DE102015118626A1 - SURFACE MOUNTED WIRE COMPONENTS - Google Patents

Abstract

The invention relates to a printed circuit board (103) having an electronic component (101) mounted thereon with connecting wires (107, 108) soldered to respective contact points (111, 112) on the printed circuit board (103), the printed circuit board (103) interposing the contact points (111, 112) for the component (101) have a recess (102) such that the mounted component (101) spans the recess (102) and is arranged at least partially in the recess (102) and in that the connection wires ( 107, 108) of the component (101) in each case run parallel to the printed circuit board (103). Furthermore, the invention relates to a corresponding assembly method for an electronic component (103). Finally, the invention relates to a circuit for high-voltage generation, in particular in an X-ray generator, with a Spannungsvervielfacherschaltung, wherein the circuit comprises a circuit board according to the invention (103).

Description

The present invention relates generally to the assembly of electronic components on a printed circuit board. In particular, the invention relates to a printed circuit board on which at least one wired electronic component similar to the known surface mounting technique is attached, and a corresponding assembly method.

Background of the invention

The through-hole technique (THT) as a classical assembly method for mounting electronic components on printed circuit boards is known. In this case, in the case of a component with lead wires (wired component), these are respectively inserted through contact holes in the printed circuit board and then electrically connected to contact surfaces on the contact holes of the printed circuit board by a soldering method, for example conventional manual soldering, wave soldering, selective soldering or reflow soldering.

Electronic components for circuits in which high voltages, such as several kilovolts and higher processed, are available for historical reasons mainly only as wired components. The domain of such components was the television technology in devices with picture tubes. At that time, Surface Mounted Components (SMDs) were still unknown. Today, this market for such high-voltage components has largely disappeared, as in today's TVs without picture tubes no high voltage is needed anymore.

The 1A to 2 B illustrate by means of a component 1 For example, an electrical resistance, the known through-hole mounting on a printed circuit board (PCB) 3 , in the first according to the circuit layout for the components required Einstecklöcher 5 calculated and drilled. First, the two connecting wires 7 of the component 1 shortened to the required length, then angled in the same direction, with the distance of the bending points 9 the distance between the associated two insertion holes 5 in the circuit board 3 equivalent. The insertion holes 5 each have a contact surface 11 usually with a conductor track 13 connected is. The insertion holes 5 are for through-hole each with a copper sleeve 13 Mistake. During assembly of the component 1 then each one of the connecting wires 7 through its associated insertion hole 5 stuck through it. Then the connecting wires 7 for example, by wave soldering with the solder pads 11 soldered. It forms between the connecting wires 7 and the respective contact surfaces 11 Teillötstellen 15a , as in 2A shown enlarged.

2A shows in more detail one of the connecting wires 5 of the component 1 of the 1A and 1B with the part killing 15a at one of the insertion holes 5 , If the circuit board 3 in a device at a certain distance from an equipotential surface 19 , For example, a conductive housing part is arranged, and the connecting wire 5 For example, a voltage of several kilovolts, which may be from the lead wire to the equipotential surface 19 towards forming electric field 17a reach the breakdown field strength for the material arranged there, usually air (but also noble gases, oils or potting compounds are possible) reach. To avoid this, the connection wire ends must be 8th on the back side 3a the circuit board 3 be soldered manually after, so there is a hemispherical second part possible soldering 15b arises. Due to the hemispherical shape of the partial solder joint 15b becomes the distribution of the field lines of the electric field 17a of the 2A changed so low that the field line course of the electric field 17b in 2 B results. In the electric field 17b The field lines are distributed over a larger space, so that the field strength is reduced accordingly. The manual re-soldering as an additional manufacturing step is complicated and time-consuming and it contains sources of error: It is difficult the hemispherical Teilillötstelle 13b reliably to produce at the desired speed, which requires the use of well-trained professionals; through the repeated soldering becomes the component 1 twice exposed to thermal stress by soldering; and in a manual soldering process, it is always difficult to maintain the correct soldering temperatures and soldering times.

