DE102013211693B3 - Micro-electromechanical angle/slant sensor for use as acceleration sensor for e.g. microphone, has micro-electromechanical chip provided on printed circuit board, where interruptions perform thermal and mechanical decoupling of chip - Google Patents

Micro-electromechanical angle/slant sensor for use as acceleration sensor for e.g. microphone, has micro-electromechanical chip provided on printed circuit board, where interruptions perform thermal and mechanical decoupling of chip Download PDF

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DE102013211693B3
DE102013211693B3 DE201310211693 DE102013211693A DE102013211693B3 DE 102013211693 B3 DE102013211693 B3 DE 102013211693B3 DE 201310211693 DE201310211693 DE 201310211693 DE 102013211693 A DE102013211693 A DE 102013211693A DE 102013211693 B3 DE102013211693 B3 DE 102013211693B3
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circuit board
chip
micro
electromechanical
sensor
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Erich Griessler
Michael Danitschek
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I-FOR-T GmbH
i for T GmbH
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I-FOR-T GmbH
i for T GmbH
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C9/00—Measuring inclination, e.g. by clinometers, by levels
    • G01C9/02—Details
    • G01C9/06—Electric or photoelectric indication or reading means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/062—Means for thermal insulation, e.g. for protection of parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)

Abstract

The sensor has a micro-electromechanical (MEMS) chip (1) provided on a printed circuit board (2). A heating element (3) maintains moderate temperature of the MEMS chip, and is located on the MEMS chip and a side of the circuit board. Interruptions (4) perform thermal and mechanical decoupling of the MEMS chip and direct heat flow between the MEMS chip and the heating element. A cooling element i.e. Peltier element, is provided in the circuit board. The MEMS chip is a three-dimensional acceleration sensor ADXL 326 of firm analog devices (IC1).

Description

Die Erfindung betrifft einen Sensor mit einem thermostatierten mikroelektromechanischen Chip.The invention relates to a sensor with a thermostated microelectromechanical chip.

Mikro-Elektro-Mechanische Sensoren (MEMS) sind Bauelemente, die mikroskopisch kleine Sensoren oder auch Aktoren mit elektronischen Bauelementen auf einen Chip vereinen. Sie sind kostengünstig herstellbar und benötigen nur wenig Raum.Micro-electro-mechanical sensors (MEMS) are components that combine microscopic sensors or actuators with electronic components on a single chip. They are inexpensive to produce and require little space.

Häufige Anwendungen sind Neigungs- oder Winkelsensoren, Beschleunigungssensoren, Mikrofone oder auch Hochfrequenzrelais oder Schalter.Common applications are inclination or angle sensors, acceleration sensors, microphones or high-frequency relays or switches.

Die vorliegende Erfindung bezieht sich auf einen mikroelektromechanischen Winkelsensor oder Neigungssensor. Geräte mit solchen Sensoren werden auch von der Anmelderin hergestellt und vertrieben.The present invention relates to a microelectromechanical angle sensor or tilt sensor. Devices with such sensors are also manufactured and sold by the Applicant.

Bekannterweise hat der Temperaturgang dieser Bauelemente einen großen Einfluss auf das Messergebnis. Deshalb werden sie oftmals thermostatiert, d. h. durch Heizung oder Kühlung stets bei einer bestimmten Temperatur betrieben. Um die Heiz- oder Kühlleistung gering zu halten, werden die Bauelemente üblicherweise thermisch von ihrer Umgebung entkoppelt.As is known, the temperature response of these components has a great influence on the measurement result. Therefore, they are often thermostated, d. H. operated by heating or cooling always at a certain temperature. In order to keep the heating or cooling power low, the components are usually thermally decoupled from their environment.

Die DE 10 2010 042 113 A1 zeigt ein in einen Chip eingebettetes MEMS-Bauelement. Zur Entkopplung des mikromechanischen Kerns gegenüber Zug- bzw. Scherkräften und/oder thermischen Einflüssen sind Hohlräume, sogenannte Gräben, vorgesehen, die zum Schutz vor Staub, Schmutz oder Lotpartikeln mit dielektrischen Schichten abgedeckt werden. Die Thermostatierung erfolgt mit einem Heizwiderstand und einem Temperaturfühler.The DE 10 2010 042 113 A1 shows a chip embedded MEMS device. To decouple the micromechanical core from tensile or shear forces and / or thermal influences, cavities, so-called trenches, are provided, which are covered with dielectric layers for protection against dust, dirt or solder particles. The thermostating is done with a heating resistor and a temperature sensor.

