DE102012014011A1 - Electrical appliance for supplying power to e.g. asynchronous motor, has optical coupler connected with power module, in high voltage region, by parallely arranged strip conductors, where strip conductors are arranged in high voltage region - Google Patents

Abstract

The appliance has an optical coupler (35) comprising a set of connectors connected with a high voltage region and another set of connectors electrically connected with low voltage region using a solder connection. The optical coupler is connected with a component i.e. power module, in a high voltage region, by parallely arranged strip conductors, where the strip conductors are arranged in the high voltage region. A cooling body (1) and a retention device are connected together in a heat conducting manner, where the retention device is made of aluminum material.

Description

The invention relates to an electrical appliance.

In electrical appliances is known to equip their electronic components on printed circuit boards.

The US 2007 0097584 A1 shows an overvoltage protection with diagnostic unit.

In the US 2010 0007403 A1 a system for measuring temperature in a power controller is shown.

From the US 2007 0247814 A1 is a cooling module known.

The DE 10 2007 062 202 A1 shows a method for contacting a rigid circuit board with a contact partner.

The US 2010 0195284 A1 shows an electrical device and a frequency converter for a motor with a cooling unit. In this case, US 2010 0195284 A1 teaches dividing a cooling medium flow into two partial streams for cooling flat components by means of a cooling body cooled by the first partial flow and for direct cooling of raised components by means of a second partial flow.

The invention is therefore the object of developing an electrical appliance, wherein the electrical appliance should be constructed compact, which material is saved, in particular so resources are spared.

According to the invention the object is achieved in the electrical appliance according to the features indicated in claim 1.

Important features of the invention in the electrical appliance are that the electrical appliance, in particular a converter for supplying an electric motor, in particular an asynchronous motor and / or synchronous motor, the electrical appliance having a single one-piece circuit board having a high voltage region and a low voltage region, wherein the high voltage region and the low voltage region on the printed circuit board are galvanically separated from each other by disposing a conductive line portion of the printed circuit board between the high voltage region and the low voltage region, in particular wherein the printed circuit free portion of the printed circuit board is transverse to the normal direction of the plane in which the printed circuit board extends , and extends parallel to the normal direction, wherein at least one optocoupler bridges the conductor tracks free portion of the circuit board, in particular wherein the optocoupler hochspannun with first connection elements the at least one optocoupler is connected by means of parallel conductor tracks, in particular conductor tracks which are arranged in the high voltage region, to a component, in particular power module, of the high-voltage region.

The advantage here is that the electrical appliance can be manufactured with only one circuit board, whereby the electrical appliance is compact, space and material saving constructible and can be mounted in a simple and cost-effective manner. Due to the galvanic isolation of the high voltage range and the low voltage range and the signal connection of these areas by means of optocouplers, voltage flashovers are prevented, ie the operational safety is increased. The parallel conductor tracks together with the differential signal transmission cause a reduction of interference. In particular, interference signals, in particular in the device itself, for example by the power module, generated interference signals from the signals transmitted differentially separated, ie in particular the signal-to-noise ratio can be improved.

In an advantageous embodiment, the control signals from the low-voltage range to the high-voltage range can be transmitted by means of at least one first optocoupler and the measurement signals can be transmitted from the high-voltage range to the low-voltage range by means of at least one second optocoupler, in particular wherein the signals can be differentially transferred by means of the parallel-guided conductor tracks. The advantage here is that the control signals and the measurement signals are transmitted from different optocouplers, thereby the signals are separable from each other and the risk of permutation of the signals is reduced, whereby the reliability of the electrical appliance is increased.

In a further advantageous embodiment, a power module, in particular an inverter, and a capacitor, in particular a film capacitor are arranged in the high voltage range, wherein the power module is connected by means of parallel conductor tracks with at least one optocoupler and wherein the conductor tracks arranged on the circuit board below the capacitor are, in particular so in the area covered by the capacitor of the circuit board. The advantage here is that the signal transmission over the parallel conductor tracks can be effectively shielded against interference signals by means of the arranged above the conductor tracks capacitor. Furthermore, an effective area utilization of the printed circuit board at maximum distance executable between the power module and the control electronics area. Where the largest possible distance between power module and control electronics area favors the freedom of the control electronics area.

In a further advantageous embodiment, a heat sink is arranged in the electrical appliance, wherein the heat sink has air guiding means and wherein the air guiding means, in particular cooling fins, guide a cooling medium flow, in particular a convection or cooling medium flow driven by a fan, along the surface of the heat sink and / or via the Lead the heat sink. The advantage here is that the electrical appliance is actively cooled, whereby the reliability is increased.

In a further advantageous embodiment, the heat sink has a substantially rectangular base surface, wherein the cooling medium flow is directed substantially parallel to the long side of the heat sink. The advantage here is that the heat sink is compact executable.

In a further advantageous embodiment, the heat sink adjoins an edge of the substantially rectangular printed circuit board, in particular the edge of a long side of the printed circuit board. The advantage here is that the electrical appliance is compact executable.

In a further advantageous embodiment of the heat sink is connected to a back plate, in particular integrally with this designed as a continuous casting, wherein the back plate is aligned perpendicular to the circuit board plane, said heat sink and circuit board are arranged on the same side of the back plate. The advantage here is that the heat sink during assembly of the electrical device is connected to the circuit board in a simple manner, with a defined distance between the base plate of the heat sink and the circuit board is maintained. As a result, the components are protected on the circuit board. Furthermore, the heat sink, the back plate and the circuit board form a compact unit that can be easily inserted into a housing.

In a further advantageous embodiment, the heat sink is arranged in the high voltage region. It is advantageous in this case that the components arranged in the high-voltage region, which generate the majority of the heat generated in the electrical appliance, are preferably cooled. In addition, the interference radiation emitted by these components is shielded by the heat sink arranged above these components by the components arranged in the low-voltage region, in particular the fault-prone control electronics region. Furthermore, a thermal barrier can be realized between the components of the high-voltage region and the components of the low-voltage region, since the heat radiated onto the cooling body and the cooling medium flow guided by the air conduction means of the heat sink can not be radiated onto the components of the low-voltage region, because the low-voltage region of Heatsink is spaced.

