DE102015112536A1 - Optoelectronic plug-in module and lighting arrangement for the interior of a vehicle cabin - Google Patents

Abstract

An optoelectronic plug-in module (100) comprises a printed circuit board (1) with an upper side (10), a lower side (11) and printed conductors (12) for distributing current along the printed circuit board (1). On the upper side (10) of the printed circuit board (1) a first optoelectronic component (20) is mounted, which is electrically contacted via the conductor tracks (12). An edge region of the printed circuit board (1) is formed as a plug (3) for insertion into an electrical connection socket (4), wherein in the region of the plug (3) the conductor tracks (12) on the top (10) and / or bottom (11) the printed circuit board (1) are guided and there exposed in the non-contacted state. The exposed conductor tracks (12) in the region of the plug (3) are designed as plug contacts (30, 31) for external contacting of the plug-in module (100) via the connection socket (4). The main function of the optoelectronic plug-in module (100) is in normal operation in the generation of light or the detection of electromagnetic radiation.

Description

An optoelectronic plug-in module is specified. In addition, a lighting arrangement for the interior of a vehicle cabin is specified.

An object to be solved is to specify a particularly simple and compactly designed optoelectronic plug-in module which can be plugged into a connection socket for power supply or data transmission. Another object to be solved is to provide a lighting arrangement for the interior of a vehicle cabin with such a plug-in module.

These objects are achieved inter alia by the subject matters of the independent patent claims. Advantageous embodiments and further developments are the subject of the dependent claims.

In accordance with at least one embodiment, the optoelectronic plug-in module has a printed circuit board with an upper side, a lower side and printed conductors for distributing current along the printed circuit board. In particular, the printed circuit board may be a plastic sheet printed with printed conductors, ie a so-called PCB board. But also a printed circuit board in the form of a metal core board, English: metal core board, short: MCB, is possible. The, for example, metallic conductor tracks can run on the top or the bottom or in the interior of the circuit board. In particular, the printed circuit board can therefore also be a multilayer printed circuit board.

The circuit board has, for example, the basic shape of a cuboid with a thickness between the top and bottom of at least 0.2 mm or at least 0.5 mm or at least 1 mm. Alternatively or additionally, the thickness is at most 2 mm or at most 1.5 mm or at most 1 mm. The length and width of the circuit board, for example, at least 0.5 cm or at least 1 cm or at least 10 cm. Alternatively or additionally, the width or length of the printed circuit board is at most 20 cm or at most 10 cm or at most 5 cm. The printed circuit board can be a flexible, in particular flexible or rollable, or a rigid printed circuit board. Even a printed circuit board with flexible and rigid areas, such as a so-called rigid-flex circuit board, is conceivable.

According to at least one embodiment, a first optoelectronic component is mounted on the upper side of the printed circuit board, which is electrically contacted via the conductor tracks. The interconnects run, for example, below the component and are in indirect contact with the component, for example via a solder material. The component may be a surface-mountable component in which the contacts for electrical contacting are arranged on a side of the first optoelectronic component facing the printed circuit board. The first optoelectronic component can then be soldered onto contact regions of the printed circuit board without the need for an electrical connection via contact wires.

In accordance with at least one embodiment, an edge region of the printed circuit board is designed as a plug for insertion into an electrical connection socket. The plug is in this case no separate, applied to the circuit board component, but is formed by the circuit board itself. The area of the plug is therefore preferably free of separately applied components, such as optoelectronic or electronic or optical components.

According to at least one embodiment, the conductor tracks are guided in the region of the plug on the top and / or bottom of the circuit board and are free in the non-contacted state. In particular, the printed conductors in the region of the plug are then exposed when the plug-in module is not inserted into the electrical connection socket.

In accordance with at least one embodiment, the exposed conductor tracks in the region of the plug form plug contacts for external contacting of the plug-in module via or by means of the connection socket. About the plug contacts, the plug-in module, for example, be electrically contacted and are supplied with power for proper operation. It is also possible that via the plug contacts a data exchange between socket and plug-in module takes place, which can be used to control or programming of the plug-in module. Preferably, all contacts of the plug-in module for external power supply or for data transmission are designed as plug contacts described here and below.

In accordance with at least one embodiment, the main function of the optoelectronic plug-in module in normal operation is the generation of light or the detection of electromagnetic radiation. In particular, the plug-in module for illuminating interiors, for example, vehicle interiors, suitable or provided. The first optoelectronic component is therefore preferably a light-generating component, such as a light-emitting diode chip or a light-emitting diode, or a photodiode or a photodetector.

