DE102011005890A1 - Electronic device with circuit carrier in a plug-in housing - Google Patents

Abstract

The invention relates to an electronic circuit arrangement (102) with a circuit carrier (106) and module (108) for receiving in a slide-in housing (104). An electronic circuit tuner (106) according to the invention and the electronic module (108) held by the circuit carrier (106) have at least one spring element (116, 118), the circuit arrangement (102) being provided for insertion into a housing (104), the module (108 ) after insertion, a housing area (110, 136) is thermally contacted for cooling, and the contacting is accomplished via the at least one spring element (116, 118); and at least one spacer (126, 128) on the module or on the housing (108) to avoid damage when the circuit arrangement (102) is inserted into the housing (104).

Description

State of the art

The invention relates to an electronic circuit arrangement with circuit carrier and module for receiving in a plug-in housing.

For electronic devices in which electronic circuits are arranged in a housing, different housing concepts are known, which are to be evaluated in the individual case from the viewpoint of space, cost and cooling of the electronic components. For electronic devices such as control units in the automotive sector, the arrangement in a housing according to the tub-lid principle, the use of an extruded profile as a housing, or the direct encapsulation of the electronic circuit arrangement is known.

In this case, designed according to the tub-lid principle electronic devices often optimum cooling options. The cooling of the components carried by a circuit carrier, such as a printed circuit board, generally takes place through the printed circuit board and onto cooling elements of the housing. However, the cost or space-related aspects tend to be more difficult to optimize in this concept.

The use of an extruded profile for the housing is usually less expensive, but problems in cooling and miniaturization can occur here. Since the profile is closed at one end, possible space and cooling potential are lost here. As a rule, only peripheral areas of the housing are available for cooling in this concept.

The direct encapsulation of a circuit board most likely supports miniaturization and has the greatest cost saving potential. However, the size of the circuit substrate to be encapsulated is limited. Therefore, this technique can only be used for comparatively small electronic devices.

From the DE 102 97 047 B4 For example, an electronic component arrangement is known in which a chip with spring-formed terminals is mounted on a frame on a printed circuit board and then brought into direct contact with a heat sink. The heat sink may serve to hold the chip in the mounted position so that the resilient terminals press the chip against the heat sink.

From the DE 196 04 124 A1 an electrical device is known in which a power device is pressed by spring means to a heat-dissipating housing part. Thus, by the thermal contacting a cooling of the device through the housing can be done.

In these approaches, a cooling over the classic concepts is improved, however, a use together with in itself cost extruded profiles is not possible, because in this case the circuit is inserted into the housing; to avoid damage, however, direct contact between the modules / components to be warmed up and the housing must be avoided.

Disclosure of the invention

According to the invention, an electronic circuit arrangement with a circuit carrier, an electronic module held by the circuit carrier and at least one spring element are proposed. The circuit arrangement is provided for insertion into a housing. For cooling, the module contacts a housing area thermally after insertion. The contacting is accomplished via a spring element. There is provided a fastening means.

The circuit carrier can be designed, for example, as a printed circuit board or PCB ("printed circuit board") and / or another, also a three-dimensional structure for holding circuits, components, etc. The module may also comprise a printed circuit board or similar support structure, and / or may comprise one or more electronic components, including electronic circuits (ICs), circuit elements such as capacitors or resistors, control elements such as transistors, etc. Such a device may either itself be a device to be heat-treated and / or may carry a device to be heat-treated.

The fastening means preferably comprises at least one spacer and / or at least one locking element. The fastening means can be provided at any points on the circuit arrangement. Preferably, the attachment means is configured so that the circuitry can be mounted in a housing. The fastening means on the circuit arrangement may be designed to be complementary to the fastening means on a housing, in which the circuit arrangement is to be inserted. Furthermore, a complementary configured fastening means of the circuit arrangement and a housing determines the position of the circuit arrangement in a housing. Complementary in the sense of the invention means that for the fastening means to the circuit arrangement a matching Counterpart is provided on a housing into which the circuit arrangement can be inserted. Thus, for example, a locking element is provided on a housing for a spacer on the circuit arrangement, in order to fasten the circuit arrangement when inserted into a housing in a desired position.