DE 103 08 817 A1 shows a printed circuit board and a method for temporary fixing of wired components on the circuit board to prevent falling out of the not yet soldered components during the soldering process in the reflow soldering oven. The printed circuit board has in each case an additional recess in an edge region of the insertion holes, into which a bent free end of a connecting wire can engage, so that the component can hang with its connecting wires in the printed circuit board during overhead transport. During subsequent overfluxing in the reflow soldering oven, the solder can flow into the recesses and into the insertion holes during the soldering process. In this modified through-hole mounting creates a relatively flat solder joint on the back of the plate, because the respective wire connection end was sunk in the recess in the circuit board and was virtually buried with solder. For the desired influence of the electric field, if necessary, these flat solder joints must also be re-soldered. This modified type of through-hole mounting is also expensive, especially since in the production of the insertion holes in the circuit board, the additional Recesses generated and the wire connections after insertion must be bent a second time. In addition, a desoldering of a defective component by the hooked in the recesses and there buried with solder terminal wire ends is much more difficult.

DE 36 36 817 A1 shows in 2 a plug-in mounting in which the component has connection elements with at least approximately square foot plates, which run parallel to the circuit board surface. The insertion holes are designed as through-plated Kapillarbohrungen in the circuit board and dimensioned and arranged in relation to the position of the patch on the circuit board member so that the foot plates protrude during assembly in the Kapillarbohrungen. During the soldering process, solder flows from the side of the printed circuit board facing away from the component on the toe plate and up to the side of the mouth of the capillary bore to the above the Fußplättchens located soldering surfaces on the connection elements. For a temporary attachment of the component to the circuit board, an adhesive drop may be provided. This type of mounting is particularly complicated, especially because the connection elements must be provided with the approximately square foot plates.

Disclosure of the invention

It is an object of the invention to propose a printed circuit board with improved mounting wired in operation high voltage leading electronic components on a circuit board and a corresponding assembly method, the disadvantages discussed above should be avoided or at least reduced as possible.

The object is achieved with the features of the independent claims. Further embodiments and advantageous developments are defined in the respective subsequent subclaims. In this case, features and details that are described in connection with the printed circuit board according to the invention with mounted component, of course, also in connection with the assembly method according to the invention and in each case vice versa. Therefore, mutual reference is made to the disclosure of the individual aspects.

A key idea of the invention is to provide a recess in a printed circuit board between the contact points for a high-voltage electronic component operating during the operation of the circuit, which has a contour such that by inserting the component into this recess, the connection wires of the component automatically to the respective Contact points are aligned on the circuit board for the component and the assembled component after soldering with the contact points spans the recess and is at least partially disposed in the recess, so that the connection wires of the component in each case run parallel to the circuit board.

A first aspect relates to a printed circuit board having an electronic component mounted thereon with leads soldered to respective pads on the printed circuit board. According to the invention, the printed circuit board has a recess between the contact points for the component such that the mounted component spans the recess and is at least partially arranged or inserted in the recess. Furthermore, according to the invention, the connecting wires of the component inserted into the recess run parallel to the printed circuit board in each case. Preferably, the mounted component is arranged in the recess such that it spans it and its connection wires are parallel to the circuit board and to the longitudinal axis of the component.

The inventive arrangement and soldering of the wired component with the associated contact points on the circuit board, it is no longer, as in the through-hole mounting in the prior art, required to bend the leads. The assembly of the printed circuit board is simplified accordingly. At the contact points of the circuit board and through holes are no longer required, so omitted in the production of the circuit board, the corresponding drilling steps and possibly further manufacturing steps for the production of vias.

Preferably, the contour of the recess is substantially similar to a shadow of the component (mathematically). In other words, the contour of the recess essentially corresponds to the outline or silhouette of the component when viewed from a direction radial to the longitudinal axis of the component. For components with two connecting wires, the longitudinal axis of the component usually follows the course of the connecting wires. Mathematically similar is here essentially mean that the contour of the recess in the circuit board can be converted by a similarity mapping in a shadow of the component. Preferably, the recess is dimensioned slightly larger. Of course, the contour of the recess does not exactly follow the outline of the component, it is sufficient if the component is inserted into the recess with proper alignment, the component and the recess cooperate so that automatically the desired orientation of the leads to the contact surfaces the circuit board sets. Thus, the recess in the circuit board is an alignment means for automatically aligning the component when equipping the circuit board.

Due to the fact that, in the case of the assembly of a wired component on a printed circuit board described here, the connecting wires do not have to be passed through insertion holes in the printed circuit board as in the through-hole mounting in the prior art, but instead the connecting wires run parallel to the printed circuit board at the contact surfaces, this is the starting point of the 2A and 2 B described problem of critical field strengths between terminal wire ends and adjacent equipotential surfaces in the operation of the circuit board reduced or almost excluded. The special design of the circuit board and arrangement of the component on the circuit board is thus particularly suitable for printed circuit boards whose circuits are set up in operation for carrying high voltages of 10 kV and higher.