"Main function" in this context means that, for example, the first or even further optoelectronic components on the plug-in module have the most important function on the plug-in module. For example, all non-optoelectronic components in the plug-in module are set up directly or indirectly for the operation or control of the optoelectronic components. For example, during operation at least 50% or at least 70% or at least 80% of the power or power supplied to the plug-in module is consumed by the optoelectronic components. In particular, the optoelectronic components consume more energy or power than integrated circuits or data storage systems or sensors or transponders possibly processed in the plug-in module.

In at least one embodiment, the optoelectronic plug-in module comprises a printed circuit board having an upper side, a lower side and printed conductors for distributing current along the printed circuit board. On the top of the circuit board, a first optoelectronic component is mounted, which is electrically contacted via the conductor tracks. An edge region of the printed circuit board is formed as a plug for insertion into an electrical connection socket, wherein in the region of the plug, the conductor tracks are guided on the top and / or bottom of the circuit board and exposed there in the non-contacted state. The exposed conductor tracks in the area of the plug are set up as plug contacts for external contacting of the plug-in module via the connection socket. The main function of the optoelectronic plug-in module is in normal operation in the generation of light or the detection of electromagnetic radiation.

The invention described here is based in particular on the idea of using the printed circuit board of an optoelectronic plug-in module itself as a plug, in particular as a so-called male part of a plug. This saves space, since a separate, serving as a plug element on the circuit board is not necessary. Furthermore, this design makes it possible to efficiently heat the plug-in module via the plug.

In accordance with at least one embodiment, the first optoelectronic component is a light-emitting diode chip or a light-emitting diode with, for example, at least 1 mW or at least 50 mW or at least 150 mW radiation power. For example, it is a high-power diode or a high-performance diode chip with at least 1 W or at least 5 W or at least 10 W radiation power. In particular, the light-emitting diode chip can be a surface-mountable and / or surface-emitting and / or volume-emitting LED chip. The light-emitting diode may also be an organic light-emitting diode. However, the first optoelectronic component can also be a semiconductor laser or a laser diode or a laser diode chip.

In accordance with at least one embodiment, the luminous intensity, for example the maximum or average luminous intensity radiated into the 4π solid angle, of the optoelectronic plug-in module during normal operation is at least 5 mcd or at least 100 mcd or at least 500 mcd or at least 1 cd or at least 10 cd or at least 100 cd or at least 1000 cd.

In accordance with at least one embodiment, the luminous flux of the optoelectronic plug-in module during normal operation is at least 0.5 lm or at least 1 lm or at least 5 lm or at least 10 lm or at least 50 lm or at least 100 lm or at least 500 lm or at least 1000 lm or at least 5000 lm.

In operation, the plug-in module preferably emits radiation in the visible range, for example blue or green or yellow or red or mixed-colored, such as white light. The luminous flux is integrated over the entire solid angle. The light intensity is a differential quantity that indicates the luminous flux per solid angle.

In accordance with at least one embodiment, the plug contacts do not project beyond the printed circuit board in a lateral direction parallel to a main extension direction of the printed circuit board. This means that the plug contacts in the form of the printed conductors are not protruding or protruding in the plug-in module. Rather, the plug contacts terminate flush in the lateral direction with one or more edges of the printed circuit board or are withdrawn relative to the edges of the printed circuit board.

According to at least one embodiment, the plug contacts in the vertical direction perpendicular to the lateral direction flush with the top and / or the underside of the circuit board. This means in particular that the plug contacts are part of the top and / or bottom. In the region of the plug, the upper side and / or the lower side with the applied plug contacts within the manufacturing tolerance are preferably flat or planar. The plug contacts are thus not protruding from the circuit board in the vertical direction or out.

By this integrated into the circuit board configuration of the plug contacts, the lateral and vertical extent of the plug-in module can be kept low. In addition, this embodiment has the advantage that the socket, which preferably the so-called female part of the Plug forms can be kept simple in their construction.

According to at least one embodiment, one or more first plug contacts are arranged on the upper side of the printed circuit board in the plug-in module. The first plug contacts are thus exposed at the top and are freely accessible for contacting. The first plug contacts may, for example, be electrical connection contacts of a first polarity, such as positive pole plug contacts.

According to at least one embodiment, one or more second plug contacts are arranged on the underside of the circuit board in the plug-in module. The second plug contacts are thus exposed at the bottom and are freely accessible for electrical contact. The second plug contacts may be plug contacts of a second polarity, such as negative pole plug contacts.