The at least one spacer may comprise an element galvanically mounted on the module, such as a sphere, hemisphere, or other raised element. Additionally or alternatively, the module may be equipped with a pre-formed element as a spacer. This component may be, for example, a ball, a rivet, a press-in pin, and / or a stamped grid.

The at least one spacer may include floating points, sliding lines or sliding surfaces, and may include, for example, three or more sliding points.

The at least one locking element can serve for locking the circuit arrangement to be inserted in an end position in a housing. The locking element may for example comprise one or more latching points. A latching point on the circuit arrangement may be provided for the engagement of a spacer on a housing.

The spring element can serve in the inserted state for defining the distance between circuit carrier and module. Alternatively, the module can also be held directly or rigidly by the circuit carrier.

The at least one spring element can serve the electrical contacting of the circuit carrier. Additionally or alternatively, this or another spring element can serve the electrical contacting of the module. For example, at least one spring element can be provided for the electrical contacting of circuit carrier and module with one another. In a specific variant of these embodiments, at least one spring element is formed from an electrical conductor led out of the circuit carrier.

The electrical conductor can be, for example, a copper track led out of the circuit carrier (for example a printed circuit board), which is provided for electrically contacting the circuit carrier. This electrical conductor can be electrically connected, for example, by means of plated-through holes with conductor tracks or further electrical conductors of the circuit carrier.

The led out of the circuit board contacting can be formed, for example, in a separate processing step to a spring element, in particular be formed. This leaf springs, all types of compression springs, torsion springs, bending springs or similar spring elements can be formed.

An electronic circuit arrangement with at least one spring element led out of the circuit carrier can also be present independently of the spacers or locking elements described here. Such a circuit may be provided, for example, for inclusion in a constructed according to the tub-lid principle housing. Furthermore, a corresponding electronic device can be provided.

The invention further proposes a housing for receiving one of the electronic circuit arrangements outlined here. The housing comprises a fastening means for locking the circuit arrangement to be inserted into an end position in the housing.

The fastening means preferably comprises at least one spacer and / or at least one locking element. The attachment means may be provided at any location on the housing. Preferably, the fastening means is designed so that the housing receives a circuit arrangement. The fastening means on the housing may be designed to be complementary to the fastening means on a circuit arrangement which is to be received in the housing. Furthermore, a complementarily designed fastening means of the housing and a circuit arrangement fixes the position of a circuit arrangement in the housing. Complementary in the sense of the invention means that for the fastening means the housing is provided a matching counterpart to a circuit arrangement which is to be received in the housing. Thus, for example, a locking element is provided on a circuit arrangement for a spacer on the housing in order to fasten a circuit arrangement when inserted into the housing in a desired position.

The at least one spacer may comprise an element galvanically mounted on the housing, such as a ball, hemisphere or other raised element. Additionally or alternatively, the housing may be equipped with a pre-formed element as a spacer. This component may be, for example, a ball, a rivet, a press-in pin, and / or a stamped grid.

The at least one spacer may include floating points, sliding lines or sliding surfaces, and may include, for example, three or more sliding points.

The at least one locking element can serve for locking a circuit arrangement to be inserted into an end position in the housing. The locking element may for example comprise one or more latching points. A locking point on the housing may be provided for the engagement of a spacer on a circuit arrangement. The housing may comprise approximately an extruded profile. Alternatively, profiles can be used, which by means of other forming processes such. B. thermoforming are made. Additionally or alternatively, the housing may be constructed according to the tub-lid principle.

According to the invention, an electronic device is furthermore proposed which comprises one of the electronic circuit arrangements outlined here and a housing into which the circuit arrangement is inserted, wherein a fastening means on the circuit arrangement is designed to be complementary to a fastening means on the housing. The housing and the circuit arrangement may be formed as outlined above, wherein the circuit arrangement is locked in the housing.

