DE102015217227B4 - Cutting station, installation and method for manufacturing wafer products - Google Patents

Abstract

Cutting station (1), system and method for severing the lateral edge (3) of the wafer blocks (2) running parallel to the cutting direction and, if necessary, for dividing the wafer blocks (2), comprising at least one cutting body (7) arranged in a cutting area (6) ), which protrudes beyond the conveying surface (5) by at least the thickness (8) of the wafer block (2), a sliding device (11) which is arranged movably along the cutting direction (9) and is driven by a drive (10) for pushing through individual wafer blocks (2) or individual wafer block stack through the cutting area (6), which is designed such that the sliding device (11) comprises a first sliding body (12) and a second sliding body (13), the first sliding body (12) and the second sliding body (13) are arranged movably along or in the direction of the cutting direction (9) via at least one drive (10, 19, 20), and wherein the second sliding body (13) relative to the first sliding body rper (12) is arranged to be movable via at least one drive (10, 20).

Description

The invention relates to a cutting station, a system for producing end products by cutting flat wafer blocks and a method for cutting wafer blocks and in particular for separating the lateral edge of the wafer blocks running parallel to the cutting direction.

Intermediate products for the production of baked products, which preferably have multiple layers of wafer on top of one another, are referred to as wafer blocks. These wafer layers are crispy, brittle and / or thin-walled wafer layers, which are baked under increased pressure in a baking machine with circumferentially arranged, lockable baking tongs. Then the individual wafer sheets are coated or filled with a compound such as a cream and placed on top of each other in several layers. The wafer blocks produced in this way have, for example, a size of approximately 40 × 80 cm, in particular 35 × 73 cm, and a thickness of approximately 7 mm to 3 cm. The products to be made from it are known, among other things, under the designation wafer slices and mostly have the shape of a bite-sized cuboid. To make these products, the edge of the wafer blocks must be cut or trimmed so that the outer edges of the wafer block have a desired smooth shape. The wafer blocks produced as an intermediate product do not have a homogeneous edge area, since on the one hand the wafer sheets cannot be evenly smeared with the cream up to the edge and on the other hand the edge of the wafer sheets cannot be given an exactly predeterminable shape during the baking process.
Furthermore, the relatively large wafer blocks have to be cut up in order to form cuboid, bite-sized or edible end products. If necessary, the wafer blocks are cut into prism-shaped end products, which for example have a trapezoidal profile, by inclined cutting bodies. The wafer blocks are preferably divided by two essentially orthogonal cuts, so that end products with essentially right-angled base areas are produced.

According to the prior art, the wafer blocks are cut up by pushing a wafer block through a cutting frame. Cutting wires or cutting tapes are tensioned in the cutting frame. By pushing it through, the wafer block is cut through the cutting wires or cutting tapes. After being pushed through the first cutting frame, the block is pushed through a second cutting frame, the first cutting direction and the second cutting direction being at 90 ° to one another. This second cut creates the desired end products.

A disadvantage of the devices of the prior art is that when the wafer blocks are cut, wafer parts often break out in the edge area and in particular in the rear corner areas. This increases the reject rate and thus reduces the efficiency of the entire process for manufacturing the end products.

According to the prior art, the corners can be prevented from breaking out by cutting off a relatively wide edge. However, this also reduces the efficiency of the process, since the wide cut edge is also eliminated as scrap.

Thus, according to the prior art, there is a conflict of objectives in improving the efficiency, which is in particular a conflict of objectives between the separation of an edge that is as narrow as possible and the break-free separation of the edge.

From the German Offenlegungsschrift DE 100 09 672 A1 A cutting station for wafer blocks is known which has two cutting stations arranged one behind the other in a line in the feed direction of the wafer blocks, one of which is a longitudinal cutting station with stationary cutting knives arranged next to one another in the transverse direction and the other as a cross cutting station with cutting knives that are movable in the transverse direction and arranged one behind the other in the longitudinal direction is trained. The wafer block to be cut is advanced by means of a sliding device which has a slide to which a sliding arm is movably articulated. In order to push the wafer block, the push arm is arranged perpendicular to the direction of displacement of the carriage and is then in contact with the back of a wafer block. The arm can be pivoted against the sliding direction and is then arranged below a sliding plane of the wafer blocks.

From the international published application WO 98/19549 a cutting station for wafer blocks is known. In order to move the wafer blocks within the cutting station, slides are provided which engage on a rear side of the respective wafer block.

The object of the invention is now to solve this conflict of objectives.

The object on which the invention is based is achieved by a cutting station with the features of claim 1, a system with the features of Claim 14 and a method having the features of claim 19 are achieved.

In a manner surprising to the person skilled in the art, it was found that the breaking out of the corners can be prevented or at least reduced if the wafer block is supported or pushed as it is pushed through the cutting area on the rear face of the edge of the wafer block. The rear end face of the wafer block is that side of the wafer block that is at the rear in the cutting direction, that is, the side on which a sliding body engages in order to push the wafer block into or through the cutting area.
The rear end face of the edge of the wafer block is that area of the wafer block which lies on the rear end face of the wafer block, specifically in the area of the edge which is to be cut off by the cutter or cutters. Thus, the device according to the invention supports the wafer block in the region of the rear face of the edge to be cut off during the cutting process.

In order, according to the invention, to keep the edge to be cut off as narrow as possible, the cutting bodies, in particular the outer cutting bodies for severing the edge, are arranged as far outside as possible.