According to at least one embodiment, the first plug contacts do not overlap with the second plug contacts in plan view of the upper side of the printed circuit board. Alternatively, it is also possible that overlap in plan view of the top, the first plug contacts with the second plug contacts.

The arrangement of first plug contacts on the top and second plug contacts on the bottom, the entire plug-in module can be made particularly compact in its width.

In accordance with at least one embodiment, all plug-in contacts of the plug-in module are arranged exclusively on the upper side or exclusively on the lower side of the printed circuit board.

According to at least one embodiment, the printed circuit board in the region of the plug on at least one connecting element for mechanically stable, permanent and non-destructive detachable connection to the connector socket. The connecting element may be, for example, a device such as a bore, a screw connection, clip connection, plug connection or clamping connection. Such compounds can preferably be repeatedly solved without damaging the connector or the plug-in module.

In accordance with at least one embodiment, the printed circuit board has at least one mounting element for the mechanically stable, permanent and non-destructive detachable connection of the plug-in module to an external carrier. As with the connecting element, the mounting element may be a device such as a bore, a screw connection, clip connection, plug connection or clamp connection. The mounting element is preferably a separate element from the connecting element and is arranged, for example, in another area of the plug-in module.

In accordance with at least one embodiment, one or more further optoelectronic or electronic components are applied to the printed circuit board in addition to the first optoelectronic component. The other components can be contacted electrically as above via the conductor tracks. For this purpose, interconnects run, for example, below the other components and are electrically connected to the other components.

In accordance with at least one embodiment, at least one of the further components is mounted on the underside of the printed circuit board. By arranging the first optoelectronic component on the upper side and one of the further components on the underside, the entire plug-in module can be kept compact in relation to the lateral extent.

According to at least one embodiment, the or the further components are selected from the following group of components: light-emitting diode, light-emitting diode chip, laser diode, laser diode chip, integrated circuit for controlling the first optoelectronic component and / or further components, RFID transponder, RFID reader, protective diode, Photodetector, capacitor, coil, sensor, resistor. In particular, here and below, one or more of the further components may have the same properties as the first optoelectronic component in terms of composition, mode of operation or position on the printed circuit board.

In accordance with at least one embodiment, the conductor tracks extend from the plug contacts to at least one component on the printed circuit board and are integrally formed in the entire region between the component and the plug contact. In particular, the printed conductors thus run continuously and without interruption from the plug contacts to at least one component on the printed circuit board.

According to at least one embodiment, a thickness of the plug corresponds to the thickness of the printed circuit board between the top and bottom. That is, the plug is preferably free of elevations or depressions on or in the circuit board.

In accordance with at least one embodiment, the one or more top mounted components are overmolded with one or more bottom mounted components one or more vias electrically connected. The plated-through holes thus extend from the upper side to the lower side of the printed circuit board and preferably completely penetrate the printed circuit board.

In accordance with at least one embodiment, the circuit board is a metal core board having a metal core and a dielectric for electrical isolation from the metal core. The metal core may, for example, comprise or consist of Al, Cu, Mg, Ti, Zr, Ta, Bi or an alloy of these metals. The dielectric is preferably an organic dielectric such as plastic. However, an inorganic dielectric is also possible.

In accordance with at least one embodiment, the dielectric comprises or consists of one or more metal oxides, such as metal oxide ceramics. The metal oxide or oxides are preferably formed from the oxidized metal of the metal core. In order to produce such a dielectric, the metal core can be processed, for example, partially via anodic oxidation, whereby the dielectric is formed.

In accordance with at least one embodiment, the dielectric has a dielectric strength or dielectric strength of at least 10 kV / mm or at least 50 kV / mm or at least 150 kV / mm.

According to at least one embodiment, the thermal conductivity of the dielectric is at least 4 W / (m · K) or at least 8 W / (m · K) or at least 12 W / (m · K) or at least 16 W / (m · K).

In accordance with at least one embodiment, the dielectric has a dielectric constant of at least 7 or at least 10 or at least 15 for a frequency range between 1 MHz and 50 GHz.

In accordance with at least one embodiment, the plug-in module has a housing which is arranged on the top side and / or the underside of the circuit board. The housing is preferably formed of an insulating material, such as a plastic or silicone or resin. The housing can contribute to the stabilization of the plug-in module and / or protect the components on the circuit board from external influences, such as mechanical influences. The housing may for example be made of a potting.

According to at least one embodiment, the plug is free of the housing, so that in the region of the plug, the circuit board is exposed with the plug contacts. The remainder of the printed circuit board may, for example, be completely covered by the housing.