In a further advantageous embodiment, the components of the electrical appliance are arranged such that the optocouplers are arranged substantially in a line, and / or that the control electronics area has a substantially rectangular shape, in particular substantially square, and / or that the capacitor has a Has a substantially rectangular base, and / or that a connection device, in particular a multi-piece connection device, the pieces are arranged in alignment, on an edge of the circuit board, in particular a heat sink opposite edge of the circuit board is arranged, and / or that the control electronics in a corner region of the printed circuit board is arranged, wherein the control electronics area adjacent to the heat sink covered printed circuit board portion and / or the connection device and / or the optocoupler and / or the capacitor, and wherein one side of the control electronics area in Wese nlichlichen is parallel to the alignment of the terminal device and / or the line of optocouplers and / or a side surface of the capacitor and / or a side surface of the heat sink and / or one side of the transformer, and / or that the connection device between the one edge of the circuit board and the line of optocouplers is arranged, wherein the edge of the printed circuit board is substantially parallel to the alignment of the connecting device and / or to the line of opto-couplers, and / or that the opto-couplers are arranged between the connecting device and the capacitor, wherein the line of optocouplers in Is substantially parallel to the alignment of the terminal device and / or to a side surface of the capacitor, and / or that the capacitor between the optocouplers and a heat sink covered portion of the circuit board is arranged, wherein one side of the capacitor substantially parallel to the alignment of the opto-couplers and / or a side surface e of the heat sink, in particular wherein the capacitor is cuboidal, and / or that the electrical appliance has a transformer, in particular wherein the transformer has a substantially rectangular base, wherein the area covered by the transformer of the printed circuit board at the area covered by the connecting device area of the printed circuit board and / or the region of the printed circuit board covered by the optocouplers and / or the region of the printed circuit board covered by the capacitor and / or the region of the printed circuit board covered by the heat sink adjacent, in particular wherein one side of the transformer is substantially parallel to the alignment of the terminal block and / or the line of optocouplers and / or a side surface of the capacitor and / or a side surface of the heat sink. The advantage here is that a compact design of the electrical device is made possible by the advantageous arrangement of the components on the circuit board with the above features.

In a further advantageous embodiment, the electrical device has an arrangement for cooling of a first heat-generating component, wherein the arrangement comprises a printed circuit board, which is equipped with a first and a second heat-generating component and a heat-conducting connected to the first heat-generating component heat sink, the air guiding means for Guiding a cooling medium flow has, wherein the Luftleitmittel a cooling medium flow along the second heat-generating component for heat dissipation of the heat generated by the second heat-generating component to the environment.

The advantage here is that various heat-generating components, although they are mounted on a circuit board, can be cooled in different ways, which are selected according to the characteristics of the respective heat-generating component. In this case, the cooling via a direct heat-conducting connection with the heat sink is particularly advantageous for flat components which have a large flat surface, which can be brought into heat-conducting contact with a surface of the heat sink, such as the power module in a converter. In this case, the power module is produced as a compact, substantially parallelepiped-shaped unit, solder-connected to conductor tracks of the printed circuit board and has pulse-width modulated controllable power semiconductor switches arranged in half-bridges. For components with irregular, in particular fissured, surface, for example, a throttle, however, the cooling over the cooling medium flow guided along this component is advantageous because it reaches and cools all surface regions of the component.

In particular, the arrangement has at least one first and one second heat-generating component, wherein the first component is cooled directly and effectively by means of a thermally conductive contacting connection with the heat sink and the second component is cooled by a cooling medium flow conducted along it and having such a high flow velocity , so that the heat is removed from the cooling air flow and only a negligible proportion of the heat sink flows.

In an advantageous embodiment of the cooling medium flow is separated from the circuit board by means of the heat sink. The advantage here is that the cooling medium flow and in particular the impurities contained in the cooling medium flow, such as dust, are kept away from the circuit board and thus prevents malfunction of the circuit board or at least reduced. As a result, therefore, the reliability of the electronic components is increased on the circuit board.

In a further advantageous embodiment, the cooling body is arranged between the cooling medium flow and the printed circuit board. The advantage here is that the cooling medium flow and the circuit board, in particular the sensitive electrical components that are mounted on the circuit board, can be estimated by the optionally loaded with dirt particles cooling medium flow, whereby the reliability is improved.

In a further advantageous embodiment, the first heat-generating component is thermally conductively connected on the side remote from the cooling medium flow side of the heat sink to the heat sink, in particular wherein thermal paste is interposed. The advantage here is that the heat sink on the side facing away from the cooling medium flow side without air guide is executable, in particular just executable, so that this side of the heat sink in a simple manner thermally conductively connected to the first component. By applying thermal compound between the heat sink and the component, a reduction of the heat transfer resistance between the component and the heat sink can be achieved.

In a further advantageous embodiment, the second heat-generating component protrudes through a first recess of the heat sink into the cooling medium flow, in particular wherein the second heat-generating component is designed as an inductance, in particular as a throttle. The advantage here is that the second heat-generating component is mounted on the same circuit board as the first heat-generating component, in particular on the same side of the circuit board is mounted. This allows a simple and inexpensive installation.

In a further advantageous embodiment, the heat sink is arranged at a distance from the second heat-generating component. The advantage here is that the second component of the heat sink is electrically isolated by interposed air as insulating. Thus, voltage flashovers between the device and the heat sink can be avoided.

In a further advantageous embodiment, the heat sink on a base plate, are pronounced on the cooling fins as Luftleitmittel, in particular in one piece or two pieces. The advantage here is that the heat sink with the cooling fins is easy to manufacture in a single step.

In a further advantageous refinement, the heat sink has cooling fingers, in particular those which function as surface-enlarging structures. The advantage here is that cold fingers have a larger surface area than cooling fins, whereby the heat radiation to the ambient air can be improved. In addition, an isotropic cooling is achievable, so independent of the installation position Entwärmungsleistung.

In a further advantageous embodiment, the heat sink is metallic, in particular made of aluminum, in particular made of anodized aluminum. The advantage here is that metallic materials have good thermal conductivity compared to, for example, ceramic materials and are easy to work with. In particular, anodized aluminum has a particularly good heat radiation.

In a further advantageous embodiment, the first recess extends through the base plate and also into a first cooling fin, wherein a second cooling fin is spaced from the first recess. The advantage here is that through the recess, the second heat-generating component is projecting executable into the cooling medium flow, wherein the cooling medium flow through the remaining cooling fins is conductive, in particular separable from the circuit board.

In a further advantageous embodiment, the first recess is a round hole made in the heat sink, in particular a milled or drilled round hole. The advantage here is that a round hole in particular by milling or drilling is easy and inexpensive manufacturable.

In a further advantageous embodiment, the heat sink is designed as a continuous casting profile. The advantage here is that the heat sink with the air directing means is simple and inexpensive manufacturable in a single step.

In a further advantageous embodiment, the first recess is a circular hole introduced into the continuous casting profile transversely to the continuous casting direction, in particular a milled or drilled round bore. The advantage here is that only a single further step for the production of the recess is required.