Since the sliding body must push the wafer block through the cutting area, a clearance must be provided in the sliding body for each cutting body so that the sliding body does not collide with the cutting body (s) when the wafer block is pushed through the cutting area. In the narrow edge area, however, this means that the distance between the side edge of the sliding body and the first clearance for the cutting body for separating the edge corresponds at most to the width of the edge. This edge width is 3 mm, for example. After deducting the tolerance of the play-prone guidance of the sliding body, only a thin web remains as a lateral section of the sliding body, which is not suitable for providing sufficient support for the rear face of the edge.

The object of the invention is therefore achieved in particular in that the sliding device comprises a first sliding body and a second sliding body, that the first sliding body and the second sliding body are arranged to be movable or moved via a drive, possibly via several drives, along or in the direction of the cutting direction, and that the second sliding body is arranged to be movable relative to the first sliding body via at least one drive.

The invention relates in particular to a cutting station for wafer blocks for separating the lateral edge of the wafer blocks running parallel to the cutting direction and, if necessary, for dividing the wafer blocks, comprising a machine frame with a conveyor surface along which the wafer blocks are transported, at least one cutting body arranged in a cutting area, which the Conveying surface protrudes at least by the thickness of the wafer block, a sliding device arranged movably along the cutting direction and driven by a drive for pushing individual wafer blocks or individual wafer block stacks through the cutting area, which is designed such that the wafer block or the wafer block stack is severed from the cutting body along the cutting direction and is cut to size in particular in the edge region, the sliding device comprising a first sliding body and a second sliding body, the first sliding body and de r second sliding body are arranged movable along or in the direction of the cutting direction via at least one drive, and that the second sliding body is arranged movable relative to the first sliding body via at least one drive.

If necessary, it is provided that the second sliding body has a clearance which is designed such that part of the second sliding body, preferably at least the front edge of the second sliding body, can be moved past the cutting body through the cutting area, so that a wafer block from the second sliding body can be pushed entirely through the cutting area, and that the clearance, in particular limited by the side edge of the second sliding body, is arranged laterally outside the second sliding body, or extends as a slot-shaped incision into the second sliding body.
If necessary, it is provided that the clearance extends essentially from the front edge of the second sliding body along the cutting direction to the rear, in particular against the cutting direction.
If necessary, it is provided that the first sliding body for pushing the wafer block into the cutting area extends laterally up to and into the area of the edge of the wafer block to be separated and in particular engages the rear face of the edge in order to push the wafer block into the cutting area.

According to the invention, it is provided that the second sliding body can be brought into a sliding position with respect to the first sliding body by at least one drive, in which the second sliding body and the first sliding body together engage the rear face of the wafer block in order to push the wafer block into the cutting area.

If necessary, it is provided that the second sliding body can be brought into a sliding position with respect to the first sliding body by at least one drive, in which the second sliding body protrudes beyond the first sliding body in the cutting direction and in which the cutting body is in the free position of the second sliding body, so that the second Sliding body protrudes beyond the cutting area in the cutting direction and the wafer block is pushed entirely through the cutting area and possibly beyond the cutting area.
If necessary, provision is made for at least one laterally arranged edge waste guide means to be provided after the cutting area in the cutting direction, or for two edge waste guide means to be provided on both sides in the cutting direction after the cutting area, the edge waste guide means extending away from the conveying surface so that the separated edge of the wafer blocks from the conveying surface is transported away.
If necessary, it is provided that the first sliding body is stopped in the sliding position in the cutting direction in front of the edge waste guide means and, if necessary, withdrawn.
If necessary, it is provided that a first drive is provided for driving the first sliding body, that a second drive is provided for moving the second sliding body and that the second sliding body can be extended beyond the first sliding body via the second drive.
If necessary, it is provided that the cutting body is rigidly connected to the machine frame and that the advance for cutting the wafer block takes place through the movement or the advance of the wafer block through the pushing device
It is optionally provided that the cutting body is a cutting wire clamped in a cutting frame or a cutting tape clamped in a cutting frame.

If necessary, provision is made for two cutting bodies to be provided, one cutting body being arranged in the left edge area and one cutting body in the right edge area, so that when the wafer block is pushed through the cutting area, the left and right edges of the wafer block are cut off at the same time.

If necessary, it is provided that three or more cutting bodies are provided, with one cutting body being arranged in the left edge area and one cutting body in the right edge area and that at least one cutting body is arranged between the cutting body in the left edge area and the cutting body in the right edge area, so that when the Wafer blocks are cut by the cutting area at the same time the left and the right edge of the wafer block and at the same time the wafer block in the middle area, between the two edges, is cut.

If necessary, it is provided that a first guide surface and a second guide surface are provided, that the two guide surfaces protrude from the conveyor surface and run essentially along the cutting direction, and that the guide surfaces are spaced apart from one another which is essentially the width of the wafer block arranged between the guide surfaces so that the wafer block is guided to the side when cutting.

The invention optionally relates to a system for producing end products by cutting flat wafer blocks, in particular flat or hollow wafer blocks, an input station for the blocks, at least one cutting station for cutting the blocks and an output station for the end products being provided in the system.

If necessary, it is provided that a first conveying direction is provided in the input station, along which the wafer blocks are fed to the first cutting station and that the cutting direction deviates from the first conveying direction, runs transversely to the conveying direction and / or runs normal to the conveying direction, or that the cutting direction is included corresponds to the first conveying direction.
If necessary, it is provided that a second cutting station is provided with a second cutting direction, and that the second cutting direction deviates from the first cutting direction and in particular runs transversely or normal to the first cutting direction.
If necessary, it is provided that the second cutting station comprises at least one second cutting body, preferably several second cutting bodies and a second pushing device, so that the wafer block previously cut and possibly cut in the first cutting station is cut one more time by being pushed through the second cutting area.
If necessary, it is provided that the system can be brought into a position via the drives of the sliding devices or has a first position in which the sliding device of the first cutting station, in particular its second sliding body, protrudes over the first cutting area and in which the second sliding device is in a retracted position Position is so that the wafer block is pushed from the first pushing device into the second cutting station.

