DE102014104510B4 - Method for joining and device for joining an assembly using the method - Google Patents

Method for joining and device for joining an assembly using the method Download PDF

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Publication number
DE102014104510B4
DE102014104510B4 DE102014104510.6A DE102014104510A DE102014104510B4 DE 102014104510 B4 DE102014104510 B4 DE 102014104510B4 DE 102014104510 A DE102014104510 A DE 102014104510A DE 102014104510 B4 DE102014104510 B4 DE 102014104510B4
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Prior art keywords
substrate material
structural element
connecting surface
temperature
heating
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DE102014104510.6A
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German (de)
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DE102014104510A1 (en
Inventor
Lutz Rissing
Meriem Akin
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Leibniz Universitaet Hannover
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Leibniz Universitaet Hannover
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Priority to DE102014104510.6A priority Critical patent/DE102014104510B4/en
Priority to PCT/EP2015/056904 priority patent/WO2015150330A1/en
Publication of DE102014104510A1 publication Critical patent/DE102014104510A1/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
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    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
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    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
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    • H05K2203/05—Patterning and lithography; Masks; Details of resist
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    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components

Abstract

Verfahren zum Fügen von Strukturelementen (3, 4) in Form von Beschichtungen (3) und/oder Bauteilen (4) auf organischen Substratmaterialien (2), bei dem eine Verbindungsoberfläche (30) wenigstens eines Strukturelements (3, 4) mit einer Verbindungsoberfläche (20) wenigstens eines Substratmaterials (2) in Form eines organischen Kunststoffmaterials stoffschlüssig verbunden wird, gekennzeichnet durch die Schritte:a) Erzeugen einer oxidierten Oberfläche an der Verbindungsoberfläche (20, 30) des Strukturelements (3, 4) und/oder des Substratmaterials (2) oder Verwenden eines Strukturelements (3, 4) und/oder Substratmaterials (2) mit einer bereits oxidierten Oberfläche an dessen Verbindungsoberfläche (20, 30),b) Pressen der Verbindungsoberfläche (30) des Strukturelements (3, 4) gegen die Verbindungsoberfläche (20) des Substratmaterials (2) mit einem bestimmten Anpressdruck (11) ungleich Null bei gleichzeitiger Erwärmung zumindest der aneinander gepressten Verbindungsoberflächen (20, 30) auf eine Temperatur oberhalb einer Mindesttemperatur, wobei die Erwärmung auf eine Temperatur durchgeführt wird, die im Bereich der Solidustemperatur des Materials des Strukturelements (3, 4) zumindest an dessen Verbindungsoberfläche (30) ist und geringer als die Liquidustemperatur des Substratmaterials (2) ist,c) Beenden des Anpressens und der Erwärmung nach Erreichen einer bestimmten Diffusionstiefe der Diffusion wenigstens eines Bestandteils der Oxidschicht der oxidierten Oberfläche an der einen Verbindungsoberfläche (20, 30) in das Material der anderen Verbindungsoberfläche (20, 30).Method for joining structural elements (3, 4) in the form of coatings (3) and / or components (4) on organic substrate materials (2), in which a connecting surface (30) of at least one structural element (3, 4) having a connecting surface (3) 20) of at least one substrate material (2) in the form of an organic plastic material, characterized by the steps: a) producing an oxidized surface on the connecting surface (20, 30) of the structural element (3, 4) and / or of the substrate material (2 ) or using a structural element (3, 4) and / or substrate material (2) with an already oxidized surface on its connecting surface (20, 30), b) pressing the connecting surface (30) of the structural element (3, 4) against the connecting surface ( 20) of the substrate material (2) with a certain contact pressure (11) not equal to zero while at the same time heating at least the joining surfaces pressed together (20, 20). 30) to a temperature above a minimum temperature, wherein the heating is carried out to a temperature which is in the region of the solidus temperature of the material of the structural element (3, 4) at least at its connecting surface (30) and less than the liquidus temperature of the substrate material (2) c) terminating the pressing and heating after reaching a certain diffusion depth of the diffusion of at least one constituent of the oxide layer of the oxidized surface at the one connection surface (20, 30) into the material of the other connection surface (20, 30).

Description

Die Erfindung betrifft ein Verfahren zum Fügen von Strukturelementen in Form von Beschichtungen und/oder Bauteilen auf organischen oder nicht-organischen Substratmaterialien gemäß dem Anspruch 1. Die Erfindung betrifft ferner eine Einrichtung zur Herstellung einer solchen Anordnung gemäß Anspruch 7.The invention relates to a method for joining structural elements in the form of coatings and / or components on organic or non-organic substrate materials according to claim 1. The invention further relates to a device for producing such an arrangement according to claim 7.

Allgemein betrifft die Erfindung das Fügen von Beschichtungen und/oder Bauteilen auf Substratmaterialien, d.h. deren stoffschlüssige Verbindung mit dem Substratmaterial. Für solche Fügeverfahren gibt es diverse Anwendungen. Ein wichtiger Anwendungsbereich liegt in der Herstellung elektrischer und/oder elektronischer Schaltungen. Diese werden gemäß dem Stand der Technik entweder auf festen Leiterplatten (Platinen) aufgebaut, oder es werden Flexleiter verwendet, die ein flexibles Substrat aufweisen, das mit Leiterbahnen versehen wird. Flexible Substrate bestehen meistens aus auf Polymerbasis entwickelten Werkstoffen. Die Leiterbahnen werden aus vornehmlich metallischen Werkstoffen gebildet. Bei Verbindungen von Polymeren mit Metallen sind verschiedene Probleme zu lösen, z.B. verschiedene Längenausdehnungskoeffizienten, im Wesentlichen keine Möglichkeit der Herstellung chemischer Verbindungen zwischen Polymeren und Metallen aufgrund verschiedener Atomstrukturen sowie die Beachtung verschiedener Schmelztemperaturen, wenn ein thermischer Fügeprozess verwendet wird.In general, the invention relates to the joining of coatings and / or components to substrate materials, i. their cohesive connection with the substrate material. There are various applications for such joining methods. An important area of application is the production of electrical and / or electronic circuits. These are built according to the prior art either on solid printed circuit boards (boards), or there are used flex conductors having a flexible substrate, which is provided with conductor tracks. Flexible substrates usually consist of polymer-based materials. The tracks are formed of primarily metallic materials. In compounds of polymers with metals, various problems are to be solved, e.g. different coefficients of linear expansion, essentially no possibility of producing chemical bonds between polymers and metals due to different atomic structures, as well as respecting different melting temperatures when using a thermal joining process.

Aber auch außerhalb der Flexleitertechnologie ist grundsätzlich ein Trend zur Verwendung von Leiterbahnen bzw. Metallisierungen auf Polymersubstraten erkennbar, da diese im Gegensatz zu Keramiken leicht sind und außerdem von Fall zu Fall dotierbar und strukturierbar sind. Dabei werden allerdings bisher dotierte und strukturierte Varianten bevorzugt, da wie erwähnt Metall/Polymerverbindungen meist unter produktionstechnisch hohem Aufwand durch thermische Fügetechnologien erstellt werden. Hier gilt es insbesondere die Reproduzierbarkeit einer präzisen Fertigung sicher zu stellen.But even outside of the flex conductor technology is a trend for the use of interconnects or metallization on polymer substrates recognizable, since they are in contrast to ceramics are light and also be doped and structurable from case to case. In this case, however, hitherto doped and structured variants are preferred because, as mentioned, metal / polymer compounds are usually created under high production costs by thermal joining technologies. In particular, the reproducibility of a precise production must be ensured.

