DE102016203883A1 - Light-emitting diode arrangement for a surface light - Google Patents

Abstract

The invention relates to a light-emitting diode arrangement (30) for a surface light comprising: - at least two strip-shaped carrier elements (32), wherein each of the carrier elements (32) has a larger dimension in a longitudinal direction (36) than in a transverse direction (38), and - a A plurality of light-emitting diodes (18) which are arranged in the longitudinal direction (36) on the carrier elements (32), and - at least one strip-shaped connecting element (34, 46) formed as a separate component, which has a larger dimension than a longitudinal direction (40) in a transverse direction (42) and connected to the carrier elements (32) such that the connecting element (34, 46) is positioned with its longitudinal direction (40) transversely to the longitudinal direction (36) of the carrier elements (32) and the carrier elements (32 ) are spaced apart in the transverse direction (38).

Description

The present invention relates to a light emitting diode array for a surface light having at least two strip-shaped carrier elements, wherein each of the carrier elements in a longitudinal direction has a larger dimension than in a transverse direction, and a plurality of light-emitting diodes which are arranged in the longitudinal direction on the carrier elements. Furthermore, the invention relates to a surface light with a housing having a light exit opening. Finally, the invention also relates to a method for producing a light-emitting diode arrangement.

Light-emitting diode arrangements, light modules and methods for their production are well known in the art, so it does not require a separate documentary evidence for this. They are usually used in building lighting, but occasionally also in outdoor lighting, for example in the area of underpasses, tunnels or the like. As a rule, they are supplied with electrical energy from a public power supply network, for example at a rated voltage of 230 V and at a mains frequency of about 50 Hz. For the purpose of energy supply, a power supply unit is provided, which generally comprises a clocked energy converter. The latter converts electrical energy supplied on the alternating voltage side and makes it available on a direct voltage side for light emitting diodes of the light emitting diode arrangement, which convert and emit the supplied electrical energy into light energy.

A generic surface lamp usually has a large light-emitting surface. On the other hand, light emitting diodes essentially represent a light emission behavior in the manner of a point light source. In order to achieve the most uniform possible light emission of the surface light over the surface when using light emitting diodes, a light emitting diode arrangement is provided which enables the individual light emitting diodes to be widely distributed and nevertheless electrically connected to one another to arrange. Usually, a printed circuit board is used for the arrangement of the LEDs, on which the light-emitting diodes are not only fixed in the predetermined manner but at the same time are electrically connected to apply the individual LEDs in a predeterminable manner with electrical energy. In this case, it is unavoidable that the printed circuit board extends substantially over the dimensions of a light-emitting surface of the surface light. Due to the very small dimensions of the individual light-emitting diodes in relation to the printed circuit board, which may for example be formed in chip form, the vast majority of the printed circuit board is free of components and also of electrical lines. A large part of the printed circuit board surface is therefore unused. This leads to a high material consumption, which also entails corresponding costs.

One way to reduce the cost of materials with respect to the printed circuit board is to form double-use, which include in manufacture interlocking printed circuit board fingers on which the LEDs are arranged. At opposite lateral edges, the associated fingers are each connected to each other via a common web. Nevertheless, the spaced arrangement of the LEDs on the circuit board still requires that the individual fingers continue to be largely unused in terms of their area.

The invention has for its object to improve a light emitting diode array and a surface light and a method of the generic type to the effect that the use of materials can be further reduced.

As a solution, the invention proposes a light-emitting diode arrangement according to claim 1. With the further independent claim 12, a corresponding surface lamp is proposed. Finally, with the further independent claim 14, a corresponding method is proposed.

Further advantageous embodiments of the invention will become apparent from the features of the dependent claims.

With the invention, it is proposed in particular for a generic light-emitting diode arrangement that the light-emitting diode arrangement has at least one strip-shaped connecting element formed as a separate component, which has a larger dimension in a longitudinal direction than in a transverse direction and is connected to the carrier elements such that the connecting element with its longitudinal direction is positioned transversely to the longitudinal direction of the carrier elements and the carrier elements are arranged spaced apart in the transverse direction.

With regard to a generic surface-mounted luminaire, it is in particular proposed that a light-emitting diode arrangement according to the invention be arranged in the housing.

• – Herstellen einer Trägerelementeinheit, die eine Mehrzahl von miteinander verbundenen streifenförmigen Trägerelementen umfasst, wobei jedes der Trägerelemente in eine Längsrichtung eine größere Abmessung als in eine Querrichtung aufweist,
• – Vereinzeln der Trägerelemente der Trägerelementeinheit,
• – Herstellen einer Verbindungselementeinheit, die eine Mehrzahl von miteinander verbundenen streifenförmigen Verbindungselementen umfasst, die in eine Längsrichtung eine größere Abmessung als in eine Querrichtung aufweisen,
• – Vereinzeln der Verbindungselemente der Verbindungselementeinheit,
• – Anordnen der Trägerelemente derart, dass die Trägerelemente in der Querrichtung voneinander in einem vorgegebenen Abstand positioniert sind,
• – Bestücken der Trägerelemente mit Leuchtdioden,
• – Anordnen wenigstens eines der Verbindungselemente derart, dass das wenigstens eine der Verbindungselemente mit seiner Längsrichtung quer zur Längsrichtung der Trägerelemente positioniert ist,
• – Verbinden der Leuchtdioden mit den Trägerelementen und
• – Verbinden der Trägerelemente mit dem wenigstens einem Verbindungselement.

With regard to a generic method, the invention particularly proposes that the method comprises the steps:

• Producing a carrier element unit comprising a plurality of interconnected strip-shaped carrier elements, each of the carrier elements having a larger dimension in a longitudinal direction than in a transverse direction,
• Separating the carrier elements of the carrier element unit,
• Producing a connecting element unit which comprises a plurality of interconnected strip-shaped connecting elements which have a larger dimension in a longitudinal direction than in a transverse direction,
• Separating the connecting elements of the connecting element unit,
• Arranging the carrier elements such that the carrier elements are positioned in the transverse direction from one another at a predetermined distance,
• - equipping the carrier elements with light-emitting diodes,
• Arranging at least one of the connecting elements such that the at least one of the connecting elements is positioned with its longitudinal direction transverse to the longitudinal direction of the carrier elements,
• - Connecting the LEDs with the support elements and
• - Connecting the support elements with the at least one connecting element.

The invention is based on the finding that a significant material savings, in particular with regard to the support elements for the light-emitting diodes can be achieved if the support elements are designed as strip-shaped support elements on which the light emitting diodes are arranged one behind the other at a predetermined distance in the longitudinal direction of the support elements and at the same time individual support elements are arranged at a corresponding distance in the transverse direction to each other. This makes it possible to produce the individual carrier elements with their preferably simple, rectangular structure in a carrier element unit in the manner of a multiple use, and arranged by separation carrier elements in the predetermined distance to each other, so that the light emitting diodes of the light emitting diode array, in particular the adjacent carrier elements, in total in the given Distance from each other are arranged. As a result, material-free intermediate spaces between the carrier elements themselves can be formed, so that a material consumption is considerably lower compared to the prior art, in particular compared to a realization by double use. In addition, the production of the carrier elements can be realized by the use of multiple benefits significantly cheaper. Large, unused areas, such as circuit board surfaces in the prior art, can be avoided. Furthermore, a considerable weight saving can be achieved by the light-emitting diode arrangement according to the invention, so that a surface light comprising this light-emitting diode arrangement can be realized not only more cost-effectively, but also with a lower weight. Especially with very large area lights, for example, with edge dimensions of greater than 0.4 m, thereby significantly simpler installation can be achieved at a predetermined position to realize the desired lighting function.

The support elements of the light-emitting diode arrangement are preferably aligned parallel to one another with regard to their extension in the longitudinal direction. In particular, they may be connected with their longitudinal direction substantially perpendicular with respect to the longitudinal direction of the at least one connecting element with this. In addition, it can of course be provided that the positioning of the support elements with respect to their longitudinal direction with respect to the longitudinal direction of the at least one connecting element can also be provided at a different angle from the right angle. The term "transverse" in the sense of this disclosure thus not only means rectangular, but also includes deviating angles unless parallelism exists. Particularly advantageously, the carrier elements have the same length in their longitudinal direction. In addition, they can also have the same width in the transverse direction. Basically, this can also be provided for the connecting elements.