• Zuführen eines Waffelblocks entlang einer ersten Förderrichtung in die erste Schneidestation,
• Bewegen der Schiebevorrichtung in Schneidrichtung, sodass der Waffelblock in und durch den Schneidbereich befördert wird,
• Anhalten des ersten Schiebekörpers vor dem Randabfallleitmittel, Weiterbewegen des zweiten Schiebekörpers in Schneidrichtung, sodass der zweite Schiebekörper den ersten Schiebekörper in Schneidrichtung überragt und der Waffelblock in Schneidrichtung weiterbefördert wird.

Gegebenenfalls ist vorgesehen, dass beim Durchschieben des Waffelblocks die in Schneidrichtung seitlichen Ränder des Waffelblocks durch zwei seitlich angeordnete Schneidkörper abgeschnitten werden.
Gegebenenfalls ist vorgesehen, dass beim Durchschieben des Waffelblocks der Waffelblock durch einen Schneidkörper entfernt vom Rand im Mittenbereich entlang der Schneidrichtung durchtrennt wird.
Gegebenenfalls ist vorgesehen, dadurch gekennzeichnet, dass der in der ersten Schneidstation gegebenenfalls in mehrere Teile zerschnittene Waffelblock in die zweite Schneidstation befördert wird und dort entlang einer zweiten Schneidrichtung zerschnitten wird, wobei die zweite Schneidrichtung von der ersten Schneidrichtung abweicht, quer zur ersten Schneidrichtung verläuft und/oder normal zur ersten Schneidrichtung verläuft.
Gegebenenfalls ist vorgesehen, dass der in der ersten Schneidstation gegebenenfalls in mehrere Teile zerschnittene Waffelblock von dem zweiten Schiebekörper in die zweite Schneidstation befördert wird und dort entlang einer zweiten Schneidrichtung zerschnitten wird, wobei die zweite Schneidrichtung von der ersten Schneidrichtung abweicht, quer zur ersten Schneidrichtung verläuft und/oder normal zur ersten Schneidrichtung verläuft.
Gegebenenfalls ist vorgesehen, dass beim Zerschneiden des Waffelblocks die in der zweiten Schneidrichtung seitlich liegenden Ränder des Waffelblocks durch zwei seitlich angeordnete Schneidkörper der zweiten Schneidstation abgeschnitten werden. Gegebenenfalls ist vorgesehen, dass beim Zerschneiden des Waffelblocks in der zweiten Schneidstation der Waffelblock durch einen Schneidkörper entfernt vom Rand entlang der zweiten Schneidrichtung durchtrennt wird.
Gegebenenfalls ist vorgesehen, dass in der ersten Schneidstation ein Waffelblock einzeln durch den Schneidbereich der ersten Schneidstation vollständig durchgeschoben und gegebenenfalls in die zweite Schneidstation gefördert wird, oder dass in der ersten Schneidstation ein Waffelblockstapel einzeln durch den Schneidbereich der ersten Schneidstation vollständig durchgeschoben und gegebenenfalls in die zweite Schneidstation gefördert wird.
Gegebenenfalls ist vorgesehen, dass die erste Schneidrichtung von der ersten Förderrichtung abweicht und insbesondere quer zur ersten Förderrichtung verläuft, oder dass die erste Schneidrichtung mit der ersten Förderrichtung übereinstimmt.The invention optionally relates to a method for cutting up flat wafer blocks, in particular flat or hollow wafer blocks, optionally for the formation of end products, comprising the following steps:

• Feeding a wafer block along a first conveying direction into the first cutting station,
• Moving the pusher in the cutting direction so that the wafer block is conveyed into and through the cutting area,
• Stopping the first sliding body in front of the edge waste guide means, moving the second sliding body in the cutting direction so that the second sliding body protrudes beyond the first sliding body in the cutting direction and the wafer block is conveyed further in the cutting direction.

If necessary, it is provided that when the wafer block is pushed through, the edges of the wafer block which are lateral in the cutting direction are cut off by two laterally arranged cutting bodies.
If necessary, it is provided that when the wafer block is pushed through, the wafer block is severed by a cutting body away from the edge in the central area along the cutting direction.
If necessary, it is provided that the wafer block, possibly cut into several parts in the first cutting station, is conveyed to the second cutting station and is cut there along a second cutting direction, the second cutting direction deviating from the first cutting direction, running transversely to the first cutting direction and / or runs normal to the first cutting direction.
If necessary, it is provided that the wafer block, possibly cut into several parts in the first cutting station, is conveyed by the second sliding body to the second cutting station and is cut there along a second cutting direction, the second cutting direction deviating from the first cutting direction, running transversely to the first cutting direction and / or runs normal to the first cutting direction.
If necessary, it is provided that when the wafer block is cut, the edges of the wafer block lying laterally in the second cutting direction are cut off by two laterally arranged cutting bodies of the second cutting station. If necessary, it is provided that when the wafer block is cut up in the second cutting station, the wafer block is severed by a cutting body away from the edge along the second cutting direction.
If necessary, it is provided that in the first cutting station a wafer block is pushed completely through the cutting area of the first cutting station and, if necessary, conveyed into the second cutting station, or that in the first cutting station a stack of wafer blocks is pushed completely individually through the cutting area of the first cutting station and, if necessary, into the second cutting station is promoted.
It is optionally provided that the first cutting direction deviates from the first conveying direction and in particular runs transversely to the first conveying direction, or that the first cutting direction coincides with the first conveying direction.