Als nachteilig wird die vergleichsweise hohe Komplexität dieses Bauelements angesehen. Insbesondere bei kleineren Stückzahlen möchte man einen noch preiswerteren MEMS-Chip verwenden, der zunächst ohne interne Thermostatierung auskommt und nur bei Bedarf bei unterschiedlichen Messaufgaben mit oder ohne Thermostatierung einsetzbar ist.A disadvantage is considered the comparatively high complexity of this device. Especially for smaller quantities you want to use an even cheaper MEMS chip, which initially works without internal thermostating and can be used only when necessary for different measurement tasks with or without thermostating.

Die DE 10 2005 029 841 B4 zeigt einen auf der Oberseite einer Leiterplatte angeordneten mikromechanischen Drucksensor mit einer biegsamen Membran, wobei die Membran von einem Passivierungsmittel abgedeckt ist. Das Eindringen bzw. die Diffusion von aggressiven Medien wird durch eine Heizvorrichtung verringert, die auch auf der Unterseite der Leiterplatte angeordnet sein kann. Nachteilig ist das Fehlen einer mechanische Entkopplung zwischen Leiterplatte und MEMS-Chip.The DE 10 2005 029 841 B4 shows a arranged on top of a circuit board micromechanical pressure sensor with a flexible membrane, wherein the membrane is covered by a Passivierungsmittel. The penetration or diffusion of aggressive media is reduced by a heater, which may also be arranged on the underside of the circuit board. A disadvantage is the lack of a mechanical decoupling between the printed circuit board and MEMS chip.

Die US 2009/0 315 127 A1 zeigt durch Gräben oder Aussparungen mechanisch von der Leiterplatte entkoppelte MEMS-Drucksensoren.The US 2009/0315127 A1 shows by trenches or recesses mechanically decoupled from the PCB MEMS pressure sensors.

Die Aufgabe der Erfindung besteht darin, einen MEMS-Winkel oder Neigungssensor anzugeben, der die o. g. Nachteile vermeidet.The object of the invention is to provide a MEMS angle or inclination sensor, the o. G. Disadvantages avoids.

Diese Aufgabe wird mit den Merkmalen des Patentanspruchs 1 gelöst. Die Unteransprüche betreffen die vorteilhafte Ausgestaltung der Erfindung.This object is achieved with the features of claim 1. The subclaims relate to the advantageous embodiment of the invention.

Der Wesentliche Erfindungsgedanke besteht darin, die Thermostatierung auf der den MEMS tragenden Leiterplatte durchzuführen. Dabei wird die Leiterplatte so ausgestaltet, dass die hier ebenfalls gewünschte thermische Entkopplung des MEMS von seiner Umgebung erreicht wird.The essential idea of the invention is to carry out the thermostating on the MEMS-carrying circuit board. In this case, the circuit board is designed so that the here also desired thermal decoupling of the MEMS is achieved by its environment.

Der Vorteil besteht darin, dass ein preiswerterer MEMS-Chip ohne eine interne mechanische Entkopplung und/oder Thermostatierung für unterschiedliche Messaufgaben einsetzbar ist, was insbesondere für eine große Gerätepalette mit kleineren Stückzahlen interessant ist.The advantage is that a cheaper MEMS chip without an internal mechanical decoupling and / or thermostating can be used for different measuring tasks, which is particularly interesting for a large range of devices with smaller quantities.

Die Erfindung wird anhand der Zeichnung näher erläutert. Es zeigen:The invention will be explained in more detail with reference to the drawing. Show it:

1: Der erfindungsgemäße elektronische Schaltungsaufbau in einer Prinzipschaltung, 1 The electronic circuit construction according to the invention in a basic circuit,

2: Ein Ausschnitt aus der erfindungsgemäßen Leiterplatte von oben, 2 : A section of the circuit board according to the invention from above,

3: Derselbe Ausschnitt aus der erfindungsgemäßen Leiterplatte von unten. 3 : The same section of the circuit board according to the invention from below.

