively compact and by means of which an improved testing in small test series is possible.

The object is achieved by a test handler according to claim 1. Advantageous embodiments of the test handler are the subject matter of claims 2 to 17.

The test handler according to the invention serves to carry out functional tests, in particular for small to medium quantities of semiconductor elements, in particular ICs, and comprises a handler unit for separating and providing the semiconductor elements in at least one test position and for sorting the semiconductor elements as a function of the result of the functional tests electrical and pneumatic energy is supplied. The test handler further comprises a supply unit for supplying the handler unit with the electrical or pneumatic energy. The supply unit and the handler unit are spatially separated from each other and connected by cables and / or hoses for supplying the handler unit with the electrical and / or pneumatic energy.

Due to the spatial separation of the supply unit and the handler unit, the control unit and the pneumatics can be separated on the one hand from the handling of the ICs, that is to say in particular from the removal of rods filled with ICs, singulation, contacting and sorting according to the test result. This results in a comparatively low weight of the handler unit, which can be easily carried by a single person. A flexible use of the handler unit is ensured. In addition, the dimensions of the handler unit are significantly reduced by the separation of the supply unit and the handler unit. The handler unit can be made extremely flat, in particular compared to known handler units, so that the distances from a test socket to the test electronics can be significantly reduced. This results in short line lengths, and thus high test frequencies are possible.

The test handler preferably comprises a carrier unit for fastening to a test head having the test electronics, wherein the handler unit is detachably connected to the carrier unit or the test head. By means of the carrier unit, the handler unit can be attached to the test head. In this case, the test head has the test electronics so that the handler unit is in close proximity to the test electronics.

Alternatively, the test handler may preferably include a support unit for receiving test electronics, which is necessary to perform the functional tests and is supplied with electrical energy. The handler unit is expediently detachably connected to the carrier unit.

In an advantageous embodiment, the test handler comprises a test board, which has the test electronics and is preferably mounted on the carrier unit by means of a spring module. A test board is a more compact embodiment of a test head used for specific applications and tests.

Advantageously, the spring module is provided with at least one preferably preloaded spring and a linear guide. The spring and linear guide enable safe and defined storage of the test board.

Preferably, the test handler comprises a pedestal defining a pedestal level, the handler unit having a surface defining a reference plane. The reference plane and the pedestal plane include a tilt angle. The handler unit can be tilted relative to the pedestal to change the tilt angle. Changing the tilt angle changes the orientation of the handler unit. This brings particular advantages in gravity handlers with it. By adjusting the inclination angle, the orientation of a sliding plane in which the IC moves in the handler unit is adjusted with respect to the effective direction of gravity. As a result, the movement of the IC within the handler unit can be influenced in a targeted manner. For example, the inclination angle can be adjusted so that the sliding plane of the IC is relatively steep. This allows fast movement and high acceleration of the IC within the handler unit. On the other hand, if the slip plane is relatively flat, the IC moves slower through the handler unit and is less accelerated. The ICs glide in the latter case rather in the slip plane and do not fall.

If the handler unit is attached directly or by means of the carrier unit to the test head, the handler unit can likewise be inclined in such a way that the orientation of the slide plane is changed with respect to the effective direction of the force of gravity. In this case, for example, the test head can be rotatably mounted in a manipulator. By adjusting the inclination of the test head via the manipulator, the inclination of the handling unit and thus the orientation of the sliding plane is automatically changed.

Advantageously, the test handler comprises an angular adjustment which is arranged on the base. The angle adjustment allows easy, fast and defined adjustment of the tilt angle. To change the angle of inclination no costly measures are needed.

Advantageously, the angle adjustment on a guide along which the carrier unit or the handler unit are guided when changing the inclination angle. The guide may be formed, for example, as a slot in which engages a provided on the carrier unit or the handler unit pin or projection.

Preferably, the angular adjustment on a lock for adjusting the inclination angle. By locking the angle of inclination is set in its current position. To change the inclination angle again, it is necessary to release the lock and then to change the inclination of the handling unit with respect to the stand. The lock may be formed, for example, as a handle and actuated by means of a rotary, a pulling or a pushing movement.

Preferably, the base is provided with a pivot bearing, via which the carrier unit or the handling unit is pivotally connected to the base to change the angle of inclination. In particular, the carrier unit or the handler unit can be mounted at one end on the pivot bearing, so that the carrier unit or the handler unit can be rotated or tilted about the pivot bearing.