Bekannte Fügeverfahren haben ferner den Nachteil, dass sie Probleme der Positionierung im Hinblick auf ihre Zugänglichkeit für eine Massenfertigung nicht befriedigend lösen können.Known joining methods also have the disadvantage that they can not satisfactorily solve problems of positioning with regard to their accessibility for mass production.

Bei Flexleitern ist außerdem die Dauerhaltbarkeit der Fügeverbindung noch nicht zufriedenstellend, insbesondere wenn der Flexleiter häufigen Biegebelastungen unterworfen ist.In flex conductors also the durability of the joint connection is still not satisfactory, especially when the flex conductor is subjected to frequent bending loads.

Aus der US 3,414,487 sind Verfahren zur Herstellung gedruckter Schaltungen bekannt. Aus der DE 26 33 869 A1 ist eine direkte Verbindung von Metallen mit Keramikmaterialien und Metallen bekannt. Aus der DE 600 01 776 T2 ist ein Einkapselungsverfahren einer Halbleiteranordnung mit einem anisotropisch leitenden Kunststoff bekannt. Aus der US 2012/0085574 A1 sind ein wärmeabstrahlendes Substrat und ein Verfahren zu dessen Herstellung bekannt. Aus der DE 10 2005 036 517 A1 ist ein Metallbondingverfahren bekannt.From the US 3,414,487 For example, methods for producing printed circuits are known. From the DE 26 33 869 A1 is a direct connection of metals with ceramic materials and metals known. From the DE 600 01 776 T2 An encapsulation method of a semiconductor device having an anisotropically conductive plastic is known. From the US 2012/0085574 A1 For example, a heat radiating substrate and a method for its production are known. From the DE 10 2005 036 517 A1 For example, a metal bonding method is known.

Der Erfindung liegt daher die Aufgabe zugrunde, ein Verfahren zum Fügen von Strukturelementen auf Substratmaterialien anzugeben, das eine hohe Präzision bei der Herstellung mit einer hohen Haltbarkeit der Fügeverbindung verbindet. Ferner soll eine dementsprechende Anordnung sowie eine Einrichtung zur Herstellung einer solchen Anordnung angegeben werden.The invention is therefore based on the object of specifying a method for joining structural elements on substrate materials, which combines a high precision in the production with a high durability of the joint connection. Furthermore, a corresponding arrangement and a device for producing such an arrangement should be specified.

Diese Aufgabe wird durch ein Verfahren zum Fügen von Strukturelementen gemäß Anspruch 1 gelöst. Das Verfahren beinhaltet die Schritte:

  • a) Erzeugen einer oxidierten Oberfläche an der Verbindungsoberfläche des Strukturelements und/oder des Substratmaterials oder Verwenden eines Strukturelements und/oder Substratmaterials mit einer bereits oxidierten Oberfläche an dessen Verbindungsoberfläche,
  • b) Pressen der Verbindungsoberfläche des Strukturelements gegen die Verbindungsoberfläche des Substratmaterials mit einem bestimmten Anpressdruck ungleich Null bei gleichzeitiger Erwärmung zumindest der aneinander gepressten Verbindungsoberflächen auf eine Temperatur oberhalb einer Mindesttemperatur,
  • c) Beenden des Anpressens und der Erwärmung nach Erreichen einer bestimmten Diffusionstiefe der Diffusion wenigstens eines Bestandteils der Oxidschicht der oxidierten Oberfläche an der einen Verbindungsoberfläche in das Material der anderen Verbindungsoberfläche.
This object is achieved by a method for joining structural elements according to claim 1. The procedure includes the steps:
  • a) producing an oxidized surface at the bonding surface of the structural element and / or the substrate material or using a structural element and / or substrate material with an already oxidized surface at the bonding surface thereof,
  • b) pressing the connecting surface of the structural element against the connecting surface of the substrate material with a certain contact pressure equal to zero while simultaneously heating at least the pressing surfaces pressed against each other to a temperature above a minimum temperature,
  • c) terminating the pressing and the heating after reaching a certain diffusion depth of the diffusion of at least one component of the oxide layer of the oxidized surface at the one connecting surface into the material of the other connecting surface.

Die Erfindung hat den Vorteil, dass sie mit relativ geringem technischen Aufwand die Herstellung erheblich haltbarer Fügeverbindungen erlaubt als bekannte Verfahren. Insbesondere werden auch andere Nachteile bekannter Verfahren, die zu Problemen bei der Herstellpräzision führen, vermieden. So gibt es bei der Erfindung z.B. keine Probleme mit übertretender Schmelze, die nachträglich erst wieder entfernt werden muss. Das erfindungsgemäße Verfahren ist auch relativ robust gegenüber fertigungsbedingten Inhomogenitäten der erzeugten Anordnung, sodass ein hoher Grad an Reproduzierbarkeit der Fertigung, gerade auch in Massenfertigung, mit vergleichsweise geringem Aufwand erreicht werden kann. Das erfindungsgemäße Fügeverfahren kann ferner ohne Zusatzstoffe, die zur Herstellung der Fügeverbindung bei bekannten Verfahren erforderlich sind, durchgeführt werden, z.B. ohne Löt- oder Schweißmittel.The invention has the advantage that it allows the production of considerably more durable joint connections with relatively little technical effort than known methods. In particular, other disadvantages of known methods, which lead to problems in manufacturing precision, are avoided. Thus, in the invention, e.g. no problems with overflowing melt, which has to be removed again afterwards. The inventive method is also relatively robust to production-related inhomogeneities of the arrangement produced, so that a high degree of reproducibility of production, especially in mass production, can be achieved with relatively little effort. The joining method according to the invention can also be carried out without additives which are necessary for the preparation of the joining compound in known processes, e.g. without soldering or welding agent.

Mit dem erfindungsgemäßen Verfahren können z.B. elektrische und/oder elektronische Schaltungen hergestellt werden. Das Substratmaterial dient dabei als Träger, ähnlich wie die Platine oder das Flexleiter-Substrat bei bekannten Schaltungen. Als Beschichtung können Leiterbahnen auf das Substratmaterial aufgebracht werden. Ferner können Bauteile, z.B. elektrische und elektronische Bauteile, auf das Substratmaterial aufgebracht werden. Die Erfindung eignet sich aber auch für andere Anwendungsbereiche, in denen ein Fügeprozess mit hoher Haltbarkeit erforderlich ist. With the method according to the invention, for example, electrical and / or electronic circuits can be produced. The substrate material serves as a carrier, similar to the board or the flex conductor substrate in known circuits. As a coating, conductor tracks can be applied to the substrate material. Furthermore, components, for example electrical and electronic components, can be applied to the substrate material. However, the invention is also suitable for other applications in which a joining process with high durability is required.

