DE102017203489A1 - camera device - Google Patents

Abstract

A camera apparatus having a holder holding an optical element therein and a circuit board on which an image sensor is mounted. The holder is connected to the circuit board using an adhesive. The circuit board has at least partially a metallic layer and a resinous layer stacked in a thickness direction of the circuit board. The circuit board has a portion of missing metallic layer in which the metallic layer is partially omitted. The missing metallic layer portion is disposed so as to overlap the bond between the holder and the printed circuit board in the thickness direction of the printed circuit board, thereby minimizing the heat transfer of the adhesive to the metallic layer. This achieves effective curing of the adhesive, allowing the ease with which the camera apparatus is assembled.

Description

REFERENCE TO GENERAL APPLICATIONS

The present application claims the priority of Japanese Patent Application No. 2016-41184 , filed on Mar. 3, 2016, the disclosure of which is incorporated herein by reference.

STATE OF THE ART

1 technical area

This invention relates generally to a camera apparatus equipped with an image sensor and an optical element that conducts light to the image sensor.

2 State of the art

The above-described type of camera apparatus equipped with an objective as an optical element is known. However, the use of the objective requires a means for ensuring an accurate positional relationship between the objective and a printed circuit board on which an image sensor is mounted to detect clear or fine images. For this purpose, a positional relationship between a holder in which the lens is held and a circuit board on which the image sensor is mounted can be corrected by means of a six-axis adjustment, whereupon the holder and the circuit board are connected by means of an adhesive.

The Japanese Patent First Publication No. 2014-225777 suggests the use of a thermosetting resin (ie, a thermosetting adhesive) such as the aforementioned type of adhesive containing an epoxy resin as a major component (also referred to as an epoxy-based material) or a UV-curing adhesive (ie, a UV curing adhesive). curing adhesive).

The use of the thermosetting adhesive or the UV-curable adhesive to provide attachment between the holder and the circuit board allows rapid curing of the adhesive as compared to using a dry-curing adhesive, however, it is desirable that the curing of the adhesive, the connects the holder and the circuit board to further accelerate.

SUMMARY

It is therefore an object to provide a camera apparatus designed to quickly assemble an adhesive for use in bonding a holder accommodating an optical element and a circuit board on which an image sensor is mounted, and also to assemble easily is.

According to one aspect of the invention, there is provided a camera apparatus comprising: (a) a circuit board having at least partially a resinous layer and a metallic layer stacked in its thickness direction; (b) an image sensor disposed on the circuit board; (c) an optical element operative to conduct light to the image sensor; (d) a holder holding the optical element; and (e) a thermosetting adhesive. The holder is connected to the circuit board by heating and curing the adhesive during a manufacturing process of the camera device, thereby ensuring the stability in the positional relationship between the image sensor and the optical element.

In general, the thermal conductivity of metal is higher than that of resin. Thus, when the thermosetting adhesive is heated and cured, the amount of heat introduced into the thermosetting adhesive is partially absorbed by the metallic layer of the circuit board. To alleviate this problem, the camera apparatus in this invention has the missing metallic layer portion in which the metallic layer is partially omitted. The missing metallic layer portion is disposed so as to overlap the bond between the holder and the printed circuit board in the thickness direction of the printed circuit board, thereby minimizing the heat transfer of the adhesive to the metallic layer. This achieves effective heating of the thermosetting adhesive to cure it quickly, allowing the ease with which the camera apparatus is assembled.

According to another aspect of this invention, there is provided a camera apparatus comprising: (a) a circuit board; (b) an image sensor disposed on the circuit board; (c) an optical element operative to conduct light to the image sensor; (d) a holder holding the optical element; and (e) a photo-curing adhesive that achieves bonding between the holder and the circuit board. The attachment of the holder to the circuit board is achieved by applying light to the photocuring adhesive to cure it, thereby ensuring stability in a desired positional relationship between the image sensor and the optical element.

The photo-curing adhesive is transparent, which increases the reach of light relative to the entire photocuring adhesive compared to a black-colored photocuring adhesive, whereby the light-curing adhesive cures quickly. This allows the ease with which the camera device is assembled.

BRIEF DESCRIPTION OF THE DRAWING

The present invention will become more fully understood from the detailed description given hereinbelow and from the accompanying drawings in which the preferred embodiments of the invention are provided, which are not intended to limit the invention to the specific embodiments, but are intended for purposes of illustration and understanding only ,

In the drawing:

1 Fig. 15 is a longitudinal sectional view illustrating a camera apparatus according to the first embodiment;

2 is a sectional view taken along the line II-II in 1 ;

3 FIG. 12 is a partial sectional view showing an area near an adhesive for use in bonding a holder and a printed circuit board of FIG 2 illustrated camera device illustrated;

4 Fig. 16 is a front view schematically showing a circuit board of the camera apparatus 1 represents;

5 Fig. 10 is a partial sectional view illustrating an area near an adhesive for use in bonding a holder and a circuit board of a camera apparatus according to the second embodiment;

6 Fig. 16 is a partial sectional view illustrating an area near an adhesive for use in bonding a holder and a circuit board of a camera apparatus according to the third embodiment; and

7 FIG. 14 is a partial sectional view illustrating an area near an adhesive for use in bonding a holder and a circuit board of a camera device according to the fourth embodiment. FIG.

