DE102011075531A1 - LED arrangement for viewing e.g. logo, has LED arranged on printed circuit board, and profile part with opening emerges radiation from arrangement, where profile part partially surrounds one of protective materials - Google Patents

Abstract

The arrangement (10) has an LED (14) arranged on a printed circuit board (12). The LED outputs a radiation during an operation of the LED, where an emission direction of the radiation coincides with an extension direction of the board. The extension direction differs from the thickness of the board. The LED and/or printed circuit board are partially embedded in transparent or translucent and opaque protective materials (18, 20), and a profile part (22) with an opening (24) emerges the radiation from the arrangement. The profile part partially surrounds one of the protective materials. An independent claim is also included for a method for manufacturing an LED arrangement.

Description

Technical area

The invention is based on a light-emitting diode arrangement which comprises at least one light-emitting diode arranged on a printed circuit board. In this case, during operation of the light-emitting diode, an exit direction of radiation originating from the light-emitting diode coincides with a direction of extension of the printed circuit board which is different from a thickness of the printed circuit board. Such an arrangement is also referred to as a side LED arrangement, since with respect to the printed circuit board there is substantially lateral radiation of the light emitting diode and no radiation directed substantially perpendicular to the printed circuit board. The at least one light emitting diode and / or the printed circuit board are at least partially embedded in a protective material.

State of the art

In a light-emitting diode arrangement known from the prior art, both the light-emitting diodes and the printed circuit board are embedded in a protective material, for example by applying a potting compound to the light-emitting diode located on the printed circuit board. Embedding in the protective material is done to provide mechanical protection and environmental protection for the LEDs and the circuit board. In a prior art LED array, polyurethane is used as the protective material, and the printed circuit board with the LEDs is surrounded by coextrusion with polyurethane.

Such a production of the light emitting diode array is complex and costly.

Presentation of the invention

The object of the present invention is to provide a light emitting diode array of the type mentioned, which is simple and inexpensive to produce.

This object is achieved by a light-emitting diode arrangement having the features of patent claim 1 and by a method having the features of patent claim 12.

Particularly advantageous embodiments can be found in the dependent claims.

The light-emitting diode arrangement according to the invention comprises a profiled part which permits the emission of radiation from the light-emitting diode arrangement and at least partially surrounds the at least one protective material. This makes it possible to realize the embedding of the at least one light-emitting diode and / or the printed circuit board in the at least one protective material by introducing the same into the profile part. By providing the profile part, it is possible to create very homogeneous surfaces of the light-emitting diode arrangement, which have reproducibly uniform properties. In addition, such a very precise embedding of the LEDs and the circuit board can be achieved in the at least one protective material without the radiation leakage disturbing cavities occur in the protective material. When using a liquid when introduced into the profile part protective material, the latter can be particularly easily and precisely dosed so that no protective material undesirably exits the profile part. Also, the handling of the protective material is substantially facilitated by the provision of the profile part. Due to the fact that the profile part providing a mold for the protective material is a component of the light-emitting diode arrangement, the light-emitting diode arrangement is particularly simple, inexpensive and inexpensive to produce.

In an advantageous embodiment of the invention, the profile part has at least one opening which allows the radiation to exit the light-emitting diode arrangement. The protective material is then arranged in an open profile part, and the radiation of the LEDs occurs in the operation of the same through the opening of the profile part. The formation of the profile part as an open profile simplifies its manufacture, since it does not need to be designed to be at least partially transparent or translucent, as basically possible, in order to allow a radiation exit.

A particularly extensive protection of the at least one light-emitting diode and / or the printed circuit board can be achieved if, according to a further advantageous embodiment of the invention, the at least one protective material fills the profile part up to the at least one opening. Then, the protective material is substantially flush with an opening bounding edge of the profile part. The at least one protective material can also fill the profile part beyond the at least one opening. By such, the edge of the opening dome-shaped superior education of the protective material can be a particularly good coupling of the radiation from the light emitting diode array reach.