Das Substratmaterial kann ein elektrisch leitendes oder ein elektrisch isolierendes Material sein. Als elektrisch isolierendes Material kann als Substratmaterial insbesondere ein organisches Kunststoffmaterial verwendet werden, z.B. in Form einer Folie oder einer dünnen Platte. So kann als Substratmaterial z.B. ein Polymermaterial verwendet werden, z.B. Polyethylenterephtalat oder Polyimid. Vorteilhaft sind insbesondere weiche Kunststoffe. Das Substratmaterial kann insbesondere ein optisches Polymermaterial sein, z.B. ein klartransparentes Material, wie z.B. Plexiglas. Auch Polycarbonate können vorteilhaft als Substratmaterial eingesetzt werden.The substrate material may be an electrically conductive or an electrically insulating material. As the electrically insulating material, as the substrate material, in particular, an organic plastic material may be used, e.g. in the form of a foil or a thin plate. Thus, as a substrate material, e.g. a polymeric material may be used, e.g. Polyethylene terephthalate or polyimide. Particularly advantageous are soft plastics. The substrate material may in particular be an optical polymer material, e.g. a clear transparent material, e.g. Plexiglas. Also, polycarbonates can be advantageously used as a substrate material.

Gemäß einer vorteilhaften Weiterbildung weist die Verbindungsoberfläche des Strukturelements ein Metall, eine Metalllegierung oder einen metallhaltigen Werkstoff auf, wobei dieses Material oxidierbar ist. Die Metalllegierung kann insbesondere eine eutektische Legierung sein. Der metallhaltige Werkstoff kann z.B. ein Kompositmaterial sein. Gemäß einer vorteilhaften Weiterbildung der Erfindung weist das Strukturelement zumindest im Bereich der Verbindungsoberfläche ein niedrigschmelzendes Metall oder eine Metalllegierung auf. Es kann sich z.B. um eine Indium-Zinn-Legierung handeln, z.B. 52In48Sn, oder eine andere Indium-Metall-Legierung. Im Falle einer Metalllegierung ist es vorteilhaft, die Legierungsmaterialien als Materialien mit im Wesentlichen gleicher dynamischer Viskosität auszuwählen. Hierdurch wird der Fügepartner homogen bereitgestellt, wodurch ein besonders homogener Diffusionsprozess der Oxidschicht erreicht werden kann.According to an advantageous development, the connection surface of the structural element to a metal, a metal alloy or a metal-containing material, said material is oxidizable. The metal alloy may in particular be a eutectic alloy. The metal-containing material may e.g. be a composite material. According to an advantageous development of the invention, the structural element has a low-melting metal or a metal alloy at least in the region of the connection surface. It can be e.g. to be an indium-tin alloy, e.g. 52In48Sn, or another indium-metal alloy. In the case of a metal alloy, it is advantageous to select the alloy materials as materials having substantially the same dynamic viscosity. As a result, the joining partner is provided homogeneously, whereby a particularly homogeneous diffusion process of the oxide layer can be achieved.

Das Strukturelement, insbesondere in Form der Beschichtung, kann auch als Mehrschichtsystem ausgebildet sein, z.B. in Form von Leiterbahnen, die als stromleitendes Element eine Edelmetall- oder Halbedelmetallschicht, z.B. Gold, Silber oder Kupfer, aufweisen, wobei an der Verbindungsoberfläche des Strukturelements die genannte Metallschicht oder Metalllegierungsschicht, die oxidierbar ist, angeordnet ist.The structural element, in particular in the form of the coating, can also be designed as a multilayer system, e.g. in the form of printed conductors which, as the current-conducting element, comprise a noble metal or semi-precious metal layer, e.g. Gold, silver or copper, wherein at the connecting surface of the structural element, the said metal layer or metal alloy layer which is oxidizable, is arranged.

Gemäß einer vorteilhaften Weiterbildung der Erfindung wird das Strukturelement mittels eines strukturierten Stempels gegen das Substratmaterial gepresst, wobei der Stempel ein Abbild der auf dem Substratmaterial zu erzeugenden geometrischen Struktur einer Beschichtung des Substratmaterials ist. Auf diese Weise können z.B. elektronische Schaltungen mit großer Präzision schnell und kostengünstig hergestellt werden. Mittels der Strukturierung des Stempels, die z.B. der zu erzeugenden Leiterbahnstruktur entsprechen kann, können die gewünschten Leiterbahnen auf dem Substratmaterial aufgepresst und zugleich durch die Diffusionsverbindung mittels der Oxidschicht stoffschlüssig befestigt werden. Bei entsprechender Ausgestaltung des Stempels können auch zugleich elektronische Bauteile der zu erzeugenden elektronischen Schaltung an dem Substratmaterial angebracht werden.According to an advantageous development of the invention, the structural element is pressed against the substrate material by means of a structured stamp, the stamp being an image of the geometric structure of a coating of the substrate material to be produced on the substrate material. In this way, e.g. electronic circuits can be manufactured with great precision quickly and inexpensively. By means of the structuring of the stamp, e.g. can correspond to the printed conductor structure to be produced, the desired conductor tracks can be pressed onto the substrate material and at the same time firmly bonded by the diffusion bonding by means of the oxide layer. With a corresponding design of the stamp, electronic components of the electronic circuit to be generated can also be attached to the substrate material at the same time.

Der beim Pressen einzustellende Anpressdruck muss selbstverständlich größer Null sein und sollte von seiner Höhe her so gewählt werden, dass innerhalb eines gewünschten, möglichst kurzen Zeitraums die bestimmte Diffusionstiefe der Diffusion der Oxidschicht in das Material der anderen Verbindungsoberfläche erreicht wird. Der Anpressdruck darf aber nicht so hoch gewählt werden, dass dabei das Strukturelement oder das Substratmaterial irreversibel deformiert oder anderweitig beschädigt wird. Beim Erzeugen von Beschichtungen, bei denen an der Verbindungsoberfläche das genannte niedrigschmelzende Metall oder die Metalllegierung vorhanden ist, auf einer Polymerfolie als Substratmaterial kann der Anpressdruck z.B. im Bereich von 0,1 bis 0,3 N/mm2 gewählt werden, z.B. bei 0,2 N/mm2.Of course, the contact pressure to be set during pressing must be greater than zero, and its height should be selected such that the determined diffusion depth of the diffusion of the oxide layer into the material of the other connection surface is achieved within a desired, shortest possible period of time. However, the contact pressure must not be so high that the structural element or the substrate material is irreversibly deformed or otherwise damaged. When producing coatings in which the said low-melting metal or metal alloy is present on the bonding surface, the contact pressure can be selected, for example, in the range from 0.1 to 0.3 N / mm 2 , for example at 0, on a polymer film as substrate material. 2 N / mm 2 .

