DE102015108639A1 - Method and device for processing thin glasses - Google Patents

Abstract

The invention relates to a composite (4) with a glass carrier (3) and a glass film (1) or a silicon wafer (2), wherein the glass film (1) or the silicon wafer (2) has a thickness of at most 400 .mu.m, particularly preferably less than the glass carrier (3) has a greater thickness than the glass sheet (1) or the silicon wafer (2), wherein the glass sheet (1) or the silicon wafer (2) adheres to the glass carrier (3), and wherein the Surface (30) of the glass carrier (3) is structured so that the between the two surfaces (10, 30) formed contact surface is smaller than the glass carrier (3) facing surface (10) of the glass sheet (1) or the silicon wafer (2) and the composite (4) has at least one cavity (34) through the structuring of the glass carrier (3), which delimits the glass film (1) or the silicon wafer (2) by the surface (10) facing the glass carrier (3) becomes.

Description

The invention relates generally to the processing and handling of thin glass sheets. More particularly, the invention relates to the handling of very thin glass sheets, such as substrates for thin film processes or microelectronic components, and the handling of silicon wafers for the fabrication of electronic or microelectronic components.

In microelectronics thin and ultrathin substrates are needed for various applications. These are today manufactured on the basis of monocrystalline silicon. The production processes for the high-purity silicon and the necessary processes for thinning the wafers are complicated and expensive. Here, glass offers a high quality and cost effective alternative. Glass can now be produced by direct melting in thicknesses of 100 μm and below. Today, thicknesses of 30μm, 50μm and 100μm are already offered as standard. These glasses have a fire-polished finish on both sides and meet the highest demands in terms of TTV (Total Thickness Variation) and surface roughness. If required, the glass can also be adapted to the technical requirements by selecting the glass type in terms of the expansion coefficient and, due to the manufacturing process, is significantly better scalable than monocrystalline silicon.

The US 6,735,982 B2 describes a method for processing relatively thin glass sheets. According to this method, the glass sheets are electrostatically charged and placed on an oppositely charged carrier disk. After processing, the carrier disk is removed. The processed glass pane may be, for example, the front window of an electronic display. The thickness of the glass is 0.5 millimeters.

From the US 2012/0040211 A1 For example, a glass film for lithium-ion batteries is known which has a thickness of 300 μm or less and a surface roughness Ra of 100 Å or less.

For thin glasses therefore arise a variety of applications, such as the fabrication of miniaturized semiconductor elements on glass or the production of thin-film batteries. However, the problem here is generally the handling of these thin glasses, especially if the glass substrates have a size suitable for mass production. The glass films behave comparatively like thin plastic films and are only dimensionally stable.

The WO 2014/179137 A1 describes a method in which a thin glass is held on a support. The thin glass is scribed and the glass is heated with the support with a temperature gradient extending from the edge of the support towards the center. Due to the voltage caused by the temperature gradient, the thin glass is separated at the scribe. However, the separate parts of the thin glass are still connected to the carrier. There is therefore the problem of safely detaching these parts from the carrier.

The invention is therefore based on the object to enable safe processing even of very thin glasses. This object is solved by the subject matter of the independent claims. Advantageous developments of the invention are specified in the respective dependent claims.

The invention will be explained in more detail below with reference to the accompanying figures. In the figures, like reference numerals designate like or corresponding elements.

Show it:

1 to 6 based on a composite with a glass sheet and a glass substrate or alternatively instead of the glass sheet with a silicon wafer process steps according to an embodiment of the method according to the invention, wherein the 2 and 3 Variants of in 1 are shown composite,

6 a variant of in 1 represented composite with a coating on a glass sheet or on a silicon wafer,

7 and 8th , one glass carrier each with a structured surface,

9 a composite with a glass substrate having a structured surface and a glass film or silicon wafer fixed thereon,

10 a variant of in 9 shown embodiment with the surfaces of the glass carrier connecting channels,

11 a further education in 10 shown embodiment,

12 a composite in which the glass sheet is separated into individual glass sheet elements or in which the silicon wafer is separated into individual silicon wafer elements,

13 dissolving glass sheet elements or silicon wafer elements by heating a fluid,

14 and 15 two embodiments with scribed glass foils or scribed silicon wafers,

16 a further education in 14 and 15 shown examples with arranged between the scratches cavities.

The inventive method is based on the use of very thin and at the same time in relation to the thickness of large glass sheets to use a glass substrate to improve the handling, on which the glass sheet is attached by adhesion forces. The method is also suitable to separate the glass sheet and the glass substrate after the process again. The glass sheet will not be damaged if the adhesion forces are adjusted properly and / or there are means to supply the mechanical forces to overcome the adhesion forces at a suitable location. A particular problem is that processing steps, such as the deposition of coatings, can also affect the adhesion forces. This should be done during processing, neither premature detachment, nor should the processing at high temperature cause the connection between the glass sheet and glass substrate is so strong that a non-destructive detachment of the glass sheet is no longer possible.

Instead of a glass sheet, according to an alternative embodiment, a silicon wafer, which is formed in particular from monocrystalline silicon, is bonded to the glass carrier and further processed.

Generally, the invention relates to a composite of thin brittle-hard materials.

The 1 to 6 show by way of example individual steps of an embodiment of the method according to the invention, and a composite of glass carrier according to the invention 3 and glass sheet 1 or alternatively instead of the glass sheet 1 with a silicon wafer 2 ,

• – eine Glasfolie 1 oder ein Siliziumwafer 2 mit einer Dicke von höchstens 400 µm (Mikrometern), vorzugsweise weniger als 145 µm (Mikrometern) und einer lateralen Abmessung von zumindest 5cm entlang einer Richtung bereitgestellt und
• – die Glasfolie 1 oder der Siliziumwafer 2 auf einem Glasträger 3 befestigt wird, welcher eine größere Dicke als die Glasfolie 1 oder der Siliziumwafer 2 aufweist. Dabei weisen die Glasfolie 1 oder der Siliziumwafer 2 und der Glasträger 3 den gleichen oder geringfügig abweichenden Ausdehnungskoeffizienten (CTE) auf, was man in der Regel erreicht, indem man für die Glasfolie und den Glasträger die gleiche oder nur geringfügig abweichende Glaszusammensetzung verwendet.

The method for further processing thin glasses according to the invention is based on that

• - a glass slide 1 or a silicon wafer 2 provided with a thickness of at most 400 μm (microns), preferably less than 145 μm (microns) and a lateral dimension of at least 5cm along one direction and
• - the glass sheet 1 or the silicon wafer 2 on a glass slide 3 is attached, which has a greater thickness than the glass sheet 1 or the silicon wafer 2 having. This show the glass sheet 1 or the silicon wafer 2 and the glass carrier 3 the same or slightly different coefficients of expansion (CTE), which is usually achieved by using the same or only slightly different glass composition for the glass sheet and the glass substrate.

Instead of a same composition of glass film and glass carrier may optionally also a slightly different composition of glass sheet and glass substrate may be used to facilitate the detachment. In this case, it can be provided, in particular, that at least one of the glass components differs by at least 0.1% by weight of the content stated in percent by weight and the deviation of all the main glass components, that is to say such glass components with a proportion of greater than 5% by weight on the Composition, not greater than 5%. This advantageously leads to slightly different chemical and in particular slightly different physical properties, such as with respect to the van der Waals interactions.

The glass sheet 1 or the silicon wafer 2 is according to an aspect of the invention on the glass slide 3 fixed by wringing. This results in a direct adhesive adhesion of the superimposed surfaces of glass sheet and glass substrate or silicon wafer and glass substrate. In particular, no adhesives or synthetic resins are used.

In this method, usually two glass surfaces with high flatness and low surface roughness are brought together. The molecular interaction between the two surfaces creates the adhesion force that the glass sheet 1 on the glass carrier 3 or alternatively the silicon wafer 2 on the glass carrier 3 attached.

The adhesive forces are adjusted when wringing so that a detachment of the glass sheet from the glass substrate after the process is possible without damaging the glass sheet. The same applies alternatively to the use of a silicon wafer.

• 1. Herstellung der Gläser mit feuerpolierten Oberflächen,
• 2. Erniedrigung der Oberflächenrauhigkeit zum Beispiel durch Polieren der Oberflächen mit Poliermitteln (z.B. Ceroxid),
• 3. Reinigung der Glasoberflächen mit Reinigungsmitteln und/oder reinem oder hochreinem Wasser,
• 4. Ultraschall- oder Megaschallreinigung des Glases oder
• 5. Anwendung alternativer Trockenreinigungsverfahren zur Abreinigung von Partikeln größer 0,2 µm,
• 6. Plasmareinigung,
• 7. Flammreinigung, insbesondere durch Flammpyrolyse,
• 8. Reinigung oder Oberflächenkonditionierung durch Ätzen,
• 9. Aufbringen von elektrischen Ladungen,
• 10. Aufbringen einer Beschichtung, insbesondere von anorganischen Schichten, wie Metallschichten, Oxidschichten, Stickstoffverbindungen, Graphitschichten oder Graphenschichten, bevorzugt als Schichten oder Zwischenschichten aus Siliziumnitrid (SiN), Silizium-Halbleiterschichten, Chromschichten, Aluminiumschichten und/oder Schichten aus Bornitrid (BN). Diese Schichten können mittels CVD, PCVD, Solgelverfahren oder Spraycoating aufgebracht werden,
• 11. Strukturierung der Substratträgeroberfläche des Glasträgers,
• 12. Applikation von Druckkräften zum Anpressen der Gläser,
• 13. Einstellen von gleichen Temperaturverhältnissen beim Ansprengen zur Vermeidung von Spannungen,
• 14. Tempern der Glasscheiben nach dem Ansprengen zur Erhöhung der Adhäsionskräfte, maximal auf eine Temperatur 30 °C unterhalb von T_g.