The test handler preferably comprises at least one connecting element for connecting the handler unit to the carrier unit. The connector is attached to the handler unit and can be connected to the carrier unit. Alternatively, the connector may be attached to the carrier unit and connected to the handler unit.

Preferably, the carrier unit has at least one support element for supporting the handler unit. the support member has a foot portion for attachment to the support unit and a head portion for receiving the connecting element. The support member may be fixed directly to the support unit or fixedly connected thereto and receives at the head portion of the connecting element. Advantageously, the number of supporting elements coincides with the number of connecting elements, so that each supporting element can receive a connecting element. In particular, it is advantageous to provide a multiplicity of supporting elements and connecting elements, for example four, six or eight in each case.

Advantageously, the support element is mounted on the foot section by means of a preferably preloaded spring on the carrier unit. The suspension ensures secure storage of the handling unit via the connecting elements and the supporting elements on the carrier unit. By biasing the spring, the spring behavior can be adjusted as required.

Advantageously, the support element has a linear guide fastened to the support unit in order to guide the support element linearly on the support unit. As a result of the linear guide, when the support element and the deflection process are loaded, the support element is guided linearly along the carrier unit, so that tilting of the support element is avoided.

Preferably, the test handler has a latch for locking the connection of the connecting element to the support element. The locking can be done for example by means of rotatably mounted hooks which engage in the support element or in the connecting element.

• 1 eine perspektivische Ansicht von einem ersten Ausführungsbeispiel des erfindungsgemäßen Testhandlers;
• 2a eine perspektivische Ansicht des Testhandlers aus 1 ohne die Versorgungseinheit;
• 2b eine perspektivische Ansicht des Testhandlers aus 2a, in der die Handlereinheit von einer Trägereinheit getrennt dargestellt ist;
• 3 eine perspektivische Ansicht des Testhandlers aus 2a, bei der Stützelemente geschnitten dargestellt sind;
• 4a eine perspektivische Ansicht von einem zweiten Ausführungsbeispiel des erfindungsgemäßen Testhandlers;
• 4b eine perspektivische Ansicht von dem Testhandler aus 4a, wobei die Handlereinheit von einem Testkopf getrennt dargestellt ist;
• 5a eine perspektivische Ansicht von einem dritten Ausführungsbeispiel des erfindungsgemäßen Testhandlers;
• 5b eine Ansicht von dem Testhandler aus 5a, wobei die Handlereinheit von der Trägereinheit getrennt dargestellt ist;
• 6 eine Schnittansicht von dem Ausführungsbeispiel gemäß 5a und 5b;
• 7a eine perspektivische Ansicht von einem vierten Ausführungsbeispiel des erfindungsgemäßen Testhandlers;
• 7b eine perspektivische Ansicht von dem Testhandler aus 7a ohne die Versorgungseinheit;
• 8 eine Schnittansicht von einem Stützelement;
• 9 eine Schnittansicht von einem Federmodul;
• 10a eine perspektivische Ansicht von einem Kontaktiermodul;
• 10b eine Explosionsdarstellung von dem Kontaktiermodul aus 10a;
• 11 eine Schnittansicht durch das Kontaktiermodul;
• 12a eine weitere Schnittansicht durch das Kontaktiermodul;
• 12b eine vergrößerte Ansicht von dem Bereich der Testkammer des Kontaktiermoduls aus 12a und
• 13 eine weitere Schnittansicht durch das Kontaktiermodul.

In the following the invention will be described by means of exemplary embodiments. In the drawings shows:

• 1 a perspective view of a first embodiment of the test handler according to the invention;
• 2a a perspective view of the test handler 1 without the supply unit;
• 2 B a perspective view of the test handler 2a in which the handler unit is shown separated from a carrier unit;
• 3 a perspective view of the test handler 2a in which supporting elements are shown cut;
• 4a a perspective view of a second embodiment of the test handler according to the invention;
• 4b a perspective view of the test handler 4a wherein the handler unit is shown separated from a test head;
• 5a a perspective view of a third embodiment of the test handler according to the invention;
• 5b a view from the test handler 5a wherein the handler unit is shown separated from the carrier unit;
• 6 a sectional view of the embodiment according to 5a and 5b ;
• 7a a perspective view of a fourth embodiment of the test handler according to the invention;
• 7b a perspective view of the test handler 7a without the supply unit;
• 8th a sectional view of a support member;
• 9 a sectional view of a spring module;
• 10a a perspective view of a contacting module;
• 10b an exploded view of the contacting module 10a ;
• 11 a sectional view through the contacting module;
• 12a a further sectional view through the contacting module;
• 12b an enlarged view of the region of the test chamber of Kontaktiermoduls 12a and
• 13 a further sectional view through the contacting module.