In a further advantageous embodiment, the heat sink has a plate-like, extending in the continuous casting rear wall, in particular which is executed perpendicular to the base plate. The advantage here is that the heat sink can be executed completed by the rear wall to the outside, in particular by means of this rear wall to a suspension can be fastened.

In a further advantageous embodiment, the rear wall is thermally connected to a cooling plate, in particular to a cooling plate arranged in a control cabinet, in particular wherein the cooling plate has cooling channels through which a further cooling medium, in particular water, compressed air or oil, can be guided. The advantage here is that the heat of the heat sink by means of the cooling plate is more effectively dissipated than by means of pure convection.

In a further advantageous embodiment, an insulating means is arranged between the heat sink and printed circuit board, which has at least two recesses through which the first and the second heat-generating component protrude, in particular wherein the insulating acts electrically insulating, in particular has a higher electrical insulation strength and / or dielectric strength as air, in particular wherein each recess of the insulating means can be brought into coincidence with the respective recess of the heat sink, wherein the insulating means has a poorer thermal conductivity than air, in particular thus improves the heat dissipation of the circuit board towards the environment, in particular via a housing of the arrangement. The advantage here is that the heat sink and the first and second heat-generating component are thermally insulated against other components on the circuit board. Wherein the heat generated by these other components can be derived via other heat conduction paths.

In a further advantageous embodiment, a frame connects the heat sink mechanically, in particular mechanically rigid, to the circuit board, in particular wherein the frame is designed as a housing part and / or wherein the frame is at least partially housing-forming, wherein the frame is mechanically connected to the circuit board, in particular mechanically rigidly connected. The advantage here is that heat sink, frame and circuit board form a compact unit and thus are easy to use in a housing.

In a further advantageous embodiment, a cooling medium flow driven by a fan flows past a surface region of the heat sink for dissipating heat to the ambient air. The advantage here is that the heat of the heat sink is discharged to the ambient air.

In another advantageous embodiment, the cooling medium flow conducted by the heat sink is convectively driven and directed vertically, in particular wherein the cooling fins extend vertically. The advantage here is that the air circulation is improved by convection.

In a further advantageous embodiment, the heat sink and circuit board of a housing part, in particular a housing part of electrically non-conductive material, at least partially surrounded, in particular wherein the housing part circulation means, in particular ventilation slots and / or flow channels, and / or mounting means for a device for increasing the Heat transfer to the surrounding medium, in particular fan has. The advantage here is that the arrangement is protected by the housing from environmental influences, such as dust and / or water Nevertheless, the heat output by means of the circulation devices and / or the fan is only slightly limited.

In a further advantageous embodiment, a temperature sensor is connected to the heat sink in a heat-conducting manner. The advantage here is that the temperature of the heat sink is measurable and controllable.

In a further advantageous embodiment, the temperature sensor is arranged on the printed circuit board, in particular wherein the printed circuit board has a first and a second printed circuit board section, in particular wherein the first printed circuit board section is connected to the second printed circuit board section over such a small connecting region that it can be deflected elastically thereto, is in particular elastically deflected, wherein the temperature sensor is mounted on the first circuit board portion. The advantage here is that a good thermal connection of a sensor is made possible at the same time cost-effective installation of the sensor. Due to the elastic deflection mechanical tolerances can be compensated, which may arise in particular by thermal expansion or as manufacturing tolerances. Characterized in that the sensor is arranged on an elastically deflectable portion which is held by the holding device to the heat sink at a distance defined by the holding device, a fixing of the circuit board on a housing part, which is fixedly connected to the heat sink allows. Tolerances and / or thermally induced expansions of the housing part, the printed circuit board and / or the heat sink therefore only lead to a corresponding elastic deflection of the sensor-receiving printed circuit board section. Furthermore, a sufficient electrical insulation distance between the temperature sensor and further electrical components can be achieved by separating the first from the second printed circuit board section. In a simple way, this can be achieved by an interposed recess and a correspondingly executed connection section.

In a further advantageous embodiment, a holding device is arranged between the heat sink and the first printed circuit board section. The advantage here is that the heat of the heat sink is passed through the holding device to the sensor and the temperature of the heat sink can be determined. In this way, the risk of overheating is reduced, that is, the safety is increased.

In a further advantageous embodiment, the connecting region and a second recess space the first and second printed circuit board sections, in particular wherein the recess is designed as a cutout in the printed circuit board. The advantage here is that a recess as a cutout is easy to manufacture.

In a further advantageous refinement, the recess with the connection region encloses or frames the second printed circuit board section at least partially, in particular, wherein the recess is arranged completely in the printed circuit board. The advantage here is that the second circuit board portion is elastically deflectable in this case, but by embedding the risk of breakage is less than when the recess opens into the edge of the circuit board.

In a further advantageous embodiment, the recess is executed from the edge of the circuit board forth or opens into the edge of the circuit board. The advantage here is that the recess from the edge is easy and inexpensive to manufacture.

In a further advantageous embodiment, the recess extends deeper into the printed circuit board than the width of the first printed circuit board section. The advantage here is that a particularly elastic deflection of the first circuit board portion is made possible, so a deflection with less force and thus lower voltages in the circuit board is reached.

In a further advantageous refinement, the heat transfer resistance from the heat sink via the holding device to the sensor is lower than via any other existing heat conduction paths between the heat sink and the sensor, in particular via air arranged between the heat sink and the first printed circuit board section, in particular wherein the heat sink and / or the holding device is metallic, in particular aluminum, is or are. The advantage here is that due to the good thermal connection an accurate determination of the temperature of the heat sink is made possible by the low heat conduction losses.

In a further advantageous embodiment, the circuit board is designed in multiple layers, in particular designed as a multilayer printed circuit board and / or has inner layers. The advantage here is that vias are possible that connect the individual layers. Through-hole is understood here that the inside of the recess, for example, hole, is completely metallized. In this way, electrically and / or thermally advantageous conditions can be achieved, in particular a lower heat transfer resistance from the heat sink to the sensor.

In a further advantageous embodiment, the circuit board is equipped in SMD technology and / or by means of push-through mounting, in particular, the temperature sensor is equipped in SMD technology. The advantage here is that mass production is possible.

In a further advantageous embodiment, metallic regions, in particular layers, are arranged in the first printed circuit board section, in particular on the upper side and / or lower side and / or the inner layers of the printed circuit board. The advantage here is that the metallic areas improve the heat transport along the circuit board, so in particular thus a lower heat transfer resistance from the heat sink to the sensor can be produced.

In a further advantageous embodiment, the metallic regions are designed as conductor tracks of the printed circuit board, in particular conductor tracks made of copper-containing material, in particular tinned copper conductor tracks. The advantage here is that high electrical and thermal conductivity can be realized by a single material.