Adhesion forces can be adjusted by the following measures:

• 1. Preparation of the glasses with fire polished surfaces,
• 2. lowering the surface roughness, for example by polishing the surfaces with polishing agents (eg cerium oxide),
• 3. cleaning the glass surfaces with cleaning agents and / or pure or ultrapure water,
• 4. Ultrasonic or megasonic cleaning of the glass or
• 5. Application of alternative dry cleaning methods for cleaning particles larger than 0.2 μm,
• 6. plasma cleaning,
• 7. flame cleaning, in particular by flame pyrolysis,
• 8. cleaning or surface conditioning by etching,
• 9. application of electrical charges,
• 10. Application of a coating, in particular of inorganic layers, such as metal layers, oxide layers, nitrogen compounds, graphite layers or graphene layers, preferably as layers or intermediate layers of silicon nitride (SiN), silicon semiconductor layers, chrome layers, aluminum layers and / or layers of boron nitride (BN). These layers can be applied by means of CVD, PCVD, sol gel method or spray coating,
• 11. structuring the substrate carrier surface of the glass carrier,
• 12. Application of compressive forces for pressing the glasses,
• 13. Setting equal temperature conditions when wringing to avoid stress,
• 14. Annealing the glass sheets after wringing to increase the adhesive forces, at a maximum temperature of 30 ° C below T _g .

The layer thickness of the coating is preferably set between 1 nm and 150 nm, wherein the adhesion force can be set as a function of the layer thickness, i. For example, the adhesion force tends to be lower for thinner metal layers than for larger or thicker metal layers. As a result, different forces can be set on a glass carrier. Thus, in particular in the edge region of the glass carrier to facilitate the removal of a smaller force can be adjusted.

Graphite layers are particularly suitable as antiadhesion layers.

According to one embodiment of the invention, the direct adhesive connection can also take place through the intermediary of a liquid. In the case of glasses, in particular water or, in particular, aqueous salt solutions are suitable for this purpose. The liquid on one or both surfaces is displaced during wringing and the surfaces adhere to each other directly adhesively here, whereby partially on remaining intermediately stored molecules of the liquid, the van der Waals forces that connect the two parts are transmitted.

1 shows the composite 4 from glass carrier 3 and applied glass foil 1 in cross section. The surface 10 opposite surface 11 the glass sheet 1 is free and can now be edited. For example, on the surface 11 now coatings are deposited.

The glass sheet 1 is further processed after wringing. This further processing may in particular also comprise a processing step at elevated temperatures. This particularly applies to temperatures above 200 ° C, especially above 300 ° C. The connection of surfaces adhering directly to each other 10 . 30 is in contrast to organic adhesives insensitive to such processing steps at high temperatures.

Alternatively, when using a silicon wafer 2 also the silicon wafer 2 be further processed after wringing, wherein particularly preferably to a temperature above 400 ° C or very particularly preferably to a temperature above 500 ° C is heated. In accordance with a further embodiment of the invention, it is also possible to carry out the further processing at room temperature or, more generally, at temperatures below 100 ° C.

According to one embodiment of the invention, the glass sheet 1 or the glass carrier 3 or both glass sheet 1 , as well as glass carrier 3 be biased. Especially with the thin glass thicknesses of the glass foil 1 suitable for this purpose is a chemical bias. The 2 and 3 show variants of the in 1 shown example. At the in 2 Example shown is a chemically tempered glass sheet 1 on the glass slide 3 fixed. Due to the chemical prestressing are on the surfaces 10 . 11 Compressive stress zones 12 educated. At the in 3 Example shown is a chemically tempered glass carrier 3 used. Accordingly, at its opposite surfaces 30 . 32 Compressive stress zones 300 available. Due to the larger glass thickness of the glass carrier 3 can the bias of the glass carrier 3 higher and / or the depth of the bias zones 300 be chosen larger than the glass sheet 1 , Optionally, the glass carrier 3 due to the greater thickness also be thermally biased.

Both embodiments can be combined with each other, so that a composite with a chemically tempered glass sheet 1 and a preferably also chemically tempered glass carrier 3 is obtained. In general, without limitation to the embodiments is accordingly in development of the invention, a composite 4 provided, wherein at least one of the composite glass sheet 1 and glass carrier 3 is biased.

The in 4 and 5 shown cross-section shows the composite 4 with one on the exposed surface 11 the glass sheet 1 deposited coating 5 , The coating may, for example, be a monolayer or multilayer semiconductor layer or also an optical functional layer, such as a dielectric filter layer or anti-reflection layer. The further processing step of depositing a coating 5 may be the step in which, while retaining the adhesive adhesion, the glass sheet 1 is heated to a temperature in a range up to 50 ° C below the glass transition temperature. According to one embodiment of the invention is therefore generally provided that the further processing of the glass sheet, the deposition of a coating 5 includes, wherein the glass sheet 1 is heated when depositing. In general, the method according to the invention is also particularly suitable for further processing steps which are not possible with an adhesive for fixing glasses or only with restrictions. This particularly applies to temperatures above 200 ° C, especially above 300 ° C. In a further development of the method it is therefore provided that at least one further processing step on the composite 4 from glass foil 1 and glass carrier 3 is carried out, wherein, while maintaining the adhesive adhesion, the glass sheet 1 is heated to a temperature in a range of at least 200 ° C, preferably at least 300 ° C.

• – eine Glasfolie 1 oder ein Siliziumwafer 2 mit einer Dicke von höchstens 400 µm, vorzugsweise von weniger als 145 µm und einer lateralen Abmessung von zumindest 5cm entlang einer Richtung bereitgestellt und
• – die Glasfolie 1 oder der Siliziumwafer 2 auf einem Glasträger 3, welcher eine größere Dicke als die Glasfolie 1 oder der Siliziumwafer 2 aufweist, befestigt wird, indem
• – die Glasfolie 1 oder der Siliziumwafer 2 und der Glasträger 3 durch Ansprengen miteinander verbunden werden und ein erfindungsgemäßer Verbund 4 erhalten wird, und
• – nach zumindest einem Weiterverarbeitungsschritt die Glasfolie 1 oder der Siliziumwafer 2 vom Glasträger 3 durch Anwendung einer mechanischen Kraft gelöst wird.

In accordance with one aspect of the invention, therefore, generally without limitation to the illustrated embodiment, there is provided a method of further processing thin glasses in which

• - a glass slide 1 or a silicon wafer 2 provided with a thickness of at most 400 microns, preferably less than 145 microns and a lateral dimension of at least 5cm along one direction and
• - the glass sheet 1 or the silicon wafer 2 on a glass slide 3 which has a greater thickness than the glass sheet 1 or the silicon wafer 2 has, is fixed by
• - the glass sheet 1 or the silicon wafer 2 and the glass carrier 3 be joined together by wringing and a composite according to the invention 4 is obtained, and
• After at least one further processing step, the glass sheet 1 or the silicon wafer 2 from the glass carrier 3 is released by application of a mechanical force.

In general, without limitation to the specifically illustrated embodiments, the further processing can include the production of a layer system for a lithium-based energy storage element. The coating steps can be deposited in a first coating step, the electrically conductive Ableiterschichten for the two electrodes of the energy storage element. In the further manufacturing process, the cathode material is then first deposited on the arrester for the cathode, generally lithium-cobalt oxide LCO. In the next step, the application of a solid electrolyte, for example, an amorphous material from the substances lithium, oxygen, nitrogen and phosphorus is suitable and which is referred to as LiPON. In the next step, an anode material is deposited in such a way that it is in connection with the substrate, the arrester for the anode and the solid electrolyte. The anode material used is in particular metallic lithium. If the two arresters are electrically conductively connected, lithium ions migrate in the charged state through the solid-state ion conductor from the anode to the cathode, which results in a current flow from the cathode to the anode due to the electrically conductive connection of the two arresters. Conversely, in the uncharged state by the application of an external voltage, the migration of ions from the cathode to the anode can be forced, resulting in charging of the battery, or the energy storage element.

Due to the fact that the coefficient of expansion between glass foil 1 or silicon wafers 2 and glass carrier 3 is equal or very similar, can build up at high temperatures, no temperature-induced stresses that premature peeling of the glass sheet 3 or the silicon wafer 2 to lead. In particular, it is provided according to the invention that the difference in the coefficients of linear expansion of the glasses of glass carrier and glass foil or silicon wafer in terms of magnitude less than 0.3 · 10 ^-6 K ^-1 , preferably less than 0.2 · 10 ^-6 K ^-1 . This absolute difference is preferably not exceeded even in a temperature range of 20 ° C to 200 ° C, preferably 20 ° C to 300 ° C. In a particularly preferred embodiment, the difference of the linear expansion coefficients is at least 0.05 × 10 ^-6 K ^-1 .

This measure according to the invention is in contrast to the wringing of glass elements, as it is used for example for processing optical elements. Here, the wringing is used to support optical glass elements, in particular prisms for processing. In order to detach the processed optical element from the carrier, the optical element is heated together with the carrier. Due to the different coefficients of linear expansion, a mechanical stress builds up between the superimposed glass surfaces, which leads to the separation of the glass element from the carrier.

After one or more further processing steps further processing is the glass sheet 1 from the glass carrier 3 or the silicon wafer 2 from the glass carrier 3 solved by applying a mechanical force.

Since the invention facilitates the handling even of large-area glass sheets, larger lateral dimensions than the above-mentioned 5 cm are preferred. In particular, the dimensions can be adapted especially for semiconductor processes to common wafer sizes. In particular, the diameter or side dimensions of the glass carrier 3 thought of at least 150 millimeters.