1 to 7b show different embodiments of test handlers. A first embodiment of a test handler 100 for performing functional tests on semiconductor elements, in particular on ICs 200 , shows 1 , The test handler is designed as a gravity handler and comprises a handler unit 34 , a supply unit 40 , a carrier unit 10 and a stand 50 , The handler unit 34 includes a contacting unit 30 , The carrier unit 10 picks up test electronics, which are necessary to carry out functional tests and are supplied with electrical energy. The handler unit 34 represents the semiconductor elements 200 ready in at least one test position and sorts them depending on the result of the functional test. The supply unit 40 serves to supply the handler unit 34 with electrical and / or pneumatic energy. For this purpose, the handler unit 34 and the supply unit 40 via cable 45 and / or hoses 46 as well as via a connection 33 connected with each other. The handler unit 34 and the supply unit 40 are spatially separated from each other to the mechanical handling of the semiconductor elements 200 from the control and pneumatics decouple. This is a small and lightweight construction of the handler unit 34 and the contacting unit 30 possible.

The spatial separation of the supply unit 40 from the handler unit 34 causes the control unit as well as the pneumatics of the handling of the ICs 200 are separated. This results in a very low weight of the handler unit 34 , Moreover, due to the separation of supply unit 40 and handler unit 34 the dimensions of the handler unit 34 significantly reduced. The handler unit 34 can be made extremely flat especially in comparison to known test handlers.

The carrier unit 10 has four support elements 11 on, which in enlarged view in 8th are shown. The support elements 11 each include a foot section 12 , a head section 13 , a preloaded spring 15 and a linear guide 16 , The support elements 11 are at the foot section 12 with the carrier unit 10 connected. Through the linear guide 16 becomes when loading the support element 11 and the compression process, the support element 11 linear along the carrier unit 10 guided, so that tilting of the support element 11 is avoided. The handler unit 34 has four fasteners 32 on. The head sections 13 the support elements 11 each serve to receive a connecting element 32 ,

The connecting elements 32 are arranged so that these each with a support element 11 the carrier unit 10 can be brought into engagement. About the fasteners 32 and the support elements 11 is the handler unit 34 with the carrier unit 10 connected. The connection of the connecting elements 32 with the support elements 11 can by means of a lock 14 be locked. The lock 14 is designed as a rotatable hook, which on the connecting elements 32 is attached and in the support elements 11 can intervene.

The base 50 defines a foot level S , The handler unit 34 has a surface 31 on which a reference plane R Are defined. The reference level R and the foot level S close a tilt angle φ one.

The base 50 includes a handle 55 for transporting the stand 50 and an angle adjustment 51 which is a guide 52 having. The leadership 52 is expediently designed as a slot, which in the angle adjustment 51 is provided. Furthermore, the stand points 50 a pivot bearing 54 on. The carrier unit 10 is at the pivot bearing 54 articulated with the base 50 connected. In particular 2a and 2 B show is on the carrier unit 10 a pin arranged in the guide 52 the angle adjustment 51 intervenes. By means of the articulated connection to the pivot bearing 54 and in the leadership 52 guided bolt can be the carrier unit 10 , and thus the handler unit 34 , in relation to the base 50 be inclined, so the angle of inclination φ is changed. Furthermore, the angle adjustment 51 with a lock 53 provided to the inclination angle φ after it has been changed. The angle adjustment 51 thus allows a simple, fast and defined adjustment of the angle of inclination φ ,

By changing the angle of inclination φ the orientation of the handler unit changes 34 , By adjusting the tilt angle φ can the movement of the ICs 200 within the handler unit 34 , especially in the Kontakiereinheit 30 , be specifically influenced. The angle of inclination φ Can be adjusted to provide a glide plane for the ICs 200 steep or flat. With a steep gradient of the slip plane is a fast movement and high acceleration of the ICs 200 within the handler unit 34 or in the Kontakiereinheit 30 allows. When the slip plane is flat, the IC moves 200 slower through the handler unit 34 or by the Kontakiereinheit 30 and is accelerated less. The IC 200 is thereby slidably moved in the slip plane, and not falling.