In accordance with at least one embodiment, the first optoelectronic component and / or further components are cast in a form-fitting manner with the housing. In particular, the housing is then in direct contact with the components and / or the circuit board. The housing may be, for example, transparent, in particular clear, for a radiation emitted or received by the optoelectronic components.

According to at least one embodiment, the printed circuit board in plan view of the top and / or bottom of a rectangular shape with two opposite longitudinal edges and two opposite transverse edges. The housing is preferably applied to the circuit board such that the housing does not border on the transverse edges, but is retracted laterally relative to the transverse edges. Areas around the transverse edges are thus free of the housing. The housing-free area at the one transverse edge then forms, for example, the plug, the opposite housing-free area at the other transverse edge forms, for example, a mounting area of the plug-in module for mounting on an external support. Furthermore, the housing preferably adjoins the longitudinal edges and terminates flush with both longitudinal edges. This arrangement of the housing may be on the top and / or bottom.

In accordance with at least one embodiment, the housing has a cavity in which the first optoelectronic component is arranged. The cavity is, for example, a hole or a recess in the housing and extends from one of the circuit board side facing away from the housing completely to the circuit board. Due to the cavity, the first optoelectronic component is not covered by the housing in plan view of the upper side of the printed circuit board. In this way, despite the housing, radiation can pass to or from the first optoelectronic component.

It is also possible for a plurality of optoelectronic components, for example a plurality of light-emitting diodes of different colors, to be arranged in the cavity so that all the optoelectronic components in the cavity are not covered by the housing in a plan view of the upper side of the printed circuit board. Preferably, all other components, for example, all non-radiation emitting or absorbing components, form-fitting transformed from the housing and encapsulated.

In accordance with at least one embodiment, the housing is reflective for one emitted by the first optoelectronic component or received electromagnetic radiation. Reflective in this context means that the housing has a reflectivity of at least 80% or at least 85% or at least 90%, wherein the reflectivity is measured, for example, at a wavelength at which the optoelectronic component has a maximum in the emission or absorption. For example, the housing has a white or black plastic or consists thereof. A reflective coating on the housing, for example in the region of the cavity, is also conceivable.

In accordance with at least one embodiment, the printed circuit board has at least one hole which extends from the upper side to the lower side of the printed circuit board. In the hole, the housing is arranged and fills the hole partially or completely. Preferably, the housing is then arranged both on the top and the bottom. About the hole, the housing can be connected on the top with the housing on the bottom. For example, the housing on the top and the housing on the bottom are formed integrally over the hole. The arrangement of the housing in the hole can prevent a vertical detachment of the housing from the top and bottom.

According to at least one embodiment, a heat sink is mounted on the top and / or bottom of the circuit board. The heat sink can comprise or consist of, for example, Cu or Al or an alloy of these metals. It is also conceivable that the heat sink is a steel sheet. The heat sink may have fins or fins.

In accordance with at least one embodiment, the plug-in module has a plurality, for example at least two or three or four, of optoelectronic components in the form of light-emitting diodes.

In accordance with at least one embodiment, the LEDs emit light of different colors during operation. For example, a first light emitting diode emits red light, a second light emitting diode green light and a third light emitting diode blue light. The light of the different light-emitting diodes can be mixed when exiting the plug-in module, so that mixed light, such as white light, is emitted.

In accordance with at least one embodiment, the plug-in module has an integrated circuit for controlling the light-emitting diodes. The integrated circuit is arranged, for example, on the underside of the circuit board. The integrated circuit may be a programmable chip with data processing interfaces. Alternatively, the integrated circuit can also be a preprogrammed chip, a so-called application-specific integrated circuit, or ASIC for short. The integrated circuit has, for example, an internal data memory. The integrated circuit allows user-defined settings to be made on the LEDs, so that, for example, depending on the user of the plug-in module, different color shades and / or different brightnesses are emitted by the plug-in module.

In addition, a lighting arrangement, in particular for the interior of a vehicle cabin, specified. The lighting arrangement comprises at least one optoelectronic plug-in module as stated above. That is, all disclosed in connection with the optoelectronic cartridge module features are also disclosed for the lighting arrangement and vice versa.

In accordance with at least one embodiment, the lighting arrangement comprises at least one connection socket in addition to the at least one optoelectronic plug-in module. The plug of the plug-in module is plugged into the socket so that the plug-in module is electrically contacted via the socket. The socket comprises contact elements which are in direct mechanical and electrical contact with the plug contacts of the plug. The connection socket can be part of a supply unit for the electrical supply of the plug-in module. The connection socket can also be connected to a computer, for example, so that the connection socket is an interface between the plug-in module and the computer, via which data and information can be exchanged between the computer and the plug-in module. By means of the contact elements of the connection socket, in addition to electrical currents, data can also be transmitted.