In general, it is preferred for many applications, such as the manufacture of the above-mentioned components, that the glass sheet 1 preferably after further processing, to obtain individual glass sheet elements by separating portions of the glass sheet. Individual embodiments will be explained in more detail in the course of the following description of the invention. The separation of sections can before, during or after the detachment of the glass sheet 1 from the glass carrier 3 respectively.

The wringing of the glass foil and the glass carrier can be done by charging the surfaces 10 . 30 get supported. The charge of a surface or the reverse polarity charge of both surfaces causes an electrostatic attraction and brings the contact surfaces of glass sheet and glass carrier together for a short time, so that the adhesion forces can form between the two contact surfaces. The adhesion forces subsequently only result from the interaction of the contact surfaces. The electrostatic attraction is then no longer necessary and incidentally no longer present or detectable. The different charges are completely degraded after adhering in a short time.

Furthermore, the waiver of the use of adhesives of any kind that the glass sheets are not contaminated with adhesives after further processing and separation from the glass slide and may need to be cleaned consuming.

Typical deposition processes are carried out in vacuo. Mention may be made of sputtering, vapor deposition or chemical vapor deposition in a low pressure gas atmosphere. Other processing steps besides the layer deposition can be done in a vacuum.

For example, such a step may be an ion implantation in vacuum. Without limiting to the illustrated embodiment, therefore, according to a further development of the invention, it is provided that after the glass foil has been placed on top of each other 1 on the glass substrate at least one further processing step is carried out in a vacuum. The invention offers the advantage here that by the direct adhesive adherence of the two smooth surfaces 10 . 30 an air inclusion between glass foil 1 and glass carrier 3 is avoided.

After further processing can then, as the example of 4 represented, the glass sheet 1 from the glass carrier 3 be detached by applying a mechanical force. In particular, the detachment can be carried out successively by progressive lifting to reduce the required forces. At the in 5 shown example is on the exposed surface a lifter 7 attached, with which the glass sheet 1 is lifted under a slight bend.

• – die über die auf dem Glasträger 3 aufliegende Oberfläche 10 der Glasfolie gemittelte Adhäsionskraft ist so gering, dass für das Ablösen der Glasfolie 1 vom Glasträger 3 eine Ablösekraft von kleiner als 1 Newton pro Zentimeter Länge der Ablöselinie 8 aufgewendet werden muss. Die Ablöselinie 8 ist in 5 eingezeichnet. Es handelt sich hierbei um den linienförmigen Bereich auf der Glasfolie, an welchem beim Biegen und Abziehen der Glasfolie 1 diese sich vom Glasträger 3 trennt. Die initiale Ablösekraft an der Kante kann dabei aber noch deutlich höher liegen, wenn keine Verfahren zum mechanischen oder chemischen Kantenlösen zum Einsatz kommen. Damit andererseits aber auch eine hinreichend feste Haftung vorliegt, um die Glasfolie 1 beim Weiterverarbeiten sicher auf dem Glasträger 3 zu fixieren, beträgt die Ablösekraft vorzugsweise mindestens 0,01 Newton pro Zentimeter Länge der Ablöselinie 8.

As I said hold glass sheet 1 and glass carrier 3 for further processing, even at high temperatures sufficiently tight to each other. In general, it is favorable if, however, the adhesive force is not too great in order to detach the glass sheet 1 from the glass carrier 3 to enable. Here is an inventive composite 4 with a glass carrier 3 and a glass slide 1 a thickness of at most 400 μm, preferably less than 145 μm, characterized by the following features:

• - the ones on the glass carrier 3 overlying surface 10 The adhesion force averaged over the glass sheet is so low that it is necessary to remove the glass sheet 1 from the glass carrier 3 a peel force of less than 1 Newton per centimeter length of the detachment line 8th must be spent. The detachment line 8th is in 5 located. This is the line-shaped area on the glass sheet, on which bending and peeling off the glass sheet 1 these are from the glass carrier 3 separates. The initial detachment force at the edge can be significantly higher if no methods for mechanical or chemical edge release are used. On the other hand, on the other hand, there is a sufficiently strong adhesion to the glass sheet 1 when processing safely on the glass slide 3 to fix, the peel force is preferably at least 0.01 Newton per centimeter of length of the peel line 8th ,

To the composite 4 to provide sufficient stability, it is provided in particular that the glass carrier 3 has a thickness which is at least three times the thickness of the glass sheet 1 is. Furthermore, it is preferred that the composite 4 has a thickness of at least 400 microns. In general, according to an alternative or additional embodiment of the invention, it is advantageous for the thickness of the glass carrier 1 depending on its lateral side dimensions, or in the case of a round glass carrier, to choose from the diameter thereof. To a sufficient mechanical stability, in particular a sufficient rigidity when wringing and peeling the glass sheet 1 On the other hand, it is favorable if, for the thickness d and the longest side dimension S, measured in millimeters, it is favorable for the ratio d ³ / S ^{2/3 to be} within a range of 2 × 10 ^-3 to 14 × 10 ^-3 , preferably 6 × 10 ^-3 to 12 × 10 ^-3 .

The inventive method is particularly suitable for the further processing steps at elevated temperatures. Here, when heated by different thermal expansion coefficients mechanical stresses between glass carrier 3 and glass sheet 1 arise. Therefore, according to a preferred embodiment of the invention for the glass carrier 3 selected a glass, which is in its linear thermal expansion coefficient of the linear coefficient of thermal expansion of the glass sheet 1 differs by a maximum of 0.2 · 10 ^-6 K ^-1 . It especially makes sense for the glass carrier 3 the same glass as for the glass sheet 1 to use, provided that the forming adhesive forces are in the above range, so neither too strong nor too weak.

A suitable group of glasses for the invention, especially here as a material for the glass sheet 1 , as well as for the glass carrier 3 are alkali-free borosilicate glasses. Here, the following composition in weight percent is preferred: component wt% SiO ₂ 58-65 Al ₂ O ₃ 14-25 B ₂ O ₃ 6-10.5 MgO 0-3 CaO 0-9 BaO 3-8 ZnO 0-2

These glasses are also used in the US 2002/0032117 A1 whose content with respect to the glass compositions and glass properties is also fully made the subject of the present application. A glass of this class is marketed with the trade name AF32 by the applicant.

Yet another class of preferred glass types are borosilicate glasses with the following components in weight percent: component wt% SiO ₂ 30-85 B ₂ O ₃ 3-20 Al ₂ O ₃ 0-15 Na ₂ O 3-15 K ₂ O 3-15 ZnO 0-12 TiO ₂ 0.5-10 CaO 0-0.1

One glass of this class of glasses is the Schott Glass D263. The glasses with more precise compositions are also used in the US 2013/207058 A1 whose content with respect to the compositions of the glasses and their properties is fully made the subject of the present application. Accordingly, according to yet another embodiment of the invention, at least one of the elements is glass carrier 3 and glass sheet 1 formed from a glass with the composition given above. Preferably, such a glass is for both the glass carrier 3 , as well as for the glass sheet 1 used.

Both classes of glass are particularly suitable for the production of the thinnest glass films, in particular with thicknesses of less than 145 μm and at the same time smooth surfaces, which enable a good adhesive adhesion. The abovementioned alkali-free borosilicate glass is furthermore also particularly suitable as a substrate for semiconductor production, in particular based on silicon. Due to the alkali-free composition, no alkali ions can diffuse into semiconductor layers deposited on the glass. Also, the linear thermal expansion coefficient is similar to that of silicon.

In order to achieve a not too strong adhesive adhesion, which assists a reliable solubility of the glass sheet, it is favorable according to still another embodiment of the invention to use glasses with a certain hardness. This applies both to the glass carrier 3 , as well as for the glass sheet 1 , If the glasses are comparatively soft, the adhesive adhesion increases. On the other hand, if the glasses are too hard, the adhesion may become too low. According to one embodiment of the invention, preference is given to glasses having a Knoop hardness in the range from 520 to 650.

In the following, further glass compositions are listed, which are suitable for the production of glass sheets with a thickness of at most 400 .mu.m, more preferably less than 145 .mu.m and for an adhesive mounting on a glass substrate, in particular a glass substrate made of the same glass.

Embodiment 1

The composition of the glass for both the glass sheet 1 , as well as for the glass carrier 3 is exemplified by the above-mentioned composition in wt .-%: SiO ₂ 30 to 85 B ₂ O ₃ 3 to 20 Al ₂ O ₃ 0 to 15 Na ₂ O 3 to 15 K ₂ O 3 to 15 ZnO 0 to 12 TiO ₂ 0.5 to 10 CaO 0 to 0.1

Embodiment 2

The composition of the glass for glass film 1 and / or glass slides 3 is further exemplified by the following composition in wt .-%, which has already been indicated above: SiO ₂ 58 to 65 B ₂ O ₃ 6 to 10.5 Al ₂ O ₃ 14 to 25 MgO 0 to 3 CaO 0 to 9 BaO 3 to 8 ZnO 0 to 2, in addition, the sum of the content of MgO, CaO and BaO is characterized by being in the range of 8 to 18 wt%.