It is optionally provided that the first cutting direction deviates from the second cutting direction and, in particular, that the first cutting direction and the second cutting direction run normal to one another.

The cutting station according to the invention, the system according to the invention and the method according to the invention are set up and / or suitable for the industrial production of baked products. The cutting stations preferably have a throughput of more than 10, possibly up to 14, wafer blocks per minute. The system preferably has an elongated machine frame, which is arranged “in-line” in an industrial production line essentially along the production direction of a baking system, a sandwich-forming station, a stacking station and coating devices connected in between.

The wafer blocks are preferably introduced into the first cutting station and cut up individually or stacked one on top of the other. The cutting in the second cutting station can extend to several wafer blocks per cutting stroke. Preferably, two wafer blocks per cutting stroke are at least partially cut in the second cutting station, so that the cut per cutting stroke passes through an interface between two wafer blocks arranged one behind the other. In the second cutting station, a wafer block is pushed through the cutting area through the following wafer block.

When cutting up the wafer blocks, especially in the first cutting station, it is important to ensure that the individual parts are not separated from one another after the cutting process, but are pressed against one another or are conveyed or transported in block form lying against one another. Otherwise, no exact cuts could be made in the second cutting station or the transfer to a downstream packaging machine could not be made in the desired order.

To achieve the object according to the invention, it is proposed that there are two sliding bodies, the second sliding body being designed to be extendable with respect to the first sliding body.

The first sliding body extends laterally up to or in the area of the rear face of the edge and supports the wafer block in this area. To cut off the edge, the wafer block is pushed at least partially through the cutting area, in particular by the first sliding body. The lateral edges of the wafer block are cut off and preferably transported away by edge waste guide means arranged behind the cutting area. Just before the edge waste guide means, in particular just after the cutting area or just after the cutting body, the first sliding body is stopped in order to prevent the first sliding body from colliding with the edge waste guide means. The second sliding body has clearances which are arranged essentially in the region of the cutting bodies and extend into the sliding body in the manner of a groove or section along the cutting direction. As a result of these clearances, the second sliding body can be moved at least partially through the cutting area without a collision between the second sliding body and the cutting bodies and possibly the edge waste guide means occurring. As a result of this extendibility, the wafer block can be supported along its entire rear face or along the rear face of the rim until immediately in front of the edge waste guide means, in order in particular to prevent the rear edges from breaking out. The first sliding body only stops when the wafer block has been pushed through completely or is transported further, and the second sliding body takes over the further transport.

The second sliding body has, in particular, a lateral clearance for that cutting body which is set up to cut off or trim the edge of the wafer block. The side edge of the second sliding body is preferably formed by this exemption. The first sliding body is, for example, designed to be narrow or web-shaped and has a lateral extent which corresponds approximately to the width of the edge or the edge to be cut off. If necessary, a gap is provided between the lateral edge of the second sliding body and the first sliding body, which preferably extends similarly or identically to the clearances along the cutting direction from the front edge of the sliding body to the rear, so that when the sliding body is partially pushed through the cutting area, the sliding body does not collide with the cutting body.

If necessary, the second sliding body is arranged or supported on the first sliding body. If necessary, the first sliding body comprises only lateral, narrow extensions which have a lateral width which corresponds approximately to the width of the edge. If necessary, the first sliding body and the second sliding body together form a sliding body which supports the wafer block essentially along its entire rear face. If necessary, the first sliding body and the second sliding body together form a sliding body which sufficiently supports the wafer block along its end face so that there is no reduction in the efficiency of the manufacturing process.

The second sliding body is preferably designed and / or arranged in such a way that the wafer block can be moved through the cutting area and into the second cutting station. For this purpose, the clearances in the second sliding body are designed such that the wafer block can be pushed completely through the cutting area and, if necessary, the wafer block can be conveyed further into an area spaced apart from the cutting area. This area, which is arranged at a distance from the cutting area, is located, for example, in the second cutting station.

• 1 zeigt eine Schrägansicht einer erfindungsgemäßen Anlage umfassend eine erfindungsgemäße Schneidstation.
• 2 zeigt eine Detailansicht einer Schrägansicht einer erfindungsgemäßen Anlage umfassend eine erfindungsgemäße Schneidstation.
• 3 zeigt eine detaillierte Schrägansicht einer erfindungsgemäßen Schneidstation.
• 4a zeigt eine Anordnung eines ersten Schiebekörpers mit einem zweiten Schiebekörper in einer ersten Position.
• 4b zeigt eine Anordnung eines ersten Schiebekörpers mit einem zweiten Schiebekörper in einer zweiten Position.

In the following, the invention will be further described using specific exemplary embodiments and using the figures.

• 1 shows an oblique view of a system according to the invention comprising a cutting station according to the invention.
• 2 shows a detailed view of an oblique view of a system according to the invention comprising a cutting station according to the invention.
• 3 shows a detailed oblique view of a cutting station according to the invention.
• 4a shows an arrangement of a first sliding body with a second sliding body in a first position.
• 4b shows an arrangement of a first sliding body with a second sliding body in a second position.

1 shows a plant for the production of end products by cutting up wafer blocks, the plant having an input station 22nd , a cutting station 1 for cutting up and / or cutting blocks and an output station 23 for the end products.

Via the input station 22nd the wafer blocks, coming from a system for the production of the wafer blocks, are directed towards the cutting station 1 promoted. The present embodiment includes a first cutting station 26th and a second cutting station 27 . The input station or the conveying device of the input station is designed in particular as a belt or belt conveyor. In the input station, the wafer block is moved along the first conveying direction 25th emotional. The first conveying direction preferably corresponds 25th essentially that Direction along which the wafer blocks are moved during their manufacture.