Preferably, the LEDs are arranged exclusively on the carrier elements. In addition, in an alternative embodiment, light-emitting diodes can also be arranged on the connecting element. The light-emitting diodes are to be rated as point light sources in relation to the area light. So that a uniform illumination as possible by the surface module can be achieved, it is necessary to arrange the LEDs at a predetermined distance from each other. In fact, if the light-emitting diodes were arranged directly adjacent to one another, very great light intensities would be generated, as is generally not necessary for the building lighting by means of the surface light. It has been found that the predetermined distance from directly adjacent light emitting diodes is preferably greater than about 1.5 cm, more preferably greater than about 2 cm, in particular greater than about 2 cm and less than about 5 cm. The light-emitting diodes, which are arranged on the carrier elements spaced one behind the other, in particular in the longitudinal direction, are preferably also arranged with this distance from one another on the carrier elements. This means in succession that they in particular in a row behind each other may be arranged, for example, linear, as along a straight line. Alternatively, the light-emitting diodes can of course also be arranged offset in the transverse direction relative to one another, provided that the carrier elements are sufficiently wide with respect to the dimensions of the light-emitting diodes. For example, the light-emitting diodes may be arranged along a triangular line, a wavy line or the like on the carrier elements.

The distance between two immediately adjacent support elements is preferably chosen such that the predetermined distance between two light-emitting diodes on the two support elements, which are arranged in the longitudinal direction of one end of the support elements at an equal distance, about the same distance as it on each of the support elements is provided between immediately adjacent light-emitting diodes, for example, greater than about 1.5 cm, preferably greater than about 2 cm, in particular greater than about 2 cm and less than about 5 cm.

The carrier elements are preferably formed from a plastic, in particular a printed circuit board material such as FR4 or the like. The light-emitting diodes are fastened on one of the two surfaces which extend in the longitudinal direction and the transverse direction of the carrier elements, for example by means of gluing, soldering and / or the like. The support elements thus have an electrically insulating material, which allows to attach light-emitting diodes in chip design. This proves to be particularly advantageous if the surface of the carrier elements on which the light-emitting diodes are arranged is provided with a suitable metallization which makes it possible not only to fix the light-emitting diodes, but also to connect them electrically at the same time. Although the invention is particularly suitable for light emitting diodes, which are formed in chip design, the invention can of course be used in particular for light-emitting diodes, which have a wired housing. In this case, it may be provided that the carrier elements at the positions at which light-emitting diodes are to be arranged have through holes for passing connecting wires of the wired light-emitting diodes.

It proves particularly advantageous if an unused area of the carrier elements on the surface on which the light-emitting diodes are arranged has a reflection layer, for example a mirror coating. This makes it possible to reflect diffracted light due to the further light guide in the area light, which is deflected in the direction of the carrier elements, again. As a result, the luminous efficacy can be further increased. The reflective surface may be provided, for example, by suitable metallization. As metallization are, for example, silver, aluminum, alloys thereof and / or the like. In addition, a preferably highly reflective lacquer, such as a white Lötstoplack or the like may be provided on the surface.

In order that a suitable surface-specific light intensity can be provided in the areal light, it is necessary to arrange the light-emitting diodes, which provide a considerably higher light intensity, correspondingly spaced. In this context, the light-emitting diodes are to be evaluated as point light sources whose luminous intensity is to be distributed to a corresponding solid angle in order to be able to achieve the desired illumination properties through the area light. For this purpose, suitable light diffraction means may be provided, for example scattered lenses or the like.

With the invention can be achieved in particular that the light emitting diode array can be created in a modular manner. For this purpose, it is possible to standardize both support elements and connecting elements and assemble them in the desired manner to a light-emitting diode arrangement as required. As a result, with a small number of standardized components, a large variety of different light-emitting diode arrangements can be achieved for different area lights. In addition, it is possible to individually test the light-emitting diodes connected to the carrier elements before joining them to form the light-emitting diode arrangement and thus to ensure that only completely functional carrier elements are further processed with light-emitting diodes. As a result, the complexity and reliability in the field of production of the light-emitting diode arrangements and the area lights can be further improved.

According to one embodiment, it is proposed that a distance between two directly adjacently arranged carrier elements is greater than the extent of the carrier elements in the transverse direction. As a result, the carrier elements can be designed to be very narrow, that is to say with a very small dimension in the transverse direction relative to the dimension in the longitudinal direction. In particular, the dimension of the carrier elements in the transverse direction approximately corresponds to the dimension of the light-emitting diodes which are to be arranged on the carrier elements. As a result, a particularly low material expenditure in relation to the carrier elements can be achieved.

A development of the invention provides that the extent of the carrier elements in the transverse direction of a dimension of the light-emitting diodes arranged on the carrier elements in the Transverse direction is formed dependent. Depending on the mechanical and / or electrical requirements, it can therefore also be provided that the dimension of the carrier elements in the transverse direction is greater. As a result, arrangement structures for the arrangement of the light-emitting diodes on the carrier elements can be achieved.

According to a further embodiment, it is proposed that the extension of the carrier elements in the transverse direction is greater than a double and smaller than a fivefold value of the dimension of the light-emitting diodes arranged on the carrier elements in the transverse direction. It has been shown that with such an extent of the carrier elements in the transverse direction with a low material usage with respect to the carrier elements a particularly good stability can be achieved. In particular, in the event that the surface light is arranged mobile and optionally also has to be transported frequently, it is advantageous if the light-emitting diode arrangement can provide sufficient inherent stability. By appropriate choice of the dimensions of the carrier elements in the transverse direction, this can be achieved. In addition, of course, can also be provided in addition that a dimension of the support elements in a thickness direction, that is, a direction which is aligned transversely to the longitudinal direction and the transverse direction, is selected accordingly in order to achieve the desired stability can. Preferably, however, a standard material is selected for the carrier elements, for example a printed circuit board material such as FR4 or the like, which is commercially available in large quantities at a material thickness of about 1.6 mm in a cost-effective manner. In this respect, the dimension in the transverse direction of the support elements is particularly suitable to adjust the desired stability can.

It also proves to be particularly advantageous if the light-emitting diode arrangement has two connecting elements, wherein the carrier elements are connected at their ends in the longitudinal direction in each case with one, preferably exactly one, of the connecting elements. In this way, a frame structure can be created, which allows a particularly high stability. If an angle between the longitudinal direction of the carrier elements and the longitudinal direction of the connecting elements is approximately perpendicular, a substantially rectangular frame structure can be achieved. The length of the support elements here preferably corresponds to the distance between the two connecting elements. On the other hand, if the angle deviates from the right angle, for example, a rhombic structure can be achieved. In addition, it can of course be provided that one or more of the support elements protrude in their longitudinal direction over at least one of the connecting elements. This embodiment is suitable, for example, if the surface module has a predetermined, for example irregular, surface structure with regard to its luminous area, for example an angular structure, a triangular structure, a curved, in particular circular structure, combinations thereof or the like. The invention makes it possible to easily provide a wide variety of different area lights. In an alternative embodiment, the support elements may protrude at least over one of the connecting elements.

It is further proposed that both the carrier elements and the at least one connecting element for mutually interconnecting each have at least one connecting unit. The connecting unit can be designed for detachable or non-detachable connection of the carrier elements to the connecting element. For example, the connection unit can be realized by a plug connection, wherein the one element of the carrier elements and the at least one connecting element may have a pin strip with contact pins, whereas the other element of the carrier elements and the at least one connecting element has correspondingly formed contact sleeves which in the connected state, the contact pins record and so can connect.

It proves to be particularly advantageous if the connection unit has a metallization for electrical and mechanical connection. This makes it possible in a simple manner to produce the connection mechanically and electrically. A connector can be saved. If, for example, an electrically conductive adhesive is used, the connection can be produced without soldering, so that a particularly simple and inexpensive connection can be achieved. But basically a solder joint can also be provided. For this purpose, a solder paste can be applied to the metallization. Preferably, three possibilities of the connection can be provided, namely that firstly opposite metallizations to be connected are connected together using a solder in a soldering process, secondly that instead of the solder in connection with the soldering process an electrically conductive adhesive is used and thirdly a supplement to the aforementioned two Opportunities through a common adhesive used for additional connection in a near area around the metallization. When using metallizations as connection units, however, the connection can also be produced by arranging the metallizations to be connected opposite one another such that they are electrically connected contact, wherein adjacent thereto, a mechanical connection is provided by means of a common adhesive. The electrical and the mechanical connection are thus formed separately from each other here. However, the connection of the connection units is preferably produced by a material connection of the connection unit of the at least one connection element to the connection unit of the support elements. A cohesive connection, for example, in addition to soldering, gluing and / or the like also brazing, welding or the like. For this purpose it can be provided that a suitable material, such as a solder, an adhesive or the like, is applied to the metallizations at least partially before the connection. The solder or the adhesive may be printed, for example in the form of a solder paste or an adhesive paste on the metallization in the desired range or the like.