DESCRIPTION OF THE PREFERRED EMBODIMENT

Embodiments of this invention will be described below with reference to the drawings.

FIRST EMBODIMENT

In relation to 1 is the camera device 11 a so-called monocular camera and is on an inner surface of a front windshield 2 a vehicle such as an automobile. Illustrated for simplicity 1 Cross sections of the front windshield 2 and the holder 12 (which will be described later in detail) from the position of a plane through the L-shaped side plates 12b the holder 12 out of view. 1 also illustrates the case 13 , viewed from the position of a plane extending through an optical axis L of the camera module 14 extends, and the camera module 14 , viewed from one side of it. As in 1 As shown, each drawing that will be returned later will leave some parts of the camera device 11 for the simplicity of presentation away.

In the following discussion, the front, back, right, left, top and bottom of each part are the camera device 11 defined as those involving the camera device 11 , as in 1 shown on the front windshield 2 is attached. In other words, the front of each part is aligned in a forward direction of the vehicle. In each drawing, "FR", "UPR" and "RH" represent the front, top and right directions, respectively. However, these directions are only defined in this invention to determine the positional relationship between each part of the camera device 11 for reasons of expediency. In practice, the orientation of the camera device 11 depending on their use. For example, the camera device 11 be secured to a section of the vehicle that is not the windshield 2 or mounted in or on other items that are not vehicles. In this case, "UPR" does not always represent the vertical direction of the camera device 11 that is defined in terms of gravity.

The camera device 11 has the bracket 12 , the case 13 and the camera module 14 on. The holder 12 is made of metal or resin and on the front windshield 2 installed inside a passenger compartment of the vehicle. The installation, as mentioned here, contains the positioning of the camera device 11 , The camera device 11 Can be detachably attached to a selected area of the front windshield 2 be assured. The holder 12 has the top plate 12a attached to the front windshield 2 is glued, and four L-shaped side plates 12b on, extending from the front, back, right and left sides of the top plate 12a extend downwards. The L-shaped side plates 12b each serve as a hook.

The housing 13 is made of metal or resin in the form of a box and shaped to have a total thickness decreasing in the forward direction. In other words, the housing indicates 13 a volume decreasing in the forward direction. The housing 13 indicates the upper surface 13a on, coming out of the front flat surface 13b , the upright flat surface 13c and the rear flat surface 13d consists.

The front flat surface 13b Expands in both the longitudinal and in the transverse direction of the vehicle. The upright flat surface 13c extends upwardly from a rear end of the front flat surface 13b , The rear flat surface 13d extends rearwardly from an upper end of the upright flat surface 13c , The upright flat surface 13c has the exposure hole 13e formed in a central portion thereof, this being through the front end of the camera module 14 outside the case 13 exposed. The exposure hole 13e is located between the front and rear ends of the upright flat surface 13c which face each other in the vertical direction and between the right and left ends of the upright flat surface 13c opposed to each other in the transverse direction.

The housing 13 has near the top surface 13a four cylindrical fixing strips 13k two of which protrude from the outer right side surface thereof (not shown) and two of which protrude from the outer left side surface thereof. For simplicity's sake 1 in perspective, only two of the fastening strips 13k on the right side of the case 13 are provided. The attachment of the housing 13 on the bracket 12 is by hanging or placing the four fixing strips 13k on the four L-shaped side panels 12b the holder 12 achieved.

The camera module 14 how clear in 2 shown has a plurality of lenses 141 , the holder 142 and the circuit board 143 on. The circuit board 143 is implemented by a known camera substrate. The holder 142 has the hollow cylinder 142a in it, the lenses in it 141 which are arranged so as to have the optical axis L coincident with the central axis (ie, the longitudinal center line) of the cylinder 142a is aligned. The holder 142 has the base plate 142b which is configured substantially rectangular and extends from a rear of the ends of the holder 142 extends, extending in the axial direction of the holder 142 are opposite. The base plate 142b extends perpendicular to the longitudinal centerline (ie the central axis) of the holder 142 ,

The upright flat surface 13c has outer shoulders 13f which are formed at their right and left ends. Shoulders 13f are through the recessed right and left ends of the upright flat surface 13c defined and are closer to the rear end of the housing 13 as it is a central body of the upright flat surface 13c with the exposure hole 13e is. The base plate 142b has a length that extends in the transverse direction and is at the inner rear surface of the shoulders 13f of the housing 13 glued using an adhesive, not shown. In such an attachment, the front of the base plate 142b used as a positioning reference surface, eliminating the entire camera module 14 relative to the housing 13 is aligned or positioned. After the camera module 14 positioned correctly in this way becomes the outer circumference of the cylinder 142a in contact with an inner periphery of the exposure hole 13e placed to prevent the entry of external light into the housing 13 to minimize. Although not shown, is inside the case 13 an unillustrated signal processor substrate adapted to process one of the camera module 14 recorded image signal operates and not shown electrical conductors arranged between the signal processor substrate and the circuit board 143 are connected.