The wafer blocks are then sent individually or stacked to the first cutting station 26th to hand over. The first cutting station 26th has a cutting direction 9 along which the wafer blocks or the wafer block is cut. The cutting direction preferably runs 9 essentially normal to the first conveying direction 25th . This results in cutting across the first conveying direction 25th causes. The first cutting station comprises a pushing device 11 . This sliding device 11 comprises in this embodiment a first sliding body 12th and a second sliding body 13 . Furthermore, there is at least one drive 10 provided over which the sliding body 12th , 13 along the cutting direction 9 can be moved. The first cutting station may have, as in the present embodiment, a first drive for the first sliding body 19th on over which the first sliding body along the cutting direction 9 can be moved. The second sliding body 13 also has a drive 10 , namely the second drive 20th on, which is designed in particular as an independent drive. According to the present embodiment, this drive enables the second sliding body to be displaced relative to the first sliding body. This shift is due to the second drive 20th driven and preferably runs essentially along the cutting direction 9 . The cutting station preferably comprises a conveying surface 5 . Along this conveying surface or on this conveying surface 5 The waffle block is pushed horizontally by the sliding bodies.

The first cutting station 26th includes a cutting area 6th . In this cutting area 6th is a cutting body 7th intended. In particular, there is at least one cutting body 7th intended. At least two cutting bodies are preferred 7th provided, with a cutting body 7th to cut off the left edge and a cutter 7th is set up to cut off the right edge. According to the present embodiment, there are several, in particular four, cutting bodies 7th provided, which in addition to severing the edge also cause further cuts so that the wafer block is divided into several parts when the wafer block is completely through the cutting area 6th being pushed or transported. Each cutting body is preferably designed as a cutting wire or cutting tape. The cutting wires can be in a cutting frame 21st be provided and / or clamped. The cutting frame is preferably rigidly connected to the machine frame and optionally inclined so that the wafer block is pressed against the conveying surface during cutting. In the slide bodies, in particular in that slide body through which the wafer block is pushed through the cutting area, there are clearances 14th intended. The exemptions 14th are provided laterally in the area in which the cutting body 7th are arranged so that the cutting body 7th when pushing the wafer block through the cutting area into the clearances 14th can be introduced without a collision between the sliding body and the cutting body (s) 7 occurring. Then to the cutting area 6th are in the cutting direction 9 Edge waste guide means 32 intended. In the present embodiment, these are designed as curved metal sheets. The edge waste guide means 32 serve to derive the cut edge from that part of the wafer block that is processed into end products. In particular, the edge trash guides are 32 designed in such a way that the separated edge laterally and out of the plane of the conveying surface when the wafer block is advanced 5 is directed.

The first cutting station 26th is a second cutting station in this embodiment 27 subordinate. The second cutting station 27 can be identical to the first cutting station 26th be executed, the second cutting direction 28 the second cutting station 27 across the cutting direction 9 the first cutting station 26th runs. This allows the wafer block to be cut in two different directions, in particular to form end products.

In the present embodiment, the second cutting station 27 has a different configuration than the first cutting station 26th . The second cutting station thus comprises a second pushing device 30th , which only includes a sliding body. The second pusher 30th conveys the wafer block to be cut in a second cutting direction 28 , in particular by one with second cutting bodies 29 provided second cutting area.

At a distance, preferably substantially parallel, from the conveying surface 5 are preferably at least one, optionally two or more hold-down devices 31 intended. These are at a distance from the conveying surface so that the wafer block fits between the hold-down device and the conveying surface and is possibly guided so that the hold-down device can function as a hold-down device in the technical sense. In particular, the hold-down serves as a hold-down against the cutting forces acting on the wafer block.

In the present embodiment, the wafer blocks are not necessarily conveyed individually through the cutting area of the second cutting station. Rather, according to the present configuration, a first wafer block or a first wafer block stack is conveyed into the first cutting station. There the wafer block or the wafer block stack is pushed by the pushing device through the cutting area of the first cutting station and transported further into the second cutting station. In normal operation, at this point in time there is a preceding wafer block or wafer block stack in the second cutting station, which is partially controlled by the second cutting body 29 is incised. The preceding wafer block or wafer block stack is advanced at least so far that the following wafer block or wafer block stack can be introduced into the second cutting station. For this purpose, the second sliding device is brought into a retracted position so that there is sufficient space to pick up the subsequent wafer block or wafer block stack. If the following wafer block, which, like the previous wafer block, was cut in the first cutting station along the first cutting direction, is deposited in the second cutting station, the second pushing device is set 30th in gear and pushes the following wafer block together with the preceding wafer block at least partially through the cutting area of the second cutting station. The second pushing device pushes 30th the following wafer block to the previous wafer block. As a result, the previous wafer block is pushed completely through the cutting area of the second cutting station. The subsequent wafer block is pushed through the cutting area of the second cutting station only so far that, on the one hand, a further subsequent wafer block can be introduced into the second cutting station and, on the other hand, that the second sliding device does not interfere with the second cutting bodies 29 collides and possibly the last strip of the subsequent wafer block is at least cut. In this position, the second sliding device is pulled back again so that another subsequent wafer block can be introduced into the second cutting station.

In contrast to the first cutting station, in which the wafer blocks or wafer block stacks are individually cut, in the second cutting station two wafer blocks or wafer block stacks are cut with one cutting stroke, whereby the preceding wafer block or wafer block stack is completely cut and the following wafer block or wafer block is at least cut.