Of course, the connection can basically be provided by the fact that both the at least one connecting element and the carrier elements in a connection region bores, in particular through holes or the like and can be connected to each other by means of wire connections, rivet, screw and / or the like. It proves to be particularly advantageous if plated-through holes are provided in which connecting wires are soldered.

A further embodiment of the invention provides that the carrier elements and / or the at least one connecting element has an electrical line for connecting the light-emitting diodes to a power supply unit. Thus, in addition to a mechanical connection, an electrical connection can also be provided at the same time with the carrier elements and / or the connecting element without additional components. For this purpose, the carrier elements and / or the at least one connecting element may be formed from a printed circuit board material, in particular an FR4 material provided with a metallization. In addition, such a printed circuit board material makes it possible to provide a conductor structure in a simple manner in order to electrically connect the light-emitting diodes in almost any desired manner and to connect them to the energy supply unit. The power supply unit may be formed by a separate ballast, as it is already in the art in use.

It proves to be particularly advantageous if the energy supply unit is integrated in the light-emitting diode arrangement. For this purpose, it can be preferably provided that the power supply unit has at least one strip-shaped carrier plate which has a larger dimension in a longitudinal direction than in a transverse direction, wherein preferably the extension of the carrier plate in the longitudinal direction is greater than or equal to the extent of the carrier elements in the longitudinal direction , wherein the carrier plate is connected to the at least one connecting element such that it is arranged between two, in particular immediately adjacent, arranged the carrier elements. It proves to be particularly advantageous if the extent of the carrier plate in the transverse direction is smaller than a distance of the two carrier elements arranged directly adjacent to one another, between which the carrier plate is arranged. This makes it possible that the light emission is not affected by the light emitting diodes substantially by the arrangement of the support plate. At the same time, a space provided by the spacing of the carrier elements from each other can be used in this way. It proves to be particularly advantageous if the carrier plate comprises exactly one single power supply unit. If necessary, however, two or more support plates may be provided with power supply units, for example, to provide a corresponding power for the operation of the LEDs of the light emitting diode array can. This proves to be particularly advantageous if the power supply unit is standardized as well, in particular if a carrier plate provides exactly one power supply unit. Depending on the power requirement, a corresponding number of energy supply units or carrier plates can then be integrated in the light-emitting diode arrangement. Preferably, the power supply units are connected in parallel in this case. However, it can also be provided that the power supply units are assigned to individual or multiple carrier elements and only supply their LEDs with electrical energy. In this way, a separate ballast can be saved. Due to the separate arrangement of the power supply unit on preferably exactly one carrier plate, a simple integration in the light-emitting diode arrangement is also possible, because by the arrangement on the separate carrier plate usually required in the field of energy supply requirements in terms of electrical safety can be realized more easily. In particular, the carrier elements need not be designed for these requirements. The extension of the carrier plate in its longitudinal direction may be independent of the reason Extension of the support elements in the longitudinal direction. For example, its extension in the longitudinal direction is selected such that preferably all of the components of the power supply unit are arranged on it. But it can also have an extension in the longitudinal direction, which corresponds to the extent of the support elements in the longitudinal direction.

It proves to be particularly advantageous if the at least one connecting element has a first and a second, opposite surface extending in the longitudinal and transverse directions, and the carrier elements are connected to the first surface and the carrier plate is connected to the second surface. As a result, a required electrical insulation between a connection of the light emitting diodes and a connection to a power supply network can be achieved in a simple manner. Preferably, the connector provides electrical isolation between the surfaces for this purpose. The connection of the carrier plate with the at least one connecting element can be substantially the same as the connection of the carrier elements with the connecting element. Alternatively or additionally, in addition, a further connection can be provided, for example by means of a rivet, a screw connection and / or the like.

Particularly advantageously, it can be provided that in the construction described so far, at least the mechanically large components are arranged on the carrier plate in such a way that they have a maximum distance from preferably all surrounding LEDs arranged on carrier elements.

In addition, it can be provided that the power supply unit is at least partially disposed on the at least one connecting element. If the power supply unit is arranged completely on the at least one connecting element, the carrier plate can be saved. Components of a light-emitting diode driver can be arranged on this connecting element in a suitable manner, so that shadow throws can be largely avoided by, in particular large, components.

According to a further embodiment, it is proposed that the energy supply unit has an electrical insulation element. The insulating element preferably serves for electrically insulating the power supply unit with respect to adjacently arranged carrier elements and / or the housing of the areal light. This makes it possible, for example, to arrange the power supply unit or its carrier plate also almost directly adjacent to the adjacent carrier elements. Through the isolation element can be achieved that creepage distances and clearances can be increased. The insulation element can be formed, for example, by a potting compound which covers the support plate at least in an area adjoining the adjacent support elements. In addition, it can also be provided that a corresponding insulating film, for example of a plastic or the like, covers the carrier plate at least in an area adjacent to the directly adjacent carrier elements. The insulating element may be connected, for example, cohesively with the carrier plate. But it can also be connected by means of connecting elements with the support plate. Particularly advantageously, the insulation element is designed such that it provides an electrical insulation with respect to the housing of the surface light. The isolation element may in particular be arranged on one side only on one of the surfaces of the carrier plate. Frequently, this housing has an electrically conductive material and can be touched from the outside in the sense of standardization in terms of electrical safety. By means of the insulation element, the requirements with respect to electrical safety can be met in a simple manner, in particular if the insulation element is designed as a foil which is arranged on the support plate at least on the housing side.

In the event that the power supply unit is at least partially arranged on the connecting element, it can be provided that the insulating element is also arranged below the connecting element and / or on the rear side to a component side. The isolation element can also be designed in two or more parts for this purpose.

In addition, it is proposed that the light-emitting diode arrangement has a first light-emitting diode block comprising at least two carrier elements which are connected to at least one connecting element, a second light-emitting diode block which likewise comprises at least two carrier elements which are connected to at least one connecting element, and a connecting element, wherein the at least one connecting element of the first light-emitting diode block is connected to the at least one connecting element of the second light-emitting diode block by means of the connecting element. This makes it possible to create the LED array cascaded. As a result, almost any size light emitting diode arrays can be achieved. It proves to be particularly advantageous that the manufacture of the light-emitting diode arrangements can be independent of limitations due to production facilities in terms of dimensions. By cascading light emitting diode arrays larger light emitting diode arrays can be created with respect to their dimensions, as would otherwise be possible due to possible limitations of the manufacturing facilities. Of course, the LED blocks may be cascaded in the longitudinal direction of the connectors. But also a cascading across this is possible. It may also provide a combination thereof be. The connection element is used to connect light-emitting diode blocks to be cascaded. This provides a mechanical connection. In addition, an electrical connection can also be provided.

It proves to be particularly advantageous if the connection element is formed by the carrier plate. As a result, the connection element can be integrally formed with the carrier plate, whereby a separate component for the connection element can be saved.

A further development provides that the connection element is connected by a soldered connection to opposite ends of the connection elements of the first and the second light-emitting diode block, for which purpose the connection elements each have at least one metallization in the region of their ends and the connection element two mechanically interconnected bridges each likewise one Have metallization, in each case one of the webs is disposed on each one of the at least one metallization of the connecting elements of the first and second light-emitting diode block and connected thereto. The connection can be formed for example by means of a solder and / or an adhesive. This makes it possible to achieve a high strength. The web should have the widest possible width in the longitudinal direction of the connecting elements, so that a good resistance in terms of torque action can be achieved with bilateral connection in addition to a large translational strength. In order to produce the connection of the connecting elements by means of the connecting element, the webs are themselves interconnected. This can for example be achieved in that the webs form part of a frame, in particular a rectangular frame.

The areal light preferably has a housing having a light exit opening. The light exit opening preferably provides the luminous area of the areal light. Preferably, it has corresponding dimensions. In the housing of the surface light, the light emitting diode array of the invention is arranged, in such a way that a light emission takes place substantially over the entire region of the light exit opening. This makes it possible to achieve a surface light emission through the surface light. The light exit opening can have an almost arbitrary flat contour. Accordingly, the light-emitting diode arrangement can be adapted.