Embodiment 3

The composition of the glass for glass film 1 and / or glass slides 3 is further exemplified by the following composition in wt .-%: SiO ₂ 55 to 75 Na ₂ O 0 to 15 K ₂ O 2 to 14 Al ₂ O ₃ 0 to 15 MgO 0 to 4 CaO 3 to 12 BaO 0 to 15 ZnO 0 to 5 TiO ₂ 0 to 2

Embodiment 4

A possible glass for glass foil 1 and / or glass slides 3 is further exemplified by the following composition in weight percent: SiO ₂ 61 B ₂ O ₃ 10 Al ₂ O ₃ 18 MgO 2.8 CaO 4.8 BaO 3.3

With this composition, the following properties of the glass are obtained: α (20-300) 3.2 · 10 ^-6 / K Tg 717 ° C density 2.43 g / cm ³

Embodiment 5

Another glass for glass film 1 and / or glass slides 3 is exemplified by the following composition in weight percent: SiO ₂ 64.0 B ₂ O ₃ 8.3 Al ₂ O ₃ 4.0 Na ₂ O 6.5 K ₂ O 7.0 ZnO 5.5 TiO ₂ 4.0 Sb ₂ O ₃ 0.6 Cl ^- 0.1

With this composition, the following properties of the glass are obtained: α (20-300) 7.2 · 10 ^-6 / K Tg 557 ° C density 2.5 g / cm ³

Embodiment 6

Another glass for glass film 1 and / or glass slides 3 is exemplified by the following composition in weight percent: SiO ₂ 69 +/- 5 Na ₂ O 8 +/- 2 K ₂ O 8 +/- 2 CaO 7 +/- 2 BaO 2 +/- 2 ZnO 4 +/- 2 TiO ₂ 1 +/- 1

With this composition, the following properties of the glass are obtained: α (20-300) 9.4 · 10 ^-6 / K Tg 533 ° C density 2.55 g / cm ³

Embodiment 7

Another glass for glass film 1 and / or glass slides 3 is exemplified by the following composition in weight percent: SiO ₂ 80 +/- 5 B ₂ O ₃ 13 +/- 5 Al ₂ O ₃ 2.5 +/- 2 Na ₂ O 3.5 +/- 2 K ₂ O 1 +/- 1

With this composition, the following properties of the glass are obtained: α (20-300) 3.25 x 10 ^-6 / K Tg 525 ° C density 2.2 g / cm ³

Embodiment 8

Another glass for glass film 1 and / or glass slides 3 is exemplified by the following composition in weight percent: SiO ₂ 62.3 Al ₂ O ₃ 16.7 Na ₂ O 11.8 K ₂ O 3.8 MgO 3.7 ZrO ₂ 0.1 CeO ₂ 0.1 TiO ₂ 0.8 As ₂ O ₃ 0.7

With this composition, the following properties of the glass are obtained: α (20-300) 8.6 · 10 ^-6 / K Tg 607 ° C density 2.4 g / cm ³

Embodiment 9

Another glass for glass film 1 and / or glass slides 3 is exemplified by the following composition in weight percent: SiO ₂ 62.2 Al ₂ O ₃ 18.1 B ₂ O ₃ 0.2 P ₂ O ₅ 0.1 Li ₂ O 5.2 Na ₂ O 9.7 K ₂ O 0.1 CaO 0.6 SrO 0.1 ZnO 0.1 ZrO ₂ 3.6

With this composition, the following properties of the glass are obtained: α (20-300) 8.5 · 10 ^-6 / K Tg 505 ° C density 2.5 g / cm ³

Embodiment 10

Another glass for glass film 1 and / or glass slides 3 is exemplified by the following composition in weight percent: SiO ₂ 52 Al ₂ O ₃ 17 Na ₂ O 12 K ₂ O 4 MgO 4 CaO 6 ZnO 3.5 ZrO ₂ 1.5

With this composition, the following properties of the glass are obtained: α (20-300) 9.7 · 10 ^-6 / K Tg 556 ° C density 2.6 g / cm ³

Embodiment 11

Another glass for glass film 1 and / or glass slides 3 is exemplified by the following composition in wt .-%: SiO ₂ 62 Al ₂ O ₃ 17 Na ₂ O 13 K ₂ O 3.5 MgO 3.5 CaO 0.3 _SnO2 0.1 TiO ₂ 0.6

With this composition, the following properties of the glass are obtained: α (20-300) 8.3 · 10 ^-6 / K Tg 623 ° C density 2.4 g / cm ³

Embodiment 12

Another glass for glass film 1 and / or glass slides 3 is exemplified by the following composition in weight percent: SiO ₂ 61.1 Al ₂ O ₃ 19.6 B ₂ O ₃ 4.5 Na ₂ O 12.1 K ₂ O 0.9 MgO 1.2 CaO 0.1 _SnO2 0.2 CeO ₂ 0.3

With this composition, the following properties of the glass are obtained: α (20-300) 8.9 x 10 ^-6 / K Tg 600 ° C density 2.4 g / cm ³

Embodiment 13

Another glass is exemplified by the following composition in weight percent: SiO ₂ 50 to 65 Al ₂ O ₃ 15 to 20 B ₂ O ₃ 0 to 6 Li ₂ O 0 to 6 Na ₂ O 8 to 15 K ₂ O 0 to 5 MgO 0 to 5 CaO 0 to 7, preferably 0 to 1 ZnO 0 to 4, preferably 0 to 1 ZrO ₂ 0 to 4 TiO ₂ 0 to 1, preferably substantially TiO ₂ -free

Further, in the glass may be contained at 0 to 1 wt .-%: P ₂ O ₅ , SrO, BaO; and refining agents to 0 to 1 wt .-%: SnO ₂ , CeO ₂ or As ₂ O ₃ or other refining agents.

Embodiment 14

Another glass is exemplified by the following composition in weight percent: SiO ₂ 58 to 65 B ₂ O ₃ 6 to 10.5 Al ₂ O ₃ 14 to 25 MgO 0 to 5, CaO 0 to 9 BaO 0 to 8 SrO 0 to 8 ZnO 0 to 2

Embodiment 15

Another glass is exemplified by the following composition in weight percent: SiO ₂ 59.7 Al ₂ O ₃ 17.1 B ₂ O ₃ 7.8 MgO 3.4 CaO 4.2 SrO 7.7 BaO 0.1

With this composition, the following properties of the glass are obtained: α (20-300) 3.8 · 10 ^-6 / K Tg 719 ° C density 2.51 g / cm ³

Embodiment 16

Another glass is exemplified by the following composition in weight percent: SiO ₂ 59.6 Al ₂ O ₃ 15.1 B ₂ O ₃ 9.7 CaO 5.4 SrO 6.0 BaO 2.3 ZnO 0.5 Sb ₂ O ₃ 0.4 As ₂ O ₃ 0.7

With this composition, the following properties of the glass are obtained: α (20-300) 3.8 · 10 ^-6 / K density 2.5 g / cm ³

Embodiment 17

Another glass is exemplified by the following composition in weight percent: SiO ₂ 58.8 Al ₂ O ₃ 14.6 B ₂ O ₃ 10.3 MgO 1.2 CaO 4.7 SrO 3.8 BaO 5.7 Sb ₂ O ₃ 0.2 As ₂ O ₃ 0.7

With this composition, the following properties of the glass are obtained: α (20-300) 3.73 x 10 ^-6 / K Tg 705 ° C density 2.49 g / cm ³

Embodiment 18

Another glass is exemplified by the following composition in weight percent: SiO ₂ 62.5 B ₂ O ₃ 10.3 Al ₂ O ₃ 17.5 MgO 1.4 CaO 7.6 SrO 0.7

With this composition, the following properties of the glass are obtained: α (20-300) 3.2 ppm / K Density: 2.38 g / cc

Embodiment 19

Another glass is exemplified by the following composition in weight percent: SiO ₂ 55 to 75 Na ₂ O 0 to 15 K ₂ O 0 to 14 Al ₂ O ₃ 0 to 15 MgO 0 to 4 CaO 3 to 12 BaO 0 to 15 ZnO 0 to 5

Embodiment 20

Another glass is exemplified by the following composition in weight percent: SiO ₂ 74.3 Na ₂ O 13.2 K ₂ O 0.3 Al ₂ O ₃ 1.3 MgO 0.2 CaO 10.7

With this composition, the following properties of the glass are obtained: α (20-300) 9.0 ppm / K Tg: 573 ° C

Embodiment 21

Another glass is exemplified by the following composition in weight percent: SiO ₂ 72.8 Na ₂ O 13.9 K ₂ O 0.1 Al ₂ O ₃ 0.2 MgO 4.0 CaO 9.0

With this composition, the following properties of the glass are obtained: α (20-300) 9.5 ppm / K Tg: 564 ° C

In all of the abovementioned exemplary embodiments, if not already mentioned, refining agents may optionally contain from 0 to 1% by weight, for example SnO ₂ , CeO ₂ , As ₂ O ₃ , Cl-, F-, sulfates.

According to the invention, the holder of the glass sheet takes place 1 on the glass slide 3 as I said by direct adhesive adhesion (wringing) of the superposed surfaces. Particularly preferably, the surfaces are formed by the respective glass itself.

Instead of a glass sheet, according to an alternative embodiment, a silicon wafer, which is formed in particular from monocrystalline silicon, can be used.

According to a further embodiment of the invention, however, can also generally on at least one of the surfaces 10 . 30 of glass carrier 3 and glass sheet 1 or silicon wafers 2 a coating may be applied in particular as an intermediate layer. 6 shows as an example and variant of in 1 shown composite 4 such a composite, wherein on the glass sheet 1 or the silicon wafer 2 a coating 6 is deposited. Just for the purpose of illustration are glass sheet 1 and glass carrier 3 or the silicon wafer 2 and the glass carrier 3 shown here somewhat spaced to show that in this example the coating 6 on the glass slide 1 or on the silicon wafer 2 is available. Preferably, the coating is 6 regardless of whether they are on the glass slide 3 , or as shown on the glass sheet 1 or the silicon wafer 2 , or is applied to both elements, as well as the glasses electrically insulating.