In a further advantageous embodiment, the holding device touches one of the metallic areas. The advantage here is that an accurate determination of the temperature of the heat sink is made possible by low heat conduction losses on the fixture and the metallic region.

In a further advantageous embodiment, a recess in the first printed circuit board section is provided, in particular a through-hole, through which the holding device is guided or passed, in particular a metallic plated-through hole, in particular of copper-containing material, in particular tinned copper. The advantage here is that the via perpendicular to the tracks, so in the normal direction to the track plane and / or circuit board level allows heat transfer through the circuit board.

In a further advantageous embodiment, a metallic region of the printed circuit board is connected to the wall of the plated-through hole. The advantage here is that the feedthrough connects metallic areas of the circuit board electrically and thermally conductive and allows a good thermal connection of the heat sink on the fixture.

In a further advantageous embodiment, the holding device touches the wall of the feedthrough. The advantage here is that the via connects the holding device electrically and thermally conductive to the circuit board.

In a further advantageous embodiment, the connection of the holding device with the first circuit board portion is detachable, in particular screw-connected, in particular a threaded hole in the holding device is providable, which receives a fastening screw, in particular the screw head touches a metallic region of the circuit board. The advantage here is that the heat sink with the holding device is easily mounted on the circuit board.

In a further advantageous embodiment, the holding device is firmly connected to the heat sink and / or materially connected, in particular via a rivet. The advantage here is that the connection of the holding device with the heat sink is compact and does not disturb the flow of cooling air between the cooling fins of the heat sink.

In a further advantageous embodiment, the holding device is detachably connected to the heat sink via a screw-toothed part. The advantage here is that the holding device is easily mounted on the heat sink.

In a further advantageous embodiment, a frame connects the heat sink mechanically, in particular mechanically rigid, with the circuit board. The advantage here is that the electrical components are protected on the surface of the circuit board against mechanical damage.

In a further advantageous embodiment, the frame and heat sink are detachably connected, in particular wherein the frame is designed as a housing part and / or wherein the frame is at least partially housing-forming, wherein the frame is mechanically connected to the circuit board in the region of the second circuit board portion, in particular mechanically rigidly connected is. From The advantage here is that heatsink, frame and circuit board form a compact unit and are easy to use in a housing.

In a further advantageous embodiment, the sensor is arranged on the heat sink facing surface of the circuit board. The advantage here is that the sensor is protected by the heat sink from mechanical damage, especially when the first circuit board portion is elastically deflected.

In a further advantageous embodiment, the sensor is connected to the circuit board via solder joints. The advantage here is that the contact and attachment of the sensor in a manufacturing step and with a single material is executable.

In a further advantageous embodiment, the sensor has connection surfaces for electrical contacting and a temperature detection surface, wherein the temperature detection surface of the sensor is solder-bonded to a metallic region on the circuit board, which extends into the wall of the plated-through hole. The advantage here is that the electrical contact is simple and inexpensive by soldering executable and temperature sensing surface of the sensor by soldering heat-conducting over the metallic region is connected to the via and is thus connected via the holding device to the heat sink.

In a further advantageous embodiment, the holding device is designed as a bolt. The advantage here is that a bolt is easy to install.

In a further advantageous embodiment, a spacer sleeve and / or a metallic washer are arranged between the heat sink and the first printed circuit board section. The advantage here is that a defined distance between the heat sink and the first circuit board portion is adjustable and mechanical stress on the circuit board can be reduced.

Further advantages emerge from the subclaims. The invention is not limited to the combination of features of the claims. For the skilled person, further meaningful combination options of claims and / or individual claim features and / or features of the description and / or figures, in particular from the task and / or the task posing by comparison with the prior art arise.

The invention will now be explained in more detail with reference to figures:

In the 1 an arrangement for detecting the temperature of a heat sink with temperature sensor in sectional view is schematically sketched.

In the 2 For this purpose, a circuit board portion having the arrangement for detecting the temperature of a heat sink, schematically outlined in plan view.

3 shows an enlarged section of a cross section of the arrangement for detecting the temperature of a heat sink.

4 shows the front side of a printed circuit board and an associated with this heat sink of an electrical appliance according to the invention in an oblique view, wherein the housing of the arrangement is not shown.

5 shows the back of the PCB in an oblique view.

In the 6 the front of the circuit board is drawn with the associated heat sink and an associated frame in plan view.

In the 7 is the front of the circuit board without heat sink drawn in plan view.

8th shows the interconnect structure, in particular layout, the circuit board 12 in plan view.

9 shows a plan view of the arrangement of component groups on a to the circuit board 12 similar circuit board 112 schematically.

The 9 shows a schematic representation of the component groups, which saves space on the circuit board 112 are arranged. The circuit board 112 is in 9 only partially visible, as large areas of the circuit board 112 be covered by the components. The different component groups are between a heat sink 101 and the circuit board 112 or next to the heat sink 101 on the circuit board 112 arranged, the base area of the heat sink 101 is essentially rectangular. A substantially rectangular area is understood here to mean that the area has four sides, wherein the adjoining sides each form an angle of 60 ° to 120 °, in particular form an angle of 80 ° to 100 °, preferably form an angle of 90 ° ,

Between the heat sink 101 and the circuit board 112 are arranged: a power module 161 and an inductance 128 , preferably a throttle. In this case, the power module 161 a rectangular base, in particular a square base. The power module 161 is centrally under the heat sink 101 arranged, in particular it is arranged such that in the circuit board level, a side edge of the power module 161 substantially parallel to a side edge of the heat sink 101 is. By substantially parallel is meant here that the deviation from the parallelism is at most 20 °, in particular 10 °, preferably 5 °. The inductance 128 is next to the power module 161 arranged.

• – ein Steuerelektronikbereich 120
• – einen ersten Kondensator 121
• – einen zweiten Kondensator 129
• – einen Transformator 130
• – eine mehrstückige Anschlussvorrichtung 133
• – Optokoppler 134.

Not from the heat sink 101 covered section of the circuit board 112 indicates:

• - A control electronics area 120
• A first capacitor 121
• - a second capacitor 129
• - a transformer 130
• - a multi-piece connection device 133
• - Optocoupler 134 ,

The substantially rectangular control electronics area 120 is in a corner area of the circuit board 112 arranged and adjacent to the heat sink 101 covered section of the circuit board 112 , In particular, the control electronics area 120 , In particular its conductor track areas, spaced from the heat sink 101 , Advantageously, a side line section of the control electronics area extends 120 parallel to an edge of the heat sink 101 , in particular to the edge of the longer side of the heat sink 101 , Thus, a large component density can be achieved and an isolation distance can be maintained without special effort.

