DE102011083661A1 - Herstellung eines PV-PSA-Verbunds durch Flüssigeinbettung auf Release-Film und seine Verwendung zur Herstellung von PV-Modulen - Google Patents
Herstellung eines PV-PSA-Verbunds durch Flüssigeinbettung auf Release-Film und seine Verwendung zur Herstellung von PV-Modulen Download PDFInfo
- Publication number
- DE102011083661A1 DE102011083661A1 DE102011083661A DE102011083661A DE102011083661A1 DE 102011083661 A1 DE102011083661 A1 DE 102011083661A1 DE 102011083661 A DE102011083661 A DE 102011083661A DE 102011083661 A DE102011083661 A DE 102011083661A DE 102011083661 A1 DE102011083661 A1 DE 102011083661A1
- Authority
- DE
- Germany
- Prior art keywords
- psa
- film
- composite
- polymerizable
- embedding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 29
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 239000007788 liquid Substances 0.000 title claims description 3
- 238000000034 method Methods 0.000 claims abstract description 14
- 239000000853 adhesive Substances 0.000 claims abstract description 6
- 150000001875 compounds Chemical class 0.000 claims abstract 3
- 239000011888 foil Substances 0.000 claims description 8
- 238000004132 cross linking Methods 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 7
- 238000010030 laminating Methods 0.000 claims description 5
- 238000006116 polymerization reaction Methods 0.000 claims description 5
- 238000002360 preparation method Methods 0.000 claims description 4
- 238000010924 continuous production Methods 0.000 claims description 2
- 239000004925 Acrylic resin Substances 0.000 claims 1
- 239000008393 encapsulating agent Substances 0.000 claims 1
- 229920005749 polyurethane resin Polymers 0.000 claims 1
- 229920002050 silicone resin Polymers 0.000 claims 1
- 239000011521 glass Substances 0.000 abstract description 14
- 229920003023 plastic Polymers 0.000 abstract description 11
- 239000010408 film Substances 0.000 description 46
- 239000010410 layer Substances 0.000 description 20
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 17
- 238000006243 chemical reaction Methods 0.000 description 13
- 239000000758 substrate Substances 0.000 description 13
- 238000003475 lamination Methods 0.000 description 12
- 239000000178 monomer Substances 0.000 description 11
- 239000004809 Teflon Substances 0.000 description 10
- 229920006362 Teflon® Polymers 0.000 description 10
- 239000004926 polymethyl methacrylate Substances 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
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- 239000012790 adhesive layer Substances 0.000 description 7
- 239000004033 plastic Substances 0.000 description 7
- 229920005372 Plexiglas® Polymers 0.000 description 6
- -1 PV strings Substances 0.000 description 5
- 239000002985 plastic film Substances 0.000 description 5
- 230000004888 barrier function Effects 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 239000005038 ethylene vinyl acetate Substances 0.000 description 4
- 239000011229 interlayer Substances 0.000 description 4
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- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 4
- 239000004417 polycarbonate Substances 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 125000003277 amino group Chemical group 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 3
- 229910052733 gallium Inorganic materials 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- 239000004014 plasticizer Substances 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920002620 polyvinyl fluoride Polymers 0.000 description 3
- 239000011669 selenium Substances 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- HVMJUDPAXRRVQO-UHFFFAOYSA-N copper indium Chemical compound [Cu].[In] HVMJUDPAXRRVQO-UHFFFAOYSA-N 0.000 description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 description 2