Advantages of the invention

With the invention, a direct contact between module to be Entwärmendem and housing can also be established if an extruded profile or other housing is used, in which the circuit arrangement is inserted. By providing spacers, the electronics (i.e., the module, or the components to be heat-treated, but also other components) as well as the housing (in particular the areas provided for thermal contacting of the module) can be protected from damage.

By means of the invention, the lossy power electronics can be applied directly to cooling surfaces of the housing, so as to realize optimal heat dissipation. An approximately existing gap between the Entwärmungsflächen of the module and the housing can be reduced by an at least partial use of a corresponding Wärmeleitmediums.

The invention thus extends the possibilities of use of a housing concept based on extruded profiles or on profiles produced by similar methods (eg deep-drawn part). The advantages resulting from this concept, in particular also cost advantages, can be used for electronic devices, but compared to the conventional concept, the cooling can be optimized because a direct cooling of modules / components is possible through the housing. The invention enables the development of optimized cooling concepts based on, for example, slug-up cooling, modular partitioning and suitable intermodule connection techniques.

Optimized cooling concepts based on the invention make it possible, for example, to use cost-effective extruded profiles or other plug-in housings not only for logic modules but also for power modules.

The thermal / mechanical contact between the component to be heated and the housing can be maintained over the desired service life of the device by the spring element with a correspondingly adapted spring constant. The spring element allows secure contact, for example, with expansions or other movements of the housing, the module, or the circuit substrate, as they can occur for example in temperature changes or shocks, z. B. at a control unit in the vehicle area.

If spring elements are provided between the circuit carrier and the module / component to be Entwärmendem, a two-sided assembly of the module is possible. If spring elements are provided between the circuit carrier and the housing, the circuit carrier, for example a base circuit board, can be equipped on two sides. In all these cases, additional space can be gained for equipping.

Optimized cooling concepts based on the invention also enable a further miniaturization of the (power) electronics installed in the electronic device.

The use of the spacers and / or locking elements according to the invention for locking the circuit arrangement to be inserted in the plug-in housing allows a simple fixation of the complete system. By fixing the optimal Entwärmungspfad is made and secured by means of the provided spring elements over the life of the device. The spacers protect the electronics as well as the heat dissipation surfaces of the module and the housing from assembly damage. The spacers, for example, sliding points and / or lines can additionally be formed as a guide element for guiding the electronic circuit arrangement when inserted into the housing.

Brief description of the drawings

Further aspects and advantages of the invention will now be described in more detail with reference to the accompanying figures. Hereby shows:

1 a section through an embodiment of an electronic device according to the invention;

2A . 2 B schematic sectional views through a circuit carrier of an electronic circuit arrangement according to the invention with led out of an inner layer spring elements; and

3 a section through another embodiment of an electronic device according to the invention.

Embodiments of the invention

1 shows in the form of a schematic sectional view of an embodiment 100 an electronic device according to the invention with an electronic circuit arrangement 102 in a plug-in housing 104 is received, but is not yet in a locked end position.

The circuit arrangement 102 includes a circuit board as a circuit board 106 as well as a module 108 , From the housing designed as an extruded profile 104 are a top 110 and a bottom 112 indicated.

The circuit board 106 carries on her the module 108 facing side elements, one of which is a component 114 as well as spring elements 116 . 118 are shown. The spring elements 116 . 118 serve the spaced positioning of the module 108 and for electrical contacting of printed circuit board 106 and module 108 , The module 108 is at its the circuit board 106 facing side with electronic components 120 . 122 stocked. On his the case 104 . 110 facing side is the module 108 with a thermal contacting element 124 and equipped with spacers, of which sliding points 126 . 128 are shown.

It is believed that for at least one of the components 120 . 122 , For example, at least the element 122 , a heat dissipation is required, for example because it is a lossy power-consuming device. The components 120 . 122 Entwärm over a circuit board 130 of the module 108 and the contacting element 124 to the top 110 of the housing 104 , For efficient thermal diffusion, the housing top 110 with cooling fins 132 fitted. In the (not shown here) completely inserted and locked state of the electronic circuit arrangement 102 in the case 104 becomes the module 108 with its contacting element 124 by means of the spring elements 116 . 118 applied spring force to the top 110 of the housing pressed. For optimal thermal contacting under certain circumstances required thermal paste or a comparable thermally conductive medium is for reasons of clarity in 1 not shown.