Furthermore, it has been found to be particularly advantageous that with the help of the recess in the circuit board between the respective contact points for the leaded component of the shortest path on the circuit board between these contact points through the contour of the recess, in particular its width transverse to the longitudinal direction of the component and / or the length in the longitudinal direction of the component, can be adjusted so that leakage currents can be reduced by the resulting longer current path between the contact points in the operation of the printed circuit board. This characteristic of the special design of the printed circuit board and arrangement of the component on the printed circuit board is thus particularly suitable for printed circuit boards whose circuits are set up in operation for carrying high voltages of 10 kV and higher.

The connecting wires of the component preferably each have a length such that they terminate in the region of the associated contact points of the printed circuit board. Since the connecting wires do not have to be bent over when the printed circuit board is fitted, the connecting wires can already be provided in advance with the corresponding lengths or the components can be designed with a relatively short standard length of the connecting wires, for example from a few millimeters up to 10 mm ,

In principle, however, it may still be advantageous to bend or deform the connection wires of the component on one or both sides in such a way that the profile of a bent connection wire, for example, an eyelet, an open D-ring, an open triangle D-ring or the like forms and defines a plane. Thus, a desired orientation of the component can be predetermined in the installed position, since the connecting wires spanning a plane will also align during assembly according to the course of this plane parallel to the circuit board. Of course, if both leads are deformed, the planes then formed on both sides in the desired mounting state of the component should both be aligned parallel to the circuit board.

A second aspect of the present invention relates to an electronic device having a printed circuit board according to the first aspect discussed above, wherein the printed circuit board in operation at a contact point of the component leads with a high voltage of 10 kV and higher at at least one of the contact points of the component.

A third aspect relates to an assembly method for at least one electronic component with lead wires on a printed circuit board, the method comprising the steps of: (a) forming the printed circuit board having contact points for the component and a recess between the at least two contact points; (b) applying a solder paste to the pads; and (c) mounting the component by placing or inserting the component into the recess so that the component spans the recess and is at least partially disposed in the recess and the connection wires of the component each extend parallel to the circuit board.

Particularly preferably, the component is automatically aligned during and by insertion into the recess so that the connecting wires are aligned with the contact points and thus arranged over the contact points.

Furthermore, it is preferable in step (a) to dimension the recess such that the shortest path over the printed circuit board between the contact points is set by the length of the recess in the longitudinal direction of the component and / or the width of the recess transversely to the longitudinal direction of the component, that leakage currents between the contact points during operation of the circuit board can be reduced.

Preferably, prior to step (c), the connecting wires of the component are shortened or the component is produced with connecting wires of appropriate length, so that the connecting wires of the component each have a length, so that the connecting wires in the region of the associated contact point of the printed circuit board end after insertion into the recess.

In an advantageous development, it may nevertheless be advantageous, prior to step (c), to make the connecting wires of the component sufficiently long in order to bend or deform them on one or both sides in such a way that the profile of the bent connecting wire is, for example, one Eyelet, an open D-ring, an open triangle D-ring or similar forms and thus one Just defined. Thus, a desired orientation of the component in installation position can be predetermined, since a plane spanning bent connecting wire will also align during assembly according to the course of the plane parallel to the circuit board and thus the component. Of course, when both leads are deformed, the planes to be formed on both sides are aligned so that both are aligned parallel to the circuit board in the assembled state of the component.

The method may further comprise, in step (d), soldering the leads to the pads by reflowing the solder paste in a reflow oven. Of course, other soldering methods, such. As wave soldering or selective soldering, possible. The shape of the solder ball forming at the soldering point can be influenced particularly advantageously by adjusting the amount of solder paste applied to the contact point.

The invention is particularly suitable for a high-voltage circuit in operation, for example, a circuit for voltage multiplication to generate a high voltage, for example consisting of one or more serially interconnected Villard circuits, as used for example in X-ray generators.

The invention therefore also relates to an X-ray generator having a circuit which is set up for multiplying a voltage for high-voltage generation, wherein the voltage multiplier circuit has a printed circuit board of the first aspect described here. Accordingly, the circuit board can be equipped with the above-described mounting method according to the third aspect.