2 shows a detailed view of an oblique view of a system according to the invention. The system and in particular the first cutting station are in a position in which the sliding device 11 Direction of the cutting area 6th has driven. Also in the second cutting station 27 is the second pusher 30th arranged in a central position. In this middle position it is not possible, for example, to convey the wafer block from the first cutting station to the second cutting station. Such a position results, for example, when the second sliding device is advanced 30th for pushing a wafer block through the cutting area of the second cutting device.

3 shows a detailed oblique view of a cutting station according to the invention. This includes a sliding device 11 . The sliding device 11 comprises a first sliding body 12th , and a second sliding body 13 . One of the sliding bodies, in particular the second sliding body 13 includes exemptions 14th . These exemptions 14th extend in a substantially slot shape from the front edge 16 of the second slider 12th backwards along the cutting direction. The distance between the clearances corresponds essentially to the distance between the cutting bodies 7th . The cutting body 7th are preferred than in a cutting frame 21st clamped cutting wires formed. The sliding device 11 has at least one drive 10 on. This drive 10 is set up and suitable to move the sliding body (s) so that the wafer block can be pushed through the cutting area. According to this embodiment, two drives are preferably provided. The first drive 19th is set up to the first sliding body 12th along the cutting direction 9 to move. The first drive 19th is designed in all embodiments of the invention, for example, as a linear drive that is below the conveying surface 5 is provided, but protrudes with an element through the conveying surface to the first sliding body 12th to drive. The second drive 20th is set up to the second sliding body 13 in cutting direction 9 to move. If necessary, the drive is 10 , especially the second drive 20th to move the second slider 13 on the first sliding body 12th attached so that the second sliding body 13 via the second drive 20th opposite the first sliding body 12th can be extended or moved.

The second sliding body 13 has a side edge 15th on. In particular, the second sliding body 13 two side edges 15th on. The distance between these two side edges 15th corresponds essentially to or is slightly smaller than the distance between the two outermost cutting bodies. Thus the distance between the two side edges corresponds 15th essentially the width of the wafer block after the side edges have been cut off, possibly minus a small tolerance.

The first sliding body 11 preferably also extends into that area in which the edge of the uncut wafer block is arranged. The width of the first sliding body thus corresponds essentially to the entire width of the uncut wafer block, that is to say the width of the two edges plus the width of the edge-trimmed wafer block.

The side edges of the second sliding body are each from an exemption 14th limited, the exemption is limited only on one side of the second sliding body, so that this lateral release 14th at the same time the side edge 15th of the second slider 13 forms. The exemptions 14th are designed such that the second sliding body at least partially through the cutting area 6th can be pushed without the second sliding body 13 with the cutting bodies 7th collided. When pushing through are the cutting bodies 7th thus in the exemptions 14th of the second sliding body arranged. By withdrawing the second sliding body 13 also leave the cutting body 7th the exemptions 14th .

A first guide surface may be used to guide the wafer block laterally 34 and a second guide surface 35 intended. These guide surfaces can be formed, for example, by bar-shaped or wall-shaped elements that essentially correspond to the cutting direction 9 are trained as follows. These lateral guide elements guide the wafer block sideways during the cutting process. In particular, the guide surfaces protrude 34 and 35 from the conveying surface 5 out and / or project beyond this, for example, or at least by the height of the wafer block to be cut. As a result, the area for receiving the wafer block, ie the area between the two guide surfaces 34 , 35 , a trough-shaped mold into which the wafer block is introduced via the conveyor device.

4a shows a schematic representation of the sliding device 11 . The sliding device 11 comprises a first sliding body 12th and a second sliding body 13 . In the position shown the 4a are the front edge of the second slide body 16 and the front edge of the first sliding body is arranged substantially in alignment with or completing one another. In this case, the first sliding body and the second sliding body form an edge which runs essentially in a straight line and / or the edge of the wafer block to be pushed, in particular the rear end face 18th of the wafer block, is modeled. On the rear face 18th of the wafer block engage the two sliding bodies together in order to push the wafer block.

For example, there is the sliding device 11 to push the wafer block towards the cutting area and into the cutting area in this position. Just before the cutting bodies, just before the cutting area 6th or shortly before the edge waste guide means the first sliding body is stopped.

4b shows another position in which the second sliding body 13 opposite the first sliding body 12th is arranged in an extended position. The first sliding body is stopped shortly before the edge waste guide means. The second slide body is via the second drive 20th moved further and in particular with respect to the first sliding body 12th extended so that the wafer block can be pushed through the cutting area. The second sliding body 13 Exemptions 14th on, especially in the area of the cutting body 7th are provided to avoid a collision between the pusher and the cutting bodies 7th to avoid. The position shown by the 4b corresponds, for example, to a position in which the wafer block completely passes through the cutting area 6th is pushed through. The first sliding body 12th is stopped in a retracted position, especially just in front of the edge waste guide means. The second sliding body projects beyond the first sliding body in the cutting direction 9 . As a result, the wafer block can also be conveyed further into the second cutting station.

In all embodiments, a stacking magazine 36 be provided. This stacking magazine 36 comprises movable extensions, in particular plate-shaped bodies, which are movably coupled to the machine frame via a movement device. This stacking magazine allows several wafer blocks coming from the wafer baking machine and in particular from the input station 22nd to be stacked on top of each other. So one waffle block can be stacked on top of the other. The stacking is preferably carried out in such a way that the wafer blocks lie congruently against one another on their flat sides or lie on one another. For example, two, three, four, five, six, seven, eight or more waffle blocks can be stacked on top of one another. This wafer block stack can subsequently be cut up by the first cutting station and, if necessary, by the second cutting station.

In all embodiments it can thus be provided that a wafer block stack is provided instead of a single wafer block. Thus, instead of a single wafer block, a single wafer block stack can be introduced into the cutting stations.