4a and 4b show an embodiment of the test handler 100 in which this one carrier unit 10 for attaching to a test head 20 having. The carrier unit 10 is designed here as a frame, which is attached to the test head 20 is attached. The test head 20 has the test electronics. In this embodiment, the handler unit 34 are also inclined so that the orientation of the slip plane is changed with respect to the direction of gravity. In this case, for example, the test head 20 be rotatably mounted in a manipulator, not shown. By adjusting the inclination of the test head 20 over the manipulator is the inclination of the handler unit 34 and thus inevitably changes the orientation of the slip plane.

As 6 shows, the carrier unit 10 a spring module 26 exhibit. On the spring module 26 is a test board 25 stored, which has the test electronics. The spring module 26 is with several preloaded springs 27 provided to the test board 25 on the carrier unit 10 to store. As further particular 9 shows clearly shows the spring module 26 a screw 29 for adjusting the preload of the springs 27 on. In addition, the spring module 26 with a linear guide 28 Mistake. The feather 27 and the linear guide 28 enable a secure and defined storage of the test board 25 ,

Out 7a and 7b is an embodiment of the test handler 100 out, that without carrier unit 10 gets along. This is the handler unit 34 directly by means of the pivot bearing 54 articulated with the base 50 connected so that a particularly compact design is available. The test electronics are provided externally in this embodiment, for example via a rack, not shown, in which test electronics are installed.

10a to 13 show a contacting module 60 , the component of the contacting unit 30 of the test handler 100 is. The contact unit 30 or the contacting module 60 For example, you can use the handler unit 34 bolted or be connected by means of quick release with this. The entire contacting unit 30 or only the contacting module 60 can basically be used with both gravity handlers and pick-and-place handlers.

The contacting module 60 includes an inlet 61 , a test chamber 62 , a movably arranged stamp 63 , one on the stamp 63 arranged temperature sensor 64 , an air supply 65 , Rinsing chambers 70a . 70b . 70c , an outlet 66 , a controller, not shown, and an air outlet 76 , Through the inlet 61 go to test ICs 200 in the contacting module 60 , From the inlet 61 become the ICs 200 due to gravity, or in the case of a pick-and-place handler by a positioning device such as a gripping arm, through the contacting module 60 emotional. To the movement of the ICs 200 specifically through the contacting module 60 to guide, has the contacting module 60 a leadership unit 67 on. The leadership unit 67 points in the area of the test chamber 62 a test socket 68 which forms the test position. The leadership unit 67 extends from the inlet 61 over the test chamber 62 to the outlet 66 , The leadership unit 67 may be wholly or partially substantially U-shaped, so that it forms a groove in which the IC 200 within the contacting module 60 is moved. For this purpose, it is particularly advantageous if the groove on the dimensions of the IC under test 200 is tuned to a precise guidance of the ICs 200 in the leadership unit 67 to ensure.

In particular 12b clearly shows, is the leadership unit 67 designed as a guide rocker and in the test chamber 62 by means of two springs 79 stored. The leadership unit 67 can with the semiconductor element to be tested 200 through the upper punch 63 to the springs 79 to be moved. This will be the springs 79 compressed. The guide rocker is open to the bottom so that the IC to be tested 200 when it is in the test position, on its underside, that is, on the upper punch 63 opposite and the lower punch 63 facing side, can be contacted by the opening of the guide rocker, so that also on the lower punch 63 provided temperature sensor 64 the IC 200 can contact. The upper stamp ensures this 63 for the necessary back pressure.

The contact unit 30 further includes a nozzle 69 , The nozzle 69 is in the immediate vicinity of the inlet 61 arranged and aligned so that these flow in the direction of the guide unit 67 generated. By the flow should the IC 200 in his movement along his leadership unit 67 be further accelerated. The nozzle 69 is in the immediate vicinity of the opening of the guide unit 67 and near the inlet 61 arranged.

From the inlet 61 arrives the IC 200 into the test chamber 62 , In the test chamber 62 becomes the IC 200 in the test position, especially on the test socket 68 , fixed and subjected to the functional test. In particular, in the case of a gravity handler, it is advantageous if, as in 11 and 13 shown a movably arranged stop 77 is provided, which is the IC under test 200 stops when it reaches the test position. The stop device 77 is preferably actuated by at least one plunger made of a temperature-stable material, wherein the power transmission can be effected for example by at least one pneumatic cylinder. To detect when the test position is occupied, that is, when the IC to be tested 200 is in the test position, the contacting unit 30 with a light sensor 75 Mistake. Once the IC 200 in the test position by the light sensor 75 is detected, the IC 200 fixed and the bump test started.