Preferred embodiments

Further advantages, features and details of the invention will become apparent from the following description in which, with reference to the drawings, embodiments of the invention are described in detail. The features mentioned in the claims and in the description may each be essential to the invention individually or in any desired combination. Likewise, the features mentioned above and the features further explained herein can be used individually or in combination in any desired combination. Functionally similar or identical components or components are partially provided with the same reference numerals. The terms "left", "right", "top" and "bottom" used in the description of the embodiments refer to the drawings in an orientation with normally readable figure designation or normal readable reference numerals. The embodiments shown and described are not to be understood as exhaustive but have exemplary character for explaining the invention. The detailed description is for the information of the person skilled in the art, therefore, in the description of known circuits, structures and methods are not shown or explained in detail in order not to complicate the understanding of the present description.

The 1A to 2 B illustrate by means of a wired component measures to avoid high electrical field strengths in through-mounted components by an additional manual soldering on the back of the circuit board, are carried out by means of hemispherical solder joints at the terminal wire end.

3A illustrates a circuit board according to the invention with an electronic component mounted thereon in a cross-sectional side view AA.

3B shows the circuit board with the electronic component mounted thereon 3A in a top view.

4A and 4B illustrate the difference in the required mounting height of a printed circuit board according to the invention in comparison to one with through-hole technology in the prior art.

5A and 5B illustrate the current path for leakage currents between two contact points of a printed circuit board according to the invention compared to one in the prior art.

6A and 6B illustrate the space available for the component for the dissipation of power output in a printed circuit board according to the invention in comparison to one in the prior art.

7 FIG. 3 is a flowchart illustrating an assembly method according to the invention. FIG.

3A shows in a cross section AA the 3B a circuit board 103 with a recess 102 and an electronic component inserted in the recess and mounted on the circuit board 101 with connecting wires 107 . 108 that with respective contact points 111 . 112 on the circuit board 103 by means of solder joints 115 . 116 are soldered. The circuit board 103 points between the contact points 111 . 112 for the component 101 the recess 102 such that the assembled component 101 the recess 102 spanned and at least partially in the recess 102 is arranged. In the 3A is the component 101 almost half in the recess 102 arranged, thus in the recess 102 inserted. The connecting wires 107 . 108 of the component 101 each run parallel to the circuit board 103 , The connecting wires 107 . 108 can do it on the contact points 111 . 112 rest, but it can also be a solder layer between a lead wire 107 . 108 and the associated contact point 111 . 112 are located.

3B shows the arrangement of 3A in the plan view. 3B further shows along which section line AA the side view of 3A was created. In addition to 3A is in the 3B to recognize that the contact points 111 . 112 with respective tracks 113 . 114 the circuit board 103 connected in the usual way or are part of the conductor track. Furthermore, in 3B to recognize that the contour of the recess 102 essentially a silhouette of the component 101 is similar. Here is the recess 102 slightly larger than the silhouette of the component 101 , The recess 102 must essentially be such that the connecting wires 107 . 108 at a component inserted into the recess 101 always on the respective contact points 111 . 112 comes to rest. This is the recess 102 essentially depending on the size of the silhouette of the component and the desired spacing of the contact points of the recess.

If the component 101 is rotationally symmetrical with respect to the longitudinal axis determined by its connecting wires, its silhouette is the same from all radial directions of view on the longitudinal axis. However, there are also components which, for example, also have longitudinal connecting wires, but have a body with, for example, a cuboid shape. In such components, depending on the selected direction different shadow cracks are conceivable. In such cases, however, the contour of the recess is preferred 102 chosen so that the desired alignment of the component can be reliably used by the interaction of its outline with the contour of the recess with regard to an automated assembly of the circuit board.

The 4A and 4B illustrate the advantageous reduction of the required height H of a printed circuit board 103 in which a wired component 101 according to the assembly proposed here, compared to a mounted by means of through-hole mounting component 1 in the prior art ( 4B ). Good is in the 4A to recognize that the assembled component is the recess 102 spanned and at least partially in the recess 102 is arranged, according to the recess 102 is inserted. Furthermore, it is easy to see that the connection wire 107 of the component 101 parallel to the PCB 103 runs. Next is the connection wire 107 of the component 101 in its length designed so that the connecting wire in the area of the associated contact point 111 - in 4A approximately in the middle - ends. Based on 4A and 4B It can be clearly seen that with respect to a virtual reference surface R a greater safety distance H between the component 101 and the reference surface R can be achieved as compared to the through-hole mounting of the prior art with a safety distance h as in 4B shown.