Gemäß der Erfindung wird die Erwärmung auf eine Temperatur durchgeführt, die im Bereich der Solidustemperatur des Materials des Strukturelements zumindest an dessen Verbindungsoberfläche ist und geringer als die Liquidustemperatur des Substratmaterials ist. Hierdurch wird ein Wegschmelzen des Substratmaterials vermieden und zugleich die Diffusion der Oxidschicht in das Material der anderen Verbindungsoberfläche gefördert, z.B. von einer oxidierten Metall- oder Metalllegierungsschicht des Strukturelements in die Verbindungsoberfläche des Substratmaterials. Die Temperatur kann dabei gleich der Solidustemperatur des Materials des Strukturelements zumindest an dessen Verbindungsoberfläche sein, oder geringfügig darüber oder darunter. Wenn das Material des Strukturelements zumindest an dessen Verbindungsoberfläche ein nicht-eutektisches Material ist, ist es vorteilhaft, wenn die Temperatur unterhalb der Liquidustemperatur dieses Materials ist.According to the invention, the heating is carried out to a temperature which is in the region of the solidus temperature of the material of the structural element at least at its connecting surface and is less than the liquidus temperature of the substrate material. This avoids melting away the substrate material and at the same time promotes the diffusion of the oxide layer into the material of the other bonding surface, e.g. from an oxidized metal or metal alloy layer of the structural element into the bonding surface of the substrate material. The temperature may be equal to the solidus temperature of the material of the structural element at least at its connection surface, or slightly above or below it. If the material of the structural element is a non-eutectic material at least at its connecting surface, it is advantageous if the temperature is below the liquidus temperature of this material.

Gemäß einer vorteilhaften Weiterbildung der Erfindung wird die Erwärmung auf eine Temperatur durchgeführt, die unterhalb der Glasübergangstemperatur des Substratmaterials ist. Hierdurch wird insbesondere bei Substratmaterialien aus Kunststoffen eine unerwünschte Beschädigung oder Verformung während des Fügeprozesses vermieden.According to an advantageous development of the invention, the heating is carried out to a temperature which is below the glass transition temperature of the substrate material. As a result, in particular with substrate materials made of plastics avoid unwanted damage or deformation during the joining process.

Die oxidierte Oberfläche an der Verbindungsoberfläche des Strukturelements und/oder des Substratmaterials kann bereits dadurch erzeugt oder bereitgestellt werden, indem die Verbindungsoberfläche der Umgebungsluft ausgesetzt wird und dadurch selbsttätig oxidiert. Gemäß einer vorteilhaften Weiterbildung der Erfindung wird die Oxidation der Verbindungsoberfläche als kontrollierter, gleichmäßig gesteuerter Oxidationsprozess durchgeführt, insbesondere als beschleunigter Oxidationsprozess. Dies hat den Vorteil, dass eine besonders gleichmäßige, homogene Oxidschicht erzeugt werden kann. Dies führt wiederum dazu, dass die Präzision und Reproduzierbarkeit der Fügeverbindung weiter verbessert wird. Hierbei ist es vorteilhaft, die Oxidschicht in Form einer kontinuierlichen, gleichmäßigen von der Außenseite der Verbindungsoberfläche nach Innen verlaufenden Oxidation durchzuführen. Der kontrollierte, gleichmäßig gesteuerte Oxidationsprozess kann z.B. mittels eines Oxidationsofens durchgeführt werden. Hierbei kann die Oxidation weiter optimiert werden durch Zuführung eines geeigneten Oxidationsgases, z.B. unter Verwendung von Präkursoren und/oder Reaktoren zur Vermeidung von ungewollten Reaktionen oder Verunreinigungen an der Verbindungsoberfläche.The oxidized surface at the bonding surface of the structural member and / or the substrate material may already be created or provided by exposing the bonding surface to ambient air and thereby self-oxidizing. According to an advantageous development of the invention, the oxidation of the connection surface is carried out as a controlled, uniformly controlled oxidation process, in particular as an accelerated oxidation process. This has the advantage that a particularly uniform, homogeneous oxide layer can be produced. This in turn means that the precision and reproducibility of the joint connection is further improved. In this case, it is advantageous to carry out the oxide layer in the form of a continuous, uniform oxidation proceeding inwards from the outside of the connection surface. The controlled, uniformly controlled oxidation process may be e.g. be carried out by means of an oxidation furnace. In this case, the oxidation can be further optimized by supplying a suitable oxidizing gas, e.g. using precursors and / or reactors to prevent unwanted reactions or impurities on the interface surface.

Gemäß einer vorteilhaften Weiterbildung der Erfindung wird das Strukturelement und/oder das Substratmaterial während der Durchführung des Fügeverfahrens mittels Unterdruck temporär fixiert. Dies hat den Vorteil, dass die häufig relativ kleinen und/oder empfindlichen Strukturelemente und Substratmaterialien zuverlässig gehalten werden können, ohne sie dabei zu beschädigen. Für die Erzeugung des Unterdrucks reichen kleine Differenzdrücke zum Umgebungsdruck bereits aus, um eine sichere Fixierung zu gewährleisten. Der Unterdruck kann dabei während des gesamten Fügeprozesses aufrecht erhalten werden. Durch den Unterdruck wird das Strukturelement bzw. das Substratmaterial angesaugt und hierdurch an einem Bauteilaufnehmer gehalten.According to an advantageous embodiment of the invention, the structural element and / or the substrate material is temporarily fixed during the implementation of the joining process by means of negative pressure. This has the advantage that the often relatively small and / or sensitive structural elements and substrate materials can be reliably maintained without damaging them. For generating the negative pressure, small differential pressures to the ambient pressure are already sufficient to ensure a secure fixation. The negative pressure can be maintained during the entire joining process. Due to the negative pressure, the structural element or the substrate material is sucked and thereby held on a component pickup.

Gemäß einer vorteilhaften Weiterbildung der Erfindung kann während des Anpressvorgangs mittels eines Anpresswerkzeugs unter Ausnutzung des Kapillardrucks die Fließrichtung des Materials der Beschichtung kontrolliert werden. So kann beim Aufsetzen des Anpresswerkzeugs auf das zu verfügende Bauteil temperaturbedingt ein nahezu luftdichtes System erzeugt werden, weil die in Folge der Erwärmung erzeugte „halbflüssige“ Schicht wie eine Dichtung wirkt. Dies ist wiederum vorteilhaft für die Durchführung der Unterdruck-Ansaugung des Bauteils. Aber auch nahezu vollkommen flüssige Schichten sind durch das beschriebene Verfahren verfügbar.According to an advantageous embodiment of the invention, the flow direction of the material of the coating can be controlled during the Anpressvorgangs means of a Anpresswerkzeugs taking advantage of the capillary pressure. Thus, when placing the Anpresswerkzeugs on the component to be equipped temperature-induced a nearly airtight system can be generated because the generated as a result of heating "semi-liquid" layer acts as a seal. This in turn is advantageous for carrying out the vacuum suction of the component. But also almost completely liquid layers are available by the method described.

Das Anpresswerkzeug kann dabei über Ansaugkanäle für die Erzeugung des Unterdrucks verfügen. Ein zusätzlich in das Anpresswerkzeug eingebrachter Entlüftungskanal kann im Bedarfsfall zum Abbau des Unterdrucks belüftet werden. Als Anpresswerkzeug kann z.B. der bereits erwähnte Stempel dienen.The pressing tool can have suction channels for generating the negative pressure. An additional venting channel inserted in the pressing tool can be vented if necessary to reduce the negative pressure. As a pressing tool, e.g. serve the aforementioned stamp.

Die vorliegende Erfindung gewährleistet einen stoffschlüssigen, präzisen Fügeprozess, der produktionstechnisch bauteil- bzw. substratunabhängig ist, mit dem Vorteil, dass Nachbearbeitungsprozesse entfallen können, Fügewerkzeuge ähnlich einem Stempel eingesetzt werden können und hierdurch der Zugang zur Massenfertigung ermöglicht wird.The present invention ensures a cohesive, precise joining process that is production-independent component or substrate-independent, with the advantage that post-processing processes can be omitted, joining tools similar to a stamp can be used and thus access to mass production is possible.