The base plate 142b has the hollow cylindrical holder leg 142c towards the rear, which extends from the rear surface, located on the opposite side of the base plate 142b to the cylinder 142a located. The holder leg 142c is rectangular in cross-section of these and integral with the base plate 142b and the cylinder 142a educated. The holder leg 142c has the rear end surface 142d on the opposite side of the base plate 142b on. The rear end surface 142d points as indicated by a dashed line in 4 indicated, a rectangular or square cross-section.

The circuit board 143 is a plate-like substrate on which the image sensor 144 is mounted. The circuit board 143 is with the rear end of the holder leg 142c of the owner 142 using the adhesive 16 connected. The adhesive 16 is implemented by a thermosetting epoxy adhesive.

The circuit board 143 has, as in 3 clearly shown, a front surface (hereinafter also referred to as a first surface) and a back surface (hereinafter also referred to as a second surface) which are opposed to each other by their thickness and is made of a laminate or stack of the solder resist 143a , the metallic layer 143b , the resinous layer 143c , the metallic layer 143d , the resinous layer 143e , the metallic layer 143f and the solder stop 143g made in this order in the thickness direction of the circuit board 143e are arranged. In other words the circuit board 143 at least partially a layer of the solder resist 143a , the metallic layer 143b , the resinous layer 143c , the metallic layer 143d , the resinous layer 143e , the metallic layer 143f and the solder mask 143g , in the thickness direction of the circuit board 143 are stacked.

The soldermask 143a and 143g serve as protective layers. The metallic layers 143b . 143d and 143f are made of an electrically conductive metallic thin film. In this embodiment, the metallic layers 143b . 143d and 143f each made of copper foil. The resinous layers 143c and 143e are made of an electrically insulating resin layer. In this embodiment, the resinous layers 143c and 143e each made of glass epoxy resin. In particular, the circuit board 143 formed in this embodiment by a four-layer glass-epoxy resin plate. The resinous layers 143c and 143e not only can be made of pure resin such as paper-epoxy resin, but also of glass-epoxy resin which is a composite material containing glass fiber.

The circuit board 143 In this embodiment, in contrast to typical glass epoxy substrates, portions with missing metallic layer K, as in FIGS 3 and 4 shown in four sides of the circuit board 143 are formed. The portions with missing metallic layer K are made of a resin layer in which the metallic layers 143b . 143d and 143f partially omitted. In other words, the resinous layers 143c and 143e formed integrally with each other in a region in which the portions with missing metallic layer K are present and to the inner surfaces of the solder resists 143a and 143g extend. Each of the holder legs 142c is with the soldermask 143a using the adhesive 16 connected, with the rear end surface 142 in contact with a corresponding portion of the solder resist 143a is placed on the sections with missing metallic layer K. The image sensor 144 is like in the 2 and 4 can be seen, arranged on a front portion of the circuit board, of the holder leg 142c is surrounded.

Manufacturing processes of the thus constructed camera module 14 are described below. First, the adhesive 16 between the holder leg 142c and the circuit board 143 applied. The positional relationship between the lens 141 and the image sensor 144 is then corrected by means of a six-axis adjustment. In particular, a Cartesian coordinate system of which one of two coordinate lines (ie, x and y axes) is the optical axis L is defined. Position misalignments of each of the holders 142 and the circuit board 143 from the x and y axes are corrected. Subsequently, a laser beam as indicated by an arrow A in FIG 3 indicated along the front of the circuit board 143 from outside the circuit board 143 delivered to the adhesive 16 cure. The front of the circuit board 143 extends perpendicular to the thickness of the circuit board 143 , Such thermal curing cures the adhesive 16 not complete, but is a step that is referred to as temporary hardening to the positional relationship between the holder 142 and the circuit board 143 ie between the lens 141 and the image sensor 144 with regard to the six axes described above, fasten. After the adhesive 16 has been temporarily cured, the camera module 14 placed in a bath of constant temperature to the adhesive 16 completely harden.