According to a described embodiment, the cutting direction runs 9 the first cutting station 26th across the first conveying direction 25th the input station 22nd . The second cutting direction 28 according to this embodiment again runs transversely to the cutting direction 9 , for example parallel to the first conveying direction 25th . According to a further embodiment not shown, however, the cutting direction can also 9 the first cutting station 26th parallel or in the direction of the first conveying direction 25th run away. In this embodiment, the second cutting direction 28 across the cutting direction 9 the first cutting station 26th and at the same time across the first conveying direction 25th run away.

If necessary, it is provided that at least one hold-down device 31 is provided, which is spaced from the conveying surface 5 is arranged, wherein the distance between the hold-down device and the conveying surface essentially corresponds to the thickness of the wafer block, which is located between the holding-down device and the conveying surface, and, if necessary, that the holding-down device is arranged in the cutting direction in front of the cutting area, so that the wafer block is guided during cutting and in particular against a The erection caused by the cutting forces is secured.

List of reference symbols

1.

Cutting station

2.

Wafer block

3.

edge

4th

Machine frame

5.

Conveying area

6th

Cutting area

7th

Cutting body

8th.

Thickness of the wafer block

9.

Cutting direction

10.

drive

11.

Sliding device

12.

First sliding body

13.

Second sliding body

14th

Exemption, in particular of the second slide body

15th

Side edge of the second sliding body

16.

Front edge of the second sliding body

17th

Rear face of the rim

18th

Rear face of the wafer block

19th

First drive

20th

Second drive

21st

Cutting frame

22nd

Input station

23.

Dispensing station

24.

End product

25th

First funding direction

26th

First cutting station

27.

Second cutting station

28.

Second cutting direction

29

Second cutter body

30th

Second sliding device

31.

Hold-down

32.

Edge waste guide means

33.

Movement device for hold-down devices

34.

First guide surface

35.

Second guide surface

36.

Stacking magazine

Claims (28)