In addition to the control electronics area 120 and also to the heat sink 101 covered section of the circuit board 112 adjacent is the first capacitor 121 , in particular a film capacitor, disposed on the the heat sink 101 opposite side to the arranged in a line optocoupler 134 borders. Adjacent to the optocouplers 134 and along the substantially straight side edge of the circuit board 112 is a multi-piece connection device 133 comprising at least one terminal block, arranged. In particular, the side edge of the circuit board 112 arranged in a line optocoupler 134 and the side edge of the circuit board 112 with the connection device 133 essentially parallel to each other.

Next to the first capacitor 121 and between the heat sink 101 covered printed circuit board section and the connection device 133 is the second capacitor 129 arranged. The second capacitor 129 borders with the optocouplers 134 to the transformer 130 that between the heat sink 101 covered printed circuit board section and the connection device 133 is arranged.

A printed circuit board-free circuit area separates the low-voltage supplied components, in particular the control electronics area 120 , from the components supplied with high voltage, in particular thus from the power module 161 , galvanic. The control electronics area 120 is with the optocouplers 134 connected via conductor tracks, wherein both control signals and measurement signals by means of the optocoupler 134 be transferred via the conductor-free printed circuit board area to the components supplied with high voltage. For this, each of the optocouplers 134 with a first portion connected to the high voltage side and with its other portion connected to the low voltage side. The optocouplers 134 are high-voltage side by means of at least partially parallel conductor tracks 160 with components of the power module 161 electrically connected. These tracks 160 run below the first capacitor 121 , so from the capacitor 121 covered area of the circuit board 112 , In particular, the control signals and measurement signals by means of the parallel conductor tracks 160 transmitted differentially.

Advantageously, by at least partially parallel routed interconnects 160 which are electrically connected to those on the high voltage side of the respective optocoupler 134 arranged connections are connected, a reduction of the interference, in particular an improved signal-to-noise ratio in the signal transmission achieved. The parallel routed tracks 160 are thus arranged in the high voltage range and do not touch the low voltage range or only indirectly by means of the opto-couplers 134 ,

1 shows an arrangement for detecting the temperature of a heat sink 1 , The arrangement has a holding device 2 on top of the heatsink 1 thermally and / or electrically with a first circuit board portion 3 combines. The holding device 2 is designed for example as a bolt or pin. The heat transfer between the heat sink 1 and holding device 2 has a low heat transfer resistance. The heat sink 1 and the holding device 2 are metallic, preferably made of aluminum. The holding device 2 is with the heat sink 1 riveted. The connection of the holding device 2 with the first circuit board section 3 is designed to be detachable, in particular via a screw 4 whose screw thread into a threaded hole in the holding device 2 is screwed in. On the first circuit board section 3 is a sensor, preferably a temperature sensor 5 , in close proximity to the holding device 2 arranged.

The circuit board 12 is a multilayer printed circuit board, especially with inner layers. The circuit board 12 is therefore also denominated as a multilayer printed circuit board. Preferably, copper-containing material or copper is used as the material for the conductor tracks 13 used: Tinned copper is advantageous for outer layers. The electrical components, in particular the temperature sensor 5 , are with the circuit board 12 soldered. The components are preferably in SMD technology and / or by push-through mounting on the printed circuit board 12 equipped, preferably equipped on both sides or one-sided equipped on the heat sink 1 facing side of the circuit board 12 , In particular, the temperature sensor 5 on the heat sink 1 , in particular the connection point between the holding device and the heat sink facing side of the first circuit board portion 3 arranged.

2 shows the first circuit board section 3 on which the temperature sensor 5 and a recess of the printed circuit board section 3 are arranged. In particular, the recess is as a via 14 executed. Through-hole is understood here that the inner wall of the recess is completely metallized, in particular copper, or tinned copper, is used for the metallization. A metallic contact surface 11 , ie conductor track section, closes on the wall of the feedthrough 14 at. In particular, the metallic contact surface encloses 11 in the plane of the conductor track section, the recess through which the holding device 2 one and / or is passed radially. Preferably, in each case one or more conductor track sections, such a metallic contact surface 11 executed. The holding device touches 2 the wall of the via 14 and / or the metallic contact surface 11 For example, with the screw head of the screw 4 ,

The first circuit board section 3 is thermally, mechanically and electrically through a further recess 10 and a small connection area of the remaining circuit board 12 separated. This is the first circuit board section 3 elastically deflectable to the remaining circuit board 12 , In particular, the first printed circuit board section 3 by production-related and / or thermally induced length tolerances of the holding device 2 compared to the rigid connection of the remaining PCB 12 with the heat sink 1 elastically deflected.

The further recess 10 that the first circuit board section 3 from the rest of the circuit board 12 is preferably completely within the circuit board 12 arranged.

The small connection area is designed such that the recess 10 the first circuit board section 3 at least 75%. In particular, the contact region of the connection region is with the first printed circuit board section 3 smaller than the length of the connecting portion, so that the first printed circuit board portion 3 to the remaining circuit board 12 is elastically deflectable.

The metallic contact surface 11 extends to the recess 10 approach and is as a conductor track 13 on the top and / or bottom and / or the inner layers of the first circuit board section 3 executed. The temperature sensor 5 is on the heatsink 1 facing side of the first circuit board portion 3 and is electrically and / or thermally with the holding device 2 connected. In particular, the temperature sensor 5 Connecting surfaces for electrical contacting and a temperature sensing surface, which with the metallic contact surface 11 connected is.

The heat sink 1 is mechanical over a frame 42 with the circuit board 12 connected. In particular, this compound is mechanically rigid. Preferably, the connection is made detachable, for example by means of respective screw connection.

In further embodiments of the invention, the recess 10 from the edge of the circuit board 12 executed here, wherein the recess 10 deeper into the PCB 12 extends as the first circuit board portion 3 is wide.

In further embodiments of the invention, a spacer sleeve between the heat sink 1 and the first circuit board section 3 arranged. By pressing the first circuit board section 3 with the in the holding device 2 , in particular spacer sleeve, screwed screw 4 to the sleeve is a defined distance between the heat sink 1 and circuit board 3 set.

In further embodiments of the invention, the connection of the holding device takes place 2 with the circuit board 3 firmly, for example via a rivet.

In further embodiments of the invention, the mechanical connection of the holding device takes place 2 with the heat sink 1 detachable, preferably by means of screw connection.

In further embodiments of the invention is a washer between the screw head and the first circuit board section 3 and / or between the spacer sleeve and the first printed circuit board section 3 arranged around the first circuit board section 3 mechanically relieve. Preferably, the washer is made of metallic material, whereby the heat transfer resistance between the holding device 2 and the metallic contact surface 11 is reduced.