A particularly simple production of the profile part, such as by extrusion, can be realized if this is formed in cross-section substantially U-shaped or substantially V-shaped. It is also possible to provide a V-profile with a somewhat wider base so that the profile part has, in cross-section, a transitional shape between a pure U-profile and a pure V-profile. To achieve that radiation over the open side emerges from the profile part, the circuit board is arranged on an inner side of a leg of the U-shaped or V-shaped profile part. In addition, the circuit board can be attached to the leg very easy, as it is particularly well accessible through the opening of the U-profile or V-profile.

In particular, in a cross-sectionally V-shaped profile part, the circuit board can be attached to one of the two legs with very little effort, since the free leg bent slightly for mounting the profile part and thus an increase in the opening width of the V-profile can be achieved.

As a further advantage, it has been shown that a distance between the two legs of the profile part is at least substantially equal to a height of the printed circuit board with the at least one light emitting diode arranged on this. In other words, a width of the profile part can be matched to the height of the printed circuit board and the LED. Then only a comparatively small volume of the profile part needs to be filled with the protective material in order to embed the light-emitting diode and the printed circuit board in this.

In a further advantageous embodiment of the invention, the circuit board and the profile part in the direction of the thickness of the circuit board are bendable nondestructive. Then, the light emitting diode array can be brought into a form which makes it possible to emulate characters, letters, numbers or logos. In this case, the light-emitting diodes then transmit the radiation counter to the viewing direction of an observer looking at the sign or logo.

In particular, when the circuit board and the profile part are bendable nondestructive, the light emitting diode array can be provided as a strand-shaped product having a plurality of light-emitting diodes. Then, as needed, a piece of the light emitting diode array can be cut and used to form a sign or logo - or area of such.

For fixing a distance of the at least one light-emitting diode from a wall of the profile part, at least one spacer can be provided. It can be provided in manufacturing technology particularly simple manner different width light emitting diode arrays, in which the arrangement of the light emitting diodes in the profile part is different. Thus, with a wide spacer, the light emitting diode is further spaced from the wall of the profile member than providing only a narrow spacer or no spacer at all. The spacer may in particular be formed integrally with the profile part, such as by a first wall of the profile part is formed thicker than a second wall of the profile part.

By providing spacers, it is possible in particular to achieve a substantially central position of the light-emitting diodes or of the printed circuit board in the profile part in relation to the width of the light-emitting diode arrangement seen perpendicular to the outlet direction. In particular, such a central arrangement of the printed circuit board allows for a flexible printed circuit board a particularly small bending radius of the light emitting diode array. However, an asymmetrical arrangement of the printed circuit board and of the light-emitting diodes in the profile part which is desired, for example for optical reasons, is also possible if at least one corresponding spacer is provided.

For fixing the printed circuit board to the profile part, in particular an adhesive and / or an adhesive tape can be provided. Additionally or alternatively, at least one locking element may be provided to fix the circuit board to the profile part. Such fixing of the circuit board to the profile part by clipping manufacturing technology is particularly low in effort and easy to accomplish. The locking element may in particular be provided by a spacer, or it may provide a spacer in cooperation with at least one further locking element for locking the circuit board to the profile part. The at least one latching element may in particular be formed integrally with the profile part. Thus, it is possible to dispense with the use of adhesive or adhesive tape for fixing the circuit board by specific design of the profile part.

Additionally or alternatively, to specify a position of the circuit board relative to the profile part, a temporary support may be provided, which is removed after the introduction of the protective material in the profile part again.

If only a protective material is to be used, then it is advantageous to provide a transparent or translucent material for this, since then a particularly extensive protection of the light-emitting diode and the printed circuit board at the same time unhindered leakage of radiation from the light emitting diode array can be achieved. Namely, the light emitting diode can be completely embedded in the transparent or translucent protective material.

If the transparent or translucent protective material substantially completely fills the profile part, air pockets are avoided, which otherwise can lead to undesirable total reflections of the radiation of the light-emitting diode.