It proves to be particularly advantageous when the light exit opening has a matt diffusing screen and a distance from light emitting diodes of the light emitting diode arrangement to the diffusing screen is greater than a distance from light emitting diodes arranged directly adjacent to one another. It has been shown that in this case a substantially uniform light emission can be achieved by the surface light. By means of the diffuser in conjunction with the distance, the almost punctiform light emission of the light-emitting diodes can be converted into a surface light emission of the surface light. The uniform light emission can be further improved by providing the light-emitting diodes with their own scattered lenses.

With the method according to the invention, the light-emitting diode arrangement according to the invention can be produced. Preferably, a carrier element unit or a connecting element unit is provided both for the carrier elements and for the connecting elements, which is designed in particular as a multiple use. The carrier element unit comprises a plurality of interconnected strip-shaped carrier elements. Accordingly, the connecting element unit comprises a plurality of interconnected strip-shaped connecting elements. Preferably, the carrier elements and / or the connecting elements are connected to one another at their longitudinal edges. The carrier element unit as well as possibly the connecting element unit can be equipped as needed, in such a way that the light-emitting diodes are arranged on the carrier elements in the predetermined manner. Components possibly provided for connecting elements, for example also light emitting diodes, can likewise already be fitted on the connecting element unit. The carrier element unit and / or the connecting element unit can then be singulated to obtain the individual carrier elements or connecting elements. This procedure is particularly suitable when the carrier elements and / or the connecting elements are standardized. As a result, not only the costs relating to the production of the carrier elements and the connecting elements can be kept low, but it can also be optimally used the material that provides the support elements and / or the connecting elements. Cuts and unused areas can be largely avoided. It proves to be particularly advantageous if the carrier elements or the connecting elements use a printed circuit board material as material. Unused surface areas as well as waste areas can be largely avoided. This saves material and resources.

It can be provided that the isolated carrier elements are arranged in a frame, then fitted with the LEDs and finally the at least one isolated connection element is arranged accordingly. The The assembly formed thereby may then be subjected to a soldering process, such as through a reflow soldering oven or the like, to fabricate the light emitting diode array in a single manufacturing step. However, this procedure is not limited to soldering but can also be used, for example, using adhesive, in particular electrically conductive adhesive.

If necessary, an order of individual process steps can also be varied. For example, the loading of the LEDs can also be done before the separation of the carrier elements. In addition, it is also possible to arrange with the equipping of the light emitting diodes at the same time the at least one connecting element.

In addition, the individual carrier elements and / or connecting elements can each be subjected to a separate functional test after the individual separation, so that only functional tested elements are used for the following further processing steps. As a result, the reliability can be increased in terms of manufacturing and thus also the manufacturing cost can be reduced. It proves particularly advantageous if components to be assembled, for example the light-emitting diodes, are provided in a chip design, for example as an SMD or the like. This makes it possible to equip the components with conventional production techniques on the carrier element unit and possibly also on the connecting element unit and then to supply the assembled carrier element unit or connecting element unit to a heat treatment for carrying out a soldering operation. The soldering process can be performed for example in a reflow soldering oven or the like.

The individual carrier elements and at least one of the separated connecting elements are arranged such that the at least one of the connecting elements is positioned with its longitudinal direction transversely to the longitudinal direction of the carrier elements and the carrier elements are positioned in their transverse direction from each other at a predetermined distance. This arrangement can be achieved for example by means of a robot or with predetermined templates and feeding the support elements and the connecting elements in a predeterminable manner. In the positioning thus produced, the carrier elements are then connected to the at least one connecting element.

The connection itself can be made purely mechanically by means of a fastening element, for example a rivet, a screw, but also a bond and / or the like. It proves to be particularly advantageous if the connection also includes an electrical connection at the same time and, with the connection, the carrier elements are connected both mechanically and electrically to the connection element. This can be achieved, for example, only by providing corresponding contact surfaces or metallizations as connection units in an area of the carrier elements to be connected and the at least one connecting element, which also provide electrical contact in the connected state in addition to a mechanical connection. In order to be able to provide a mechanical connection at the same time, it can be provided that an electrically conductive adhesive or the like is arranged between the metallizations of the carrier elements and the at least one connecting element. The electrically conductive adhesive may be applied in the region of the contact surfaces and in the assembled state of the carrier elements with the at least one connecting element produce a corresponding cohesive connection, which allows both a mechanical connection and an electrical connection. In addition, of course, it is possible to connect the corresponding contact surfaces by means of soldering, so that at the same time a mechanical connection can be achieved. Finally, of course, there is also the possibility that plated-through holes are provided in the region of the metallizations and at the same time an electrical and a mechanical connection is provided by means of a rivet, a screw or the like which is formed from an electrically conductive material. If the connection is realized by means of solder, provision can be made for the assembled carrier elements and the at least one connecting element to be guided in the positioned state through a soldering oven, for example the reflow soldering oven, in order thereby to establish the connection. This proves to be particularly advantageous if, at the same time, the carrier elements are also soldered together with the light-emitting diodes and possibly other components mounted thereon. As a result, the complete light-emitting diode arrangement can be produced with a single soldering process.

If the light-emitting diode arrangement also includes a carrier plate, it can be provided that the light-emitting diode arrangement is reflow-soldered without a carrier plate in one pass. Only then is the carrier plate, for example, by hand or by "selective wave-soldering" or the like, connected to the light emitting diode array.

It proves to be particularly advantageous if the carrier elements are aligned parallel to one another in relation to their extension in the longitudinal direction.

With the method according to the invention, a power supply unit for the components of the carrier plates and possibly of the at least one connecting element can also be integrated into the light-emitting diode arrangement in a simple manner. For this purpose it can be provided that a carrier plate unit is provided which has interconnected strip-shaped carrier plates, wherein each of the carrier plates has a larger dimension in a longitudinal direction than in a transverse direction. Preferably, the strip-shaped support plates are square, in particular rectangular.

The support elements may be square, in particular rectangular. In addition, however, they can also be formed at least partially triangular, trapezoidal or the like in order to be able to emulate a desired predetermined contour, for example, with the light-emitting diode arrangement. The contour can be predetermined, for example, by the surface light, in particular by its light exit opening. For example, the contour may be a triangle, a quadrangle or else an n-corner or the like.

Preferably, the carrier plate unit is equipped with components of power supply units such that each of the carrier plates, the components, in particular, exactly one of the power supply units carries. The carrier plate unit preferably has a printed circuit board material, which makes it possible to mechanically and electrically connect the assembled components at the same time. For this purpose, the carrier plate unit has carrier plate-related conductor structures made of an electrically conductive material, in particular a metallization such as copper or the like. The carrier plate unit may then be subjected to a soldering process in which the connection of the components to the printed circuit board material can be made. Then, the carrier plates of the carrier plate unit are singulated. For example, they may be subjected to a function test or the like. At least one of the carrier plates is connected to the at least one connecting element in such a way that the carrier plate is arranged between two directly adjacently arranged carrier elements. Preferably, the carrier plate is arranged in a space formed by the distance between the two carrier elements. As a result, on the one hand, the available space can be optimally utilized and, on the other hand, it can be achieved that the light emission through the light-emitting diodes of the carrier plates is largely undisturbed. In this way it is possible to integrate the power supply unit without additional effort in the light emitting diode array.

Of course, the power supply unit may be configured to provide a predetermined electrical power. Should the light emitting diode array require more power than can be provided by one of the power supply units, two or more power supply units may be provided in the light emitting diode array according to the method of the invention. In this way, a modular design can be realized, which makes it possible to provide in a highly flexible manner light emitting diode arrangements of different dimensions and light outputs.

The invention makes it possible to achieve in a simple manner by standardized support elements, fasteners and support plates that different constructions of surface lights can be realized with very little design effort.

It proves to be particularly advantageous if the dimensions of the carrier plate in its longitudinal direction are preferably greater than or equal to the dimension of the carrier elements in the longitudinal direction. Depending on the available distance between the immediately adjacent carrier elements, between which the carrier plate is to be arranged, it can preferably be provided that the carrier plate has in its transverse direction a dimension which is greater than or equal to the dimension of the carrier elements in the transverse direction thereof.

Further advantages and features will become apparent from the description of exemplary embodiments. In the figures of the embodiments, like reference numerals designate like features and functions.

Show it:

1 in a schematic plan view of a light emitting diode array with a printed circuit board and disposed thereon light emitting diodes produced by a double-use,

2 A first embodiment of a light emitting diode array according to the invention in a schematic plan view,

3 in a schematic representation of a pair of connecting elements, as in the light-emitting diode according to 2 are used

4 in a schematic sectional view of the light emitting diode arrangement according to 2 .