In 4 is an inventive electrical device, in particular a converter, with a heat sink 1 , that over the top, so front, the circuit board 12 is arranged, shown with the housing removed. The electrical appliance is via a first connector part 27 connectable to the electrical supply network. About a second connector part 31 the electrical connection to the consumer, in particular a motor, preferably asynchronous motor and / or synchronous motor.

The circuit board 12 is divided into two areas: a low-voltage area with a signal electronics, the z. B. a microcontroller 20 contains, as well as a first connection device 32 for an adapter for secure hold, a second connection device 33 as a signal connection, a third connection device 36 for connection to field distribution systems and a fourth connection device 37 for an external control panel.

• – ein Leistungsmodul 61,
• – ein erster Netzfilter 22 mit einer Induktivität 28 zur Entstörung des Eingangssignals.
• – ein zweiter Netzfilter 52 zur Entstörung des Ausgangssignals,
• – ein galvanisch getrennter Widerstand 50 und
• – Shuntwiderstände 51.

The second area is a high voltage area with power electronics. In the field of power electronics are arranged

• - a power module 61 .
• - a first line filter 22 with an inductance 28 for interference suppression of the input signal.
• - a second line filter 52 for interference suppression of the output signal,
• - a galvanically isolated resistor 50 and
• - Shunt Resistors 51 ,

The power module 61 includes an inverter, a rectifier and a temperature sensing device. Preferably, the power module is made of a ceramic and / or copper plate, whereby the heat dissipation is improved to the heat sink. The inverter has power semiconductor switches arranged in half bridges, preferably IGBT or MOSFET switches. In the area between the power module and the control electronics is a first capacitor 21 an intermediate circuit and a second capacitor 29 as an auxiliary capacitor. In particular, this arrangement provides a large spatial distance between the power module 61 and control electronics achieved.

The means of the first connector part 27 fed alternating current is rectified in the rectifier and in the first capacitor 21 cached. By means of the power semiconductor switch arranged in the inverter, the direct current thus generated is converted into an alternating current with a frequency and voltage changed in comparison with the supplied alternating current.

The signal transmission between the control electronics area and the power module takes place by means of a galvanically isolating first optocoupler 34 for control signals and galvanically isolating second optocoupler 35 for measuring signals. In particular, the circuit board 12 in the area between control electronics and power electronics in all levels, free of conductor tracks, ie metallic layers. The optocouplers 34 and 35 So bridge this circuit board free circuit section. In this case, each optocoupler has 34 or 35 first connection elements and second connection elements, wherein the first connection elements connected to the low voltage region, in particular soldered and the second connection elements are connected to the high voltage region, in particular soldered.

The printed circuit board section which is free of printed conductors thus extends in the transverse direction to the normal direction of the plane in which the printed circuit board extends 12 extends, and parallel to the normal direction. The optocouplers 34 and 35 are thus essentially parallel to the plane in which the circuit board 12 extends, arranged.

The optocouplers 34 and 35 are by means of parallel lines 60 with the components of the power module 61 connected. The processing of the switching network is carried out by means of a transformer 30 , In particular, a low voltage, preferably 24 V DC, is generated to supply the components of the low-voltage range.

The heat sink 1 is in the field of power electronics, it covers the line filters 22 and 52 as well as the resistance 50 and the shunts 51 and the power module 61 , The heat sink 1 extends over the entire length of the circuit board 12 from the first connector part 27 to the second connector part 31 ,

The prototype of the heat sink 1 is produced by continuous casting and from it the heat sink 1 generated by further processing. In particular, the heat sink is manufactured in one piece. The continuous casting profile has a base plate on which cooling fins extending in the continuous casting direction 26 and a plate-like, extending in a continuous casting back wall, ie back plate 25 , are integrally formed. Preferential meadow is the back plate 25 formed perpendicular to the base plate.

In the field of inductance 28 is a recess 40 in the heat sink 1 executed. This recess 40 , Preferably a round bore introduced into the continuous casting profile transversely to the continuous casting direction, divides a base plate of the cooling body 1 in two areas: a first base plate section 24 and a second base plate section 41 , Here is the recess 40 not only in the base plate, but also in medium cooling fins 26 brought in. In particular, it protrudes on the circuit board 12 arranged inductance 28 into the recess 40 of the heat sink 1 into it. In particular, the recess 40 after the continuous casting of the heat sink 1 executed, preferably drilled and / or milled.

Laterally, the heat sink 1 through a first cooling fin 23 and a back plate 25 completed the electrical appliance. About the back plate 25 the electrical appliance is thermally connected to a control cabinet, not shown in the figures and can be cooled by means of a cooling plate, not shown in the figures, in particular cold plate. This cooling plate has, for example, channels through which a cooling medium can be guided, wherein as a cooling medium, for example, water, compressed air or oil is used.

In further embodiments of the invention, the cooling plate on the opposite side of the electrical appliance surface enlarging structures, for example, cooling fins and / or cold fingers, which are cooled by convection.

In further embodiments of the invention, the heat sink is electrically connected to a grounded element of the cabinet.

In further embodiments of the invention, the heat sink 1 directly with the second recess 40 Cast as a single part, preferably cast by die casting.

In further exemplary embodiments according to the invention, the heat sink has cooling fingers as surface-enlarging structures.

In further embodiments of the invention is between the heat sink 1 and the power electronics arranged an insulating means, wherein the insulating means on the one hand the electrical components electrically insulated from the heat sink 1 and on the other hand, a lower heat transfer resistance from the electrical components to the heat sink 1 has as all other Wärmeleitpfade between the electrical components and the heat sink 1 , For example, thermal pads or thermal grease can be used as electrical insulation.

In further exemplary embodiments according to the invention, an electrical insulating means has a lower heat transfer resistance from the electrical components to the heat sink 1 has as all other Wärmeleitpfade between the electrical components and the heat sink 1 , a recess on, that of the recess 40 in the heat sink 1 corresponds to the implementation of components, in particular an inductance 28 , Such an insulating means is in particular integrally executable, for example as a heat conducting pad.

In further embodiments of the invention, the heat sink 1 made of anodized aluminum, reducing the heat emission of the heat sink 1 is increased.

In further embodiments of the invention, the circuit board 12 and the heat sink 1 by means of a frame part 42 are connected, arranged in a housing. This housing has a housing wall, which is preferably made of electrically non-conductive material.

In further embodiments according to the invention, the housing has circulation means, such as ventilation slots and flow channels, for increasing the heat release to the surrounding medium.

In further embodiments of the invention, the electrical device is air cooled by a fan. For this purpose, the ventilation current of the fan on the cooling fins 26 and thereby dissipates the heat to the ambient air.