In a further advantageous embodiment of the invention, a first, transparent or translucent protective material is provided and a second, opaque protective material. By the opaque protective material different components of the light emitting diode array can be hidden from the LEDs, so that there is a visually appealing appearance of the light emitting diode array. In contrast, the transparent or translucent protective material ensures unhindered leakage of the radiation of the light-emitting diode from the light-emitting diode arrangement. In particular, when two protective materials are successively introduced into the profile part, it is advantageous, at least during the introduction of the printed circuit board embedding the LEDs with the protective material to provide a holder to fix the circuit board relative to the profile part in their position.

It is furthermore advantageous if at least one component of the light-emitting diode arrangement which is different from the at least one light-emitting diode is completely embedded in the second, opaque protective material. In this case, in particular, a filling level of the opaque protective material in the profile part can be selected so that all components except the light-emitting diodes are embedded in the opaque protective material and thus hidden. It is then ensured that a viewer can only see the light-emitting diodes arranged in the profile part.

Additionally or alternatively, the at least one light-emitting diode can be embedded up to an edge thereof in the second, opaque protective material. If the second protective material only extends to a lower edge of the light-emitting diode, as seen in the outlet direction, a particularly large part of it is embedded in the transparent or translucent protective material. However, the opaque protective material may also extend to an upper edge of the at least one light emitting diode, or the light emitting diodes may be partially embedded in the second, opaque protective material. Then the LEDs are also largely hidden.

If two different light-transmissive protective materials are introduced into the profile part, they can cure successively or together, for example by applying the same with UV light. In a co-curing of the two protective materials, a particularly good adhesion of the same can be achieved.

The opaque protective material may be colored, depending on the choice of coloring pigments different colors of the protective material, even within one and the same profile part, may be provided. In particular, the same or different colors can be provided for the opaque protective material and the profile part, so that a very great creative freedom is given.

Furthermore, it is possible to provide a transparent protective material and a translucent protective material, wherein then, in particular, the components to be concealed from the view of a viewer of the light-emitting diode arrangement may be arranged in the translucent protective material. This translucent protective material can also be used in different colors.

Finally, it has proven to be advantageous if the at least one protective material and / or the profile part comprises a polymer. Then namely a particularly cost-effective production of the light emitting diode array is possible. In particular silicones or polyurethanes can be used as polymers, wherein the use of a silicone is particularly advantageous due to the longevity and the resistance.

The use of a polymer for the protective material and the profile part makes it possible to make electrical contact with the printed circuit board through the protective material and / or the profile part. Such a material, in particular in the form of a silicone or a polyurethane, namely can be easily penetrated with an acicular contact element from the outside. This is advantageous in particular when the light-emitting diode arrangement is in the form of a strand, wherein only a cut piece of the strand is to be used for providing radiation, in particular for forming a sign or logo.

In the method according to the invention for producing a light-emitting diode arrangement, at least one light-emitting diode is arranged on a printed circuit board in such a way that an exit direction of radiation emitted by the at least one light-emitting diode coincides with a direction of extension of the printed circuit board that is different from a thickness of the printed circuit board. The printed circuit board is introduced into a profile part which allows the radiation to emerge from the light-emitting diode arrangement. Subsequently, the at least one light emitting diode and / or the printed circuit board are at least partially embedded in at least one protective material such that the profile part surrounds the at least one protective material at least partially. This method enables a particularly simple and cost-effective production of the light-emitting diode arrangement.

Alternatively, the circuit board can first be arranged on the profile part, and before embedding the circuit board and / or the at least one light-emitting diode in the protective material, the light-emitting diode can be arranged on the circuit board.

The advantages and preferred embodiments described for the light-emitting diode arrangement according to the invention also apply to the method according to the invention.

The features and feature combinations mentioned above in the description as well as the features and feature combinations mentioned below in the description of the figures and / or in the figures alone can be used not only in the respectively specified combination but also in other combinations or in isolation, without the scope of To leave invention.