After the IC 200 gets into the test position, it gets through the stamp 63 fixed in the test position. The Stamp 63 is, as described above, with a temperature sensor 64 Mistake. The temperature sensor 64 engages directly on the surface of the IC 200 to get an accurate measurement of the surface temperature of the IC 200 to reach. For this purpose, the temperature sensor 64 by a spring 72 biased in the stamp 63 stored. The Stamp 63 and the temperature sensor 64 can be on any page of the test socket 68 or the test position, or it is ever a stamp 63 and a temperature sensor 64 at opposite sides of the test socket 68 or the test position, as in 11 to 13 shown.

The movement of the stamp 63 towards the test position by means of a movably arranged cross member 73 that the stamp 63 positively receives. The movement of the crossbeam 73 towards the test position is by at least one plunger 74 excited from a temperature-stable material. The power transmission can be done for example by at least one pneumatic cylinder. In particular 12a In particular, two plungers can 74 be provided.

By contacting the IC 200 through the temperature sensor 64 and the controller, not shown, the temperature of the Temperierstroms depending on the measured surface temperature of the ICs 200 be set. So is a very fast and extremely accurate setting of the temperature of the ICs 200 guaranteed. This promotes rapid testing of semiconductor devices 200 , Furthermore, the compact construction of the contacting module makes it possible 60 and in particular the test chamber 62 in that only a small tempering current is necessary to the test chamber 62 to heat or cool. In the test chamber 62 becomes the IC 200 released after performing the functional test and passes through the outlet 66 from the contacting module 60 out.

The air outlet 76 serves for discharging the tempering current from the contacting module 60 and is suitably oriented so that this in the operating state of the contacting 30 directed upward to avoid icing or moisture on the outside walls. The tempering is thus on the air supply 65 in the air chamber 62 and from there via the air outlet 76 from the contacting module 60 led out. Here is the air supply 65 Aligned so that the tempering is passed to the test position and so in the test position located IC 200 can temper. In particular, the tempering current is largely in the direction of movement of the IC 200 directed to the test position. This allows a very stable temperature on the surface of the IC 200 be achieved. In addition, after the bump test, moving or accelerating the IC 200 in the direction of the outlet 66 facilitated.

The rinsing chambers 70a . 70b . 70c have air connections 71a . 71b . 71c on, on the preferably tempered purging air in the rinsing chambers 70a . 70b . 70c can be initiated. The rinsing chambers 70a . 70b . 70c serve to flush around the test chamber 62 , the temperature sensor 64 and / or the air supply 65 with scavenging air, to freeze or overheat the test chamber 62 , the temperature sensor 64 , the air supply 65 and / or an outer wall of the contacting module 60 avoided if a relatively cold or relatively warm Temperierstrom in the Kontaktiermodul 60 is initiated. For example, it becomes a transition area 78 , which forms a transition to a test board, not shown, by means of the rinsing chamber 70c lapped with air. There are also entrances 61 and outlet 66 Shielded against external air by means of an air curtain formed by purging air. The air curtain is in the rinsing chamber 70b is formed and flows orthogonal to the orientation of the inlet 61 and the outlet 66 , This leaves the contacting module 60 free of ambient air, in particular the temperature in the test chamber 62 would disturb.

As further particular 10b shows clearly shows the contacting module 60 One Base 80 and a hood 85 on that with the base 80 connected is. Base 80 and hood 85 enclose the test chamber 62 , The base 80 and the hood 85 are in particular releasably connected to each other, for example by means of screws. Particularly advantageous is a compound of base 80 and hood 85 by means of quick-release fasteners. That's how the hood can be 85 from the base 80 Easily replace, provided a mechanical failure in the test chamber 62 is present or should be tested at room temperature. Base 80 and hood 85 are preferably made of a temperature-stable plastic.