An example of a further processing of a compound 4 with a silicon wafer 2 the coating is preferably with an inorganic coating, in particular a layer of silicon nitride (SiN), a silicon semiconductor layer, a metallic chromium layer, an aluminum layer and / or a layer of boron nitride (BN), preferably with a thickness between 1 and 500 nm, especially as an intermediate layer 6 between the silicon wafer 2 and the glass carrier 3 on their surfaces 10 and 30 according to 6 ,

An example of a further processing of the glass sheet 1 is the deposition of semiconductor layers with optoelectronic functions. For example, on the glass sheet, as in 6 also illustrated, light emitting diodes 13 be produced by deposition and patterning of semiconductor layers. The coating 6 can then be advantageous an anti-reflection coating to improve the light output of the LEDs. A method of making gallium nitride light-emitting diodes on glass substrates is known.

Without restricting to the illustrated example, it is generally provided in a development of the invention that the further processing of the glass sheet involves the production or application of optoelectronic components on the surface 11 , which of the glass carrier 3 adherent surface 10 opposite.

Furthermore, a coating 6 on the glass slide 3 and / or the glass sheet 1 , in particular as an interface layer or intermediate layer 6 , serve to adjust the adhesion force. If the adhesive force due to the glass used is greater or less than the limits specified above, another material may be applied as a coating to adjust the adhesion.

If the adhesion force is too great, even with very thin glasses, there is another possibility for adjusting the adhesion such that non-destructive peeling occurs even after the further processing of the glass foil 1 is possible. This may be the surface of the glass carrier 3 be structured accordingly, so that the bearing surface, or between the two surfaces 10 . 30 forming contact area, smaller than the surface 10 the glass sheet 1 and thus there is no full-surface adhesion.

Of course, the same applies to a corresponding composite 4 from glass carrier 3 and silicon wafers 2 ,

At the in 7 example shown are in the surface 30 of the glass carrier 3 wells 33 intended. Will the glass sheet 1 or the silicon wafer 2 applied, the glass sheet or the silicon wafer then lies over the wells 33 not on the glass slide 3 on. The contact surface is around the surface containing the depressions 33 under the glass sheet or under the silicon wafer, reduced. Preferably, these recesses extend to the edge of the glass sheet or the silicon wafer. Are, as in the examples shown above, the lateral dimensions of the glass sheet 1 or the silicon wafer 2 about the same size as the dimensions of the glass carrier 3 , extend the depressions 33 appropriate to the edge 31 of the glass carrier 3 ,

According to a variant of this development of the invention, the structured surface 30 of the glass carrier 3 with depressions 33 through a structured coating 9 on the glass slide 3 achieved. An example shows 8th , In order to produce such a coating, for example, a sol-gel layer can be applied and patterned by embossing, or in general the coating can be structured by lift-off of a complementarily structured intermediate layer.

Such a structured surface of the glass carrier 3 also offers with regard to vacuum processes during the further processing of the glass foil 1 or the silicon wafer 2 special advantages. When placing the glass sheet 1 or the silicon wafer 2 Optionally, an air lock may be applied to the glass carrier. This can also happen when a particle is between the two adherent surfaces 10 . 30 located locally and the two surfaces apart. In a vacuum process, such air entrapment may then cause the glass sheet to crack or peel off due to the pressure difference created in the vacuum 1 or the silicon wafer 2 to lead. The wells 33 on the other hand, cause an air inclusion in an adjacent depression 33 can vent into it or even when placing the formation of trapped air is avoided.

Another advantage of this embodiment is that also the detachment of the glass sheet 1 or the silicon wafer 2 after further processing is facilitated because the glass sheet 1 or the silicon wafer 2 in the area of the depressions 33 do not adhere to the glass slide.

It is also possible, the glass sheet or the silicon wafer 2 provided with a structured coating to achieve the above advantages.

In general, all the coatings mentioned are based on glass 3 and / or glass sheet 1 preferably inorganic coatings. This is useful so that a degradation of the respective coating does not occur during further processing at elevated temperature.

The following in the 9 to 16 exemplified composites 4 with a glass carrier 3 and a glass slide 1 apply equally to corresponding associations 4 with a silicon wafer 2 instead of a glass sheet 1 with the appropriate modifications for the silicon wafer.

9 shows a composite 4 in which a glass carrier 3 was used, its surface 30 as well as in the 7 and 8th The examples shown are structured in such a way that they are located between the two surfaces 10 . 30 forming contact surface is smaller than the surface 10 the glass sheet 1 , In particular, wells are again 33 educated. Generally, without limitation to the illustrated embodiments, the recesses 33 have the shape of open channels.

This is also the case with the examples 7 and 8th given. In combination with the glass foil 1 be from the depressions 33 one or more cavities 34 educated. The at least one cavity 34 is also due to the glass carrier 3 facing surface 10 limited. Such cavities can be used very advantageous to the peeling or breaking off of the glass sheet 1 to assist or to effect and / or to adjust changes in the adhesion force during further processing, in particular to counteract such changes. Also, by setting a pressure difference such that the ambient pressure is higher than the pressure of the fluid in the cavity, the glass sheet can also be adjusted 1 on the glass slide 3 held or a contact pressure for wringing the glass sheet 1 generated on the glass carrier. The principle a replacement of the glass sheet 1 by applying a pressure difference between a fluid in the cavity 34 and the environment can be applied not only to a direct adhesive attachment of the glass sheet to the glass substrate, or a wringing. For example, an adhesion caused by an adhesive or a suitable plastic layer can be overcome in this way for detaching the glass sheet.

Generally, without limitation to the specific configuration and shape of the cavities 34 as the example of 9 shows, as well as without limitation, a direct adhesive bond of glass sheet 1 and glass carrier 3 is therefore a composite according to another aspect of the invention 4 provided, wherein at least one cavity 34 is provided, which by the glass carrier 3 facing surface 10 the glass sheet 1 is limited. In particular, it is favorable if the cavity 34 communicates with the environment, so is open to the environment, to allow a fluid exchange. However, according to another embodiment, the cavity may also be closed to the environment. The closing of the cavity can be carried out before, during or after the further processing. The various possibilities will be explained in more detail in the course of the following description.

Take, for example, the in 7 and 8th shown glass carrier 3 in which the depressions 33 extend to the edge, so have after wringing the glass sheet or generally after attaching the glass sheet 1 on the glass slide 3 the cavity or cavities formed thereby openings at the edge 31 on. In particular, therefore, according to the invention is a composite 4 with a glass carrier 3 and a glass slide 1 provided, which has a thickness of less than 400 microns, more preferably less than 145 microns, wherein the glass carrier 3 a greater thickness than the glass sheet 1 having, wherein the glass sheet 1 on the glass carrier 3 adheres, and where the surface 30 of the glass carrier 3 is structured so that is between the two surfaces 10 . 30 forming contact surface is smaller than the glass carrier facing surface 10 the glass sheet 1 and the composite by the structuring of the glass carrier at least one cavity 34 which passes through the glass carrier 3 facing surface 10 the glass sheet 1 is limited. To be able to supply or remove fluid, or, for example, in high-temperature and / or vacuum processes in the further processing of the glass sheet 1 to allow pressure equalization is the cavity 34 preferably open to the environment, or communicates with this. The cavity 34 However, according to a further development, if necessary, it can also be closed in order to specifically bring about a pressure difference. This will be explained in more detail below.

One way to perform the peeling of the glass sheet after further processing or support, so is a pressure difference between a fluid in the cavities 34 and the environment, wherein the fluid is pressurized to ambient pressure. An otherwise undesirable effect in the form of an escape, as may be caused by an above-mentioned unwanted air entrapment between the surfaces in vacuum processes, is therefore being used here to assist or carry out the detachment.

According to a development of the method according to the invention is accordingly provided that when wringing glass sheet 1 and glass carrier 3 at least one cavity 34 is formed, which by the glass carrier 3 facing surface 10 the glass sheet 1 is limited, and wherein the application of a mechanical force to detach the glass sheet 1 from the glass carrier 3 producing a pressure difference between a fluid in the at least one cavity 34 and the environment, such that the pressure of the fluid in the cavity 34 is higher than the ambient pressure. The force caused by the pressure difference on the side 10 The glass sheet acts in the direction away from the glass carrier.

Also, a reverse pressure differential may assist in wringing. In other words, for wringing the glass sheet is set by a negative pressure in the cavities with respect to the ambient pressure 34 the glass sheet 1 on the glass carrier 3 sucked. This variant is also very advantageous because it first enables a precise alignment of the glass sheet without or under low contact pressure. When the glass sheet is properly positioned, it can create a pressure differential between the fluid in the cavity 34 and the environment the glass sheet 1 be sucked on the glass slide. Sustained-eye can not only support the wringing, but also generally the mounting and fixing of the glass sheet 1 on the glass carrier 3 serve. According to one embodiment, therefore, for fixing the glass sheet 1 on the glass carrier 3 in the cavity 34 creates a negative pressure and the glass sheet 1 on the glass carrier 3 sucked firmly.

Alternatively or additionally, the wringing can also be assisted or effected by an electrostatic charging of the surfaces. The charge difference, which thereby the mutual attraction the surfaces of glass slides 3 and glass sheet 1 is generally degraded rapidly after contact and the formation of the direct adhesive adhesion.

The further processing of the glass sheet may include, in addition to an application of coatings, optical, electronic or optoelectronic components, also a processing of the glass itself. An application for this is also in 9 shown. After fixing the glass sheet 1 on the glass slide 3 recesses are introduced into the glass sheet. In particular, these depressions, as in 9 represented, channels 17 which are the surfaces 10 . 11 the glass sheet 1 connect with each other. In general, without limitation to the specific example, it is therefore provided in a development of the invention that the further processing of the glass sheet 1 the insertion of a depression, preferably one of the surfaces 10 . 11 connecting channel. A glass slide 1 with such channels 17 , or glass sheet elements with the channels, that of the glass sheet 1 can be separated, for example, can be used as a so-called interposer. An interposer serves as an insulating intermediate layer for wiring levels on electronic circuits or components, in particular also on integrated circuits. The channels 17 serve to create vias through the insulating interlayer by introducing a conductive material.