- 239000011707 mineral Substances 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229910052711 selenium Inorganic materials 0.000 description 2
- 239000011265 semifinished product Substances 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 235000001892 vitamin D2 Nutrition 0.000 description 2
- BUHVIAUBTBOHAG-FOYDDCNASA-N (2r,3r,4s,5r)-2-[6-[[2-(3,5-dimethoxyphenyl)-2-(2-methylphenyl)ethyl]amino]purin-9-yl]-5-(hydroxymethyl)oxolane-3,4-diol Chemical compound COC1=CC(OC)=CC(C(CNC=2C=3N=CN(C=3N=CN=2)[C@H]2[C@@H]([C@H](O)[C@@H](CO)O2)O)C=2C(=CC=CC=2)C)=C1 BUHVIAUBTBOHAG-FOYDDCNASA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BWGNESOTFCXPMA-UHFFFAOYSA-N Dihydrogen disulfide Chemical compound SS BWGNESOTFCXPMA-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 229920004482 WACKER® Polymers 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- ZZEMEJKDTZOXOI-UHFFFAOYSA-N digallium;selenium(2-) Chemical compound [Ga+3].[Ga+3].[Se-2].[Se-2].[Se-2] ZZEMEJKDTZOXOI-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 150000003627 tricarboxylic acid derivatives Chemical class 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
- B32B2037/243—Coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
- B32B2037/268—Release layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B2038/0052—Other operations not otherwise provided for
- B32B2038/0076—Curing, vulcanising, cross-linking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/08—Dimensions, e.g. volume
- B32B2309/10—Dimensions, e.g. volume linear, e.g. length, distance, width
- B32B2309/105—Thickness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2333/00—Polymers of unsaturated acids or derivatives thereof
- B32B2333/04—Polymers of esters
- B32B2333/08—Polymers of acrylic acid esters, e.g. PMA, i.e. polymethylacrylate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2375/00—Polyureas; Polyurethanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/12—Photovoltaic modules
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
- B32B37/1009—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using vacuum and fluid pressure
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laminated Bodies (AREA)
- Photovoltaic Devices (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102011083661A DE102011083661A1 (de) | 2011-06-29 | 2011-09-29 | Herstellung eines PV-PSA-Verbunds durch Flüssigeinbettung auf Release-Film und seine Verwendung zur Herstellung von PV-Modulen |
PCT/EP2012/059952 WO2013000648A1 (fr) | 2011-06-29 | 2012-05-29 | Production de composite composé de cellules photovoltaïques en couches minces (pv) et de films adhésifs sensibles à la pression (psa) par incorporation liquide sur pellicule anti-adhésive et son utilisation pour produire des modules photovoltaïques |
TW101122791A TW201330292A (zh) | 2011-06-29 | 2012-06-26 | 藉由在脫離膜上面之嵌埋用液體之作用來製造pv-psa組合件,以及利用彼來製造pv模組 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102011078305.9 | 2011-06-29 | ||
DE102011078305 | 2011-06-29 | ||
DE102011083661A DE102011083661A1 (de) | 2011-06-29 | 2011-09-29 | Herstellung eines PV-PSA-Verbunds durch Flüssigeinbettung auf Release-Film und seine Verwendung zur Herstellung von PV-Modulen |
Publications (1)
Publication Number | Publication Date |
---|---|
DE102011083661A1 true DE102011083661A1 (de) | 2013-01-03 |
Family
ID=47355070
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102011083661A Withdrawn DE102011083661A1 (de) | 2011-06-29 | 2011-09-29 | Herstellung eines PV-PSA-Verbunds durch Flüssigeinbettung auf Release-Film und seine Verwendung zur Herstellung von PV-Modulen |
Country Status (3)
Country | Link |
---|---|
DE (1) | DE102011083661A1 (fr) |
TW (1) | TW201330292A (fr) |