• 1a) Die Leiterplatte 143 ist, wie oben beschrieben, mit den Abschnitten mit fehlender metallischer Schicht K ausgestattet, in denen die metallischen Schichten 143b, 143d und 143f weggelassen sind. Die Abschnitte mit fehlender metallischer Schicht K befinden sich in Ausrichtung mit den Verbindungen des Halters 142 an der Leiterplatte 143 durch das Haftmittel 16 in der Dickenrichtung der Leiterplatte 143. Mit anderen Worten, weist die Leiterplatte 143 die Abschnitte mit fehlender metallischer Schicht K auf, die angebracht sind, um die Verbindungen des Halters 142 mit der Leiterplatte 143 zu überlappen, in Dickenrichtung der Leiterplatte 143 betrachtet. Wenn die metallischen Schichten 143b, 143d und 143f, die eine höhere Wärmeleitfähigkeit aufweisen, derart ausgebildet sind, dass sie sich in der Leiterplatte 143 vollständig in einer Richtung (d. h. einer Breitenrichtung) senkrecht zu der Dickenrichtung der Leiterplatte 143 erstrecken, kann dies dazu führen, dass Wärme, die durch den auf das Haftmittel 16 aufgebrachten Laserstrahl erzeugt wird, teilweise von den metallischen Schichten 143b, 143d und 143f absorbiert wird. Um diesen Nachteil zu beseitigen, ist die Leiterplatte 143 dieses Ausführungsbeispiels derart ausgelegt, dass sie Abschnitte mit fehlender metallischer Schicht K aufweist, die angebracht sind, um das Haftmittel 16 (d. h. die Halterschenkel 142c) in Dickenrichtung der Leiterplatte 143 zu überlappen, wodurch die Wärmeübertragung des Haftmittels 16 auf die metallischen Schichten 143b, 143d und 143f minimiert ist. Die Struktur der Kameravorrichtung 11 dieses Ausführungsbeispiels ist imstande, das wärmehärtenden Haftmittel 16 wirksam zu erwärmen und schnell auszuhärten, wodurch die Leichtigkeit ermöglicht wird, mit der die Kameravorrichtung 11 produziert wird. Ein derart nützlicher Vorteil kann auch in einem Fall hergeleitet werden, in dem das Haftmittel 16 durch Heißluft unter Verwendung eines Gebläses ausgehärtet wird.
• 1b) Die in der Leiterplatte 143 verwendeten metallischen Schichten 143b, 143d und 143f können aus verschiedenen Arten von Metall hergestellt sein, aber in diesem Ausführungsbeispiel sind sie aus Kupferfolie hergestellt, die dafür bekannt ist, dass sie eine höherer Wärmeleitfähigkeit aufweist. Die Struktur der Leiterplatte 143, die mit den Abschnitten mit fehlender metallischer Schicht K ausgestattet ist, ist daher sehr nützlich bei der Minimierung der Wärmeübertragung des Haftmittels 16 auf die metallischen Schichten 143b, 143d und 143f.
• 1c) Ein Acrylhaftmittel ist als schneller in der Aushärtungsreaktion bekannt als ein Epoxidhaftmittel, jedoch mit einem größeren Verformungsgrad bei der Aushärtung. Ein Acrylhaftmittel ist nach vollständiger Aushärtung in der mechanischen Festigkeit ebenfalls geringer als ein Epoxidhaftmittel. Das in diesem Ausführungsbeispiel verwendete Haftmittel 16 besteht aus einem Epoxidklebstoff, bei dem der Verformungsgrad bei der Aushärtung kleiner ist und eine höhere mechanische Festigkeit aufweist als der Acrylhaftmittel nach vollständiger Aushärtung. Dies gewährleistet die Stabilität bei der Beibehaltung eines gewünschten Positionsverhältnisses zwischen dem Objektiv 141 und dem Bildsensor 144, nachdem es mittels einer sechsachsigen Einstellung korrigiert worden ist.

The structure of the camera device 11 in the first embodiment offers the following advantages.

• 1a) The circuit board 143 is, as described above, equipped with the sections with missing metallic layer K, in which the metallic layers 143b . 143d and 143f are omitted. The sections with missing metallic layer K are in alignment with the connections of the holder 142 on the circuit board 143 through the adhesive 16 in the thickness direction of the circuit board 143 , In other words, rejects the circuit board 143 the portions with missing metallic layer K, which are attached to the connections of the holder 142 with the circuit board 143 to overlap, in the thickness direction of the circuit board 143 considered. When the metallic layers 143b . 143d and 143f having a higher thermal conductivity, are formed so that they are in the circuit board 143 completely in one direction (ie, a width direction) perpendicular to the thickness direction of the circuit board 143 This can cause heat to be spread through the adhesive 16 applied laser beam is generated, partially from the metallic layers 143b . 143d and 143f is absorbed. To eliminate this disadvantage, the circuit board 143 This embodiment is designed such that it has portions with missing metallic layer K, which are attached to the adhesive 16 (ie the holder legs 142c ) in the thickness direction of the circuit board 143 overlap, thereby increasing the heat transfer of the adhesive 16 on the metallic layers 143b . 143d and 143f is minimized. The structure of the camera device 11 this embodiment is capable of the thermosetting adhesive 16 effective to heat and cure quickly, which allows the ease with which the camera device 11 is produced. Such a useful advantage can also be derived in a case where the adhesive 16 cured by hot air using a blower.
• 1b) The in the circuit board 143 used metallic layers 143b . 143d and 143f may be made of various types of metal, but in this embodiment they are made of copper foil, which is known to have a higher thermal conductivity. The structure of the circuit board 143 Therefore, it is very useful in minimizing the heat transfer of the adhesive provided with the portions lacking metallic layer K 16 on the metallic layers 143b . 143d and 143f ,
• 1c) An acrylic adhesive is known to be faster in the curing reaction than an epoxy adhesive, but with a greater degree of strain in the cure. An acrylic adhesive is also less than an epoxy adhesive after complete cure in mechanical strength. The adhesive used in this embodiment 16 consists of an epoxy adhesive in which the degree of deformation during curing is smaller and has a higher mechanical strength than the acrylic adhesive after complete curing. This ensures stability in maintaining a desired positional relationship between the lens 141 and the image sensor 144 after being corrected by means of a six-axis attitude.