Short description of the drawing (s)

Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. Show it:

1 in a schematic sectional view of a light-emitting diode arrangement in which outgoing light from a light emitting diode from an open-topped U-profile, wherein the U-profile is filled with a colored potting compound and above the light emitting diode with a transparent potting compound;

2 in a schematic sectional view of a light emitting diode array with one of the two potting filled profile part, which has mutually inclined legs;

3 in a schematic sectional view of a light emitting diode array in which instead of a U-profile, a V-profile is filled by the two potting compounds;

4 in a schematic sectional view of a light-emitting diode according to 1 , wherein the U-profile is completely filled with transparent potting compound;

5 in a schematic sectional view of a light-emitting diode according to 2 , wherein the profile part is completely filled with transparent potting compound;

6 in a schematic sectional view of a light-emitting diode according to 3 , wherein the V-profile is completely filled with transparent potting compound;

7 in a schematic sectional view and in a schematic plan view of a light emitting diode array according to 1 wherein the light-emitting diodes are arranged centrally between the two legs of the U-profile;

8th in two schematic sectional views and in a schematic plan view of a light emitting diode array with a U-profile, wherein spacers determine the distance of the LEDs from a leg of the U-profile;

9 in two schematic sectional views and in a schematic plan view of a light emitting diode array having a U-profile, wherein the U-profile has different thickness legs and wherein spacers provide for a substantially central arrangement of the LEDs in the U-profile;

10 in a schematic sectional view and in a schematic plan view of a light emitting diode array according to 7 , wherein the U-profile is filled with only one, transparent potting compound;

11 in two schematic sectional views and in a schematic plan view of a light emitting diode array according to 8th , wherein the U-profile is filled with only one, transparent potting compound; and

12 in two schematic sectional views and in a schematic plan view of a light emitting diode array according to 9 , wherein the U-profile is filled with only one, transparent potting compound.

Preferred embodiment of the invention

1 shows schematically and cut a light emitting diode array 10 which is a circuit board 12 and one on the circuit board 12 arranged light emitting diode 14 includes. Here is the LED 14 so on the circuit board 12 arranged that from the light emitting diode 14 emitted light, which in 1 through an arrow 16 is illustrated, in the extension direction of the circuit board 12 from the light emitting diode array 10 exit. Such an arrangement of light emitting diodes 14 on a circuit board 12 is also referred to as a side LED arrangement because the light is not perpendicular to the circuit board 12 but substantially parallel to this from the light emitting diode array 10 exit.

The circuit board 12 and the light emitting diode 14 are at the in 1 shown embodiment of the light emitting diode array 10 for mechanical protection and protection against environmental influences in protective materials in the form of two potting compounds 18 . 20 embedded. The two potting compounds 18 . 20 fill in this case a profile part in the form of a U-profile 22 to an opening 24 of the U-profile 22 out. Out of the opening 24 this occurs from the LED 14 outgoing light.

The U-profile 22 includes a first leg 26 and a second leg 28 which have a base 30 connected to each other. The circuit board 12 is by means of an adhesive tape 32 on the first leg 26 attached, and indeed upright. In alternative embodiments, the circuit board 12 in the U-profile 22 be attached by clipping. For this purpose, corresponding locking webs or the like locking elements may be provided.

On the circuit board 12 are other electronic components 34 arranged, of which in 1 one is shown schematically. Such components 34 can provide a polarity reversal protection, so that one of the wrong polarity ago connecting the LED 14 leads to no damage. Alternatively or additionally, as a component 34 a ballast be provided, which the driving of the light emitting diode 14 serves. In particular, in a plurality of in the light emitting diode array 10 provided light-emitting diodes 14 can the component 34 cause a compensation of resistances, so that the same luminous intensity of the arranged in a row LEDs 14 be achieved.

According to 1 are the circuit board 12 , the component 34 and the light emitting diode 14 into the potting compound provided with colored pigments 18 embedded. For example, as a colored potting compound 18 white silicone are used. The pigmented, opaque casting compound 18 but may have other colors.