Are, as explained above, wells in the glass slide 3 provided, which serve to form a cavity and build up a pressure difference to the environment in the cavity, it is expedient, as shown, the channels 17 not over the wells 33 insert, because in this way the cavity 34 would be opened. However, according to another embodiment, the channels may also just above such a recess 33 be inserted when the recess 33 , or the cavity formed with the depression 34 is not used to increase the pressure of the glass sheet 1 replace. To explain this embodiment opens one of in 9 marked channels 17 (the rightmost channel) in a well 33 , The one through the depression 33 formed cavity 34 in which the channel 17 opens, it can be advantageous, inter alia, to receive material that is obtained during glass processing, possibly also to suck. Furthermore, fluids can also be supplied or removed for different process or control steps. Thus, it can be verified, for example via the inflow or outflow of a fluid, that the channel 17 in fact, the surfaces 10 . 11 combines.

10 shows a development of such a composite 4 with cavities 34 as he is in 9 is shown. At the in 10 illustrated embodiment are as wells 33 channels 35 through the glass carrier 3 provided, which are the two opposite surfaces 30 . 32 connect and thus via openings 36 communicate with the environment. The openings 37 in the surface 30 be in the composite 4 through the surface 10 closed the glass sheet. This embodiment now offers the possibility of this exposed side, or the back of the composite 4 supply the fluid and / or adjust the desired pressure difference. The openings 36 on the back surface 32 do not have to be the same size as the openings on the contact surface with the glass sheet 1 forming surface 30 be. To get a higher force on the glass sheet 1 through the fluid, the openings closed by the glass foil can 37 also be larger than the opposite openings 36 in the page 32 ,

A similar effect, in which given a pressure difference, a large force by a hydrostatic translation results in the rest even in a glass slide with extending to the edge wells 33 as he exemplifies in the 7 and 8th is shown. Here too, when the glass sheet is blown up, the surface of the glass sheet subjected to pressure is pressed 1 bigger than the ones on the edge 31 resulting opening.

According to one embodiment of the invention can be used as fluid, a gaseous medium, in particular air.

In the embodiments discussed so far, the glass sheet adhesively adheres to the glass carrier 3 , According to yet another embodiment of the invention, however, the adhesion of the glass sheet may also be used 1 on the glass carrier 3 itself by a pressure difference without having substantial adhesive or direct adhesive adhesion. In doing so, the foil is exposed to the environment, especially to the surface 11 which the glass carrier 3 turned away, lower pressure in the cavity 34 on the glass carrier 3 pressed and held in this way. This embodiment of the invention is particularly favorable for further processing, in which the further processing steps are not carried out under vacuum. Among other things, this embodiment is also very suitable for carrying out further processing steps at very high temperatures. This embodiment has with the other embodiments of the invention, in which for detaching the glass sheet 1 between the pressure of the fluid in the cavity 34 is higher, as the ambient pressure in common that the glass sheet 1 from the glass carrier 3 is solved by the pressure in the cavity 34 is increased.

• – eine Glasfolie 1 mit einer Dicke von höchstens 400 µm, besonders bevorzugt weniger als 145 µm und einer lateralen Abmessung von zumindest 5cm entlang einer Richtung bereitgestellt und
• – die Glasfolie 1 auf einem Glasträger 3, welcher eine größere Dicke als die Glasfolie 1 aufweist, befestigt wird,
• – wobei beim Befestigen der Glasfolie 1 am Glasträger 3 zumindest ein Hohlraum 34 gebildet wird, welcher durch die dem Glasträger 3 zugewandten Oberfläche 10 der Glasfolie 1 begrenzt wird, und
• – nach zumindest einem Weiterverarbeitungsschritt die Glasfolie 1 vom Glasträger 3 gelöst wird, indem der im Hohlraum 34 herrschende Druck erhöht wird.

Accordingly, in another aspect of the invention, regardless of the manner of adhesion of the glass sheet 1 on the glass carrier 3 and also provided independent of the linear thermal expansion coefficients of the glasses, a method for further processing of thin glasses, in which

• - a glass slide 1 provided with a thickness of at most 400 μm, more preferably less than 145 μm and a lateral dimension of at least 5 cm along one direction, and
• - the glass sheet 1 on a glass slide 3 which has a greater thickness than the glass sheet 1 has, is attached,
• - Wherein attaching the glass sheet 1 on the glass carrier 3 at least one cavity 34 is formed, which by the glass carrier 3 facing surface 10 the glass sheet 1 is limited, and
• After at least one further processing step, the glass sheet 1 from the glass carrier 3 is solved by the in the cavity 34 prevailing pressure is increased.

In this case, the cavity can also be kept continuously under negative pressure during further processing. In particular, here the fixation of the glass sheet 1 also caused solely by the contact pressure caused by the negative pressure, or the fixation are at least supported by such a contact pressure. At the in 10 shown embodiment, for example, the glass carrier 3 with the page 32 be connected to a vacuum source. For example, the glass carrier 3 with the page 32 be placed on a vacuum plate. By the way in the cavities 34 caused negative pressure is the glass sheet 1 on the glass slide 3 fixed. In general, without limitation to the embodiments, it is therefore provided according to an embodiment of the invention that in the composite 4 in at least one cavity 34 a negative pressure prevails, which the glass sheet 1 on the glass carrier 3 sucking fast.

Conversely, however, before peeling and during further processing of the glass sheet 1 temporarily an overpressure in at least one cavity 34 getting produced. This can especially in connection with the fixation of the glass sheet 1 be favorable by wringing and further processing at high temperatures. At high temperatures, direct adhesive adhesion may increase and, optionally, many covalent, firm bonds may form between the surfaces. This makes subsequent detachment difficult. Will now over the or the cavities 34 , especially during further processing at high temperatures (for example 200 ° C and more) generates an overpressure, the adhesive adhesion is counteracted. The formation of firm bonds between the surfaces is thus prevented or at least partially suppressed.

According to one embodiment of the method according to the invention with blasted glass film is therefore provided that when wringing glass sheet 1 and glass carrier 3 at least one cavity 34 is formed, which by the glass carrier 3 facing surface 10 the glass sheet 1 is limited, and wherein at least one further processing step is performed, wherein the glass sheet 1 is heated to a temperature in a range of at least 200 ° C, preferably at least 300 ° C, and wherein during this processing step the cavity 34 is pressurized.

According to one embodiment of the invention, the thermal expansion of fluids, which is typically orders of magnitude greater than solids, may be used to produce sufficient peel forces. Here is a basic idea is to first blow off the fluid in the at least one cavity 34 fill, close the opening to the environment and then heat the fluid. The temperature expansion of the fluid then leads to the formation of an overpressure in the cavity 34 ,

According to this embodiment of the invention, accordingly, the composite 4 then at least one filled with a fluid, closed cavity 34 on top of that from the surface 10 the glass sheet 1 is limited, which the glass carrier 3 is facing.

Particularly high pressures can be generated with liquids as fluid. Liquids typically have an order of magnitude higher temperature expansion than glasses and at the same time a low compressibility.

11 shows such an embodiment of a composite 4 , The channels 35 are in preparation for peeling off the glass sheet 1 with a liquid 14 filled. On the back surface 32 of the glass carrier 3 is another glass carrier 7 put on and with the glass slide 3 connected. These are the openings 36 in the glass sheet 1 remote surface 32 of the glass carrier 3 locked.

Will the composite 4 now heated, the liquid expands 14 much stronger than the glass of the glass carrier 3 and the glass sheet 1 , leaving a high pressure on the glass sheet 1 can be exercised until the glass sheet 1 from the glass carrier 3 solves.

It is advantageous here, as already stated, when the openings 37 of the channels 35 to the contact surface forming surface 30 of the glass carrier 3 are larger than the openings 36 in the opposite surface 32 , At the in 11 shown embodiment, while expanding the channels 35 conical to the contact surface of the glass carrier 3 forming surface 30 out. Of course, other geometries, such as a cup-shaped extension on the surface 30 possible.

The embodiment of 11 is also an example of an embodiment of the method according to the invention, in which the cavity 34 at least during part of the further processing of the glass sheet communicates with the environment, in which case the cavity 34 before peeling off the glass sheet 1 from the glass carrier 3 closed with the inclusion of a fluid and then the glass sheet 1 causes or assisted by an increase in the pressure of the fluid is replaced.

According to yet another embodiment of the invention, before detachment from the glass carrier 3 a separation of the glass sheet 1 into individual glass sheet elements from the surface 11 her, that is, the surface of the glass carrier 3 turned away done. In particular, the glass sheet elements can be equipped by further processing with optical, electrical or optoelectronic components. By splitting thus becomes a composite with on the glass carrier 3 maintained, but already laterally separated and provided with said components glass sheet elements. The compound edited in this way 4 can therefore also be considered as a composite with several juxtaposed glass sheets. 12 shows such an example. As components, for example, the in 6 shown LEDs 13 serve. At the in 12 shown example are as components but exemplary energy storage elements 15 , Preferably provided lithium-based energy storage elements.