5 a schematic side view of a power supply unit, as in the light-emitting diode according to 2 is arranged

6 in a schematic representation of a perspective view of the power supply unit according to 5 .

7 in a schematic representation connecting units to carrier elements for connection to the connecting elements according to the invention,

8th in a schematic representation of an alternative embodiment of a connection unit on a support element for connection to the connecting element,

9 in a schematic perspective view of a connecting portion of a support plate of the power supply unit with one of the connecting elements according to 2 .

10 a schematic representation of a first embodiment of carrier elements according to the invention,

11 a schematic representation of a second embodiment of carrier elements according to the invention,

12 a schematic representation of a third embodiment of support elements according to the invention,

13 a schematic representation of a fourth embodiment of support elements according to the invention,

14 a schematic representation of another embodiment of a light emitting diode array according to the invention with cascaded light emitting diode blocks and

15 a schematic, enlarged view of a range XV in 14 ,

1 shows a schematic plan view of a light emitting diode array 10 with a circuit board 16 in the manner of a double benefit. The circuit board 16 represents the one part of the double benefit and includes webs 12 , which by means of a connection section 14 are connected together at one end. On the circuit board 16 are light emitting diodes 18 arranged at a predetermined distance, in such a way that immediately adjacent arranged light-emitting diodes 18 have substantially the same distance from one another in an x-direction and a y-direction. In the present case, the distance between the light emitting diodes 18 about 2 cm. Both the connection section 14 as well as the footbridges 12 have mounting holes 24 on, can be pushed through the fastening elements, not shown, to the light emitting diode array 10 to be mounted in a housing, not shown, a surface light also not shown. The light-emitting diodes 18 emit light perpendicular to a plane formed by the x-direction and the y-direction, up from the plane of the drawing.

The bridges 12 have a substantially sawtooth-shaped structure in their extension in the x direction, wherein the light-emitting diodes 18 are arranged substantially at the outer tips of the sawtooth structure formed thereby. As a result, the predetermined distance between LEDs adjacent webs 12 be reached in the y direction. At the same time, on a jetty 12 the predetermined distance between two LEDs 18 be achieved in the same position in the x-direction.

In the 1 structure shown is suitable for the formation of a double benefit, so that a simplified production can be achieved at reduced PCB costs. Nevertheless, each of the bridges 12 a surface area 20 on, in which the circuit board 16 is unused. The areas 20 form a potential for further material savings. Although it is possible, the surface areas 20 from the respective bars 12 auszustanzen, however, thereby reducing the one hand, the stability of the circuit board 16 and on the other hand, this can not be saved circuit board costs, because the punched-out circuit board parts no further use in the context of the light emitting diode array 10 can be supplied. So even if the surface areas 20 punched out, this could be saved no cost. Rather, it is to be expected that the additional punching process further increases the production costs.

A surface light, which should have a large light-emitting surface, it requires that the light-emitting diodes 18 distributed widely and yet arranged electrically connected to each other. In order to achieve the simplest possible overall structure, it is desirable to have a light-emitting diodes 18 Power supply unit supplying electrical energy, often also called a ballast, to be able to be integrated in the panel light.

It is therefore desirable to achieve the largest possible extent of the printed circuit board assembly with sufficient mechanical strength, and to be able to integrate the power supply unit with low consumption of printed circuit board material in the area light. At the same time a particularly favorable structure in terms of production and costs is desired.

It is known to operate area lights with external ballasts, also called DC module. However, it is necessary to mount the ballast as a separate component in a suitably designed light. Therefore, the lamp needs a corresponding space. At the same time, it should be noted that the ballast is not arranged in the light path of the light emitting diode array, because otherwise parts of a light exit surface of the surface light can be shaded. With a separate ballast here is not a satisfactory solution to achieve.

In the 1 illustrated embodiment allows, by the production of the double benefit in a manufacturing step two light emitting diode assemblies 10 produce at the same time and then to separate. In the light-emitting diode arrangement 10 according to 1 is - in 1 not shown - a second circuit board rotated by 180 degrees arranged such that their webs in through the webs 12 Intervene formed interstices. As a result, the PCB utilization can be significantly improved, because with only slightly larger PCB area two light emitting diode arrays 10 can be produced.

Despite the light diode arrangement 10 according to 1 achievable reduction of the required for the light emitting diode array board surface are still large parts of board material unused, because due to the predetermined distance of adjacent light emitting diodes 18 to each other the extension of the webs 12 must be comparatively large in the y-direction. This results in the surface areas 20 that are still unused.

In the embodiment according to 1 Although the ballast thereby in the light emitting diode array 10 integrated, that required for the ballast components on the circuit board 16 distributed, however, this proves to be disadvantageous in that only SMD components can be used, since in this embodiment on the underside of the circuit board 16 There shall be no live parts to comply with electrical safety requirements.

2 shows a second embodiment of a light emitting diode array 30 for a surface light, which is not shown in the figures, by means of which the aforementioned disadvantages can be avoided. The light-emitting diode arrangement 30 in the present case comprises twelve strip-shaped carrier elements 32 wherein each of the support elements 32 in a longitudinal direction 36 a larger dimension than in a transverse direction 38 having. A length of the support elements 32 is thus greater than a width of the carrier elements 32 , Each of the carrier elements 32 is further comprising a plurality of light-emitting diodes 18 equipped in the longitudinal direction 36 spaced apart in a row on the support element 32 are arranged. For this purpose, each carrier element comprises 32 a correspondingly formed, not designated circuit board, which at the same time also has a corresponding conductor track structure 66 provides to the light emitting diodes 18 to connect electrically. In the present case, it is provided that all light-emitting diodes 18 a respective one of the carrier elements 32 are connected in series. The individual light-emitting diodes 18 are on the respective one of the support elements 32 arranged at a predetermined distance from each other. In the present case, the distance between two light emitting diodes arranged directly adjacent to one another is on each of the carrier elements 32 about 2 cm.

Out 2 it can be seen that the longitudinal direction 36 the support elements 32 an x-direction is assigned, whereas the transverse direction 38 the support elements 32 associated with a y-direction. How out 2 it can be seen, are the support elements 32 in this case approximately the same length in the longitudinal direction 36 and also equally wide in the transverse direction 38 , They are spaced apart, by a distance 44 in this embodiment between immediately adjacent the support elements 32 is essentially the same size. The carrier elements 32 are also with respect to their longitudinal direction 36 arranged parallel to each other.

The distance 44 is chosen such that light-emitting diodes 18 from immediately adjacent to the support elements 32 also about 2 cm apart with respect to a same position in the x-direction. In the present case, this is the distance 44 about a width of the support elements 32 in the transverse direction 38 reduced from the intended distance of about 2 cm of the LEDs 18 , Furthermore, in the present case, the extension of the carrier elements 32 in the transverse direction 38 that is, its width, greater than about four times the dimension of the dimension on the support members 32 arranged light-emitting diodes 18 ,

The light-emitting diodes 18 are presently formed by LEDs in chip design, the type of SMD component on the circuit boards of the support elements 32 are soldered.

The light-emitting diode arrangement 30 further comprises two connecting elements 34 . 46 , which are also formed in the present case by a printed circuit board material. The carrier elements 32 are in their longitudinal direction 36 at their ends in each case with one of the two connecting elements 34 . 46 connected.

Each of the connecting elements 34 . 46 is formed as a separate, strip-shaped component, which in a longitudinal direction 40 a bigger one Dimension than in a transverse direction 42 having. The longitudinal direction 40 the connecting elements 34 . 46 is assigned here the y-direction, whereas the transverse direction 42 the connecting elements 34 . 46 associated with the x-direction. Due to the structure formed thereby, a substantially rectangular-shaped frame is formed, in which the light-emitting diodes 18 are arranged substantially uniformly distributed over the surface formed by the frame. The connecting elements 34 . 46 are with their longitudinal directions 40 accordingly transverse to the longitudinal direction 36 the support elements 32 positioned. Furthermore, the carrier elements 32 in the transverse direction 38 or the y-direction spaced from each other.

How out 2 also can be seen, the support elements 32 end contact surfaces 48 . 50 on, the connection units of the support elements 32 form. The contact surface 50 makes a positive connection of each of the support elements 32 ready, whereas the contact surface 48 a negative terminal of the respective one of the carrier elements 32 provides. About these contact surfaces 48 . 50 are the carrier elements 32 with the fasteners 34 . 46 not only mechanically but also electrically connectable.