In addition to an electrical contact, the socket can also contribute to a mechanical stabilization of the plug-in module. For example, the lighting arrangement of connection socket and plug-in module can be self-supporting.

According to at least one embodiment, the lighting arrangement is mechanically stable and permanently fixed in the intended use in a vehicle interior trim. Preferably, therefore, the lighting device does not detach itself from the vehicle interior trim. The mechanically stable and permanent attachment is preferably non-destructively detachable, so that the lighting arrangement can be repeatedly removed or replaced, for example, for reprogramming.

In accordance with at least one embodiment, the lighting arrangement is covered by the vehicle interior trim and is not freely accessible to the vehicle occupant. In particular, the vehicle interior trim from the vehicle cabin completely covers the lighting arrangement. In the region of the first optoelectronic component of the plug-in module, the vehicle interior trim can have a window, for example in the form of a glass pane, through which light can enter the vehicle cabin. A light emitted by the plug-in module can also be directed into the vehicle cabin via a light guide, for example via optical fibers.

In accordance with at least one embodiment, the illumination arrangement illuminates the vehicle interior during normal operation.

It is also possible for a plurality of the plug-in modules or lighting arrangements to be connected to one another in a supply and / or data string. Several plug-in modules or lighting arrangements can in particular form a common lighting area, for example in the roof of a vehicle. The lighting arrangements described here can also serve, for example, for illuminating doors, such as car doors, or ignition locks or seats. Depending on the user or driver, an individual illumination, for example an individual illumination color or illumination brightness, is then preferably adjustable.

In the following, an optoelectronic plug-in module described here and an optoelectronic lighting arrangement described here will be explained in more detail with reference to drawings on the basis of exemplary embodiments. The same reference numerals indicate the same elements in the individual figures. However, no scale relationships are shown; Rather, individual elements may be exaggerated in size for better understanding.

Show it:

1A and 1B Embodiments of an optoelectronic plug-in module in lateral cross-sectional view and in plan view,

2A to 5B Embodiments of an optoelectronic illumination arrangement in lateral cross-sectional view and in plan view,

6 an embodiment of a lighting arrangement in the interior of a vehicle cabin.

In the embodiment of 1A is an optoelectronic plug-in module 100 shown in side cross-sectional view. To recognize is a circuit board 1 , which is formed, for example, as a metal core board with a metal core and dielectric regions. Inside the circuit board 1 run tracks 12 for power distribution along the circuit board 1 , The tracks 12 consist for example of Cu or Al. On a top 10 the circuit board 1 are several optoelectronic components 20 applied in the form of light emitting diodes. Also on the top 10 the circuit board 1 arranged are surface mount components 22 , for example in the form of resistors or capacitors. On one of the top 10 opposite bottom 11 the circuit board 1 are other surface mount components 22 as well as an integrated circuit 21 arranged. The integrated circuit 21 is used, for example, to control the LEDs 20 and for storing data. The integrated circuit 21 may be, for example, a programmable computer or a preprogrammed microcontroller.

The components 21 . 22 on the bottom 11 are with the components 20 . 22 on top over vias 13 through the circuit board 1 electrically connected.

The optoelectronic components 20 as well as the other components 21 . 22 on the circuit board 1 are with a housing 5 encapsulated, which encloses all components on the top and bottom completely and form-fitting and is in direct contact with them. In the case 5 it can be a potting, such as a Silikonverguss act. The housing 5 is preferably transparent or clear-sighted for one of the light-emitting diodes 20 emitted electromagnetic radiation.

An edge area of the printed circuit board 1 is free from the housing 5 , This edge area of the circuit board 1 forms a plug 3 , In the area of the plug 3 are the tracks 12 on top 10 and bottom 11 the circuit board 1 guided and form there exposed plug contacts 30 . 31 , About the plug contacts 30 . 31 can the plug-in module 100 be contacted electrically. Also, the plug contacts 30 . 31 for data transmission between plug-in module 100 and a computer or higher-level control unit, such as a master controller.

In 1B is a top view on the top 10 of the optoelectronic plug-in module 100 of the 1A shown. A total of three optoelectronic components can be seen 20 in the form of light-emitting diodes. In operation, the three LEDs emit, for example, light of different colors, such as red and green and blue light. By the mixture of the three light emitting diodes 20 emitted radiation can be emitted, for example, during operation white light. It can also be seen that the conductor tracks 12 at least partially on the top 10 run and the optoelectronic devices 20 with other electronic components 22 connect.