The glass sheet 1 is separated according to an embodiment of the invention after applying the components by sawing. The separation of the glass carrier 3 remote surface 3 takes place here by the insertion of the sawing gap in the surface 11 , Accordingly, the individual glass sheet elements 100 through column 18 , preferably separated from each other in the form of crevices. The gaps typically have a width of 30 μm to 200 μm. According to one embodiment, the crevices 18 like the one in 12 shown example in the glass slide 3 extend, the glass carrier 3 but not through the crevices 18 is severed. The individual glass-foil elements 100 Although they are laterally separated, they still adhere adhesively to the glass carrier 3 , After this process step, the glass sheet 1 , or the glass sheet elements 100 then be solved by applying a mechanical force. In particular, the glass sheet elements 100 also be picked up individually or in groups. This corresponds to the so-called pick-and-place method used in semiconductor production. The detachment can according to a further development in turn by generating a pressure difference between a fluid in a through the surface 10 of the glass sheet element 100 limited cavity 34 and the environment, or by increasing the in through the respective glass sheet element 100 limited cavity 34 prevailing pressure can be realized. At the in 12 The example shown here is the glass carrier 3 with channels 35 similar to those in 10 or 11 shown embodiments equipped. The detachment can be like in the 11 Example shown by inclusion of a fluid, preferably a liquid in the channels and a heating of the fluid take place. The openings 37 of the channels 35 or other wells 33 are expediently under the individual glass sheet elements 100 ,

For the pick-and-place method, furthermore, a device can advantageously be provided for the cavities 34 to apply a pressure difference separately. Then can be caused by the pressure difference or supports the respective glass sheet elements 100 be lifted while the remaining glass sheet elements 100 still stick to the glass carrier.

The same applies to corresponding associations 4 with a glass slide 3 and instead of the glass sheet 1 with a silicon wafer 2 are designed, and their to the glass sheet elements 100 corresponding silicon wafer elements 101 . 12 to 16 ,

For example, as in 11 represented a liquid 14 in the cavities 34 filled and become the cavities 34 then closed, the individual cavities can be selectively heated. Among other things, a radiation source whose radiation in the liquid is suitable for this purpose 14 is absorbed, so that the liquid heats up.

The example of the 12 Thus, the method described is generally based on the fact that after the further processing, preferably the application of optical, electrical or optoelectronic components, the glass sheet 1 in individual glass foil parts 100 which are laterally separated, but adhere to the glass carrier, and wherein after the separation of the glass foil parts 100 individually or in several groups detached from the glass slide using a mechanical force and lifted.

Applying the mechanical force to detach the glass sheet elements 100 In this case, according to an advantageous development of the invention, as stated, preferably comprises the production of a pressure, which is higher than the ambient pressure, of a fluid in a cavity 34 passing through the glass sheet element 100 is completed.

13 shows an embodiment of the method generally described above. After further processing of the glass sheet 1 Here again, for example, by equipping with optical, electrical or optoelectronic components, the cavities communicating with the environment, including a fluid, here again a liquid, become 14 closed. The closing takes place as in the 11 shown example by attaching another glass carrier 7 , Likewise, however, the individual cavities can also be closed individually, for example by applying a hardenable medium, such as a synthetic resin, into the openings 36 is filled and after curing the openings 36 forming occlusive plugs. To the individual glass sheet elements 100 a laser beam having a wavelength absorbed by the fluid is applied to the respective cavity under the glass sheet member 100 directed and absorbed on or in the cavity. For example, the laser light 20 a laser 21 through the glass carrier 7 be directed through. Here, the glass of the glass carrier 7 be transparent to the laser radiation while the fluid is in the cavity 34 the laser radiation absorbs and warms up, so that, as in the example shown, the cavity 100 closing glass sheet element 100 is blasted off due to the overpressure caused by the heating.

According to yet another embodiment of the invention, the glass sheet is peeled off 1 or, as in the example of 13 of individual glass sheet elements 100 also uses a liquid which is in the cavity 34 this is used to generate an overpressure, alternatively or in addition to a volume expansion of the liquid caused by heating in at least one cavity 34 is evaporated. For example, water is suitable, or in the case of moisture-sensitive layers on the glass sheet 1 also an organic liquid, such as an alcohol or an organic solvent.

The invention is also particularly suitable, not only laterally separated glass sheet elements 100 to hold together in the composite, but also, a glass sheet 1 to use, which is pre-scratched. The pre-scoring is very suitable, in particular during the detachment of the glass sheet 1 these into individual glass sheet elements 100 separate.

At the in 14 illustrated embodiment are line-shaped scratches 102 in the glass carrier 3 facing away, or external surface 11 the glass sheet 1 inserted. By breaking the glass sheet 1 at the individual line-shaped scratches 102 then corresponding glass sheet elements 100 receive. At the in 14 shown embodiment of the invention, the glass sheet 1 , preferably by wringing, first on the glass slide 3 attached and then the insertion of the scratches 102 be performed. Due to the support on the rigid glass carrier 3 Here is the risk of an undesirable break when scribing the glass sheet 1 greatly reduced.

Under certain circumstances, but depending on the way of further processing, the scratches can 102 on the outside surface 11 also disturb the further processing. In this case, the glass sheet 1 also pre-scored before bonding to the glass slide and then the glass sheet 1 with the pre-scored surface on the glass slide 3 placed on and fixed to this, preferably by wringing.

Such a composite shows 15 , Also at the in 14 However, it is conceivable embodiment, the scratches 102 before fixing on the glass slide 3 make.

The two methods explained are characterized in that the glass sheet 1 before detachment from the glass slide 3 with linear scratches 102 is pre-scored, and wherein the glass sheet 1 during or after detachment from the glass slide 3 in single, through the linear scratches 102 defined glass sheet elements 100 is separated. At the in 15 embodiment shown are the scratches 102 even before the further processing of the glass sheet 1 available. It is generally particularly advantageous if the pre-scoring before the other processing of the glass sheet 1 he follows. This avoids glass particles getting scratched form the surface 10 contaminate. So can at the in 14 The first embodiment shown, the glass sheet 1 sprinkled, then the scribe made and before further processing the surface 11 getting cleaned.

Regardless of whether the scratches of the exposed, or the glass carrier 3 remote surface 11 or on the glass carrier 3 facing surface 10 are inserted, it is particularly advantageous if the linear thermal expansion coefficients of glass carrier 3 and glass sheet 1 differ little or even the same. The scoring embodiment may also be used with the embodiment with lateral separation of the glass sheet elements 100 as they are the embodiments of the 12 and 13 show, be combined. Thus, for example, larger, laterally separated glass sheet elements 100 through linear scratches 102 be further subdivided.

The separation into individual glass sheet elements 100 is a general preferred embodiment of the invention, regardless of whether this separation before (eg as in 13 shown) during or after peeling the glass sheet 1 from the glass carrier 3 he follows. In general, however, it is provided that the individual sections of the glass sheet 1 , which after the separation of the glass sheet elements 100 form, directly with the glass slide 3 are connected. Would be the glass sheet 1 For example, connected only at the edge thereof with the glass carrier, so at a bending load, in which the contact surface is bent concavely, the glass sheet 1 take off at the unconnected areas. Also could be a lateral separation of the glass sheet elements in combination with the glass carrier 3 as the embodiments of the 12 and 13 show, not performed when the individual sections of the glass sheet elements 100 not with the glass carrier 3 are connected. The glass foil elements 100 are generally also the sections of the glass sheet, which are further processed. Without limitation as to whether a division into individual glass sheet elements occurs, or the glass sheet is used after peeling as a whole, it is generally particularly preferred that the glass sheet 1 at those sections with the glass carrier 3 connected, which are further processed.

16 shows a further education in 14 and 15 illustrated examples. At the in 16 represented composite 4 are similar to the one in 12 illustrated embodiment cavities 34 provided by the glass sheet 1 be limited. Instead of the column 18 are here as in the examples of 14 and 15 linear scratches 102 intended. The sections between the scratches 102 define the glass sheet elements obtained by subsequent separation or separation 100 , To get through the scratches 102 No unwanted leaks, or pressure differences between the cavities 34 and the surroundings the scratches 102 not to burden, it is beneficial if, as shown, the cavities 34 in supervision of the glass sheet 1 considered between the linear scratches 102 are arranged. In other words, the linear scratches run 102 between the sections of the glass sheet 1 which the cavities 34 on the glass sheet 1 facing surface 30 of the glass carrier 3 shut down.

The same applies to corresponding associations 4 with a glass slide 3 and instead of the glass sheet 1 with a silicon wafer 2 are designed, and their to the glass sheet elements 100 corresponding silicon wafer elements 101 . 12 to 16 , LIST OF REFERENCE NUMBERS 1 window film 2 silicon wafer 3 . 7 glass slides 4 Composite off 1 . 3 5 on surface 11 deposited coating 6 Coating, in particular as an intermediate layer 8th separation line 9 structured coating 10 . 11 Surfaces of 1 . 2 12 . 300 Compressive stress zone 13 led 14 liquid 15 Energy storage element 17 Channel through 1 18 gap 20 laser beam 21 laser 30 . 32 Surfaces of 3 31 Edge of 3 33 Deepening in 30 34 cavity 35 channel 36 . 37 Opening of 35 in surfaces 30 . 32 100 Glass foil element 101 Silicon wafer element 102 scoring

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• US Pat. No. 6,735,982 B2 [0003]
• US 2012/0040211 A1 [0004]
• WO 2014/7179137 A1 [0006]
• US 2002/0032117 A1 [0055]
• US 2013/207058 A1 [0057]

Claims (24)