Beschrieben wird außerdem eine Anordnung aus wenigstens einem organischen oder nicht-organischen Substratmaterial und wenigstens einem stoffschlüssig damit verbundenen Strukturelement, wobei Strukturelemente Beschichtungen und/oder Bauteile sein können, wobei die stoffschlüssige Verbindung als Diffusionsverbindung zwischen einer Verbindungsoberfläche des Substratmaterials und einer Verbindungsoberfläche des Strukturelements ausgebildet ist und innerhalb einer Diffusionszone der Diffusionsverbindung sich wenigstens ein Bestandteil einer oxidierte Oberfläche der Verbindungsoberfläche des Substratmaterials und/oder des Strukturelements befindet. Die Diffusionsverbindung ist dabei eine durch Diffusion erzeugte stoffschlüssige Verbindung zwischen den beiden Verbindungsoberflächen. Die Anordnung kann aus den zuvor für das Fügeverfahren genannten Materialien gebildet werden, insbesondere im Hinblick auf das Substratmaterial und das Material der Strukturelemente. Die Anordnung kann insbesondere als flexible elektronische Schaltung ausgebildet sein.Described is also an arrangement of at least one organic or non-organic substrate material and at least one materially connected thereto structural element, wherein structural elements coatings and / or components may be, wherein the cohesive connection is formed as a diffusion bond between a connection surface of the substrate material and a connection surface of the structural element and within a diffusion zone of the diffusion compound is at least a constituent of an oxidized surface of the bonding surface of the substrate material and / or the structural member. In this case, the diffusion connection is a cohesive connection produced by diffusion between the two connection surfaces. The arrangement can be formed from the materials mentioned above for the joining process, in particular with regard to the substrate material and the material of the structural elements. The arrangement can be designed in particular as a flexible electronic circuit.

Die eingangs genannte Aufgabe wird ferner durch eine Einrichtung gemäß Anspruch 7 gelöst. Dies umfasst eine Einrichtung zur Herstellung einer Anordnung unter Verwendung eines Verfahrens der zuvor beschriebenen Art, mit einer Anpressvorrichtung zum Anpressen der Verbindungsoberfläche des Substratmaterials an die Verbindungsoberfläche des Strukturelements mit einer definierten Anpresskraft. Mit einer solchen Einrichtung können ebenfalls die zuvor genannten Vorteile erzielt werden.The object mentioned above is further achieved by a device according to claim 7. This comprises a device for producing an assembly using a method of the type described above, with a pressing device for pressing the connection surface of the substrate material to the connecting surface of the structural element with a defined contact pressure. With such a device, the aforementioned advantages can also be achieved.

Gemäß einer vorteilhaften Weiterbildung der Erfindung weist die Einrichtung einen strukturierten Stempel auf, der eine Strukturierung entsprechend einem Abbild der auf dem Substratmaterial zu erzeugenden geometrischen Struktur einer Beschichtung des Substratmaterials aufweist. According to an advantageous development of the invention, the device has a structured stamp which has a structuring corresponding to an image of the geometrical structure of a coating of the substrate material to be produced on the substrate material.

Gemäß einer vorteilhaften Weiterbildung der Erfindung weist der Stempel Aussparungen zur Aufnahme von mittels des Stempels auf dem Substratmaterial aufzubringenden Bauteilen auf. Dies hat den Vorteil, dass insbesondere elektronische Schaltungen in einem Arbeitsschritt derart hergestellt werden können, dass sowohl die elektrischen Leiterbahnen auf dem Substratmaterial befestigt werden als auch elektrische und/oder elektronische Bauteile auf dem Substratmaterial oder den hergestellten Leiterbahnen befestigt und daran elektrisch angeschlossen werden können. Dies erlaubt eine hoch effiziente Massenfertigung von Anordnungen der zuvor genannten Art, insbesondere in Form von elektronischen Schaltungen.According to an advantageous embodiment of the invention, the punch on recesses for receiving by means of the stamp on the substrate material applied components. This has the advantage that in particular electronic circuits can be manufactured in one step in such a way that both the electrical conductor tracks are fastened to the substrate material and electrical and / or electronic components can be fastened and electrically connected to the substrate material or the produced conductor tracks. This allows a highly efficient mass production of arrangements of the aforementioned type, in particular in the form of electronic circuits.

Gemäß einer vorteilhaften Weiterbildung der Erfindung weist der Stempel an seiner Andruckseite, mit der er mit der am Substratmaterial anzupressenden Beschichtung in Kontakt kommt, eine Antihaftbeschichtung auf. Dies hat den Vorteil, dass der Stempel nach Durchführung des Anpressvorgangs im Wesentlichen ohne Rückstände des Beschichtungsmaterials wieder entfernt werden kann. Hierdurch werden insbesondere unerwünschte Beschädigungen durch das Entfernen des Stempels am Beschichtungsmaterial vermieden. Die Antihaftbeschichtung kann aus Teflon oder anderen Materialien, die eine Lotuseffekt-Oberfläche hervorrufen, verwendet werden.According to an advantageous development of the invention, the stamp has on its pressure side, with which it comes into contact with the coating to be applied to the substrate material, a non-stick coating. This has the advantage that the stamp can be removed after carrying out the Anpressvorgangs substantially without residues of the coating material again. As a result, in particular unwanted damage caused by the removal of the stamp on the coating material. The non-stick coating can be made of Teflon or other materials that create a lotus effect surface.

Gemäß der Erfindung weist die Einrichtung eine Beheizungseinrichtung auf, die zur Beheizung des Strukturelements und/oder Substratmaterials zumindest im Bereich der Verbindungsoberflächen eingerichtet ist. Dies hat den Vorteil, dass die erfindungsgemäße Einrichtung bereits integrierte Mittel zur Erzeugung der notwendigen Erwärmung im Bereich der Verbindungsoberflächen aufweist und keine externe Beheizung notwendig ist. Die Beheizungseinrichtung kann z.B. ganz oder teilweise in den strukturierten Stempel integriert sein. Die Beheizungseinrichtung kann z.B. in Form von Heizkartuschen oder als Heißluft-Heizung ausgebildet sein. Für die Realisierung der Heißluft-Heizung können im Stempel dünne Luftkanäle (Kapillare) vorgesehen sein.According to the invention, the device has a heating device which is set up for heating the structural element and / or substrate material at least in the region of the connecting surfaces. This has the advantage that the device according to the invention already has integrated means for generating the necessary heating in the region of the connecting surfaces and no external heating is necessary. The heating device may e.g. be fully or partially integrated in the structured stamp. The heating device may e.g. be designed in the form of cartridges or as a hot air heater. For the realization of the hot-air heating thin air ducts (capillary) can be provided in the stamp.

Generell ist es vorteilhaft, die sich in der Fügezone befindenden Werkzeugbestandteile im Hinblick auf ihre Geometrie abzurunden bzw. mit einer Antihaftbeschichtung zu versehen. Dies kann insbesondere bei den Kapillaren durch Erzeugen von Inlays realisiert werden, die zur Erzeugung von sehr dünnen Kanälen durch spanende Bearbeitung erzeugt werden können. Ferner können auch aktive Absaugvorrichtungen zum Zwecke der Schmelzeführung eingesetzt werden.In general, it is advantageous to round off the tool components located in the joining zone with respect to their geometry or to provide them with a non-stick coating. This can be realized in particular in the capillaries by producing inlays, which can be produced by machining to produce very thin channels. Furthermore, active suction devices can be used for the purpose of melt management.

