DE102013101642A1 - Verfahren und Vorrichtung zum Herstellen und Füllen von Behältern - Google Patents

Verfahren und Vorrichtung zum Herstellen und Füllen von Behältern Download PDF

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Publication number
DE102013101642A1
DE102013101642A1 DE201310101642 DE102013101642A DE102013101642A1 DE 102013101642 A1 DE102013101642 A1 DE 102013101642A1 DE 201310101642 DE201310101642 DE 201310101642 DE 102013101642 A DE102013101642 A DE 102013101642A DE 102013101642 A1 DE102013101642 A1 DE 102013101642A1
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Germany
Prior art keywords
preform
forming
filling
gas
inert gas
Prior art date
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Ceased
Application number
DE201310101642
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German (de)
English (en)
Inventor
Ludwig Clüsserath
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KHS GmbH
Original Assignee
KHS GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KHS GmbH filed Critical KHS GmbH
Priority to DE201310101642 priority Critical patent/DE102013101642A1/de
Priority to JP2015557353A priority patent/JP2016514071A/ja
Priority to EP14711679.2A priority patent/EP2958732B1/de
Priority to CN201480009231.7A priority patent/CN105073385B/zh
Priority to PCT/EP2014/000428 priority patent/WO2014127903A1/de
Priority to US14/768,607 priority patent/US11345073B2/en
Publication of DE102013101642A1 publication Critical patent/DE102013101642A1/de
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C49/00—Blow-moulding, i.e. blowing a preform or parison to a desired shape within a mould; Apparatus therefor
    • B29C49/42—Component parts, details or accessories; Auxiliary operations
    • B29C49/4252—Auxiliary operations prior to the blow-moulding operation not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C49/00—Blow-moulding, i.e. blowing a preform or parison to a desired shape within a mould; Apparatus therefor
    • B29C49/08—Biaxial stretching during blow-moulding
    • B29C49/16—Biaxial stretching during blow-moulding using pressure difference for pre-stretching, e.g. pre-blowing
    • B29C49/1602—Biaxial stretching during blow-moulding using pressure difference for pre-stretching, e.g. pre-blowing pre-blowing without using a mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C49/00—Blow-moulding, i.e. blowing a preform or parison to a desired shape within a mould; Apparatus therefor
    • B29C49/42—Component parts, details or accessories; Auxiliary operations
    • B29C49/46—Component parts, details or accessories; Auxiliary operations characterised by using particular environment or blow fluids other than air
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B3/00—Packaging plastic material, semiliquids, liquids or mixed solids and liquids, in individual containers or receptacles, e.g. bags, sacks, boxes, cartons, cans, or jars
    • B65B3/02—Machines characterised by the incorporation of means for making the containers or receptacles
    • B65B3/022—Making containers by moulding of a thermoplastic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B3/00—Packaging plastic material, semiliquids, liquids or mixed solids and liquids, in individual containers or receptacles, e.g. bags, sacks, boxes, cartons, cans, or jars
    • B65B3/04—Methods of, or means for, filling the material into the containers or receptacles
    • B65B3/10—Methods of, or means for, filling the material into the containers or receptacles by application of pressure to material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B31/00—Packaging articles or materials under special atmospheric or gaseous conditions; Adding propellants to aerosol containers
    • B65B31/02—Filling, closing, or filling and closing, containers or wrappers in chambers maintained under vacuum or superatmospheric pressure or containing a special atmosphere, e.g. of inert gas
    • B65B31/025—Filling, closing, or filling and closing, containers or wrappers in chambers maintained under vacuum or superatmospheric pressure or containing a special atmosphere, e.g. of inert gas specially adapted for rigid or semi-rigid containers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B55/00—Preserving, protecting or purifying packages or package contents in association with packaging
    • B65B55/02—Sterilising, e.g. of complete packages
    • B65B55/04—Sterilising wrappers or receptacles prior to, or during, packaging
    • B65B55/08—Sterilising wrappers or receptacles prior to, or during, packaging by irradiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B55/00—Preserving, protecting or purifying packages or package contents in association with packaging
    • B65B55/02—Sterilising, e.g. of complete packages
    • B65B55/04—Sterilising wrappers or receptacles prior to, or during, packaging
    • B65B55/10—Sterilising wrappers or receptacles prior to, or during, packaging by liquids or gases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, the devices being individual devices of subclass H10D or integrated devices of class H10
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C49/00—Blow-moulding, i.e. blowing a preform or parison to a desired shape within a mould; Apparatus therefor
    • B29C49/42—Component parts, details or accessories; Auxiliary operations
    • B29C49/46—Component parts, details or accessories; Auxiliary operations characterised by using particular environment or blow fluids other than air
    • B29C2049/4602—Blowing fluids
    • B29C2049/465—Blowing fluids being incompressible
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2791/00—Shaping characteristics in general
    • B29C2791/004—Shaping under special conditions
    • B29C2791/006—Using vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2791/00—Shaping characteristics in general
    • B29C2791/004—Shaping under special conditions
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C49/00—Blow-moulding, i.e. blowing a preform or parison to a desired shape within a mould; Apparatus therefor
    • B29C49/08—Biaxial stretching during blow-moulding
    • B29C49/10—Biaxial stretching during blow-moulding using mechanical means for prestretching
    • B29C49/14—Clamps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C49/00—Blow-moulding, i.e. blowing a preform or parison to a desired shape within a mould; Apparatus therefor
    • B29C49/42—Component parts, details or accessories; Auxiliary operations
    • B29C49/42403—Purging or cleaning the blow-moulding apparatus
    • B29C49/42405—Sterilizing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C49/00—Blow-moulding, i.e. blowing a preform or parison to a desired shape within a mould; Apparatus therefor
    • B29C49/42—Component parts, details or accessories; Auxiliary operations
    • B29C49/42414—Treatment of preforms, e.g. cleaning or spraying water for improved heat transfer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C49/00—Blow-moulding, i.e. blowing a preform or parison to a desired shape within a mould; Apparatus therefor
    • B29C49/42—Component parts, details or accessories; Auxiliary operations
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    • B29C49/42418—Purging or cleaning the preforms for sterilizing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2067/00—Use of polyesters or derivatives thereof, as moulding material
    • B29K2067/003—PET, i.e. poylethylene terephthalate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/712—Containers; Packaging elements or accessories, Packages
    • B29L2031/7158—Bottles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
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    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/13101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
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    • H01L2224/16104—Disposition relative to the bonding area, e.g. bond pad
    • H01L2224/16105—Disposition relative to the bonding area, e.g. bond pad the bump connector connecting bonding areas being not aligned with respect to each other
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    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/75261—Laser
    • H01L2224/75263—Laser in the upper part of the bonding apparatus, e.g. in the bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75743—Suction holding means
    • H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8112—Aligning
    • H01L2224/81121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81192—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81193—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81194—Lateral distribution of the bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/812—Applying energy for connecting
    • H01L2224/8122—Applying energy for connecting with energy being in the form of electromagnetic radiation
    • H01L2224/81224—Applying energy for connecting with energy being in the form of electromagnetic radiation using a laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/81986—Specific sequence of steps, e.g. repetition of manufacturing steps, time sequence
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes
    • H01L2225/04—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same main group of the same subclass of class H10
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06551—Conductive connections on the side of the device