Cutting station (1) for wafer blocks for separating the lateral edge (3) of the wafer blocks running parallel to the cutting direction, comprising: - a machine frame (4) with a conveying surface (5) along which the wafer blocks are transported, - at least one in a cutting area ( 6) arranged cutting body (7), which protrudes over the conveying surface (5) at least by the thickness of the wafer block (2), - a sliding device (11) arranged movably along the cutting direction (9) and driven by a drive (10) for pushing through individual Wafer blocks or individual wafer block stacks through the cutting area (6), which is designed such that the wafer block or the wafer block stack is severed by the cutting body (7) along the cutting direction (9), characterized in that the sliding device (11) has a first sliding body ( 12) and a second sliding body (13) comprises that the first sliding body (12) and the second sliding body (13) u Are arranged movable via at least one drive (10, 19, 20) along or in the direction of the cutting direction (9) so that the second sliding body (13) is arranged movable relative to the first sliding body (12) via at least one drive (10, 20) , and that the second sliding body (13) can be brought into a sliding position with respect to the first sliding body (12) by at least one drive (10) in which the second sliding body (13) and the first sliding body (12) together on the rear face ( 18) of the wafer block in order to push the wafer block into the cutting area (6). Cutting station after Claim 1 , characterized in that the second sliding body (13) has an opening (14) which is designed such that part of the second sliding body (13), preferably at least the front edge of the second sliding body (13), on the cutting body (7 ) can be moved past through the cutting area (6), so that a wafer block can be pushed completely from the second sliding body (13) through the cutting area (6), and that the clearance (14), in particular from the side edge (15) of the second sliding body ( 13) is limited and arranged laterally outside of the second sliding body (13), or extends as a slot-shaped incision in the second sliding body (13). Cutting station after Claim 2 , characterized in that the clearance (14) runs essentially from the front edge (16) of the second sliding body (13) along the cutting direction (9) to the rear, in particular against the cutting direction (9). Cutting station after one of the Claims 1 to 3 , characterized in that the first sliding body (12) for pushing the wafer block into the cutting area (6) extends laterally up to and into the area of the edge (3) of the wafer block to be separated and in particular on the rear end face (17) of the edge ( 3) engages to push the wafer block into the cutting area (6). Cutting station after one of the Claims 1 to 4th , characterized in that the second sliding body (13) can be brought into a push-through position relative to the first sliding body (12) by at least one drive (10) in which the second sliding body (13) moves the first sliding body (12) in the cutting direction (9) and in which the cutting body (7) is in the free position (14) of the second sliding body (13), so that the second sliding body (13) projects beyond the cutting area (6) in the cutting direction (9) and the wafer block entirely through the cutting area (6) and possibly pushed beyond the cutting area (6). Cutting station after one of the Claims 1 to 5 , characterized in that in the cutting direction (9) after the cutting area (6) at least one laterally arranged edge waste guide means (32) is provided, or that in the cutting direction (9) after the cutting area (6) on both sides two edge waste guide means (32) are provided, wherein the edge waste guide means (32) extend away from the conveying surface (5) so that the separated edge (3) of the wafer blocks (2) is transported away by the conveying surface (5). Cutting station after Claim 6 , characterized in that the first sliding body (12) in the push-through position in the cutting direction (9) is stopped in front of the edge waste guide means (32) and possibly withdrawn. Cutting station after one of the Claims 1 to 7th , characterized in that a first drive (19) is provided for driving the first sliding body (12), that a second drive (20) is provided for moving the second sliding body (13) and that the second sliding body (13) via the second Drive (20) protruding from the first sliding body (12) can be extended. Cutting station after one of the Claims 1 to 8th , characterized in that the cutting body (7) is rigidly connected to the machine frame (4) and that the advance for cutting the wafer block is effected by the movement or the advance of the wafer block by the pushing device Cutting station after one of the Claims 1 to 9 , characterized in that the cutting body (7) is a cutting wire clamped in a cutting frame (21) or a cutting tape clamped in a cutting frame (21). Cutting station after one of the Claims 1 to 10 , characterized in that two cutting bodies (7) are provided, one cutting body (7) being arranged in the left edge area and a cutting body (7) in the right edge area, so that when the wafer block is pushed through the cutting area (6), the left and the right edge of the wafer block must be cut off. Cutting station after one of the Claims 1 to 11 , characterized in that three or more cutting bodies (7) are provided, one cutting body (7) being arranged in the left edge area and a cutting body (7) in the right edge area and that at least one cutting body (7) is arranged between the cutting body (7) in the left edge area and the cutting body (7) is arranged in the right edge area, so that when the wafer block is pushed through the cutting area (6), the left and right edges of the wafer block are cut off at the same time and the wafer block in the middle area, between the two edges, is cut at the same time . Cutting station after one of the Claims 1 to 12th , characterized in that a first guide surface (34) and a second guide surface (35) are provided that the two guide surfaces (34, 35) protrude from the conveying surface (5) and run essentially along the cutting direction (9) and that the Guide surfaces (34, 35) have a spacing from one another which essentially corresponds to the width of the wafer block arranged between the guide surfaces (34, 35), so that the wafer block is guided laterally during cutting. Plant for producing end products (24) by cutting flat wafer blocks (2), in particular flat or hollow wafer blocks, with an input station (22) for the blocks, at least one cutting station (1) for cutting the blocks and a Output station (23) for the end products (24) are provided, characterized in that at least one cutting station (1) according to one of the Claims 1 to 13 is trained. Plant after Claim 14 characterized in that a first conveying direction (25) is provided in the input station (22), along which the wafer blocks are fed to the first cutting station (26) and that the cutting direction (9) deviates from the first conveying direction (25), transverse to the conveying direction (25) runs and / or runs normal to the conveying direction (25), or that the cutting direction (9) coincides with the first conveying direction (25). Plant after Claim 14 or 15th characterized in that a second cutting station (27) with a second cutting direction (28) is provided, and that the second cutting direction (28) deviates from the first cutting direction (26) and in particular runs transversely or normal to the first cutting direction (26). Plant according to one of the Claims 14 to 16 , characterized in that the second cutting station (27) comprises at least one second cutting body (29), preferably several second cutting bodies (29) and a second sliding device (30) so that the wafer block previously cut and possibly cut in the first cutting station (26) is cut once more by pushing it through the second cutting area. Plant according to one of the Claims 14 to 17th , characterized in that the system can be brought into a position via the drives of the sliding devices or has a first position in which the sliding device of the first cutting station, in particular its second sliding body, protrudes over the first cutting area and in which the second sliding device is in a retracted position Position is so that the wafer block is pushed from the first pushing device into the second cutting station. Method for cutting flat wafer blocks, in particular flat or hollow wafer blocks, optionally for the formation of end products, comprising the following steps: a. Feeding a wafer block along a first conveying direction into the first cutting station, b. Moving the sliding device (11) in the cutting direction so that the wafer block is conveyed into and through the cutting area, c. Stopping the first slide body (12) in front of the edge waste guide means, d. Moving the second sliding body (13) further in the cutting direction so that the second sliding body (13) protrudes beyond the first sliding body (12) in the cutting direction and the waffle block is conveyed further in the cutting direction, the second sliding body (13) being at least a drive (10) can be brought into a sliding position in which the second sliding body (13) and the first sliding body (12) together engage the rear face (18) of the wafer block in order to push the wafer block into the cutting area (6). Procedure according to Claim 19 , characterized in that when the wafer block is pushed through, the edges of the wafer block which are lateral in the cutting direction are cut off by two laterally arranged cutting bodies. Procedure according to Claim 19 or 20th , characterized in that when the wafer block is pushed through, the wafer block is severed by a cutting body away from the edge in the central area along the cutting direction. Method according to one of the Claims 19 to 21st , characterized in that the wafer block, possibly cut into several parts in the first cutting station, is conveyed to the second cutting station and is cut there along a second cutting direction, the second cutting direction deviating from the first cutting direction, running transversely to the first cutting direction and / or normal runs to the first cutting direction. Method according to one of the Claims 19 to 22nd , characterized in that the wafer block, possibly cut into several parts in the first cutting station, is conveyed by the second sliding body to the second cutting station and is cut there along a second cutting direction, the second cutting direction deviating from the first cutting direction, running transversely to the first cutting direction and / or runs normal to the first cutting direction. Method according to one of the Claims 19 to 23 , characterized in that when the wafer block is cut, the edges of the wafer block lying laterally in the second cutting direction are cut off by two laterally arranged cutting bodies of the second cutting station. Method according to one of the Claims 19 to 24 , characterized in that the Cutting up the wafer block in the second cutting station the wafer block is severed by a cutting body away from the edge along the second cutting direction. Method according to one of the Claims 19 to 25th , characterized in that in the first cutting station a wafer block is pushed completely through the cutting area of the first cutting station and possibly conveyed to the second cutting station, or that in the first cutting station a stack of wafer blocks is pushed completely individually through the cutting area of the first cutting station and possibly into the second cutting station is promoted. Method according to one of the Claims 19 to 26th , characterized in that the first cutting direction deviates from the first conveying direction and in particular runs transversely to the first conveying direction, or that the first cutting direction coincides with the first conveying direction. Method according to one of the Claims 19 to 27 , characterized in that the first cutting direction deviates from the second cutting direction and in particular that the first cutting direction and the second cutting direction run normal to one another.

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