In the area of the plug 3 In addition, it can be seen that the conductor track 12 is wider and on top 10 is guided. There forms the exposed conductor track 12 a first plug contact 30 , Also indicated is a lateral next to the first plug contact 30 arranged second plug contact 31 standing on the bottom 11 the circuit board 1 is arranged. Also the second plug contact 31 is through a track 12 formed on the bottom 11 is guided. The first plug contact 30 and the second plug contact 31 overlap in plan view on the top 10 Not.

In a the plug 3 at the top 10 opposite area of the circuit board 1 is the circuit board 1 also free from the housing 5 ,

In the embodiments of the 2A and 2 B is a lighting arrangement 1000 shown in side cross-sectional view and in plan view. The lighting arrangement 1000 includes the plug-in module 100 the previous one 1A . 1B , In addition, the lighting arrangement comprises a connection socket 4 , The connection socket 4 forms the counterpart to the plug 3 of the plug-in module 100 , Furthermore, the connection socket includes 4 a first contact element 40 and a second contact element 41 , wherein the first contact element 40 at the top 10 in direct contact with the first plug contact 30 is and the second contact element 41 on the bottom 11 in direct contact with the second plug contact 31 is. In the case of the preferably metallic contact elements 40 . 41 These are terminal contacts which are inserted when the plug is inserted 3 into the connection socket 4 be pressed apart and due to spring forces on the plug contacts 30 . 31 be pressed on.

In the 3A and 3B Again, embodiments of lighting arrangements 1000 shown in side cross-sectional view and top view. The lighting arrangement 1000 of the 3 differs from the lighting arrangement 1000 of the 2 only with regard to the optoelectronic plug-in module 100 , In contrast to 2 is on the circuit board 1 no transparent housing 5 applied. Rather, the case 5 in 3 for those of the light emitting diodes 20 emitting electromagnetic radiation reflecting. Furthermore, the housing has 5 a cavity 51 on, in which the light-emitting diodes 20 are arranged. In the plan view of 3B it can be seen that the light-emitting diodes 20 not from the case 5 are covered.

The cavity 51 is also with a transparent potting 52 refilled. It can be the casting 52 also converter particles for converting the light-emitting diodes 20 have emitted radiation.

Next is in 3A to recognize that the circuit board 1 holes 15 which extends from the top 10 to the bottom 11 extend. The holes 15 are with the case 5 filled up, so over the holes 15 that on the top 10 arranged housing 5 with the one on the bottom 11 arranged housing 5 mechanically connected. In particular, the housing 5 on the top 10 and the case 5 on the bottom 11 integrally formed. In this way, a vertical or lateral detachment of the housing 5 from the circuit board 1 prevented.

The embodiment of the lighting arrangement 1000 of the 4 corresponds substantially to the embodiment of 3 , Additionally is in 4 however, to recognize that the plug-in module 100 fasteners 16 and mounting elements 17 having. The connecting elements 16 serve for the mechanically stable, permanent and non-destructive detachable connection of the plug-in module 100 with the connection socket 4 , The mounting elements 17 serve for permanent, mechanically stable and non-destructive detachable connection of the entire optoelectronic module assembly 1000 on a carrier 6 , The connecting elements 16 and the mounting elements 17 are in areas of the circuit board 1 formed, not from the housing 5 are covered. For example, the connecting elements 16 and the mounting elements 17 on in the lateral direction opposite edge regions of the circuit board 1 educated.

In the embodiment of 4 are both the fasteners 16 as well as the mounting elements 17 in the form of holes or holes through the circuit board 1 educated. The connection socket 4 has clamping elements that when inserting the plug-in module 100 into the connection socket 4 at least partially into the connection holes 16 penetrate and get stuck there. In this way, an independent detachment of the plug-in module 100 from the connection socket 4 prevented.

For applying the lighting arrangement 1000 on the carrier 6 instructs the wearer 6 For example, a screw on through the mounting hole 17 can be carried out. About a screw, for example with the help of a mother, the lighting arrangement 1000 then permanently and mechanically stable on the carrier 6 be attached.

The embodiment of 5 again corresponds in essence to the embodiment of 3 , Unlike in 3 is the reflective case 5 in 5 however only on the top 10 the circuit board 1 applied. On the bottom 11 is a heat sink 7 , For example, in the form of a steel sheet, arranged. The heat sink 7 serves for effective removal of the components 20 . 21 . 22 generated heat during operation.