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
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  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
  • Filling Of Jars Or Cans And Processes For Cleaning And Sealing Jars (AREA)
  • Basic Packing Technique (AREA)
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CN201480009231.7A CN105073385B (zh) 2013-02-19 2014-02-17 用于生产和填充容器的方法和设备
PCT/EP2014/000428 WO2014127903A1 (de) 2013-02-19 2014-02-17 Verfahren und vorrichtung zum herstellen und füllen von behältern
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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014016140A1 (de) * 2014-10-30 2016-05-04 Khs Corpoplast Gmbh Verfahren zur Entfernung von Luft aus Vorformlingen zur Herstellung von gefüllten Behältern aus Kunststoff
WO2016088003A1 (en) * 2014-12-01 2016-06-09 Gea Procomac S.P.A. A production apparatus of sterile receptacles, a bottling plant comprising the apparatus and a production method of a sterile receptacle
DE102015208677A1 (de) * 2015-05-11 2016-11-17 Krones Ag Blasform und Verfahren zum Ausformen von Kunststoffbehältern
DE102015211131A1 (de) * 2015-06-17 2016-12-22 Krones Ag Verfahren und Blasmaschine zum Ausformen und Füllen von Behältern
ITUB20159786A1 (it) * 2015-12-30 2017-06-30 Gea Procomac Spa Unita di decontaminazione di preforme in materiale termoplastico e apparato di formatura di contenitori a partire da preforme in materiale termoplastico
CN111954593A (zh) * 2017-12-18 2020-11-17 西帕股份有限公司 生产热塑性材料容器的系统和工艺方法
FR3116463A1 (fr) * 2020-11-26 2022-05-27 Sidel Participations Machine de formage comportant un dispositif de stérilisation d'un réseau de soufflage
IT202200002438A1 (it) * 2022-02-10 2023-08-10 Siapi S R L Metodo e impianto di soffiaggio di una preforma