At the in 1 shown embodiment of the light emitting diode array 10 extends the colored potting compound 18 up to an upper edge 36 the LED 14 , Above this potting compound 18 is in the U-profile 22 the transparent potting compound 20 intended. In this way, those of the light emitting diode 14 various electronic components 34 which within the U-profile 22 are arranged through the colored potting compound 18 hidden, and that of the LED 14 Outgoing light can pass freely through the transparent potting compound 20 pass.

The potting compounds 18 . 20 may in particular be formed as silicones, which are curable by means of UV light.

On at least one of the thighs 26 . 28 and / or - as shown here - at the base 30 of the U-profile 22 can be a tape 38 be provided so that the U-profile 22 can be attached by gluing to a surface. When leakage of light is not just about the opening 24 from the U-profile 22 is desired, also can the U-profile 22 - and optionally the tape 38 Be formed at least partially transparent or translucent.

At the in 2 shown embodiment of the light emitting diode array 10 is a profile part instead of a U-profile 40 with a comparatively short base 30 and two legs inclined to each other 26 . 28 provided in which the potting compounds 18 . 20 are arranged. Again, the circuit board 12 with the LED 14 and the component 34 by means of the adhesive tape 32 on one of the two legs 26 attached. The pigmented potting compound 18 but not enough to the top 36 the LED 14 but this is only in its lower part in the potting compound 18 embedded. Accordingly, by the transparent potting compound 20 through a part of the LED 14 and the circuit board 12 visible to a viewer.

The width of the base 30 can both at the in 1 as well as at the 2 shown embodiment, which height on the circuit board 12 arranged components 34 or light-emitting diodes 14 exhibit. So profile parts can be provided with different widths.

At the in 3 shown embodiment of the light emitting diode array 10 is a profile part 42 designed as a V-profile, the legs 26 . 28 of the profile part 42 so they collide at an acute angle. Again, as with the in 2 shown embodiment, for accommodating different heights having electronic components 34 within the profile part 42 the two thighs 26 . 28 include different sized angles. The profile part 42 can therefore have different opening angles in different embodiments.

Also the filling level of the pigmented potting compound 18 can be made dependent on where on the circuit board 12 arranged electronic components 34 as seen in the exit direction of the light. Shall these electronic components 34 completely in the pigmented potting compound 18 be embedded, so is a correspondingly large filling height of the same in the profile parts 22 . 40 . 42 provided.

The exit side on the LED 14 provided transparent potting compound 20 can the U-profile 22 until the opening 24 fill in (compare 1 ) or the thighs 26 . 28 can over the transparent potting compound 20 extend (compare 2 and 3 ). However, it can also be the transparent potting compound 20 one over the opening 24 form outward reaching summit, in order to achieve a particularly good light extraction.

The light-emitting diode arrangement 10 is perpendicular to the exit direction of the light bendable, so that by means of the light emitting diode array 10 Let letters, numbers or logos with curved areas be realized. For this are both the circuit board 12 as well as the profile parts 22 . 40 . 42 designed to be non-destructively bendable.

In the 4 shown embodiment of the light emitting diode array 10 is essentially the same as in 1 shown. According to 4 is however the U-profile 22 up to an upper edge of the thighs 26 . 28 out of the transparent potting compound 20 filled. So here is the potting compound 20 in one step in the U-profile 22 introduced while at the in 1 shown embodiment, the potting compounds 18 . 20 be filled in layers. Even with a taking place in two separate steps introducing the potting compounds 18 . 20 in the U-profile 22 However, the curing of the same can be done in one step.

In the 5 and 6 shown embodiments of the light emitting diode array 10 are essentially the same as in 2 and 3 shown, but here is instead of two different translucent potting compounds only a potting compound 20 provided, which is transparent. Thus, in the in 4 to 6 shown embodiments of the light emitting diode array 10 from one through the opening 24 in the profile part 22 . 40 . 42 looking at the viewer on the circuit board 12 arranged components 34 , the circuit board 12 and the light emitting diodes 14 be seen.