Die Erfindung wird nachfolgend anhand von Ausführungsbeispielen unter Verwendung von Zeichnungen näher erläutert.The invention will be explained in more detail by means of embodiments using drawings.

Es zeigen:

  • 1 bis 3 die Schritte des Erzeugens von Beschichtungen in Form von Leiterbahnen auf einer Polymerfolie und
  • 4 bis 7 die Schritte des monolithischen Beschichtens einer Polymerfolie mit Leiterbahnen und des Bestückens mit Bauteilen und
  • 8 ein Schnittbild einer realen Probe, die eine Diffusionsverbindung zwischen einem Strukturelement in Form einer Beschichtung und einem Substrat in Form einer Polymerfolie aufweist.
Show it:
  • 1 to 3 the steps of producing coatings in the form of printed conductors on a polymer film and
  • 4 to 7 the steps of monolithic coating of a polymer film with conductor tracks and the assembly of components and
  • 8th a sectional view of a real sample having a diffusion bond between a structural element in the form of a coating and a substrate in the form of a polymer film.

In den Figuren werden gleiche Bezugszeichen für einander entsprechende Elemente verwendet.In the figures, like reference numerals are used for corresponding elements.

Die in den 1 bis 3 dargestellte Einrichtung 1 zur Herstellung einer erfindungsgemäßen Anordnung weist einen strukturierten Stempel 8 auf, an dem an einer mit einer Antihaftschichtung 7 versehenen Seite Strukturen von Leiterbahnen angeordnet sind, die als Beschichtung 3 auf ein Substratmaterial 2, hier beispielhaft ein Polymerfilm, aufgebracht werden sollen. Die Beschichtungen 3 sind als Schichtaufbau aus einem eine Leiterbahn bildenden Metall 5 und als Oberschicht 6 aus einer oxidierten Metalllegierung ausgebildet, die eine Verbindungsoberfläche 30 der Beschichtung 3 bildet. Insbesondere kann eine indiumbasierte Legierung als oxidierte Oberschicht 6 vorgesehen sein. Der Polymerfilm 2 ist auf einer in den Figuren nicht dargestellten Auflagefläche der Einrichtung 1 angeordnet und daran z.B. durch Adhäsion fixiert. Das Substratmaterial 2 weist eine zu den Beschichtungen 3 gerichtete Verbindungsoberfläche 20 auf.The in the 1 to 3 illustrated device 1 for producing an arrangement according to the invention has a structured stamp 8th on, on the one at with a non-stick coating 7 provided side structures of printed conductors are arranged as a coating 3 on a substrate material 2 , here by way of example a polymer film, to be applied. The coatings 3 are as a layer structure of a conductor forming a metal 5 and as the upper class 6 formed of an oxidized metal alloy having a bonding surface 30 the coating 3 forms. In particular, an indium-based alloy may be used as the oxidized upper layer 6 be provided. The polymer film 2 is on a supporting surface, not shown in the figures of the device 1 arranged and fixed thereto, for example by adhesion. The substrate material 2 indicates one of the coatings 3 directed connection surface 20 on.

In dem Stempel 8 befindet sich ein Kanalsystem 9, das mit einem Heiz- und Saugkopf 16 gekoppelt ist. Hierüber kann ein Ansaugen der Beschichtungen 3 an die antihaftbeschichtete Oberfläche des Stempels 8 mittels Unterdruck erfolgen. Zudem kann eine Beheizung zur Erreichung einer ausreichenden Erwärmung im Bereich der Verbindungsoberflächen 20, 30 durch Durchleiten erwärmter Luft durch Heizkanäle des Kanalsystems 9 erfolgen. Der Stempel 8 ist ferner mit einer Mikropositioniereinheit 10 verbunden, mit der eine hoch genaue Positionierung des Stempels gegenüber dem Substratmaterial 2 in drei Raumrichtungen erfolgen kann.In the stamp 8th there is a channel system 9 that with a heating and suction head 16 is coupled. This can be a suction of the coatings 3 to the non-stick coated surface of the stamp 8th done by means of negative pressure. In addition, a heating to achieve a sufficient heating in the area of the bonding surfaces 20 . 30 by passing heated air through heating channels of the sewer system 9 respectively. The Stamp 8th is further provided with a micropositioning unit 10 connected with the highly accurate positioning of the punch relative to the substrate material 2 can be done in three directions.

Die 1 zeigt die Einrichtung 1 in einem mit den Beschichtungen 3 vorbereiteten, bestückten Zustand. Gemäß 2 erfolgt der Schritt des Pressens der Verbindungsoberfläche 30 der Beschichtungen 3 an die Verbindungsoberfläche 20 des Polymermaterials 2. Hierbei wird eine Anpresskraft 11 erzeugt, die einen vorbestimmten Anpressdruck zwischen dem Substratmaterial und dem Strukturelement erzeugt. Zugleich erfolgt eine Erwärmung der aneinander gepressten Verbindungsoberflächen auf eine Temperatur oberhalb einer Mindesttemperatur, zumindest oberhalb von 50°C. Wie erwähnt, kann die Erwärmung auf eine Temperatur durchgeführt wird, die nahe oder oberhalb der Solidustemperatur des Materials der Beschichtungen 3 zumindest an deren Verbindungsoberflächen 30 ist und geringer als der Glasübergangstemperatur des Polymermaterials 2 ist. Nun beginnt die Oxidschicht in das Material der Verbindungsoberfläche 20 bzw. in das Polymermaterial 2 hinein zu diffundieren. Hierbei bilden sich Sauerstoffbrücken zwischen der Oxidschicht und dem Polymermaterial 2.The 1 shows the device 1 in one with the coatings 3 prepared, stocked condition. According to 2 the step of pressing the bonding surface occurs 30 the coatings 3 to the connection surface 20 of the polymer material 2 , This is a contact pressure 11 generates, which generates a predetermined contact pressure between the substrate material and the structural element. At the same time, a heating of the pressed against each other connecting surfaces to a temperature above a minimum temperature, at least above 50 ° C. As mentioned, the heating may be performed at a temperature close to or above the solidus temperature of the material of the coatings 3 at least at their connection surfaces 30 is and less than the glass transition temperature of the polymer material 2 is. Now the oxide layer begins in the material of the connection surface 20 or in the polymer material 2 to diffuse into. In this case, oxygen bridges form between the oxide layer and the polymer material 2 ,

Der Zustand gemäß 2 wird solange beibehalten, bis die Oxidschicht der oxidierten Oberfläche an der Verbindungsoberfläche 30 ausreichend tief in das Material der Verbindungsoberfläche 20 bzw. in das Polymermaterial 2 diffundiert ist. Nach Erreichen einer bestimmten Diffusionstiefe werden der Anpressvorgang sowie die Erwärmung beendet. Der Stempel 8 wird mittels einer Zugkraft 12 von der nun fertigen Anordnung aus dem Substratmaterial 2 sowie den Beschichtungen 3 entfernt. Dies gelingt dank der Antihaftbeschichtung 7 im Wesentlichen rückstandsfrei.The condition according to 2 is maintained until the oxide layer of the oxidized surface at the bonding surface 30 sufficiently deep in the material of the bonding surface 20 or in the polymer material 2 is diffused. After reaching a certain depth of diffusion of the pressing and heating are stopped. The Stamp 8th is by means of a tensile force 12 from the now finished arrangement of the substrate material 2 as well as the coatings 3 away. This succeeds thanks to the non-stick coating 7 essentially residue-free.