Die 1 zeigt einen erfindungsgemäßen Schaltungsaufbau in einer grob vereinfachten Darstellung. Der MEMS-Chip 1 ist der hier mit auch IC1 bezeichnete dreidimensionale Beschleunigungssensor ADXL 326 der Firma Analog Devices.The 1 shows a circuit construction according to the invention in a rough simplified representation. The MEMS chip 1 is the here also IC1 designated three-dimensional acceleration sensor ADXL 326 of the company Analog Devices.

Er wird in seiner Standardkonfiguration betrieben und von einem mit μC bezeichneten handelsüblichen Mikrocontroller gesteuert und ausgewertet. Die Ergebnisse können über die Ports des Mikrokontrollers ausgegeben werden. Die beiden gezeigten LEDs dienen zur Zustandsanzeige.It is operated in its standard configuration and controlled and evaluated by a commercial microcontroller designated μC. The results can be output via the ports of the microcontroller. The two LEDs shown serve to indicate the status.

Die elektronischen Bauelemente sind auf einer Leiterplatte 2 untergebracht. Zur thermischen und mechanischen Entkopplung des MEMS-Chips 1 und des zu seiner Thermostatierung dienenden Heizers 3, hier ein NPN-Leistungstransistor der Bauform SOT-89 von den übrigen Bauelementen weist die Leiterplatte 2 in den folgenden Figuren näher gezeigte Durchbrüche bzw. Unterbrechungen 4 auf.The electronic components are on a printed circuit board 2 accommodated. For thermal and mechanical decoupling of the MEMS chip 1 and the heater serving for its thermostating 3 , here an NPN power transistor of the type SOT-89 of the remaining components assigns the circuit board 2 Breakthroughs or interruptions shown in more detail in the following figures 4 on.

Der Heizer 3 ist vorteilhaft unterhalb des MEMS-Chips 1 auf der gegenüberliegenden Seite der Leiterplatte 3 untergebracht. Er wird vom Mikrocontroller über einen Vorwiderstand mit einem pulsweitenmoduliertem Signal (PWM) angesteuert.The heater 3 is advantageous below the MEMS chip 1 on the opposite side of the circuit board 3 accommodated. It is controlled by the microcontroller via a series resistor with a pulse width modulated signal (PWM).

Die Temperatur wird in diesem Ausführungsbeispiel mit einem Platinwiderstand PT1000 in der üblichen Brückenschaltung gemessen und einem Port des Mikrocontrollers μC zugeführt. Natürlich kann die Temperatur auch mit einem Thermoelement gemessen werden. Da der Aufbau eines derartigen Neigungssensors bekannt ist, wurde auf weitere Einzelheiten verzichtet. Lediglich die Stromversorgung ist oben rechts angedeutet.The temperature is measured in this embodiment with a platinum resistor PT1000 in the usual bridge circuit and fed to a port of the microcontroller μC. Of course, the temperature can also be measured with a thermocouple. Since the structure of such a tilt sensor is known, has been dispensed with further details. Only the power supply is indicated on the top right.

Die 2 und 3 zeigen die Leiterplatte 2 mit MEMS-Chip 1 und Heizelement 3, sowie den erfindungsgemäßen Durchbrüchen 4 zur thermischen Entkopplung und Erzeugung eines gerichteten Wärmestroms zwischen dem MEMS-Chip 1 und dem Heizelement 3.The 2 and 3 show the circuit board 2 with MEMS chip 1 and heating element 3 , as well as the breakthroughs according to the invention 4 for thermal decoupling and generation of a directed heat flow between the MEMS chip 1 and the heating element 3 ,

BezugszeichenlisteLIST OF REFERENCE NUMBERS

11
MEMS-Chip 1 (Mikroelektromechanischer Sensorchip)MEMS chip 1 (Microelectromechanical sensor chip)
22
Leiterplatte (PCB)Printed circuit board (PCB)
33
Heizelement (Transistor und/oder Widerstand)Heating element (transistor and / or resistor)
44
Unterbrechungen in der Leiterplatte 2 Interruptions in the circuit board 2

Claims (2)