When manufacturing the light-emitting diode arrangements 10 First, the with a plurality of light emitting diodes 14 and the electronic components 34 provided, flexible circuit board 12 on the thigh 26 of the profile part 22 . 40 . 42 attached. Subsequently, only the transparent potting compound 20 or the opaque potting compound 18 and the transparent potting compound 20 in the profile part 22 . 40 . 42 filled. After curing of the casting compounds 18 . 20 are the light-emitting diodes 14 and the circuit board 12 as well as arranged on this other components 34 protected against damage and against harmful environmental influences.

At the in 7 shown sectional view of the light emitting diode array 10 border the two thighs 26 . 28 of the U-profile 22 to the circuit board 12 on the one hand and the light emitting diode 14 on the other hand. Accordingly, the light emitting diodes 14 essentially centered in the U-profile 22 arranged. Between the LEDs 14 is through the transparent potting compound 20 through the pigmented potting compound 18 visible, but not visible are those of these laminated components 34 ,

At the in 8th shown embodiment of the light emitting diode array 10 is the circuit board 12 on one of the two legs 26 arranged. On the opposite leg 28 are spacers 44 . 46 provided by which the distance of the light-emitting diodes 14 from the opposite leg 28 is fixed. In 8th are exemplary of various light emitting diode arrangements 10 spacer 44 . 46 different widths shown, which with correspondingly different widths of the base 30 of the U-profile 22 correspond.

In particular, from the top view in 8th it becomes apparent that by providing the spacers 44 an asymmetrical arrangement of the circuit board 12 and the LEDs 14 in the U-profile 22 is reached.

In the embodiment according to 9 are as well as in the embodiments according to 7 and 8th the opaque casting compound 18 which are the electronic components 34 laminated, and the transparent potting compound 20 intended. Also here are on one of the two thighs 28 of the U-profile 22 the spacers 44 respectively. 46 intended. However, that points to the spacers 44 respectively. 46 opposite thighs 26 a greater wall thickness than the leg 28 on. In cooperation with the spacers 44 . 46 and the thicker thigh 26 of the U-profile 22 This results in a substantially central arrangement of the circuit board 12 and the LEDs 14 in the U-profile 22 , Such profile parts with legs 26 . 28 different thickness can be produced particularly easily by extrusion of the profile parts.

In the 10 shown embodiment of the light emitting diode array 10 is essentially the same as in 7 shown, but here only fills the transparent potting compound 20 the U-profile 22 out. Accordingly, in the plan view between the middle between the two legs 26 . 28 arranged light-emitting diodes 14 the electronic components 34 through the transparent potting compound 20 to recognize through.

At the in 11 shown embodiment, which otherwise the in 9 shown, ensure the transparent potting compound 20 embedded spacers 44 . 46 for that the light emitting diodes 14 and the circuit board 12 asymmetric in the U-profile 22 are arranged. Through the transparent potting compound 20 through are the electronic components 34 recognizable to a viewer, which opposes the exit direction of the light on the U-profile 22 looks.

In the 12 shown embodiment of the light emitting diode array 10 is essentially the same as in 9 shown, in which the leg 26 on which the circuit board 12 is arranged, has a greater thickness than the opposite leg 28 on which the spacers 44 . 46 are arranged. Again, the U-profile 22 with the transparent potting compound 20 and the underlying pigmented potting compound 18 filled. Consequently, in the plan view of the opening 24 of the U-profile 22 through the transparent potting compound 20 through only the pigmented potting compound 18 and the spacers 44 recognizable.