SECOND EMBODIMENT

The camera device 11 of the second embodiment will be described below with reference to 5 described. The same reference numerals as used in the first embodiment refer to the lots, and a detailed explanation thereof will be omitted here.

The circuit board 143 of the first embodiment is with the metallic layers 143b . 143d and 143f each having the missing metallic layer portion K, however, has the circuit board 143 of the second embodiment, no portion with missing metallic layer K in the metallic layer 143f on, the furthest from the adhesive 16 are removed, ie, the portions with missing metallic layer K only in the metallic layers 143b and 143d on, getting closer to the adhesive 16 are as the metallic layer 143f , In other words, the metallic layer extends 143f completely in the circuit board 143 in a direction perpendicular to the thickness direction of the circuit board 143 ,

The structure of the camera device 11 in the second embodiment offers the following advantages.

The closer the metallic layers are 143b . 143d and 143f on the adhesive 16 the greater the amount of heat of the adhesive 16 that of the metallic layers 143b . 143d and 143f is absorbed. The metallic layer 143f , the furthest from the adhesive 16 is removed does not necessarily have the portion with missing metallic layer K with respect to the beneficial advantages as described in the first embodiment.

THIRD EMBODIMENT

The camera device 11 of the third embodiment will be described below with reference to FIGS 6 described. The same reference numerals as used in the first embodiment refer to the lots, and a detailed explanation thereof will be omitted here.

The circuit board 143 of the first embodiment is with the metallic layers 143b . 143d and 143f however, each of them has the portion with missing metallic layer K, but the circuit board has 143 of the third embodiment, a portion with missing metallic layer K only in the metallic layer 143b on, the closest to the adhesive 16 lies, ie has sections with missing metallic layer K only in the metallic layers 143d and 143f on, which is further from the adhesive 16 are removed as the metallic layer 143b , In other words, the metallic layers extend 143d and 143f completely in the circuit board 143 in a direction perpendicular to the thickness direction of the circuit board 143 ,

The structure of the camera device 11 in the third embodiment offers the following advantages.

The closer the metallic layers are 143b . 143d and 143f on the adhesive 16 the greater the amount of heat of the adhesive 16 that of the metallic layers 143b . 143d and 143f is absorbed. Only the metallic layer 143b containing the adhesive 16 may be closest to the missing metallic layer portion K with respect to the beneficial advantages as described in the first embodiment. The effect of rapid heating and subsequent curing of the adhesive 16 however, is highest in the first embodiment, but lowest in the third embodiment.

FOURTH EMBODIMENT

The camera device 11 of the fourth embodiment will be described below with reference to 7 described. The same reference numerals as used in the first embodiment refer to the lots, and a detailed explanation thereof will be omitted here.

The circuit board 143 of the first embodiment is with the metallic layers 143b . 143d and 143f however, each of them has the portion with missing metallic layer K, but the circuit board has 143 of the fourth embodiment no portion at all with missing metallic layer K in the metallic layers 143b . 143d and 143f on. In other words, all the metallic layers extend 143b . 143d and 143f completely in the circuit board 143 in a direction perpendicular to the thickness direction of the circuit board 143 , This embodiment uses an adhesive 216 instead of the thermosetting adhesive 16 , The adhesive 216 is a transparent light-curing adhesive. In particular, the adhesive is 216 an epoxy UV-curing adhesive and is rendered transparent by the delivery of an additional conventional colorant used. The camera device 11 This embodiment differs from that of the first embodiment only in this feature.

In the fourth embodiment, after the positional relationship between the lens 141 and the image sensor 144 corrected by means of the six-axis adjustment, a UV ray as indicated by an arrow B in FIG 7 indicated along the front of the circuit board 143 from outside the circuit board 143 delivered to the adhesive 216 cure. Such curing cures the adhesive 16 not complete, but is a step that is referred to as temporary hardening to the positional relationship between the holder 142 and the circuit board 143 ie between the lens 141 and the image sensor 144 with regard to the six axes described above, fasten.