Winkelsensor oder Neigungssensor umfassend einen mikroelektromechanischen MEMS-Chip (1), der auf einer Leiterplatte (2), die ein Heizelement (3) zur Temperierung des MEMS-Chips (1) aufweist, angeordnet ist wobei das Heizelement (3) auf der dem MEMS-Chip (1) gegenüber liegenden Seite der Leiterplatte (2) angeordnet ist und die Leiterplatte (2) in der Umgebung des MEMS-Chips (1) Unterbrechungen (4) aufweist, die zur thermischen und mechanischen Entkopplung des MEMS-Chips (1) vom Rest der Leiterplatte (2), sowie zur Erzeugung eines gerichteten Wärmestroms zwischen dem MEMS-Chip (1) und dem Heizelement (3) geeignet sind.Angle sensor or tilt sensor comprising a microelectromechanical MEMS chip ( 1 ) mounted on a printed circuit board ( 2 ), which is a heating element ( 3 ) for tempering the MEMS chip ( 1 ) is arranged, wherein the heating element ( 3 ) on the MEMS chip ( 1 ) opposite side of the circuit board ( 2 ) is arranged and the circuit board ( 2 ) in the vicinity of the MEMS chip ( 1 ) Interruptions ( 4 ) for thermal and mechanical decoupling of the MEMS chip ( 1 ) from the rest of the circuit board ( 2 ), and for generating a directed heat flow between the MEMS chip ( 1 ) and the heating element ( 3 ) are suitable. Sensor nach Anspruch 1, dadurch gekennzeichnet, dass die Leiterplatte (2) ein Kühlelement, vorzugsweise ein Peltierelement, aufweist.Sensor according to claim 1, characterized in that the printed circuit board ( 2 ) has a cooling element, preferably a Peltier element.
DE201310211693 2013-06-20 2013-06-20 Micro-electromechanical angle/slant sensor for use as acceleration sensor for e.g. microphone, has micro-electromechanical chip provided on printed circuit board, where interruptions perform thermal and mechanical decoupling of chip Active DE102013211693B3 (en)

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Cited By (3)

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Publication number Priority date Publication date Assignee Title
US20160178415A1 (en) * 2014-12-19 2016-06-23 Invensense, Inc. Device and method for sensor calibration
US20180052007A1 (en) * 2014-12-19 2018-02-22 Invensense, Inc. Device and method for sensor calibration
WO2018069429A1 (en) * 2016-10-14 2018-04-19 Roche Diagnostics Gmbh Test element support

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US20090315127A1 (en) * 2008-06-20 2009-12-24 Garmin Ltd. Method and apparatus for improving measurement accuracy of mems devices
DE102010042113A1 (en) * 2010-10-07 2012-04-12 Robert Bosch Gmbh Semiconductor component for use in micro-electromechanical system in microsystems technology, has dielectric closure layer attached on structured dielectric layer, where surface of layer comprises depth profile in direction of chip interior
DE102005029841B4 (en) * 2004-07-28 2013-09-05 Robert Bosch Gmbh Micromechanical pressure sensor with heated passivating agent and method for its control

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DE102005029841B4 (en) * 2004-07-28 2013-09-05 Robert Bosch Gmbh Micromechanical pressure sensor with heated passivating agent and method for its control
US20090315127A1 (en) * 2008-06-20 2009-12-24 Garmin Ltd. Method and apparatus for improving measurement accuracy of mems devices
DE102010042113A1 (en) * 2010-10-07 2012-04-12 Robert Bosch Gmbh Semiconductor component for use in micro-electromechanical system in microsystems technology, has dielectric closure layer attached on structured dielectric layer, where surface of layer comprises depth profile in direction of chip interior

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160178415A1 (en) * 2014-12-19 2016-06-23 Invensense, Inc. Device and method for sensor calibration
WO2016100953A1 (en) * 2014-12-19 2016-06-23 Invensense, Inc. Device and method for sensor calibration
CN107003161A (en) * 2014-12-19 2017-08-01 应美盛有限公司 Apparatus and method for pick up calibration
US9804007B2 (en) * 2014-12-19 2017-10-31 Invensense, Inc. Device and method for sensor calibration
US20180052007A1 (en) * 2014-12-19 2018-02-22 Invensense, Inc. Device and method for sensor calibration
US10794728B2 (en) * 2014-12-19 2020-10-06 Invensense, Inc. Device and method for sensor calibration
WO2018069429A1 (en) * 2016-10-14 2018-04-19 Roche Diagnostics Gmbh Test element support
US11911768B2 (en) 2016-10-14 2024-02-27 Roche Diagnostics Operations, Inc. Test element support

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