LIST OF REFERENCE NUMBERS

10

support unit

11

support element

12

foot section

13

header

14

lock

15

feather

16

linear guide

20

test head

25

test Board

26

spring module

27

feather

28

linear guide

29

screw

30

contacting

31

surface

32

connecting member

33

connection

34

handle purity

40

supply unit

45

electric wire

46

tube

50

stand

51

angle adjustment

52

guide

53

lock

54

pivot bearing

55

Handle

60

contacting module

61

inlet

62

test chamber

63

stamp

64

temperature sensor

65

air supply

66

outlet

67

Guide unit

68

test socket

69

jet

70a

rinsing chamber

70b

rinsing chamber

70c

rinsing chamber

71a

air connection

71b

air connection

71c

air connection

72

feather

73

crossbeam

74

tappet

75

light sensor

76

air outlet

77

stopping device

78

Transition area

79

feather

80

Base

85

Hood

100

test handler

200

IC

R

reference plane

S

stand level

φ

tilt angle

Claims (17)

A test handler (100) for performing functional tests on semiconductor elements, in particular on ICs (200), comprising: a handler unit (34) for singulating and providing the semiconductor elements (200) in at least one test position and for sorting the semiconductor elements (200) in dependence on the Result of the functional tests, which is supplied with electrical and pneumatic energy, and a supply unit (40) for supplying the handler unit (34) with the electrical or pneumatic energy; wherein the handler unit (34) comprises a contacting unit (30) for contacting the semiconductor elements (200) in the test position having a contacting module (60); characterized in that the supply unit (40) and the handler unit (34) are spatially separated and interconnected by cables (45) or hoses (46) for supplying the handler unit (34) with electrical or pneumatic energy. Test handler (100) after Claim 1 characterized by a carrier unit (10) for attachment to a test head (20) having the test electronics, wherein the handler unit (34) is detachably connected to the carrier unit (10) or the test head (20). Test handler (100) after Claim 1 characterized by a support unit (10) for receiving test electronics necessary for carrying out the functional tests and being supplied with electrical energy, the handler unit (34) being detachably connected to the support unit (10). Test handler (100) after Claim 3 characterized by a test board (25) having the test electronics and preferably by means of a spring module (26) on the carrier unit (10) is mounted. Test handler (100) after Claim 4 , characterized in that the spring module (26) with at least one spring (27), which is preferably biased, and a linear guide (28) is provided. Test handler (100) after one of the Claims 1 to 5 characterized by a pedestal (50) defining a pedestal plane (S), the peddler unit (34) having a surface (31) defining a reference plane (R), the reference plane (R) and the pedestal plane (S) an inclination angle (φ), wherein preferably the handler unit (34) is tiltable with respect to the pedestal (50) to change the inclination angle (φ). Test handler (100) after Claim 6 characterized by an angular adjustment (51) disposed on the pedestal (50). Test handler (100) after Claim 7 , characterized in that the angular displacement (51) has a guide (52), along which the handler unit (34) is guided when changing the inclination angle (φ). Test handler (100) after Claim 2 and 7 , characterized in that the angular adjustment (51) has a guide (52), along which the carrier unit (10) when changing the inclination angle (φ) is guided. Test handler (100) after Claim 7 or 8th or 9 , characterized in that the angle adjustment (51) has a detent (53) for fixing the inclination angle (φ). Test handler (100) after one of the Claims 6 to 8th and 10 , characterized in that the pedestal (50) is provided with a pivot bearing (54), via which the handler unit (34) is pivotally connected to the pedestal (50) to change the inclination angle (φ). Test handler (100) after Claim 2 and one of the Claims 6 to 10 , characterized in that the base (50) is provided with a pivot bearing (54), via which the carrier unit (10) is pivotally connected to the base (50) to change the inclination angle (φ). Test handler (100) after one of the Claims 2 to 12 characterized by at least one connecting element (32) for connecting the handler unit (34) to the carrier unit (10). Test handler (100) after Claim 13 characterized in that the support unit (10) comprises at least one support element (11) for supporting the handler unit (34), the support element (11) having a foot section (12) for attachment to the support unit (10) and a head section (13) for receiving the connecting element (32). Test handler (100) after Claim 14 , characterized in that the support element (11) on the foot portion (12) by means of a spring (15), which is preferably biased, is mounted on the carrier unit (10). Test handler (100) after Claim 14 or 15 , characterized in that the supporting element (11) has a linear guide (16) fixed to the carrier unit (10) in order to guide the supporting element (11) linearly on the carrier unit (10). Test handler (100) after one of the Claims 14 to 16 characterized by a lock (14) for locking the connection of the connecting element (32) to the supporting element (11).

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