Das anhand der 1 bis 3 beschriebene Verfahren zum Fügen der Beschichtungen 3 an dem Substratmaterial 2 kann auch erweitert werden zu einem monolithischen Beschichtungs- und Bestückungsverfahren, bei dem zugleich elektronische Bauteile mittels des Stempels 8 auf dem als flexible Leiterplatte dienenden Substratmaterial 2 angebracht werden. Dies wird nachfolgend anhand der 4 bis 7 beschrieben. Es wird wiederum eine Einrichtung 1 verwendet, die im Wesentlichen so aufgebaut ist wie zuvor anhand der 1 bis 3 beschrieben. Im Unterschied zu der Einrichtung 1 gemäß den 1 bis 3 weist der Stempel 8 eine oder mehrere Aussparungen zur Aufnahme jeweils eines Bauteils 4 auf. Wie in 4 erkennbar, kann ein Bauteil 4 z.B. zwischen zwei Beschichtungen 3 in einer Aussparung des Stempels 8 angeordnet werden. Hierbei ist das Bauteil 4 bereits mit einer Lötmittelschicht 13 an der dem Substratmaterial 2 zugewandten Seite versehen, z.B. mit Lötzinn. Die Beheizung sowie das Fixieren der Beschichtungen 3 und diesem Fall zusätzlich des Bauteils 4 erfolgt wie zuvor mittels des kombinierten Heiz- und Saugkopfs 16. Das Bauteil 4 kann z.B. ein SMD-Bauteil (SMD - Surface Mounted Device) sein, z.B. eine Leuchtdiode, ein Widerstand oder ein Kondensator.That on the basis of 1 to 3 described method for joining the coatings 3 on the substrate material 2 can also be extended to a monolithic coating and assembly process, in which at the same time electronic components by means of the punch 8th on the serving as a flexible printed circuit substrate material 2 be attached. This will be explained below with reference to 4 to 7 described. It will turn into a device 1 used, which is constructed substantially as previously based on the 1 to 3 described. Unlike the decor 1 according to the 1 to 3 has the stamp 8th one or more recesses for receiving a respective component 4 on. As in 4 recognizable, can be a component 4 eg between two coatings 3 in a recess of the stamp 8th to be ordered. Here is the component 4 already with a solder layer 13 at the substrate material 2 facing side, eg with solder. The heating and fixing of the coatings 3 and this case additionally of the component 4 takes place as before by means of the combined heating and suction head 16 , The component 4 For example, it may be an SMD component (SMD - Surface Mounted Device), eg a light emitting diode, a resistor or a capacitor.

Die Befestigung des Bauteils 4 an dem Substratmaterial 2 kann auch durch Kleben erfolgen, z.B. mit einem anisotropen (elektrisch leitfähigen) Klebstoff.The attachment of the component 4 on the substrate material 2 can also be done by gluing, eg with an anisotropic (electrically conductive) adhesive.

Gemäß 5 erfolgt wiederum der Anpressvorgang zum Erzeugen der stoffschlüssigen Diffusionsverbindung zwischen der Oxidschicht an der Verbindungsoberfläche 30 mit dem Substratmaterial 2, wie zuvor anhand der 2 erläutert. Das Bauteil 4 sowie die Lötmittelschicht 13 wird zu diesem Zeitpunkt noch nicht beaufschlagt. Sobald die gewünschte Diffusionsverbindung mit der bestimmten Diffusionstiefe hergestellt ist, kann unmittelbar eine Herstellung einer Lötverbindung zum elektrischen Kontaktieren des Bauteils 4 mit den benachbarten Leiterbahnen 5 erfolgen, wie in der 6 anhand der nun durch das Lötmittel überbrückten Lücken 14 dargestellt ist. Das Lötmittel kann z.B. durch Erwärmen mittels des Stempels 8 verflüssigt werden. Nach Erkalten des Lötmittels ist zugleich das Bauteil 4 mechanisch an dem Substratmaterial 2 fixiert. Sodann wird der Stempel 8 entfernt, wie in 7 dargestellt. Die 7 zeigt damit zugleich eine fertige Anordnung aus dem Substratmaterial 2 mit den damit verbundenen Beschichtungen 3 sowie dem Bauteil 4.According to 5 in turn, the pressing process for generating the cohesive diffusion bond between the oxide layer at the connection surface 30 with the substrate material 2 as previously based on the 2 explained. The component 4 and the solder layer 13 will not be charged at this time. Once the desired diffusion bonding having the particular diffusion depth is established, fabrication of a solder joint for electrically contacting the device may be instantaneous 4 with the neighboring tracks 5 done as in the 6 based on the now bridged by the solder gaps 14 is shown. The solder can eg by heating by means of the punch 8th be liquefied. After cooling of the solder is also the component 4 mechanically to the substrate material 2 fixed. Then the stamp 8th removed, as in 7 shown. The 7 shows at the same time a finished arrangement of the substrate material 2 with the associated coatings 3 as well as the component 4 ,

Die 8 zeigt einen Ausschnitt einer realen Probe mit der Diffusionsverbindung zwischen dem Bauteil 3 und dem Substratmaterial 2. Erkennbar ist, dass die oxidierte Oberschicht 6 der indiumbasierten Legierung gleichmäßig in das Polymermaterial 2 hinein diffundiert ist und Diffusionsbereiche 17 herausgebildet hat. Vorteilhaft ist hierbei insbesondere eine kontinuierliche, gleichmäßige, von Außen nach Innen verlaufende Oxidation, wie durch die Ellipse 15 in 8 markiert.The 8th shows a section of a real sample with the diffusion connection between the component 3 and the substrate material 2 , It can be seen that the oxidized upper layer 6 of the indium-based alloy evenly into the polymeric material 2 diffused into and diffusion areas 17 has emerged. In this case, it is particularly advantageous to have a continuous, uniform, from outside to inside, oxidation, as by the ellipse 15 in 8th marked.