By means of these ventilation slots, the components arranged in the low voltage range can be cooled. In this case, the heat of the components arranged in the low-voltage region is radiated to the air located in the interior of the housing. This air is convectionally replaced by the ventilation slots with the cooler outside air. Thus, the invention teaches a comprehensive cooling concept for the entire electrical appliance, which is the cooling of the power module 61 and the inductance 28 by means of the heat sink and the cooling of the microcontroller 20 by means of convection through the ventilation slots.

In practice, therefore, a thermal barrier is realized between the low-voltage region and the high-voltage region of the electrical appliance by means of a low heat transfer resistance between the heat-generating components in the high-voltage region, such as the inductance 28 and the power module 61 , and the cooling medium flow and on the other hand, a low heat transfer resistance between the components in the low voltage area, such as the microcontroller 20 , and the air in the housing, which is cooled convectively with the cooler outside air, whereas a comparatively larger heat transfer resistance between the Components of the low-voltage region and the cooling medium flow and between the components of the high-voltage region and the air in the housing is present.

In further embodiments of the invention, the electrical appliance is mounted vertically, in particular mounted such that the cooling fins are arranged vertically, so that the air circulation through the cooling fins is improved by a chimney effect.

LIST OF REFERENCE NUMBERS

1

heatsink

2

holder

3

first printed circuit board section

4

screw

5

temperature sensor

10

first recess

11

contact area

12

circuit board

13

conductor tracks

14

via

20

microcontroller

21

first capacitor

22

first line filter

23

first cooling fin

24

first base plate section

25

backplate

26

cooling fins

27

first connector part

28

inductance

29

second capacitor

30

transformer

31

second connector part

32

first connection device

33

second connection device

34

first optocoupler

35

second optocoupler

36

third connection device

37

fourth connection device

40

second recess

41

second base plate section

42

frame part

50

resistance

51

shunt resistor

52

second mains filter

60

cables

61

power module

101

heatsink

112

circuit board

120

Control electronics

121

first capacitor

128

inductance

129

second capacitor

130

transformer

133

connection device

134

optocoupler

160

cables

161

power module

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• US 20070097584 A1 [0003]
• US 20100007403 A1 [0004]
• US 20070247814 A1 [0005]
• DE 102007062202 A1 [0006]
• US 20100195284 A1 [0007]

Claims (15)