The 5A and 5B illustrate the beneficial effect of the targeted adjustment of the distance between the contact points of a component on the circuit board for leakage currents. In the 5A is the circuit board 103 with two contact points 111 . 112 the associated interconnects 113 . 114 shown. Between the contact points 111 . 112 there is the recess 102 into which the electronic component to be mounted 101 (such as in the 3A to 4A illustrated). Through the recess 102 Creepage currents can no longer be directly from the contact point 111 to the contact point 112 or vice versa, but would need the recess 102 bypass. As a result, the effective distance and accordingly the insulation resistance between the two contact points increases 111 . 112 , Since the voltage differences between contact points occurring in operation of the circuit are known in advance, taking into account the operating conditions which are expected during operation of the circuit, a distance LL can be determined by dimensioning the length and / or the width of the recess 102 be preset. In the prior art, in the 5B is shown, only the direct distance between the contact points 11 and 12 can be varied, ie at high voltage leading circuit parts so far only a correspondingly large distance between the contact points can be adjusted, which increases the circuit layout accordingly.

The 6A and 6B illustrate in comparison the improved dissipation of power dissipation of the circuit board presented here with appropriately mounted wired electronic component. As in 6A to recognize stands in the operation of power loss in the form of heat-emitting component 101 essentially the complete free space (360 °) of its environment for heat dissipation available. In contrast, stands the component 1 in the classic push-through mounting on the circuit board 3 , as in 6B shown only half the clearance (180 °) available for heat dissipation.

7 is a flowchart illustrating an assembly method for at least one electronic component with leads on a circuit board (see. 3A and 3B ).

In step S1, a printed circuit board ( 103 ) with printed conductors ( 113 . 114 ) and at least two contact points ( 111 . 112 ) for an electronic component ( 101 ) and a recess ( 102 ) between the at least two contact points ( 111 . 112 ) produced.

In step S2, a solder paste is applied to the pads. In step S3, the component is inserted into the recess, wherein the component spans the recess, at least partially disposed in the recess, and the connecting wires ( 107 . 108 ) of the component in each case run parallel to the printed circuit board. It is particularly advantageous that in step S3 by inserting into the recess, the component is automatically aligned so that the connecting wires are arranged above the contact points.

In a step S4, the connection wires are soldered to the contact surfaces by melting the solder paste, for example in a reflow oven. The resultant shape of the solder joints can be advantageously adjusted to the pads by adjusting the amount of solder paste applied in step S2.

In preferred embodiments of the method, the recess is dimensioned in step S1 such that the shortest path on the printed circuit board between the contact points is set by the length of the recess in the longitudinal direction of the component and / or by the width of the recess transversely to the longitudinal direction of the component, that leakage currents between the contact points in the operation of the circuit board can be reduced.

In preferred embodiments of the method, in step S3, the connecting wires of the component are shortened before assembly or components with correspondingly short connecting wires are used, so that the connecting wires of the component each have a length such that when inserting the component in the recess in the End area of the associated contact point of the circuit board.

In an advantageous development, it may be advantageous to bend or deform the connection wires of the component on one or both sides in step S3 such that the course of a bent connection wire, for example, an eyelet, an open D-ring, an open triangle D-ring or similar forms and thus defines a plane. This is possibly taken into account in the above-described reduction of the connecting wires. The deformation of one or both connecting wires can be done for the purpose of predetermining a desired orientation of the component in the installation position in the printed circuit board. When inserting the component in step S3, the component is then automatically aligned additionally, as desired, since at least one plane spanning bent lead wire during assembly will align itself in accordance with the course of the plane parallel to the circuit board and thus also firmly connected to the lead wire component. When both leads are deformed, the lead-wire planes to be formed on both sides are aligned with each other so that both are aligned parallel to the PCB in the mounting position of the component.

Finally, it should be noted that the above description for ease of illustration and description of an electronic component with two leads. Of course, the assembly method described here can also be applied correspondingly to components with a plurality of connecting wires. In other words, the present solution is not limited to wired components with only two leads.

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• DE 10308817 A1 [0006]
• DE 3636817 A1 [0007]

Claims (15)