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014010283A1 (de) * 2014-07-13 2016-01-14 Khs Corpoplast Gmbh Verfahren und Blasformungsmaschine zur blasformenden Herstellung von zumindest bereichsweise sterilen Behältern
EP2987622B1 (de) * 2014-08-20 2018-02-21 Krones AG Formfüllmaschine und Verfahren zum Ausformen und Füllen von Behältern
JP6272214B2 (ja) * 2014-12-02 2018-01-31 三菱重工機械システム株式会社 容器の殺菌方法、及び、殺菌システム
US20180186057A1 (en) * 2015-04-30 2018-07-05 Dai Nippon Printing Co., Ltd. Aseptic container molding method and apparatus and aseptic filling method and apparatus
JP6645771B2 (ja) * 2015-08-27 2020-02-14 株式会社吉野工業所 容器成形装置および容器成形方法
JP6632872B2 (ja) 2015-11-27 2020-01-22 株式会社吉野工業所 液体ブロー成形方法
DE102017008803A1 (de) * 2017-09-20 2019-03-21 Kocher-Plastik Maschinenbau Gmbh Vorrichtung zum Herstellen und Befüllen von Behältererzeugnissen
DE102018110227A1 (de) * 2018-04-27 2019-10-31 Multivac Sepp Haggenmüller Se & Co. Kg Verpackungsmaschine zum Verpacken von Produkten in Kunststoffverpackungen
FR3081299B1 (fr) * 2018-05-23 2020-09-11 Oreal Dispositif de preparation d'une compostion cosmetique, et procede associe
DE102019130052A1 (de) * 2019-11-07 2021-05-12 Khs Gmbh Verfahren zum Befüllen und Verschließen von Behältern

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2352926A1 (de) 1973-10-22 1975-04-24 Heidenreich & Harbeck Gmbh Verfahren und vorrichtung zum erwaermen eines werkstueckes aus kunststoff
DE4212583A1 (de) 1992-04-15 1993-10-21 Krupp Corpoplast Masch Vorrichtung zur Blasformung
DE4340291A1 (de) 1993-11-26 1995-06-01 Krupp Corpoplast Masch Mehrfachnutzung von Blasluft
EP2161202A1 (de) 2008-08-30 2010-03-10 Krones AG Elektronenstrahlsterilisation für Behältnisse
DE102009008633A1 (de) 2009-02-12 2010-08-19 Krones Ag Vorrichtung zum Sterilisieren von Behältnissen
DE102011009889A1 (de) 2011-01-31 2012-08-02 Khs Corpoplast Gmbh Verfahren und Vorrichtung zur Herstellung von gefüllten Behältern
DE102011012665A1 (de) 2011-02-28 2012-08-30 Khs Corpoplast Gmbh Verfahren sowie Vorrichtung zum Herstellen von mit einem flüssigen Füllgut gefüllten Behältern
DE102011012664A1 (de) 2011-02-28 2012-08-30 Khs Corpoplast Gmbh Verfahren und Vorrichtung zur Herstellung von mit einem flüssigen Füllgut gefüllten Behältern

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2774912B1 (fr) 1998-02-16 2000-09-01 Sidel Sa Procede pour steriliser des corps creux et dispositif pour la mise en oeuvre
JP2001212874A (ja) 2000-02-02 2001-08-07 Shikoku Kakoki Co Ltd 無菌容器成形充填方法
DE10114401B4 (de) * 2001-03-23 2005-03-17 Tetra Laval Holdings & Finance S.A. Verfahren zum Blasformen eines Behälters aus Kunststoff und zum Beschichten des Behälterinneren
ES2295727T3 (es) * 2004-05-21 2008-04-16 DEUTSCHE SISI-WERKE GMBH & CO. BETRIEBS KG Procedimiento y dispositivo para llenar bolsas de laminas flexibles.
FR2884225B1 (fr) * 2005-04-12 2007-06-22 Airlessystems Soc Par Actions Procede de remplissage et dispositif de remplissage d'un reservoir de volume utile variable
DE102007017938C5 (de) * 2007-04-13 2017-09-21 Khs Gmbh Behälterherstellungsvorrichtung und Herstellverfahren für Formkörper
US8017064B2 (en) * 2007-12-06 2011-09-13 Amcor Limited Liquid or hydraulic blow molding
DE102008056346A1 (de) * 2008-11-07 2010-05-12 Krones Ag Verfahren zur Vorbehandlung von Vorformlingen und Streckblasmaschine zur Vorbehandlung und zum Streckblasen von Vorformlingen zu Behältern
DE102009041215A1 (de) * 2009-09-11 2011-03-24 Krones Ag Verfahren und Vorrichtung zum Streckblasformen oder Blasformen und Füllen steriler Behälter
FR2961125B1 (fr) * 2010-06-10 2012-07-13 Sidel Participations Procede de recyclage d'air comportant un agent sterilisant et installation de fabrication de recipients comportant un circuit de recyclage d'air
EP3492237B1 (en) * 2011-12-21 2020-07-01 Discma AG Method for forming and filling a container including blow nozzle cleaning
DE102014104874A1 (de) * 2014-04-04 2015-10-08 Krones Ag Vorrichtung und Verfahren zur Herstellung einer Kunststoffflasche und deren Befüllung mit einem Füllprodukt