Claims (12)

Light emitting diode arrangement, with at least one light emitting diode ( 14 ), which are mounted on a printed circuit board ( 12 ) is arranged, wherein an exit direction ( 16 ) of during operation of the at least one light emitting diode ( 14 ) of this outgoing radiation with one of a thickness of the printed circuit board ( 12 ) different extension direction of the circuit board ( 12 ), and wherein the at least one light-emitting diode ( 14 ) and / or the printed circuit board ( 12 ) at least partially into at least one protective material ( 18 . 20 ) are embedded, characterized in that the light-emitting diode arrangement ( 10 ) the leakage of radiation from the light emitting diode array ( 10 ) permitting profile part ( 22 . 40 . 42 ) comprising the at least one protective material ( 18 . 20 ) at least partially surrounds. Light-emitting diode arrangement according to claim 1, characterized in that the profile part ( 22 . 40 . 42 ) at least one of the emission of radiation from the light emitting diode array ( 10 ) permitting opening ( 24 ) having. Light-emitting diode arrangement according to claim 2, characterized in that the at least one protective material ( 18 . 20 ) the profile part ( 22 . 40 . 42 ) to the at least one opening ( 24 ) and / or via the at least one opening ( 24 ). Light-emitting diode arrangement according to one of claims 1 to 3, characterized in that the profile part ( 22 . 40 . 42 ) is formed in cross-section substantially U-shaped and / or substantially V-shaped, wherein the circuit board ( 12 ) on an inner side of a thigh ( 26 ) of the profile part ( 22 . 40 . 42 ) is arranged. Light-emitting diode arrangement according to claim 4, characterized in that a distance between the two legs ( 26 . 28 ) of the profile part ( 22 . 40 . 42 ) at least substantially a height of the printed circuit board ( 12 ) with the at least one arranged on this light emitting diode ( 14 ) is equal to. Light-emitting diode arrangement according to one of claims 1 to 5, characterized in that the printed circuit board ( 12 ) and the profile part ( 22 . 40 . 42 ) in the direction of the thickness of the printed circuit board ( 12 ) are non-destructively bendable. Light emitting diode arrangement according to one of claims 1 to 6, characterized by at least one, in particular in one piece with the profile part ( 22 . 40 . 42 ), spacers ( 44 . 46 ) for defining a spacing of the at least one light-emitting diode ( 14 ) from a wall ( 28 ) of the profile part ( 22 . 40 . 42 ). Light-emitting diode arrangement according to one of Claims 1 to 7, characterized by an adhesive and / or an adhesive tape ( 32 ) and / or at least one latching element for fixing the printed circuit board ( 12 ) on the profile part ( 22 . 40 . 42 ). Light-emitting diode arrangement according to one of Claims 1 to 8, characterized by a first, transparent or translucent protective material ( 20 ) and a second, opaque protective material ( 18 ). Light-emitting diode arrangement according to claim 9, characterized in that in the second protective material ( 18 ) at least one of the at least one light emitting diode ( 14 ) different component ( 34 ) of the light-emitting diode arrangement ( 10 ) completely and / or the at least one light-emitting diode ( 14 ) to an edge ( 36 ) are embedded. Light-emitting diode arrangement according to one of claims 1 to 10, characterized in that the at least one protective material ( 18 . 20 ) and / or the profile part ( 22 . 40 . 42 ) comprises a polymer, in particular a silicone or a polyurethane. Method for producing a light-emitting diode arrangement ( 10 ) with the steps: a. Arranging at least one light emitting diode ( 14 ) on a printed circuit board ( 12 ) such that an exit direction ( 16 ) of during operation of the at least one light emitting diode ( 14 ) of this outgoing radiation with one of a thickness of the printed circuit board ( 12 ) different extension direction of the circuit board ( 12 ) coincides; b. Inserting the printed circuit board ( 12 ) in a the leakage of radiation from the light emitting diode array ( 10 ) permitting profile part ( 22 . 40 . 42 ); c. Embedding at least a portion of the at least one light emitting diode ( 14 ) and / or the printed circuit board ( 12 ) in at least one protective material ( 18 . 20 ) such that the profile part ( 22 . 40 . 42 ) the at least one protective material ( 18 . 20 ) at least partially surrounds.

Images