Some embodiments for the support elements 32 are based on the 10 to 13 shown schematically. 10 shows a carrier element 32 in which the light-emitting diodes 18 are arranged in a row one behind the other at a predetermined distance. At the longitudinal ends of the support element 32 are the contact surfaces 48 . 50 for connecting to the connecting element 34 respectively 46 arranged. In the present case are the contact surfaces 48 . 50 through copper surfaces of the carrier element 32 educated. You may also be printed with a solder paste to in the context of a soldering process with the fasteners 34 . 46 to be connected.

11 represents a variant of the embodiment according to 10 in which, in contrast to the carrier element 32 according to 10 at the carrier element 32 according to 11 the contact surfaces 48 . 50 between the LEDs 18 are arranged. In the present embodiment, each end is a further light-emitting diode 18 arranged. The contact surfaces 48 . 50 are thus between end-side pairs of light-emitting diodes 18 arranged.

12 shows a further embodiment of the support elements 32 , This support element differs from that previously based on 11 described carrier element in that the contact surfaces 48 . 50 are arranged immediately adjacent to each other. This allows both a positive and a negative voltage connection to both fasteners 34 . 46 will be realized. In the present case it is provided that the contact surfaces 48 and also the contact area 50 each electrically connected in parallel.

The embodiment according to 13 differs from the embodiment according to 12 in that the contact surfaces 48 . 50 only at one of the ends of the carrier element 32 are provided. In the present case, therefore, only the connecting element 34 electrically and mechanically with the carrier element 32 connected. The connecting element 46 is purely mechanical with the carrier element 32 connected.

Are the fasteners 34 . 46 between the LEDs of the carrier elements 32 positioned, can at this point a greater distance than the predetermined distance 44 between the LEDs 18 be provided.

Accordingly, the connecting elements 34 . 46 also as connection units 52 . 54 corresponding contact surfaces. This is the contact surface 52 a positive connection for the respective carrier element to be connected 32 ready, whereas the contact surface 54 provides a respective negative terminal. This is based on 3 clarified.

In 3 are the two fasteners 34 and 46 shown together. They each have a non-designated circuit board, in addition to the contact surfaces 52 . 54 that connect to the respective carrier elements 32 serve, at the same time also strip conductors 60 . 62 and 64 by means of which the contact surfaces 52 . 54 in a given interconnection with a connection area 70 are electrically connected. The connection area 70 serves a power supply unit 68 ( 2 ), which is the electrical power supply of the LEDs 18 serves. For this purpose, the electric power supply unit 68 a DC voltage ready, which is a suitable power for operating the light-emitting diodes 18 provides.

In the illustration according to 3 is through the interconnect structure a series connection of the above the connection area 70 connected support elements 32 formed, which is a series connection of the carrier elements 32 and thus all of these through these support elements 32 provided light emitting diodes 18 realized. A corresponding series connection is through the conductor track structure in the lower area below the connection area 70 realized. Due to the interconnection in the connection area 70 Then, a parallel connection of the upper region of support elements 32 with the lower portion of the support elements 32 realized. ever If necessary, this structure can be modified as desired, for example, predetermined powers at given DC voltages for the purpose of powering the light-emitting diodes 18 adapt.

From the 2 and 3 it can be seen that both the support elements 32 on the one hand and the connecting elements 34 and 46 On the other hand, they have substantially the same geometric dimensions. This makes it possible, the support elements 32 and the connecting elements 34 . 46 to standardize and in the form of multiple benefits, such as a carrier element unit or a connector unit to produce. As a result, a high degree of utilization in relation to the printed circuit board surface can be achieved. So it is possible, the corresponding multiple benefits, for example in the form of a carrier element unit, in which the carrier elements 32 along an edge in the longitudinal direction 36 connected to each other to undergo a common manufacturing process and then to separate, so that the isolated support elements 32 can form a separate module. These can then be tested separately for their function before the support elements 32 a further processing for light emitting diode array 30 be supplied. It proves particularly advantageous if a stocked multiple use, that is, the carrier element unit for the purpose of soldering the light-emitting diodes 18 on the individual support elements 32 the carrier element unit are arranged to be driven together through a soldering oven.

Accordingly, a manufacturing process for the fasteners 34 . 46 be provided. Thus, it is possible to provide a fastener unit which is either only fasteners 34 or only fasteners 46 includes. In addition, of course, can also be provided that the fasteners 34 and the connecting elements 46 be produced in the context of a common multiple use, for example, in pairs, so that when singling always an even number of fasteners is created, so always pairs of fasteners 34 . 46 can be produced.

In the present case is an assembly with light-emitting diodes 18 only for the carrier elements 32 intended. The connecting elements 34 . 46 are formed component-free in this embodiment. In alternative embodiments, however, it can also be provided that the connecting elements 34 . 46 likewise with components, in particular light-emitting diodes 18 , can be stocked. In addition to light emitting diodes, further functional components can be provided here as well.

The contact surfaces 48 . 50 . 52 . 54 are presently formed by a metallization, namely copper. They are printed with a solder paste, so the light emitting diode array 30 can be created on simple by that the support elements 32 be arranged in the desired position, and then the fasteners 34 . 46 at the ends in the longitudinal direction 36 to be ordered. The arrangement thus formed can be driven through a soldering oven to solder the electrical and the mechanical connection between the support elements 32 and the connecting elements 34 . 46 manufacture. This allows the light-emitting diode arrangement in a simple manner 30 manufacture. Alternatively, however, it can also be provided that the individual carrier elements 32 arranged in a frame and with light-emitting diodes 18 be fitted. Then the two fasteners 34 . 46 added and the resulting structure performed by a reflow soldering to the light emitting diode array 30 to build.

Out 2 It can also be seen that the light-emitting diode arrangement 30 a power supply unit 68 having. The power supply unit 68 is about the fasteners 34 . 46 as well as the electrical lines 60 . 62 . 64 . 66 to the LEDs 18 connected so that they can be supplied with electrical energy to emit light in the desired manner.

The power supply unit 68 has a strip-shaped carrier plate 72 on, which in the present case is also designed as a printed circuit board. The carrier plate 72 points in a longitudinal direction 36 a larger dimension than in a transverse direction 38 on. Furthermore, the extension of the carrier plate corresponds 72 in the longitudinal direction 36 the extension of the support elements 32 in the longitudinal direction 36 , Out 2 It can also be seen that the carrier plate 72 with the fasteners 34 . 46 is connected, in such a way that it between two immediately adjacent arranged carrier elements 32 is arranged ( 2 ). This makes it possible in a simple manner, the power supply for the LEDs 18 in the light emitting diode array 30 to integrate. Because of the carrier plate 72 with the power supply unit 68 between the carrier elements 32 is arranged, the light emission of the light-emitting diodes 18 essentially not affected.

In the present embodiment, it is provided that the dimension of the carrier plate 72 in the transverse direction 38 less than the distance 44 , This can be achieved that a certain distance of the support plate 72 to the immediately adjacent support elements 32 is made. This is advantageous because the power supply unit 68 As a rule, an electrical voltage is applied which is higher than a low voltage and thus higher demands are placed on the electrical safety. In contrast, the support elements 32 be formed so that they are acted upon only with a low voltage, resulting in advantages in terms of electrical safety.

An individual representation of the energy supply unit 68 in a schematic side view shows 5 , It can be seen that the carrier plate 72 two electrical contacts at one of its two longitudinal ends 94 wears in the 2 illustrated, connected state the connection area 70 of the connecting element 34 contact the connected light emitting diodes 18 to apply electrical energy. 6 shows the power supply unit 68 in a schematic perspective view.

From the 5 and 6 It can also be seen that an insulation element 78 is provided, which is the carrier plate 72 at least partially surrounds. The isolation element 78 is presently formed by a film which is formed from an electrically insulating material, for example PE or the like. At its ends, the insulating element 78 each fastening elements 96 on, in unnamed openings of the support plate 72 with the carrier plate 72 Can be locked to the insulation element 78 with the carrier plate 72 connect to.

Preferably, the isolation element detects 78 also components that are on the carrier plate 72 are arranged so that an electrical insulation with respect to the immediately adjacent support elements 32 can be achieved. 4 shows the overall structure according to 2 in a schematic side view. The isolation element 78 In the present case, at least one electrical insulation is provided with respect to the housing of the surface light.