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2352926A1 (de) 1973-10-22 1975-04-24 Heidenreich & Harbeck Gmbh Verfahren und vorrichtung zum erwaermen eines werkstueckes aus kunststoff
DE4212583A1 (de) 1992-04-15 1993-10-21 Krupp Corpoplast Masch Vorrichtung zur Blasformung
DE4340291A1 (de) 1993-11-26 1995-06-01 Krupp Corpoplast Masch Mehrfachnutzung von Blasluft
EP2161202A1 (de) 2008-08-30 2010-03-10 Krones AG Elektronenstrahlsterilisation für Behältnisse
DE102009008633A1 (de) 2009-02-12 2010-08-19 Krones Ag Vorrichtung zum Sterilisieren von Behältnissen
DE102011009889A1 (de) 2011-01-31 2012-08-02 Khs Corpoplast Gmbh Verfahren und Vorrichtung zur Herstellung von gefüllten Behältern
DE102011012665A1 (de) 2011-02-28 2012-08-30 Khs Corpoplast Gmbh Verfahren sowie Vorrichtung zum Herstellen von mit einem flüssigen Füllgut gefüllten Behältern
DE102011012664A1 (de) 2011-02-28 2012-08-30 Khs Corpoplast Gmbh Verfahren und Vorrichtung zur Herstellung von mit einem flüssigen Füllgut gefüllten Behältern

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014016140A1 (de) * 2014-10-30 2016-05-04 Khs Corpoplast Gmbh Verfahren zur Entfernung von Luft aus Vorformlingen zur Herstellung von gefüllten Behältern aus Kunststoff
WO2016066276A1 (de) * 2014-10-30 2016-05-06 Khs Corpoplast Gmbh Verfahren zur entfernung von luft aus vorformlingen zur herstellung von gefüllten behältern aus kunststoff
WO2016088003A1 (en) * 2014-12-01 2016-06-09 Gea Procomac S.P.A. A production apparatus of sterile receptacles, a bottling plant comprising the apparatus and a production method of a sterile receptacle
US10343325B2 (en) 2014-12-01 2019-07-09 Gea Procomac S.P.A. Production apparatus of sterile receptacles, a bottling plant comprising the apparatus and a production method of a sterile receptacle
DE102015208677A1 (de) * 2015-05-11 2016-11-17 Krones Ag Blasform und Verfahren zum Ausformen von Kunststoffbehältern
DE102015211131A1 (de) * 2015-06-17 2016-12-22 Krones Ag Verfahren und Blasmaschine zum Ausformen und Füllen von Behältern
ITUB20159786A1 (it) * 2015-12-30 2017-06-30 Gea Procomac Spa Unita di decontaminazione di preforme in materiale termoplastico e apparato di formatura di contenitori a partire da preforme in materiale termoplastico
EP3187324A1 (en) * 2015-12-30 2017-07-05 Gea Procomac S.p.A. Decontaminating unit for decontaminating parisons made of a thermoplastic material and molding apparatus for molding containers starting from parisons made of a thermoplastic material
CN111954593A (zh) * 2017-12-18 2020-11-17 西帕股份有限公司 生产热塑性材料容器的系统和工艺方法
CN111954593B (zh) * 2017-12-18 2022-11-15 西帕股份有限公司 生产热塑性材料容器的系统和工艺方法
FR3116463A1 (fr) * 2020-11-26 2022-05-27 Sidel Participations Machine de formage comportant un dispositif de stérilisation d'un réseau de soufflage
WO2022112301A1 (fr) * 2020-11-26 2022-06-02 Sidel Participations Machine de formage comportant un dispositif de stérilisation d'un réseau de soufflage
EP4251400B1 (fr) 2020-11-26 2024-08-14 Sidel Participations Machine de formage comportant un dispositif de stérilisation d'un réseau de soufflage
IT202200002438A1 (it) * 2022-02-10 2023-08-10 Siapi S R L Metodo e impianto di soffiaggio di una preforma
EP4227066A1 (en) * 2022-02-10 2023-08-16 Siapi S.r.l. Method and system for blowing a parison
US11999092B2 (en) 2022-02-10 2024-06-04 Siapi S.R.L. Method and system for blowing a parison

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CN105073385B (zh) 2017-06-23
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US11345073B2 (en) 2022-05-31

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