• 4a) Ein typischer UV-härtender Klebstoff zur Verwendung bei einer vorübergehenden Befestigung des Halters 142 und der Leiterplatte 143 ist üblicherweise mit Kohlenstoff schwarz gefärbt. Das in dem vierten Ausführungsbeispiel verwendete Haftmittel 216 ist ein transparenter UV-härtender Klebstoff, wodurch die Reichweite eines UV-Strahls auf das gesamte Haftmittel 216 erhöht wird, verglichen mit einem Fall, wenn das Haftmittel 216 schwarz gefärbt ist, was das Haftmittel 216 schnell aushärten lässt und die Leichtigkeit ermöglicht, mit der die Kameravorrichtung zusammengebaut wird. Die nützlichen Wirkungen, wie sie durch die Verwendung des transparenten Haftmittels 216 geboten werden, gelten gleichermaßen für ein Haftmittel, das durch Licht (z. B. sichtbares Licht) anstelle des UV-Lichts ausgehärtet wird.
• 4b) Wenn das Haftmittel 216 schwarz gefärbt ist, dient es dazu, das Eindringen von Außenlicht in die Halterschenkel 142c zu vermeiden, jedoch ist aber das Gehäuse 13 der Kameravorrichtung 11 dafür ausgelegt, gegen Außenlicht abzuschirmen. Insbesondere bedeckt das Gehäuse 13 den Bildsensor 144, die Leiterplatte 143 und das Haftmittel 16 oder 216, um zu verhindern, dass Licht den Bildsensor 144 erreicht, ohne durch das Objektiv 141 zu gehen, wodurch es ermöglicht wird, das Haftmittel 216 transparent zu machen, ohne ein Risiko von ungünstigen Wirkungen von Außenlicht auf Bilder, die von dem Bildsensor 144 aufgenommen wurden.
• 4c) Ein Acrylhaftmittel ist als schneller in der Aushärtungsreaktion bekannt als ein Epoxidhaftmittel, jedoch mit einem größeren Verformungsgrad bei der Aushärtung. Ein Acrylhaftmittel ist auch nach vollständiger Aushärtung in einem Konstant-Temperaturbad geringer in der mechanischen Festigkeit als ein Epoxidhaftmittel. Das in diesem Ausführungsbeispiel verwendete Haftmittel 216 besteht aus einem Epoxidklebstoff, bei dem der Verformungsgrad bei der Aushärtung kleiner ist und nach vollständiger Aushärtung eine höhere mechanische Festigkeit aufweist als das Acrylhaftmittel. Dies gewährleistet die Stabilität bei der Beibehaltung eines gewünschten Positionsverhältnisses zwischen dem Objektiv 141 und dem Bildsensor 144, nachdem es mittels einer sechsachsigen Einstellung korrigiert worden ist.

The structure of the camera device 11 in the fourth embodiment offers the following advantages.

• 4a) A typical UV-curing adhesive for use in temporary attachment of the holder 142 and the circuit board 143 is usually colored black with carbon. The adhesive used in the fourth embodiment 216 is a transparent UV-curing adhesive, which increases the reach of a UV beam on the entire adhesive 216 is increased compared with a case when the adhesive 216 black colored is what the adhesive 216 Cures quickly and allows the ease with which the camera device is assembled. The beneficial effects, as demonstrated by the use of the transparent adhesive 216 apply equally to an adhesive that is cured by light (eg, visible light) instead of UV light.
• 4b) If the adhesive 216 colored black, it serves the penetration of outside light into the holder legs 142c to avoid, however, is the case 13 the camera device 11 designed to shield against outside light. In particular, the housing covers 13 the image sensor 144 , the circuit board 143 and the adhesive 16 or 216 to prevent light from the image sensor 144 achieved without passing through the lens 141 to go, thereby allowing the adhesive 216 making it transparent, without the risk of adverse effects of external light on images taken by the image sensor 144 were recorded.
• 4c) An acrylic adhesive is known to be faster in the cure reaction than an epoxy adhesive, but with a greater degree of strain on cure. An acrylic adhesive, even after complete cure in a constant temperature bath, is lower in mechanical strength than an epoxy adhesive. The adhesive used in this embodiment 216 consists of an epoxy adhesive, in which the degree of deformation during curing is smaller and after complete curing has a higher mechanical strength than the acrylic adhesive. This ensures stability in maintaining a desired positional relationship between the lens 141 and the image sensor 144 after being corrected by means of a six-axis attitude.

"Transparent" as mentioned in this invention does not necessarily mean the fact that the light transmission of the adhesive 261 100%. It is advisable that the light transmittance of the adhesive 261 is higher than that of the conventional adhesives used. For example, the adhesive 216 after curing, have a light transmittance allowing 50% or more of electromagnetic waves (ie, light) having a wavelength of 200 nm to 400 nm to pass therethrough, preferably having a light transmittance of 90% or more of electromagnetic waves having a wavelength of 200 nm to 400 nm allows to go through there.