WO (1) | WO2013000648A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020185615A1 (fr) * | 2019-03-08 | 2020-09-17 | H.B. Fuller Company | Systèmes et procédés d'encapsulation d'un composant électronique |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB201504760D0 (en) * | 2015-03-20 | 2015-05-06 | Dupont Teijin Films Us Ltd Partnership | PV cells |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3924393A1 (de) | 1989-07-24 | 1991-01-31 | Roehm Gmbh | Wasserloeslicher druckempfindlicher hauthaftkleber, dessen verwendung und damit ausgeruestete mittel |
DE19653606A1 (de) | 1996-12-20 | 1998-06-25 | Roehm Gmbh | Haft- und Bindemittel aus (Meth)acrylatpolymer, organischer Säure und Weichmacher |
DE19653605A1 (de) | 1996-12-20 | 1998-06-25 | Roehm Gmbh | Haft- und Bindemittel für dermale oder transdermale Therapiesysteme |
DE102008024551A1 (de) * | 2008-05-21 | 2009-11-26 | Tesa Se | Verfahren zur Verkapselung von optoelektronischen Bauteilen |
DE102008064620A1 (de) * | 2008-07-04 | 2010-01-21 | Kraussmaffei Technologies Gmbh | Verfahren und Vorrichtung zur Herstellung eines Solarmoduls und solches Solarmodul |
DE102008062130A1 (de) * | 2008-12-16 | 2010-06-17 | Tesa Se | Verfahren zur Kapselung einer elektronischen Anordnung |
DE102010030074A1 (de) | 2010-06-15 | 2011-12-15 | Evonik Degussa Gmbh | Kunststoff-Photovoltaik-Modul und Verfahren zu seiner Herstellung |
DE102011084054A1 (de) | 2010-12-07 | 2012-06-14 | Evonik Degussa Gmbh | Photovoltaik(PV)-PSA-Verbund und Verwendung zur Herstellung von PV-Modulen durch Flüssigeinbettung |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3013037C2 (de) * | 1980-04-03 | 1985-09-12 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Terrestrischer Solargenerator |
CN101548391B (zh) * | 2005-11-04 | 2012-01-25 | 陶氏康宁公司 | 封装光伏电池 |
US8404967B2 (en) * | 2008-01-08 | 2013-03-26 | Certainteed Corporation | Photovoltaic module |
EP2460266A4 (fr) * | 2009-07-31 | 2013-07-17 | Du Pont | Agents d encapsulation réticulables pour cellules photovoltaïques |
-
2011
- 2011-09-29 DE DE102011083661A patent/DE102011083661A1/de not_active Withdrawn
-
2012
- 2012-05-29 WO PCT/EP2012/059952 patent/WO2013000648A1/fr active Application Filing
- 2012-06-26 TW TW101122791A patent/TW201330292A/zh unknown
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3924393A1 (de) | 1989-07-24 | 1991-01-31 | Roehm Gmbh | Wasserloeslicher druckempfindlicher hauthaftkleber, dessen verwendung und damit ausgeruestete mittel |
DE19653606A1 (de) | 1996-12-20 | 1998-06-25 | Roehm Gmbh | Haft- und Bindemittel aus (Meth)acrylatpolymer, organischer Säure und Weichmacher |
DE19653605A1 (de) | 1996-12-20 | 1998-06-25 | Roehm Gmbh | Haft- und Bindemittel für dermale oder transdermale Therapiesysteme |
DE102008024551A1 (de) * | 2008-05-21 | 2009-11-26 | Tesa Se | Verfahren zur Verkapselung von optoelektronischen Bauteilen |
DE102008064620A1 (de) * | 2008-07-04 | 2010-01-21 | Kraussmaffei Technologies Gmbh | Verfahren und Vorrichtung zur Herstellung eines Solarmoduls und solches Solarmodul |
DE102008062130A1 (de) * | 2008-12-16 | 2010-06-17 | Tesa Se | Verfahren zur Kapselung einer elektronischen Anordnung |
DE102010030074A1 (de) | 2010-06-15 | 2011-12-15 | Evonik Degussa Gmbh | Kunststoff-Photovoltaik-Modul und Verfahren zu seiner Herstellung |
DE102011084054A1 (de) | 2010-12-07 | 2012-06-14 | Evonik Degussa Gmbh | Photovoltaik(PV)-PSA-Verbund und Verwendung zur Herstellung von PV-Modulen durch Flüssigeinbettung |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020185615A1 (fr) * | 2019-03-08 | 2020-09-17 | H.B. Fuller Company | Systèmes et procédés d'encapsulation d'un composant électronique |
Also Published As
Publication number | Publication date |
---|---|
WO2013000648A1 (fr) | 2013-01-03 |
TW201330292A (zh) | 2013-07-16 |
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