Composite ( 4 ) with a glass slide ( 3 ) and a glass sheet ( 1 ) or with a glass slide ( 3 ) and a silicon wafer ( 2 ), whereby the glass foil ( 1 ) or the silicon wafer ( 2 ) has a thickness of at most 400 μm, particularly preferably less than 145 μm, wherein the glass carrier ( 3 ) has a greater thickness than the glass sheet ( 1 ) or as the silicon wafer ( 2 ), wherein the glass sheet ( 1 ) or the silicon wafer ( 2 ) on the glass carrier ( 3 ) and wherein the surface ( 30 ) of the glass carrier ( 3 ) is structured so that between the two surfaces ( 10 . 30 ) formed contact surface is smaller than that of the glass carrier ( 3 ) facing surface ( 10 ) of the glass sheet ( 1 ) or the silicon wafer ( 2 ) and the composite ( 4 ) by the structuring of the glass carrier ( 3 ) at least one cavity ( 34 ), which by the glass carrier ( 3 ) facing surface ( 10 ) of the glass sheet ( 1 ) or the silicon wafer ( 2 ) is limited. Composite ( 4 ) according to one of the preceding claims, characterized in that - a surface ( 10 ) of the glass sheet ( 1 ) or the silicon wafer ( 2 ) directly adhesive with a surface ( 30 ) of the glass carrier ( 3 ) and wherein the difference of the linear expansion coefficients of the glasses of glass carrier ( 3 ) and glass foil ( 1 ) or glass slide ( 3 ) and silicon wafers ( 2 ) in a temperature interval in a temperature interval of 20 ° C to 200 ° C in terms of magnitude less than 0.3 · 10 ^-6 K ^-1 , preferably less than 0.2 · 10 ^-6 K ^-1 . Composite ( 4 ) according to the preceding claim, wherein the glass carrier ( 3 ) made of the same glass as the glass foil ( 1 ) is formed. Composite ( 4 ) according to one of the preceding claims, characterized by at least one of the features: - the glass carrier ( 3 ) has a thickness which is at least three times the thickness of the glass sheet ( 1 ) or the silicon wafer ( 2 ) is the ratio d ³ / S ^2/3 , where d is the thickness and S is the longest side dimension or the diameter of the glass carrier ( 3 ), each measured in millimeters, is in a range of 2 × 10 ^-3 to 14 × 10 ^-3 , preferably 6 × 10 ^-3 to 12 × 10 ^-3 , the composite ( 4 ) has a thickness of at least 400 microns, - the diameter or the side dimensions of the glass carrier ( 3 ) amount to at least 150 millimeters, - the Knoop hardness of the glasses of glass carrier ( 3 ) and glass foil ( 1 ) or silicon wafers ( 2 ) ranges from 520 to 650. Composite ( 4 ) according to one of the preceding claims, characterized in that at least one of the elements glass sheet ( 1 ) and glass slides ( 3 ), preferably both glass sheet ( 1 ), as well as glass carrier ( 3 ) are formed from a glass having one of the following compositions: component wt% SiO ₂ 58-65 Al ₂ O ₃ 14-25 B ₂ O ₃ 6-10.5 MgO 0-3 CaO 0-9 BaO 3-8 ZnO 0-2, or component wt% SiO ₂ 30-85 B ₂ O ₃ 3-20 Al ₂ O ₃ 0-15 Na ₂ O 3-15 K ₂ O 3-15 ZnO 0-12 TiO ₂ 0.5-10 CaO 0-0.1. Composite ( 4 ) according to any one of the preceding claims, wherein on at least one of the surfaces ( 10 . 30 ) of glass carrier ( 3 ) and glass foil ( 1 ) or silicon wafers ( 2 ) a coating, in particular as an intermediate layer ( 6 ), preferably an inorganic coating, such as in particular a layer of silicon nitride (SiN), a silicon semiconductor layer, a metallic chromium layer, an aluminum layer and / or a layer of boron nitride (BN), preferably with a thickness between 1 and 500 nm. Composite ( 4 ) according to any one of the preceding claims, wherein the surface ( 30 ) of the glass carrier ( 3 ) is structured so that between the two surfaces ( 10 . 30 ) forming contact surface is smaller than the surface ( 10 ) of the glass sheet ( 1 ) or the silicon wafer ( 2 ). Composite ( 4 ) according to one of the preceding claims, characterized by at least one filled with a liquid, closed cavity. Composite ( 4 ) according to one of the preceding claims, characterized in that the glass sheet ( 1 ) or the silicon wafer ( 2 ) in on the glass carrier ( 3 ), laterally separated glass sheet elements ( 100 ) or laterally separated silicon wafer elements ( 2 ) is separated. Composite ( 4 ) according to one of the preceding claims, characterized in that at least one of the composite parts glass sheet ( 1 ) and glass slides ( 3 ) is biased, preferably chemically biased. Composite ( 4 ) according to one of the preceding claims, characterized in that the glass sheet ( 1 ) or the silicon wafer ( 2 ) is scratched. Composite ( 4 ) according to the preceding claim, characterized in that in the glass sheet ( 1 ) or in the silicon wafer ( 2 ) linear scratches ( 102 ), the scratches ( 102 ) between the sections of the glass sheet ( 1 ) or the silicon wafer ( 2 ) extending the cavities ( 34 ) on the glass sheet ( 1 ) or the silicon wafer ( 2 ) facing surface ( 30 ) of the glass carrier ( 3 ) shut down. Composite ( 4 ) according to one of the preceding claims, characterized in that in at least one cavity ( 34 ) there is a negative pressure, which the glass sheet ( 1 ) or the silicon wafer ( 2 ) on the glass carrier ( 3 ) Process for the further processing of thin glasses, in which - a glass sheet ( 1 ) or a silicon wafer ( 2 ) with a thickness of less than 145 μm and a lateral dimension of at least 5 cm along one direction, and - the glass sheet ( 1 ) or the silicon wafer ( 2 ) on a glass slide ( 3 ), which has a greater thickness than the glass sheet ( 1 ) or the silicon wafer ( 2 ) and a composite ( 4 ) according to any one of the preceding claims, - wherein when fixing the glass sheet ( 1 ) or the silicon wafer ( 2 ) on the glass carrier ( 3 ) at least one cavity ( 34 ) formed by the glass carrier ( 3 ) facing surface ( 10 ) of the glass sheet ( 1 ) or the silicon wafer ( 2 ) is limited, and - after at least one further processing step, the glass sheet ( 1 ) or the silicon wafer ( 2 ) from the glass carrier ( 3 ) is dissolved by the in the cavity ( 34 ) prevailing pressure is increased. Method according to the preceding claim, wherein for detaching the glass sheet ( 1 ) or the silicon wafer ( 2 ) a pressure difference between a fluid in the at least one cavity ( 34 ) and the environment is adjusted, such that the pressure of the fluid in the cavity ( 34 ) is higher than the ambient pressure. Method according to one of the preceding claims, in which the cavity ( 34 ) at least during a part of the further processing of the glass sheet ( 1 ) or the silicon wafer ( 2 ) communicates with the environment, in which case the cavity ( 34 ) before peeling off the glass sheet ( 1 ) or the silicon wafer ( 2 ) from the glass carrier ( 3 ) sealed with the inclusion of a fluid and then the glass sheet ( 1 ) or the silicon wafer ( 2 ) is released by increasing the pressure of the fluid. Method according to the preceding claim, characterized in that in the cavity ( 34 ) enclosed a liquid and the overpressure is generated by heating and associated thermal expansion and / or evaporation of the liquid. Method according to one of the two preceding claims, in which the glass sheet ( 1 ) and the glass carrier ( 3 ) or the silicon wafer ( 2 ) and the glass carrier ( 3 ) are joined together by wringing. Method according to one of the preceding claims, characterized in that after the laying on of the glass sheet ( 1 ) or the silicon wafer ( 2 ) on the glass slide ( 3 ) at least one further processing step is carried out in a vacuum. Method according to one of the preceding claims, characterized in that the further processing of the glass sheet ( 1 ) or the silicon wafer ( 2 ) - the production of a layer system for a lithium-based energy storage element, or - the production or application of optoelectronic components on the surface ( 11 ) of the glass sheet ( 1 ) or the silicon wafer ( 2 ), which on the glass carrier ( 3 ) adherent surface ( 10 ), - the insertion of a depression, preferably one of the surfaces ( 10 . 11 ) connecting channel ( 17 ). Method according to one of the preceding claims, characterized in that at least one further processing step is carried out, wherein, while retaining the preferably adhesive adhesion, the glass sheet ( 1 ) or the silicon wafer ( 2 ) is heated to a temperature in a range of at least 200 ° C, preferably at least 300 ° C, wherein the silicon wafer ( 2 ) is particularly preferably heated to a temperature above 400 ° C or very particularly preferably to a temperature above 500 ° C. Method according to one of the preceding claims, characterized in that for fixing the glass sheet ( 1 ) or the silicon wafer ( 2 ) on the glass carrier ( 3 ) in the cavity ( 34 ) creates a negative pressure and the glass sheet ( 1 ) or the silicon wafer ( 2 ) on the glass carrier ( 3 ) is sucked tight. Method according to one of the preceding claims, characterized in that after further processing individual glass sheet elements ( 100 ) or individual silicon wafer elements ( 101 ) by separating portions of the glass sheet ( 1 ) or the silicon wafer ( 2 ) getting produced. Method according to one of the preceding claims, characterized in that after the further processing, preferably the application of optical, electrical or optoelectronic components, the glass sheet ( 1 ) or the silicon wafer ( 2 ) in individual glass foil parts ( 100 ) or silicon wafer elements ( 101 ) of the glass carrier ( 3 ) facing away from the surface ( 11 ), which are laterally separated, but adhere to the glass carrier, and wherein after the separation of the glass film parts ( 100 ) or the silicon wafer elements ( 101 ) individually or in several groups from the glass slide ( 3 ) by increasing the in through the respective glass sheet element ( 100 ) limited cavity ( 34 ) or by increasing the in through the respective silicon wafer element ( 101 ) limited cavity pressure prevailing and lifted.

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