Claims (10)

Verfahren zum Fügen von Strukturelementen (3, 4) in Form von Beschichtungen (3) und/oder Bauteilen (4) auf organischen Substratmaterialien (2), bei dem eine Verbindungsoberfläche (30) wenigstens eines Strukturelements (3, 4) mit einer Verbindungsoberfläche (20) wenigstens eines Substratmaterials (2) in Form eines organischen Kunststoffmaterials stoffschlüssig verbunden wird, gekennzeichnet durch die Schritte: a) Erzeugen einer oxidierten Oberfläche an der Verbindungsoberfläche (20, 30) des Strukturelements (3, 4) und/oder des Substratmaterials (2) oder Verwenden eines Strukturelements (3, 4) und/oder Substratmaterials (2) mit einer bereits oxidierten Oberfläche an dessen Verbindungsoberfläche (20, 30), b) Pressen der Verbindungsoberfläche (30) des Strukturelements (3, 4) gegen die Verbindungsoberfläche (20) des Substratmaterials (2) mit einem bestimmten Anpressdruck (11) ungleich Null bei gleichzeitiger Erwärmung zumindest der aneinander gepressten Verbindungsoberflächen (20, 30) auf eine Temperatur oberhalb einer Mindesttemperatur, wobei die Erwärmung auf eine Temperatur durchgeführt wird, die im Bereich der Solidustemperatur des Materials des Strukturelements (3, 4) zumindest an dessen Verbindungsoberfläche (30) ist und geringer als die Liquidustemperatur des Substratmaterials (2) ist, c) Beenden des Anpressens und der Erwärmung nach Erreichen einer bestimmten Diffusionstiefe der Diffusion wenigstens eines Bestandteils der Oxidschicht der oxidierten Oberfläche an der einen Verbindungsoberfläche (20, 30) in das Material der anderen Verbindungsoberfläche (20, 30). Method for joining structural elements (3, 4) in the form of coatings (3) and / or components (4) on organic substrate materials (2), in which a connecting surface (30) of at least one structural element (3, 4) having a connecting surface (3) 20) of at least one substrate material (2) in the form of an organic plastic material, characterized by the steps: a) producing an oxidized surface on the connecting surface (20, 30) of the structural element (3, 4) and / or of the substrate material (2 ) or using a structural element (3, 4) and / or substrate material (2) with an already oxidized surface on its connecting surface (20, 30), b) pressing the connecting surface (30) of the structural element (3, 4) against the connecting surface ( 20) of the substrate material (2) with a certain contact pressure (11) not equal to zero with simultaneous heating of at least the pressing surfaces pressed together (2 0, 30) to a temperature above a minimum temperature, wherein the heating is carried out to a temperature which is in the range of the solidus temperature of the material of the structural element (3, 4) at least at its connecting surface (30) and is less than the liquidus temperature of the substrate material (2), c) stopping the pressing and the Heating, after reaching a certain diffusion depth, the diffusion of at least one constituent of the oxide layer of the oxidized surface at the one connection surface (20, 30) into the material of the other connection surface (20, 30). Verfahren nach Anspruch 1, dadurch gekennzeichnet, dass das Strukturelement (3, 4) mittels eines strukturierten Stempels (8) gegen das Substratmaterial (2) gepresst wird, wobei der Stempel (8) ein Abbild der auf dem Substratmaterial (2) zu erzeugenden geometrischen Struktur einer Beschichtung (3) des Substratmaterials (2) ist.Method according to Claim 1 , characterized in that the structural element (3, 4) is pressed against the substrate material (2) by means of a structured stamp (8), the stamp (8) being an image of the geometric structure of a coating () to be produced on the substrate material (2). 3) of the substrate material (2). Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Erwärmung auf eine Temperatur durchgeführt wird, die unterhalb der Glasübergangstemperatur des Substratmaterials (2) ist.Method according to one of the preceding claims, characterized in that the heating is carried out to a temperature which is below the glass transition temperature of the substrate material (2). Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Verbindungsoberfläche (30) des Strukturelements (3, 4) ein Metall, eine Metalllegierung oder einen metallhaltigen Werkstoff aufweist, wobei dieses Material oxidierbar ist.Method according to one of the preceding claims, characterized in that the connecting surface (30) of the structural element (3, 4) comprises a metal, a metal alloy or a metal-containing material, wherein said material is oxidizable. Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Oxidation der Verbindungsoberfläche als kontrollierter, gleichmäßig gesteuerter Oxidationsprozess durchgeführt wird.Method according to one of the preceding claims, characterized in that the oxidation of the bonding surface is carried out as a controlled, uniformly controlled oxidation process. Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das Strukturelement (3, 4) und/oder das Substratmaterial (2) während der Durchführung des Fügeverfahrens mittels Unterdruck temporär fixiert wird.Method according to one of the preceding claims, characterized in that the structural element (3, 4) and / or the substrate material (2) is temporarily fixed during the implementation of the joining process by means of negative pressure. Einrichtung (1) zur Herstellung einer Anordnung unter Verwendung eines Verfahrens nach einem der Ansprüche 1 bis 6, mit einer Anpressvorrichtung (7, 8) zum Anpressen der Verbindungsoberfläche (20) des Substratmaterials (2) in Form eines organischen Kunststoffmaterials an die Verbindungsoberfläche (30) des Strukturelements (3, 4) mit einer definierten Anpresskraft (11), wobei die Einrichtung eine Beheizungseinrichtung (16) aufweist, die zur Beheizung des Strukturelements (3, 4) und/oder des Substratmaterials (2) zumindest im Bereich der Verbindungsoberflächen (20, 30) derart eingerichtet ist, dass die Erwärmung auf eine Temperatur durchgeführt wird, die im Bereich der Solidustemperatur des Materials des Strukturelements (3, 4) zumindest an dessen Verbindungsoberfläche (30) ist und geringer als die Liquidustemperatur des Substratmaterials (2) ist.Device (1) for producing an assembly using a method according to one of the Claims 1 to 6 , with a pressing device (7, 8) for pressing the connection surface (20) of the substrate material (2) in the form of an organic plastic material to the connecting surface (30) of the structural element (3, 4) with a defined contact pressure (11), wherein the device a heating device (16) which is arranged for heating the structural element (3, 4) and / or the substrate material (2) at least in the region of the connecting surfaces (20, 30) such that the heating is carried out to a temperature which is in Range of the solidus temperature of the material of the structural element (3, 4) at least at the connecting surface (30) and is less than the liquidus temperature of the substrate material (2). Einrichtung nach Anspruch 7, dadurch gekennzeichnet, dass die Einrichtung (1) einen strukturierten Stempel (8) aufweist, der eine Strukturierung entsprechend einem Abbild der auf dem Substratmaterial (2) zu erzeugenden geometrischen Struktur einer Beschichtung (3) des Substratmaterials (2) aufweist.Setup after Claim 7 , characterized in that the device (1) has a structured stamp (8) which has a structuring corresponding to an image of the geometrical structure of a coating (3) of the substrate material (2) to be produced on the substrate material (2). Einrichtung nach Anspruch 8, dadurch gekennzeichnet, dass der Stempel (8) Aussparungen zur Aufnahme von mittels des Stempels (8) auf dem Substratmaterial (2) aufzubringenden Bauteilen (4) aufweist.Setup after Claim 8 , characterized in that the punch (8) has recesses for receiving by means of the punch (8) on the substrate material (2) to be applied components (4). Einrichtung nach Anspruch 8 oder 9, dadurch gekennzeichnet, dass der Stempel (8) an seiner Andruckseite, mit der er mit der am Substratmaterial (2) anzupressenden Beschichtung (3) in Kontakt kommt, eine Antihaftbeschichtung (7) aufweist.Setup after Claim 8 or 9 , characterized in that the punch (8) on its pressure side, with which it comes into contact with the substrate material (2) to be pressed coating (3), a non-stick coating (7).
DE102014104510.6A 2014-03-31 2014-03-31 Method for joining and device for joining an assembly using the method Expired - Fee Related DE102014104510B4 (en)

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DE102007027999A1 (en) * 2007-06-14 2008-12-18 Leonhard Kurz Gmbh & Co. Kg Hot embossing of structures
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