Printed circuit board ( 103 ) with an electronic component mounted thereon ( 101 ) with connecting wires ( 107 . 108 ), with respective contact points ( 111 . 112 ) on the printed circuit board ( 103 ) are soldered, characterized in that the printed circuit board ( 103 ) between the contact points ( 111 . 112 ) for the component ( 101 ) a recess ( 102 ) such that the assembled component ( 101 ) the recess ( 102 ) spans and at least partially in the recess ( 102 ) and that the connecting wires ( 107 . 108 ) of the component ( 101 ) each parallel to the circuit board ( 103 ). Printed circuit board ( 103 ) according to claim 1, wherein the contour of the recess ( 102 ) substantially a silhouette of the component ( 101 ) is similar. Printed circuit board ( 103 ) according to claim 2, wherein the orientation of the connecting wires ( 107 . 108 ) of the component ( 101 ) by inserting the component ( 101 ) in the recess ( 102 ) is determined. Printed circuit board ( 103 ) according to one of the preceding claims, wherein the component ( 101 ) during operation of the printed circuit board ( 103 ) is arranged to carry a high voltage of at least 10 kilovolts. Printed circuit board ( 103 ) according to one of the preceding claims, wherein the shortest path (LL) on the printed circuit board ( 103 ) between the contact points ( 111 . 112 ) by the length of the recess ( 102 ) in the longitudinal direction of the component ( 101 ) and / or the width of the recess ( 102 ) transverse to the longitudinal direction of the component ( 101 ) is adjusted so that leakage currents between contact points ( 111 . 112 ) during operation of the printed circuit board ( 103 ) are reduced compared to a circuit board without recess. Printed circuit board ( 103 ) according to any one of the preceding claims, wherein the connecting wires ( 107 . 108 ) of the component ( 101 ) each have a length that they in the region of the associated contact points ( 111 . 112 ) of the printed circuit board ( 103 ) end up. Printed circuit board ( 103 ) according to one of the preceding claims, wherein at least one of the connecting wires ( 107 . 108 ) of the component ( 101 ) on one or both sides of the component ( 101 ) is deformed such that the course of the deformed connecting wire defines a plane, for example in the form of an eyelet, an open D-ring, an open triangular D-ring is deformed. Device with a printed circuit board ( 103 ) according to one of claims 1 to 7, wherein the printed circuit board ( 103 ) in operation at least at one of the contact points ( 111 . 112 ) of the component ( 101 ) with connecting wires ( 107 . 108 ) carries a high voltage of at least 10 kilovolts. Assembly method for at least one electronic component ( 101 ) with connecting wires ( 107 . 108 ) on a printed circuit board ( 103 ), the method comprising the steps of: (a) fabricating (S1) the printed circuit board ( 103 ) with contact points ( 111 . 112 ) for the component ( 101 ) and a recess ( 102 ) between the at least two contact points ( 111 . 112 ); (b) applying (S2) a solder paste to contact points ( 111 . 112 ); (c) mounting (S3) the component ( 101 ) by inserting the component ( 101 ) in the recess ( 102 ), so that the component ( 101 ) the recess ( 102 ) spans and at least partially in the recess ( 102 ) and the connecting wires ( 107 . 108 ) of the component ( 101 ) each parallel to the circuit board ( 103 ). Assembly method according to claim 9, wherein in step (a) the component ( 101 ) by insertion into the recess ( 102 ) is automatically aligned so that the connecting wires ( 107 . 108 ) above the contact points ( 111 . 112 ) are arranged. The assembling method according to one of claims 9 or 10, wherein the method further comprises the step of: (d) soldering (S4) the leads ( 107 . 108 ) with the contact points ( 111 . 112 ) by melting the solder paste in a reflow oven. Assembly method according to one of claims 9 to 11, wherein in step (b) the amount of solder paste applied to the contact point ( 111 . 112 ) is adjusted so that in step (d) results in a desired shape of the solder at the solder joint. Mounting method according to one of claims 9 to 12, wherein in step (a) the recess ( 102 ) is dimensioned such that the shortest path (LL) on the printed circuit board ( 103 ) between the contact points ( 111 . 112 ) by the length of the recess ( 102 ) in the longitudinal direction of the component ( 101 ) and / or the width of the recess ( 102 ) transverse to the longitudinal direction of the component ( 101 ) is adjusted so that leakage currents between the contact points ( 111 . 112 ) during operation of the printed circuit board ( 103 ) are reduced compared to a circuit board without the recess. Mounting method according to one of claims 8 to 13, wherein before step (c) the connecting wires ( 107 . 108 ) of the component ( 101 ) or wired component ( 101 ) with connecting wires ( 107 . 108 ) are used with a predetermined length such that the connecting wires ( 107 . 108 ) of the component ( 101 ) each after installation in Area of the associated contact point ( 111 . 112 ) of the printed circuit board ( 103 ) end up. Circuit for generating high voltage, in particular in an x-ray generator, having a voltage multiplier circuit, the circuit comprising a printed circuit board ( 103 ) according to one of claims 1 to 7 and wherein the printed circuit board ( 103 ) preferably with a mounting method according to one of claims 9 to 14 with at least one leaded component ( 101 ) was equipped.

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