In the embodiment of 6 is a lighting arrangement 1000 shown, which is used for the interior lighting of a vehicle cabin. The lighting arrangement 1000 corresponds to the lighting arrangement 1000 of the 4 , But it is also any other of the discussed embodiments for lighting arrangements 1000 conceivable. It is the lighting arrangement 1000 mechanically stable, durable and non-destructively detachable with a vehicle interior trim 6 connected inside the vehicle cabin. In the present case is the lighting arrangement 1000 arranged in the sky of the vehicle cabin. From the perspective of the occupant in the vehicle cabin is the lighting arrangement 1000 completely from the vehicle interior paneling 6 covered. For this purpose, the vehicle interior lining 6 For example, a window over which the radiation generated by the illumination arrangement can enter the vehicle cabin.

The invention is not limited by the description based on the embodiments of these. Rather, the invention encompasses any novel feature as well as any combination of features, including in particular any combination of features in the claims, even if these features or this combination itself is not explicitly stated in the patent claims or exemplary embodiments.

LIST OF REFERENCE NUMBERS

1

 circuit board

3

 plug

4

 socket

5

 casing

6

 carrier

7

 heatsink

10

Top of the circuit board 1

11

Bottom of the circuit board 1

12

 conductor tracks

13

 via

15

 hole

16

 connecting element

17

 mounting element

20

 optoelectronic component

21

 integrated circuit

22

 electronic component

30

 first plug contact

31

 second plug contact

40

first contact element

41

 second contact element

51

 cavity

52

 grouting

100

 optoelectronic plug-in module

1000

 lighting arrangement

Claims (17)