Electric device, in particular converter for supplying an electric motor, in particular an asynchronous motor and / or synchronous motor, wherein the electrical device comprises a single integral printed circuit board having a high voltage region and a low voltage region, wherein the high-voltage region and the low-voltage region are galvanically separated on the printed circuit board by arranging a conductor-free section of the printed-circuit board between the high-voltage region and the low-voltage region, especially - Wherein within the circuit board plane, the high voltage region and the low voltage region are spaced apart by means of the free portion - and / or wherein the conductor-free portion of the printed circuit board extends transversely to the normal direction of the plane in which the printed circuit board extends, and parallel to the normal direction, wherein at least one optocoupler bridges the conductor tracks free portion of the printed circuit board, in particular wherein the optocoupler is electrically connected to the first terminal elements high voltage side and second terminal elements low voltage side with respective conductor track sections, in particular soldered, wherein the at least one opto-coupler is connected to a component, in particular a power module, of the high-voltage region by means of conductor tracks guided in parallel, in particular conductor tracks arranged in the high-voltage region. Electric appliance according to at least one of the preceding claims, characterized in that Control signals from the low voltage range to the high voltage range can be transmitted by means of at least one first optocoupler and measurement signals from the high voltage range to the low voltage range can be transmitted by means of at least one second optocoupler, in particular wherein the signals are each differentially transferable by means of the parallel tracks. Electrical appliance according to at least one of the preceding claims, characterized in that in the high voltage region, a power module, in particular an inverter, and a capacitor, in particular a film capacitor, are arranged, wherein the power module is connected by means of parallel conductor tracks with at least one optocoupler and wherein the conductor tracks are arranged on the circuit board below the capacitor, in particular in the region of the printed circuit board covered by the capacitor. Electric appliance according to at least one of the preceding claims, characterized in that a heat sink is arranged in the electrical appliance, wherein the heat sink has air guiding means and wherein the air guiding means, in particular cooling ribs, guide a cooling medium flow, in particular a convection or cooling medium flow driven by a fan, along the surface of the heat sink and / or lead over the heat sink, and / or that the cooling body has a substantially rectangular base surface, wherein the cooling medium flow is directed substantially parallel to the long side of the rectangular base, and / or that the heat sink adjoins an edge of the substantially rectangular printed circuit board, in particular the edge of the long side of the printed circuit board, and / or that the heat sink is connected to a backplate, in particular integrally formed therewith as a continuous cast part, the backplate being oriented perpendicular to the circuit board plane, wherein the heat sink and the circuit board are arranged on the same side of the backplate, and / or that the heat sink is arranged in the high voltage region. Electric appliance according to at least one of the preceding claims, characterized in that the optocouplers are arranged substantially in a line, and / or that the control electronics region has a substantially rectangular shape, in particular substantially square, and / or that the capacitor is a substantially Has rectangular base, and / or that a connection device, in particular a multi-piece running connection device, the pieces are arranged in alignment, on an edge of the circuit board, in particular a heat sink opposite edge of the circuit board is disposed, and / or that the control electronics area in a corner region of the printed circuit board is arranged, wherein the control electronics area adjacent to the heat sink covered printed circuit board portion and / or the connection device and / or the optocoupler and / or the capacitor, and wherein one side of the control electronics area in Wese in parallel is arranged to escape the connection device and / or the line of a linear arrangement of optocouplers and / or a side surface of the capacitor and / or a side surface of the heat sink and / or a side of the transformer, wherein the connection device between an edge of the circuit board and the line the optocoupler is arranged, wherein the edge of the circuit board is substantially parallel to the alignment of the connection device and / or to the line of the opto-couplers, and / or that the opto-couplers are arranged between the connection device and the capacitor, wherein the line of optocouplers substantially parallel to Escape of the terminal device and / or to a side surface of the capacitor is, and / or that of the capacitor covered area of the circuit board between the area covered by the optocouplers portion of the circuit board and the heat sink covered portion of the circuit board is arranged, wherein one side of the condensate Sators is substantially parallel to the alignment of the optocouplers and / or a side surface of the heat sink, in particular wherein the capacitor is cuboid, and / or that the electrical appliance has a transformer, in particular wherein the transformer has a substantially rectangular base, wherein the transformer covered area of the circuit board to the area covered by the connecting device portion of the circuit board and / or the photocoupler covered area of the circuit board and / or the capacitor covered area of the circuit board and / or the heat sink covered area of the circuit board adjacent, in particular wherein one side the transformer is substantially parallel to the alignment of the terminal block and / or the line of optocouplers and / or a side surface of the capacitor and / or a side surface of the heat sink. Electric appliance according to at least one of the preceding claims, characterized in that the electrical appliance has an arrangement for cooling a first heat-generating component, the arrangement A printed circuit board which is equipped with a first and a second heat-generating component, A heat-conducting connected to the first heat-generating component heat sink, the air guide means for guiding a cooling medium flow, having, wherein the air guiding means guide a cooling medium flow along the second heat generating component for heat dissipation of the heat generated by the second heat generating component to the environment. Electric appliance according to at least one of the preceding claims, characterized in that the cooling medium flow is separated from the printed circuit board by means of the heat sink and / or that is arranged between the cooling medium flow and the circuit board of the heat sink, and / or that, the first heat-generating component is thermally conductively connected to the heat sink on the side of the heat sink facing away from the cooling medium flow, in particular wherein thermal paste is interposed. Electric appliance according to at least one of the preceding claims, characterized in that the second heat-generating component protrudes through a first recess of the heat sink in the cooling medium flow, in particular wherein the second heat-generating component is designed as an inductance, in particular as a throttle and / or that the heat sink is spaced from the second heat generating component. Electric appliance according to at least one of the preceding claims, characterized in that the heat sink has a base plate on which cooling fins are formed as an air-conducting means, in particular in one piece or two pieces, and / or that the heat sink has cold fingers, in particular that function as surface-enlarging structures, and / or that the heat sink is metallic, in particular made of aluminum, in particular anodized aluminum. Electric appliance according to at least one of the preceding claims, characterized in that the first recess extends through the base plate and also into a first cooling fin. wherein a second cooling fin is spaced from the first recess, in particular wherein the first recess is a round hole made in the heat sink, in particular a milled or drilled round hole. Electric appliance according to at least one of the preceding claims, characterized in that the heat sink is designed as a continuous casting profile, in particular wherein the first recess is a round hole introduced into the continuous casting profile transversely to the continuous casting direction, in particular a milled or drilled round bore, and / or that the heat sink has a plate-like, extending in a continuous casting rear wall, in particular which is executed perpendicular to the base plate, and / or that the rear wall is thermally connected to a cooling plate, in particular to a cooling plate arranged in a control cabinet, in particular wherein the cooling plate has cooling channels through which a further cooling medium, in particular water, compressed air or oil, can be guided. Electric appliance according to at least one of the preceding claims, characterized in that between the heat sink and printed circuit board, an insulating means is arranged, which has at least two recesses through which the first and the second heat-generating component protrude through, in particular wherein the insulating means is electrically insulating, in particular has a higher electrical insulation strength and / or dielectric strength than air, in particular wherein each recess of the insulating means can be brought into coincidence with the respective recess of the cooling body, wherein the insulating means has a lower thermal conductivity than air, in particular thus the heat dissipation of the printed circuit board to the environment improved, in particular via a housing of the arrangement. Electric appliance according to at least one of the preceding claims, characterized in that a frame mechanically, in particular mechanically rigidly, connects the heat sink to the circuit board, in particular wherein the frame is designed as a housing part and / or wherein the frame is at least partially housing-forming, wherein the frame is mechanically connected to the circuit board, in particular mechanically rigidly connected, and / or that a cooling medium flow driven by a fan flows past a surface region of the heat sink for dissipating heat to the ambient air, and / or that the cooling medium flow conducted by the heat sink is convectively driven and directed vertically, in particular wherein the cooling fins extend vertically, and / or that Heatsink and circuit board of a housing part, in particular a housing part of electrically non-conductive material, at least partially surrounded, in particular wherein the housing part circulation means, in particular ventilation slots and / or flow channels, and / or mounting means for a device for increasing the heat transfer to the surrounding medium , in particular fans. Electric appliance according to at least one of the preceding claims, characterized in that a temperature sensor is thermally conductively connected to the heat sink, and / or that the temperature sensor is arranged on the printed circuit board, and / or that the printed circuit board has a first and a second printed circuit board section, in particular wherein the first printed circuit board section is connected to the second printed circuit board section via such a small connecting region that it is elastically deflectable, in particular deflected, and / or that the temperature sensor is arranged on the first printed circuit board section, and / or that a holding device is arranged between the heat sink and the first printed circuit board section, and / or that the connecting region and a second recess space the first and second printed circuit board sections, in particular wherein the second cutout is designed as a cutout in the printed circuit board, and / or that the second recess with the connection region at least partially surrounds and / or frames the second circuit board section, in particular wherein the second recess is arranged completely in the printed circuit board and / or the second recess is made from the edge of the printed circuit board and / or the recess in the edge of the printed circuit board opens and / or the second recess extends deeper into the circuit board than the width of the first circuit board section, and / or that the heat sink and the holding device are thermally conductively connected, in particular wherein the holding device is metallic, preferably made of aluminum. Electric appliance according to at least one of the preceding claims, characterized in that the printed circuit board is multi-layered, in particular designed as a multilayer printed circuit board and / or has inner layers, in particular wherein the printed circuit board is equipped in SMD technology and / or by means of push-through mounting, and / or the temperature sensor is equipped with SMD technology, and / or that metallic regions, in particular layers, are arranged in the first printed circuit board section, in particular on the upper side and / or lower side and / or the inner layers of the printed circuit board, in particular wherein the metallic regions are designed as conductor tracks of the printed circuit board, in particular conductor tracks of copper-containing material, in particular tinned copper conductor tracks, wherein the holding device touches one of the metallic areas, and / or that a third recess is provided in the first printed circuit board section, in particular a metallic through-connection, in particular of copper-containing material, in particular tinned copper, in particular a metallic region of the printed circuit board the wall of the via is connected, in particular wherein the holding device touches the wall, the via, and / or that the temperature sensor is disposed on the side facing the heat sink side of the circuit board, said de r temperature sensor is connected to the circuit board via solder joints, and / or that the sensor has contact surfaces for electrical contacting and a temperature sensing surface, in particular wherein the temperature sensing surface of the temperature sensor is soldered to a metallic region on the circuit board, which extends into the wall of the via, and / or that the connection of the holding device with the first circuit board portion is detachable, in particular screw-connected, in particular a threaded bore is provided in the holding device, which receives a fastening screw, in particular the screw head touches a metallic region of the circuit board, and / or that the holding device with the heat sink is firmly connected and / or materially connected, in particular via a rivet, or that the holding device is detachably connected to the heat sink via a screw-toothed part, and / or he that the holding device is designed as a bolt and / or a spacer sleeve and / or a metallic washer between the heat sink and the first circuit board portion is arranged or are.

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