The circuit arrangement 102 is in the by the arrow 134 indicated direction in the housing 104 inserted. This slides the circuit board 106 over the bottom 112 of the housing 104 while the floating points 126 and 128 along the inner surface 136 the top 110 of the housing 104 slide. How out 1 As can be seen, the floating points 126 . 128 via the thermal contact 124 and optionally further, on top of the base board 130 of the module 108 existing components raised, so that when inserting the arrangement 102 only the floating points 126 . 128 in mechanical engagement with the inner surface 136 the top of the housing 110 stand. In this way, when inserting a damage to the structures on the circuit board 130 , z. B. the thermal contacting element 124 (more generally, the heat dissipation area of the module 108 ), but also the inner surface 136 the top 110 of the housing 104 avoided. Also, one is optionally on the top of the item 124 or the inner surface 136 the top of the housing 110 previously applied Wärmeleitmedium not abraded or otherwise impaired.

The floating points 126 . 128 are in the example of 1 formed as balls, either as prefabricated components on top of the base circuit board 130 of the module 108 be fitted, or galvanically on the circuit board 130 being constructed. Other embodiments of the sliding points 126 . 128 are also conceivable, for example in the form of hemispheres or pyramids; More generally, other types of spacers can be used in addition to sliding points, such as sliding surfaces such as the surfaces of rivets or Einpresspins, or sliding lines or lines such as the surface of a stamped grid.

In the 1 shown balls 126 . 128 For example, in a standard SMD ("Surface Mounted Device") process, e.g. B. be generated via a balling method. For this purpose, neither special machines nor screwing or riveting processes are required. Thus, in principle, the complete module 108 in a standard SMT ("Surface Mounted Technology") process.

On the inner surface 136 the top 110 of the housing 104 are as detents Locking points or depressions 138 . 140 prepared. When inserting the arrangement 102 reaches the ball 126 the position of the locking point 138 and the ball 128 the position of the locking point 140 , Mediated by the elements 116 . 118 applied spring force locks the module 108 with the balls 126 . 128 in one through the latching points 138 . 140 predetermined position inside the housing 104 one. The circuit arrangement 102 stays in the housing 104 fixed as long as the spring elements 116 . 118 exert sufficient spring force, accordingly, for a certain life of the device 100 must be designed.

While in the 1 only two floating points 126 . 128 are indicated, it is advantageous in the exclusive use of sliding points as spacers, in particular at least three sliding points on the side facing the housing of the module to be able to insert the module optimally without components such as the thermal contacting or Entwärmungselement 124 , a thermal grease, or the inner surface 136 the top 110 to damage. In this case, the at least three sliding points should preferably not be on a line parallel to the direction of insertion 134 are located. On the inner surface 136 of the housing, a corresponding number Einrastpunkte be provided. In order to ensure a simple, reliable and correct insertion and locking of the arrangement, the number of spacers or latching points should not be too large. For a use of slide lines or surfaces and the combination of floating points, lines and surfaces applies mutatis mutandis.

After snapping is between the Entwärmungskomponente 124 and the inner surface 136 of the housing 104 only a minimal distance 142 , which may be filled by a Wärmeleitmedium. The heat transfer medium does not have the entire contact surface of the contacting element 124 cover; it is sufficient that the medium is partially present at least where a thermal contact must be optimized for a heat dissipation of a device. Required by the components 120 . 122 so for example. In particular, the element 122 an efficient heat dissipation path, so must a heat transfer medium to bridge the remaining gap 142 in particular over the component 122 on the surface of the contacting element 124 be upset.