Out 4 It can also be seen that the connecting elements 34 . 46 two each, in the longitudinal and the transverse direction 40 . 42 extending surfaces 74 . 76 and the carrier elements 32 with one of the surfaces 76 and the carrier plate 72 with the other of the surfaces 74 connected is. This allows a vertical distance between the carrier plate 72 and the carrier elements 32 due to a thickness of the connecting elements 34 . 46 can be achieved, whereby requirements for creepage distances and clearances can be realized in a simplified manner.

Out 4 It can also be seen that the light-emitting diode arrangement 30 by means of screws 98 can be attached to a housing, not shown, a surface light. For this purpose, the support elements 32 fixing recesses 92 on ( 2 ), which in the present case are formed by drilled holes at the edge. In this way, with the support elements 32 at the same time a good mounting option of the light emitting diode array 30 provided.

With the invention it is thus possible to have a modular design for the light-emitting diode arrangement 30 to reach. In this case, individual light-emitting diode strips in the form of the carrier elements 32 , which can be assembled in high packing density on a board material and then separated, can be used. Preferably, a width of these light-emitting diode strips is a dimension in the transverse direction 38 , reduced to an absolute minimum, which in particular by the size of the LEDs 18 , the minimum area required for their cooling and any necessary creepage distances to the board edge due to electrical safety requirements.

For the purpose of mounting the light-emitting diode strip or carrier elements 32 are the fasteners 34 . 46 provided as a fastening strip, by means of which the light-emitting diode strip or carrier elements 32 can be connected mechanically and electrically.

It proves particularly advantageous that in the light emitting diode array 30 also a power supply unit 68 can be integrated, the components also on a narrow strip, namely the support plate 72 , and then mounted between the light emitting diode strips, namely the carrier elements 32 , can be mechanically and electrically connected to the fastening strips.

The connecting elements 34 . 46 preferably have required conductor tracks to the power supply unit 68 with the carrier elements 32 electrically connect with each other. In 2 Although a rectangular, planar shape of the light emitting diode array 30 illustrated, however, other contours can be realized, for example, a round or an oval contour of the light emitting diode array. These can also be realized in a modular manner according to the invention. For example, curved connecting elements and / or carrier elements with different lengths can be provided for this purpose.

The basic structure according to the invention allows a high degree of flexibility in the formation of light-emitting diode arrangements, because the number of light-emitting diode strips or carrier elements 32 as well as the number of LEDs 18 on a respective support element 32 are arranged, as well as the positioning of one the multiple power supply units 68 are almost freely selectable. As a result, a modular system can be realized with the modular components, the most diverse light-emitting diode arrays can be produced.

Due to the in 4 shown construction of the light emitting diode array 30 can be achieved that the underside of the support elements 32 according to a thickness of the carrier elements 32 and the connecting elements 34 . 46 above the housing of the surface light, which provides sufficient space for SMD components and protruding wires of the power supply unit 68 can be made available. This space can be for insulation, for example by means of the insulation element 78 be used to ensure adequate electrical insulation between the components of the power supply unit 68 and the other components of the light emitting diode array 30 to realize.

Of course, the structure, as in 4 are also varied, for example, to meet other requirements, for example by both the support elements 32 as well as the carrier plate 72 only on one of the surfaces of the fasteners 34 . 46 are arranged. In order to reduce shadows on a surface of the surface light, it is advantageous to the support plate 72 so between the support elements 32 arrange that between the carrier plate 72 and an outer contour or at least one support element 32 is arranged to minimize the effect of shadow artifacts. Preferably, the power supply unit 68 centrally in the light-emitting diode arrangement 30 arranged.

To the connection between the support elements 32 and the connecting elements 34 . 46 To be able to train, it can be provided that the carrier elements 32 with the fasteners 34 . 46 be glued. For this purpose is at the contact surfaces 48 . 50 preferably applied an electrically conductive adhesive. After positioning the support elements 32 and the connecting elements 34 . 46 The adhesive can be cured. In addition, an ordinary adhesive may also be provided in order to further strengthen the mechanical connection. It proves to be particularly advantageous if the contact surfaces for the mechanical adhesive on the carrier elements 32 and the connecting elements 34 . 46 have a suitable structuring of the copper surfaces in the sense of a "confidence", as for example in 8th is shown. With 84 there is a contact pad shown, which is printed with an electrically conductive adhesive. The contact pad 84 used to make an electrical connection. Longitudinal 36 is on both sides of the contact pad 84 each a metallization structure 82 out in the transverse direction 38 arranged strips provided. On this strip, the mechanical adhesive is preferably applied in addition.

Alternatively, there is the possibility of soldering the light-emitting diode strip or carrier elements 32 with the fastening strips or connecting elements 34 . 46 , For this purpose, the circuit boards, which are the support elements 32 and the connecting elements 34 . 46 provide, laminated on both sides with copper. At the positions where the support elements 32 at the connecting elements 34 . 46 to be attached, is a sectional area of the support elements 32 also coated with copper ( 9 ). Because the fasteners 34 . 46 over the support elements 32 lie ( 4 ), a connection can be made by soldering. In contrast, in an alternative embodiment, the connecting elements 34 . 46 only one side, that is, on a top, laminated with copper, can have a hole in the copper surface at the positions where the fasteners 34 . 46 on the support elements 32 should be provided. The carrier elements 32 also have a hole under the copper surface. By a soldering process with sufficient solder, a connection between the connecting elements 34 . 46 and the carrier elements 32 in and around the hole.

A hole depth is bridged by the solder. Of course, this method can also be applied such that the carrier elements 32 on the connecting elements 34 . 46 and have the appropriate holes.

According to a further embodiment it can be provided that the carrier elements 32 with the fastening elements or connecting elements 34 . 46 soldered at the same time. The carrier elements 32 For this purpose have at their ends solder pads, which are coated with solder paste. In addition, all pads for components are also coated with solder paste and the components populated. Subsequently, the so coated and equipped carrier elements 32 mechanically positioned in their final desired arrangement, the fasteners 34 . 46 on the support elements 32 and optionally the carrier plate 72 put on and soldered the thus prepared overall arrangement in a single reflow soldering process. As a result, both an electrical and a mechanical connection is produced, in a single process step.

In an alternative embodiment, it may further be provided that the connection between the carrier elements 32 and the connecting elements 34 . 46 by means of connectors will be produced. For this purpose it can be provided that each of the support elements 32 equipped with two contact pins and on the connecting elements 34 . 46 corresponding contact sleeves are provided. The connection can then be made by simply plugging together. The corresponding contact pins and contact sleeves can previously on the respective elements 32 . 34 . 46 be equipped.

14 shows a second embodiment of the light emitting diode array 30 in a schematic view. The light-emitting diode arrangement 30 here has a first light-emitting diode block 102 , the three carrier elements 32 Includes, with two fasteners 34 . 46 are connected, a second light-emitting diode block 102 , which also has three support elements 32 Includes, with two fasteners 34 . 46 are connected, and a connection element 100 on. The connecting elements 34 . 46 of the first light-emitting diode block 102 are with the fasteners 34 . 46 of the second light-emitting diode block 102 by means of the connection element 100 connected. This allows the light emitting diode blocks in 14 cascaded to form the light emitting diode array 30 get connected. Out 14 It can also be seen that the carrier plate 72 the connection elements 100 can include and provide integrally. The compound is in the present case formed both mechanically and electrically.

15 schematically shows an enlarged view of a region XV in 14 , In the area of the connection of the connecting elements 34 by means of the connection element 100 the carrier plate 72 has the carrier plate 72 an approximately rectangular opening 108 on, making webs 106 are formed. At their opposite ends, the connecting elements 34 two each in their transverse direction 42 adjacently arranged contact surfaces 104 on. The bridges 106 are positioned so that they are on the contact surfaces 104 both fasteners 34 rest. Furthermore, at edges of the webs 106 recesses 110 formed, which are provided with a metallization. By a soldering process, the webs 106 with the contact surfaces 104 connected. This allows a particularly stable connection of the carrier plate 72 with the fasteners 34 as well as the connecting elements 34 be reached each other. Alternatively, of course, it can also be provided that gluing is used instead of soldering or in addition thereto.

The connection element 100 serves in particular, in addition to a mechanical connection and an electrical connection of the connecting elements 34 . 46 train with each other. Although a cascading of the LED blocks is present in the longitudinal direction 40 the connecting elements 34 . 46 described. Alternatively or additionally, however, can also be a compound in the transverse direction 42 be provided.