Optoelectronic plug-in module ( 100 ) comprising: - a printed circuit board ( 1 ) with a top side ( 10 ), a bottom ( 11 ) and printed conductors ( 12 ) for the current distribution along the printed circuit board ( 1 ), - one on the top ( 10 ) of the printed circuit board ( 1 ) mounted first optoelectronic device ( 20 ), via the tracks ( 12 ) is electrically contacted, wherein - an edge region of the printed circuit board ( 1 ) as a plug ( 3 ) for insertion into an electrical connection socket ( 4 ), - the printed conductors ( 12 ) in the area of the plug ( 3 ) on the top ( 10 ) and / or underside ( 11 ) of the printed circuit board ( 1 ) are exposed and there exposed in the non-contacted state, - the exposed tracks ( 12 ) in the area of the plug ( 3 ) as plug contacts ( 30 . 31 ) for external contacting of the plug-in module ( 100 ) via the connection socket ( 4 ), - the main function of the optoelectronic plug-in module ( 100 ) in normal operation is the generation of light or the detection of electromagnetic radiation. Optoelectronic plug-in module according to claim 1, wherein - the first optoelectronic component ( 20 ) is a light-emitting diode or a light-emitting diode chip, - the luminous flux of the optoelectronic plug-in module ( 100 ) is at least temporarily at least 100 lm in operation or the light intensity is at least temporarily at least 10 cd. Optoelectronic plug-in module ( 100 ) according to claim 1 or 2, wherein - the plug contacts ( 30 . 31 ) in the lateral direction parallel to a main extension direction of the printed circuit board ( 1 ) the printed circuit board ( 1 ), - the plug contacts ( 30 . 31 ) in the vertical direction, perpendicular to the lateral direction, flush with the top ( 10 ) and / or the underside ( 11 ) of the printed circuit board ( 1 ) to lock. Optoelectronic plug-in module ( 100 ) according to one of the preceding claims, wherein - one or more first plug contacts ( 30 ) on the top ( 10 ) of the printed circuit board ( 1 ) are arranged One or more second plug contacts ( 31 ) on the bottom ( 10 ) of the printed circuit board ( 1 ) are arranged, - in plan view of the top ( 10 ) of the printed circuit board ( 1 ) the first plug contacts ( 30 ) not with the second plug contacts ( 31 ) overlap. Optoelectronic plug-in module ( 100 ) according to one of claims 1 to 3, wherein all plug contacts ( 30 . 31 ) of the plug-in module ( 100 ) exclusively on the top ( 10 ) or the underside ( 11 ) of the printed circuit board ( 1 ) are arranged. Optoelectronic plug-in module ( 100 ) according to one of the preceding claims, wherein - the printed circuit board ( 1 ) in the area of the plug ( 3 ) at least one connecting element ( 16 ) for mechanically stable, permanent and non-destructive detachable connection with the connector ( 4 ), - the printed circuit board ( 1 ) at least one mounting element ( 17 ) for mechanically stable, permanent and non-destructive detachable connection of the plug-in module ( 100 ) on an external carrier ( 6 ) having. Optoelectronic plug-in module ( 100 ) according to one of the preceding claims, wherein - on the printed circuit board ( 1 ) next to the first optoelectronic component ( 20 ) one or more further optoelectronic or electronic components ( 21 . 22 ) are applied, which via the conductor tracks ( 12 ) are electrically contacted, - at least one of the further components ( 21 . 22 ) on the bottom ( 11 ) of the printed circuit board ( 1 ), - the one or more components ( 21 . 22 ) are selected from the following group of components: light-emitting diode, laser diode, integrated circuit for controlling the first optoelectronic component ( 20 ) and / or other components, RFID transponder, RFID reader, protection diode, photodetector, capacitor, coil, sensor, resistor. Optoelectronic plug-in module ( 100 ) according to the preceding claim, wherein - the conductor tracks ( 12 ) from the plug contacts ( 30 . 31 ) to at least one component ( 20 . 21 ) and are integrally formed, - a thickness of the plug ( 3 ) the thickness of the printed circuit board ( 1 ) between top ( 10 ) and underside ( 11 ), - the circuit board ( 1 ) is between 0.2 mm and 2 mm thick, inclusive. Optoelectronic plug-in module ( 100 ) according to claim 7 or 8, wherein the component or components ( 20 . 21 . 22 ) on the top ( 10 ) with the component or components ( 21 . 22 ) on the bottom ( 11 ) via one or more vias ( 13 ) are electrically connected. Optoelectronic plug-in module ( 100 ) according to one of the preceding claims, wherein - the printed circuit board ( 1 ) is a metal core board having a metal core and a dielectric for electrical insulation of the metal core, - the dielectric is an inorganic dielectric. Optoelectronic plug-in module ( 100 ) according to the preceding claim, wherein - the dielectric comprises or consists of one or more metal oxides of the oxidized metal of the metal core, - the dielectric strength of the dielectric is at least 10 kV / mm, - the thermal conductivity of the dielectric is at least 4 W / ( m · K). Optoelectronic plug-in module ( 100 ) according to one of the preceding claims, further comprising a housing ( 5 ), which is on the top ( 10 ) and / or underside ( 11 ) of the printed circuit board ( 1 ), wherein - the plug ( 3 ) free from the housing ( 5 ), - the first optoelectronic component ( 20 ) and / or further components ( 21 . 22 ) in a form-fitting manner with the housing ( 5 ) are shed. Optoelectronic plug-in module ( 100 ) according to the preceding claim, wherein - the housing ( 5 ) a cavity ( 51 ), in which the first optoelectronic component ( 20 ), - the housing ( 5 ) reflective to one of the first optoelectronic device ( 20 ) emitted or received electromagnetic radiation. Optoelectronic plug-in module ( 100 ) according to one of claims 12 or 13, wherein - the printed circuit board ( 1 ) at least one hole ( 15 ) extending from the top ( 10 ) to the bottom ( 11 ), - the housing ( 5 ) in the hole ( 15 ) is arranged. Optoelectronic plug-in module ( 100 ) according to any one of the preceding claims, wherein at the bottom ( 11 ) and / or at the top ( 10 ) of the printed circuit board ( 1 ) a heat sink ( 7 ) is attached. Optoelectronic plug-in module ( 100 ) according to one of the preceding claims, wherein the plug-in module ( 100 ) a plurality of optoelectronic components ( 20 ) in the form of light-emitting diodes, wherein - the light-emitting diodes emit light of different colors, - the plug-in module ( 100 ) an integrated circuit ( 21 ) for controlling the light-emitting diodes. Lighting arrangement ( 1000 ) for the interior of a vehicle cabin, comprising: - at least one plug-in module ( 100 ) according to one of the preceding claims, - at least one connection socket ( 4 ), where - the plug ( 3 ) of the plug-in module ( 100 ) into the connection socket ( 4 ) is plugged in so that the plug-in module ( 100 ) electrically via the connection socket ( 4 ), - the lighting arrangement ( 1000 ) in a vehicle interior trim ( 6 ) is mechanically stable and permanently fixed, - the lighting arrangement ( 1000 ) of the vehicle interior trim ( 6 ) and not freely accessible to vehicle occupants, - in normal operation, the lighting arrangement ( 1000 ) illuminates the vehicle interior.

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