MODIFICATIONS

• 5a) In jedem der obigen Ausführungsbeispiele ist das Haftmittel 16 oder 216 ein Epoxidklebstoff, kann aber jedoch auch alternative ein Acrylklebstoff oder ein anderer Typ sein. Das Haftmittel 16 oder 216 kann auch ein Haftmittel sein, das sowohl wärmehärtende als auch lichthärtende Eigenschaften aufweist. Ein solches Hybrid-Haftmittel ist in dem Haftmittel 16 oder 216 enthalten.
• 5b) Das Positionsverhältnis zwischen dem Objektiv 141 und dem Bildsensor 144 wird in den vorherigen Ausführungsbeispielen der sechsachsigen Einstellung unterzogen, kann aber jedoch durch eine vierachsige Einstellung korrigiert werden. Die Kameravorrichtung 11 kann alternativ dazu ausgelegt sein, anstelle des Objektivs 141 ein optisches Element, wie beispielsweise einen Filter, aufzuweisen, so dass es ermöglicht wird, dass Licht dort hindurchdringt oder in Richtung des Bildsensors 144 unter Verwendung optischer Eigenschaften wie Brechung, Reflexion, selektiver Permeabilität oder optische Drehung reflektiert wird. Die Einstellung des Positionsverhältnisses kann leicht in Abhängigkeit von der Art des verwendeten optischen Elements erzielt werden.
• 5c) In jeder des ersten bis dritten Ausführungsbeispiels ist zumindest die metallische Schicht 143b der Leiterplatte 143 derart geformt, dass sie den Abschnitt mit fehlender metallischer Schicht K aufweist, der derart angeordnet ist, dass er den gesamten Verbund zwischen dem Halter 142 (d. h. dem Halterschenkel 142c) und der Leiterplatte 143 durch das Haftmittel 16 in Dickenrichtung der Leiterplatte 143 überlappt, aber jedoch der Abschnitte) mit fehlender metallischer Schicht K derart angeordnet sein kann, dass er den Verbund zwischen dem Halter 142 und der Leiterplatte 143 in der Dickenrichtung der Leiterplatte 143 teilweise überlappt. Wenn zum Beispiel die metallische Schicht 143b aus Kupferfolie hergestellt ist, können Löcher in einem regelmäßigen Abstand voneinander in Abschnitten der metallischen Schicht 143b gebohrt oder gestanzt werden, welche den obigen Verbunde in Dickenrichtung der Leiterplatte 143 überlappen, und die Abschnitte mit fehlender metallischer Schicht K können in den jeweiligen Löchern ausgebildet sein.
• 5d) In dem vierten Ausführungsbeispiel muss das transparente Haftmittel 216 nicht notwendigerweise auf ganze Bereiche des Halters 142 (d. h. des Halterschenkel 142c) und der Leiterplatte 143, die miteinander verbunden werden sollen, aufgebracht werden, aber kann jedoch ein farbiges Haftmittel stattdessen nur auf einen Abschnitt(e) der Bereiche des Halters 142 und der Leiterplatte 143 aufgebracht werden, die miteinander verbunden werden sollen.
• 5e) Bei den ersten bis dritten Ausführungsbeispielen weist die Leiterplatte 143 zumindest in der metallischen Schicht 143b den Abschnitt mit fehlender metallischer Schicht K auf, kann aber jedoch alternativ derart ausgelegt sein, dass sie den Abschnitt mit fehlender metallischer Schicht K nur in der metallischen Schicht 143f aufweist, die sich am weitesten von dem Verbund zwischen dem Halter 142 und der Leiterplatte 143 entfernt befindet. Dies verringert auch die Wärmemenge des Haftmittels 16, die von der metallischen Schicht 143f absorbiert wird, wodurch eine schnelle Aushärtung des Haftmittels 16 erzielt wird.
• 5f) Die Funktion oder Aufgabe eines der zuvor beschriebenen Komponenten der Kameravorrichtung 11 in den vorherigen Ausführungsbeispielen kann mit zwei oder mehr von ihnen geteilt werden. Die Aufgaben von zwei oder mehr der Komponenten der Kameravorrichtung 11 können alternativ einer der Komponenten zugeordnet sein. Die Komponenten der Kameravorrichtung 11 können teilweise weggelassen werden. Die Komponente(n) der Kameravorrichtung 11 in einem der Ausführungsbeispiele oder Abwandlungen kann zu einem anderen Ausführungsbeispiel hinzugefügt oder modifiziert oder durch eine anderes Ausführungsbeispiel oder Abwandlung ersetzt werden. Daher sollte die Erfindung so verstanden werden, dass sie alle möglichen Ausführungsbeispiele und Abwandlungen der gezeigten Ausführungsbeispiele aufweist, die ausgeführt werden können, ohne vom Prinzip der Erfindung abzuweichen, wie es in den beigefügten Ansprüchen dargelegt ist.

While the present invention is disclosed in relation to the preferred embodiments For a better understanding of these, it should be recognized that the invention may be embodied in various ways without departing from the principle of the invention. Therefore, the invention should be understood to include all possible embodiments and modifications of the illustrated embodiments which can be embodied without departing from the principle of the invention as set forth in the appended claims.