The embodiments are only illustrative of the invention and are not limiting for these. Thus, of course, functions, the structure of the light-emitting diode arrangement as well as the choice of materials for the support elements, the support plate and the connecting elements and other features can be designed arbitrarily, without departing from the spirit of the invention. In addition, the invention can of course be provided not only for surface lighting modules, which are used for building lighting, but it can also be provided for lights that are used in an outdoor area, in particular for illuminating a walkway, a street, a workspace and / or the like can. The surface light according to the invention can thus also be an outdoor lamp, a street lamp and / or the like.

Finally, it should be noted that the advantages stated for the light-emitting diode arrangement according to the invention can be achieved equally for the surface light according to the invention and the method for the production thereof. In addition, corresponding device features and vice versa may be provided for device features.

LIST OF REFERENCE NUMBERS

10

 LED array

12

 web

14

 connecting portion

16

 circuit board

18

 led

20

 area

24

 mounting holes

30

 LED array

32

 support element

34

 connecting element

36

 longitudinal direction

38

 transversely

40

 longitudinal direction

42

 transversely

44

 distance

46

 connecting element

48

 contact area

50

 contact area

52

 connecting unit

54

 contact area

60

 conductor path

62

 conductor path

64

 conductor path

66

 Conductor structure

68

 Power supply unit

70

 terminal area

72

 support plate

74

 surfaces

76

 surface

78

 insulation element

82

 metallization

84

 Contact pad

92

 fixing recesses

94

 contacts

96

 fasteners

98

 screw

100

 connecting element

102

 LEDs block

104

 contact surfaces

106

 Stege

108

 opening

110

 recesses

Claims (17)

Light-emitting diode arrangement ( 30 ) for a surface lamp comprising: - at least two strip-shaped carrier elements ( 32 ), wherein each of the carrier elements ( 32 ) in a longitudinal direction ( 36 ) a larger dimension than in a transverse direction ( 38 ), and - a plurality of light-emitting diodes ( 18 ), which in the longitudinal direction ( 36 ) on the carrier elements ( 32 ) are arranged, characterized by - at least one designed as a separate component strip-shaped connecting element ( 34 . 46 ), which in a longitudinal direction ( 40 ) a larger dimension than in a transverse direction ( 42 ) and with the carrier elements ( 32 ) is connected such that the connecting element ( 34 . 46 ) with its longitudinal direction ( 40 ) transverse to the longitudinal direction ( 36 ) of the carrier elements ( 32 ) is positioned and the carrier elements ( 32 ) in the transverse direction ( 38 ) are spaced from each other. Light-emitting diode arrangement according to claim 1, characterized in that a distance ( 44 ) between two immediately adjacent support elements ( 32 ) greater than the extension of the support elements ( 32 ) in the transverse direction ( 38 ). Light-emitting diode arrangement according to claim 1 or 2, characterized in that the extension of the carrier elements ( 32 ) in the transverse direction ( 38 ) of a dimension of the on the support elements ( 32 ) arranged light emitting diodes ( 18 ) in the transverse direction ( 38 ) is formed dependent. Light-emitting diode arrangement according to one of Claims 1 to 3, characterized by two connecting elements ( 34 . 46 ), wherein the carrier elements ( 32 ) at their ends in the longitudinal direction ( 36 ) each with one of the connecting elements ( 34 . 46 ) are connected. Light-emitting diode arrangement according to one of Claims 1 to 4, characterized in that both the carrier elements ( 32 ) as well as the at least one connecting element ( 34 . 46 ) for mutually connecting at least one connecting unit ( 48 . 50 . 52 . 54 ) exhibit. Light-emitting diode arrangement according to claim 5, characterized in that the connection unit ( 48 . 50 . 52 . 54 ) has a metallization for electrical and mechanical bonding. Light-emitting diode arrangement according to one of Claims 1 to 6, characterized in that the carrier elements ( 32 ) and / or the at least one connecting element ( 34 . 46 ) an electrical line ( 60 . 62 . 64 . 66 ) for connecting the light emitting diodes ( 18 ) to a power supply unit ( 68 ) exhibit. Light-emitting diode arrangement according to one of Claims 1 to 7, characterized by the energy supply unit ( 68 ), the at least one strip-shaped carrier plate ( 72 ), which in a longitudinal direction ( 36 ) a larger dimension than in a transverse direction ( 38 ), wherein the carrier plate ( 72 ) with the at least one connecting element ( 34 . 46 ) is connected in such a way that it is connected between two of the carrier elements ( 32 ) is arranged. Light-emitting diode arrangement according to claim 8, characterized in that the at least one connecting element ( 34 . 46 ) a first and a second in the longitudinal and the transverse direction ( 40 . 42 ) extending, opposite surface ( 74 . 76 ) and the carrier elements ( 32 ) with the first surface ( 76 ) and the carrier plate ( 72 ) with the second surface ( 74 ) are connected. Light-emitting diode arrangement according to one of claims 7 to 9, characterized in that the power supply unit ( 68 ) an electrical insulation element ( 78 ) having. Light-emitting diode arrangement according to one of Claims 1 to 10, characterized by a first light-emitting diode block ( 102 ), the at least two support elements ( 32 ) provided with at least one connecting element ( 34 . 46 ), a second light emitting diode block ( 102 ), which also has at least two support elements ( 32 ) provided with at least one connecting element ( 34 . 46 ), and a connection element ( 100 ), wherein the at least one connecting element ( 34 . 46 ) of the first light-emitting diode block ( 102 ) with the at least one connecting element ( 34 . 46 ) of the second light-emitting diode block ( 102 ) by means of the connecting element ( 100 ) connected is. Light-emitting diode arrangement according to claim 11, characterized in that the connection element ( 100 ) through the carrier plate ( 72 ) is formed. Light-emitting diode arrangement according to claim 11 or 12, characterized in that the connection element ( 100 ) by a solder joint with opposite ends of the connecting elements ( 34 . 46 ) of the first and the second light-emitting diode block ( 102 ), for what purpose are the fasteners ( 34 . 46 ) in the region of their ends in each case at least one metallization ( 104 ) and the connecting element ( 100 ) two mechanically interconnected webs ( 106 ) each also having a metallization, wherein each one of the webs ( 106 ) on each one of the at least one metallization ( 104 ) of the connecting elements ( 34 . 46 ) of the first and the second light-emitting diode block ( 102 ) is arranged and connected to this. Flächenleute with a light exit opening having a housing, characterized in that in the housing a light emitting diode array ( 30 ) is arranged according to one of the preceding claims. Flächenleute according to claim 14, characterized in that the light exit opening has a matte lens and a distance from light emitting diodes ( 18 ) of the light-emitting diode arrangement ( 30 ) to the lens is greater than a distance from immediately adjacent to each other arranged light emitting diodes ( 18 ). Method for producing a light-emitting diode arrangement ( 30 ), comprising the steps of: - producing a carrier element unit which has a plurality of interconnected strip-shaped carrier elements ( 32 ), wherein each of the carrier elements ( 32 ) in a longitudinal direction ( 36 ) a larger dimension than in a transverse direction ( 38 ), - separating the carrier elements ( 32 ) of the carrier element unit, - producing a connection element unit which has a plurality of interconnected strip-shaped connection elements ( 34 . 46 ) arranged in a longitudinal direction ( 40 ) a larger dimension than in a transverse direction ( 42 ), - separating the connecting elements ( 34 . 46 ) of the connecting element unit, - arranging the carrier elements ( 32 ) such that the carrier elements ( 32 ) in the transverse direction ( 38 ) from each other at a predetermined distance ( 44 ), - equipping the carrier elements ( 32 ) with light-emitting diodes ( 18 ), - arranging at least one of the connecting elements ( 34 . 46 ) such that the at least one of the connecting elements ( 34 . 46 ) with its longitudinal direction ( 40 ) transverse to the longitudinal direction ( 36 ) of the carrier elements ( 32 ), - connecting the light-emitting diodes ( 18 ) with the carrier elements ( 32 ), and - connecting the carrier elements ( 32 ) with the at least one connecting element ( 34 . 46 ). A method according to claim 16, characterized by the steps: - producing a carrier plate unit with interconnected strip-shaped carrier plates ( 72 ), each of the support plates ( 72 ) in a longitudinal direction ( 36 ) a larger dimension than in a transverse direction ( 38 ), - equipping the carrier plate unit with components of power supply units ( 68 ), each of the support plates ( 72 ) the components of a power supply unit ( 68 ), - separating the carrier plates ( 72 ) of the carrier plate unit and - connecting at least one of the carrier plates ( 72 ) with the at least one connecting element ( 34 . 46 ) such that it is arranged between two directly adjacent support elements ( 32 ) is arranged.

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