The through the spring elements 116 . 118 maintained spacing of printed circuit board 106 and module 108 allows placement of both the top of the circuit board 106 as well as the underside of the circuit board 130 of the module 108 (ie a two-sided assembly of the module 108 ). This allows for a suitable partitioning of the components to be accommodated minimizing the design of the device 100 ,

The module 108 can be processed in a standard SMD process, in which, for example, first a solder paste pressure on the circuit board 130 takes place, then a loading of the module, and then a soldering. The spring contacts 116 . 118 can during the manufacturing process of the module 108 as prefabricated components on the module 108 be attached. For the spring elements 116 . 118 finished springs could be used as in 1 shown z. B. for the element 118 a C-spring and for the element 116 an S spring. Also, coil springs and the like spring designs can be more on the module 108 equipped and soldered. If such springs are used, which are standard components, a special or additional production cost is not incurred. There are a variety of different springs known as such, so there is a great deal of flexibility in geometry and material with respect to the specific requirements for each application.

An electrical contact of the module 108 can over at least one of the spring elements 116 . 118 respectively. In this case, additional connection points for electrical contact between module 108 and base board 106 omitted.

Serves one or more of the spring elements 116 . 118 the electrical contact, can be used as a material z. B. spring bronze can be used. For a long-lasting, reliable contact force, the use of spring steel is preferable. For a plurality of springs, these can be fitted individually depending on the requirements; in the example of 1 So could for example be the spring 116 exist for electrical contacting of spring bronze, while the spring element 118 is not required for electrical contact and reliable generation of a spring force over the desired life of the device 100 may consist of spring steel, for example. Thus, control units for more robust applications such as in a vehicle can be optimized.

In the 2A . 2 B is an embodiment of a module according to the invention 200 shown. One the module 200 holding base circuit board and other elements such as spacers or a housing for receiving a module 200 and base circuit board existing circuitry are omitted for clarity.

An electrical conductor 204 , For example, a copper track, is used for electrical contacting of the module 200 and runs between external or led out contact surfaces 210 through the inside of the module circuit board 202 , Via a via 206 is the leader 204 with further tracks 208 of the module 200 electrically connected. The 2A and 2 B illustrate a state before and after a process step for editing the module 200 in which the external connections 210 be processed (for example, bent or deformed), so that areas 212 of the leader 204 be used as spring elements. The areas 212 are thus comparable to the spring elements after machining 116 . 118 of the embodiment 100 out 1 and can the module 200 Space from a base circuit board and at the same time press for heat dissipation to an inner surface of a side of the housing.

While in the example of the 2 B the areas 212 Represent C springs, in principle, any resilient design form can be generated, for example, an S-shape, or even a simple leaf spring (the latter if there is sufficient space available for this purpose on the base board or in the electronic device). If an extruded profile is used as housing, are on the top 214 of the module 200 Spacers such as those in 1 shown floating points 126 . 128 advantageous. When using a housing according to the tub-lid principle, a plurality of spacers can also be provided in relation to, for example, provided in a lid latching positions, or it is dispensed with spacers and / or locking.

3 shows in the form of a schematic sectional view of an alternative embodiment 100 an electronic device according to the invention with an electronic circuit arrangement 102 in a plug-in housing 104 is received, but is not yet in a locked end position.

In the 3 illustrated embodiment corresponds to the embodiment of 1 , In contrast to 1 is in 3 another embodiment of the fastener 126 . 128 . 138 . 140 on the plug-in housing 104 and the circuit arrangement 102 shown.

The circuit arrangement 102 includes a circuit board as a circuit board 106 as well as a module 108 , From the housing designed as an extruded profile 104 are a top 110 and a bottom 112 indicated. The circuit arrangement 102 is in the by the arrow 134 indicated direction in the housing 104 inserted. This slides the circuit board 106 over the bottom 112 of the housing 104 while the floating points 126 and 128 along the inner surface 136 the top 110 of the housing 104 slide.