• 5a) In each of the above embodiments, the adhesive is 16 or 216 an epoxy adhesive, but may alternatively be an acrylic adhesive or other type. The adhesive 16 or 216 may also be an adhesive having both thermosetting and photocuring properties. Such a hybrid adhesive is in the adhesive 16 or 216 contain.
• 5b) The positional relationship between the lens 141 and the image sensor 144 is subjected to the six-axis adjustment in the previous embodiments, but can be corrected by a four-axis adjustment. The camera device 11 may alternatively be designed instead of the lens 141 having an optical element, such as a filter, so as to allow light to penetrate there or toward the image sensor 144 is reflected using optical properties such as refraction, reflection, selective permeability, or optical rotation. The adjustment of the position ratio can be easily achieved depending on the kind of the optical element used.
• 5c) In each of the first to third embodiments, at least the metallic layer 143b the circuit board 143 shaped so as to have the portion of missing metallic layer K arranged so as to cover the entire bond between the holder 142 (ie the holder leg 142c ) and the circuit board 143 through the adhesive 16 in the thickness direction of the circuit board 143 overlapped, but the portions) with missing metallic layer K can be arranged such that it forms the bond between the holder 142 and the circuit board 143 in the thickness direction of the circuit board 143 partially overlapped. If, for example, the metallic layer 143b Made of copper foil, holes can be at a regular distance from each other in sections of the metallic layer 143b drilled or punched, which the above composites in the thickness direction of the circuit board 143 overlap, and the portions with missing metallic layer K may be formed in the respective holes.
• 5d) In the fourth embodiment, the transparent adhesive must 216 not necessarily on entire areas of the holder 142 (ie the holder leg 142c ) and the circuit board 143 Instead, a colored adhesive may only be applied to a portion (e) of the areas of the holder 142 and the circuit board 143 be applied, which are to be interconnected.
• 5e) In the first to third embodiments, the circuit board 143 at least in the metallic layer 143b however, the portion having a missing metallic layer K may alternatively be designed to include the missing metallic layer portion K only in the metallic layer 143f that is farthest from the bond between the holder 142 and the circuit board 143 is located away. This also reduces the amount of heat of the adhesive 16 that of the metallic layer 143f is absorbed, resulting in rapid curing of the adhesive 16 is achieved.
• 5f) The function or task of one of the camera device components previously described 11 in the previous embodiments may be shared with two or more of them. The tasks of two or more of the components of the camera device 11 may alternatively be associated with one of the components. The components of the camera device 11 can be partially omitted. The component (s) of the camera device 11 in one of the embodiments or modifications may be added to another embodiment or modified or replaced by another embodiment or modification. Therefore, the invention should be understood to include all possible embodiments and modifications of the illustrated embodiments which can be embodied without departing from the principle of the invention as set forth in the appended claims.

QUOTES INCLUDE IN THE DESCRIPTION

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Cited patent literature

• JP 2016-41184 [0001]
• JP 2014-225777 [0004]

Claims (8)

Camera apparatus comprising: a printed circuit board ( 143 ), which at least partially a resinous layer ( 143c . 143e ) and a metallic layer ( 143b . 143d . 143f ) stacked in their thickness direction; an image sensor ( 144 ) disposed on the circuit board; an optical element ( 141 ), which operates to pass light to the image sensor; a holder ( 142 ) holding the optical element; and a thermosetting adhesive ( 16 ), which achieves a bond between the holder and the printed circuit board, wherein the printed circuit board has a portion (K) with missing metallic layer in which the metallic layer is partially omitted, wherein the portion with missing metallic layer is arranged such that it Bond between the holder and the printed circuit board overlaps in the thickness direction of the printed circuit board. The camera apparatus according to claim 1, wherein the circuit board at least partially comprises the resinous layer and a plurality of metallic layers stacked in the thickness direction thereof, wherein the resinous layer is disposed between two of the metallic layers, and wherein the missing metallic layer portion is partially omitted realized one of the metallic layers, which is closest to the bond between the holder and the circuit board. The camera apparatus according to claim 1, wherein the circuit board at least partially comprises the resinous layer and a plurality of metallic layers stacked in its thickness direction, the resinous layer being interposed between two of the metallic layers, and wherein the missing metallic layer section is omitted Section of each of the metallic layers is realized, which overlaps the bond between the holder and the circuit board in the thickness direction. A camera apparatus according to claim 1, wherein the metallic layer is made of copper foil. A camera apparatus according to claim 1, wherein the thermosetting adhesive is an epoxy adhesive. Camera apparatus comprising: a printed circuit board ( 143 ); an image sensor ( 144 ) disposed on the circuit board; an optical element ( 141 ), which operates to pass light to the image sensor; a holder ( 142 ) holding the optical element; and a light-curing adhesive ( 216 ), which achieves a bond between the holder and the circuit board. A camera apparatus according to claim 6, further comprising a housing which covers the image sensor, the circuit board and the adhesive to prevent light from reaching the image sensor without passing through the optical element. A camera apparatus according to claim 6, wherein the photo-curing adhesive is an epoxy adhesive.

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