In contrast to 1 is in 3 the fastener 138 . 140 at the circuit arrangement 102 by two locking elements 138 . 140 educated. These locking elements 138 . 140 are on the housing side facing the circuit board 130 of the module 108 provided and are as latching points or depressions 138 . 140 designed. As counterparts to the locking elements 138 . 140 on the module 108 is the fastener 126 . 128 on the housing by two spacers 126 . 128 realized. These are called floating points 126 . 128 via the thermal contact 124 and optionally further, on top of the base board 130 of the module 108 existing components raised, so that when inserting the arrangement 102 only the floating points 126 . 128 in mechanical engagement with the circuit board 130 of the module 108 stand. In this way, when inserting a damage to the structures on the circuit board 130 , z. B. the thermal contacting element 124 (more generally, the heat dissipation area of the module 108 ), but also the inner surface 136 the top 110 of the housing 104 avoided. Also, one will possibly be on the top of the item 124 or the inner surface 136 the top of the housing 110 previously applied Wärmeleitmedium not abraded or otherwise impaired.

When inserting the arrangement 102 reaches the locking point 138 the position of the ball 126 and the latching point 140 the position of the ball 128 , Mediated by the elements 116 . 118 applied spring force locks the module 108 with the latching points 138 . 140 in one by the balls 126 . 128 predetermined position inside the housing 104 one. The circuit arrangement 102 stays in the housing 104 fixed as long as the spring elements 116 . 118 exert sufficient spring force, accordingly, for a certain life of the device 100 must be designed.

The invention is not limited to the embodiments described herein and the aspects highlighted therein; Rather, within the scope given by the appended claims a variety of modifications are possible, which are within the scope of expert action.

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• DE 10297047 B4 [0006]
• DE 19604124 A1 [0007]

Claims (13)

Electronic circuit arrangement ( 102 ), with - a circuit carrier ( 106 ); One of the circuit carrier ( 106 ) held electronic module ( 108 ); - at least one spring element ( 116 . 118 ), wherein the circuit arrangement ( 102 ) for insertion into a housing ( 104 ), the module ( 108 ) after insertion a housing area ( 110 . 136 ) thermally contacted for cooling, and the contacting via the at least one spring element ( 116 . 118 ) is accomplished; and a fastening means ( 126 . 128 . 138 . 140 ). Circuit arrangement according to claim 1, wherein the fastening means ( 126 . 128 . 138 . 140 ) at least one spacer ( 126 . 128 ) and / or at least one locking element ( 138 . 140 ). Circuit arrangement according to one of claims 1 or 2, wherein the at least one spacer ( 126 . 128 ) one on the module ( 108 ) comprises electroplated ball. Circuit arrangement according to one of claims 1 to 3, wherein the module ( 108 ) with at least one component in the form of a ball, a rivet, a press-fit pin, and / or a stamped grid for forming the at least one spacer ( 126 . 128 ) is equipped. Circuit arrangement according to one of the preceding claims, wherein the at least one spacer ( 126 . 128 ) comprises three or more floating points. Circuit arrangement according to claim 1 or 2, wherein the locking element ( 138 . 140 ) one or more locking points ( 138 . 140 ). Circuit arrangement according to one of the preceding claims, wherein at least one spring element ( 116 . 118 ) of the electrical contacting of the circuit carrier ( 106 ) and / or module ( 108 ) serves. Circuit arrangement according to claim 7, wherein at least one spring element ( 212 ) from one of the module ( 200 ) led out electrical conductor ( 204 ) is formed. Casing ( 104 ) for receiving an electronic circuit arrangement ( 102 ) according to one of the preceding claims, with a fastening means ( 126 . 128 . 138 . 140 ), for locking the circuit arrangement to be inserted ( 102 ) in an end position in the housing ( 104 ). Housing according to claim 9, wherein the fastening element ( 126 . 128 . 138 . 140 ) is configured according to one of claims 2 to 6. Housing according to claim 9 or 10, wherein the housing ( 104 ) comprises an extruded profile. Electronic device ( 100 ) with an electronic circuit arrangement ( 102 ) according to one of claims 1 to 8 and a housing ( 104 ) into which the circuit arrangement ( 102 ) is inserted, wherein a fastening means ( 126 . 128 . 138 . 140 ) on the circuit arrangement ( 102 ) complementary to a fastener ( 126 . 128 . 138 . 140 ) on the housing ( 104 ) is configured. An electronic device according to claim 12, wherein the housing ( 104 ) according to one of claims 9 to 11 and the circuit arrangement ( 102 ) in the housing ( 104 ) is locked.

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